CN109483557A - Mechanical arm component and semiconductor production equipment with camera shooting arrangement for detecting - Google Patents
Mechanical arm component and semiconductor production equipment with camera shooting arrangement for detecting Download PDFInfo
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- CN109483557A CN109483557A CN201710815798.9A CN201710815798A CN109483557A CN 109483557 A CN109483557 A CN 109483557A CN 201710815798 A CN201710815798 A CN 201710815798A CN 109483557 A CN109483557 A CN 109483557A
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- wafer
- cassette
- arrangement
- mechanical arm
- counting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of mechanical arm component and semiconductor production equipment with camera shooting arrangement for detecting, and mechanical arm component includes: mechanical arm, and mechanical arm includes: transmission pedestal, fixed frame and inserted sheet；Image arrangement for detecting, for being imaged to the wafer in wafer cassette or cassette, to obtain the arrangement real image of wafer in wafer cassette or cassette, the arrangement real image according to the wafer obtained counts the wafer in wafer cassette or cassette, and obtains the spacing between adjacent wafers according to counting time period.Mechanical arm component of the invention images the arrangement real image of the available wafer of arrangement for detecting by setting, and combines the spacing between the adjacent wafers for counting and obtaining, and Difference test millimetre-sized between wafer can be come out, accuracy with higher.
Description
Technical field
The invention belongs to technical field of manufacturing semiconductors, more particularly to a kind of mechanical arm with camera shooting arrangement for detecting
Component and semiconductor production equipment.
Background technique
In existing semiconductor equipment, the transmission of wafer generally passes through mechanical arm, and for example wafer is in wafer cassette and crystalline substance
Transmission between circle box, transmission and wafer of the wafer between wafer cassette and cassette are between wafer cassette and reaction chamber
Transmission etc..Existing mechanical arm 11 as shown in Figure 1, the mechanical arm 11 front end be equipped with luminescence sensor 12 and with institute
The corresponding receiving sensor 13 of luminescence sensor 12 is stated, is being grabbed between wafer out of wafer cassette or cassette, can first use institute
It states mechanical arm 11 to be from top to bottom scanned all wafers, and passes through the luminescence sensor 12 and institute while scanning
It states receiving sensor 13 and perceives the arrangement situation of wafer in the wafer cassette or the cassette and (confirm the wafer cassette or described
Wafer in cassette whether there is or not lamination, be broken or come off etc.).However, being sensed using the luminescence sensor 12 and the reception
When device 13 cooperates the wafer arrangement situation carried out in detecting wafer cassette or cassette, due to the luminescence sensor 12 and the reception
The influence of itself precision of sensor 13 and external environment, so that can have various errors during detecting perception, detecting sense
The accuracy known is not high enough.However, if the accuracy of detecting perception is not high enough will to will lead to serious production accident, for example,
As shown in Figures 2 and 3, by taking the batch processing equipment of diffusion technique as an example, after the completion of technique, if because expansion causes position in cassette 14
When the rupture of wafer 15 thereon leads to abnormal (as shown in Figure 2), if the luminescence sensor 12 on the mechanical arm 11
And the receiving sensor 13 does not detect the wafer 15 of rupture, it is dynamic that the mechanical arm 11 just will do it normal crawl
Make, and exception can be grabbed when grabbing the wafer 15 of rupture, leads to 14 run-off the straight of cassette (as shown in Figure 3),
The problems such as being fallen so as to cause the wafer 15 in the entire cassette 14.Further, since the luminescence sensor 12 and
The receiving sensor 13 is respectively positioned on the front end of the mechanical arm 11, is transmitted in the mechanical arm 11 crawl wafer
In the process, also detecting perception can not be carried out to whether the wafer in transmission can be abnormal.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of camera shooting arrangement for detecting, have
The mechanical arm component and semiconductor production equipment for imaging arrangement for detecting, for solve in the prior art using luminescence sensor and
Receiving sensor carries out existing accuracy lower problem when detecting perceives to the arrangement situation of wafer, and can not be to transmission
In wafer whether be abnormal carry out detecting perception the problem of.
To achieve the above object and other related purposes, the present invention provide a kind of mechanical arm component, the mechanical arm
Component includes:
Mechanical arm, the mechanical arm include: transmission pedestal, fixed frame and inserted sheet；The fixed frame is fixed on described
Transmit the upper surface side of pedestal；Described inserted sheet one end is fixed on the fixed frame, and the inserted sheet and the transmission pedestal
Upper surface it is parallel, for grabbing the wafer in wafer cassette or cassette；The transmission pedestal for drive the fixed frame and
The inserted sheet rotation and mobile, the transfer with realization to wafer；
Arrangement for detecting is imaged, for detecting the arrangement situation of wafer in wafer cassette or cassette, the camera shooting arrangement for detecting packet
It includes:
Photographing module, for being imaged to the wafer in wafer cassette or cassette, to obtain the wafer cassette or the crystalline substance
The arrangement real image of wafer in boat；And
Counting module is connected with the photographing module, the row of the wafer for obtaining according to the photographing module
Cloth real image counts the wafer in the wafer cassette or the cassette, and obtains the adjacent crystalline substance according to counting time period
Spacing between circle；
Wherein, the camera shooting arrangement for detecting is fixed on the top of the fixed frame, and the camera shooting end court of the photographing module
The side of the inserted sheet is equipped with to the fixed frame.
