CN109411958B - High speed interconnect assembly - Google Patents
High speed interconnect assembly Download PDFInfo
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- CN109411958B CN109411958B CN201811616297.9A CN201811616297A CN109411958B CN 109411958 B CN109411958 B CN 109411958B CN 201811616297 A CN201811616297 A CN 201811616297A CN 109411958 B CN109411958 B CN 109411958B
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- 230000008054 signal transmission Effects 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims description 13
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- 210000001503 joint Anatomy 0.000 claims description 6
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- 230000005540 biological transmission Effects 0.000 abstract description 8
- 239000012212 insulator Substances 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 description 16
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- 230000013011 mating Effects 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 4
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The utility model provides a high-speed interconnection subassembly, includes circuit board, two through the interconnecting piece module of a plurality of groups cable interconnect, each connecting piece module is realized signal transmission with circuit board corresponding position respectively, each connecting piece module including be equipped with the conductive shell of main part and with the terminal subassembly that main part is fixed mutually, the terminal subassembly includes insulator and fixes a plurality of signal terminal of group in the insulator, each signal terminal of group includes a pair of signal terminal, each signal terminal includes fix terminal fixed part in the insulator, by terminal fixed part extends and corresponds the terminal wiring portion of being connected with the cable and by terminal fixed part extends and corresponds the terminal interfacing part of being connected with the circuit board, each keep apart through conductive shell shielding between two sets of adjacent signal terminals. High-speed signal transmission at different side positions of the circuit board is realized by combining the cables through the two connector modules, the whole structure is stable, the transmission rate is high, and the cost is low.
Description
Technical Field
The present invention relates to a high-speed interconnect assembly.
Background
In the prior art, signal transmission is established between two circuit boards which need to communicate high-speed signals, a socket connector is often required to be fixedly arranged at each circuit board end, switching communication is realized through a cable with two ends fixedly provided with a plug connector, signal transmission is realized between the socket connector and a matched chip on the circuit board through copper foil wiring on the circuit board, and finally signal transmission between the matched chips on the two circuit boards is realized.
A receptacle connector for transmitting high-speed signals, such as QSFP-DD (Quad Small Form-factor Pluggable Double Density) published by the prior art specification, defines a high-speed communication module having eight channels. Each channel has an operation rate of 25Gbit/s or 50Gbit/s, so that the QSFP-DD module supports Ethernet application with a rate of 200Gbit/s or 400 Gbit/s. The QSFP-DD module is provided with a socket connector (such as a socket connector disclosed in patent application No. CN107994402A of 2018, 05 month and 04), and a plug connector matched with the socket connector.
However, such a design of matching the plug connector with the socket connector in the prior art inevitably results in a larger overall volume, and cannot achieve smaller structural matching, and the larger volume simultaneously results in the inability to arrange the socket connector to a position very close to the matching chip, so that signal transmission between the socket connector and the matching chip on the circuit board is realized by using a copper foil wiring with a longer path on the circuit board, which increases transmission loss and is unfavorable for transmission of high-speed signals. If the high-speed stability of the signal transmission of the circuit board part needs to be ensured, the performance and quality requirements of the circuit board and the copper foil wiring need to be improved, so that the cost is directly increased. In addition, more signal transfer (transfer between the socket connector and the circuit board, transfer between the socket connector and the plug connector, transfer between the plug connector and the cable) is also unfavorable for high-speed signal transmission.
In view of the foregoing, there is a need for a new high-speed interconnect assembly that solves the above-described problems.
Disclosure of Invention
The invention aims to provide a high-speed interconnection assembly, wherein the connector module can realize high-speed signal intercommunication between different side positions of a circuit board and has stable overall structure.
In order to achieve the above object, the present invention provides a high-speed interconnection assembly, including two connector modules connected to each other by a plurality of sets of cables, each connector module being capable of achieving signal transmission with respect to a circuit board, each connector module including a conductive housing having a main body portion and a terminal assembly fixed to the main body portion, the terminal assembly including an insulating body and a plurality of sets of signal terminals fixed to the insulating body, each set of signal terminals including a pair of signal terminals, each signal terminal including a terminal fixing portion fixed to the insulating body, a terminal connecting portion extending from the terminal fixing portion and corresponding to the cable, and a terminal abutting portion extending from the terminal fixing portion and adapted to be connected to the corresponding circuit board, each adjacent two sets of signal terminals being shielded and isolated by the conductive housing.
Further, the connector module is provided with at least seven groups of signal terminals per square centimeter of area, and the highest operation rate of each group of signal terminals can reach 56Gbps.
Further, after the connector module is fixed on the corresponding circuit board, the overall height in the up-down direction is not higher than 3.5mm.
Further, each set of cables includes a signal line and a grounding structure, the signal line of each set of cables is connected with the terminal connection part of the corresponding signal terminal of each set, and the grounding structure of each set of cables is electrically connected with the conductive shell.
Further, the terminal connection parts are arranged along the left-right direction, and the terminal connection parts of any two groups of adjacent signal terminals along the arrangement direction are separated by a grounding structure.
Further, the conductive housing is made of a conductive material, or the conductive housing is made of an insulating material and the surface is at least partially plated to form a conductive layer.
Furthermore, the main body part is formed with a plurality of terminal module accommodating cavities in a penetrating manner in the up-down direction, shielding walls are formed around each terminal module accommodating cavity by the conductive shell, the terminal assemblies are correspondingly fixed in the terminal module accommodating cavities, and the shielding walls realize shielding isolation between two groups of signal terminals.
Further, the end of the signal wire is welded and fixed with the terminal connection part of each corresponding group of signal terminals, the connector module further comprises an outer module, and the outer module wraps the upper surface of the main body part, the connection position of the terminal connection part and the signal wire and at least part of the front surface and the rear surface of the main body part.
Further, each group of cables is fixedly connected with the terminal connection part of each corresponding signal terminal, and the terminal butt joint part of each signal terminal is contacted with the corresponding circuit board in an elastic compression joint mode.
Further, the high-speed interconnection assembly further comprises a circuit board in butt joint with the connecting piece module, the lower surface of the conductive shell is fixedly provided with a grounding piece, the grounding piece is provided with a grounding spring sheet in contact with the corresponding circuit board, the grounding spring sheet is provided with a plurality of grounding spring sheets in the left-right direction and the front-back direction, the grounding spring sheets are arranged between two adjacent groups of signal terminals, or the lower surface of the conductive shell is coated with conductive adhesive, the conductive adhesive is lapped with the corresponding circuit board, and conductive adhesive is coated between the two adjacent groups of signal terminals in the left-right direction and the front-back direction.
