CN217640989U

CN217640989U - Paster electrolytic capacitor

Info

Publication number: CN217640989U
Application number: CN202220617874.1U
Authority: CN
Inventors: 郑锐锋; 郑泳斌; 郑秀娜
Original assignee: Foshan Shunde Smiler Electrical & Electronic Co ltd
Current assignee: Foshan Shunde Smiler Electrical & Electronic Co ltd
Priority date: 2022-03-16
Filing date: 2022-03-16
Publication date: 2022-10-21
Anticipated expiration: 2032-03-16

Abstract

The utility model relates to an electrolytic capacitor technical field discloses a paster electrolytic capacitor, including capacitor body and base, capacitor body is equipped with two electrode pins that are the platykurtic, and the base is seted up and is run through the utmost point hole of crossing of its table side and bottom side, and the bottom side of base is inwards sunken to form the heat dissipation region, and the surface in heat dissipation region is equipped with the heat dissipation layer, and electrode pin penetrates to the bottom side of base and enters into extremely along crossing the utmost point hole heat dissipation region, electrode pin's end extends to the outside of base, and electrode pin's upside surface contacts with the heat dissipation layer, forms the heat dissipation gas tank between electrode pin's the left and right sides and the internal surface in heat dissipation region. The chip electrolytic capacitor has the advantages that the heat dissipation area is formed on the base, the heat dissipation air groove is formed, the pins of the capacitor can form airflow through the contact bonding pads and the heat dissipation area, and the airflow is formed through the heat dissipation air groove to dissipate heat, so that the tin soldering difficulty is reduced, the welding effect and the overcurrent capacity of the capacitor are improved, and the remarkable heat dissipation effect is achieved.

Description

Paster electrolytic capacitor

Technical Field

The utility model belongs to the technical field of electrolytic capacitor technique and specifically relates to a paster electrolytic capacitor.

Background

The capacitor product is used widely in equipment of all walks of life as components and parts at present, and along with the continuous improvement of science and technology, equipment technology is constantly promoted, and especially the extensive use of present power electronic device, the requirement to the condenser is also more and more high. As one type of capacitor, the electrolytic capacitor is generally in a direct-insert type structure, namely, a capacitor main body is provided with two linear pins which can penetrate through hole positions on a circuit board and are welded with the circuit.

In order to overcome the technical defects, the prior art proposes a patch electrolytic capacitor, which generally comprises a capacitor body and a base, wherein a pin of the capacitor body passes through the base and then is closely attached to the bottom surface of the base, extends along the direction of the bottom surface of the base and is exposed from the edge of the base.

The chip electrolytic capacitor can improve the production efficiency, but has the problem of poor heat dissipation, and the technical means for solving the problem in the prior art is to increase the contact area between the pin and the pad, for example, to extend the length of the pin (to bend the pin) and to increase the tin absorption amount of the pin (to open a hole at the bottom of the pin). However, the above technical means cannot sufficiently improve the heat dissipation effect of the chip electrolytic capacitor structure.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a patch electrolytic capacitor to solve one or more of the problems of the prior art and to provide at least one of the advantages of the present invention.

The utility model provides a paster electrolytic capacitor, include:

the capacitor comprises a capacitor body, wherein the capacitor body is provided with two flat electrode pins;

the base is provided with a through pole hole penetrating through the surface side and the bottom side of the base, the bottom side of the base is inwards sunken to form a heat dissipation area, and a heat dissipation layer is arranged on the surface of the heat dissipation area;

the electrode pins penetrate into the bottom side of the base along the electrode passing holes and enter the heat dissipation area, the tail ends of the electrode pins extend to the outside of the base, the upper side surfaces of the electrode pins are in contact with the heat dissipation layer, and heat dissipation air grooves are formed between the left side and the right side of the electrode pins and the inner surface of the heat dissipation area.

As an improvement of the scheme, the electrode pins are positioned in the middle of the heat dissipation area, so that the widths of the two heat dissipation air grooves are consistent.

As a modification of the above, the width of the heat dissipation area is at least twice the width of the electrode leads.

As the improvement of the scheme, the bottom surface of the electrode pin is inwards sunken to form a tin guiding groove and a tin guiding hole, one end of the tin guiding groove extends to the left side or the right side of the electrode pin, and the other end of the tin guiding groove is communicated with the tin guiding hole.