As a preferred solution of the present invention, the photographing module is optical camera module.
As a preferred solution of the present invention, the counting module includes:
Counting unit is connected with the photographing module, the row of the wafer for obtaining according to the photographing module
Cloth real image carries out real-time counting to the wafer in the wafer cassette or the cassette；
Processing unit is connected with the counting unit, for according to the counting unit adjacent time counted twice
Spacing between the adjacent wafer of interval calculation.
As a preferred solution of the present invention, the camera shooting arrangement for detecting further includes display module, the display module
It is connected with the photographing module and the counting module, for showing that the arrangement of the wafer of the photographing module acquisition is real
At least one in the spacing three between adjacent wafers that picture, the count results of the counting module and the counting module obtain
Person.
As a preferred solution of the present invention, the camera shooting arrangement for detecting further include:
Shell, the shell is interior to be equipped with accommodating chamber, and the photographing module and the counting module are respectively positioned on the accommodating chamber
Interior, one end of the shell is equipped with the opening for exposing the photographing module；
Cooling water pipeline is surrounded on the periphery of the shell, and one end is connected with cooling water source, in the camera shooting mould
Block and the counting module are passed through cooling water when working to cool down to the photographing module and the counting module.
As a preferred solution of the present invention, the camera shooting arrangement for detecting further include:
Shell, the shell is interior to be equipped with accommodating chamber, and the photographing module and the counting module are respectively positioned on the accommodating chamber
It is interior, and there is spacing between the shell；One end of the shell is equipped with the opening for exposing the photographing module, the shell
It is equipped with air through hole and exhaust hole in vivo；The air through hole is connected with an air inlet pipeline, in the photographing module
And be passed through cooling gas into the shell when counting module work, with to the photographing module and the counting module into
Row cooling；The exhaust hole is connected with a gas exhaust piping.
As a preferred solution of the present invention, the mechanical arm includes five inserted sheets, five inserted sheet edges
The short transverse parallel interval of the fixed frame is arranged.
The present invention also provides a kind of semiconductor production equipment, the semiconductor production equipment includes:
Loading stage, for loading wafer cassette；
Vacuum transfer is connected to the loading stage；
The mechanical arm component as described in above-mentioned either a program is located in the vacuum transfer；
Reaction chamber is connected to the vacuum transfer.
The present invention also provides a kind of semiconductor production equipment, the semiconductor production equipment includes:
Loading stage, for loading wafer cassette；
Wafer loading zone has load interlocking vacuum plant；The wafer loading zone is connected to the loading stage；
The mechanical arm component as described in above-mentioned either a program is located in the wafer loading zone, and is located at described add
It carries between interlocking vacuum plant and the loading stage；
Batch type DIFFUSION TREATMENT chamber is connected to the wafer loading zone；
Cassette is located in the wafer loading zone, for loading wafer；The cassette can be in the wafer loading zone and institute
It states and is transmitted back and forth between batch type DIFFUSION TREATMENT chamber.
The present invention also provides a kind of semiconductor technology method, the semiconductor technology method includes the following steps:
1) wafer cassette equipped with wafer to be processed is loaded on into the semiconductor production equipment as described in above-mentioned either a program
On；
2) wafer in the wafer cassette is imaged from top to bottom using the camera shooting arrangement for detecting, described in obtaining
The arrangement real image of wafer in wafer cassette, and the arrangement real image of the wafer according to acquisition carries out the wafer in the wafer cassette
It counts, and obtains the spacing between the adjacent wafer according to counting time period；
3) wafer cassette is judged according to the spacing between the arrangement real image and the adjacent wafer of the wafer obtained
In wafer arrangement it is whether normal；
If 4) wafer arrangement in the wafer cassette is normal, the wafer is grabbed and passed using the mechanical arm
It send to carrying out process in the reaction chamber.
The present invention also provides a kind of semiconductor technology method, the semiconductor technology method includes the following steps:
1) wafer cassette equipped with wafer to be processed is loaded on into the semiconductor production equipment as described in above-mentioned either a program
On；
2) wafer in the wafer cassette is imaged from top to bottom using the camera shooting arrangement for detecting, described in obtaining
The arrangement real image of wafer in wafer cassette, and the arrangement real image of the wafer according to acquisition carries out the wafer in the wafer cassette
It counts, and obtains the spacing between the adjacent wafer according to counting time period；
3) wafer cassette is judged according to the spacing between the arrangement real image and the adjacent wafer of the wafer obtained
In wafer arrangement it is whether normal；
If 4) wafer arrangement in the wafer cassette is normal, the wafer is grabbed and passed using the mechanical arm
It send in the cassette to wafer loading zone, and the cassette for being mounted with the wafer is sent into the batch type DIFFUSION TREATMENT chamber
Indoor carry out process.
As a preferred solution of the present invention, further include following steps after step 4):
5) cassette is sent back into the wafer loading zone after process；
6) wafer in the cassette is imaged from top to bottom using the camera shooting arrangement for detecting, to obtain the crystalline substance
The arrangement real image of wafer in boat, and the arrangement real image of the wafer according to acquisition counts the wafer in the cassette,
And the spacing between the adjacent wafer is obtained according to counting time period；
7) judge in the cassette according to the spacing between the arrangement real image and the adjacent wafer of the wafer obtained
Wafer arrangement it is whether normal；
If 8) wafer arrangement in the cassette is normal, the wafer is grabbed and transmitted using the mechanical arm
Return the wafer cassette.
