CN109509572A - 铜箔丝结构及其制造方法 - Google Patents

铜箔丝结构及其制造方法 Download PDF

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CN109509572A
CN109509572A CN201710833864.5A CN201710833864A CN109509572A CN 109509572 A CN109509572 A CN 109509572A CN 201710833864 A CN201710833864 A CN 201710833864A CN 109509572 A CN109509572 A CN 109509572A
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conductive layer
coat
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wire structure
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张淑卿
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Abstract

本发明关于一种铜箔丝结构及其制造方法。该铜箔丝结构包含一线芯、一导电层及一金属包覆层。线芯具有一外表面并定义一长度方向，导电层沿该长度方向螺旋缠绕于线芯的外表面，而金属包覆层设置于导电层外围以包覆线芯及导电层。其中，导电层以不交叠的方式螺旋缠绕于线芯的外表面以定义一间隙，使该间隙相应地以不交叠的方式螺旋缠绕于线芯的外表面，且金属包覆层于包覆线芯及导电层时，适可同时包覆该间隙。

Description

铜箔丝结构及其制造方法
技术领域
本发明关于一种铜箔丝结构及其制造方法，特别指一种具有一金属包覆层的铜箔丝结构及其制造方法。
背景技术
现今的电子产品虽多数皆已支持各种类型的无线通讯协议，而能够以无线传输的方式进行讯号或资料的传递，但在实际使用上，无线传输仍然容易受到传输频宽不足、遭受其他讯号干扰或传输路径上存有障碍物等因素而影响到传输质量。因此，以有线方式进行讯号或资料的传递，仍为使用者较常选择的传输方案。
以有线方式进行讯号或资料的传递时，其挑选的线材所具有的电阻大小与线材的传输质量息息相关；一般而言，线材所具有的电阻越大，在进行讯号或资料的传递时所遇到的阻碍越大，而越容易导致讯号失真或影响传递速度。
此外，由电阻公式：
电阻(R)＝电阻常数(ρ)×长度(L)/截面积(A)
可知，当电阻常数(ρ)为定值时，电阻(R)与长度(L)成正比，而电阻(R)与截面积(A)成反比。换言之，讯号(或电流)于传输时所行经的距离(即：长度)越长，则电阻越大；而当讯号(或电流)于传输时所行经的截面积越小，则电阻越大。
在目前所使用的铜箔丝结构中，由于其所具有的导电层乃是以螺旋缠绕于一线芯的方式设置，故当一讯号(或电流)由铜箔丝结构的一端传递至另一端时，该电流通过螺旋缠绕的导电层所行进的距离(长度)将远大于铜箔丝结构的二端部的直线距离，从而导致电阻的增加并对讯号传递造成不良影响。
另一方面，于传输过程中随电阻增加而产生的热，会造成导电层的软化而降低其挠曲性。当采用具有小线径(导线直径)的铜箔丝结构时，因小线径所导致的小截面积便会具有相对大的电阻，故当铜箔丝结构因高电阻而承受较高的工作温度、且于经过多次弯折后，铜箔丝结构所具有的导电层便容易断裂而无法继续传递讯号，使得这类小线径的铜箔丝结构存在不耐弯曲的缺陷。
有鉴于此，如何在有限的线径内提供一低阻抗且耐弯折的铜箔丝结构，乃为此一业界亟待解决的问题。
发明内容
本发明的一目的在于提供一种铜箔丝结构及其制造方法，其可使铜箔丝结构在具有一小线径的同时，依旧保有较低的电阻与较高的耐弯折度，以符合不同厂商的客制化需求。
为达上述目的，本发明提供的一种铜箔丝结构包含一线芯、一导电层及一金属包覆层。线芯具有一外表面并定义一长度方向，导电层沿该长度方向螺旋缠绕于线芯的外表面，而金属包覆层设置于导电层外围以包覆线芯及导电层。其中，导电层以不交叠的方式螺旋缠绕于线芯的外表面以定义一间隙，使该间隙相应地以不交叠的方式螺旋缠绕于线芯的外表面，且金属包覆层于包覆线芯及导电层时，适可同时包覆该间隙。
为达上述目的，本发明提供的一种铜箔丝结构的制造方法包含下列步骤：步骤S1：提供一线芯，该线芯具有一外表面并定义一长度方向；步骤S2：沿线芯的长度方向螺旋缠绕一导电层于线芯的外表面；以及步骤S3：于导电层的外围形成一金属包覆层以包覆线芯及导电层；其中，导电层以不交叠的方式螺旋缠绕于线芯的外表面以定义一间隙，使该间隙相应地以不交叠的方式螺旋缠绕于线芯的外表面，且金属包覆层于包覆线芯及导电层时，适可同时包覆该间隙。
为了让上述的目的、技术特征和优点能够更为本领域的人士所知悉并应用，下文以本发明的数个较佳实施例以及附图进行详细的说明。