The beneficial effects of the invention are as follows: high-speed signal transmission at different side positions of the circuit board is realized by combining the cables through the two connector modules, the whole structure is stable, the transmission rate is high, and the cost is low.
Drawings
Fig. 1 is a schematic view of a connector module in a high-speed interconnect assembly of the present invention after assembly to a circuit board.
Fig. 2 is a schematic view of the connector module shown in fig. 1 from another angle.
Fig. 3 is a partially exploded perspective view of the connector module shown in fig. 1, showing a schematic perspective view of the overmold separated from the conductive housing.
Fig. 4 is a schematic view of the connector module of fig. 3 from another angle.
Fig. 5 is a partially exploded perspective view of the connector module shown in fig. 1, showing an isometric view of the overmold with one of the solder joint protection modules separated from the conductive housing.
Fig. 6 is a partially exploded perspective view of the connector module shown in fig. 1, showing an isometric view of the overmold, one of the solder joint protection modules, the upper row of cables, and the heat shrink tubing separated from the conductive housing.
Fig. 7 is a partially exploded perspective view of the connector module shown in fig. 1, showing an isometric view of the overmold, two solder joint protection modules, upper flat cable and heat shrink tubing separated from the conductive housing.
Fig. 8 is a partially exploded perspective view of the connector module shown in fig. 1, showing an isometric view of the overmold, two solder joint protection modules, an upper cable, a lower cable, one of the terminal assemblies and heat shrink tubing separated from the conductive housing.
Fig. 9 is a schematic view of the perspective exploded view of fig. 8 from another angle.
Fig. 10 is a front view of the schematic diagram of fig. 1.
Fig. 11 is a schematic diagram of the structure shown in fig. 10 with the external module and the circuit board removed.
Fig. 12 is a schematic perspective view of a second embodiment of a connector module in a high-speed interconnect assembly of the present invention.
Fig. 13 is a partially exploded perspective view of the connector module of the present invention shown in fig. 12 from another angle, showing a schematic perspective view of the outer mold piece separated from the conductive housing.
Fig. 14 is a further exploded perspective view of the connector module of the present invention shown in fig. 13, showing a perspective view of the outer module and ground member separated from the conductive housing.
Fig. 15 is a partially exploded perspective view of the connector module of the present invention shown in fig. 12, showing a perspective view of the outer module, ground member and first row of terminal assemblies separated from the conductive housing.
Fig. 16 is a schematic perspective view of the connector module of the present invention shown in fig. 15 from another angle.
Fig. 17 is a bottom view of the connector module of the present invention shown in fig. 12.
Fig. 18 is a cross-sectional view taken along line A-A of the connector module of the present invention shown in fig. 17 with the outer module removed.
Fig. 19 is an enlarged view of the structure within the broken line circle of the connector module of the present invention shown in fig. 18.
Fig. 20 is a third embodiment of the connector module of the present invention.
Fig. 21 is a view of the connector module of fig. 20 in use, showing a top view of two of the connector modules assembled side by side and secured to a circuit board.
Fig. 22 is a view showing a front view of the connector module of fig. 20 after three connector modules are assembled and fixed to a circuit board, wherein two connector modules are relatively fixed to upper and lower surfaces of the circuit board.
Fig. 23 is a schematic perspective view of the high-speed interconnect assembly of the present invention, which specifically illustrates the structure of two connector modules to establish signal transmission between two circuit boards via cables.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. For the sake of accuracy, reference is made herein to fig. 1 for all references to directions, wherein the extending direction of the X-axis is the left-right direction (where the positive direction of the X-axis is the right), the extending direction of the Y-axis is the front-back direction (where the positive direction of the Y-axis is the front), and the extending direction of the Z-axis is the up-down direction (where the positive direction of the Z-axis is the up).
Referring to fig. 1 to 11, a connector module 100 in a high-speed interconnection assembly 400 according to a first embodiment of the present invention is shown, wherein the connector module 100 in the first embodiment includes a conductive housing 1, a terminal assembly 2 fixed to the conductive housing 1 by assembling, a cable 3 electrically connected to the terminal assembly 2, a solder joint protection module 4 covering a connection position between the terminal assembly 2 and the cable 3, an outer mold 5 covering the conductive housing 1, and a heat shrinkage sleeve 6 sleeved on the cable 3. The connector module 100 is configured to be mated and secured to a circuit board 200 (see fig. 1).
Referring to fig. 2 and fig. 6 to 11, the conductive housing 1 has a substantially plate shape and includes a plate-shaped main body 11 and ears 12 extending along left and right sides of the main body 11. The main body 11 has a stepped structure on an upper surface thereof in a vertical direction, and has an upper bearing surface 111 and a lower bearing surface 112 that is formed to be a drop with the upper bearing surface 111. The upper bearing surface 111 is the same shape as the lower bearing surface 112. A row of a plurality of terminal module accommodating cavities 110 are respectively formed on the upper bearing surface 111 and the lower bearing surface 112 penetrating the main body 11 in the up-down direction, shielding walls 101 (see fig. 8) are formed around each terminal module accommodating cavity 110 by the conductive housing 1, and cable limiting grooves 113 are respectively recessed in the rear positions of the upper bearing surface 111 and the lower bearing surface 112 in the terminal module accommodating cavities 110 to form stop walls 114 (see fig. 7 and 8). The upper bearing surface 111 and the lower bearing surface 112 are respectively formed with protrusions (not labeled) protruding upward at the right side or the left side of each terminal module accommodating cavity 110 and form a grounding surface 115, and the protrusions are in a strip-shaped convex rib structure.
Referring to fig. 2 and fig. 6 to fig. 11, a plurality of protruding ribs 116 are formed on the lower surface of the main body 11 of the conductive housing 1, the plurality of protruding ribs 116 are in a strip-shaped linear protruding rib structure, and the protruding ribs 116 continuously extend from the front end edge to the rear end edge of the conductive housing 1 along the front-rear direction. Each of the ears 12 has a fixing hole 121 formed therethrough in the vertical direction, and the fixing holes 121 are engaged with a locking bolt (not shown) to fix the conductive housing 1 to the corresponding circuit board 200. Ribs 117 are formed on the front and rear surfaces of the main body 11 so as to protrude outward, and the ribs 117 are formed in a stripe shape and extend in the left-right direction.