As described above, camera shooting arrangement for detecting provided by the invention, the mechanical arm component with camera shooting arrangement for detecting and half
Conductor production equipment has the advantages that and the camera shooting arrangement for detecting is arranged on mechanical arm component of the invention, passes through
Photographing module obtains the arrangement real image of wafer in wafer cassette or cassette, and by counting module to the wafer cassette or the cassette
In wafer counted, and the spacing between the adjacent wafer is obtained according to counting time period, since crystalline substance can be obtained
Round arrangement real image, and the spacing between the adjacent wafers for counting and obtaining is combined, difference millimetre-sized between wafer can be examined
It measures and, accuracy with higher；At the same time it can also realize the detecting in wafer transmit process.
Detailed description of the invention
Fig. 1 is shown as the overlooking structure diagram of mechanical arm crawl wafer in the prior art.
Fig. 2 to Fig. 3 is shown as in cassette there are fragmentation, and mechanical arm leads to the inclined schematic diagram of cassette when grabbing wafer.
Fig. 4 is shown as the structural schematic diagram of the mechanical arm component provided in the embodiment of the present invention one.
Fig. 5 to Fig. 9 is shown as the structural block diagram of the camera shooting arrangement for detecting provided in the embodiment of the present invention one.
Figure 10 to 12 is shown as the different arrangement situation schematic diagrams of wafer in wafer cassette, wherein wafer is normally arranged in Figure 10
Cloth, Tu11Zhong, wafer have lamination to arrange extremely, and Tu12Zhong, wafer has fragmentation to arrange extremely.
Figure 13 is shown as the partial structural diagram of the semiconductor production equipment provided in the embodiment of the present invention two.
Figure 14 is shown as the partial structural diagram of the semiconductor production equipment provided in the embodiment of the present invention three.
Figure 15 is shown as the flow chart of the semiconductor technology method provided in the embodiment of the present invention four.
Figure 16 is shown as the flow chart of the semiconductor approach provided in the embodiment of the present invention five.
Reference numerals explanation
11 mechanical arms
12 luminescence sensors
13 receiving sensors
14 cassettes
15 wafers
2 camera shooting arrangement for detecting
21 photographing modules
22 counting modules
221 counting units
222 processing modules
23 shells
231 openings
232 air through hole
233 exhaust holes
24 cooling water pipelines
25 accommodating chambers
26 camera shooting ends
3 display modules
4 mechanical arms
41 transmission bases
42 fixed frames
43 inserted sheets
51 loading stages
52 vacuum transfers
53 reaction chambers
61 wafer loading zones
62 load interlocking vacuum plants
63 batch type DIFFUSION TREATMENT chambers
64 cassettes
65 boat elevators
7 wafers
8 wafer cassettes
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Disclosed content understands further advantage and effect of the invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Fig. 4 is please referred to Figure 16.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, though only show in diagram with related component in the present invention rather than package count when according to actual implementation
Mesh, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind, and its
Assembly layout form may also be increasingly complex.
Embodiment one
Fig. 4 and Fig. 5 is please referred to, the present invention also provides a kind of mechanical arm component, the mechanical arm component includes: machinery
Arm 4, the mechanical arm 4 include: transmission pedestal 41, fixed frame 42 and inserted sheet 43；The fixed frame 42 is fixed on the biography
Send the upper surface side of pedestal 41；Described 43 one end of inserted sheet is fixed on the fixed frame 42, and the inserted sheet 43 and the biography
Send the upper surface of pedestal 41 parallel, for grabbing the wafer in wafer cassette or cassette；The transmission pedestal 41 is for driving institute
State fixed frame 42 and the rotation of the inserted sheet 43 and mobile, the transfer with realization to wafer；Arrangement for detecting 2 is imaged, for detecting crystalline substance
The arrangement situation of wafer, the camera shooting arrangement for detecting 2 include: photographing module 21 and counting module 22 in circle box or cassette, described
Photographing module 21 is for imaging the wafer in wafer cassette or cassette, to obtain wafer in the wafer cassette or the cassette
Arrangement real image；The counting module 22 is connected with the photographing module 21, for what is obtained according to the photographing module 21
The arrangement real image of the wafer counts the wafer in the wafer cassette or the cassette, and obtains according to counting time period
Take the spacing between the adjacent wafer；Wherein, the camera shooting arrangement for detecting 2 is fixed on the top of the fixed frame 42, and institute
The camera shooting end 26 for stating photographing module 21 is equipped with the side of the inserted sheet 43 towards the fixed frame 42；The camera shooting arrangement for detecting 2
Specific structure please refer to embodiment one, be not repeated herein.
As an example, the photographing module 21 can be but be not limited only to optical camera module；Preferably, the present embodiment
In, the photographing module 21 is optical photography instrument.
