CN102255180B - Electrical connector system - Google Patents
Electrical connector system Download PDFInfo
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- CN102255180B CN102255180B CN201110090159.3A CN201110090159A CN102255180B CN 102255180 B CN102255180 B CN 102255180B CN 201110090159 A CN201110090159 A CN 201110090159A CN 102255180 B CN102255180 B CN 102255180B
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- thin slice
- base module
- connector system
- housing
- electric connector
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Abstract
An electrical connector system includes a plurality of chip components (204). Each chip component includes a shell component (211), a plurality of electrical contact channels (217) on the side of the shell component, and electrical contact arrays substantially arranged in the plurality of electrical contact channels. The electrical contact arrays comprises a plurality of cooperation connectors (218) extending from one end of the shell component and a plurality of installation connectors (220) extending from the other end of the shell component. The electrical connector system further comprises a chip shell (206) which positions the plurality of chip components adjacently to each other. The chip shell comprises a first guide component (704).A tube socket module (902) in cooperation with the chip shell comprises a second guide component (1102) which is prepared in a certain size to be connect with the first guide component and thereby to align the tube socket module with the shell component. A power contact (208) traverses the openings (802,908) of the chip shell and the tube socket module so as to provide power transmission paths in the electrical connector system.
Description
Technical field
The present invention relates to a kind of electric connector system for circuit board or other substrate interconnection.
Background technology
Typically, electric connector system is used for such as, by the first substrate, printed circuit board (PCB), parallel or be vertically connected to the second substrate, such as another printed circuit board (PCB).Because electronic component dimensions reduction and electronic component generally become more complicated, usually wish, in circuit board or other on-chip less spaces, more element is installed.Thus, wish that the spacing reduced between the electric terminal in electric connector system also increases the quantity of the electric terminal be contained in electric connector system.Therefore, it is desirable to research and develop the electric connector system that can run when speed increases and can also increase the quantity of the electric terminal be contained in electric connector system simultaneously.
Summary of the invention
According to the present invention, electric connector system comprises multiple wafer assemblies.Each wafer assemblies comprises housing parts, multiple electrical contacts array being formed in the electrical contact passage on a side of housing parts and being located substantially in multiple electrical contact passage.Electrical contacts array comprises multiple matching connector extended from one end of housing parts, and from the mounted connector that the other end of housing parts extends.Electric connector system comprises the thin slice housing making multiple wafer assemblies adjacent one another are further.Thin slice housing comprises the first guide member.The base module coordinated with thin slice housing comprises the second guide member, and its size is made and engaged with the first guide member align base module and thin slice housing.The opening of the alignment of electrical contact in thin slice housing and base module to provide power transmission path in electric connector system.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the backplane connector system the first substrate being connected to the second substrate;
Fig. 2 is the perspective view of the electric connector system comprising multiple wafer assemblies;
Fig. 3 shows the wafer assemblies of the electric connector system in Fig. 2;
Fig. 4 shows the metal center ground plane of the wafer assemblies in Fig. 3;
Fig. 5 shows the multiple ribs on over-molded metal center ground plane in the diagram;
Fig. 6 is the zoomed-in view of the electrical contact from the electric connector system in Fig. 2;
Fig. 7 is the zoomed-in view of the thin slice housing from electric connector system in Fig. 2;
Fig. 8 is another view of the thin slice housing in Fig. 7;
Fig. 9 shows the base module engaged with the thin slice housing in Fig. 7;
Figure 10 is another view of the base module in Fig. 9;
Figure 11 shows another view of base module;
Figure 12 shows a view again of base module;
Figure 13 is the perspective view of another electric connector system comprising multiple wafer assemblies;
Figure 14 is another view of the electric connector system in Figure 13;
Figure 15 shows the housing parts from the electric connector system in Figure 13;
Figure 16 shows the electrical contacts array from the electric connector system in Figure 13.
