CN109454557A - Polishing pad trimmer and its manufacturing method - Google Patents
Polishing pad trimmer and its manufacturing method Download PDFInfo
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- CN109454557A CN109454557A CN201710796671.7A CN201710796671A CN109454557A CN 109454557 A CN109454557 A CN 109454557A CN 201710796671 A CN201710796671 A CN 201710796671A CN 109454557 A CN109454557 A CN 109454557A
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- Prior art keywords
- pedestal
- buffering
- polishing pad
- solder
- solder layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention discloses a kind of polishing pad trimmer and its manufacturing method.The manufacturing method of polishing pad trimmer includes at least: providing a composite base, composite base includes pedestal and at least one layer of buffering solder layer, wherein, one is included at least in the step of composite base is provided to be heating and curing processing, buffer solder layer and pedestal to be formed.Before forming the step of grind section is in composite base, planarization step is first carried out, to form flat surfaces in the wherein side of composite base.Grind section will form on flat surfaces.In this way, can overcome because of pedestal thermal deformation, the problem for causing the height fall between multiple tips of grind section excessive.
Description
Technical field
The present invention relates to a kind of polishing pad trimmers and its manufacturing method applied to CMP step, especially
It is related to a kind of polishing pad trimmer and its manufacturing method for being suitable for modifying polishing pad.
Background technique
Chemical mechanical grinding is one of current planarization most common means of semiconductor wafer surface.In chemical mechanical grinding
In processing procedure, it will usually cooperate polishing fluid using polishing pad, come polished semiconductor wafer surface.In CMP step,
Pad interface can be modified using trimming device for polishing cushion, the waste material generated when removing wafer polishing, and reply polishing pad
Roughness, to maintain the stabilization of quality of finish.
Existing trimming device for polishing cushion generally includes substrate and is set to the diamond abrasive layer of substrate wherein side.?
In the process of existing production trimming device for polishing cushion, a solder layer first can be formed on a flat work surface of substrate.Then, will
Diamond grains are spread out evenly throughout on solder layer, and make the difference in height between the tip of these diamond grains less than 100 μm.It
Afterwards, about 1000 DEG C at a temperature of impose heating hard solder (Brazing) processing, fix diamond grains can by solder layer
On the working face of substrate.
However, due to the thermal expansion coefficient of solder layer and substrate difference, and during heating hard solder processing, substrate
Center and edge cooling velocity it is uneven, substrate deformation is caused, so as to cause the tip of multiple diamond grains after subsequent hard solder
Height fall increases.Specifically, the working face that substrate deformation will lead to otherwise flat becomes by edge towards the convex of central protuberance
Face, or by edge towards the concave surface of center indent.Convex or indent working face can also make to be incorporated into multiple on working face
Height fall (about 100 μm to 300 μm) between the tip of diamond grains is too big.If between the cusp of these diamond grains
Height fall is excessive (being greater than 50 μm), when modifying polishing pad, will lead to the roughness descent of pad interface, to influence
Quality of finish.As integrated circuit line width gradually reduces, the requirement for polishing pad trimmer is also increased accordingly.Further and
Speech, when carrying out CMP step less than 45 nanometers wafer below for line width, the planarization of polishing pad must be higher,
To avoid scratch (Micro-Scratches) wafer or causes metallic circuit recess (Dishing) and corrode (Erosion)
Phenomenon.
It is by being provided at the very start with a curved working face in the patent I530361 that Taiwan has been announced
Substrate, to compensate the deflection of the substrate in hardening heat-treatment process.However, to be formed by processing has curved working face
Substrate difficulty of processing it is higher, and precision be difficult to control.
In addition, the deflection and region when substrate heats every time are possible to will receive density of material, solder layer material, add
The parameters such as hot temperature, cooling rate influence, and different.Because each final deformed condition of substrate it is difficult to predict,
The parameter of processing procedure is difficult to control after heating each time, the height fall between the cusp of diamond grains can be made to meet pre-
The result of phase.
Summary of the invention
Technical problem to be solved by the present invention lies in reduce because pedestal thermal deformation leads to the more of polishing pad trimmer surface
The excessive problem of height fall between a cutting tip.
In order to solve the above technical problems, a wherein technical solution of the present invention is to provide a kind of polishing pad
The polishing pad trimmer of the manufacturing method of trimmer and application manufactured by it.Polishing pad trimmer includes composite base and grinding
Portion.Composite base includes a pedestal and the buffering solder layer being formed on pedestal.An at least surface for pedestal is curved surface, and slow
Rush solder layer covering surface.Grind section is set on composite base and including a binder course and multiple scattering devices in the knot
Close the abrasive grains in layer.Multiple abrasive grains are respectively provided with multiple cutting tips of a lapped face of protrusion binder course,
In, it buffers heating solidus temperature corresponding to solder layer and is greater than heating liquidus temperature corresponding to the binder course.
An other technical solution of the present invention is to provide a kind of manufacturing method of polishing pad trimmer.Firstly, mentioning
For a composite base, composite base includes pedestal and the buffering solder layer being formed on pedestal, wherein pedestal has at least one
Curved surface, and buffer solder layer covering surface.Then, to composite base execute a planarization step, with composite base wherein
Side forms a flat surfaces.Then, formed a grind section on flat surfaces, wherein grind section include a binder course and
Abrasive grains of multiple scattering devices in the binder course, and multiple abrasive grains are respectively provided with a grinding of protrusion binder course
Multiple cutting tips on surface.