In the first embodiment of the present invention, the conductive housing 1 is made of a metal material with conductive properties. In the second embodiment, the conductive housing 1 is made of an insulating material by injection molding, and at least a partial position of the conductive housing 1 made of an insulating material is formed with a conductive layer by electroplating to achieve a function, for example, forming a conductive layer at the positions of the ground plane 115, the protruding strips 116 and the shielding wall 101, and achieving a common ground by making the conductive layer conductive with a designated ground position on the circuit board 200.
Referring to fig. 4 to 11, the terminal assemblies 2 are provided in plurality, each terminal assembly 2 includes an insulating body 21 and a pair of signal terminals 22, and the pair of signal terminals 22 are correspondingly fixed to the insulating body 21 by injection molding. Referring to fig. 8, each of the signal terminals 22 includes a terminal fixing portion 221 fixed in the insulating body 21, a terminal connecting portion 222 extending from one end of the terminal fixing portion 221 and exposed outside the insulating body 21 and the conductive housing 1, and a terminal abutting portion 223 extending from the other end of the terminal fixing portion 221 and exposed outside the insulating body 21 and the conductive housing 1. Each of the signal terminals 22 extends in the same plane, the terminal fixing portion 221 is in a linear shape, the extending direction of the terminal connecting portion 222 is perpendicular to the terminal fixing portion 221, and the terminal abutting portion 223 and the terminal connecting portion 222 are located on the same side of the extending direction of the terminal fixing portion 221 in the plane where the signal terminals 22 extend. In the connector module 100, the terminal connection parts 222 are arranged in a row on the upper bearing surface 111; the terminal connection parts 222 are arranged in a row on the lower bearing surface 112; the terminal butting portions 223 are arranged in two rows on the lower surface of the main body 11.
Referring to fig. 7 to 9, a pair of signal terminals 22 of each terminal assembly 2 are correspondingly used for transmitting a pair of differential signals. In the first embodiment, the terminal assemblies 2 are independent from each other, the terminal assemblies 2 are correspondingly assembled to the terminal module accommodating cavities 110 of the conductive housing 1, and the shielding and blocking effects between signals are achieved between the terminal assemblies 2 through the shielding walls 101 around the terminal module accommodating cavities 110, so as to prevent differential signal interference between the terminal assemblies 2.
In another embodiment (not shown) of the terminal assembly 2, in this embodiment, the terminal assembly 2 is of a one-piece design, the insulating body 21 is provided with only one, two signal terminals 22 are respectively fixed on the insulating body 21, and the terminal module receiving cavities 110 of the conductive housing 1 are partially penetrated with each other along the left-right direction and the up-down direction at the lower surface position to match the structure of the insulating body 21, in other words, the shielding walls 101 around the terminal module receiving cavities 110 are partially communicated. The terminal assembly 2 is designed in one piece of the insulative housing 21 compared to the first embodiment, so that the process is simpler, but the shielding wall 101 is partially connected, so that the shielding effect between the pairs of signal terminals 22 is slightly inferior to that of the first embodiment.
Referring to fig. 3 to 9, the cables 3 are provided with a plurality of groups, and the plurality of groups of cables 3 are divided into an upper flat cable 31 connected to the terminal assembly 2 fixed on the upper carrying surface 111 of the conductive housing 1 and a lower flat cable 32 connected to the terminal assembly 2 fixed on the lower carrying surface 112 of the conductive housing 1. Each set of cables 3 includes two signal wires 301 and a ground structure 302. During assembly, each group of cables 3 is correspondingly placed in the corresponding cable limiting groove 113, forward assembly and stop of the cables 3 are realized through the stop wall 114, two signal wires 301 of each group of cables 3 correspondingly contact one pair of signal terminals 22 of the terminal assembly 2, and a grounding structure 302 of each cable 3 correspondingly contacts a grounding surface 115 on the conductive shell 1. In the present invention, each of the terminal connection parts 222 at least partially protrudes out of the insulating body 21 and forms a contact surface (not shown), and the contact surface of each of the terminal connection parts 222 is flush with the ground plane 115. In the embodiment of the present invention, the grounding structure 302 is a metal strip structure, however, in other embodiments, the grounding structure 302 may be replaced by other structures, such as a copper foil or a metal mesh braid structure.
Referring to fig. 3 to 9, the solder joint protection module 4 is formed by injection molding of an insulating material, and two solder joint protection modules 4 are provided, which are respectively formed on the upper bearing surface 111 and the lower bearing surface 112 of the conductive housing 1, and are used for covering the contact portion between the protection terminal connection portion 222 and the corresponding signal line 301. In the present invention, after the cable 3 is fixed to the signal terminal 22 and the ground plane 115, and before the solder joint protection module 4 is formed, the portion where the terminal connection portion 222 contacts the corresponding signal line 301 is covered with an insulating protection layer (not numbered, for example, the insulating protection layer may be formed by gluing) to pre-protect the portion where the terminal connection portion 222 contacts the signal line 301 before and during the injection molding of the solder joint protection module 4. After the formation of the solder joint protection module 4, the solder joint protection module 4 is actually covered outside the insulating protection layer.
Referring to fig. 3, 6, 8 and 11, the grounding structure 302 of each set of cables 3 is located at a middle position corresponding to two signal wires 301, and after the cables 3 are assembled to the conductive housing 1, the grounding structure 302 is bent to pass over the insulating layer of the adjacent signal wires 301 and contact with the grounding surface 115 of the conductive housing 1. When the solder joint protection module 4 is formed, only the part of the grounding structure 302 of the cable 3 above the insulating layer of the signal line 301 protrudes out of the solder joint protection module 4, and the structural feature design ensures that the solder joint protection module 4 has better protection effect and also has thinner structural design. To ensure that the overall thickness of the connector module 100 is relatively thin.
Referring to fig. 1 to 9, the outer mold 5 is formed by injection molding of an insulating material, the outer mold 5 covers the upper surface, the front and rear surfaces, the left and right surfaces and the solder joint protection mold 4 of the conductive housing 1, and ribs 117 on the conductive housing 1 are embedded in the outer mold 5 to increase the adhesion between the outer mold 5 and the conductive housing 1.
