CN109413853A - Calculation circuit board and calculation equipment comprising same - Google Patents
Calculation circuit board and calculation equipment comprising same Download PDFInfo
- Publication number
- CN109413853A CN109413853A CN201811354624.8A CN201811354624A CN109413853A CN 109413853 A CN109413853 A CN 109413853A CN 201811354624 A CN201811354624 A CN 201811354624A CN 109413853 A CN109413853 A CN 109413853A
- Authority
- CN
- China
- Prior art keywords
- computing
- computing board
- board according
- welding layer
- operating die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a computing circuit board and computing equipment comprising the same. According to the computing circuit board and the computing equipment comprising the same, the exhaust gap is arranged on the welding layer, so that gas in solder paste can be exhausted, welding is full and bubble-free, excessive soldering tin can be prevented from seeping out of the working chip and the copper sheet, and the reliability of connection is guaranteed.
Description
Technical field
The present invention relates to a kind of circuit boards, specifically, being the counting circuit for being related to a kind of soldering and being completely embedded bubble-free
Plate.The invention further relates to a kind of calculating equipment including above-mentioned computing board.
Background technique
Pcb board, that is, printed circuit board is the general designation of common circuit plate, by material be divided into cardboard, half glass-fiber-plate, glass-fiber-plate,
Metal substrate etc..Wherein, the pcb board of metal substrate form has good heat sinking function, and general single side pcb board is by three-decker
It is formed, is copper foil layer, thermal insulation layer and metal-based layer respectively.Surface mount (SMT) step of single side pcb board is divided into: pre-
Apply soldering paste → patch → Reflow Soldering → inspection and electrical testing.The area Reflow Soldering Fen Sige: heating zone, heat preservation zone, welding section and cooling
Area.When pcb board enters heating zone, solvent, gas evaporation in soldering paste fall, while scaling powder wet pads, first device in soldering paste
Part end and pin, soldering paste softening, slump simultaneously cover pad, pad, component's feet are isolated with oxygen.Pcb board enters guarantor
When warm area, pcb board and component are adequately preheated.Temperature, which rises rapidly, when pcb board enters welding section makes soldering paste reach molten
Change state, liquid solder soaks the pad of pcb board, component end and pin, spreads, cross flow or reflux are mixed to form scolding tin
Contact.Solder joint solidifies when pcb board enters cooling zone, completes Reflow Soldering at this time.But pcb board will appear tin in heating zone
The problem of gas in cream can not be discharged in time and pcb board is caused to there is bubble after welding, influence heat dissipation and electric conductivity.
Summary of the invention
The object of the present invention is to provide a kind of computing board and the calculating equipment including the computing board, circuit board
It can be avoided generation bubble when surface mount process, guarantee that product heat dissipation and electric conductivity are good.
To achieve the goals above, computing board of the invention, including copper foil layer, welding layer, operating die and copper
Piece, the operating die and copper sheet pass through the welding layer respectively and are attached on the copper foil layer, and the copper sheet is set to phase
Between the adjacent operating die, wherein the welding layer includes welding layer main body and is set on the welding body layer
Exhaust clearance.
In one embodiment of above-mentioned computing board, the exhaust clearance includes open end, the open end Yu Suoshu institute
Stating welding layer main body includes the first bulk end and the second bulk end being separated from each other.
In one embodiment of above-mentioned computing board, the exhaust clearance is in strip rectangle or fan-shaped.
In one embodiment of above-mentioned computing board, the welding layer main body includes opposite first side and second
Side, the exhaust clearance are set to the first side and/or second side.
Further include metal substrate in one embodiment of above-mentioned computing board, the copper foil layer include the first face and
Second face, the attached operating die of first face paste and copper sheet, the metal substrate are attached at second face.
In one embodiment of above-mentioned computing board, the operating die is arranged in the first direction multiple.
In one embodiment of above-mentioned computing board, along the first direction, between the adjacent operating die
Apart from incremented/decremented.
In one embodiment of above-mentioned computing board, the operating die be arrange in a second direction it is multiple rows of.
In one embodiment of above-mentioned computing board, the first direction is vertical with the second direction.
Calculating equipment of the invention include power supply unit, the control unit being connected with the power supply unit and with it is described
The computing unit that control unit is connected with power supply unit, the computing unit are integrated on one or more computing boards, wherein
The computing board is above-mentioned computing board.