As an example, as shown in fig. 6, the counting module 22 includes: counting unit 221, the counting unit 221 and institute
It states photographing module 21 to be connected, the arrangement real image of the wafer for obtaining according to the photographing module 21 is to the wafer cassette
Or the wafer in the cassette carries out real-time counting；Processing unit 222, the processing unit 222 and 221 phase of counting unit
Connection, for calculating the spacing between the adjacent wafer according to the adjacent time interval counted twice of the counting unit 221.
As an example, the counting unit 221 can obtain the wafer cassette or the cassette in the photographing module 21
The arrangement real image of middle wafer carries out real-time counting to the wafer in the wafer cassette or the cassette simultaneously, can also take the photograph described
The arrangement real image of wafer is obtained in the wafer cassette or the cassette as module 21 and then is obtained according to the photographing module 21
The arrangement real image of wafer counts the wafer in the wafer cassette or the cassette in real time in the wafer cassette or the cassette
Number.
Camera shooting arrangement for detecting 2 of the invention obtains the arrangement real image of wafer in wafer cassette or cassette by photographing module 21,
And the wafer in the wafer cassette or the cassette is counted by counting module 22, and is obtained according to counting time period
Spacing between the adjacent wafer, due to that can obtain the arrangement real image of wafer, and combine count the adjacent wafers that obtain it
Between spacing, Difference test millimetre-sized between wafer can be come out, accuracy with higher.
In one example, as shown in fig. 7, the camera shooting arrangement for detecting 2 further include: shell 23 is equipped in the shell 23
Accommodating chamber 25, the photographing module 21 and the counting module 22 are respectively positioned in the accommodating chamber 25, one end of the shell 23
Equipped with the opening 231 for exposing the photographing module 21, to ensure that the photographing module 21 can be in wafer cassette or cassette
Wafer is imaged；Cooling water pipeline 24, the cooling water pipeline 24 are surrounded on the periphery of the shell 23, one end and cooling water
Source (not shown) is connected, for being passed through cooling water to described in the photographing module 21 and the work of the counting module 22
Photographing module 21 and the counting module 22 are cooled down.It is set since the camera shooting arrangement for detecting 2 is normally at semiconductor production
On standby internal mechanical arm, operating ambient temperature is higher, and higher temperature will will affect the photographing module 21 and institute
The precision of the work of counting module 22 is stated, therefore, cooling water pipeline 24 is set outside the shell 23 of the camera shooting arrangement for detecting 2
Cool down to the photographing module 21 and the counting module 22, can make the camera shooting arrangement for detecting 2 keep having compared with
High accuracy.
In another example, as shown in figure 8, the camera shooting arrangement for detecting further include: shell 23 is equipped in the shell 23
Accommodating chamber 25, the photographing module 21 and the counting module 22 are respectively positioned in the accommodating chamber 25, and with the shell 23 it
Between have spacing；One end of the shell 23 is equipped with the opening 231 for exposing the photographing module 21, to ensure the camera shooting mould
Block 21 can image the wafer in wafer cassette or cassette, be equipped with air through hole 232 and exhaust hole in the shell 23
233；The air through hole 232 is connected with an air inlet pipeline (not shown), in the photographing module 21 and the counting
Module 22 is passed through cooling gas into the shell 23 when working, to the photographing module 21 and the progress of the counting module 22
It is cooling；The exhaust hole 233 is connected with a gas exhaust piping (not shown).In the shell 23 setting with it is on its interior
The accommodating chamber 25 air through hole 232 and exhaust hole 233, can be by being passed through cooling gas (for example, cooling nitrogen
Deng) it is that the photographing module 21 and the counting module 22 cool down, ensuring the holding of camera shooting arrangement for detecting 2 tool
While having higher accuracy, have many advantages, such as that structure is simple, convenient to carry out and low in cost compared to water cooling.
As an example, as shown in figure 9, the camera shooting arrangement for detecting further includes display module 3, the display module 3 and institute
It states photographing module 21 and the counting module 22 is connected, the arrangement of the wafer for showing the acquisition of photographing module 21
In the spacing three between adjacent wafers that real image, the count results of the counting module 22 and the counting module 22 obtain
At least one.
As an example, the arrangement real image for the wafer that the display module 3 can obtain the photographing module 21, institute
The spacing between adjacent wafers that the count results and the counting module 22 for stating counting module 22 obtain is in same display unit
In show simultaneously；Arrangement real image, the counting module 22 for the wafer that the photographing module 21 can also be obtained
Count results and the counting module 22 obtain adjacent wafers between spacing it is selective in different display units
Distribution is shown.
By the way that the display module 3 is arranged, staff more can intuitively know what the photographing module 21 obtained
Between the adjacent wafers that the arrangement real image of the wafer, the count results of the counting module 22 and the counting module 22 obtain
The information such as spacing.
As an example, the quantity of the inserted sheet 43 can be set according to actual needs on the mechanical arm 4, it is described
The quantity of inserted sheet 43 can be a piece of, two panels, three pieces, four, five or more.Preferably, when the mechanical arm 4 is used for
When grabbing single-wafer, the quantity of the inserted sheet 43 is a piece of on the mechanical arm 4；The mechanical arm 4 is used for while grabbing
When taking more wafers, the quantity of the inserted sheet 43 is five on the mechanical arm 4.It should be noted that no matter the machinery
The quantity of the inserted sheet 43 is how many on arm 4, and all inserted sheets 43 are perpendicular with the side wall of the fixed frame 42, and work as
When the inserted sheet 43 is five, five inserted sheets 43 are arranged along the short transverse parallel interval of the fixed frame 42.