附图说明
图1为本发明的铜箔丝结构尚未设置金属包覆层的示意图；
图2为本发明的铜箔丝结构已设置金属包覆层的示意图；
图3为图2的铜箔丝结构的剖视图；
图4为图3的圈起处的局部放大示意图；以及
图5为本发明的铜箔丝结构的制造方法步骤图。
【符号说明】
10 铜箔丝结构
20 线芯
22 外表面
30 导电层
32 间隙
40 金属包覆层
L 长度方向
W1 第一宽度
W2 第二宽度
T1 厚度
具体实施方式
如图1及图2所示，本发明的一种铜箔丝结构10包含一线芯20、一导电层30及一金属包覆层40，使其可用以进行讯号(或电流)的传输作业。
于图1的实施例所示，线芯20具有一外表面22并定义一长度方向L，导电层30沿长度方向L螺旋缠绕于线芯20的外表面22，且如图2所示，金属包覆层40设置于导电层30外围以包覆线芯20及导电层30，从而使铜箔丝结构10具有一完整外观。
详细而言，如图3及图4的剖面图所示(其中，图4以较夸大的比例绘示，以清楚显示铜箔丝结构10的结构)，铜箔丝结构10所具有的导电层30以不交叠的方式螺旋缠绕于线芯20的外表面22，并可因此定义一间隙32，使间隙32相应地以不交叠的方式螺旋缠绕于线芯20的外表面22。此外，金属包覆层40于包覆线芯20及导电层30时，适可同时包覆间隙32，使间隙32不会露出。
于本发明的铜箔丝结构10中，线芯20为一纤维线芯，以使其具有耐高温及耐弯折的特性，而导电层30则为一金属箔。请再次参阅图1，作为导电层30的金属箔沿长度方向L定义有一第一宽度W1，间隙32沿长度方向L定义有一第二宽度W2，且第一宽度W1与第二宽度W2的比值介于10：1～15：1之间。藉由上述针对第一宽度W1与第二宽度W2的比值的定义，可确保金属包覆层40在用以包覆线芯20及导电层30的同时，能确实覆盖间隙32，使间隙32不会因此自金属包覆层40露出，以确保金属包覆层40可达到的电磁波遮蔽效果。
于本发明的一较佳实施例中，如图4所示，形成导电层30的金属箔具有一厚度，且该厚度介于0.01～0.05mm之间，以确保本发明的铜箔丝结构10的总线径可被维持在一相对较细的范围内。此外，本发明的金属箔为一铜合金金属箔，且该铜合金金属箔为锡铜合金箔、银铜合金箔或铁铜合金箔。
为使设置于铜箔丝结构10的最外围的金属包覆层40可确实且完整地包覆线芯20、导电层30及间隙32，本发明的金属包覆层40乃是经由一热浸镀方式而包覆并设置于导电层30的外围，且该热浸镀方式所浸镀的金属液为液态锡。
因此，如图4所示，即便以热浸镀方式所形成的金属包覆层40的外观于微观状态下将能够确实地覆盖间隙32使其不会露出。如此一来，藉由金属包覆层40的设置，当一讯号(或电流)由铜箔丝结构10的右端传递至左端，且该讯号于遭遇间隙32时，该讯号将可自间隙32的一端(即：右端)藉由金属包覆层40而直接传递至间隙32的另一端(即：左端)，从而避免先前技术中讯号传递时需行经的螺旋缠绕路径，大大地缩短讯号传递的距离。
另一方面，当讯号传递路径缩短后，于传输过程中所会产生的热也将相应地变小，故本发明的铜箔丝结构10亦可具有下述优点：能够有效地避免导电层30的软化并增加其挠曲性。
如图5所示，本发明更提供铜箔丝结构10的制造方法，其包含下列步骤：首先如步骤S1所示：提供一线芯20，线芯20具有一外表面22并定义一长度方向L；如步骤S2所示：沿线芯20的长度方向L螺旋缠绕一导电层30于线芯20的外表面22；最后，如步骤S3所示：于导电层30的外围形成一金属包覆层40以包覆线芯20及导电层30。其中，导电层30以不交叠的方式螺旋缠绕于线芯20的外表面22以定义一间隙32，使间隙32相应地以不交叠的方式螺旋缠绕于线芯20的外表面22，且金属包覆层40于包覆线芯20及导电层30时，适可同时包覆间隙32，使间隙32不会露出。
相同于前述关于铜箔丝结构10的描述，于铜箔丝结构10的制造方法中，线芯20为一纤维线芯，以使其具有耐高温及耐弯折的特性，而导电层30则为一金属箔。用以形成导电层30的金属箔较佳为一铜合金金属箔，且该铜合金金属箔为锡铜合金箔、银铜合金箔或铁铜合金箔。
另一方面，为使设置于铜箔丝结构10的最外围的金属包覆层40可确实且完整地包覆线芯20、导电层30及间隙32，本发明的金属包覆层40乃是经由一热浸镀方式以包覆并设置于导电层30的外围，且该热浸镀方式所浸镀的金属液可为液态锡。
综上所述，藉由本发明所揭示的一种铜箔丝结构及其制造方法中所设置的金属包覆层，将得以使讯号以近乎于直线的方式进行传递，从而降低废热的产生并有效地避免导电层的软化以增加其挠曲性。此外，以热浸镀方式设置的金属包覆层亦可有效避免铜箔丝结构的整体线径的增加，使铜箔丝结构的整体线径依旧维持在一相对较细的尺寸，以符合不同厂商的客制化需求。
上述的实施例仅用来例举本发明的实施态样，以及阐释本发明的技术特征，并非用来限制本发明的保护范畴。任何熟悉此技术者可轻易完成的改变或均等性的安排均属于本发明所主张的范围，本发明的权利保护范围应以申请专利范围为准。

