CN109423232A - A kind of room-temperature curing epoxy conducting resinl - Google Patents
A kind of room-temperature curing epoxy conducting resinl Download PDFInfo
- Publication number
- CN109423232A CN109423232A CN201710767450.7A CN201710767450A CN109423232A CN 109423232 A CN109423232 A CN 109423232A CN 201710767450 A CN201710767450 A CN 201710767450A CN 109423232 A CN109423232 A CN 109423232A
- Authority
- CN
- China
- Prior art keywords
- conducting resinl
- room
- temperature curing
- ethylenediamine
- silver powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of room-temperature curing epoxy conducting resinls, comprising: E-44 epoxy resin 40, silver powder 60, dibutyl phthalate 10 ~ 20, ethylenediamine 6；Epoxy resin: first being heated fusing by the conducting resinl preparation method in a water bath, and dibutyl ester and silver powder are added in the resin of fusing, is stirring evenly and then adding into ethylenediamine, is stirred for uniformly, that is, can be used.The beneficial effects of the present invention are: adhesive strength is high, good water-proof effect is environmentally protective.
Description
Technical field
The present invention relates to a kind of adhesive, specifically a kind of room-temperature curing epoxy conducting resinl belongs to coating class field.
Background technique
Adhesive is a kind of substance with fine bond properties.By adhesion strength and cohesive force by surface bonding company
Connect the effect of object.China's adhesives industries are started in nineteen fifties, and it is high that the eighties form first production
Tide.Last decade has the development advanced by leaps and bounds, and initially enters the new period of high speed development.The bonding of adhesive on the market at present
Degree is all poor, and waterproof effect is also poor.
Summary of the invention
To overcome the shortcomings of the existing technology, the present invention provides a kind of room-temperature curing epoxy conducting resinl, adhesive strength height is realized,
Good water-proof effect, environmentally protective purpose.
To solve prior art problem, the technical scheme adopted by the invention is that:
A kind of room-temperature curing epoxy conducting resinl, comprising: E-44 epoxy resin 40, silver powder 60, dibutyl phthalate 10 ~ 20,
Ethylenediamine 6；Epoxy resin: first being heated fusing by the conducting resinl preparation method in a water bath, and dibutyl ester is added in the resin of fusing
And silver powder, it is stirring evenly and then adding into ethylenediamine, is stirred for uniformly, that is, can be used.
The beneficial effects of the present invention are: adhesive strength is high, good water-proof effect is environmentally protective.
Specific embodiment
In order to enable those skilled in the art more to understand technical solution of the present invention, below with reference to embodiment to the present invention
It is further analyzed.
A kind of room-temperature curing epoxy conducting resinl, comprising: E-44 epoxy resin 40, silver powder 60, dibutyl phthalate 10 ~
20, ethylenediamine 6；Epoxy resin: first being heated fusing by the conducting resinl preparation method in a water bath, and two fourths are added in the resin of fusing
Ester and silver powder, are stirring evenly and then adding into ethylenediamine, are stirred for uniformly, that is, can be used.
Technical solution provided herein is described in detail above, embodiment used herein is to the application
Principle and embodiment be expounded, the explanation of above embodiments be served only for help understand the present processes and its core
Thought；At the same time, for those skilled in the art, according to the thought of the application, in specific embodiment and application range
Upper there will be changes, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (1)
1. a kind of room-temperature curing epoxy conducting resinl characterized by comprising E-44 epoxy resin 40, silver powder 60, phthalic acid
Dibutyl ester 10 ~ 20, ethylenediamine 6；Epoxy resin: first being heated fusing by the conducting resinl preparation method in a water bath, in the resin of fusing
Middle addition dibutyl ester and silver powder, are stirring evenly and then adding into ethylenediamine, are stirred for uniformly, that is, can be used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710767450.7A CN109423232A (en) | 2017-08-31 | 2017-08-31 | A kind of room-temperature curing epoxy conducting resinl |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710767450.7A CN109423232A (en) | 2017-08-31 | 2017-08-31 | A kind of room-temperature curing epoxy conducting resinl |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109423232A true CN109423232A (en) | 2019-03-05 |
Family
ID=65505187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710767450.7A Pending CN109423232A (en) | 2017-08-31 | 2017-08-31 | A kind of room-temperature curing epoxy conducting resinl |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109423232A (en) |
-
2017
- 2017-08-31 CN CN201710767450.7A patent/CN109423232A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190305 |
|
| WD01 | Invention patent application deemed withdrawn after publication |