CN109423248A - A kind of high strength structural adhesion - Google Patents
A kind of high strength structural adhesion Download PDFInfo
- Publication number
- CN109423248A CN109423248A CN201710767437.1A CN201710767437A CN109423248A CN 109423248 A CN109423248 A CN 109423248A CN 201710767437 A CN201710767437 A CN 201710767437A CN 109423248 A CN109423248 A CN 109423248A
- Authority
- CN
- China
- Prior art keywords
- ethanedioic acid
- high strength
- strength structural
- present
- glycerol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
Abstract
The present invention relates to a kind of high strength structural adhesions, E-20 epoxy resin 100, and ethanedioic acid glyceride 20 ~ 60, aluminium powder 15 ~ 20, ethanedioic acid and glycerol mole ratio are 3, and the preparation method of the glue: above-mentioned three fraction is weighed up, is mixed, 90 ~ 95 DEG C is heated to, stirs evenly.After the ethanedioic acid and glycerol gram molecule feed intake, 150 DEG C of reaction temperature rise to 180 ~ 190 DEG C, 150 DEG C are down to after reaction, vacuum dehydration.The beneficial effects of the present invention are: adhesive strength is high, good water-proof effect is environmentally protective.
Description
Technical field
The present invention relates to a kind of adhesive, specifically a kind of high strength structural adhesion belongs to coating class field.
Background technique
Adhesive is a kind of substance with fine bond properties.By adhesion strength and cohesive force by surface bonding company
Connect the effect of object.China's adhesives industries are started in nineteen fifties, and it is high that the eighties form first production
Tide.Last decade has the development advanced by leaps and bounds, and initially enters the new period of high speed development.The bonding of adhesive on the market at present
Degree is all poor, and waterproof effect is also poor.
Summary of the invention
To overcome the shortcomings of the existing technology, the present invention provides a kind of high strength structural adhesion, adhesive strength height, waterproof effect are realized
Fruit is good, environmentally protective purpose.
To solve prior art problem, the technical scheme adopted by the invention is that:
A kind of high strength structural adhesion, E-20 epoxy resin 100, ethanedioic acid glyceride 20 ~ 60, aluminium powder 15 ~ 20, ethanedioic acid with it is sweet
Oily mole ratio is 3, and the preparation method of the glue: above-mentioned three fraction is weighed up, is mixed, 90 ~ 95 DEG C is heated to, stirs evenly.
Further, after the ethanedioic acid and glycerol gram molecule feed intake, 150 DEG C of reaction temperature rise to 180 ~ 190 DEG C, reaction
After be down to 150 DEG C, vacuum dehydration.
The beneficial effects of the present invention are: adhesive strength is high, good water-proof effect is environmentally protective.
Specific embodiment
In order to enable those skilled in the art more to understand technical solution of the present invention, below with reference to embodiment to the present invention
It is further analyzed.
A kind of high strength structural adhesion, E-20 epoxy resin 100, ethanedioic acid glyceride 20 ~ 60, aluminium powder 15 ~ 20, ethanedioic acid
It is 3 with glycerol mole ratio, the preparation method of the glue: above-mentioned three fraction is weighed up, is mixed, 90 ~ 95 DEG C is heated to, stirs evenly.
The present invention is applied to the bonding of alloy aluminum.
Technical solution provided herein is described in detail above, embodiment used herein is to the application
Principle and embodiment be expounded, the explanation of above embodiments be served only for help understand the present processes and its core
Thought；At the same time, for those skilled in the art, according to the thought of the application, in specific embodiment and application range
Upper there will be changes, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (2)
1. a kind of high strength structural adhesion, it is characterised in that: E-20 epoxy resin 100, ethanedioic acid glyceride 20 ~ 60, aluminium powder 15 ~
20, ethanedioic acid and glycerol mole ratio are 3, and the preparation method of the glue: above-mentioned three fraction being weighed up, is mixed, is heated to 90 ~ 95 DEG C,
It stirs evenly.
2. a kind of high strength structural adhesion according to claim 1, it is characterised in that: ethanedioic acid feeds intake with glycerol gram molecule
Afterwards, 180 ~ 190 DEG C are risen to for 150 DEG C of reaction temperature, 150 DEG C is down to after reaction, vacuum dehydration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710767437.1A CN109423248A (en) | 2017-08-31 | 2017-08-31 | A kind of high strength structural adhesion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710767437.1A CN109423248A (en) | 2017-08-31 | 2017-08-31 | A kind of high strength structural adhesion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109423248A true CN109423248A (en) | 2019-03-05 |
Family
ID=65505168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710767437.1A Pending CN109423248A (en) | 2017-08-31 | 2017-08-31 | A kind of high strength structural adhesion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109423248A (en) |
-
2017
- 2017-08-31 CN CN201710767437.1A patent/CN109423248A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190305 |
|
| WD01 | Invention patent application deemed withdrawn after publication |