Referring to fig. 8 to 11, the terminal abutting portion 223 of the signal terminal 22 is a cantilever structure formed by extending one end of the terminal fixing portion 221 obliquely, and each terminal abutting portion 223 protrudes into the elastic space formed between the two protruding strips 116 correspondingly. The ribs 116 provide isolation and shielding between the differential pairs of each terminal assembly 2. The terminal abutting portion 223 is contacted with the circuit board 200 by elastic pressure bonding.
Referring to fig. 5, 5 and 6, the heat-shrinkable sleeve 6 is correspondingly sleeved on the cable 3 adjacent to the outer module 5, so that the heat-shrinkable sleeve 6 is heated to shrink and bind the cable 3 for protection.
Referring to fig. 2 to 9, the following describes in detail the method for manufacturing the connector module 100 according to the present invention, the method comprises the following steps:
A. the conductive shell 1 is manufactured by means of powder metallurgy, injection molding and the like;
B. Forming a plurality of signal terminals 22 by punching, fixing the plurality of signal terminals 22 to the conductive housing 1 by the insulating body 21 formed by injection molding;
C. preparing a plurality of groups of cables 3, wherein each group of cables 3 comprises a signal wire 301 and a grounding structure 302, the signal wires 301 of each group of cables 3 are welded and fixed with the terminal wiring parts 222 of the signal terminals 22 on the lower bearing surface 112 on the corresponding conductive shell 1 to realize electrical connection, and the grounding structure 302 is welded and fixed with the grounding surface 115 on the lower bearing surface 111 on the corresponding conductive shell 1 to realize electrical connection.
D. In the step C, an insulating protection layer is formed on the surface of the conductive housing 1 at the position where the terminal connection portion 222 is electrically contacted with the signal line 301;
E. forming a welding spot protection module 4 on the surface of the conductive shell 1 at the position where the insulating protection layer is positioned in the step D through injection molding;
F. preparing a plurality of groups of cables 3, wherein each group of cables 3 comprises a signal wire 301 and a grounding structure 302, the signal wires 301 of each group of cables 3 are welded and fixed with the terminal wiring parts 222 of the signal terminals 22 on the upper bearing surface 111 on the corresponding conductive shell 1 to realize electrical connection, and the grounding structure 302 is welded and fixed with the grounding surface 115 on the upper bearing surface 111 on the corresponding conductive shell 1 to realize electrical connection.
G. In step F, an insulating protection layer is formed on the surface of the conductive housing 1 at the position where the terminal connection portion 222 is electrically contacted with the signal line 301;
H. forming a welding spot protection module 4 on the surface of the conductive shell 1 at the position where the insulating protection layer is positioned in the step G through injection molding;
I. an outer mold 5 is formed on the outer circumference of the solder joint protection mold 4 and the conductive housing 1 by injection molding;
J. and sleeving a heat-shrinkable sleeve 6 at a position of the cable 3 close to the outer module 5, and heating the heat-shrinkable sleeve 6 to shrink and bind the cable 3 by the heat-shrinkable sleeve 6.
Referring to fig. 12-19, a second embodiment of a connector module 100 in a high-speed interconnect assembly according to the present invention is shown. The connector module 100' in the second embodiment has the following differences from the connector module 100 in the first embodiment:
specifically, compared to the first embodiment, the connector module 100' in the second embodiment adds the grounding member 7' at the bottom of the conductive housing 1 '. The electrically conductive housing 1', terminal assembly 2' construction differs from the first embodiment as well, as described in more detail below.
Referring to fig. 12 to 16, in the second embodiment, two terminal assemblies 2 'are provided, and each terminal assembly 2' includes an insulating member 201 'and a plurality of pairs of signal terminals 22'. Each insulating member 201 'includes a plurality of insulating bodies 21' and a connecting body 211 'integrally connecting the plurality of insulating bodies 21', specifically, the connecting body 211 'is formed by horizontally extending from a position below the front end surface of each insulating body 21', that is, the connecting body 211 'is located at an end position of the terminal abutting portion 223'. The structure of each signal terminal 22 'is identical to that of the first embodiment, and the structure of the insulating body 21' is identical to that of the first embodiment. A pair of signal terminals 22 'are provided in each of the insulating bodies 21' as in the first embodiment.
Referring to fig. 12 to 16, in the second embodiment, the conductive housing 1 'is also substantially plate-shaped, and includes a plate-shaped main body 11' and ears 12 'extending along the left and right sides of the main body 11'. The upper surface structure of the main body 11' is the same as that of the first embodiment, and will not be described herein. The main body 11' penetrates the main body 11' in the up-down direction to form a plurality of terminal module accommodating cavities 110' corresponding to the accommodating insulating bodies 21', and the plurality of terminal module accommodating cavities 110' are arranged in two rows in the front-back direction, including a front accommodating cavity 1101' at the front end and a rear accommodating cavity 1102' at the rear end. The lower surface of the conductive housing 1 'is formed with two connecting grooves 1103' corresponding to the receiving connecting bodies 211 'at the end positions of the terminal abutting portions 223', and the connecting grooves 1103 'do not penetrate the main body 11' in the up-down direction. One of the connecting grooves 1103' connects the plurality of terminal module accommodating cavities 110' into a whole and forms the front row accommodating cavity 1101'; the other connecting groove 1103' connects the plurality of terminal module receiving cavities 110' together and forms the rear receiving cavity 1102'. The conductive housing 1 also forms a shielding wall 101 '(see fig. 15) around each terminal module housing cavity 110'.
The structure of the insulating member 201 'in the second embodiment is simpler than the assembly process of the first embodiment in cooperation with the structure of the conductive housing 1'. The positions of the connection body 211' and the connection groove 1103' are designed to be far away from the positions of the terminal fixing parts, so that the influence on the high-frequency signals of the pairs of signal terminals 22' can be reduced. In addition, in the present embodiment, the thickness of the connection body 211' in the up-down direction is smaller than the thickness of the insulation body 21', so that the influence on the high-frequency signals between the pairs of signal terminals 22' can be reduced.
Referring to fig. 12 to 15, in the second embodiment, the lower surface of the main body 11 'of the conductive housing 1' is concavely formed with a ground receiving groove 13 'and a ground mounting surface 131'. The terminal module receiving cavity 110' and the connecting groove 1103' are further recessed inward from the ground member mounting surface 131'. A middle shielding convex rib 132 'is formed between the front-row accommodating cavity 1101' and the rear-row accommodating cavity 1102', and the middle shielding convex rib 132' extends along the whole length of the front-row accommodating cavity 1101 'and the rear-row accommodating cavity 1102' in the left-right direction, so that a better barrier shielding effect between the front-row accommodating cavity 1101 'and the rear-row accommodating cavity 1102' is realized. The rear end of the rear receiving chamber 1102 'is formed with a rear shielding rib 133', and the rear shielding rib 133 'extends along the entire length of the rear receiving chamber 1102' in the left-right direction.