The beneficial effects of the present invention are polishing pad trimmer and its manufacturing method provided by technical solution of the present invention exist
It is formed before grind section, first providing includes buffering the composite base of solder layer and pedestal, and buffering the cured mistake of solder layer
It deforms pedestal in advance and there is curved surface, then formed positioned at composite base wherein by processing planarization step
The flat surfaces of side.Grind section is being formed when on pedestal, since pedestal first passes through deformation in advance, and cured buffering is welded
The bed of material can also limit the deformation quantity of pedestal in conjunction with pedestal, so deformation quantity of the pedestal when executing heating hard solder processing can be substantially
It reduces.Therefore, the height fall at the cutting tip of multiple abrasive grains of grind section is smaller by pedestal influence of thermal deformation, and can accord with
Close practical application request.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however provided attached drawing is merely provided for reference and description, is not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the flow chart of the wherein manufacturing method of the polishing pad trimmer of an embodiment of the invention.
Fig. 2A is diagrammatic cross-section of the polishing pad trimmer of a wherein embodiment of the invention in the step S100 of Fig. 1.
Fig. 2 B is the diagrammatic cross-section of the wherein composite base of an embodiment of the invention.
Fig. 2 C is diagrammatic cross-section of the polishing pad trimmer of a wherein embodiment of the invention in the step S200 of Fig. 1.
Fig. 2 D is diagrammatic cross-section of the polishing pad trimmer of a wherein embodiment of the invention in the step S300 of Fig. 1.
Fig. 2 E is diagrammatic cross-section of the polishing pad trimmer of another embodiment of the present invention in the step S200 of Fig. 1.
Fig. 2 F is diagrammatic cross-section of the polishing pad trimmer of another embodiment of the present invention in the step S300 of Fig. 1.
Fig. 3 A is diagrammatic cross-section of the polishing pad trimmer of another embodiment of the present invention in the step S100 of Fig. 1.
Fig. 3 B is the diagrammatic cross-section of the composite base of another embodiment of the present invention.
Fig. 3 C is diagrammatic cross-section of the polishing pad trimmer of another embodiment of the present invention in the step S200 of Fig. 1.
Fig. 3 D is diagrammatic cross-section of the polishing pad trimmer of another embodiment of the present invention in the step S300 of Fig. 1.
Fig. 3 E is diagrammatic cross-section of the polishing pad trimmer of further embodiment of this invention in the step S200 of Fig. 1.
Fig. 3 F is diagrammatic cross-section of the polishing pad trimmer of further embodiment of this invention in the step S300 of Fig. 1.
Fig. 4 A is diagrammatic cross-section of the polishing pad trimmer of yet another embodiment of the invention in the step S100 of Fig. 1.
Fig. 4 B is diagrammatic cross-section of the polishing pad trimmer of yet another embodiment of the invention in the step S200 of Fig. 1.
Fig. 4 C is diagrammatic cross-section of the polishing pad trimmer of yet another embodiment of the invention in the step S300 of Fig. 1.
Fig. 5 A is diagrammatic cross-section of the polishing pad trimmer of other embodiments of the invention in the step S200 of Fig. 1.
Fig. 5 B is diagrammatic cross-section of the polishing pad trimmer of other embodiments of the invention in the step S300 of Fig. 1.
Specific embodiment
Please refer to Fig. 1, Fig. 2A to Fig. 2 D.Fig. 1 is the manufacturing method of the wherein polishing pad trimmer of an embodiment of the invention
Flow chart.Fig. 2A to 2D is respectively section of the polishing pad trimmer of a wherein embodiment of the invention in each step of Fig. 1
Schematic diagram.
As shown in Figure 1, in the step s 100, providing a composite base, composite base is including a pedestal and is formed in base
Buffering solder layer on seat, wherein pedestal has an at least curved surface, and buffers solder layer covering surface.
A and Fig. 2 B referring to figure 2. is painted and provides the process of composite base.Specifically, as shown in Figure 2 A, being initially formed one
Solder 2 " is buffered on an initial pedestal 1 ".
The material of initial pedestal 1 " can be iron, molybdenum, tungsten, stainless steel, invar alloy or nickel based super alloy.Implement one
In example, the material of initial pedestal 1 " is stainless steel.In addition, initial pedestal 1 " has a top surface 1a " and the one and top surface 1a "
An opposite bottom surface 1b ".In the present embodiment, buffering solder 2 " is the top surface 1a " for being formed on initial pedestal 1 ".But at it
In his embodiment, buffering solder 2 " can be formed on the bottom surface 1b " of initial pedestal 1 ".
In addition, it should be noted that, in fig. 2, only first buffering solder 2 " is formed on initial pedestal 1 ", is not set
Set abrasive grains.
Buffering solder 2 " can be the mixing of weld tabs (foil), soldering paste (paste) or glue material (such as: resin) and welding powder
Object.For different state sample implementations, solder 2 " can will be buffered by the multiple technologies means being currently known and be formed in just primordium
On seat 1 ", the present invention is not intended to limit.