Beneficial functional of the invention is, computing board of the invention and the calculating equipment including the computing board
By the way that exhaust clearance is arranged on welding layer, the gas in tin cream can not only be discharged, make to weld full bubble-free, can also keep away
Exempt to ensure that the reliability of connection except extra scolding tin exudation operating die and copper sheet.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1 is schematic top plan view when computing board of the invention does not attach operating die and copper sheet；
The A-A schematic cross-sectional view that Fig. 2 is Fig. 1 (after attaching operating die and copper sheet)；
Fig. 3 is the structural schematic diagram of an embodiment of the welding layer of computing board of the invention；
Fig. 4 is the structural schematic diagram of an embodiment of the welding layer of computing board of the invention；
Fig. 5 is the module map of an embodiment of calculating equipment of the invention.
Wherein, appended drawing reference
20: computing board
100: copper foil layer
200: welding layer
210: welding layer main body
211: the first bulk ends
212: the second bulk ends
210a: first side
210b: second side
210c: third side
210d: the four side
220: exhaust clearance
220a: open end
200 ': welding layer
210 ': welding layer main body
210a ': edge
220 ': exhaust clearance
300: operating die
400: copper sheet
500: metal substrate
600: thermal insulation layer
10: calculating equipment
11: power supply unit
12: control unit
13: computing unit
13A: computing board
14: heat-sink unit
X: first direction
Y: second direction
S1: the first face
S2: the second face
P1, p2, p3: spacing
Specific embodiment
Technical solution of the present invention is described in detail in the following with reference to the drawings and specific embodiments, to be further understood that
The purpose of the present invention, scheme and effect, but it is not intended as the limitation of scope of the appended claims of the present invention.
It is directed to the reference of " embodiment ", " another embodiment ", " the present embodiment " etc. in specification, refers to the reality of description
Applying example may include specific feature, structure or characteristic, each embodiment of but not must comprising these special characteristics, structure or
Characteristic.In addition, such statement not refers to the same embodiment.Further, describe in conjunction with the embodiments specific feature,
When structure or characteristic, regardless of either with or without specific description, it has been shown that such feature, structure or characteristic are integrated to other realities
Apply in example is in the knowledge of those skilled in the range.
Some vocabulary is used in specification and following claims to censure specific components or component, this field
The member of ordinary skill, it is to be appreciated that technology user or manufacturer can be different noun or term come call the same component or
Component.This specification and following claims not in such a way that the difference of title is as component or component is distinguished, and
It is the criterion with component or component difference functionally as differentiation.In specification in the whole text and subsequent claim
Mentioned " comprising " and "comprising" is an open term, therefore should be construed to " including but not limited to ".In addition, " connection "
One word includes any direct and indirect connection means herein.
It should be noted that in the description of the present invention, such as occur term " transverse direction ", " longitudinal direction ", "upper", "lower", " preceding ",
The orientation or positional relationship of the instructions such as " rear ", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" be based on
Orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, and is not indication or suggestion institute
The device or element of finger must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to this hair
Bright limitation." first ", " second ", " third ", the order term such as " the 4th " to be addressed herein convenient for clear explanation are to be used for
By element, region, partially with another the same or similar element, region, partially distinguish, rather than it is specific to limit
Element, region, part.
As depicted in figs. 1 and 2, computing board 20 of the invention includes copper foil layer 100, welding layer 200, operating die
300 and copper sheet 400, operating die 300 and copper sheet 400 are attached on copper foil layer 100 by welding layer 200 respectively.In detail
For, operating die 300 and copper sheet 400 are respectively multiple, the e.g. various calculating of operating die 300 and control chip,
As the working efficiency of operating die 300 is higher and higher, the calorific value of operating die 300 is also increasing.Copper sheet 400 has very
Good heat spreading function, welding copper sheet 400 on pcb board is effective radiating mode, is in general set to copper sheet 400 adjacent
Between operating die 300, in addition copper sheet 400 can also reduce line power loss.
As shown in Figure 1, welding layer 200 includes that welding layer main body 210 and exhaust clearance 220, exhaust clearance 210 are set to
It welds on body layer 210.
Operating die 300 and copper sheet 400 are passed through welding layer 200 and copper foil layer with exhaust clearance 220 by the present invention
100 phases attach, the gas that the tin cream that can be not only discharged in welding layer 200 is generated in heating zone, guarantee full no gas after welding
Bubble can also avoid except extra scolding tin exudation operating die 300 and copper sheet 400.