Wafer 7 is grabbed out of wafer cassette 8 with the mechanical arm 4 as an example, the embodiment of the present invention mechanical arm group
The working principle of part are as follows: before mechanical arm 4 grabs the wafer 7 out of described wafer cassette 8, the mechanical arm 4 is first moved to
The 8 opening top side of wafer cassette, is then moved from top to bottom, at this point, being located at the camera shooting on the mechanical arm 4
The photographing module 21 in arrangement for detecting 2 successively to the arrangement situation of the wafer 7 in the wafer cassette 8, meanwhile, the meter
The arrangement real image for the wafer 7 that digital-to-analogue block 22 is obtained according to the photographing module 21 is to the wafer 7 in the wafer cassette 8
It is counted, and obtains the spacing between the adjacent wafer 7 according to counting time period.When the crystalline substance in the wafer cassette 8
When circle 7 has any exception, the camera shooting arrangement for detecting 2 can accurately be found in time.Wherein, Figure 10 is the wafer 7 in institute
State the schematic diagram normally arranged in wafer cassette 8；Figure 11 is that the wafer 7 has what lamination arranged extremely to show in the wafer cassette 8
It is intended to, wherein the region a in Figure 11 is the area of absence of no wafer 7, and the region b is to have wafer 7 described in two panels to be stacked in
Lamination region together；Figure 12 is the schematic diagram that the wafer 7 has fragmentation to arrange extremely in the wafer cassette 8, is hited, Figure 12
In the region c be the fragmentation region for having fragmentation.
Embodiment two
Figure 13 is please referred to, the present invention also provides a kind of semiconductor production equipment, the semiconductor production equipment is at monolithic
Equipment is managed, the equipment as once handled wafer, the semiconductor production equipment includes: loading stage 51, described
Loading stage 51 is for loading wafer cassette 8；Vacuum transfer 52, the vacuum transfer 52 are connected to the loading stage 51；Strictly according to the facts
Mechanical arm component described in example one is applied, the mechanical arm component is located in the vacuum transfer 52, the manipulator
The specific structure of arm component please refers to embodiment one, is not repeated herein；Reaction chamber 53, the reaction chamber 53 are connected to institute
State vacuum transfer 52.
The working principle of semiconductor production equipment described in the present embodiment are as follows: be not loaded onto the dress in the wafer cassette 8
Before microscope carrier 51, the loading stage 51 and the vacuum transfer 52 and the vacuum be sent to 52 with the reaction chamber 53 it
Between there is isolating door (not shown) to keep apart；After the wafer cassette 8 loads on the loading stage 51, the wafer cassette 8
Box cover and the isolating door loaded between body 51 and the vacuum transfer 52 open, the mechanical arm 4 is moved to institute
The top side for stating wafer cassette, is moved from top to bottom, at this point, in the camera shooting arrangement for detecting 2 being located on the mechanical arm 4
The photographing module 21 successively to the arrangement situation of the wafer 7 in the wafer cassette 8, meanwhile, the counting module 22 according to
The arrangement real image of the wafer 7 obtained according to the photographing module 21 counts the wafer 7 in the wafer cassette 8,
And the spacing between the adjacent wafer 7 is obtained according to counting time period；When ensuring the wafer 7 in the wafer cassette 8
When without abnormal arrangement, the mechanical arm 4 grabs wafer 7 to be treated and is sent in the reaction chamber 53
Reason；Finally, the mechanical arm 4 grabs the wafer 7 and sends back the wafer cassette 8 after handling outside to the wafer 7
It is interior.It should be noted that the mechanical arm 4 grabs during the wafer 7 transmits, the reaction chamber 53 with it is described true
Isolating door between empty transfer chamber 52 is opened, and to the wafer 7 in the process of processing, the reaction chamber 53 and institute
The isolating door stated between vacuum transfer 52 is closed.It is described during transmitting wafer 7 using the mechanical arm 4
Camera shooting arrangement for detecting 2 carries out implementation detecting to the wafer 7 being located on the mechanical arm 4, to ensure that the wafer 7 is passing
It is found in time when being abnormal during sending.
Embodiment three
Figure 14 is please referred to, the present invention also provides a kind of semiconductor production equipment, the semiconductor production equipment is batch type
Processing equipment, it is preferable that in the present embodiment, the semiconductor production equipment is the batch processing equipment of diffusion technique, described partly to lead
Body production equipment includes: loading stage 51, and the loading stage 51 is for loading wafer cassette 8；Wafer loading zone 61, the wafer load
Area 61 has load interlocking vacuum plant 62；The wafer loading zone 61 is connected to the loading stage 51；In embodiment one as above
The mechanical arm component, the mechanical arm component are located in the wafer loading zone 61, and are located at the load and interlock
Between vacuum plant 62 and the loading stage 51；Batch type DIFFUSION TREATMENT chamber 63, the batch type DIFFUSION TREATMENT chamber 63 connect
It is connected to the wafer loading zone 61；Cassette 64, the cassette 64 is located in the wafer loading zone 61, for loading wafer；Institute
Stating cassette 64 can transmit back and forth between the wafer loading zone 61 and the batch type DIFFUSION TREATMENT chamber 63.
