CN109473281B - Electronic component and electronic component device - Google Patents

Electronic component and electronic component device Download PDF

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Publication number
CN109473281B
CN109473281B CN201811038634.0A CN201811038634A CN109473281B CN 109473281 B CN109473281 B CN 109473281B CN 201811038634 A CN201811038634 A CN 201811038634A CN 109473281 B CN109473281 B CN 109473281B
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electrode layer
region
conductive resin
resin layer
face
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CN109473281A (en
Inventor
小野寺伸也
田村健寿
武田笃史
森田健
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TDK Corp
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TDK Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H01G4/1245—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates containing also titanates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

The invention provides an electronic component, wherein an element body in a rectangular parallelepiped shape has: a first main surface serving as a mounting surface, a second main surface facing the first main surface in the first direction, a pair of side surfaces facing each other in the second direction, and a pair of end surfaces facing each other in the third direction. The external electrodes are disposed at the ends of the element body in the third direction. The external electrode has a conductive resin layer. The conductive resin layer covers a region of the end face close to the first main face. The conductive resin layer has a height in the first direction when viewed from the third direction, the height being greater at the ends in the second direction than at the center in the second direction.

Description

Electronic component and electronic component device
Technical Field
The invention relates to an electronic component and an electronic component device.
Background
A known electronic component includes an element body having a rectangular parallelepiped shape and a plurality of external electrodes (see, for example, japanese unexamined patent publication No. 8-107038). The element has: a pair of main surfaces opposed to each other, a pair of end surfaces opposed to each other, and a pair of side surfaces opposed to each other. The plurality of external electrodes are disposed at both end portions of the element body in the direction in which the pair of end faces face each other. The external electrode has a conductive resin layer covering the entire end face.
Disclosure of Invention
An object of one embodiment of the present invention is to provide a conductive sub-member in which an electrical resin layer is less likely to peel from an element body and moisture resistance reliability is improved. Another object of the present invention is to provide an electronic component device in which a conductive resin layer is less likely to peel from an element body and moisture resistance reliability is improved.
An electronic component of one embodiment includes an element body having a rectangular parallelepiped shape and a plurality of external electrodes. The element has: a first main surface serving as a mounting surface, a second main surface facing the first main surface in the first direction, a pair of side surfaces facing each other in the second direction, and a pair of end surfaces facing each other in the third direction. The plurality of external electrodes are disposed at both ends of the element body in the third direction, respectively. The plurality of external electrodes have a conductive resin layer. The conductive resin layer covers a region close to the first main surface of a corresponding one of the pair of end surfaces. The conductive resin layer has a height in the first direction when viewed from the third direction, the height being greater at the ends in the second direction than at the center in the second direction.
In the above one aspect, the conductive resin layer has a height in the first direction that is greater at the end in the second direction than at the center in the second direction when viewed from the third direction. Therefore, the conductive resin layer is difficult to peel from the matrix. Moisture may penetrate into the region between the element body and the conductive resin layer. When moisture penetrates from the region between the element body and the conductive resin layer, the durability of the electronic component is reduced. In the above-described one embodiment, the paths through which moisture permeates are less than in a structure in which the conductive resin layer covers the entire end face. Therefore, the above embodiment can improve the moisture resistance reliability. As a result, the above-described one embodiment can provide an electronic component in which the conductive resin layer is less likely to peel from the element body and the moisture resistance reliability is improved.
When a certain element is described as covering another element, the certain element may directly cover the other element or indirectly cover the other element.
In the above-described one aspect, the conductive resin layer may cover a region close to the first main surface of the first ridge line portion located between the corresponding end surface and the side surface. The height of the portion of the conductive resin layer covering the first ridge line portion in the first direction may be larger than the height of the conductive resin layer at the center in the second direction when viewed from the third direction. In this structure, the conductive resin layer is less likely to peel off from the matrix.
In the above one aspect, the conductive resin layer may cover a region of the first main surface close to the corresponding end face. When electronic components are mounted by soldering to electronic devices, external forces acting on the electronic components from the electronic devices tend to act as stresses on the element body. The electronic device is, for example, a circuit board or an electronic component. The external force acts on the element body from the solder fillet formed at the time of solder mounting through the external electrode. The external force tends to act on the region of the first main surface of the element body near the end face. In the structure in which the conductive resin layer covers the region near the end face of the first main surface, an external force acting on the electronic component from the electronic device is less likely to act on the element body. Therefore, the above structure can suppress the occurrence of cracks in the element body.
In the above one aspect, the conductive resin layer may integrally cover: a region of the first main surface near the corresponding end surface, and a region of the corresponding end surface near the first main surface. When the conductive resin layer integrally covers the region of the first main surface close to the corresponding end face and the region of the corresponding end face close to the first main surface, the conductive resin layer is less likely to be reliably peeled from the end face, and the external force acting on the electronic component from the electronic device is less likely to be reliably applied to the element body.
In the above one aspect, the conductive resin layer may integrally cover: the region of the first main surface near the corresponding end surface, the region of the corresponding end surface near the first main surface, and the region of the side surface near the first main surface. When the conductive resin layer covers the region of the first main surface close to the corresponding end face, the region of the corresponding end face close to the first main surface, and the region of the side surface close to the first main surface, the conductive resin layer is less likely to be more reliably peeled from the end face, and an external force acting on the electronic component from the electronic device is less likely to be more reliably applied to the element body.
The one aspect may further include an internal conductor exposed at the corresponding end surface. The plurality of external electrodes may have sintered metal layers formed on the corresponding end surfaces so as to be connected to the internal conductors. The sintered metal layer may have: a first region covered with the conductive resin layer, and a second region exposed from the conductive resin layer. In the present structure, the sintered metal layer is in good contact with the internal conductor. Therefore, the external electrode and the internal conductor are reliably electrically connected. The conductive resin layer contains a conductive material and a resin. The conductive material contains, for example, metal powder. The resin contains, for example, a thermosetting resin. The resistance of the conductive resin layer is greater than that of the sintered metal layer. In the case where the sintered metal layer has the second region, the second region is electrically connected to the electronic device without the conductive resin layer. Therefore, even when the external electrode has a conductive resin layer, the present structure suppresses an increase in ESR (equivalent series resistance).
In the above one embodiment, the sintered metal layer may be formed by: a first ridge line portion located between the corresponding end surface and the side surface, and a second ridge line portion located between the corresponding end surface and the first main surface. The conductive resin layer may cover the entire part of the sintered metal layer formed on the first ridge line portion and the part formed on the second ridge line portion. The bonding strength between the conductive resin layer and the element body is smaller than the bonding strength between the conductive resin layer and the sintered metal layer. Therefore, the conductive resin layer may be peeled off from the matrix. In this structure, the conductive resin layer covers the entire part of the sintered metal layer formed at the first ridge line portion and the part formed at the second ridge line portion. Therefore, in the present structure, even when the conductive resin layer is peeled from the element body, the peeling of the conductive resin layer is less likely to progress beyond the positions corresponding to the first ridge line portion and the second ridge line portion to the positions corresponding to the end faces.
In the above one aspect, the plurality of external electrodes may have a plating layer covering the second region of the conductive resin layer and the sintered metal layer. In the present structure, the electronic component can be mounted to the electronic apparatus by soldering. The second region of the sintered metal layer is electrically connected to the electronic device via the plating layer. Therefore, this structure can further suppress an increase in ESR.
Another electronic component device according to another embodiment includes the electronic component and an electronic apparatus having a plurality of pad electrodes. The plurality of external electrodes are connected to corresponding ones of the plurality of pad electrodes via solder fillets, respectively.
