CN109459676A - A kind of condenser failure analyzing detecting method - Google Patents
A kind of condenser failure analyzing detecting method Download PDFInfo
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- CN109459676A CN109459676A CN201811437172.XA CN201811437172A CN109459676A CN 109459676 A CN109459676 A CN 109459676A CN 201811437172 A CN201811437172 A CN 201811437172A CN 109459676 A CN109459676 A CN 109459676A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
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Abstract
The present invention relates to a kind of condenser failure analyzing detecting methods, include the following steps: visual examination；Interior inspection is surveyed, and carries out failure point location to failure capacitor by flaw detection equipment, and determine failpoint position；Preliminary confirmation failure cause, lists possible failure cause according to failpoint position；Simulation test be targetedly powered to non-defective unit capacitor and simulate according to failure cause, verifies possible failure cause, and failpoint situation of the non-defective unit capacitor after failure damage is compared with the failpoint position of failure capacitor, determines failure cause；The capacitor that fails is made the microsection of failpoint position and confirmed under the microscope in metallography microscope, reused scanning electron microscope and energy depressive spectroscopy and carry out surface sweeping analysis to microsection, verify and determine condenser failure Wear cause and provide analysis conclusion by metallographic detection.The present invention can fast and efficiently confirm the basic reason of condenser failure, and the raising for realizing the functional reliability for electronic system is analyzed by condenser failure.
Description
Technical field
The present invention relates to electronic components to test and analyze technical field, more particularly to a kind of condenser failure analysis detection side
Method.
Background technique
Capacitor is the important devices of increase power factor in the power system, is to be vibrated, filtered in electronic circuit
The main element of the effects of wave, phase shift, bypass, coupling.But electronic component is also fragility simultaneously, it often can be because of multiple reasons
It causes to fail, such as some electric system are in use for some time, it is possible to lead to not just because of the failure of capacitor
Often work, then just needing to test and analyze the reason of condenser failure, to prevent the generation of same problem.
Slow in the presence of analysis speed for the method for condenser failure analysis at present, detection accuracy is low, and fail no valid reason
The problems such as, therefore, how fast and efficiently to carry out failure analysis to capacitor becomes failure analysis field problem anxious to be resolved.
Summary of the invention
The invention aims to provide a kind of condenser failure analyzing detecting method, electricity can be fast and efficiently confirmed
The basic reason for holding failure analyzes the raising for realizing the functional reliability for electronic system by condenser failure.
In order to achieve the above objectives, the technical solution adopted by the present invention is that:
The present invention provides a kind of condenser failure analyzing detecting method, for analyzing failure capacitor, including detects step as follows
It is rapid:
Step 1: visual examination checks the damage situation of failure capacitor and to check whether record failure capacitive surface has obvious different
Often occur as；
Step 2: interior inspection is surveyed, and carries out failure point location to failure capacitor by flaw detection equipment, and determine failure point
It sets；
Step 3: tentatively confirmation failure cause lists possible failure cause according to failpoint position；
Step 4: simulation test be targetedly powered to non-defective unit capacitor and simulate, verifies possible failure according to failure cause
Reason, and failpoint situation of the non-defective unit capacitor after failure damage is compared with the failpoint position of failure capacitor, it determines
Failure cause；
Step 5: the metallographic of failpoint position is made according to the failpoint position that step 2 determines in the capacitor that fails by metallographic detection
Be sliced simultaneously metallography microscope under the microscope confirmation failpoint position, reuse scanning electron microscope and energy depressive spectroscopy to microsection into
Row surface sweeping analysis, verify determine condenser failure damage according to reason, and provide analysis conclusion.
For above-mentioned technical proposal, there are also further Optimized Measures by applicant.
Further, after carrying out the metallographic detection of step 5, the failure environment that artificial capacitor defective products fails when damaging,
The failure mechanism of secondary verifying capacitor, determines the analysis conclusion finally provided.
Further, obvious abnormal phenomenon signified in step 1 refers to abrasion present in capacitor, cracks, burns
Situation.
Further, flaw detection equipment employed in step 2 is X ray detector.