As an improvement of the scheme, the heat dissipation area is in a radial shape and radially expands along the extension direction of the electrode pin.

As the improvement of the scheme, the top wall of the capacitor body is provided with an explosion-proof groove.

As an improvement of the scheme, a heat insulation layer is arranged between the heat dissipation layer and the base, and the base is made of heat-resistant materials.

As an improvement of the scheme, the heat dissipation layer is made of metal copper or copper alloy.

The utility model has the advantages that: form the heat dissipation region and form the heat dissipation gas tank on the base, make the pin accessible contact pad of condenser, heat dissipation region and form the air current through the heat dissipation gas tank and dispel the heat, reduce the soldering tin degree of difficulty and promote the overcurrent capacity of welding effect and condenser, have apparent radiating effect.

Drawings

Fig. 1 is a schematic structural view of a patch electrolytic capacitor according to an embodiment.

Fig. 2 is an exploded view of the patch electrolytic capacitor according to an embodiment.

Fig. 3 is a schematic view of the bottom-side surface structure of the patch electrolytic capacitor according to the embodiment.

Fig. 4 is a partial structural diagram of an electrode pin according to an embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the present invention will be further described with reference to the following embodiments and accompanying drawings.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of terms means an indefinite amount, and a plurality of terms means two or more, and the terms greater than, less than, exceeding, etc. are understood to include no essential numbers, and the terms greater than, less than, within, etc. are understood to include essential numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated. Additionally, appearing throughout and/or representing three side-by-side scenarios, e.g., A and/or B represents a scenario satisfied by A, a scenario satisfied by B, or a scenario satisfied by both A and B.

In the description of the present invention, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, which may include other elements not expressly listed, in addition to those listed.

The electrolytic capacitor is one kind of capacitor, the metal foil is a positive electrode (aluminum or tantalum), an oxide film (aluminum oxide or tantalum pentoxide) close to metal and close to the positive electrode is a dielectric, and the cathode is composed of a conductive material, an electrolyte (the electrolyte can be liquid or solid) and other materials. In the prior art, a bottom plate, namely a chip electrolytic capacitor, is usually arranged at the bottom of an electrolytic capacitor, and an electrode of the electrolytic capacitor penetrates through the bottom plate and then is fixed, so as to be welded with a bonding pad. However, the bottom plate shields the sight of a technician, the technician cannot determine the welding condition of the electrode and the pad by the sight, and the bottom plate shields the pad, so that heat dissipation is not facilitated.

In order to solve the technical problem, the utility model provides a paster electrolytic capacitor.

As shown in fig. 1 to 3, the chip electrolytic capacitor includes a capacitor body 100 and a base 200, the capacitor body 100 being fixed to an upper surface of the base 200, and a lower surface of the base 200 being for contact with a pad.

The capacitor body 100 is provided with two flat electrode pins 110, the base 200 is provided with a through-electrode hole 210 penetrating through the surface side and the bottom side of the base 200, the bottom side of the base 200 is recessed inwards to form a heat dissipation area 220, the surface of the heat dissipation area 220 is provided with a heat dissipation layer 230, the electrode pins 110 penetrate into the bottom side of the base 200 along the through-electrode hole 210 and enter the heat dissipation area 220, the tail ends of the electrode pins 110 extend to the outside of the base 200, the upper side surfaces of the electrode pins 110 are in contact with the heat dissipation layer 230, and heat dissipation air grooves 240 are formed between the left side and the right side of the electrode pins 110 and the inner surface of the heat dissipation area 220.

The patch electrolytic capacitor described in the embodiment has a good heat dissipation effect. After the chip electrolytic capacitor is soldered on the circuit board, heat generated by the electrode pin 110 being energized is discharged through three paths, the first path is to the pad contacting the electrode pin 110, the second path is to the heat dissipation layer 230 contacting the electrode pin 110, the third path is to the electrode pin 110 contacting the air, and the hot air is discharged from the heat dissipation air duct 240.