In one embodiment, when buffering solder 2 " is a weld tabs, weld tabs can be fixed on by spot welding or glue material
On initial pedestal 1 ", wherein glue material is, for example, liquid glue, glue spraying or double-sided adhesive.The primordium at the beginning of being directly fixed on weld tabs with glue material
When on seat 1 ", in subsequent high-temperature heat treatment arc may be presented from side or corner warpage in weld tabs.Therefore, one
In embodiment, if weld tabs is fixed on initial pedestal 1 " by glue material, during executing heating hard solder processing, Ke Yili
With another bulk, such as: graphite block applies the active force pushed to weld tabs, can avoid weld tabs be heating and curing handle when, from side
Side or corner warpage.
In another embodiment, buffering solder 2 " is the mixture of welding powder and resin.In this embodiment, there are two types of sides
Buffering solder 2 " can be formed on initial pedestal 1 " by formula.One of which is first that welding powder and resin (or other sizing materials) is mixed
The weldering cake of similar pie is closed and be fabricated to, then weldering cake is attached to a wherein surface (top surface 1a " or the bottom surface of initial pedestal 1 "
1b").Another kind is the top surface 1a " or bottom surface 1b " that resin (other sizing materials) is first directly coated on to initial pedestal 1 "
On, welding powder is sprinkled on resin.Sizing material above-mentioned can be glue spraying, liquid glue or double-sided adhesive.Alternatively, it is also possible to first attach
After double-sided adhesive, welding powder is sprinkled on double-sided adhesive.
It is noted that the fusing point of buffering solder 2 " cannot be less than the process temperatures for being subsequently formed grind section.Implement one
In example, buffering solder 2 " can choose the solder for being suitable for welding with the material of initial pedestal 1 ".In one embodiment, when initial
When pedestal 1 " is stainless steel, buffering solder 2 " can choose the Nickel Matrix Solder of amorphous, wherein the Nickel Matrix Solder of general amorphous melts
Point or corresponding solidus temperature can be between 883 DEG C to 1052 DEG C.Amorphous Nickel Matrix Solder above-mentioned is, for example, AWS BNi5a
Or AWS BNi5b, corresponding solidus temperature are 1052 DEG C and 1030 DEG C respectively.In addition, in the present embodiment, buffering solder
2 " thickness is between 25 to 500 μm.
Then, B referring to figure 2. executes one and is heating and curing processing, so that buffering solder 2 " is cooling after melting and forms one and delays
Rush solder layer 2 '.Initial pedestal 1 " deforms after execution is heating and curing processing with buffer layer 2 ' and forms pedestal 1 '.In other words, base
Seat 1 ' is actually the deformation pedestal of thermal deformation by high temperature, thus makes the top surface 1a ' (or bottom surface 1b ') of pedestal 1 ' for song
Face.Curved surface above-mentioned can be cambered surface or lower camber side.Accordingly, composite base M1 " includes pedestal 1 ' and buffering solder layer 2 '.
Hold above-mentioned, be heating and curing in treatment process in execution, be initial pedestal 1 " and buffering solder 2 " are warming up to it is slow
It is cooled down again after rushing the temperature of the correspondence liquidus curve of solder 2 " or more.In this process, due to the thermal expansion system of initial pedestal 1 "
The thermal expansion coefficient difference of number and buffering solder 2 ", and initial pedestal 1 " itself is at center and the cooling rate in periphery
Difference will lead to initial pedestal 1 " and deform, and formation one is generally in the pedestal 1 ' of arc body.In the present embodiment, pedestal 1 '
Central part protrudes from marginal portion, thus the top surface 1a ' and bottom surface 1b ' of pedestal 1 ' is made all to form cambered surface.
In addition, buffering solder 2 " is bonded on pedestal 1 ' after high-temperature fusion and cooling, and form buffering solder
Layer 2 '.As shown in Figure 2 B, buffering solder layer 2 ' cooperate pedestal 1 ' deformation and with arc outer surface 2S ' and arc it is interior
Side surface, wherein arc shaped inside surface is connected to the top surface 1a ' of pedestal 1 '.
Then, Fig. 1, Fig. 2 B and Fig. 2 E are please referred to.In step s 200, a planarization step is executed to composite base,
To form a flat surfaces in the wherein side of composite base.Planarization step above-mentioned can be a single side planarization step or
Person is a two-sided planarization step.In one embodiment, planarization step can be executed by grinding machine, cutter or grinding wheel.
Specifically, B referring to figure 2..It is along dotted line depicted in Fig. 2 B to composite base in the embodiment of Fig. 2 B
Seat M1 " executes a two-sided planarization step, to form the flat surfaces for being located at two opposite side of composite base M1.
Furthermore, in the present embodiment, buffering a part of solder layer 2 ' and a part of pedestal 1 ' can be gone
It removes, so that the bottom surface 1b of the outer surface 2S for buffering solder layer 2 and pedestal 1 be made all to form flat surfaces.In addition, buffering solder
The outer surface 2S of layer 2 and the bottom surface 1b of pedestal 1 can be substantially parallel.