The calorific value of especially present computing board 20 is increasing, in order to keep heat dissipation effect more preferable, generally by copper sheet
400 are sized to more greatly, then more, and can be less susceptible to be discharged in the gas flow that heating zone welding layer 200 generates.The present invention
The design of welding layer 200 gas can be made to be discharged in time, do not influence the welding quality of follow-up phase, improve the reliable of product
Property.
As shown in Figure 3 and Figure 4, the exhaust clearance 220 of welding layer 200 includes open end 220a, at the 220a of open end, weldering
Connecing layer main body 210 includes the first bulk end 211 and the second bulk end 212 being separated from each other.Computing board 20 enters heating zone
When, bulk gas is generated since temperature raises in the soldering paste of welding layer 200, which passes through exhaust clearance 220
Guidance discharge.In more detail, the bulk gas is along exhaust clearance 220, and the opening by being located at 220 tail portion of exhaust clearance
220a discharge is held, that is, the gap row between the first bulk end 211 and the second bulk end 212 for passing through welding layer main body 210
It puts into ambient atmosphere.
It should be noted that welding layer can at least set an exhaust clearance, can also according to the shape of welding layer with
And size sets multiple exhaust clearances.Multiple exhaust clearances can be unified shape and size, be also possible to different
Shape and size or partial exhaust clearance is of similar shape and size, this is all according to actual needs
It is adjusted, the present invention does not limit.
In addition, the shape and quantity itself of each welding layer main body 210 of welding layer 200 are according to the work core welded
The shape and quantity of piece 300 and copper sheet 400 and set, only illustrated below with Fig. 3 and embodiment shown in Fig. 4.
As shown in figure 3, the welding layer main body 210 of welding layer 200 is rectangle, including first side 210a and second side
210b, first side 210a are oppositely arranged with second side 210b, and exhaust clearance 220 is set to first side 210a and second
Side 210b.Specifically, exhaust clearance 220 in first side 210a and second side 210b be respectively set gradually three
A, whole is in herring-bone form.In the present embodiment, exhaust clearance 220 is set to relatively long first side 210a and second side
Side 210b is conducive to be vented in time.Certainly, according to placement-and-routing's needs, exhaust clearance 220 also be can be set in relatively short
Third side 210c and four side 210d or exhaust clearance 220 are set to first side 210a and second side simultaneously
Side 210b, third side 210c and four side 210d.
In the present embodiment, exhaust clearance 220 is in strip rectangle, not only smooth gas discharge, and is easy to make, but the present invention not with
This is limited, and allows gas that the open end passed through is discharged as long as exhaust clearance 220 has.
As shown in figure 4, the welding layer main body 210 ' of welding layer 200 ' is circle, including edge 210a ', wherein between exhaust
Gap 220 ' extends to edge 210a ' in the middle part of welding layer main body 210 '.Specifically, exhaust clearance 220 ' is along welding
Set gradually four of the excircle of layer main body 210 ', and the shape of exhaust clearance 220 ' is fan-shaped.
In the present embodiment, the shape of exhaust clearance 220 ' can also be in the shapes such as rectangle, trapezoidal, quantity can also as needed into
Row adjustment.
Computing board 20 of the invention further includes metal substrate 500 combined with Figure 1 and Figure 2, and copper foil layer 100 includes first
Face S1 and the second face S2, wherein the first face S1 attaches operating die 300 and copper sheet 400, metal substrate 500 are attached at second
Face S2, specifically, metal substrate 500 are connected by thermal insulation layer 600 and 100 hot pressing of copper foil layer pressing.When copper foil layer 100
On each component heat be transmitted on metal substrate 500 by thermal insulation layer 600 after, the metal of metal substrate 500 (such as
Metal substrate uses aluminum substrate) there is good heat spreading function, heat can be distributed rapidly, to quickly give copper foil layer
Each component cooling on 100.
In terms of the overlook direction of the computing board 20 of Fig. 1, computing board 20 includes first direction X and second direction Y.