Embodiment
The disclosure content is devoted to the backplane connector system being connected to one or more substrate.Backplane connector system can (such as, up at least 25Gbps) operation at high speeds, meanwhile, in some embodiments, additionally provides high pin density (such as, at least general 50 right electric connectors of per inch).In one embodiment, as shown in fig. 1, backplane connector system 102 can be used for such as, by the first substrate 104, printed circuit board (PCB), parallel or be vertically connected to the second substrate 106, such as another printed circuit board (PCB).The execution mode of disclosed connector system can comprise earth shield structure, and it is through base plate trace, back plane connector, and/or subcard trace in three dimensions roughly encapsulation can be the right electric connector pair of the electric connector of difference.The ground structure of these encapsulation, together with surrounding the insulating packing of electric connector to different grooves itself, can prevent during the operation of high speed backplane connector system undesirable non-transverse, longitudinal and propagation that is more higher modes.
Fig. 2 is the perspective view of the electric connector system 202 for connecting multiple substrate.In one embodiment, electric connector system 202 defines the installation end be connected with the first substrate and the abutting end be connected with the second substrate.Can directly or by interface connector be connected with the first substrate or the second substrate.In some embodiments, when engaging with electric connector system 202, the first and second substrates can become and generally perpendicularly arrange.
Electric connector system 202 can comprise one or more wafer assemblies 204, and it provides the electrical path between two substrates.Each wafer assemblies 204 can comprise the first electrical contacts array 210 (also referred to as the first lead frame assembly), central frame 212, second electrical contacts array 214 (also referred to as the second lead frame assembly), one or more ground strip 215 and organizer 216.Electrical contacts array 210 and 214 each being configured to is connected to provide multiple electrical path between the first substrate and the second substrate with the first substrate and the second substrate.These electrical paths can be signal transmission path, power transmission path, or earthing potential path.
The central frame 212 of wafer assemblies 204 can be housing parts, and it is contained in the electrical contacts array 210 and 214 on every side of central frame.First side of central frame 212 can comprise the conductive surface limiting multiple first passage 217.Similarly, the second side of central frame 212 can comprise the conductive surface limiting multiple second channel.Although the second channel on the second side of central frame 212 is invisible in the view of Fig. 2, they are roughly similar to multiple first passages 217 that the first side of central frame 212 illustrates.
In some embodiments, each passage of central frame 212 is coated with insulating barrier, such as over-molded plasticity insulator, to make when electrical contacts array 210 and 214 is located substantially in passage, the conductive surface of the current-carrying part of electrical contacts array 210 and 214 and central frame 212 is isolated by insulating barrier.In other embodiments, electrical contacts array 210 and 214 is surrounded by over-molded insulating barrier with the channel separation by the conductive lead frame in electrical contacts array 210 and 214 and other conductive surfaces such as central frame 212 at least in part.
Fig. 3 shows the wafer assemblies 204 electrical contacts array 210 and 214 and organizer 216 are connected to after central frame 212.In described multiple first passages 217 that electrical contacts array 210 can be located substantially on the first side of central frame 212 and electrical contacts array 214 can be located substantially in described multiple passage of the second side of central frame 212.When being positioned at the passage of central frame 212, the electrical contact adjacent positioned of each electrical contact of electrical contacts array 210 and the corresponding of electrical contacts array 214.In some embodiments, electrical contacts array 210 and 214 in the passage of central frame 212 to make the distance between the adjacent electrical contacts in whole wafer assemblies 204 scope substantially the same.Meanwhile, the adjacent electrical contact of electrical contacts array 210 and 214 forms a series of electrical contact pair.Such as, in Fig. 3, wafer assemblies 204 comprises eight pairs of electrical contacts.Often pair of contact comprises a contact from electrical contacts array 210 and a contact from electrical contacts array 214.In some embodiments, electrical contact is to the differential pair that can be electrical contact.Such as, electrical contact sends out differential signal to may be used for.
In some embodiments, for each electrical contact pair, the electrical contact of an electrical contacts array and the electrical contact mirror image of another adjacent electrical contacts array.The electrical contact mirror image making electrical contact right provides benefit in manufacture and the row for high speed electric property in row consistency, meanwhile, also in paired two row, provides exclusive architecture.