In the other embodiment, as described above, the conductive resin layer is less likely to peel from the element body, and the moisture resistance reliability is improved.
In the other aspect, the electronic component may include an internal conductor exposed at the corresponding end surface. The external electrode may have a sintered metal layer disposed between the conductive resin layer and the element body. The sintered metal layer has: a first region covered with the conductive resin layer, and a second region exposed from the conductive resin layer. The solder fillet may also overlap the second area of the sintered metal layer when viewed from the third direction. In the present structure, the second region is electrically connected to the electronic device via the solder fillet. The second region is electrically connected to the electronic device without via the conductive resin layer. Therefore, this structure can suppress an increase in ESR even when the external electrode has a conductive resin layer.
The present invention will become more fully understood from the detailed description given below and the accompanying drawings given solely by way of illustration, and thus, are not to be considered as limiting the invention.
The detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
Drawings
Fig. 1 is a perspective view of a multilayer capacitor of a first embodiment;
fig. 2 is a side view of the multilayer capacitor of the first embodiment;
fig. 3 is a view showing a cross-sectional structure of the multilayer capacitor according to the first embodiment;
fig. 4 is a view showing a cross-sectional structure of the multilayer capacitor according to the first embodiment;
fig. 5 is a view showing a cross-sectional structure of the multilayer capacitor according to the first embodiment;
fig. 6 is a plan view showing the element body, the first electrode layer, and the second electrode layer;
fig. 7 is a side view showing the element body, the first electrode layer, and the second electrode layer;
fig. 8 is an end view showing the element body, the first electrode layer, and the second electrode layer;
fig. 9 is a view showing a mounting structure of the multilayer capacitor according to the first embodiment;
fig. 10 is a plan view of the laminated feedthrough capacitor of the second embodiment;
fig. 11 is a plan view of the laminated feedthrough capacitor of the second embodiment;
fig. 12 is a side view of the laminated feedthrough capacitor of the second embodiment;
fig. 13 is an end view of the laminated feedthrough capacitor of the second embodiment;
fig. 14 is a view showing a cross-sectional structure of the laminated feedthrough capacitor according to the second embodiment;
fig. 15 is a view showing a cross-sectional structure of the laminated feedthrough capacitor according to the second embodiment;
fig. 16 is a view showing a cross-sectional structure of the laminated feedthrough capacitor according to the second embodiment;
fig. 17 is a side view showing the element body, the first electrode layer, and the second electrode layer.
Detailed Description
In the following description, the same reference numerals are given to the same structures or structures having the same functions, and redundant description is omitted.
(first embodiment)
The structure of the multilayer capacitor C1 according to the first embodiment will be described with reference to fig. 1 to 8. Fig. 1 is a perspective view of a multilayer capacitor according to a first embodiment. Fig. 2 is a side view of the multilayer capacitor of the first embodiment. Fig. 3, 4, and 5 are views showing cross-sectional structures of the multilayer capacitor according to the first embodiment. Fig. 6 is a plan view showing the element body, the first electrode layer, and the second electrode layer. Fig. 7 is a side view showing the element body, the first electrode layer, and the second electrode layer. Fig. 8 is an end view showing the element body, the first electrode layer, and the second electrode layer. In the first embodiment, the electronic component is, for example, a multilayer capacitor C1.
As shown in fig. 1, the multilayer capacitor C1 includes an element body 3 having a rectangular parallelepiped shape and a plurality of external electrodes 5. In the present embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. The pair of external electrodes 5 are disposed on the outer surface of the element body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge portions are chamfered and a rectangular parallelepiped shape in which corners and ridge portions are rounded.
The element 3 has: a pair of main surfaces 3a and 3b facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. The pair of main surfaces 3a and 3b and the pair of side surfaces 3c are each rectangular. The direction in which the pair of main surfaces 3a and 3b face each other is the first direction D1. The direction in which the pair of side faces 3c oppose each other is the second direction D2. The opposing direction of the pair of end faces 3e is the third direction D3. The multilayer capacitor C1 is solder-mounted to the electronic device. The electronic device includes, for example, a circuit substrate or an electronic component. In the multilayer capacitor C1, the main surface 3a faces the electronic device. The main surface 3a is arranged to constitute a mounting surface. The principal surface 3a is a mounting surface.
The first direction D1 is a direction orthogonal to the main surfaces 3a and 3b, and is orthogonal to the second direction D2. The third direction D3 is a direction parallel to the main surfaces 3a and 3b and the side surfaces 3c, and is orthogonal to the first direction D1 and the second direction D2. The second direction D2 is a direction orthogonal to the side surfaces 3c, and the third direction D3 is a direction orthogonal to the end surfaces 3 e. In the first embodiment, the length of the element body 3 in the third direction D3 is greater than the length of the element body 3 in the first direction D1 and greater than the length of the element body 3 in the second direction D2. The third direction D3 is the longitudinal direction of the element body 3.
The pair of side surfaces 3c extend in the first direction D1 so as to connect the pair of main surfaces 3a and 3 b. The pair of side surfaces 3c also extends in the third direction D3. The pair of end surfaces 3e extend in the first direction D1 so as to connect the pair of main surfaces 3a and 3 b. The pair of end faces 3e also extend in the second direction D2.
The element 3 has: a pair of ridge line portions 3g, a pair of ridge line portions 3h, four ridge line portions 3i, a pair of ridge line portions 3j, and a pair of ridge line portions 3 k. The ridge portion 3g is located between the end face 3e and the main face 3 a. The ridge portion 3h is located between the end face 3e and the main face 3 b. The ridge line portion 3i is located between the end face 3e and the side face 3 c. The ridge line portion 3j is located between the main surface 3a and the side surface 3 c. The ridge line portion 3k is located between the main surface 3b and the side surface 3 c. In the present embodiment, each of the ridge portions 3g, 3h, 3i, 3j, 3k is rounded. The element body 3 is subjected to so-called reverse R-plane processing.
The end face 3e and the main face 3a are indirectly adjacent to each other via the ridge portion 3 g. The end face 3e and the main face 3b are indirectly adjacent to each other via the ridge portion 3 h. The end face 3e and the side face 3c are indirectly adjacent to each other via the ridge line portion 3 i. The main surface 3a and the side surface 3c are indirectly adjacent to each other via the ridge portion 3 j. The main surface 3b and the side surface 3c are indirectly adjacent to each other via the ridge portion 3 k.
The element body 3 is formed by laminating a plurality of dielectric layers in the second direction D2. The element body 3 has a plurality of dielectric layers laminated together. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the second direction D2. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example: BaTiO 23Series, Ba (Ti, Zr) O3Is (Ba, Ca) TiO or3Is an electric medium ceramic. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers cannot be recognized. In the element body 3, the stacking direction of the plurality of dielectric layers may be aligned with the first direction D1.
As shown in fig. 3, 4, and 5, the multilayer capacitor C1 includes a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each of the inner electrodes 7 and 9 is an inner conductor disposed in the element body 3. Each of the internal electrodes 7 and 9 is made of a conductive material which is generally used as an internal electrode of a laminated electronic component. The conductive material contains, for example, a base metal. The conductive material contains, for example, Ni or Cu. The internal electrodes 7 and 9 are formed as sintered bodies of conductive paste containing the conductive material. In the first embodiment, the internal electrodes 7 and 9 are made of Ni.