First direction X is vertical with second direction Y.Wherein, operating die 300 is tactic multiple along first direction X.Separately along first
Direction X, the distance between operated adjacent chip 300 gradually increase.As shown, spacing p1 is less than spacing p2, spacing p2 is less than
Spacing p3, and so on.Correspondingly, the size for the copper sheet 400 being set between operated adjacent chip 300 is gradually increased, that is, set
The size for being placed in the copper sheet of spacing p2 is greater than the size for being set to the copper sheet of spacing p1, and the size for being set to the copper sheet of spacing p3 is big
In the size for the copper sheet for being set to spacing p2, and so on.
In other embodiments, the distance between operated adjacent chip can gradually decrease.Correspondingly, being set to adjacent work
The size for making the copper sheet between chip is gradually reduced.When it is implemented, the arrangement of operating die 300 by computing board 20 is tighter
Close one end is corresponding with the relatively high one end of radiating efficiency in heat dissipation channel, sparse one end that operating die 300 is arranged
It is set to the relatively low one end of radiating efficiency in heat dissipation channel, such as the more close one end that can will arrange is set to air intake vent,
Sparse one end of arranging is set to air outlet, so as to balance the heat dissipation effect of each operating die 300, guarantees each work core
The stability of the work of piece 300, to guarantee integrated circuit the operation is stable.
As shown in Figure 1, operating die 300 may be arranged as the multiple rows of of Y arrangement in a second direction, in the present embodiment, if
Set the two rows that operating die 300 is Y arrangement in a second direction, wherein number of rows, which can according to need, to be adjusted.
Calculating equipment of the invention can be the calculating equipment that mine is dug for ideal money, as shown in figure 5, meter of the invention
Calculating equipment 10 includes power supply unit 11, control unit 12, computing unit 13, heat-sink unit 14 etc., control unit 12 and power supply
Unit 11 is connected, and computing unit 13 is connected with control unit 12 and power supply unit 11.Power supply unit 11 is control unit
12 and computing unit 13 power source is provided, computing unit 13 is for running specific algorithm to calculate data, control
The effect of unit 12 processed be receive computing unit 13 calculating data, and to calculate data be analyzed and processed and export, with
Respective virtual coin can be obtained after distant server communication, heat-sink unit 14 is used to radiate to computing unit 13 to guarantee its normal work
Make.Wherein, computing unit 13 is for example integrated on a computing board 13A, and certainly, computing unit 13 also may include multiple calculating
Plate 13A, referring to figure 1 and figure 5, computing board 13A are above-mentioned computing board 20.
It should be noted that the connection type of the power supply unit of above-mentioned calculating equipment, control unit and computing unit
Only a kind of citing of specific embodiment, however not excluded that have the possibility of other connection types, the present invention is to calculating equipment each unit
Connection type do not limit.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (10)
1. a kind of computing board, including copper foil layer, welding layer, operating die and copper sheet, the operating die and copper sheet
It is attached on the copper foil layer by the welding layer respectively, the copper sheet is set between the adjacent operating die, special
Sign is that the welding layer includes the exhaust clearance for welding layer main body and being set on the welding body layer.
2. computing board according to claim 1, which is characterized in that the exhaust clearance includes open end, Yu Suoshu
Welding layer main body includes the first bulk end and the second bulk end being separated from each other described in open end.
3. computing board according to claim 1, which is characterized in that the exhaust clearance is in strip rectangle or in fan
Shape.
4. computing board according to claim 1, which is characterized in that the welding layer main body includes the first opposite side
Side and second side, the exhaust clearance are set to the first side and/or second side.
5. computing board according to any one of claims 1 to 4, which is characterized in that it further include metal substrate, the copper
Layers of foil includes the first face and the second face, and the attached operating die of first face paste and copper sheet, the metal substrate are attached at
Second face.
6. computing board according to any one of claims 1 to 4, which is characterized in that the operating die is along first
Direction arranges multiple.
7. computing board according to claim 6, which is characterized in that along the first direction, the adjacent work core
The distance between piece incremented/decremented.
8. computing board according to claim 6, which is characterized in that the operating die arranges in a second direction
It is multiple rows of.
9. computing board according to claim 8, which is characterized in that the first direction and the second direction are hung down
Directly.
