CN109478589A - 热电带材 - Google Patents

热电带材 Download PDF

Info

Publication number
CN109478589A
CN109478589A CN201780038242.1A CN201780038242A CN109478589A CN 109478589 A CN109478589 A CN 109478589A CN 201780038242 A CN201780038242 A CN 201780038242A CN 109478589 A CN109478589 A CN 109478589A
Authority
CN
China
Prior art keywords
thermoelectric
flexible
project
electrothermal module
thermoelectric element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780038242.1A
Other languages
English (en)
Chinese (zh)
Inventor
李在容
罗杰·W·巴顿
多纳托·G·凯瑞格
安基特·马哈詹
拉维·帕拉尼斯瓦米
詹姆斯·F·波奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN109478589A publication Critical patent/CN109478589A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Structure Of Printed Boards (AREA)
CN201780038242.1A 2016-06-23 2017-06-12 热电带材 Pending CN109478589A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662353752P 2016-06-23 2016-06-23
US62/353,752 2016-06-23
PCT/US2017/037032 WO2017222853A1 (en) 2016-06-23 2017-06-12 Thermoelectric tape

Publications (1)

Publication Number Publication Date
CN109478589A true CN109478589A (zh) 2019-03-15

Family

ID=59153305

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780038242.1A Pending CN109478589A (zh) 2016-06-23 2017-06-12 热电带材

Country Status (6)

Country Link
US (1) US20190181322A1 (https=)
EP (1) EP3475990B1 (https=)
JP (1) JP2019525454A (https=)
KR (1) KR102414392B1 (https=)
CN (1) CN109478589A (https=)
WO (1) WO2017222853A1 (https=)

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US11424397B2 (en) * 2017-03-16 2022-08-23 Lintec Corporation Electrode material for thermoelectric conversion modules and thermoelectric conversion module using same
EP3602642A4 (en) 2017-03-31 2020-12-23 3M Innovative Properties Company ELECTRONIC DEVICES INCLUDING SOLID SEMICONDUCTOR CHIPS
CN110573230B (zh) 2017-04-28 2022-09-06 3M创新有限公司 基于热电装置的空气过滤监测
US11450797B2 (en) 2017-12-08 2022-09-20 3M Innovative Properties Company Differential thermoelectric device
JPWO2021193357A1 (https=) * 2020-03-25 2021-09-30
WO2022232056A1 (en) * 2021-04-26 2022-11-03 Chan Zuckerberg Biohub, Inc. Testing devices
KR102910002B1 (ko) * 2021-10-18 2026-01-08 에스케이온 주식회사 배터리 모듈
KR102726083B1 (ko) * 2021-11-03 2024-11-05 엘티메탈 주식회사 배터리셀 냉각용 평판형 열전 소자

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CN1836340A (zh) * 2003-05-19 2006-09-20 应用数字解决方案公司 小功率热电发生器
JP3879769B1 (ja) * 2006-02-22 2007-02-14 株式会社村田製作所 熱電変換モジュールおよびその製造方法
WO2011019078A1 (ja) * 2009-08-13 2011-02-17 独立行政法人産業技術総合研究所 フレキシブル熱電発電デバイスの高速製造方法
JP2011091243A (ja) * 2009-10-23 2011-05-06 Osaka Univ 熱電変換モジュール及び熱電変換モジュール作製方法
US20110220162A1 (en) * 2010-03-15 2011-09-15 Siivola Edward P Thermoelectric (TE) Devices/Structures Including Thermoelectric Elements with Exposed Major Surfaces
CN102297543A (zh) * 2006-12-18 2011-12-28 美国能量变换公司 直接热电冷却器组件
JP2014007376A (ja) * 2012-05-30 2014-01-16 Denso Corp 熱電変換装置
JP2014033114A (ja) * 2012-08-03 2014-02-20 Fujitsu Ltd 熱電変換デバイス及びその製造方法
KR20150116187A (ko) * 2014-04-07 2015-10-15 홍익대학교 산학협력단 신축성 열전모듈
JP2016011949A (ja) * 2014-06-03 2016-01-21 株式会社デンソー 質量流量計および速度計

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DE10045419B4 (de) * 2000-09-14 2007-12-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines thermoelektrischen Bauelements, thermoelektrisches Bauelement sowie Vorrichtung zur Durchführung des Verfahrens
US6611046B2 (en) 2001-06-05 2003-08-26 3M Innovative Properties Company Flexible polyimide circuits having predetermined via angles
JP2003262425A (ja) * 2002-03-11 2003-09-19 Sekisui Plastics Co Ltd 加熱冷却帯状体および加熱冷却装置
JP4175839B2 (ja) * 2002-07-10 2008-11-05 株式会社東芝 流路管用熱電変換モジュール
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JP4829552B2 (ja) * 2004-07-06 2011-12-07 財団法人電力中央研究所 熱電変換モジュール
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JP5228160B2 (ja) * 2008-04-24 2013-07-03 株式会社アセット・ウィッツ 熱電変換モジュールならびにその製造方法および熱電発電システム
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WO2013114854A1 (ja) * 2012-02-03 2013-08-08 日本電気株式会社 有機熱電発電素子およびその製造方法
US20130218241A1 (en) * 2012-02-16 2013-08-22 Nanohmics, Inc. Membrane-Supported, Thermoelectric Compositions
JP5984748B2 (ja) * 2013-07-01 2016-09-06 富士フイルム株式会社 熱電変換素子および熱電変換モジュール
WO2015046254A1 (ja) * 2013-09-25 2015-04-02 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1836340A (zh) * 2003-05-19 2006-09-20 应用数字解决方案公司 小功率热电发生器
CN1795568A (zh) * 2003-05-23 2006-06-28 皇家飞利浦电子股份有限公司 热电器件的制造方法和通过该方法得到的热电器件
JP2007511893A (ja) * 2003-05-23 2007-05-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 熱電デバイスの製造方法およびそのような方法によって得られた熱電デバイス
JP3879769B1 (ja) * 2006-02-22 2007-02-14 株式会社村田製作所 熱電変換モジュールおよびその製造方法
CN102297543A (zh) * 2006-12-18 2011-12-28 美国能量变换公司 直接热电冷却器组件
WO2011019078A1 (ja) * 2009-08-13 2011-02-17 独立行政法人産業技術総合研究所 フレキシブル熱電発電デバイスの高速製造方法
JP2011091243A (ja) * 2009-10-23 2011-05-06 Osaka Univ 熱電変換モジュール及び熱電変換モジュール作製方法
US20110220162A1 (en) * 2010-03-15 2011-09-15 Siivola Edward P Thermoelectric (TE) Devices/Structures Including Thermoelectric Elements with Exposed Major Surfaces
JP2014007376A (ja) * 2012-05-30 2014-01-16 Denso Corp 熱電変換装置
JP2014033114A (ja) * 2012-08-03 2014-02-20 Fujitsu Ltd 熱電変換デバイス及びその製造方法
KR20150116187A (ko) * 2014-04-07 2015-10-15 홍익대학교 산학협력단 신축성 열전모듈
JP2016011949A (ja) * 2014-06-03 2016-01-21 株式会社デンソー 質量流量計および速度計

Also Published As

Publication number Publication date
EP3475990B1 (en) 2020-08-05
JP2019525454A (ja) 2019-09-05
US20190181322A1 (en) 2019-06-13
WO2017222853A1 (en) 2017-12-28
EP3475990A1 (en) 2019-05-01
KR102414392B1 (ko) 2022-06-30
KR20190022651A (ko) 2019-03-06

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Application publication date: 20190315

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