The internal electrodes 7 and the internal electrodes 9 are disposed at different positions (layers) in the second direction D2. The internal electrodes 7 and the internal electrodes 9 are alternately arranged in the element body 3 so as to face each other with a gap therebetween in the second direction D2. The internal electrodes 7 and 9 are different in polarity from each other. When the stacking direction of the plurality of dielectric layers is the first direction D1, the internal electrodes 7 and the internal electrodes 9 are disposed at different positions (layers) in the first direction D1. One end of each of the internal electrodes 7 and 9 is exposed at the corresponding end face 3 e. The internal electrodes 7 and 9 have one ends exposed at the corresponding end surfaces 3 e.
The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are alternately arranged in the second direction D2. The inner electrodes 7 and 9 are located in planes substantially perpendicular to the main surfaces 3a and 3 b. The internal electrodes 7 and 9 are opposed to each other in the second direction D2. The direction in which the internal electrodes 7 and 9 face each other (the second direction D2) is perpendicular to the direction (the first direction D1) perpendicular to the main surfaces 3a and 3 b.
As shown in fig. 2, the external electrodes 5 are disposed at both ends of the element body 3 in the third direction D3, respectively. Each external electrode 5 is disposed on the corresponding end face 3e side of the element body 3. As shown in fig. 3, 4, and 5, the external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, and 5 e. The electrode portion 5a is disposed on the principal surface 3a and on the ridge portion 3 g. The electrode portion 5b is disposed on the ridge portion 3 h. The electrode portions 5c are disposed on the side surfaces 3c and on the ridge portions 3 i. The electrode portions 5e are disposed on the corresponding end surfaces 3 e. The external electrode 5 also has an electrode portion disposed on the ridge portion 3 j.
The external electrodes 5 are formed on four surfaces, i.e., one main surface 3a, one end surface 3e, and a pair of side surfaces 3c, and on the ridge line portions 3g, 3h, 3i, and 3 j. The electrode portions 5a, 5b, 5c, 5e adjacent to each other are connected to each other and electrically connected. In the present embodiment, the external electrode 5 is not intentionally formed on the main surface 3 b. The electrode portion 5e disposed on the end face 3e entirely covers one end of the corresponding internal electrode 7, 9. The internal electrodes 7 and 9 are directly connected to the corresponding electrode portions 5 e. The internal electrodes 7 and 9 are electrically connected to the corresponding external electrodes 5.
As shown in fig. 3, 4, and 5, the external electrode 5 includes: a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 is the outermost layer of the external electrode 5. Each of the electrode portions 5a, 5c, and 5E includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The electrode portion 5b includes a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4.
The first electrode layer E1 of the electrode portion 5a is disposed on the ridge portion 3g and not on the main surface 3 a. In the present embodiment, the first electrode layer E1 of the electrode portion 5a is in contact with the entire ridge portion 3 g. The main surface 3a is not covered with the first electrode layer E1, but is exposed from the first electrode layer E1. The second electrode layer E2 of the electrode portion 5a is disposed on the first electrode layer E1 and on the main surface 3 a. The entirety of the first electrode layer E1 is covered with the second electrode layer E2. In the electrode portion 5a, the second electrode layer E2 is in contact with a part of the main surface 3a and the entire first electrode layer E1. The electrode portion 5a has a four-layer structure on the ridge portion 3g and a three-layer structure on the main surface 3 a.
As described above, when a certain element is described as covering another element, the certain element may directly cover the other element or indirectly cover the other element. When a certain element is described as indirectly covering another element, the element is interposed between the certain element and the other element. When a certain element is described as directly covering another element, the element does not exist between the certain element and the other element.
The second electrode layer E2 of the electrode portion 5a is formed so as to cover the entire ridge portion 3g and a part of the main surface 3 a. The second electrode layer E2 of the electrode portion 5a indirectly covers the entire ridge portion 3g so that the first electrode layer E1 is positioned between the second electrode layer E2 and the ridge portion 3 g. The second electrode layer E2 of the electrode portion 5a directly covers a part of the principal surface 3 a. The second electrode layer E2 of the electrode portion 5a directly covers the entire part of the ridge portion 3g formed in the first electrode layer E1.
The first electrode layer E1 of the electrode portion 5b is disposed on the ridge portion 3h and not on the main surface 3 b. In the present embodiment, the first electrode layer E1 of the electrode portion 5b is in contact with the entire ridge portion 3 h. The main surface 3b is not covered with the first electrode layer E1, but is exposed from the first electrode layer E1. The electrode portion 5b does not have the second electrode layer E2. The main surface 3b is not covered with the second electrode layer E2, but is exposed from the second electrode layer E2. The electrode portion 5b has a three-layer structure.
The first electrode layer E1 of the electrode portion 5c is disposed on the ridge portion 3i, but not on the side surface 3 c. In the present embodiment, the first electrode layer E1 of the electrode portion 5c is in contact with the entire ridge line portion 3 i. The side surface 3c is not covered with the first electrode layer E1, but is exposed from the first electrode layer E1. The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and on the side surface 3 c. A part of the first electrode layer E1 is covered with the second electrode layer E2. In the electrode portion 5c, the second electrode layer E2 is in contact with a part of the side surface 3c and a part of the first electrode layer E1.
The second electrode layer E2 of the electrode portion 5c is formed so as to cover a part of the ridge portion 3i and a part of the side surface 3 c. The second electrode layer E2 of the electrode portion 5c indirectly covers a part of the ridge portion 3i so that the first electrode layer E1 is positioned between the second electrode layer E2 and the ridge portion 3 i. The second electrode layer E2 of the electrode portion 5c indirectly covers the region of the ridge portion 3i close to the main surface 3 a. The second electrode layer E2 of the electrode portion 5c directly covers a part of the side surface 3 c. The second electrode layer E2 of the electrode portion 5c directly covers a part of the first electrode layer E1 formed in the ridge portion 3 i.
The electrode portion 5c has an area 5c1And region 5c2. Region 5c2Is located in the ratio area 5c1Closer to the main surface 3 a. In the present embodiment, the electrode portion 5c has only two regions 5c1、5c2. Region 5c1Has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 5c1The second electrode layer E2 is not present. Region 5c1Is a three-layer structure. Region 5c2Has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. Region 5c2The ridge portion 3i has a four-layer structure, and the side surface 3c has a three-layer structure. Region 5c1The first electrode layer E1 is exposed from the second electrode layer E2. Region 5c2Is a region where the first electrode layer E1 is covered with the second electrode layer E2.
The first electrode layer E1 of the electrode portion 5E is disposed on the end face 3E. The entire end face 3E is covered with the first electrode layer E1. The first electrode layer E1 of the electrode portion 5E is in contact with the entire end face 3E. The second electrode layer E2 of the electrode portion 5E is disposed on the first electrode layer E1. A part of the first electrode layer E1 is covered with the second electrode layer E2. In the electrode portion 5E, the second electrode layer E2 is in contact with a part of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5E is formed so as to cover a part of the end face 3E. The second electrode layer E2 of the electrode portion 5E indirectly covers a part of the end face 3E in such a manner that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3E. The second electrode layer E2 of the electrode portion 5E directly covers a part of the first electrode layer E1 formed on the end face 3E.
The electrode portion 5e has an area 5e1And region 5e2. Region 5e2Is located in a ratio area 5e1Closer to the main surface 3 a. In the present embodiment, the electrode portion 5e has only two regions 5e1、5e2. Region 5e1Has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 5e1The second electrode layer E2 is not present. Region 5e1Is a three-layer structure. Region 5e2Has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. Region 5e2Is of a four-layer construction. Region 5e1The first electrode layer E1 is exposed from the second electrode layer E2. Region 5e2Is a region where the first electrode layer E1 is covered with the second electrode layer E2.