Referring to fig. 12 to 15, in the second embodiment, a rear terminal shielding rib 134' is formed between two adjacent terminal module receiving cavities 110' in the rear row of receiving cavities 1102', the front end of each rear terminal shielding rib 134' is connected to the middle shielding rib 132', and the rear end of each rear terminal shielding rib 134' is spaced apart from the rear shielding rib 133 '. Front terminal shielding ribs 135 'are formed between two adjacent terminal module receiving cavities 110' in the front receiving cavity 1101', the rear ends of the front terminal shielding ribs 135' are spaced apart from the middle shielding ribs 133', a yielding gap 136' is formed between two adjacent front terminal shielding ribs 135 'at a position of the front receiving cavity 1101' far away from the rear receiving cavity 1102 'in the front-rear direction, and the yielding gap 136' is used for realizing yielding of a specific structure on the circuit board 200. The lower surfaces (not labeled) of the above-described middle shield ribs 132', rear shield ribs 133', rear terminal shield ribs 134', and front terminal shield ribs 135' are flush with the mounting surface 131 '.
Referring to fig. 15 and 19, the bottom surface of the conductive housing 1 'is recessed inward at the free end positions of the terminal abutting portions 223' of the signal terminals 22 'of each pair to form a clearance groove 16', and the clearance groove 16 'is used to make the distance between the free end edges of the terminal abutting portions 223' and the conductive housing 1 '(refer to fig. 15 and 19), so as to prevent the risk of overlap between the free end edges of the terminal abutting portions 223' and the conductive housing 1', and ensure the high-frequency characteristics between the signal terminals 22' of each pair.
Referring to fig. 12 to 15, in the second embodiment, ribs 117 'and snap-fit protrusions 118' are formed on the front and rear surfaces of the main body 11 'in an outwardly protruding manner, and the ribs 117' are in a strip shape or a block shape and extend or are arranged in a left-right direction. The fastening projection 118 'is spaced from the rib 117', and the fastening projection 118 'is configured to fasten to the grounding member 7'.
Referring to fig. 12 to 17, in the second embodiment, the grounding member 7 'is formed by punching and bending a metal plate, and includes a main body plate and a limiting plate 72' formed by bending and extending the front and rear end edges of the main body plate. The limiting plates 72 'are formed with two through-hole fastening structures 721', and the grounding member 7 'is assembled and fixed to the lower surface of the conductive housing 1', specifically, the main body plate is correspondingly received in the grounding member receiving groove 13 'and is attached to the grounding member mounting surface 131', the lower surface of the middle shielding rib 132', the lower surface of the rear shielding rib 133', the lower surface of the rear terminal shielding rib 134', and the lower surface of the front terminal shielding rib 135'. The limiting plates 72 'are correspondingly attached to the front and rear surfaces of the conductive housing 1', and the buckling structures 721 'are correspondingly and bayonet-fixed with the buckling lugs 118'. The main body plate is matched with
Referring to fig. 12 to 17, in the second embodiment, the main body plate includes two side plates 711 'located at left and right sides of the front-row housing chamber 1101' and the rear-row housing chamber 1102', a middle plate 712' located between the front-row housing chamber 1101 'and the rear-row housing chamber 1102', and a rear plate 713 'located behind the rear-row housing chamber 1102'. The two ends of the middle plate 712 'are correspondingly connected with the middle positions of the two side plates 711', and the two ends of the rear plate 713 'are correspondingly connected with the rear positions of the two side plates 711'. Two ends of one of the limiting plates 72 'are correspondingly connected with front end positions of the two side plates 711', and the other limiting plate 72 'is connected with a rear side edge of the rear plate 713' into a whole.
Referring to fig. 14 to 16, in the second embodiment, a plurality of grounding spring plates are formed on each of the side plates 711', the middle plate 712', the rear plate 713 'and the limiting plate 72' at the front end, and each of the grounding spring plates is in a cantilever shape extending obliquely downward. Specifically, each side plate 711' is provided with two vertical grounding spring pieces 731' extending in the front-rear direction and respectively located at one side of each terminal assembly 2 '; seven vertical grounding spring pieces 731' and eight horizontal grounding spring pieces 732' are arranged on the middle plate 712', each vertical grounding spring piece 731' is respectively located between two adjacent pairs of signal terminals, and each horizontal grounding spring piece 732' is located at the front end of a corresponding pair of signal terminals; eight horizontal grounding spring pieces 732' are arranged on the rear plate 713', and each horizontal grounding spring piece 732' is positioned at the rear end of a corresponding pair of signal terminals; seven vertical grounding spring pieces 731' are arranged on the limiting plate 72' at the front end, and each vertical grounding spring piece 731' is respectively located between two adjacent pairs of signal terminals. The grounding spring plate can be elastically pressed against the circuit board 200 correspondingly, and is used for realizing shielding and blocking effects between each pair of signal terminals, preventing differential signal interference between each pair of signal terminals, and simultaneously having better grounding effect. The grounding piece 7 'is not provided with any grounding spring piece at the position of the yielding notch 136' of the conductive shell 1', and a matching notch 722' is formed in the grounding piece 7 'in a matching manner at the position of the yielding notch 136'.
Referring to fig. 14 to 16, in the second embodiment, a relief groove 15 'is formed on the lower surface of the main body 11' of the conductive housing 1 'corresponding to the free end positions of each vertical grounding spring piece 731' and the horizontal grounding spring piece 732 'in an inward recessed manner, and the relief groove 15' is used for providing a displacement space for elastic deformation of the corresponding grounding spring piece.
