CN109423241A - A kind of temperature resistant structural adhesive - Google Patents

A kind of temperature resistant structural adhesive Download PDF

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Publication number
CN109423241A
CN109423241A CN201710767366.5A CN201710767366A CN109423241A CN 109423241 A CN109423241 A CN 109423241A CN 201710767366 A CN201710767366 A CN 201710767366A CN 109423241 A CN109423241 A CN 109423241A
Authority
CN
China
Prior art keywords
temperature resistant
resistant structural
present
structural adhesive
prepares
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710767366.5A
Other languages
Chinese (zh)
Inventor
梁沛明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Zhi Zhi Enterprise Incubator Development Co Ltd
Original Assignee
Zhongshan Zhi Zhi Enterprise Incubator Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongshan Zhi Zhi Enterprise Incubator Development Co Ltd filed Critical Zhongshan Zhi Zhi Enterprise Incubator Development Co Ltd
Priority to CN201710767366.5A priority Critical patent/CN109423241A/en
Publication of CN109423241A publication Critical patent/CN109423241A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0856Iron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention relates to a kind of temperature resistant structural adhesives, comprising: diamino diphenyl ether polyfunctional epoxy resin 100, liquid nitrile rubber 8-10, curing agent 10, iron powder 20;It prepares in proportion.The beneficial effects of the present invention are: adhesive strength is high, good water-proof effect is environmentally protective.

Description

A kind of temperature resistant structural adhesive
Technical field
The present invention relates to a kind of adhesive, specifically a kind of temperature resistant structural adhesive belongs to coating class field.
Background technique
Adhesive is a kind of substance with fine bond properties.By adhesion strength and cohesive force by surface bonding company Connect the effect of object.China's adhesives industries are started in nineteen fifties, and it is high that the eighties form first production Tide.Last decade has the development advanced by leaps and bounds, and initially enters the new period of high speed development.The bonding of adhesive on the market at present Degree is all poor, and waterproof effect is also poor.
Summary of the invention
To overcome the shortcomings of the existing technology, the present invention provides a kind of temperature resistant structural adhesive, adhesive strength height, waterproof effect are realized Good, environmentally protective purpose.
To solve prior art problem, the technical scheme adopted by the invention is that:
A kind of temperature resistant structural adhesive, comprising: diamino diphenyl ether polyfunctional epoxy resin 100, liquid nitrile rubber 8-10, solidification Agent 10, iron powder 20;It prepares in proportion.
The beneficial effects of the present invention are: adhesive strength is high, good water-proof effect is environmentally protective.
Specific embodiment
In order to enable those skilled in the art more to understand technical solution of the present invention, below with reference to embodiment to the present invention It is further analyzed.
A kind of temperature resistant structural adhesive, comprising: diamino diphenyl ether polyfunctional epoxy resin 100, liquid nitrile rubber 8-10, Curing agent 10, iron powder 20;It prepares in proportion.
The repairing for the defects of present invention is mainly applied to the sand holes of cast iron parts peculiar to vessel, gap, fine cracks, technological effect It is good, it is especially more preferable to the component that cannot be repaired with welding or mechanical fixing means.
Technical solution provided herein is described in detail above, embodiment used herein is to the application Principle and embodiment be expounded, the explanation of above embodiments be served only for help understand the present processes and its core Thought;At the same time, for those skilled in the art, according to the thought of the application, in specific embodiment and application range Upper there will be changes, in conclusion the contents of this specification should not be construed as limiting the present application.

Claims (1)

1. a kind of temperature resistant structural adhesive, it is characterised in that: include: diamino diphenyl ether polyfunctional epoxy resin 100, liquid butyronitrile rubber Glue 8-10, curing agent 10, iron powder 20;It prepares in proportion.
CN201710767366.5A 2017-08-31 2017-08-31 A kind of temperature resistant structural adhesive Pending CN109423241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710767366.5A CN109423241A (en) 2017-08-31 2017-08-31 A kind of temperature resistant structural adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710767366.5A CN109423241A (en) 2017-08-31 2017-08-31 A kind of temperature resistant structural adhesive

Publications (1)

Publication Number Publication Date
CN109423241A true CN109423241A (en) 2019-03-05

Family

ID=65505014

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710767366.5A Pending CN109423241A (en) 2017-08-31 2017-08-31 A kind of temperature resistant structural adhesive

Country Status (1)

Country Link
CN (1) CN109423241A (en)

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190305