The first electrode layer E1 is formed by sintering the electroconductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover the end face 3E and the ridge portions 3g, 3h, and 3 i. The first electrode layer E1 is formed by sintering a metal component (metal powder) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. The first electrode layer E1 is not intentionally formed on the pair of main surfaces 3a and 3b and the pair of side surfaces 3 c. For example, the first electrode layer E1 may be unintentionally formed on the main surfaces 3a and 3b and the side surface 3c due to manufacturing errors or the like.
In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example: a powder composed of Cu or Ni, a glass component, an organic binder, and an organic solvent.
The second electrode layer E2 is formed by curing the conductive resin applied to the first electrode layer E1, the main surface 3a, and the pair of side surfaces 3 c. The second electrode layer E2 is formed over the first electrode layer E1 and over the element body 3. The second electrode layer E2 covers a partial region of the first electrode layer E1. The second electrode layer E2 covers the region 5c of the first electrode layer E1 with the electrode portion 5a and the electrode portion 5c2And an electrode unit5e of the region 5e2The corresponding area. The second electrode layer E2 directly covers a part of the ridge line portion 3 j. The second electrode layer E2 is in contact with a part of the ridge line portion 3 j. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer formed on the first electrode layer E1.
The conductive resin paste contains, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, metal powder. The metal powder is, for example, Ag powder or Cu powder. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin.
The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 by an electroplating method. The third electrode layer E3 is formed in a portion of the first electrode layer E1 exposed from the second electrode layer E2. The third electrode layer E3 directly covers the second electrode layer E2 and a portion of the first electrode layer E1 exposed from the second electrode layer E2. In this embodiment mode, the third electrode layer E3 is formed by plating Ni on the first electrode layer E1 and on the second electrode layer E2. The third electrode layer E3 is a Ni-plated layer. The third electrode layer E3 may be a Sn plated layer, a Cu plated layer, or an Au plated layer. The third electrode layer E3 contains Ni, Sn, Cu, or Au.
The fourth electrode layer E4 is formed on the third electrode layer E3 by an electroplating method. The fourth electrode layer E4 indirectly covers the second electrode layer E2 and the portion of the first electrode layer E1 exposed from the second electrode layer E2 so that the third electrode layer E3 is located between the fourth electrode layer E4 and the portions of the second electrode layer E2 and the first electrode layer E1 exposed from the second electrode layer E2. In this embodiment mode, the fourth electrode layer E4 is formed by plating Sn on the third electrode layer E3. The fourth electrode layer E4 is a Sn plated layer. The fourth electrode layer E4 may also be a Cu-plated layer or an Au-plated layer. The fourth electrode layer E4 contains Sn, Cu, or Au. The third electrode layer E3 and the fourth electrode layer E4 constitute a plating layer formed on the second electrode layer E2. In this embodiment mode, the plating layer formed on the second electrode layer E2 has a two-layer structure.
The first electrode layers E1 included in the electrode portions 5a, 5b, 5c, and 5E are integrally formed. The second electrode layer E2 included in each of the electrode portions 5a, 5c, and 5E is integrally formed. The third electrode layers E3 included in the electrode portions 5a, 5b, 5c, and 5E are integrally formed. The fourth electrode layer E4 included in each of the electrode portions 5a, 5b, 5c, and 5E is integrally formed.
The first electrode layer E1 (the first electrode layer E1 of the electrode portion 5E) is formed on the end face 3E so as to be connected to the corresponding internal electrodes 7 and 9. The first electrode layer E1 covers the entire end face 3E, the entire ridge portion 3g, the entire ridge portion 3h, and the entire ridge portion 3 i. The second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, 5E) continuously covers a part of the principal surface 3a, a part of the end surface 3E, and a part of each of the pair of side surfaces 3 c. The second electrode layer E2 integrally covers a region of the principal surface 3a near the end surface 3E, a region of the end surface 3E near the principal surface 3a, and a region of the side surface 3c near the principal surface 3 a.
The second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, 5E) covers the entire ridge portion 3g, a part of the ridge portion 3i, and a part of the ridge portion 3 j. The second electrode layer E2 covers the entire ridge portion 3g, a part of the ridge portion 3i, and a part of the ridge portion 3j such that the first electrode layer E1 is located between the ridge portion 3g, the ridge portion 3i, and the ridge portion 3j and the second electrode layer E2. The second electrode layer E2 directly covers the entire part of the first electrode layer E1 formed in the ridge portion 3g, a part of the part formed in the ridge portion 3i, and a part of the part formed in the ridge portion 3 j. The second electrode layer E2 has a plurality of portions corresponding to a part of the principal surface 3a, a part of the end surface 3E, parts of the pair of side surfaces 3c, the entirety of the ridge portion 3g, a part of the ridge portion 3i, and a part of the ridge portion 3j, respectively.
The first electrode layer E1 (the first electrode layer E1 of the electrode portions 5a, 5b, 5c, 5E) has a region covered with the second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, 5E) and a region not covered with the second electrode layer E2 (the second electrode layer E2 of the electrode portions 5a, 5c, 5E). The region not covered with the second electrode layer E2 is a region exposed from the second electrode layer E2. The third electrode layer E3 and the fourth electrode layer E4 cover a region of the first electrode layer E1 not covered by the second electrode layer E2 and the second electrode layer E2. The first electrode layer E1 (the first electrode layer E1 of the electrode portion 5E) is directly connected to the corresponding internal electrodes 7, 9.
As shown in fig. 6, when viewed from the first direction D1, the entire first electrode layer E1 (the first electrode layer E1 of the electrode portion 5 a) is covered with the second electrode layer E2. When viewed from the first direction D1, the first electrode layer E1 (the first electrode layer E1 of the electrode portion 5 a) is not exposed from the second electrode layer E2.
As shown in fig. 7, when viewed from the second direction D2, an end region of the first electrode layer E1 near the main surface 3a is covered with the second electrode layer E2. The end region of the first electrode layer E1 close to the main surface 3a includes a region 5c2Has a first electrode layer E1. When viewed from the second direction D2, the end edge E2E of the second electrode layer E2 intersects the end edge E1E of the first electrode layer E1. When viewed from the second direction D2, an end region of the first electrode layer E1 close to the main surface 3b is exposed from the second electrode layer E2. The end region of the first electrode layer E1 close to the main surface 3b includes a region 5c1Has a first electrode layer E1. The area of the second electrode layer E2 on the side surface 3c and the ridge portion 3i is larger than the area of the first electrode layer E1 on the ridge portion 3 i.
As shown in fig. 8, when viewed from the third direction D3, an end region of the first electrode layer E1 near the main surface 3a is covered with the second electrode layer E2. The end region of the first electrode layer E1 near the main surface 3a includes a region 5E2Has a first electrode layer E1. When viewed from the third direction D3, the edge E2E of the second electrode layer E2 is located on the first electrode layer E1. When viewed from the third direction D3, an end region of the first electrode layer E1 close to the main surface 3b is exposed from the second electrode layer E2. The end region of the first electrode layer E1 close to the main surface 3b includes a region 5E1Has a first electrode layer E1. The area of the second electrode layer E2 on the end face 3E and the ridge portion 3g is smaller than the area of the first electrode layer E1 on the end face 3E and the ridge portion 3 g.
In the present embodiment, the second electrode layer E2 is formed so as to continuously cover only a part of the principal surface 3a, a part of the end surface 3E, and a part of each of the pair of side surfaces 3 c. The second electrode layer E2 is formed so as to cover only the entire ridge portion 3g, a part of the ridge portion 3i, and a part of the ridge portion 3 j. Of the first electrode layer E1 to cover the ridge line part 3iA part of the thus formed portion is exposed from the second electrode layer E2. For example, region 5c1The first electrode layer E1 is exposed from the second electrode layer E2.