10. a kind of calculating equipment, including power supply unit, the control unit being connected with the power supply unit and with the control
The computing unit that unit is connected with power supply unit, the computing unit are integrated on one or more computing boards, and feature exists
In the computing board is the described in any item computing boards of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210423121.1A CN114698243A (en) | 2018-09-07 | 2018-11-14 | Calculation circuit board and calculation equipment comprising same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018214686049 | 2018-09-07 | ||
| CN201821468604 | 2018-09-07 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210423121.1A Division CN114698243A (en) | 2018-09-07 | 2018-11-14 | Calculation circuit board and calculation equipment comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109413853A true CN109413853A (en) | 2019-03-01 |
Family
ID=65473470
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811354624.8A Pending CN109413853A (en) | 2018-09-07 | 2018-11-14 | Calculation circuit board and calculation equipment comprising same |
| CN202210423121.1A Pending CN114698243A (en) | 2018-09-07 | 2018-11-14 | Calculation circuit board and calculation equipment comprising same |
| CN201821877005.2U Active CN209572223U (en) | 2018-09-07 | 2018-11-14 | Calculation circuit board and calculation equipment comprising same |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210423121.1A Pending CN114698243A (en) | 2018-09-07 | 2018-11-14 | Calculation circuit board and calculation equipment comprising same |
| CN201821877005.2U Active CN209572223U (en) | 2018-09-07 | 2018-11-14 | Calculation circuit board and calculation equipment comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN109413853A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413853A (en) * | 2018-09-07 | 2019-03-01 | 杭州嘉楠耘智信息科技有限公司 | Calculation circuit board and calculation equipment comprising same |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0812015A1 (en) * | 1996-06-04 | 1997-12-10 | MAGNETI MARELLI S.p.A. | A heat dissipator for integrated circuits |
| US20030141103A1 (en) * | 2002-01-31 | 2003-07-31 | Ng Wee Lee | PCB solder pad geometry including patterns improving solder coverage |
| US20030234447A1 (en) * | 2002-06-24 | 2003-12-25 | Mohammad Yunus | Contact structure for reliable metallic interconnection |
| JP2007317957A (en) * | 2006-05-26 | 2007-12-06 | Sony Corp | Solder ball, semiconductor device, and method of manufacturing solder ball |
| US20090001138A1 (en) * | 2007-06-26 | 2009-01-01 | Advanced Micro Devices, Inc. | Method for preventing void formation in a solder joint |
| US20100206626A1 (en) * | 2009-02-18 | 2010-08-19 | Silitek Electronic (Guangzhou) Co., Ltd. | Printed circuit board unit |
| CN103112241A (en) * | 2011-11-16 | 2013-05-22 | 纬创资通股份有限公司 | Coating device and solder paste printer thereof |
| CN203896646U (en) * | 2013-03-28 | 2014-10-22 | 控制技术有限公司 | Electronic component and printed circuit board of heating element on cooling printed circuit board |
| CN209572223U (en) * | 2018-09-07 | 2019-11-01 | 杭州嘉楠耘智信息科技有限公司 | Calculation circuit board and calculation equipment comprising same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4254447A (en) * | 1979-04-10 | 1981-03-03 | Rca Corporation | Integrated circuit heat dissipator |
| JP3028673B2 (en) * | 1992-03-09 | 2000-04-04 | 住友金属工業株式会社 | Heat sink for multi-chip module and its manufacturing method |
| JP3670102B2 (en) * | 1997-01-04 | 2005-07-13 | 新潟精密株式会社 | Semiconductor device and manufacturing method thereof |
| US20080128897A1 (en) * | 2006-12-05 | 2008-06-05 | Tong Wa Chao | Heat spreader for a multi-chip package |
| JP2008147308A (en) * | 2006-12-07 | 2008-06-26 | Hitachi Metals Ltd | Circuit board and semiconductor module having same |
| DE102008044986A1 (en) * | 2008-08-29 | 2010-03-04 | Advanced Micro Devices, Inc., Sunnyvale | A 3-D integrated circuit device with an internal heat distribution function |
| US8617927B1 (en) * | 2011-11-29 | 2013-12-31 | Hrl Laboratories, Llc | Method of mounting electronic chips |
| CN102709262B (en) * | 2012-06-06 | 2015-09-30 | 华为技术有限公司 | Radiator and the circuit board being provided with this radiator of multi-chip common |