Referring to fig. 17 to 19, in the second embodiment, after the connector module 100 'is mounted and fixed to the circuit board 200, the lower surface of the conductive housing 1' is correspondingly attached to the circuit board 200 (specifically, at least includes the lower surface of the ear 12 'and at least the lower surface of the grounding member 7'). A gap 1001' is formed between the lower surface of the insulating body 21' and the circuit board, and the gap 1001' is used for accommodating the corresponding terminal abutting portion 223', and simultaneously the terminal abutting portion 223' is elastically deformed. The terminal abutting portions 223' and the grounding spring plate are all contacted with the golden finger on the circuit board 200. The terminal abutting portion 223' of each signal terminal 22' in the front row of terminal assemblies 2' is designed to form an included angle β (refer to fig. 19) with the surface of the circuit board, and the optimal angle range of the included angle β is designed to be not less than 3 degrees and not more than 20 degrees, and the included angle β is preferably 6.5 degrees. The angle design of the included angle beta can enable the terminal butt joint part 223' corresponding to the signal terminal 22' to form a specific interval between one end position close to the terminal fixing part and the surface of the circuit board, so as to realize the yielding of the local position of the front row of signal terminals 22' to the wiring of the circuit board. In addition, the yielding notch 136' and the mating notch 722' of the front end of the conductive housing 1' are also used to yield the specific structure and the trace on the circuit board 200.
Referring to fig. 19, in the present embodiment, each terminal abutting portion 223' of the front row of signal terminals 22' defines an abutting portion 2232' at the front end of the free end and a yielding portion 2231' at the rear end for connecting the abutting portion 2232' and the vertical terminal fixing portion. The length of the abdication section 2231' in the horizontal and transverse direction is not less than 0.5mm, and the distance between the abdication section 2231' and the surface of the circuit board is not less than 0.1mm, so that the abdication of the abdication section 2231' and the terminal fixing part to specific structures and wires on the circuit board at the lower position is realized. In this embodiment, each terminal abutting portion 223 'of the front row of signal terminals 22' is inclined. Of course, in other embodiments, the step-down segment 2231' may be designed to be disposed parallel to the circuit board, for example, the step-down segment 2231' is bent into a horizontal shape by the terminal fixing portion, and the butt-joint segment 2232' is formed by extending the step-down segment 2231' obliquely downward, which of course still needs to satisfy the length of the step-down segment 2231' and the spacing condition between the step-down segment and the circuit board.
Referring to fig. 19, in this embodiment, the space between the lower surface of the insulating member 201' at the front end and the circuit board is larger than the space between the lower surface of the insulating member 201' at the rear end and the circuit board, so as to match the shape of the front-row terminal abutting portion 223' and achieve the yielding of the specific structure and routing on the circuit board 200.
Referring to fig. 20, a third embodiment of a connector module 100 in a high-speed interconnect assembly 400 according to the present invention is shown. The connector module 100″ in the third embodiment has the following differences from the connector module 100' in the second embodiment:
specifically, the grounding member 7 "and the ear 12" of the connector module 100 "in the third embodiment are different from those of the second embodiment, which is described in detail below.
In the third embodiment, the grounding member 7 "is formed by conductive adhesive correspondingly applied to the lower surface of the conductive housing 1", and the application position of the conductive adhesive includes at least all positions where the grounding spring is disposed as described in the second embodiment. The process of forming the grounding member 7 "by applying the conductive adhesive can be simplified, and the applying path of the conductive adhesive is more effective than the process of forming the grounding member 7" by a metal plate, in this embodiment, the lengths of the conductive adhesive on both sides of at least one pair of the terminal abutting portions 223 "are not less than the lengths of the corresponding pair of the terminal abutting portions 223", the lengths of the conductive adhesive on one end of at least one pair of the terminal abutting portions 223 "are greater than the spacing between the corresponding pair of the terminal abutting portions 223", and the applying paths of the conductive adhesive are continuous as a whole.
Referring now to fig. 1-20, three different embodiments of the ear 12 of the connector module 100 of the present invention are shown, wherein fig. 1-10 show a first embodiment of the ear 12, wherein fig. 12-19 show a second embodiment of the ear 12, wherein fig. 20 shows a third embodiment of the ear 12, and specific features, differences and functions of the second and third embodiments of the ear are described in detail below:
referring to fig. 12 to 19, in a second embodiment of the ear 12, in the second embodiment, a dislocation structure 14 'with a certain level difference in the left-right direction is formed on the outer side surface of each ear 12', and a protruding portion 122 'with a larger width and a retracting portion 123' with a smaller width in the left-right direction are formed, and the protruding portion 122 'and the retracting portion 123' are transited by smooth cambered surfaces. The protruding portion 122 'is formed with a through hole 1221' therethrough in the up-down direction, and the indented portion 123 'is formed with a positioning post 1231' protruding downward on the lower surface thereof. In this embodiment, the through hole 1221 'and the positioning post 1231' are respectively located at the left side or the right side of the terminal butt-joint portion 223 'corresponding to the row of signal terminals 22'. The connector module 100 'is snap-fastened to the circuit board by at least one snap nut 300 engaging the through hole 1221'. In this embodiment, the diameter of the through hole 1221 'is larger than the outer diameter of the positioning post 1231', and the design of the outer side surface dislocation structure 14 'of the engaging lug 12' ensures that when the connector module 100 'can be firmly locked on the circuit board by the locking nut 300, it can be ensured that when two or more connector modules 100' are fixed on the same circuit board side by side along the left-right direction, the plurality of connector modules 100 'occupy a smaller circuit board area, and at the same time, the space between two adjacent connector modules 100' can be increased as much as possible.
Referring to fig. 20, in a third embodiment of the ear portion 12, in the third embodiment, a dislocation structure 14 "with a certain level difference in the left-right direction is formed on the outer side surface of each ear portion 12", and a protruding portion 122 "with a larger width in the left-right direction and a recessed portion 123" with a smaller width are formed. The protruding portion 122 "has a through hole 1221" formed therethrough in the up-down direction, the retracting portion 123 "has a threaded hole 1232" formed therethrough in the up-down direction, and the lower surface of the ear portion 12 "has a positioning post 1231" formed by protruding downward from a position intermediate the threaded hole 1232 "and the through hole 1221". In this embodiment, the through hole 1221 "and the threaded hole 1232" are respectively located at the left side or the right side of the terminal abutting portion 223 "corresponding to the signal terminals 22" of one row. The connector module 100 "is snap-fastened to the circuit board by at least one snap nut 300 engaging through-holes 1221" and/or threaded holes 1232 ". In this embodiment, the diameter of the threaded hole 1232 "is smaller than that of the through hole 1221", which is designed to fit the dislocation structure 14 "on the one hand and the shape of the lock nut 300 on the other hand. When two or more connector modules 100 "are fixed to the same circuit board side by side in the left-right direction, the dislocation structure 14", the through hole 1221 "and the threaded hole 1232" may be designed such that the two or more connector modules 100 "occupy a smaller circuit board area while the space between two adjacent connector modules 100" may be increased as much as possible. In addition, the threaded holes 1232 "are designed to mate with the through holes 1221" to enable stacking and fixing of two connector modules 100 "on two sides of the same circuit board (see fig. 22 specifically), and the positioning posts 1231" are configured to mate with positioning hole structures (not shown) on the circuit board 200 for assembly and positioning. In this embodiment, the axis connecting line of the two through holes 1221 "and the axis connecting line of the two threaded holes 1232" are respectively located at two ends of two diagonal lines of the same rectangle.