Due to the above technical solutions, the present invention has the following advantages over the prior art:
Condenser failure analyzing detecting method of the invention, the detection method combined by macroscopic observation and microcosmic detection, confirmation
The failpoint position of capacitor, and targetedly Metallographic Analysis is carried out for failpoint position, while being scanned Electronic Speculum and power spectrum
Analysis carries out secondary test to failure cause in conjunction with capacitor working environment (failure environment) to confirm the failure cause of capacitor
Card so, it is possible efficiently and accurately to carry out analysis determination to the failure cause of failure capacitor, be the steady operation of electronic system
It escorts.
Detailed description of the invention
Some specific embodiments of the present invention is described in detail by way of example and not limitation with reference to the accompanying drawings hereinafter.
Identical appended drawing reference denotes same or similar part or part in attached drawing.It should be appreciated by those skilled in the art that these
What attached drawing was not necessarily drawn to scale.In attached drawing:
Fig. 1 is the failure capacitor in the test sample of the embodiment of the present invention；
Fig. 2 is the non-defective unit capacitor in the test sample of the embodiment of the present invention；
Fig. 3-1 is the interior inspection mapping of failure capacitor in the embodiment of the present invention；
Fig. 3-2 is the interior inspection mapping of a non-defective unit capacitor in the embodiment of the present invention；
Fig. 3-3 is the interior inspection mapping of another non-defective unit capacitor in the embodiment of the present invention；
Fig. 3-4 is the interior inspection mapping of another non-defective unit capacitor in the embodiment of the present invention；
Fig. 4-1 is the microsection scanning figure of failure capacitor in the embodiment of the present invention；
Fig. 4-2 is the microsection scanning figure of a non-defective unit capacitor in the embodiment of the present invention；
Fig. 4-3 is the microsection scanning figure of another non-defective unit capacitor in the embodiment of the present invention；
Fig. 4-4 is the microsection scanning figure of another non-defective unit capacitor in the embodiment of the present invention.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
The present embodiment is for the monolithic capacitor in rear wiper bracket assembly, model specification are as follows: DSDR-474, wherein
Test sample in the present embodiment includes a failure capacitor and three not used non-defective unit capacitors with batch.
Firstly, to failure capacitor carry out visual examination, the failure capacitor as shown in Figure 1, non-defective unit capacitor then as shown in Fig. 2,
Two capacitors are the same producer of same model, and failure capacitor appearance is obviously burnt, have been unable to test its electrical property, surface color
Obviously different from the color of non-defective unit capacitor, and the pin of one end has been blown, and half capacitive surface is burnt.
Then interior inspection is surveyed, and is scanned inspection respectively to non-defective unit capacitor and failure capacitor by X ray detector,
In, the interior inspection mapping for the capacitor that fails as shown in figure 3-1, and the interior inspection mapping of three non-defective unit capacitors then respectively as Fig. 3-2, figure
Shown in 3-3, Fig. 3-4, it is seen then that failure capacitor is uneven compared with its internal intermediate medium for non-defective unit capacitor, and part has been burned out,
It is whole no longer complete, it primarily determines out positioned at the failpoint position at middle part according to intermediate medium situation, carries out failure point location.
Preliminary confirmation failure cause, it may be possible to since local voltage is excessive, a pin of failure capacitor be caused to burn
It ruins, in view of this, the non-defective unit capacity measurement in the case of being powered is simulated.
Here, the parameters such as the capacitance capacitance (C) of sample, loss angle tangent (tan δ) and insulation resistance (IR) are carried out
Test, test result is as follows shown in table 1:
Table 1: the electric parameters testing result of non-defective unit capacitor
As it can be seen that the parameters index of not used non-defective unit capacitor is normal, it is seen that the capacitor under conventional energization is very normal, no
Can fail damage.