In addition, the chip electrolytic capacitor described in the present embodiment has a good soldering effect. When a technician performs manual welding, the tail end extending to the outside of the base 200 through the electrode pin 110 heats the tin wire, so that the heated tin liquid is in contact with the electrode pin 110 and the bonding pad, the tin wire is continuously heated in an incremental manner, the generated tin liquid enters from the heat dissipation air groove 240, is in contact with the left side and the right side of the electrode pin 110 and the bonding pad and is shaped, and the welding area of the electrode pin 110 is increased as much as possible; during automatic welding, after the electrode pins 110 are fixed on the corresponding bonding pads, the chip electrolytic capacitor is welded on the circuit board in a reflow soldering mode, and high-temperature heated tin liquid flows in through the heat dissipation air tank 240 to immerse the electrode pins 110 and the bonding pads, so that the electrode pins 110 can be welded with the bonding pads in all directions except the upper surfaces, and the welding area and the overcurrent capacity are increased.

In this embodiment, the electrode pin 110 is located in the middle of the heat dissipation area 220, so that the widths of the two heat dissipation air grooves 240 are the same, and the heat dissipation capability and the welding effect of the left and right sides of the electrode pin 110 are similar.

Further, the width of the heat dissipation area 220 is at least twice the width of the electrode lead 110, so as to provide enough space for the left and right sides of the electrode lead 110.

As shown in fig. 4, in an embodiment, the bottom surface of the electrode lead 110 is recessed inward to form a solder guiding groove 111 and a solder guiding hole 112, one end of the solder guiding groove 111 extends to the left or right side of the electrode lead 110, and the other end of the solder guiding groove 111 is communicated with the solder guiding hole 112. In the welding process, the tin liquid flows into the tin guiding groove 111 or the tin guiding holes 112 are formed through the tin guiding groove 111, and the cooled soldering tin is retained in the tin guiding groove 111 or the tin guiding holes 112 and is in contact with the electrode pin 110 and the inner area of the bonding pad, so that the contact area, the heat dissipation capacity and the overcurrent capacity of the electrode pin 110 and the bonding pad are further increased.

As shown in fig. 3, in the present embodiment, the heat dissipation area 220 is radial, and the heat dissipation area 220 radially expands along the extending direction of the electrode pin 110. After the electrode pins 110 are fixed in the heat dissipation area 220, the heat dissipation air grooves 240 are formed in a radial shape, so that air flow is accelerated, and difficulty of tin liquid entering the heat dissipation air grooves 240 is reduced.

In this embodiment, the top wall of the capacitor body 100 is provided with an explosion-proof groove 120. The explosion-proof groove 120 is used to prevent the internal pressure of the capacitor body 100 from being too high, and to discharge the excessive pressure, thereby avoiding an excessively strong explosion.

As shown in fig. 3 (fig. 3 shows the stacking relationship of the heat dissipation layer 230, the thermal insulation layer 250 and the base 200 by a plane partial area), in this embodiment, the thermal insulation layer 250 is disposed between the heat dissipation layer 230 and the base 200, and the base 200 is made of a heat-resistant material. The thermal insulation layer 250 is used for isolating the heat of the heat dissipation layer 230 from the base 200, so as to prevent the base 200 from being damaged by heat.

In this embodiment, the heat dissipation layer 230 is copper or copper alloy.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A chip electrolytic capacitor, comprising:

the capacitor comprises a capacitor body, wherein two flat electrode pins are arranged on the capacitor body;

2. The patch electrolytic capacitor as claimed in claim 1, wherein the electrode pins are located at the middle of the heat dissipation area so that the width of the two heat dissipation air grooves is uniform.

3. The patch electrolytic capacitor of claim 2 wherein the width of the heat dissipation area is at least twice the width of the electrode leads.

4. The patch electrolytic capacitor as claimed in claim 1, wherein the bottom surface of the electrode pin is recessed inward to form a tin guiding groove and a tin guiding hole, one end of the tin guiding groove extends to the left or right side of the electrode pin, and the other end of the tin guiding groove communicates with the tin guiding hole.

5. The patch electrolytic capacitor as claimed in claim 1, wherein the heat dissipation area is radial, and the heat dissipation area is radially expanded in an extension direction of the electrode pin.

6. The patch electrolytic capacitor of claim 1 wherein the top wall of the capacitor body is provided with an explosion-proof recess.

7. The patch electrolytic capacitor of claim 1 wherein a thermal insulation layer is disposed between the heat dissipation layer and the base, and the base is made of a heat-resistant material.

8. The patch electrolytic capacitor of claim 1 wherein the heat dissipation layer is metallic copper or a copper alloy.