With reference to figure 2 and 3, the first electrical contacts array 210 can be limited to multiple mounted connectors 220 of the multiple electric matching connector 218 of the abutting end of wafer assemblies 204 and the installation end in wafer assemblies 204.Similarly, the second electrical contacts array 214 can be limited to multiple mounted connectors 224 of the multiple electric matching connector 222 of the abutting end of wafer assemblies 204 and the installation end in wafer assemblies 204.Matching connector 218 and 222 can be close band shape, three strip-shapeds, two strip-shaped, circle, male form, female, hermaphroditic type, or the connector type of other pairings.Mounted connector 220 and 224 can be substrate joint element, and such as electrical contact installs pin, and it is sized to load in respective aperture in substrate or through hole to be connected with substrate.
When electrical contacts array 210 and 214 is positioned at the passage of central frame 212, electricity matching connector 218 and 222 the abutting end of wafer assemblies 204 to extend from one end of the passage of central frame 212 with the first substrate or another cooperating equipment, such as base module couples.Similar, when electrical contacts array 210 and 214 is positioned at the passage of central frame 212, mounted connector 220 and 224 extends to couple with the second substrate or another cooperating equipment at the installation end of wafer assemblies 204 from the other end of the passage of central frame 212.In electrical contacts array 210, one in electric matching connector 218 one end that can be positioned on each electrical path of array, and in mounted connector 220 one can be positioned on the other end of each electrical path of array.Similarly, in electrical contacts array 214, one in matching connector 222 one end that can be positioned on each electrical path of array, and in mounted connector 224 one can be positioned on the other end of each electrical path of array.
Fig. 4 shows the stamped metal centre-point earth layer 402 of the central frame 212 in Fig. 2 and 3.Metal center ground plane 402 can be made up of brass, phosphor bronze or another centre-point earth layer material.Metal center ground plane in Fig. 4 is also shown with the manufacture framework 404 removed before operation.Metal center ground plane 402 can comprise multiple hole 406, its from the first side of metal center ground plane 402 through the second side of metal center ground plane 402.Hole 406 for allowing that plastic molded material passes metal center ground plane 402 during the over-molded process of passage 217 forming central frame 212.
Fig. 5 show on metal center ground plane 402 that passage 217 forms in the diagram after central frame 212.In some embodiments, passage 217 limited by multiple ribs of plastic 502.Ribs of plastic 502 can plate electric conducting material or can be shaping by conductive plastics.Ribs of plastic 502 can by liquid crystal polymer (" LCP "), high-temperature thermoplastics, or another timber material is formed.In a metal heart ground plane 402 is formed in the structure of passage 217, ribs of plastic 502 by over-molded on metal center ground plane 402.
In some embodiments, ribs of plastic 502 can be over molded on metal center ground plane 402 the first side on so that the first side of heart ground plane 402 in a metal to form multiple first electrical contact passage.Then, the first electrical contacts array can be located substantially in multiple first electrical contact passage 217.Second side of heart ground plane 402 is in a metal formed in the structure of multiple second electrical contact passage, and over-molded ribs of plastic 502 also can be formed on the second side of metal center ground plane 402.Then the second electrical contact array can be located substantially in multiple second electrical contact passage.Although the most of ribs of plastic 502 on the second side of heart ground plane 402 is in a metal invisible in Figure 5, the rib 502 on the second side is substantially similar to the rib 502 on the first side of metal center ground plane 402.Therefore, the rib 502 on the first side can relative to the rib alignment on the second side, to make the electrical contact adjacent positioned of each electrical contact of the first electrical contacts array and the corresponding of the second electrical contacts array to form the differential pair of multiple electrical contact.
In one embodiment, metal center ground plane 402 can be exposed to the bottom of each passage 217 in central frame 212.Such as, the passage 217 of central frame 212 is limited between the first plastics flank 504 and the second plastics flank 506.First and second plastics flanks 504 and 506 can be over molded on metal center ground plane 402, are exposed between the first plastics flank 504 and the second plastics flank 506 to make the metal center ground plane 402 of a part.In some embodiments, after being formed on metal center ground plane 402 by ribs of plastic 502, metal center ground plane 402 can be electrically connected to the conductive surface of one or more ribs of plastic 502 on the one or both sides of central frame 212.