That is, in this step, by two-sided planarization step, the outer surface of buffering solder layer 2 ' can be reduced
Parallelism tolerance between 2S and the bottom surface 1b of pedestal 1.In one embodiment, buffer solder layer 2 outer surface 2S and
Parallelism tolerance between the bottom surface 1b of pedestal 1 is no more than 20 μm.
It is worth noting that, the top surface 1a ' that pedestal 1 is contacted with buffering solder layer 2 is still a curved surface, and buffer solder layer 2
Thickness cooperation curved surface profile, it is cumulative or decrescence towards center by the periphery of buffering solder layer 2.In the present embodiment, due to
The top surface 1a ' of pedestal 1 is upper cambered surface, and therefore, the thickness for buffering solder layer 2 can be from periphery towards center decrescence.In addition, by double
After the planarization step of face, the thickness of pedestal 1 is then cumulative from periphery towards center.
Please refer to Fig. 1.Then, in step S300, a grind section is formed on one of flat surfaces, wherein grind
Mill portion includes the abrasive grains of a binder course and multiple scattering devices in binder course, and multiple abrasive grains be respectively provided with it is convex
Multiple cutting tips of a lapped face of binder course out.
Referring to Fig. 2 D, wherein Fig. 2 D is the polishing pad trimmer of a wherein embodiment of the invention in the step S300 of Fig. 1
Diagrammatic cross-section.As shown in Figure 2 D, in the present embodiment, grind section 3 is formed at the outer surface 2S of buffering solder layer 2
On.In addition, grind section 3 includes the abrasive grains 31 of binder course 30 and multiple scattering devices in binder course 30.It is above-mentioned to grind
Abrasive particle 31 is, for example, diamond or boron nitride.
Furthermore, binder course 30 and buffering solder layer 2 are the same sides for being located at pedestal 1, and binder course 30 is positioned at slow
It rushes on the flat surfaces (i.e. outer surface 2S) that the surface of solder layer 2 is constituted.In addition, each abrasive grains 31 is with convex
The cutting tip 31t of a lapped face 30S of binder course 30 out.
In addition, forming grind section 3 in the step on composite base M1 may include: to form one to combine solder flat in wherein one
On smooth surface；Multiple abrasive grains are set on pedestal；And a heating hard solder processing (Brazing) is executed, it is welded so as to combine
Material melting and solidification, to form grind section.The heating hard solder temperature for executing heating hard solder processing is no more than to be heating and curing in execution
The temperature that is heating and curing of processing.
Specifically, combination solder above-mentioned can be the mixture of weld tabs, soldering paste or glue material and welding powder.It is real one
It applies in example, when combining solder is weld tabs, weld tabs can be fixed on flat surfaces (i.e. cushioned material layer by spot welding or glue material
Outer surface 2S) on.It should be noted that if heating hard solder executing when weld tabs being fixed on flat surfaces by glue material
During processing, another bulk can use, such as: graphite block applies the active force pushed to weld tabs, can avoid weld tabs and is adding
When hot hard solder is handled, from side or corner warpage.
In addition, multiple abrasive grains 31 can be consolidated by another glue material when abrasive grains 31 are dispersed on weld tabs
It is fixed.The glue material for being previously used for fixing multiple abrasive grains 31 can be double-sided adhesive and be formed in weldering and spraying or being coated with
The glue-line of on piece.
In one embodiment, in conjunction with the thickness of solder be between 25 μm to 300 μm, can be according to the ruler of abrasive grains 31
Very little size selects.Furthermore, the size of abrasive grains 31 is bigger, also can be thicker in conjunction with the thickness of solder, but is passing through
It crosses heating hard solder to handle and formed after binder course 30, binder course 30 will not cover the cutting tip 31t of abrasive grains 31.
It should be noted that heating hard solder temperature must make to combine melt solder, to make more when executing heating hard solder processing
A abrasive grains 31 anchor on pedestal 1.But heating hard solder temperature when heating hard solder processing need to be controlled, to avoid buffering
Solder layer also melts together when combining melt solder.Therefore, in one embodiment, the heating hard solder of heating hard solder processing is executed
Temperature can be lower than the temperature that is heating and curing for executing the processing that is heating and curing.
It, in embodiments of the present invention, can be lower than the fusing point of buffering solder in conjunction with the fusing point of solder based on above-mentioned.Further and
Speech, the liquidus temperature in conjunction with corresponding to solder can be less than solidus temperature corresponding to buffering solder.In addition, buffering solder institute
Difference between liquidus temperature corresponding to corresponding solidus temperature and combination solder is at least more than 20 DEG C, or makes to delay
It rushes liquidus temperature corresponding to solder and is higher than in conjunction with corresponding to solder at least 100 DEG C of liquidus temperature, be relatively avoided that and holding
When row heating hard solder processing, buffering solder layer 2 is melted.
For example, when the material of buffering solder layer 2 selects AWS BNi5a (corresponding solidus (solidus) temperature
It is 1052 DEG C), the Nickel Matrix Solder of amorphous is also possible in conjunction with solder, such as: AWS BNi2 (corresponding liquidus curve (liquidus) temperature
Degree is 1024 DEG C) or BNi6 (corresponding liquidus curve (liquidus) temperature is 921 DEG C).