The working principle of semiconductor production equipment described in the present embodiment are as follows: when the wafer cassette 8 loads on the loading
After platform 51, the mechanical arm 4 is moved to the top side of the wafer cassette 8, moves from top to bottom, at this point, being located at described
The photographing module 21 in the camera shooting arrangement for detecting 2 on mechanical arm 4 is successively to the wafer 7 in the wafer cassette 8
Arrangement situation, meanwhile, the arrangement real image for the wafer 7 that the counting module 22 is obtained according to the photographing module 21 is to institute
The wafer 7 stated in wafer cassette 8 is counted, and obtains the spacing between the adjacent wafer 7 according to counting time period；
When ensuring the wafer 7 in the wafer cassette 8 without abnormal arrangement, the mechanical arm 4 grabs wafer 7 to be treated
It is sent in the cassette 64；After all wafers 7 to be treated are sent in the cassette 64, the cassette
64 are moved in the batch type DIFFUSION TREATMENT chamber 63 under the drive of boat elevator 65 and handle the wafer 7；
After being disposed to the wafer 7, the cassette 64 moves back to the wafer under the drive of the boat elevator 65 and adds
It carries in area 61；At this point, the mechanical arm 4 is moved to the 64 top side of cassette, move from top to bottom, at this point, being located at institute
The photographing module 21 in the camera shooting arrangement for detecting 2 on mechanical arm 4 is stated successively to the wafer 7 in the cassette 64
Arrangement situation, meanwhile, the arrangement real image for the wafer 7 that the counting module 22 is obtained according to the photographing module 21 is to institute
The wafer 7 stated in cassette 64 is counted, and obtains the spacing between the adjacent wafer 7 according to counting time period；
When ensuring the wafer 7 in the cassette 64 without abnormal arrangement, the mechanical arm 4 will be described in the cassette 64
Wafer 7 is successively transmitted back in the crystal-boat box 8.It is described to take the photograph during transmitting wafer 7 using the mechanical arm 4
As arrangement for detecting 2 to be located at the mechanical arm 4 on the wafer 7 carry out implementation detecting, to ensure that the wafer 7 is transmitting
It is found in time when being abnormal in the process.
Example IV
Incorporated by reference to Figure 13 refering to fig. 15, the present invention also provides a kind of semiconductor technology method, the semiconductor technology is pair
The technique that single-wafer is handled, the semiconductor technology method in the present embodiment described in embodiment two based on partly leading
Body production equipment is practiced, and the semiconductor technology method includes the following steps:
1) wafer cassette 8 equipped with wafer 7 to be processed is loaded on the semiconductor production equipment as described in embodiment two；
2) wafer 7 in the wafer cassette 8 is imaged from top to bottom using the camera shooting arrangement for detecting 2, to obtain
The arrangement real image of wafer 7 in the wafer cassette 8, and the arrangement real image of the wafer 7 according to acquisition is in the wafer cassette 8
Wafer 7 is counted, and obtains the spacing between the adjacent wafer 7 according to counting time period；
3) wafer is judged according to the spacing between the arrangement real image and the adjacent wafer 7 of the wafer 7 obtained
Whether the arrangement of wafer 7 in box 8 is normal；
If 4) wafer 7 in the wafer cassette 8 is arranged normally, the wafer 7 is grabbed using the mechanical arm 4
And it is sent in the reaction chamber 53 and carries out process.
Embodiment five
Incorporated by reference to Figure 14 refering to fig. 16, the present invention also provides a kind of semiconductor technology method, the semiconductor technology is pair
More wafers carry out the technique of batch processed, and the semiconductor technology method in the present embodiment is based on described in embodiment three
Semiconductor production equipment is practiced, and the semiconductor technology method includes the following steps:
1) wafer cassette 8 equipped with wafer 7 to be processed is loaded on the semiconductor production equipment as described in embodiment three；
2) wafer 7 in the wafer cassette 8 is imaged from top to bottom using the camera shooting arrangement for detecting 2, to obtain
The arrangement real image of wafer 7 in the wafer cassette 8, and the arrangement real image of the wafer 7 according to acquisition is in the wafer cassette 8
Wafer 7 is counted, and obtains the spacing between the adjacent wafer 7 according to counting time period；
3) wafer is judged according to the spacing between the arrangement real image and the adjacent wafer 7 of the wafer 7 obtained
Whether the arrangement of wafer 7 in box 8 is normal；
If 4) wafer 7 in the wafer cassette 8 is arranged normally, the wafer 7 is grabbed using the mechanical arm 4
And it is sent in the cassette 64 in the wafer loading zone 61, and the cassette 64 for being mounted with the wafer 7 is sent into described
Process is carried out in batch type DIFFUSION TREATMENT chamber 63.
As an example, further including following steps after step 4):
5) cassette 64 is sent back into the wafer loading zone 61 after process；
6) wafer 7 in the cassette 64 is imaged from top to bottom using the camera shooting arrangement for detecting 2, to obtain
The arrangement real image of wafer 77 in cassette 64 is stated, and the arrangement real image of the wafer according to acquisition is to the wafer in the cassette 64
7 are counted, and obtain the spacing between the adjacent wafer 7 according to counting time period；
7) cassette is judged according to the spacing between the arrangement real image and the adjacent wafer 7 of the wafer 7 obtained
Whether the arrangement of wafer 7 in 64 is normal；
If 8) wafer 7 in the cassette 64 is arranged normally, the wafer 7 is grabbed using the mechanical arm 4
And send back the wafer cassette 8.