Start to carry out failure capacitor targetedly metallographic detection and microsection analysis, according to IPC-TM-650
2.1.1-2004-E(metallographic examination criteria) in program, to failure capacitor and non-defective unit capacitor carry out slice test respectively, in gold
It is observed and recorded under phase microscope as a result, simultaneously, reusing scanning electron microscope and energy depressive spectroscopy sweeping microsection
Surface analysis.The microsection of failure capacitor is as shown in Fig. 4-1, and the microsection of three non-defective unit capacitors is respectively such as Fig. 4-2, Fig. 4-
3, shown in Fig. 4-4.As it can be seen that there are a large amount of apparent crackles in failure capacitor, the pin of one end, the pin of the other end can only see
It all burns
It can to sum up summarize and obtain following analysis as a result, finding that failure capacitive surface is seriously burnt, not burn the color at position
Apparent variation has occurred.In the perspective scanning of X ray detector, it is observed that failure capacitor interior media is no longer
Unevenly, not used non-defective unit capacitor is no abnormal.In microsection Germicidal efficacy, have in discovery failure capacitor big
Apparent crackle is measured, can only see the pin of one end, the pin of the other end is all burnt.Conclusion is exactly that electricity is not used
The items of appearance check equal no problem, and fail condenser failure the reason of introduce abnormal voltage for capacitor pin end electricity caused to burn
It ruins.
By secondary verifying, simulation is passed through high pressure, damage situation and first mistake at the capacitor pin end of non-defective unit capacitor
It is consistent to imitate capacitor, it is known that analysis result is errorless.
It is found that condenser failure analyzing detecting method of the invention, is the inspection combined by macroscopic observation and microcosmic detection
Survey method confirms the failpoint position of capacitor, and carries out targetedly Metallographic Analysis for failpoint position, is scanned simultaneously
Electronic Speculum and energy spectrum analysis, so that the failure cause of capacitor is confirmed, in conjunction with capacitor working environment (failure environment) to failure cause
Secondary verifying is carried out, so, it is possible efficiently and accurately to carry out analysis determination to the failure cause of failure capacitor, be electronic system
Steady operation escort.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (4)
1. a kind of condenser failure analyzing detecting method, for analyzing failure capacitor, which is characterized in that including detecting as follows
Step:
Step 1: visual examination checks the damage situation of failure capacitor and to check whether record failure capacitive surface has obvious different
Often occur as；
Step 2: interior inspection is surveyed, and carries out failure point location to failure capacitor by flaw detection equipment, and determine failure point
It sets；
Step 3: tentatively confirmation failure cause lists possible failure cause according to failpoint position；
Step 4: simulation test be targetedly powered to non-defective unit capacitor and simulate, verifies possible failure according to failure cause
Reason, and failpoint situation of the non-defective unit capacitor after failure damage is compared with the failpoint position of failure capacitor, it determines
Failure cause；
Step 5: the metallographic of failpoint position is made according to the failpoint position that step 2 determines in the capacitor that fails by metallographic detection
Be sliced simultaneously metallography microscope under the microscope confirmation failpoint position, reuse scanning electron microscope and energy depressive spectroscopy to microsection into
Row surface sweeping analysis, verify determine condenser failure damage according to reason, and provide analysis conclusion.
2. condenser failure analyzing detecting method according to claim 1, which is characterized in that in the metallographic inspection for carrying out step 5
After survey, the failure environment that artificial capacitor defective products fails when damaging, the failure mechanism of secondary verifying capacitor, what determination finally provided
Analyze conclusion.
3. condenser failure analyzing detecting method according to claim 1, which is characterized in that signified obvious different in step 1
The case where often occurring as referring to abrasion present in capacitor, cracking, burn.