In this embodiment, buffering solder layer 2 is melted as long as being avoided that when executing heating hard solder processing, the present invention
In be not intended to limit buffering solder and combine solder selection.Therefore, it is formed in the cutting of multiple abrasive grains 31 on pedestal 1
Tip 31t will not because of pedestal 1 thermal deformation and have excessive difference in height.That is, by the above-mentioned manufacture method, it is multiple
The cutting tip 31t of abrasive grains 31 can substantially be fallen on identical horizontal plane.
As shown in Figure 2 D, the polishing pad trimmer of the embodiment of the present invention includes pedestal 1, buffering solder layer 2 and grind section
3.In the present embodiment, the top surface 1a ' of pedestal 1 is curved surface, and bottom surface 1b is flat surfaces.Buffering solder layer 2 is to be set to curved surface
On.In addition, in the present embodiment, curved surface is cambered surface on one, and the thickness for buffering solder layer 2 is with closing cambered surface by periphery in
Centre is decrescence.
Grind section 3 is set on pedestal 1, and grind section 3 and buffering solder layer 2 are all located at the same side of pedestal 1.Also
It is to say, buffering solder layer 2 is located between binder course 30 and curved surface (top surface 1a ').
Grind section 3 includes the abrasive grains 31 of a binder course 30 and multiple scattering devices in binder course 30.It is multiple to grind
Abrasive particle 31 is respectively provided with multiple cutting tip 31t of a lapped face 30S of protrusion binder course 30.
If the highest cutting tip 31t of first three height and position in multiple cutting tip 31t be will form into a plane, and
By the plane definition at a plane of reference.It is formed by polishing pad trimmer P1, grinds in the manufacturing method via the present embodiment
Vertical drop between multiple cutting tip 31t and the plane of reference in mill portion 3 can be no more than 50 μm, with meet to line width 45nm with
Under semiconductor crystal wafer polishing demand.
In another embodiment, planarization step is also possible to single side planarization step.E and Fig. 2 F referring to figure 2..?
It is that one single side planarization step is executed to composite base M " to along dotted line depicted in Fig. 2 E, thus compound in Fig. 2 E
The wherein side of pedestal M1 ' forms flat surfaces.
Specifically, as shown in Fig. 2 E and Fig. 2 F, when executing single side planarization step, one of buffering solder layer 2 '
Branch is removed.Therefore, as shown in Figure 2 F, the outer surface 2S for buffering solder layer 2 is flat surfaces, and grind section 3 is to be formed
On the flat surfaces (i.e. outer surface 2S) of buffering solder layer 2.
Unlike the embodiment of Fig. 2 B, in the present embodiment, the bottom surface 1b ' of pedestal 1 ' is still curved surface.Usual pedestal 1 '
Bottom surface 1b ' can be equipped with multiple screw holes, using as one locking face.In that case, not for the flatness of bottom surface 1b '
It is required that it is very high, therefore planarization step only can be executed to the wherein side of composite base M ".
Fig. 3 A to 3D is respectively section signal of the polishing pad trimmer of another embodiment of the present invention in each step of Fig. 1
Figure.The present embodiment and the identical part of previous embodiment repeat no more, and identical element label having the same.
Referring to figure 3. unlike the embodiment of A and Fig. 2A, in the present embodiment, buffering solder 2 " is formed at initially
The bottom surface 1b " of pedestal 1 ".Then, B referring to figure 3., is carrying out the processing that is heating and curing, and makes to buffer the melting of solder 2 " and cooling and solidifying
Afterwards, the composite base M2 " with buffering solder layer 2 ' and pedestal 1 ' is formed.The pedestal 1 ' of the present embodiment is by initial 1 " shape of pedestal
Become and generally in arc body.
However, in the present embodiment, due to the thermal expansion coefficient of the thermal expansion coefficient and pedestal 1 ' of buffering solder 2 "
Difference, and the top surface 1a ' of pedestal 1 ' and bottom surface 1b ' is made all to form lower camber side.In addition, buffering solder layer 2 ' cooperates the change of pedestal 1 '
The inner surface (not labeled) of shape and outer surface 2S and arc with arc, wherein arc shaped inside surface is connected to pedestal
1 ' bottom surface 1b '.
C referring to figure 3. in the present embodiment, and executes two-sided planarization step to composite base M2 ", to form two
A flat surfaces for being located at two opposite side of composite base M2, and the outer surface 2S for buffering solder layer is flat surfaces.
It is worth noting that, in the composite base M2 of the present embodiment, bottom surface 1b ' that pedestal 1 is contacted with buffering solder layer 2
It is still a curved surface, and in the present embodiment, curved surface is lower camber side.Accordingly, the wheel of the thickness cooperation bottom surface 1b ' of solder layer 2 is buffered
Exterior feature, it is cumulative towards center by the periphery of buffering solder layer 2.In addition, by two-sided planarization step remove a part of pedestal 1 ' it
Afterwards, the top surface 1a of pedestal 1 is flat surfaces, and the thickness of pedestal 1 is central decrescence from periphery direction.
Then, D referring to figure 3. forms grind section 3 on pedestal 1.In the present embodiment, grind section 3 and buffering solder
Layer 2 is two opposite sides for being located at pedestal 1.The step of forming grind section 3 is similar with previous embodiment, does not repeat herein.