In conclusion the present invention provide it is a kind of with camera shooting arrangement for detecting mechanical arm component and semiconductor production set
Standby, the mechanical arm component includes: mechanical arm, and the mechanical arm includes: transmission pedestal, fixed frame and inserted sheet；It is described
Fixed frame is fixed on the upper surface side of the transmission pedestal；Described inserted sheet one end is fixed on the fixed frame, and described slotting
Piece is parallel with the transmission upper surface of pedestal, for grabbing the wafer in wafer cassette or cassette；The transmission pedestal is used for
Drive the fixed frame and inserted sheet rotation and mobile, the transfer with realization to wafer；Arrangement for detecting is imaged, for detecting crystalline substance
The arrangement situation of wafer in circle box or cassette, the camera shooting arrangement for detecting includes: photographing module, for in wafer cassette or cassette
Wafer imaged, to obtain the arrangement real image of wafer in the wafer cassette or the cassette；And counting module, and it is described
Photographing module is connected, and the arrangement real image of the wafer for obtaining according to the photographing module is to the wafer cassette or described
Wafer in cassette is counted, and obtains the spacing between the adjacent wafer according to counting time period；Wherein, described to take the photograph
As arrangement for detecting is fixed on the top of the fixed frame, and the camera shooting end of the photographing module be equipped with towards the fixed frame it is described
The side of inserted sheet.The camera shooting arrangement for detecting is set on mechanical arm component of the invention, wafer cassette is obtained by photographing module
Or in cassette wafer arrangement real image, and the wafer in the wafer cassette or the cassette is counted by counting module,
And the spacing between the adjacent wafer is obtained according to counting time period, since the arrangement real image of wafer can be obtained, and tie
The spacing between adjacent wafers that total number obtains, Difference test millimetre-sized between wafer can be come out, with higher
Accuracy；At the same time it can also realize the detecting in wafer transmit process.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (12)
1. a kind of mechanical arm component, which is characterized in that the mechanical arm component includes:
Mechanical arm, the mechanical arm include: transmission pedestal, fixed frame and inserted sheet；The fixed frame is fixed on the transmission
The upper surface side of pedestal；Described inserted sheet one end is fixed on the fixed frame, and the inserted sheet transmits the upper of pedestal with described
Surface is parallel, for grabbing the wafer in wafer cassette or cassette；The transmission pedestal is for driving the fixed frame and described
Inserted sheet rotation and mobile, the transfer with realization to wafer；
Arrangement for detecting is imaged, for detecting the arrangement situation of wafer in wafer cassette or cassette, the camera shooting arrangement for detecting includes:
Photographing module, for being imaged to the wafer in wafer cassette or cassette, to obtain in the wafer cassette or the cassette
The arrangement real image of wafer；And
Counting module is connected with the photographing module, and the arrangement of the wafer for obtaining according to the photographing module is real
As being counted to the wafer in the wafer cassette or the cassette, and according to counting time period obtain the adjacent wafer it
Between spacing；
Wherein, the camera shooting arrangement for detecting is fixed on the top of the fixed frame, and the camera shooting end of the photographing module is towards institute
State the side that fixed frame is equipped with the inserted sheet.
2. mechanical arm component according to claim 1, which is characterized in that the photographing module is optical camera module.
3. mechanical arm component according to claim 1, which is characterized in that the counting module includes:
Counting unit is connected with the photographing module, and the arrangement of the wafer for obtaining according to the photographing module is real
As carrying out real-time counting to the wafer in the wafer cassette or the cassette；
Processing unit is connected with the counting unit, for according to the adjacent time interval counted twice of the counting unit
Calculate the spacing between the adjacent wafer.
4. mechanical arm component according to claim 1, which is characterized in that the camera shooting arrangement for detecting further includes display mould
Block, the display module are connected with the photographing module and the counting module, for showing what the photographing module obtained
Between between the adjacent wafers that the arrangement real image of the wafer, the count results of the counting module and the counting module obtain
Away from least one of three.
5. mechanical arm component according to any one of claim 1 to 4, which is characterized in that the camera shooting arrangement for detecting
Further include:
Shell, the shell is interior to be equipped with accommodating chamber, and the photographing module and the counting module are respectively positioned in the accommodating chamber, institute
The one end for stating shell is equipped with the opening for exposing the photographing module；
Cooling water pipeline is surrounded on the periphery of the shell, and one end is connected with cooling water source, in the photographing module and
The counting module is passed through cooling water when working to cool down to the photographing module and the counting module.
6. mechanical arm component according to any one of claim 1 to 4, which is characterized in that the camera shooting arrangement for detecting
Further include:
Shell, the shell is interior to be equipped with accommodating chamber, and the photographing module and the counting module are respectively positioned in the accommodating chamber, and
There is spacing between the shell；One end of the shell, which is equipped with, exposes the opening of the photographing module, in the shell
Equipped with air through hole and exhaust hole；The air through hole is connected with an air inlet pipeline, in the photographing module and institute
It is passed through cooling gas into the shell when stating counting module work, it is cold to be carried out to the photographing module and the counting module
But；The exhaust hole is connected with a gas exhaust piping.