As shown in fig. 2, the farther from the main surface 3a, the region 5c in the third direction D32The smaller the width of (c). The farther from the electrode portion 5a is from the region 5c of the third direction D32The smaller the width of (c). The farther from the end face 3e, the region 5c of the first direction D12The smaller the width of (c). The farther from the electrode portion 5e, the region 5c in the first direction D12The smaller the width of (c). In the present embodiment, the region 5c is viewed from the second direction D22The end edge of (a) is substantially arc-shaped. When viewed from the second direction D2, the region 5c2Is substantially fan-shaped. In the present embodiment, as shown in fig. 7, the width of the second electrode layer E2 when viewed from the second direction D2 decreases as the distance from the main surface 3a increases. The end edge E2E of the second electrode layer E2 has a substantially arc shape.
As shown in fig. 8, the height of the first direction D1 of the second electrode layer E2 is such that the end of the second direction D2 is greater than the center of the second direction D2 when viewed from the third direction D3. The height of the second electrode layer E2 in the first direction D1 is a height along the first direction D1 from the position of the end edge E2f of the second electrode layer E2 to the end edge E2E of the second electrode layer E2, when viewed from the third direction D3. Hereinafter, the height of the second electrode layer E2 in the first direction D1 is simply referred to as "the height of the second electrode layer E2". When viewed from the third direction D3, the end edge E2f of the second electrode layer E2 is defined by the surface of the second electrode layer E2 located at a position close to the main surface 3a in the first direction D1. The center of the second electrode layer E2 in the second direction D2 is located at the same distance in the second direction D2 from the pair of end edges E2g of the second electrode layer E2. The pair of end edges E2g are defined by the surfaces of the second electrode layer E2 located close to the side surfaces 3c in the second direction D2 when viewed from the third direction D3. The end of the second electrode layer E2 in the second direction D2 is located closer to the end edge E2g than the center of the second direction D2 in the second direction D2. "equivalent" does not necessarily mean that the values are identical. When the minute difference, the measurement error, or the like within a predetermined range is included in the value, the values may be made equal.
In fig. 8, the outer shape of the end face 3e viewed from the third direction D3 is indicated by a dashed-dotted line. The outer shape of the end face 3e is defined by the boundaries between the ridge portions 3g, 3i and the end face 3 e. When viewed from the third direction D3, the second electrode layer E2 has: a central portion E2c, a boundary portion E2d, and an end edge portion E2 i. The central portion E2c is located at the center in the second direction D2. The boundary portion E2d is located at the boundary between the end face 3E and the ridge line portion 3 i. The edge portion E2i covers the ridge portion 3i and is located on the ridge portion 3 i. The height Tb of the second electrode layer E2 in the boundary portion E2d and the height Tc of the second electrode layer E2 in the end edge portion E2i are greater than the height Ta of the second electrode layer E2 in the central portion E2c, respectively. The height Tc is greater than the height Tb. The height of the second electrode layer E2 increases in the order of the central portion E2c, the boundary portion E2d, and the edge portion E2 i. The height of the second electrode layer E2 is largest at the edge E2g when viewed from the third direction.
Like the height of the second electrode layer E2, the height of the portion of the second electrode layer E2 covering the end face 3E in the first direction D1 is larger at the end of the second direction D2 than at the center of the second direction D2. Hereinafter, the portion of the second electrode layer E2 covering the end face 3E is simply referred to as "end face coating portion". The height of the end surface covering portion in the first direction D1 is a height along the first direction D1 from the boundary position between the ridge line portion 3g and the end surface 3E to the end edge E2E. Height Tb of the end surface covering portion at the portion corresponding to boundary E2deA height Ta of the end face coating part relative to the part corresponding to the central part E2ccIs large. In fig. 8, for convenience, in the second direction D2, the height Ta is showncIs deviated from the position of the height Ta, but actually the height Ta iscCoincides with the position of the height Ta. Also, in fig. 8, in the second direction D2, the height Tb is showneIs offset from the position of the height Tb, but actually the height Tb iseCoincides with the position of the height Tb.
In the second direction D2, the height of the second electrode layer E2 increases from the center toward the end. In the second direction D2, the edge E2E of the second electrode layer E2 is located at a position closer to the edge E2g from the center and further away from the edge E2 f. The end edge E2E of the second electrode layer E2 is substantially arc-shaped when viewed from the third direction D3. When viewed from the third direction, the end edge E2E of the second electrode layer E2 has a concave curved shape curving in a direction from the main surface 3b toward the main surface 3 a.
The length of the first direction D1 of the region of the first electrode layer E1 exposed from the second electrode layer E2 is such that the end of the second direction D2 is smaller than the center of the second direction D2. Hereinafter, the region exposed from the second electrode layer E2 will be simply referred to as "exposed region". When viewed from the third direction D3, the length of the exposed region of the first electrode layer E1 is the distance along the first direction D1 from the end edge E1f of the first electrode layer E1 to the end edge E2E of the second electrode layer E2. When viewed from the third direction D3, the end edge E1f of the first electrode layer E1 is defined by the surface of the first electrode layer E1 located at a position close to the main surface 3b in the first direction D1. The center of the first electrode layer E1 in the second direction D2 is located at the same distance from the pair of edges E1g of the first electrode layer E1 in the second direction D2. The pair of end edges E1g are defined by the surfaces of the first electrode layer E1 located close to the side surfaces 3c in the second direction D2 when viewed from the third direction D3. The end of the first electrode layer E1 in the second direction D2 is located closer to the end edge E1g than the center of the second direction D2 in the second direction D2.
In the second direction D2, the length of the exposed region of the first electrode layer E1 decreases from the center toward the ends. In the second direction D2, the edge E1h of the exposed region of the first electrode layer E1 is located closer to the edge E1f as the edge E1g approaches from the center. When viewed from the third direction D3, the end edge E1h of the exposed region of the first electrode layer E1 has a substantially arc shape. The end edge E1h of the exposed region of the first electrode layer E1 is also curved convexly from the main surface 3b toward the main surface 3a when viewed from the third direction D3.
As described above, in the first embodiment, the height of the first direction D1 of the second electrode layer E2 is such that the end of the second direction D2 is located at the center of the second direction D2 when viewed from the third direction D3. Therefore, the second electrode layer E2 is difficult to peel off from the element body 3. In the multilayer capacitor C1, the second electrode layer E2 covers the entire end face 3E, and thus the paths through which moisture permeates are less. Therefore, the moisture resistance reliability of the multilayer capacitor C1 is improved.
In the multilayer capacitor C1, the height Tc of the second electrode layer E2 in the end edge portion E2i is greater than the height Ta of the second electrode layer E2 in the central portion E2C. Therefore, the second electrode layer E2 is more difficult to be peeled off from the element body 3.
When the multilayer capacitor C1 is mounted by soldering to an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act on the element body as a stress. External force is applied to the element body 3 from a solder fillet formed at the time of solder mounting via the external electrode 5. The external force tends to act on the region of the main surface 3a of the element body 3 near the end surface 3 e. In the structure in which the second electrode layer E2 covers the region of the principal surface 3a near the end surface 3E, an external force acting on the multilayer capacitor C1 from the electronic device is less likely to act on the element body 3. Therefore, the multilayer capacitor C1 can suppress the occurrence of cracks in the element assembly 3.
The second electrode layer E2 integrally covers: a region of the main surface 3a close to the end surface 3e, a region of the end surface 3e close to the main surface 3a, and a region of the side surface 3c close to the main surface 3 a. Therefore, the second electrode layer E2 is difficult to be reliably peeled off from the end face 3E, and an external force acting on the multilayer capacitor C1 from the electronic device is difficult to be reliably applied to the element body 3.