It in the present embodiment, is the weld tabs either glue material containing welding powder in conjunction with solder.Since pedestal 1 is Fig. 3 B's
Deformed in step, and buffer solder layer 2 also can inhibit pedestal deformation, execute heating hard solder processing when, even if pedestal 1 still some
Light deformation, but the degree deformed is not to cause the height fall between multiple cutting tips of multiple abrasive grains 31 too big.
E and 3F referring to figure 3..In another embodiment, surface that can also only to the wherein side of composite base M2 "
(such as pedestal 1 ' top surface 1a ' or buffer solder layer 2 ' outer surface 2S ') execute planarization step.
It is that planarization step only is executed to the top surface 1a ' of pedestal 1 ' in the embodiment of Fig. 3 E.Accordingly, as illustrated in Figure 3 F,
In composite base M2 ', the top surface 1a of pedestal 1 is flat surfaces, and grind section 3 is formed on flat surfaces.In this implementation
In example, grind section 3 and buffering solder layer 2 ' are two opposite sides for being located at pedestal 1.In addition, in the present embodiment, executing
When heating hard solder processing, the buffering solder layer 2 ' on the bottom surface 1b ' of pedestal 1 can still limit the deformation of pedestal 1, to reduce
Deformation extent of the pedestal 1 when heating hard solder processing.
In addition, A to 4C referring to figure 4., shows each step of the polishing pad trimmer in Fig. 1 of yet another embodiment of the invention
In diagrammatic cross-section.In the present embodiment, composite base M3 ' further includes two layers of buffering weldering for being located at two opposite side of pedestal 1 '
The bed of material 2 '.
Specifically, in the step of providing composite base, as shown in Figure 4 A, first respectively in the top surface of initial pedestal 1 "
One layer of buffering solder 2 " of each formation on 1a " and bottom surface 1b ".Then, as shown in Figure 4 B, execute one to be heating and curing processing, make to delay
After rushing the melting of solder 2 " and cooling and solidifying, forms two layers and be located at two opposite side of pedestal 1 ' buffering solder layer 2 '.It is worth noting
, in the present embodiment, original 1 " deformation of initial pedestal, therefore the top surface 1a ' and bottom surface 1b ' of the pedestal 1 ' after deformation are all
For convex surface.
Then, a planarization step is executed, so that composite base M3 has an at least flat surfaces.In the present embodiment,
It is to execute two-sided planarization step, so that the outer surface 2S for being located at two layers of buffering solder layer 2 of 1 ' two sides of pedestal is flat
Surface.
In another embodiment, it can also execute single side planarization step, be located at the wherein side of pedestal 1 ' to planarize
Buffer the outer surface 2S ' of solder layer 2 '.
Then, as shown in Figure 4 C, grind section 30 is formed on the wherein outer surface 2S of a buffering solder layer 2.It must say
Bright, when executing heating hard solder processing, two layers of buffering solder layer 2 in the present embodiment can be provided in the two sides of pedestal 1 '
Active force, to further suppress the deformation of pedestal 1 ', to reduce the degree of the deformation of pedestal 1 '.Accordingly, it can avoid because of pedestal 1 '
The problem that thermal deformation causes the height fall between the cutting tip 31t of multiple abrasive grains 31 of grind section 3 excessive.
A and Fig. 5 B referring to figure 5., wherein the step of Fig. 5 A and Fig. 5 B is hookup 4A.That is, carrying out Fig. 5 A's
Before step, buffering solder 2 " first can be formed in two opposite sides of initial pedestal 1 ", as shown in Figure 4 A.
Unlike the embodiment of Fig. 4 B, be heating and curing processing in execution one, make to buffer the melting of solder 2 " and it is cooling admittedly
After change, original 1 " deformation of initial pedestal, to make the top surface 1a ' of the pedestal 1 ' after deformation and bottom surface 1b ' they be all inner concave.
In addition, in the present embodiment, a single side planarization step is executed to composite base M4 ', to keep removal a part of
Positioned at the buffering solder layer 2 ' of top surface 1a '.Accordingly, after executing single side planarization step, in composite base M4, it is located at top
The outer surface 2S of the buffering solder layer 2 of face 1a ' is flat surfaces, and the outside table of the buffering solder layer 2 ' positioned at bottom surface 1b '
Face 2S ' is curved surface.
Then, grind section 3 is formed on composite base M4.In the present embodiment, grind section 3 is to be located at top surface 1a '
It buffers on solder layer 2.As previously mentioned, two layers of buffering solder layer 2,2 ' in the present embodiment is still when executing heating hard solder processing
Active force can be provided in the two sides of pedestal 1 ', to further suppress the deformation of pedestal 1 ', to can avoid the thermal deformation because of pedestal 1 '
The problem for causing the height fall between the cutting tip 31t of multiple abrasive grains 31 of grind section 3 excessive.