Referring to fig. 13 to 15, in the second embodiment, eighteen vertical grounding spring pieces 731' are provided on the grounding member 7', sixteen horizontal grounding spring pieces 732' are provided, and the lengths and widths of the grounding spring pieces are slightly different according to the placement positions of the grounding spring pieces, so as to achieve shielding and blocking effects between the signal terminals of each pair and prevent differential signal interference between the signal terminals of each pair. In this embodiment, the connector module 100 'is generally locked to the circuit board by two lock nuts 300 in cooperation with the through holes 1221' (of course, four lock nuts 300 may be provided for locking, as in the third embodiment, and fig. 20 to 22 may be combined). In this embodiment, after the connector module 100 'is assembled and locked to the circuit board 200, in order to ensure that the terminal butting portion 223' of each signal terminal 22 'contacts the circuit board 200 stably, it is necessary to have a minimum contact pressure of not less than 40 g generated by each terminal butting portion 223' to the circuit board 200 through multiple experimental tests. Meanwhile, taking the locking force bearing capacity of the ear portion 12 'of the conductive housing 1', the locking force bearing capacity of the circuit board 200 and the locking stability between the connector module 100 'and the circuit board 200 into consideration, through multiple experimental tests, the contact pressure generated by each terminal abutting portion 223' on the circuit board 200 is required to be not more than 80 grams at most, and the contact pressure generated by each grounding spring piece of the grounding piece 7 'on the circuit board 200 is required to be not more than one half of the contact pressure generated by any terminal abutting portion 223' on the circuit board 200. In addition, in order to ensure the latching stability of the connector module 100 'and the circuit board 200, the latching force between the connector module 100' and the circuit board 200 needs to be designed to be at least 6 kg. In addition, in consideration of the latching force bearing capability of the ear portion 12' of the conductive housing 1', the latching force bearing capability of the circuit board 200, and the like, the latching force between the connector module 100' and the circuit board 200 needs to be designed to be at most 12 kg. In this embodiment, the lock nut 300 is made of SUS 304 (stainless steel). Of course, the elastic force of the terminal abutting portion 223', the elastic force of the grounding spring of the grounding member 7', the locking force of the locking nut 300, and the like are all related to the material, the length, the thickness, the shape design, and the like. And will not be described in detail herein.
In three embodiments of the present invention, the conductive housing 1 is made of a metal material with conductive properties. In other embodiments, the conductive housing 1 is made of an insulating material by injection molding, and at least a partial position of the conductive housing 1 made of the insulating material is formed with a conductive layer by electroplating to perform a function, for example, forming the conductive layer at specific positions of the ground plane 115, the protruding strip 116, the shielding wall 101, the ground member receiving slot 13', and the like, and performing a common ground by making the conductive layer conductive with a designated ground position on the circuit board 200.
In summary, the signal terminals 22 of the connector module 100 of the present invention can well realize shielding isolation; meanwhile, the structural design of the insulating protection layer, the welding point protection module 4 and the outer module 5 ensures that the whole structure of the connector module 100 is stable; in addition, the signal terminal 22 of the connector module 100 is fixed with the cable 3 by welding, and the signal terminal 22 is connected with the circuit board 200 by elastic compression joint, so that the connector module 100 is integrally modularized, and is easy to repair and replace after damage; furthermore, the grounding structure 302 of the cable 3 of the connector module 100 achieves a common ground effect by contacting the conductive housing 1; in addition, the manufacturing method of the connecting piece module 100 designed by the invention is simple, is suitable for mass industrialized production, has controllable yield and long service life of finished products.
Referring to fig. 23, a high-speed interconnection assembly 400 according to the present invention is shown, wherein the high-speed interconnection assembly 400 includes two circuit boards 200, the connector modules 100 respectively fixed on the circuit boards 200, and a cable 3 connecting the two connector modules 100. Signal transmission between the two circuit boards 200 is achieved by the two connector modules 100.
Of course, in other embodiments, the signal transmission can be implemented by the two connector modules 100 and the cable 3 at different side positions of the same circuit board 200.
Of course, the circuit board 200 may be any currently known printed circuit board, or a printed circuit board mounted with some sort of mating chip (not shown), or any other surface-mounted physical layer device known in the art.
The high-speed interconnect assembly 400 of the present invention achieves high-speed signal transmission from one side circuit board to the other side circuit board via the cable 3 (jumper). Compared with a traditional socket connector (not shown), the connector module 100 in the design can be miniaturized, the height size can be controlled within 3.5mm, the connector module 100 can be arranged below a radiator of a matching chip, so that the connector module 100 can be closer to the matching chip (a target element to be connected), the signal transmission distance between the connector module 100 and the matching chip is reduced, the transmission loss can be reduced, the requirement on the circuit board material can be reduced while the high-speed signal transmission requirement is ensured, for example, a common low-cost material (such as FR-4) circuit board can be used for replacing a high-end and high-cost (such as M7) circuit board, and the cost is greatly saved. In addition, the wiring space of the circuit board 200 can be greatly saved, and the space utilization rate of the circuit board can be improved. In addition, the transmission density of the connector module 100 is extremely high, 7 differential pairs (i.e. 7 pairs of signal terminals 22) can be designed per square centimeter area, the highest operation rate of each differential pair can reach 56Gbps at present, and the transmission rate can be improved greatly. Of course, the overall transmission rate of the high-speed interconnect assembly 400 in the present design also requires matching the performance of the cable 3, the circuit board 200, and the mating chips on the circuit board. In addition, the connector module 100 has a unit cell structure, that is, the number of differential pairs can be laterally expanded, so that technical difficulties and performance effects caused by the expansion of the number of terminals of the conventional socket connector and the mating plug connector are solved.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present invention.