| KR20170087400A (en) * | 2016-12-14 | 2017-07-28 | 김말숙 | Manufacturing methods of metal PCB for heat sinking and the metal PCB thereof |
| CN206743752U (en) * | 2017-05-02 | 2017-12-12 | 江苏群达智能科技有限公司 | A kind of heat radiating type convertible frequency air-conditioner control panel |
| CN207266366U (en) * | 2017-07-25 | 2018-04-20 | 沈雪芳 | Flexible printed circuit board and line source |
-
2018
- 2018-11-14 CN CN201811354624.8A patent/CN109413853A/en active Pending
- 2018-11-14 CN CN202210423121.1A patent/CN114698243A/en active Pending
- 2018-11-14 CN CN201821877005.2U patent/CN209572223U/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0812015A1 (en) * | 1996-06-04 | 1997-12-10 | MAGNETI MARELLI S.p.A. | A heat dissipator for integrated circuits |
| US20030141103A1 (en) * | 2002-01-31 | 2003-07-31 | Ng Wee Lee | PCB solder pad geometry including patterns improving solder coverage |
| US20030234447A1 (en) * | 2002-06-24 | 2003-12-25 | Mohammad Yunus | Contact structure for reliable metallic interconnection |
| JP2007317957A (en) * | 2006-05-26 | 2007-12-06 | Sony Corp | Solder ball, semiconductor device, and method of manufacturing solder ball |
| US20090001138A1 (en) * | 2007-06-26 | 2009-01-01 | Advanced Micro Devices, Inc. | Method for preventing void formation in a solder joint |
| US20100206626A1 (en) * | 2009-02-18 | 2010-08-19 | Silitek Electronic (Guangzhou) Co., Ltd. | Printed circuit board unit |
| CN103112241A (en) * | 2011-11-16 | 2013-05-22 | 纬创资通股份有限公司 | Coating device and solder paste printer thereof |
| CN203896646U (en) * | 2013-03-28 | 2014-10-22 | 控制技术有限公司 | Electronic component and printed circuit board of heating element on cooling printed circuit board |
| CN209572223U (en) * | 2018-09-07 | 2019-11-01 | 杭州嘉楠耘智信息科技有限公司 | Calculation circuit board and calculation equipment comprising same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114698243A (en) | 2022-07-01 |
| CN209572223U (en) | 2019-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7295441B1 (en) | Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe | |
| CN104701291B (en) | For the PCB thermal pad of QFN chip, QFN chip and PCB welding method | |
| CN209572223U (en) | Calculation circuit board and calculation equipment comprising same | |
| CN108520867A (en) | Encapsulating structure and welding method | |
| CN101740528B (en) | Radiating-enhanced outer pin-free semiconductor packaging structure and combination thereof | |
| CN107230665A (en) | Micro-space packaging structure | |
| CN104062806B (en) | Backlight component and liquid crystal display thereof | |
| CN207474451U (en) | A kind of lead frame | |
| US5917704A (en) | Laser-solderable electronic component | |
| CN1964614A (en) | Circuit arrangement, especially frequency converter | |
| CN206294476U (en) | Electronic equipment | |
| CN101600292B (en) | Circuit board | |
| CN205726813U (en) | A kind of electronic equipment | |
| JP6098705B1 (en) | Inverter | |
| CN107498132B (en) | Welder and welding method | |
| US10998253B1 (en) | Fluid diverting heat sink | |
| CN104898813B (en) | Radiator and server | |
| CN207340269U (en) | A kind of wiring board of flexible extension | |
| CN207369500U (en) | A kind of element radiating structure | |
| CN105101647A (en) | Manufacturing method of heat dissipation PCB (printed circuit board) | |
| CN104582247B (en) | VFC plate | |
| CN205789112U (en) | Circuit board and apply the memorizer of this circuit board | |
| CN104966774A (en) | Reverse-buckling type small-dimension large-power LED packaging structure | |
| CN217241242U (en) | Through hole type TEC thermocouple element and PCB | |
| CN217640989U (en) | Paster electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211015 Address after: 200436 room 138, No. 5 and 6, Lane 1188, Wanrong Road, Jing'an District, Shanghai Applicant after: Shanghai Canaan Jiesi Information Technology Co.,Ltd. Address before: 310000 Room 1203, 12/F, Building 4, No. 9, Jiuhuan Road, Jianggan District, Hangzhou City, Zhejiang Province Applicant before: Hangzhou Canaan Creative Information Technology Ltd. Applicant before: Canaan Creative Co.,Ltd. |
|
| TA01 | Transfer of patent application right |