The beneficial effects of the present invention are, polishing pad trimmer P1, P2, P1 ' provided by technical solution of the present invention,
It is before forming grind section 3, first providing includes buffering solder layer 2,2 ' and pedestal in P2 ', P3, P4 and its manufacturing method
1 ' composite base M1 ", M2 ", M3 ', M4 ', and become pedestal 1 ' in advance during buffering solder layer 2,2 ' is cured
Shape and there is curved surface, the wherein side ', M2, M2 ', M3, M4 is then formed positioned at composite base M1, M1 by planarization step
Flat surfaces.
Formed grind section 3 in composite base M1, M1 ', M2, M2 ', on M3, M4 when, in advance due to pedestal 1,1 '
By deformation, and cured buffering solder layer 2,2 ' can also Authority limit pedestal 1 ' deformation quantity, so pedestal 1 ' is at heating hard solder
Deformation quantity when reason can be greatly reduced.Therefore, multiple abrasive grains 31 of grind section 3 cutting tip 31r height fall by
Pedestal 1,1 ' influence of thermal deformation are smaller, and may conform to practical application request.
Content disclosed above is only preferred possible embodiments of the invention, and Bing is non-, and because of Ci Authority to limit application of the invention special
Sharp range, so all equivalence techniques variations done with description of the invention and accompanying drawing content, are both contained in of the invention
In claim.
Claims (19)
1. a kind of polishing pad trimmer, which is characterized in that the polishing pad trimmer includes:
One composite base, the composite base include a pedestal and the buffering solder layer being formed on the pedestal, wherein institute
At least surface for stating pedestal is curved surface, and the buffering solder layer covers the curved surface；And
One grind section is set on the composite base, wherein the grind section includes a binder course and multiple scattering devices
Abrasive grains in the binder course, wherein the multiple abrasive grains are respectively provided with the grinding for protruding the binder course
Multiple cutting tips on surface；
Wherein, solidus temperature corresponding to the buffering solder layer is greater than liquidus temperature corresponding to the binder course.
2. the polishing pad trimmer as described in claims 1, which is characterized in that the grind section is set on the curved surface, and institute
Buffering solder layer is stated between the binder course and the curved surface.
3. the polishing pad trimmer as described in claims 2, which is characterized in that the pedestal further includes another curved surface, and another institute
It states curved surface and the grind section is located at two opposite sides of the pedestal.
4. the polishing pad trimmer as described in claims 1, which is characterized in that the polishing pad trimmer still further comprises another
Solder layer is buffered, the buffering solder layer and another buffering solder layer are located at two opposite sides of the pedestal.
5. the polishing pad trimmer as described in claims 1, which is characterized in that the curved surface is cambered surface or a lower camber side on one, and
The thickness of the buffering solder layer cooperates the profile of the curved surface, cumulative or gradually towards center by the periphery of the buffering solder layer
Subtract.
6. the polishing pad trimmer as described in claims 1, which is characterized in that liquidus temperature corresponding to the buffering solder layer
Higher than at least 100 DEG C of liquidus temperature corresponding to the binder course.
7. the polishing pad trimmer as described in claims 1, which is characterized in that the grind section and the buffering solder layer distinguish position
In two opposite sides of the pedestal, and the curved surface is located at the bottom of the pedestal, and the surface of the buffering solder layer is song
Face or plane.
8. the polishing pad trimmer as described in claims 1, which is characterized in that the material of the pedestal be iron, molybdenum, tungsten, stainless steel,
Invar alloy or nickel based super alloy.
9. the polishing pad trimmer as described in claims 1, which is characterized in that the thickness of the buffering solder layer is between 25 to 500 μ
Between m, and the thickness of the binder course is between 25 to 300 μm.
10. a kind of manufacturing method of polishing pad trimmer, which is characterized in that the manufacturing method of the polishing pad trimmer includes:
One composite base is provided, the composite base includes a pedestal and the buffering solder layer being formed on the pedestal,
In, the pedestal has an at least curved surface, and the buffering solder layer covers the curved surface；
One planarization step is executed to the composite base, to form a flat table in the wherein at least side of the composite base
Face；
A grind section is formed on the flat surfaces, wherein the grind section includes a binder course and multiple scattering devices
Abrasive grains in the binder course, and the multiple abrasive grains are respectively provided with the lapped face for protruding the binder course
Multiple cutting tips.
11. the manufacturing method of the polishing pad trimmer as described in claims 10, which is characterized in that providing the composite base
In step, comprising:
A buffering solder is formed on an initial pedestal；And
It executes one to be heating and curing processing, so as to the buffering melt solder and be formed by curing the buffering solder layer, wherein described
Initial pedestal deforms after being heating and curing processing described in the execution and forms the pedestal.
12. the manufacturing method of the polishing pad trimmer as described in claims 11, which is characterized in that the buffering solder is a weldering
Piece, and in forming the step of buffering solder is in the initial pedestal, it is to be fixed the weld tabs by spot welding or sizing material
In on the initial pedestal.
13. the manufacturing method of the polishing pad trimmer as described in claims 11, which is characterized in that form the grind section in described
Step on pedestal includes at least:
One is formed in conjunction with solder on the flat surfaces；
Multiple abrasive grains are set on the pedestal, wherein multiple abrasive grains pass through the combination solder point
It is set on the pedestal scatteredly；And
Hard solder heat treatment is executed, so that the combination melt solder and solidification, to form the grind section, and are executing institute
State be heating and curing temperature of the heating hard solder temperature lower than the processing that is heating and curing described in execution of heating hard solder processing.