Region 5c of electrode portion 5c2Having a second electrode layer E2. Therefore, even when the external electrode 5 has the electrode portion 5c, stress is less likely to be concentrated at the edge of the external electrode 5. The edge of the external electrode 5 is less likely to become a starting point of the crack. As a result, the multilayer capacitor C1 reliably suppresses the occurrence of cracks in the element assembly 3.
Region 5e of electrode portion 5e2Having a second electrode layer E2. Therefore, even when the external electrode 5 has the electrode portion 5e, stress is less likely to be concentrated at the edge of the external electrode 5. For example, it is difficult to concentrate stress at the edge of the portion of the external electrode 5 near the main surface 3 a. As a result, the multilayer capacitor C1 reliably suppresses the occurrence of cracks in the element assembly 3.
The external electrode 5 has a first electrode layer E1 formed on the end face 3E so as to be connected to the corresponding internal electrodes 7 and 9. The first electrode layer E1 has a region covered with the second electrode layer E2 and a region exposed from the second electrode layer E2. The first electrode layer E1 is in good contact with the corresponding internal electrodes 7, 9. Therefore, the external electrode 5 and the internal electrodes 7 and 9 are electrically connected reliably.
The resistance of the second electrode layer E2 is greater than that of the first electrode layer E1. In the multilayer capacitor C1, the region of the first electrode layer E1 exposed from the second electrode layer E2 is electrically connected to an electronic device without passing through the second electrode layer E2. Therefore, even in the case where the external electrode 5 includes the second electrode layer E2, the multilayer capacitor C1 can suppress an increase in ESR.
The bonding strength between the second electrode layer E2 and the element body 3 is smaller than the bonding strength between the second electrode layer E2 and the first electrode layer E1. Therefore, the second electrode layer E2 may be peeled off from the element body 3.
In the multilayer capacitor C1, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1 formed in the ridge portion 3i and the entire part of the first electrode layer E1 formed in the ridge portion 3 g. Therefore, in the multilayer capacitor C1, even when the second electrode layer E2 is peeled off from the element body 3, the peeling of the second electrode layer E2 hardly proceeds beyond the positions corresponding to the ridge line portions 3i and 3g to the position corresponding to the end face 3E.
In the multilayer capacitor C1, the external electrode 5 includes the third electrode layer E3 and the fourth electrode layer E4. Therefore, the multilayer capacitor C1 can be soldered to an electronic device.
The region of the first electrode layer E1 exposed from the second electrode layer E2 is electrically connected to an electronic device via the third electrode layer E3 and the fourth electrode layer E4. Therefore, the multilayer capacitor C1 can further suppress an increase in ESR.
Next, a mounting structure of the multilayer capacitor C1 will be described with reference to fig. 9. Fig. 9 is a diagram showing a mounting structure of the multilayer capacitor C1 according to the first embodiment.
As shown in fig. 9, the electronic component device ECD1 includes a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or an electronic component.
The multilayer capacitor C1 is solder-mounted to the electronic device ED. The electronic device ED has a main surface EDa and a plurality of pad electrodes PE1, PE 2. In this embodiment, the electronic device ED includes two pad electrodes PE1 and PE 2. The pad electrodes PE1 and PE2 are disposed on the main surface EDa. The two pad electrodes PE1, PE2 are separated from each other. The multilayer capacitor C1 is disposed on the electronic device ED such that the main surface 3a and the main surface EDa face each other. As described above, the main surface 3a constitutes the mounting surface.
In the case of solder mounting the multilayer capacitor C1, the molten solder wets the external electrode 5 (the fourth electrode layer E4). The wetted solder is solidified to form a solder fillet SF in the external electrode 5. The corresponding external electrode 5 and the pad electrodes PE1 and PE2 are connected by a solder fillet SF.
The solder fillet SF is formed in the area 5e of the electrode portion 5e1And region 5e2. Not only the region 5e2Even in the region 5E not having the second electrode layer E21And also connected to the pad electrodes PE1 and PE2 via the solder fillets SF. Although not shown, the solder fillet SF is also formed in the region 5c of the electrode portion 5c1And region 5c2. The solder fillet SF overlaps with a region of the first electrode layer E1 exposed from the second electrode layer E2 when viewed from the third direction D3. The height of the first direction D1 of the solder fillet SF is greater than the height of the first direction D1 of the second electrode layer E2. The solder fillet SF extends in the first direction D1 in a direction closer to the main surface 3b than the end edge E2E of the second electrode layer E2.
In the electronic component device ECD1, as described above, the second electrode layer E2 is difficult to peel from the element body 3, and the moisture resistance reliability is improved.
The solder fillet SF overlaps with a region of the first electrode layer E1 exposed from the second electrode layer E2 when viewed from the third direction D3. The region of the first electrode layer E1 exposed from the second electrode layer E2 is electrically connected to the electronic device ED via the solder fillet SF. The region of the first electrode layer E1 exposed from the second electrode layer E2 is electrically connected to the electronic device ED without passing through the second electrode layer E2. Therefore, even in the case where the external electrode 5 includes the second electrode layer E2, the electronic component device ECD1 can suppress an increase in ESR.
(second embodiment)
The structure of the multilayer feedthrough capacitor C3 according to the second embodiment will be described with reference to fig. 10 to 17. Fig. 10 and 11 are plan views of the multilayer feedthrough capacitor according to the second embodiment. Fig. 12 is a side view of the laminated feedthrough capacitor of the second embodiment. Fig. 13 is an end view of the laminated feedthrough capacitor according to the second embodiment. Fig. 14, 15, and 16 are views showing a cross-sectional structure of the multilayer feedthrough capacitor according to the second embodiment. Fig. 17 is a side view showing the element body, the first electrode layer, and the second electrode layer. In the second embodiment, the electronic component is, for example, the laminated feedthrough capacitor C3. Next, a difference between the multilayer capacitor C1 and the multilayer feedthrough capacitor C3 will be mainly described.
As shown in fig. 10 to 13, the multilayer feedthrough capacitor C3 has an element body 3, a pair of external electrodes 5, and one external electrode 6. The pair of external electrodes 5 and one external electrode 6 are disposed on the outer surface of the element body 3. In the present embodiment, the element body 3 is configured by laminating a plurality of dielectric layers along the first direction D1. The pair of external electrodes 5 and the one external electrode 6 are separated from each other. Each external electrode 5 constitutes, for example, a signal terminal electrode. The external electrode 6 constitutes, for example, a terminal electrode for grounding.
As shown in fig. 14, 15, and 16, the multilayer feedthrough capacitor C3 includes a plurality of internal electrodes 17 and a plurality of internal electrodes 19. Each of the inner electrodes 17 and 19 is an inner conductor disposed in the element body 3. The internal electrodes 17 and 19 are made of a conductive material generally used as internal electrodes of laminated electronic components, similarly to the internal electrodes 7 and 9. In the second embodiment, the internal electrodes 17 and 19 are also made of Ni.
The internal electrodes 17 and the internal electrodes 19 are disposed at different positions (layers) in the first direction D1. The internal electrodes 17 and the internal electrodes 19 are alternately arranged in the element body 3 so as to face each other with a gap therebetween in the first direction D1. The internal electrodes 17 and 19 are different in polarity from each other. When the stacking direction of the plurality of dielectric layers is the second direction D2, the internal electrodes 17 and the internal electrodes 19 are disposed at different positions (layers) in the second direction D2. The end portions of the internal electrodes 17 are exposed at the pair of end faces 3 e. The end portions of the internal electrodes 19 are exposed at the pair of side surfaces 3 c.
