CN109428500B - 功率转换器装置 - Google Patents

功率转换器装置 Download PDF

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Publication number
CN109428500B
CN109428500B CN201811030328.2A CN201811030328A CN109428500B CN 109428500 B CN109428500 B CN 109428500B CN 201811030328 A CN201811030328 A CN 201811030328A CN 109428500 B CN109428500 B CN 109428500B
Authority
CN
China
Prior art keywords
power converter
converter device
resistor
electrically connected
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811030328.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN109428500A (zh
Inventor
R·菏泽
R·比特纳
N·布拉尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Electronics Co ltd
Original Assignee
Semikron Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Electronics Co ltd filed Critical Semikron Electronics Co ltd
Publication of CN109428500A publication Critical patent/CN109428500A/zh
Application granted granted Critical
Publication of CN109428500B publication Critical patent/CN109428500B/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/40—Testing power supplies
    • G01R31/42—AC power supplies
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05567—Disposition the external layer being at least partially embedded in the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inverter Devices (AREA)
  • Dc-Dc Converters (AREA)
CN201811030328.2A 2017-09-05 2018-09-05 功率转换器装置 Active CN109428500B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017120356.7A DE102017120356A1 (de) 2017-09-05 2017-09-05 Stromrichtereinrichtung
DE102017120356.7 2017-09-05

Publications (2)

Publication Number Publication Date
CN109428500A CN109428500A (zh) 2019-03-05
CN109428500B true CN109428500B (zh) 2023-09-19

Family

ID=65363532

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811030328.2A Active CN109428500B (zh) 2017-09-05 2018-09-05 功率转换器装置

Country Status (2)

Country Link
CN (1) CN109428500B (de)
DE (1) DE102017120356A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021127644A1 (de) 2021-10-25 2023-04-27 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Überwachung des Betriebs einer Stromrichtereinrichtung und Stromrichteranordnung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6434181A (en) * 1987-07-30 1989-02-03 Mitsubishi Electric Corp Dc voltage detection circuit of invertor device
CN1691476A (zh) * 2004-04-27 2005-11-02 三洋电机株式会社 逆变器模块
DE102012109283A1 (de) * 2012-09-28 2014-04-03 Siemens Aktiengesellschaft Stromrichter mit Zusatzschaltung, sowie Verfahren zum Betreiben eines Stromrichters
DE102014112517B3 (de) * 2014-09-01 2015-08-27 Semikron Elektronik Gmbh & Co. Kg Stromrichtereinrichtung
CN106787622A (zh) * 2016-12-05 2017-05-31 广州金升阳科技有限公司 一种电压采样方法及电压采样电路

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004180281A (ja) * 2002-11-13 2004-06-24 Renesas Technology Corp 直交ミキサ回路及びそれを用いた携帯端末
DE102006062101B4 (de) * 2006-12-30 2017-10-05 Conti Temic Microelectronic Gmbh Vorrichtung zum Entladen des Zwischenkreiskondensators der Leistungselektronik eines Hybridantriebssystems
DE102008010978A1 (de) 2008-02-25 2009-08-27 Robert Bosch Gmbh Entladeschaltung für Hochspannungsnetze
EP2308088A1 (de) * 2008-07-02 2011-04-13 Nxp B.V. Verbesserter meander-widerstand

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6434181A (en) * 1987-07-30 1989-02-03 Mitsubishi Electric Corp Dc voltage detection circuit of invertor device
CN1691476A (zh) * 2004-04-27 2005-11-02 三洋电机株式会社 逆变器模块
DE102012109283A1 (de) * 2012-09-28 2014-04-03 Siemens Aktiengesellschaft Stromrichter mit Zusatzschaltung, sowie Verfahren zum Betreiben eines Stromrichters
DE102014112517B3 (de) * 2014-09-01 2015-08-27 Semikron Elektronik Gmbh & Co. Kg Stromrichtereinrichtung
CN106787622A (zh) * 2016-12-05 2017-05-31 广州金升阳科技有限公司 一种电压采样方法及电压采样电路

Also Published As

Publication number Publication date
CN109428500A (zh) 2019-03-05
DE102017120356A1 (de) 2019-03-07

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