As shown in Figure 5, a part for a passage 217 of central frame 212 is limited by flank 504, flank 506, flank 508 and flank 510.In addition, other flanks also can contribute to limiting whole passage 217, as shown in Figure 5.Flank 504 and flank 508 form a part for the first wall on the side of passage 217.Equally, flank 506 and flank 510 form a part for the second wall in the opposite side of passage 217.As shown in Figure 5, flank 504 can be substantially parallel with the flank 506 on the opposite side of passage 217.Flank 508 can be substantially parallel with the flank 510 of the opposite side at passage 217.As shown in Figure 5, flank 504 is substantially not parallel with flank 510, and flank 506 is substantially not parallel with flank 508.Therefore, passage 217 user in Fig. 5 to change by over-molded flank to hold electrical contacts array, this electrical contacts array connects roughly perpendicular two substrates.Passage 217 can have other sizes, structure and configuration.Such as, passage 217 may be tailored to size and the configuration of the electrical contacts array for connecting multiple substrate in electric connector 202.
Return with reference to Fig. 2 and 3, multiple ground strips 215 can be positioned at the abutting end of wafer assemblies 204.Ground strip 215 extends out from central frame 212 and can be electrically connected to the first side and/or second side of central frame 212.Ground strip 215 can be oar shape or other arbitrary shapes, and it shields adjacent electrical contact.In some embodiments, one in ground strip 215 the abutting end of wafer assemblies 204 be arranged in each electric connector on and another of ground strip 215 be positioned at each electric connector under.In some embodiments, ground strip 215 is included in brass or other coating conducted electricity or the base metal of zinc-plated (Sn) on nickel (Ni) coating.
As ground strip 215, organizer 216 can be positioned at the abutting end of wafer assemblies 204.Organizer 216 comprises multiple aperture, and these apertures are made into certain size to allow the electric matching connector 218 and 222 that extends from wafer assemblies 212 and ground strip 215 through organizer 216 when organizer 216 is positioned at the abutting end of wafer assemblies 204.In some embodiments, organizer 216 is for locking together central frame 212, first electrical contacts array 210, second electrical contacts array 214 and ground strip 215 securely.
With reference to figure 2, electric connector system 202 also can comprise thin slice housing 206.Thin slice housing 206 is for receiving multiple wafer assemblies 204 and multiple wafer assemblies 204 being positioned at adjacent to each other in electric connector system 202.In some embodiments, thin slice housing 206 engages with each wafer assemblies 204 at the abutting end of wafer assemblies 204.Such as, thin slice housing 206 can receive the electric matching connector 218 and 222 and ground strip 215 that extend from the abutting end of multiple wafer assemblies 204.Connection between thin slice housing 206 and wafer assemblies 204 is by each wafer assemblies 204 and another wafer assemblies 204 adjacent positioned.The size of the interface connector of thin slice housing 206 defines the relative spacing of multiple wafer assemblies 204.
As shown in Figure 2, electric connector system 202 also can comprise one or more power contacts 208 and 209, and it is positioned to the outside being positioned at independent wafer assemblies 204.Power contacts 208 and 209 makes certain size to pass the one or more openings in thin slice housing 206.Power contacts 208 and 209 is for providing one or more power transmission path between two substrates being connected to electric connector system 202.
Fig. 6 shows the zoomed-in view of the power contacts 208 and 209 in Fig. 2.As seen in Figure 6, power contacts 208 comprises Part I 602 and Part II 604, this Part I 602 is configured to joint first substrate, and this Part II 604 makes certain size to be passed in the opening of the alignment in thin slice housing 206 and base module 902 and to be connected to the second substrate.As shown in Figure 6, Part I 602 can be approximately perpendicular to Part II 604.In some embodiments, Part I 602 locates to make power contacts 208 and 209 can be connected to two substantially vertical substrates relative to Part II 604.Each power contacts 208 and 209 also can comprise one or more substrate joint element 606, and as electrical contact installs pin, it is made certain size with the corresponding hole in passing through substrate or through hole and is connected to substrate.