Claims (10)
1. A high speed interconnect assembly, characterized by: the connector module is used for correspondingly realizing signal transmission with a circuit board, the connector module comprises a conductive shell provided with a main body part and a terminal assembly fixed with the main body part, the terminal assembly comprises an insulating body and a plurality of groups of signal terminals fixed in the insulating body, each group of signal terminals comprises a pair of signal terminals, each signal terminal comprises a terminal fixing part fixed in the insulating body, a terminal wiring part which extends from the terminal fixing part and corresponds to the cable and a terminal butt joint part which extends from the terminal fixing part and is used for being connected with the corresponding circuit board, and two adjacent groups of signal terminals are shielded and isolated by the conductive shell.
2. The high-speed interconnect assembly of claim 1, wherein: the unit square centimeter area of the connector module is provided with at least seven groups of signal terminals, and the highest running speed of each group of signal terminals can reach 56Gbps.
3. The high-speed interconnect assembly of claim 1, wherein: after the connecting piece module is fixed on the corresponding circuit board, the overall height of the connecting piece module in the up-down direction is not higher than 3.5mm.
4. The high-speed interconnect assembly of claim 1, wherein: the cable comprises a signal wire and a grounding structure, wherein the signal wire of the cable is connected with the terminal wiring parts of the corresponding groups of signal terminals, and the grounding structure of the cable is electrically connected with the conductive shell.
5. The high-speed interconnect assembly of claim 1, wherein: the terminal wiring parts are arranged in the left-right direction, and the terminal wiring parts of any two groups of adjacent signal terminals in the arrangement direction are separated by a grounding structure.
6. The high-speed interconnect assembly of claim 1, wherein: the conductive housing is made of a conductive material or the conductive housing is made of an insulating material and the surface is at least partially electroplated to form a conductive layer.
7. The high-speed interconnect assembly of claim 1, wherein: the main body part is formed with a plurality of terminal module accommodating cavities in a penetrating manner in the up-down direction, shielding walls are formed around each terminal module accommodating cavity by the conductive shell, the terminal assemblies are correspondingly fixed in the terminal module accommodating cavities, and the shielding walls realize shielding isolation between two groups of signal terminals.
8. The high-speed interconnect assembly of claim 4, wherein: the end part of the signal wire is welded and fixed with the terminal wiring part of each corresponding group of signal terminals, the connecting piece module further comprises an outer module, and the outer module wraps the upper surface of the main body part, the connection position of the terminal wiring part and the signal wire and at least part of the front surface and the rear surface of the main body part.
9. The high-speed interconnect assembly of claim 1, wherein: the cable is fixedly connected with the terminal wiring part of each corresponding signal terminal, and the terminal butt joint part of each signal terminal is contacted with the corresponding circuit board in an elastic compression joint mode.
10. The high-speed interconnect assembly of claim 1, wherein: the high-speed interconnection assembly further comprises a circuit board in butt joint with the connecting piece module, the lower surface of the conductive shell is fixedly provided with a grounding piece, the grounding piece is provided with a plurality of grounding spring pieces in contact with the corresponding circuit board, the grounding spring pieces are arranged in the left-right direction and the front-back direction, the grounding spring pieces are arranged between two adjacent groups of signal terminals, or the lower surface of the conductive shell is coated with conductive adhesive, the conductive adhesive is overlapped with the corresponding circuit board, and conductive adhesive is coated between the two adjacent groups of signal terminals in the left-right direction and the front-back direction.
Applications Claiming Priority (4)
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| CN201810570837 | 2018-06-05 | ||
| CN2018105708378 | 2018-06-05 | ||
| CN201810989798.5A CN109038115A (en) | 2018-08-28 | 2018-08-28 | Connector mould group |
| CN2018109897985 | 2018-08-28 |
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| CN109411958A CN109411958A (en) | 2019-03-01 |
| CN109411958B true CN109411958B (en) | 2023-11-14 |
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| CN201811616297.9A Active CN109411958B (en) | 2018-06-05 | 2018-12-27 | High speed interconnect assembly |
| CN201822222649.4U Withdrawn - After Issue CN209169533U (en) | 2018-06-05 | 2018-12-27 | High speed interconnecting assembly |
| CN201822227310.3U Withdrawn - After Issue CN209169534U (en) | 2018-06-05 | 2018-12-27 | High speed interconnecting assembly |
| CN201811616295.XA Active CN109411957B (en) | 2018-06-05 | 2018-12-27 | High speed interconnect assembly |
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| CN201822222649.4U Withdrawn - After Issue CN209169533U (en) | 2018-06-05 | 2018-12-27 | High speed interconnecting assembly |
| CN201822227310.3U Withdrawn - After Issue CN209169534U (en) | 2018-06-05 | 2018-12-27 | High speed interconnecting assembly |
| CN201811616295.XA Active CN109411957B (en) | 2018-06-05 | 2018-12-27 | High speed interconnect assembly |
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| JP6994081B2 (en) * | 2019-06-14 | 2022-01-14 | センサービュー・インコーポレイテッド | Small coaxial cable connector for ultra-high frequency signal transmission |
| CN113473701A (en) * | 2020-03-31 | 2021-10-01 | 华为技术有限公司 | Optoelectronic component, network device and method for producing an optoelectronic component |
| CN111478086B (en) * | 2020-04-14 | 2021-11-19 | 东莞立讯技术有限公司 | High speed connector |
| CN113783002B (en) * | 2020-06-09 | 2023-09-12 | 三赢科技（深圳）有限公司 | Protection connector and lens module |
| CN114256696B (en) * | 2020-09-21 | 2023-03-03 | 华为技术有限公司 | Connector assembly, method of manufacturing the same, and electronic apparatus |
| CN112117604B (en) | 2020-10-09 | 2022-05-13 | 东莞立讯技术有限公司 | Electrical connector with improved contact arrangement |
| CN112072401B (en) * | 2020-10-09 | 2021-09-14 | 东莞立讯技术有限公司 | Terminal structure and electric connector |
| CN112886342B (en) * | 2021-01-14 | 2022-12-16 | 深圳盛凌电子股份有限公司 | Terminal equipment and connector thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN209169533U (en) | 2019-07-26 |
| CN109411958A (en) | 2019-03-01 |
| CN109411957B (en) | 2023-11-14 |
| CN209169534U (en) | 2019-07-26 |
| CN109411957A (en) | 2019-03-01 |
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