7. mechanical arm component according to claim 1, which is characterized in that the mechanical arm includes five described slotting
Piece,
Five inserted sheets are arranged along the short transverse parallel interval of the fixed frame.
8. a kind of semiconductor production equipment, which is characterized in that the semiconductor production equipment includes:
Loading stage, for loading wafer cassette；
Vacuum transfer is connected to the loading stage；
Mechanical arm component as described in claim 1, is located in the vacuum transfer；
Reaction chamber is connected to the vacuum transfer.
9. a kind of semiconductor production equipment, which is characterized in that the semiconductor production equipment includes:
Loading stage, for loading wafer cassette；
Wafer loading zone has load interlocking vacuum plant；The wafer loading zone is connected to the loading stage；
Mechanical arm component as described in claim 1, is located in the wafer loading zone, and is located at the load and interlocks vacuum
Between device and the loading stage；
Batch type DIFFUSION TREATMENT chamber is connected to the wafer loading zone；
Cassette is located in the wafer loading zone, for loading wafer；The cassette can be in the wafer loading zone and described batch
It is transmitted back and forth between secondary type DIFFUSION TREATMENT chamber.
10. a kind of semiconductor technology method, which is characterized in that the semiconductor technology method includes the following steps:
1) wafer cassette equipped with wafer to be processed is loaded on semiconductor production equipment as claimed in claim 8；
2) wafer in the wafer cassette is imaged from top to bottom using the camera shooting arrangement for detecting, to obtain the wafer
The arrangement real image of wafer in box, and the arrangement real image of the wafer according to acquisition counts the wafer in the wafer cassette
Number, and the spacing between the adjacent wafer is obtained according to counting time period；
3) judge in the wafer cassette according to the spacing between the arrangement real image and the adjacent wafer of the wafer obtained
Whether wafer arrangement is normal；
If 4) wafer arrangement in the wafer cassette is normal, the wafer is grabbed and is sent to using the mechanical arm
Process is carried out in the reaction chamber.
11. a kind of semiconductor technology method, which is characterized in that the semiconductor technology method includes the following steps:
1) wafer cassette equipped with wafer to be processed is loaded on semiconductor production equipment as claimed in claim 9；
2) wafer in the wafer cassette is imaged from top to bottom using the camera shooting arrangement for detecting, to obtain the wafer
The arrangement real image of wafer in box, and the arrangement real image of the wafer according to acquisition counts the wafer in the wafer cassette
Number, and the spacing between the adjacent wafer is obtained according to counting time period；
3) judge in the wafer cassette according to the spacing between the arrangement real image and the adjacent wafer of the wafer obtained
Whether wafer arrangement is normal；
If 4) wafer arrangement in the wafer cassette is normal, the wafer is grabbed and is sent to using the mechanical arm
In the cassette in wafer loading zone, and the cassette for being mounted with the wafer is sent into the batch type DIFFUSION TREATMENT chamber
Carry out process.
12. semiconductor technology method according to claim 11, which is characterized in that further include walking as follows after step 4)
It is rapid:
5) cassette is sent back into the wafer loading zone after process；
6) wafer in the cassette is imaged from top to bottom using the camera shooting arrangement for detecting, to obtain in the cassette
The arrangement real image of wafer, and the arrangement real image of the wafer according to acquisition counts the wafer in the cassette, and according to
The spacing between the adjacent wafer is obtained according to counting time period；
7) crystalline substance in the cassette is judged according to the spacing between the arrangement real image and the adjacent wafer of the wafer obtained
Whether circle arrangement is normal；
If 8) wafer arrangement in the cassette is normal, the wafer is grabbed using the mechanical arm and sends back institute
State wafer cassette.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710815798.9A CN109483557B (en) | 2017-09-12 | 2017-09-12 | Manipulator arm assembly with camera shooting detection device and semiconductor production equipment |
| CN202010573208.8A CN111687861B (en) | 2017-09-12 | 2017-09-12 | Manipulator arm assembly with camera shooting detection device and semiconductor production equipment |
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| CN201710815798.9A CN109483557B (en) | 2017-09-12 | 2017-09-12 | Manipulator arm assembly with camera shooting detection device and semiconductor production equipment |
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| CN202010573208.8A Division CN111687861B (en) | 2017-09-12 | 2017-09-12 | Manipulator arm assembly with camera shooting detection device and semiconductor production equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110444493A (en) * | 2019-08-15 | 2019-11-12 | 德淮半导体有限公司 | A kind of device for preventing arm from hitting wafer |
| CN116936394A (en) * | 2023-07-27 | 2023-10-24 | 江苏森标科技有限公司 | Battery piece defect detection and colour sorting mechanism |
| CN117352438A (en) * | 2023-12-04 | 2024-01-05 | 北京锐洁机器人科技有限公司 | Multi-size wafer loading platform |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114783924B (en) * | 2022-04-06 | 2023-09-01 | 深圳市深科达智能装备股份有限公司 | Wafer carrying device, wafer carrying control method, electric device, and storage medium |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111687861B (en) | 2021-12-21 |
| CN109483557B (en) | 2021-01-26 |
| CN111687861A (en) | 2020-09-22 |
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