4. condenser failure analyzing detecting method according to any one of claim 1 to 3, which is characterized in that in step 2
Used flaw detection equipment is X ray detector.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811437172.XA CN109459676A (en) | 2018-11-28 | 2018-11-28 | A kind of condenser failure analyzing detecting method |
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| CN201811437172.XA CN109459676A (en) | 2018-11-28 | 2018-11-28 | A kind of condenser failure analyzing detecting method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111415343A (en) * | 2020-03-18 | 2020-07-14 | 珠海市奥德维科技有限公司 | Artificial intelligence-based six-side appearance detection method for chip multilayer ceramic capacitor |
| CN111521957A (en) * | 2020-03-24 | 2020-08-11 | 航天科工防御技术研究试验中心 | Failure analysis method for solid tantalum electrolytic capacitor with built-in fuse |
| CN111626999A (en) * | 2020-05-22 | 2020-09-04 | 广东电网有限责任公司 | Patch capacitor failure detection method and grinding and polishing method |
| CN112362662A (en) * | 2020-10-27 | 2021-02-12 | 航天科工防御技术研究试验中心 | Method and device for analyzing failure point of chip fuse |
| CN113567828A (en) * | 2021-06-15 | 2021-10-29 | 中国电子科技集团公司第十三研究所 | Nondestructive failure detection method for multilayer low-temperature co-fired ceramic substrate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419338A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Capacitor failure analysis method |
| CN102495780A (en) * | 2011-11-29 | 2012-06-13 | 苏州华碧微科检测技术有限公司 | Computer mainboard failure analysis method |
| CN103091590A (en) * | 2013-01-30 | 2013-05-08 | 华为技术有限公司 | Series capacitor detection method and device |
| CN103884952A (en) * | 2014-02-17 | 2014-06-25 | 深圳市易瑞来科技开发有限公司 | Analysis method of ceramic capacitor failure |
| CN105785207A (en) * | 2014-12-16 | 2016-07-20 | 王祖刚 | Blurred screen fault detection circuit board for displays |
| CN106405263A (en) * | 2015-07-31 | 2017-02-15 | 佛山市顺德区美的电热电器制造有限公司 | Electromagnetic heating system, failure detection method of resonant capacitor and apparatus thereof |
| CN106770502A (en) * | 2017-01-03 | 2017-05-31 | 航天科工防御技术研究试验中心 | A kind of position finding and detection method of capacitance short-circuit failure |
-
2018
- 2018-11-28 CN CN201811437172.XA patent/CN109459676A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419338A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Capacitor failure analysis method |
| CN102495780A (en) * | 2011-11-29 | 2012-06-13 | 苏州华碧微科检测技术有限公司 | Computer mainboard failure analysis method |
| CN103091590A (en) * | 2013-01-30 | 2013-05-08 | 华为技术有限公司 | Series capacitor detection method and device |
| CN103884952A (en) * | 2014-02-17 | 2014-06-25 | 深圳市易瑞来科技开发有限公司 | Analysis method of ceramic capacitor failure |
| CN105785207A (en) * | 2014-12-16 | 2016-07-20 | 王祖刚 | Blurred screen fault detection circuit board for displays |
| CN106405263A (en) * | 2015-07-31 | 2017-02-15 | 佛山市顺德区美的电热电器制造有限公司 | Electromagnetic heating system, failure detection method of resonant capacitor and apparatus thereof |
| CN106770502A (en) * | 2017-01-03 | 2017-05-31 | 航天科工防御技术研究试验中心 | A kind of position finding and detection method of capacitance short-circuit failure |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111415343A (en) * | 2020-03-18 | 2020-07-14 | 珠海市奥德维科技有限公司 | Artificial intelligence-based six-side appearance detection method for chip multilayer ceramic capacitor |
| CN111415343B (en) * | 2020-03-18 | 2020-10-27 | 珠海市奥德维科技有限公司 | Artificial intelligence-based six-side appearance detection method for chip multilayer ceramic capacitor |
| CN111521957A (en) * | 2020-03-24 | 2020-08-11 | 航天科工防御技术研究试验中心 | Failure analysis method for solid tantalum electrolytic capacitor with built-in fuse |
| CN111521957B (en) * | 2020-03-24 | 2023-01-10 | 航天科工防御技术研究试验中心 | Failure analysis method for solid tantalum electrolytic capacitor with built-in fuse |
| CN111626999A (en) * | 2020-05-22 | 2020-09-04 | 广东电网有限责任公司 | Patch capacitor failure detection method and grinding and polishing method |
| CN112362662A (en) * | 2020-10-27 | 2021-02-12 | 航天科工防御技术研究试验中心 | Method and device for analyzing failure point of chip fuse |
| CN113567828A (en) * | 2021-06-15 | 2021-10-29 | 中国电子科技集团公司第十三研究所 | Nondestructive failure detection method for multilayer low-temperature co-fired ceramic substrate |
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Application publication date: 20190312 |
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