Fig. 7 and 8 shows another view of the thin slice housing 206 of the electric connector system 202 in Fig. 2.Thin slice housing 206 comprises one or more aperture 702 in thin slice housing 206, it is made certain size and is connected to the corresponding matching connector relevant to substrate or other cooperating equipments, base module 902 as shown in figs. 9-12 to allow the matching connector 218 and 222 extended from wafer assemblies 204.
As shown in Figure 7, thin slice housing 206 also can comprise guide member 704 and be sized the opening 706 of the element portion receiving base module 902.Fig. 8 shows the opposition side of the thin slice housing 206 in Fig. 7.In fig. 8, show the thin slice housing 206 with one or more grooves 802 and 804, this groove 802 and 804 makes certain size to receive power contacts 208 and 209.Such as, groove 802 can receive power contacts 208, and groove 804 can receive power contacts 209.Power contacts 208 and 209 can comprise the surface portion 608 and 610 of one or more protrusion, as shown in Figure 6, when power contacts 208 and 209 placement enters in the groove 802 and 804 of thin slice housing 206, described surface portion is provided in the interference fit between power contacts 208 and 209 and thin slice housing 206.
The different views being applicable to the base module 902 coordinated with the thin slice housing 206 in Fig. 7 and 8 has been shown in Fig. 9-12.In one embodiment, base module 902 is used as the interface connection component between thin slice housing 206 and substrate.Base module 902 can comprise framework 904, opening 906, groove 908 and 910.
As shown in figs. 9 and 10, the part framework 904 forming groove 908 and 910 can be given prominence to from the back side of base module 902.When base module 902 engages with thin slice housing 206, these protuberances fit in the opening 706 of thin slice housing 206.When base module 902 joins in thin slice housing 206, the groove 908 and 910 in the framework 904 of base module 902 aligns with the groove 802 and 804 in the thin slice housing 206 in Fig. 7 and 8.After thin slice housing 206 and base module 902 are joined together, the power contacts 208 and 209 in Fig. 2 is sized through alignd groove to provide power transmission path two substrates.Such as, power contacts 208 can pass the groove 802 of thin slice housing 206 and the groove 908 of base module 902.Similarly, power contacts 209 can pass the groove 804 of thin slice housing 206 and the groove 910 of base module 902.
As shown in figure 11, base module 902 also can comprise power contacts interface connector 1106 and 1108.One end of power contacts interface connector 1106 and 1108 comprises substrate joint element 1109, and such as electrical contact installs pin, and it makes certain size to be assembled in corresponding hole in substrate or through hole to be connected to substrate.The other end of power contacts interface connector 1106 and 1108 can comprise sheet connector system 1110 to produce pressing or interference fit between electrical contact interface connector 1106,1108 and respective power contacts 208 and 209.A sheet in sheet connector system 1110 is designed to the first side of adjacent power contacts, and another sheet in sheet connector system 1110 is designed to the second side of adjacent power contacts.
As shown in FIG. 11 and 12, the opening 906 in framework 904 provides a position to be connected to base module 902 for guide member 1102.In one embodiment, securing member 1104 engages guide member 1102 and is kept in place by guide member 1102 with the framework 904 relative to base module 902.Guide member 1102 can work together to the corresponding guide member 704 of the thin slice housing 206 in Fig. 7 the cooperation improved between thin slice housing 206 and base module 902 and align.In one embodiment, the guide member 1102 of base module 902 can comprise guide post, and the guide member 704 of thin slice housing 206 can comprise guide recess, and when thin slice housing 206 engages with base module 902, this guide recess receives this guide post.Usually, before thin slice housing 206 joins base module 902 to, the guide member 1102 of base module 902 and the guide member 704 of corresponding thin slice housing 206 engage to provide initial location.Such as, join the corresponding matching connector of electrical contacts array 210 and 214 in the signal pins 1116 of base module 902 before, base module 902 and thin slice housing 206 can be alignd by guidance system.As shown in figure 11, guide member 1102 can be connected with the framework 904 of base module 902, or guide member 1102 can be the integral part of framework 904.Same, as shown in Figure 7, guide member 704 can be the integral part of the framework of thin slice housing 206, or guide member 704 can be attached to the framework of thin slice housing 206.