14. the manufacturing method of the polishing pad trimmer as described in claims 13, which is characterized in that the combination solder and institute
State the mixture that buffering solder is weld tabs, soldering paste or sizing material and welding powder.
15. the manufacturing method of the polishing pad trimmer as described in claims 13, which is characterized in that the combination solder is weld tabs,
And the combination solder is being formed in the step on the flat surfaces, it is by spot welding or sizing material by the fixation of the weld tabs
In on the composite base.
16. the manufacturing method of the polishing pad trimmer as described in claims 13, which is characterized in that corresponding to the buffering solder
Solidus temperature is greater than liquidus temperature corresponding to the combination solder, and solidus temperature corresponding to the buffering solder
Difference between liquidus temperature corresponding to the combination solder is at least more than 20 DEG C.
17. the manufacturing method of the polishing pad trimmer as described in claims 10, which is characterized in that the flat surfaces are described slow
An outer surface of solder layer is rushed, the binder course is incorporated on the flat surfaces, and the binder course and the buffering are welded
The bed of material is located at the same side of the pedestal.
18. the manufacturing method of the polishing pad trimmer as described in claims 10, which is characterized in that the flat surfaces are the bases
A top surface or a bottom surface for seat, the binder course are incorporated on the flat surfaces, and the binder course and the buffering solder
Layer is located at two opposite sides of the pedestal.
19. the manufacturing method of the polishing pad trimmer as described in claims 10, which is characterized in that providing the composite base
In step, the composite base further includes another buffering solder layer, and the buffering solder layer and another buffering solder layer
It is two opposite sides for being located at the pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710796671.7A CN109454557B (en) | 2017-09-06 | 2017-09-06 | Polishing pad dresser and method of manufacturing the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710796671.7A CN109454557B (en) | 2017-09-06 | 2017-09-06 | Polishing pad dresser and method of manufacturing the same |
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| Publication Number | Publication Date |
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| CN109454557A true CN109454557A (en) | 2019-03-12 |
| CN109454557B CN109454557B (en) | 2020-11-24 |
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| CN201710796671.7A Expired - Fee Related CN109454557B (en) | 2017-09-06 | 2017-09-06 | Polishing pad dresser and method of manufacturing the same |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001150328A (en) * | 1999-11-26 | 2001-06-05 | Fujimori Gijutsu Kenkyusho:Kk | Polishing dresser for polishing disk of chemical machine polisher and manufacturing method for it |
| JP2006305659A (en) * | 2005-04-27 | 2006-11-09 | Nippon Steel Corp | Dresser for polishing cloth |
| CN101298132A (en) * | 2007-04-30 | 2008-11-05 | 三芳化学工业股份有限公司 | Combined grinding pad and method of manufacturing the same |
| CN102601725A (en) * | 2011-01-21 | 2012-07-25 | 硅电子股份公司 | Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus |
| CN202952159U (en) * | 2012-08-08 | 2013-05-29 | 铼钻科技股份有限公司 | Chemical mechanical polishing dresser |
| CN203380772U (en) * | 2013-04-08 | 2014-01-08 | 宋健民 | Chemical mechanical polishing dresser |
| CN203390712U (en) * | 2013-04-08 | 2014-01-15 | 宋健民 | Chemical mechanical polishing dresser |
| TW201417949A (en) * | 2012-11-07 | 2014-05-16 | Kinik Co | Chemical mechanical polishing conditioner and associated methods |
| US20150050871A1 (en) * | 2013-08-16 | 2015-02-19 | Kinik Company | Chemical Mechanical Polishing Conditioner Made From Woven Preform |
-
2017
- 2017-09-06 CN CN201710796671.7A patent/CN109454557B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001150328A (en) * | 1999-11-26 | 2001-06-05 | Fujimori Gijutsu Kenkyusho:Kk | Polishing dresser for polishing disk of chemical machine polisher and manufacturing method for it |
| JP2006305659A (en) * | 2005-04-27 | 2006-11-09 | Nippon Steel Corp | Dresser for polishing cloth |
| CN101298132A (en) * | 2007-04-30 | 2008-11-05 | 三芳化学工业股份有限公司 | Combined grinding pad and method of manufacturing the same |
| CN102601725A (en) * | 2011-01-21 | 2012-07-25 | 硅电子股份公司 | Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus |
| CN202952159U (en) * | 2012-08-08 | 2013-05-29 | 铼钻科技股份有限公司 | Chemical mechanical polishing dresser |
| TW201417949A (en) * | 2012-11-07 | 2014-05-16 | Kinik Co | Chemical mechanical polishing conditioner and associated methods |
| CN203380772U (en) * | 2013-04-08 | 2014-01-08 | 宋健民 | Chemical mechanical polishing dresser |
| CN203390712U (en) * | 2013-04-08 | 2014-01-15 | 宋健民 | Chemical mechanical polishing dresser |
| US20150050871A1 (en) * | 2013-08-16 | 2015-02-19 | Kinik Company | Chemical Mechanical Polishing Conditioner Made From Woven Preform |
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| CN109454557B (en) | 2020-11-24 |
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