The external electrodes 5 are arranged at both ends of the element body 3 in the third direction D3, as are the external electrodes 5 of the multilayer capacitor C1. Each external electrode 5 is disposed on the corresponding end face 3e side of the element body 3. The external electrode 5 has a plurality of electrode portions 5a, 5b, 5c, 5 e. The electrode portion 5a is disposed on the principal surface 3a and on the ridge portion 3 g. The electrode portion 5b is disposed on the ridge portion 3 h. The electrode portions 5c are disposed on the side surfaces 3c and on the ridge portions 3 i. The electrode portions 5e are disposed on the corresponding end surfaces 3 e. The external electrode 5 also has an electrode portion disposed on the ridge portion 3 j.
The electrode portion 5e entirely covers the end portion of the internal electrode 17 where the end face 3e is exposed. The inner electrode 17 is directly connected to the electrode portion 5 e. The internal electrodes 17 are electrically connected to the pair of external electrodes 5.
The external electrodes 6 are arranged in the center portion of the element body 3 in the third direction D3. In the third direction D3, the external electrode 6 is located between the pair of external electrodes 5. The external electrode 6 has an electrode portion 6a and a pair of electrode portions 6 c. The electrode portion 6a is disposed on the main surface 3 a. The electrode portions 6c are disposed on the side surface 3c and on the ridge portions 3j, 3 k. The external electrodes 6 are formed on the three surfaces of the main surface 3a and the pair of side surfaces 3c and the ridge line portions 3j and 3 k. The electrode portions 6a and 6c adjacent to each other are connected to each other and electrically connected.
The electrode portion 6c entirely covers the end portion of the internal electrode 19 exposed at the side surface 3 c. The inner electrode 19 is directly connected to each electrode portion 6 c. The internal electrode 19 is electrically connected to one of the external electrodes 6.
As shown in fig. 14, 15, and 16, the external electrode 6 includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 6. The electrode portion 6a includes the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4. Each electrode portion 6c has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4.
The second electrode layer E2 of the electrode portion 6a is disposed on the principal surface 3 a. The electrode portion 6a does not have the first electrode layer E1. The second electrode layer E2 of the electrode portion 6a is in contact with the principal surface 3 a. The electrode portion 6a has a three-layer structure.
The first electrode layer E1 of the electrode portion 6c is disposed on the side surface 3c and on the ridge portions 3j, 3 k. The second electrode layer E2 of the electrode portion 6c is disposed on the first electrode layer E1, on the side surface 3c, and on the ridge portion 3 j. A part of the first electrode layer E1 is covered with the second electrode layer E2. The second electrode layer E2 of the electrode portion 6c is in contact with the side surface 3c and the ridge portion 3 j.
The electrode portion 6c has an area 6c1And region 6c2. Region 6c2Is located in the ratio area 6c1Further to the main surface 3 a. Region 6c1Has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 6c1The second electrode layer E2 is not present. Region 6c1Has a three-layer construction. Region 6c2Has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. Region 6c2Has a four-layer construction. Region 6c1The first electrode layer E1 is exposed from the second electrode layer E2. Region 6c2Is a region where the first electrode layer E1 is covered with the second electrode layer E2.
The first electrode layer E1 is formed so as to cover the side surface 3c and the ridge portions 3j and 3 k. The first electrode layer E1 is intentionally not formed on the pair of main surfaces 3a, 3 b. For example, the first electrode layer E1 may be unintentionally formed on the main surfaces 3a and 3b due to manufacturing variations and the like.
The second electrode layer E2 is formed over the first electrode layer E1 and over the element body 3. The second electrode layer E2 covers a partial region of the first electrode layer E1. The second electrode layer E2 covers the electrode portion 6c corresponding to the region 6c2The area of (a). The second electrode layer E2 covers a partial region of the main surface 3a, a partial region of the side surface 3c, and a partial region of the ridge portion 3 j.
The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 by an electroplating method. The third electrode layer E3 is formed in a portion of the first electrode layer E1 exposed from the second electrode layer E2. The fourth electrode layer E4 is formed on the third electrode layer E3 by an electroplating method.
The second electrode layers E2 included in the electrode portions 6a and 6c are integrally formed. The third electrode layer E3 included in each of the electrode portions 6a and 6c is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 6a and 6c is integrally formed.
As shown in fig. 17, regarding the external electrode 6, when viewed from the second direction D2, an end region close to the main surface 3a of the first electrode layer E1 is covered with the second electrode layer E2. The end of the first electrode layer E1 near the main surface 3aRegion-containing region 6c2Has a first electrode layer E1. When viewed from the second direction D2, the end edge E2E of the second electrode layer E2 intersects the end edge E1E of the first electrode layer E1. When viewed from the second direction D2, an end region of the first electrode layer E1 close to the main surface 3b is exposed from the second electrode layer E2. The end region of the first electrode layer E1 close to the main surface 3b includes a region 6c1Has a first electrode layer E1.
As shown in fig. 12, the area 6c of the third direction D32The width of (a) is smaller as it is farther from the main surface 3 a. Region 6c of third direction D32The width of (b) becomes smaller as it becomes farther from the electrode portion 6 a. In the present embodiment, the region 6c is viewed from the second direction D22The end edge of (a) is substantially arc-shaped. When viewed from the second direction D2, the region 6c2Is substantially semicircular in shape. In the present embodiment, as shown in fig. 17, the width of the second electrode layer E2 when viewed from the second direction D2 decreases as it goes away from the main surface 3 a. Region 6c2The end edge E2E of the second electrode layer E2 has a substantially arc shape.
The multilayer feedthrough capacitor C3 is also mounted to the electronic device by soldering. In the multilayer feedthrough capacitor C3, the main surface 3a also faces the electronic device. The main surface 3a is arranged to constitute a mounting surface. The principal surface 3a is a mounting surface.
The structure of the external electrode 5 when viewed from the third direction D3 is the same as that of the external electrode 5 of the first embodiment. In the second embodiment, the external electrode 5 has the second electrode layer E2 having the height in the first direction D1 that is larger at the end of the second direction D2 than at the center of the second direction D2 when viewed from the third direction D3. Therefore, in the multilayer feedthrough capacitor C3, the second electrode layer E2 is less likely to peel from the element body 3, and the moisture resistance reliability is improved, as in the case of the multilayer capacitor C1. In the second embodiment, the configuration of the external electrode 5 when viewed from the third direction D3 is not shown.
In the multilayer feedthrough capacitor C3, the end region of the first electrode layer E1 near the principal surface 3a is covered with the second electrode layer E2 with respect to the external electrode 6 when viewed from the second direction D2. Thus, in the region 6c2Stress concentration is hardly formed at the edge of the first electrode layer E1. As a result, the multilayer feedthrough capacitor C3 can be suppressed toCracks are generated in the element body 3.
In the area 6c of the electrode part 6c1In addition, the first electrode layer E1 is exposed from the second electrode layer E2. Region 6c1The second electrode layer E2 is not present. In the region 6c1In addition, the first electrode layer E1 is electrically connected to an electronic device without passing through the second electrode layer E2. Therefore, the multilayer feedthrough capacitor C3 can suppress an increase in ESR.
Area 6c of electrode portion 6c2Having a second electrode layer E2. Therefore, when the external electrode 6 includes the electrode portion 6c, it is difficult to form stress concentration at the edge of the external electrode 6. The edge of the external electrode 6 is less likely to become a starting point of the crack. As a result, the multilayer feedthrough capacitor C3 reliably suppresses the occurrence of cracks in the element body 3.