As illustrated in figs. 11 and 12, the mating surface of base module 902 can comprise earth shield 1112, one row's ground strip 1114 of multiple C shape and form the right multiple signal pins 116 of signal pins.When wafer assemblies 204, thin slice housing 206 and base module 902 all engage, signal pins 1116 is couple to the matching connector 218 and 222 of wafer assemblies 204.In some embodiments, the earth shield 1112 of the C shape of base module 902, that row's ground strip 1114 and multiple signal pins to 1116 configuration, assembling and use with US Patent No. 12/474, the configuration of the corresponding part of the base module described in No. 568, assembling and use are identical.
Figure 13 is the perspective view of the electric connector system 1302 for connecting many substrates.As electric connector system 202, electric connector system 1302 can comprise one or more wafer assemblies 1304, thin slice housing 206, and power contacts 208 and 209.Figure 14 shows and to assemble in wafer assemblies 1304 and to join the electric connector system 1302 after thin slice housing 206 to.The wafer assemblies 1304 be not both in Figure 13 of electric connector system 1302 and electric connector system 202 is different from the wafer assemblies 204 in Fig. 2.In electric connector system 1302, wafer assemblies 1304 can comprise the first housing 1306, electrical contacts array 1308, electrical contacts array 1310, second housing 1312 and earth shield 1314.
In some embodiments, the configuration of the first housing 1306 of electric connector system 1302, electrical contacts array 1308, electrical contacts array 1310, second housing 1312 and earth shield 1314, assembling and use and the U.S. Patent number be incorporated by reference are US 12/474, and configuration, the assembling of the corresponding part of the electric connector system described by the Figure 41-47 in 568 combines are identical with use.Such as, as shown in figure 15, housing parts 1306 can limit multiple passage 1502, and it is made into certain size to receive one or more electrical contacts array.Figure 16 shows electrical contacts array 1308, and it is sized in multiple passages 1502 of the housing parts 1306 being assembled to Figure 15.As U.S. Patent number US12/474, described by 568, and similar with 214 to above-mentioned electrical contacts array 210, electrical contacts array 1308 comprises multiple matching connector 1602 and multiple mounted connector 1604, for connecting many substrates.
Each wafer assemblies 1304 includes a housing (e.g., housing 1306 or housing 1312), and this housing has the face electrical contacts array 1308 and 1310 in wafer assemblies 1304 and the electrical contacts array in contiguous slices assembly isolated.As mentioned above, power contacts 208 and 209 passes the opening alignd of thin slice housing 206 and base module 902.The opening alignd relative to other links (as, the link of the thin slice housing 206 engaged with wafer assemblies 1304) locate, to make when power contacts 208,209 and multiple wafer assemblies 1304 when joining thin slice housing 206 to, power contacts 208 and 209 is positioned at the outside of housing parts 1306 and 1312.Such as, power contacts 208 and 209 can in the outside of the housing of wafer assemblies 1304.
Claims (6)
1. an electric connector system, is characterized in that:
Multiple wafer assemblies (204), each wafer assemblies comprises:
Housing parts (212);
Multiple electrical contact passage (217), the plurality of electrical contact passage is formed on a side of described housing parts; And
Electrical contacts array (214), this electrical contacts array is positioned at described multiple electrical contact passage, and wherein said electrical contacts array comprises the multiple matching connectors (218) extended from one end of described housing parts and the multiple mounted connectors (220) extended from the other end of described housing parts;
Thin slice housing (206), described multiple wafer assemblies is positioned in described electric connector system by this thin slice housing adjacent to each other, and wherein said thin slice housing comprises the first guide member (704);
Base module (902), this base module coordinates with described thin slice housing, wherein said base module comprises the second guide member (1102), this second guide member is made into certain size to engage with described first guide member, thus when described thin slice housing coordinates with described base module by described base module and described thin slice housing alignment; And
Power contacts (208), this power contacts is passed in the opening (802,908) alignd in described thin slice housing and described base module, to provide power transmission path in described electric connector system.