Claims (14)

1.一种铜箔丝结构，包含：
一线芯，具有一外表面并定义一长度方向；
一导电层，沿该长度方向螺旋缠绕于该线芯的该外表面；以及
一金属包覆层，设置于该导电层外围以包覆该线芯及该导电层；
其中，该导电层以不交叠的方式螺旋缠绕于该线芯的该外表面以定义一间隙，使该间隙相应地以不交叠的方式螺旋缠绕于该线芯的该外表面，且该金属包覆层于包覆该线芯及该导电层时，适可同时包覆该间隙。
2.根据权利要求1所述的铜箔丝结构，其中该线芯为一纤维线芯，且该导电层为一金属箔。
3.根据权利要求2所述的铜箔丝结构，其中该金属箔沿该长度方向定义有一第一宽度，该间隙沿该长度方向定义有一第二宽度，且该第一宽度与该第二宽度的比值介于10：1～15：1之间。
4.根据权利要求2所述的铜箔丝结构，其中该金属箔具有一厚度，且该厚度介于0.01～0.05mm之间。
5.根据权利要求2所述的铜箔丝结构，其中该金属箔为一铜合金金属箔。
6.根据权利要求5所述的铜箔丝结构，其中该铜合金金属箔为锡铜合金箔、银铜合金箔或铁铜合金箔。
7.根据权利要求1所述的铜箔丝结构，其中该金属包覆层以一热浸镀方式设置于该导电层外围。
8.根据权利要求7所述的铜箔丝结构，其中该热浸镀方式所浸镀的金属液为液态锡。
9.一种铜箔丝结构的制造方法，包含下列步骤：
提供一线芯，该线芯具有一外表面并定义一长度方向；
沿该线芯的该长度方向螺旋缠绕一导电层于该线芯的该外表面；以及
于该导电层的外围形成一金属包覆层以包覆该线芯及该导电层；
其中，该导电层以不交叠的方式螺旋缠绕于该线芯的该外表面以定义一间隙，使该间隙相应地以不交叠的方式螺旋缠绕于该线芯的该外表面，且该金属包覆层于包覆该线芯及该导电层时，适可同时包覆该间隙。
10.根据权利要求9所述的制造方法，其中该线芯为一纤维线芯，且该导电层为一金属箔。
11.根据权利要求10所述的制造方法，其中该金属箔为一铜合金金属箔。
12.根据权利要求11所述的制造方法，其中该铜合金金属箔为锡铜合金箔、银铜合金箔或铁铜合金箔。
13.根据权利要求9所述的制造方法，其中该金属包覆层以一热浸镀方式设置于该导电层外围。
14.根据权利要求13所述的制造方法，其中该热浸镀方式所浸镀的金属液为液态锡。
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