Region 6c2The end edge of (2) may be substantially linear. Region 6c2May also have sides along the third direction D3 and sides along the first direction D1. Region 6c2Includes the edge E2E of the second electrode layer E2.
Although the embodiments and modifications of the present invention have been described above, the present invention is not limited to these embodiments and modifications. These embodiments may be variously modified without departing from the spirit and scope of the present invention.
The first electrode layer E1 may be formed on the main surface 3a so as to extend from the end surface 3E over the entire ridge portion 3g or a part thereof. The first electrode layer E1 may be formed on the main surface 3b so as to extend from the end surface 3E over the entire ridge portion 3h or a part thereof. The first electrode layer E1 may be formed on the side surface 3c so as to extend from the end surface 3E over the whole or part of the ridge portion 3 i.
The electronic component of the first embodiment is a multilayer capacitor C1, and the electronic component of the second embodiment is a multilayer feedthrough capacitor C3. Applicable electronic components are not limited to the multilayer capacitor and the multilayer feedthrough capacitor. Applicable electronic components are for example: a multilayer inductor, a multilayer varistor, a multilayer piezoelectric actuator, a multilayer thermistor, a multilayer electronic component such as a multilayer composite component, or an electronic component other than a multilayer electronic component.

Claims (19)

1. An electronic component characterized in that, in a case,
the disclosed device is provided with:
an element body having a rectangular parallelepiped shape and having a first main surface serving as a mounting surface, a second main surface facing the first main surface in a first direction, a pair of side surfaces facing each other in a second direction, and a pair of end surfaces facing each other in a third direction; and
a plurality of external electrodes disposed at both end portions of the element body in the third direction, respectively,
the plurality of external electrodes have a conductive resin layer covering a region close to the first main surface of a corresponding one of the pair of end surfaces,
the conductive resin layer does not cover a region near the second main surface in the end face,
the conductive resin layer has a height in the first direction that is greater at an end in the second direction than at a center in the second direction when viewed from the third direction.
2. The electronic component of claim 1, wherein,
the conductive resin layer covers a region close to the first main surface in a first ridge line portion located between the corresponding end surface and the side surface,
a height of a portion of the conductive resin layer covering the first ridge line portion in the first direction is larger than the height of the conductive resin layer at the center in the second direction when viewed from the third direction.
3. The electronic component of claim 1, wherein,
the conductive resin layer covers a region of the first main surface close to the corresponding end surface.
4. The electronic component of claim 2, wherein,
the conductive resin layer covers a region of the first main surface close to the corresponding end surface.
5. The electronic component of claim 3, wherein,
the conductive resin layer integrally covers: a region of the first main face that is close to the corresponding end face, and a region of the corresponding end face that is close to the first main face.
6. The electronic component of claim 4, wherein,
the conductive resin layer integrally covers: a region of the first main face that is close to the corresponding end face, and a region of the corresponding end face that is close to the first main face.
7. The electronic component of claim 5, wherein,
the conductive resin layer integrally covers: a region of the first main face that is close to the corresponding end face, a region of the corresponding end face that is close to the first main face, and a region of the side face that is close to the first main face.
8. The electronic component of claim 6,
the conductive resin layer integrally covers: a region of the first main face that is close to the corresponding end face, a region of the corresponding end face that is close to the first main face, and a region of the side face that is close to the first main face.
9. The electronic component according to any one of claims 1 to 8,
further comprises internal conductors exposed at the corresponding end faces,
the plurality of external electrodes further have sintered metal layers formed on the corresponding end surfaces so as to be connected to the internal conductors,
the sintered metal layer has: a first region covered with the conductive resin layer, and a second region exposed from the conductive resin layer.
10. The electronic component of claim 9, wherein,
the sintered metal layer is also formed from: a first ridge line portion located between the corresponding end surface and the side surface, and a second ridge line portion located between the corresponding end surface and the first main surface,
the conductive resin layer covers the entire part of the sintered metal layer formed at the first ridge line portion and the part formed at the second ridge line portion.
11. The electronic component of claim 9, wherein,
the plurality of external electrodes further have a plating layer covering the conductive resin layer and the second region of the sintered metal layer.
12. The electronic component of claim 10, wherein,
the plurality of external electrodes further have a plating layer covering the conductive resin layer and the second region of the sintered metal layer.
13. An electronic component device, comprising:
the electronic component of any one of claims 1 to 8; and
an electronic device having a plurality of pad electrodes,
the plurality of external electrodes are respectively connected with the corresponding pad electrodes in the plurality of pad electrodes through welding fillets.
14. The electronic component device of claim 13,
the electronic component further includes an internal conductor exposed at the corresponding end face,
the external electrode further comprises a sintered metal layer disposed between the conductive resin layer and the element body,
the sintered metal layer has: a first region covered with the conductive resin layer, a second region exposed from the conductive resin layer,
the solder fillet overlaps the second region of the sintered metal layer when viewed from the third direction.
15. The electronic component device of claim 14,
the sintered metal layer is also formed from: a first ridge line portion located between the corresponding end surface and the side surface, and a second ridge line portion located between the corresponding end surface and the first main surface,
the conductive resin layer covers the entire part of the sintered metal layer formed at the first ridge line portion and the part formed at the second ridge line portion.
16. The electronic component device according to claim 14 or 15,
the plurality of external electrodes further have a plating layer covering the conductive resin layer and the second region of the sintered metal layer.
17. An electronic component characterized in that, in a case,
the disclosed device is provided with:
an element body having a rectangular parallelepiped shape and having a first main surface serving as a mounting surface, a second main surface facing the first main surface in a first direction, a pair of side surfaces facing each other in a second direction, and a pair of end surfaces facing each other in a third direction; and
an external electrode disposed at an end of the element body in the third direction,
the external electrode has a conductive resin layer covering a region close to the first main surface in the end face,
the conductive resin layer does not cover a region near the second main surface in the end face,
the conductive resin layer has a height in the first direction that is greater at an end in the second direction than at a center in the second direction when viewed from the third direction.
18. An electronic component characterized in that, in a case,
the disclosed device is provided with:
an element body having a rectangular parallelepiped shape and having a first main surface serving as a mounting surface, a second main surface facing the first main surface in a first direction, a pair of side surfaces facing each other in a second direction, and a pair of end surfaces facing each other in a third direction; and
a plurality of external electrodes disposed at both end portions of the element body in the third direction, respectively,
the plurality of external electrodes have a conductive resin layer covering a region close to the first main surface of a corresponding one of the pair of end surfaces,
the conductive resin layer covers only integrally: a region of the first main face that is close to the corresponding end face, a region of the corresponding end face that is close to the first main face, and a region of the side face that is close to the first main face,
the conductive resin layer has a height in the first direction that is greater at an end in the second direction than at a center in the second direction when viewed from the third direction.
19. An electronic component characterized in that, in a case,
the disclosed device is provided with:
an element body having a rectangular parallelepiped shape and having a first main surface serving as a mounting surface, a second main surface facing the first main surface in a first direction, a pair of side surfaces facing each other in a second direction, and a pair of end surfaces facing each other in a third direction,
a plurality of external electrodes disposed at both end portions of the element body in the third direction, respectively; and
an inner conductor exposed at a corresponding one of the pair of end faces,
the plurality of external electrodes have: a conductive resin layer covering a region close to the first main surface of a corresponding one of the pair of end surfaces; and a sintered metal layer formed on the corresponding end surface so as to be connected to the internal conductor,
the sintered metal layer has only: a first region covered with the conductive resin layer and located close to the first main surface, and a second region exposed from the conductive resin layer and located close to the second main surface,
the conductive resin layer has a height in the first direction that is greater at an end in the second direction than at a center in the second direction when viewed from the third direction.
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