2. electric connector system as claimed in claim 1, wherein said first guide member comprises guide recess, and wherein said second guide member comprises guide post, and this guide post is sized to be assembled in described guide recess.
3. electric connector system as claimed in claim 2, wherein said guide post is sized to engage with described guide recess, with before engaging to the corresponding matching connector of described electrical contacts array in the signal pins of described base module by described base module and described thin slice housing alignment.
4. electric connector system as claimed in claim 1, wherein said power contacts comprises Part I (602), and this Part I is configured to engage with the first substrate; With Part II (604), this Part II is sized to be connected with the second substrate through the opening alignd in described thin slice housing and described base module, and wherein said Part I is substantially perpendicular to described Part II.
5. electric connector system as claimed in claim 1, wherein said thin slice housing and described base module comprise the second opening (804 of one group of alignment, 910), and described electric connector system comprises the second power contacts (209) further, the second opening that this second power contacts aligns through that group in described thin slice housing and described base module, to provide the second power transmission path between the first substrate and the second substrate.
6. electric connector system as claimed in claim 1, the opening alignd in wherein said thin slice housing and described base module is located relative to other links of described thin slice housing, with when described power contacts and described multiple wafer assemblies engage with described thin slice housing, described power contacts is made to be positioned at the outside of described multiple wafer assemblies.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/713,710 US8187034B2 (en) | 2008-12-05 | 2010-02-26 | Electrical connector system |
| US12/713,710 | 2010-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102255180A CN102255180A (en) | 2011-11-23 |
| CN102255180B true CN102255180B (en) | 2015-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110090159.3A Active CN102255180B (en) | 2010-02-26 | 2011-02-28 | Electrical connector system |
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| CN (1) | CN102255180B (en) |
| TW (1) | TWI556518B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014159908A1 (en) * | 2013-03-14 | 2014-10-02 | Fci Asia Pte. Ltd | Flexible power connector |
| TWI492461B (en) * | 2013-10-18 | 2015-07-11 | Topconn Electronic Kunshan Co Ltd | Communication connecting device and lead frame pair thereof |
| JP7076298B2 (en) * | 2018-06-21 | 2022-05-27 | ヒロセ電機株式会社 | Right angle electrical connector |
| US11355902B2 (en) * | 2019-01-28 | 2022-06-07 | TE Connectivity Services Gmbh | Power connector for a bus bar |
| CN110783756A (en) * | 2019-09-23 | 2020-02-11 | 中航光电科技股份有限公司 | Mixed printed board connector |
| CN212849131U (en) * | 2020-09-21 | 2021-03-30 | 东莞立讯技术有限公司 | Terminal module and backplane connector |
| CN215600610U (en) * | 2021-02-02 | 2022-01-21 | 中山得意电子有限公司 | Electric connection combination |
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| CN1515051A (en) * | 2002-03-29 | 2004-07-21 | ̩ | Matrix connector with integrated power contacts |
| US7381092B2 (en) * | 2004-01-09 | 2008-06-03 | Japan Aviation Electronics Industry, Limited | Connector |
| US7384311B2 (en) * | 2006-02-27 | 2008-06-10 | Tyco Electronics Corporation | Electrical connector having contact modules with terminal exposing slots |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWM322090U (en) * | 2007-05-11 | 2007-11-11 | Chief Land Electronic Co Ltd | Ground terminal capable of preventing noise |
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- 2011-02-24 TW TW100106150A patent/TWI556518B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1515051A (en) * | 2002-03-29 | 2004-07-21 | ̩ | Matrix connector with integrated power contacts |
| US7381092B2 (en) * | 2004-01-09 | 2008-06-03 | Japan Aviation Electronics Industry, Limited | Connector |
| US7384311B2 (en) * | 2006-02-27 | 2008-06-10 | Tyco Electronics Corporation | Electrical connector having contact modules with terminal exposing slots |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI556518B (en) | 2016-11-01 |
| TW201145705A (en) | 2011-12-16 |
| CN102255180A (en) | 2011-11-23 |
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