TWI580122B - Electrical connector system - Google Patents

Electrical connector system Download PDF

Info

Publication number
TWI580122B
TWI580122B TW100106153A TW100106153A TWI580122B TW I580122 B TWI580122 B TW I580122B TW 100106153 A TW100106153 A TW 100106153A TW 100106153 A TW100106153 A TW 100106153A TW I580122 B TWI580122 B TW I580122B
Authority
TW
Taiwan
Prior art keywords
electrical contact
electrical
housing
array
central housing
Prior art date
Application number
TW100106153A
Other languages
Chinese (zh)
Other versions
TW201145706A (en
Inventor
詹姆斯 里 費德
強 愛德華 納伯
E 史考特 馬丁
琳恩 羅伯特 史派
Original Assignee
太谷電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/713,741 external-priority patent/US8157591B2/en
Application filed by 太谷電子公司 filed Critical 太谷電子公司
Publication of TW201145706A publication Critical patent/TW201145706A/en
Application granted granted Critical
Publication of TWI580122B publication Critical patent/TWI580122B/en

Links

Description

電氣連接器系統Electrical connector system

本發明係關於一種用於互連電路板或其他基板的電氣連接器系統。This invention relates to an electrical connector system for interconnecting circuit boards or other substrates.

電氣連接器系統一般係用於以平行或垂直關係連接一第一基板(例如一印刷電路板)與一第二基板(例如另一印刷電路板)。由於電子組件的尺寸減小且電子組件普遍變得更為複雜,通常需要在電路板或其他基板上較小空間中安裝更多組件;因此,已經變成需要減少電氣連接器系統內電氣終端之間的該間隔,並增加該等系統內所包圍之電氣終端的數量。據此,需發展一種可以增加速度運作,同時增加該電氣連接器系統內所包圍之電氣終端數量的電氣連接器系統。Electrical connector systems are typically used to connect a first substrate (e.g., a printed circuit board) and a second substrate (e.g., another printed circuit board) in a parallel or perpendicular relationship. As electronic components shrink in size and electronic components become more complex, it is often necessary to install more components in a smaller space on a circuit board or other substrate; therefore, it has become necessary to reduce the number of electrical terminals within the electrical connector system. This interval increases the number of electrical terminals enclosed within the systems. Accordingly, there is a need to develop an electrical connector system that can increase speed operation while increasing the number of electrical terminals enclosed within the electrical connector system.

根據本發明,一種電氣連接器系統包含一第一中央殼體,其界定在該第一中央殼體之一第一側面上的複數個第一電氣接點通道以及在該第一中央殼體之一第二側面上的複數個第二電氣接點通道。一第一電氣接點陣列係實質上位於該第一中央殼體之該第一側面上的前述複數個第一電氣接點通道內。一第二中央殼體界定在該第二中央殼體之一第一側面上的複數個第一電氣接點通道以及在該第二中央殼體之一第二側面上的複數個第二電氣接點通道。一第二電氣接點陣列係實質上位於該第二中央殼體之該第二側面上的前述複數個第二電氣接點通道內。該等一與第二中央殼體係於該電氣連接器系統中彼此相鄰,使得該第一電氣接點陣列與該第二電氣接點陣列相鄰以形成複數個電氣接點差動對。According to the present invention, an electrical connector system includes a first central housing defining a plurality of first electrical contact passages on a first side of the first central housing and in the first central housing a plurality of second electrical contact channels on a second side. A first electrical contact array is substantially located within the plurality of first electrical contact channels on the first side of the first central housing. a second central housing defining a plurality of first electrical contact channels on a first side of the second central housing and a plurality of second electrical connections on a second side of the second central housing Point channel. A second array of electrical contacts is located substantially within the plurality of second electrical contact channels on the second side of the second central housing. The first and second central housings are adjacent one another in the electrical connector system such that the first electrical contact array is adjacent to the second electrical contact array to form a plurality of electrical contact differential pairs.

本發明係與連接於一或多個基板的背板連接器系統有關。該等背板連接器系統係可以高速(例如達至少約25Gbps)運作,同時在某些實作例中也可提供高接腳密度(例如達至少每英吋有約50對電氣連接器)。在一實作例中,如第一圖所示,背板連接器系統102係用於以平行或垂直關係連接一第一基板104(例如一印刷電路板)與一第二基板106(例如另一印刷電路板)。該等所揭露之連接器系統的實作例包含可實質上以三維方式於背板覆蓋區(backplane footprint)、背板連接器、及/或子卡覆蓋區(daughtercard footprint)間將成對的電氣連接器(其係電氣連接器差動對)封進內部之接地屏蔽結構。這些封進內部的接地結構以及環繞該等成對的電氣連接器本身周圍之該等差動室的介電質填充物係可於該等高速背板連接器系統的運作期間避免非橫向、縱向與高階模式的無用傳播。The present invention is related to a backplane connector system that is coupled to one or more substrates. The backplane connector systems are capable of operating at high speeds (e.g., up to about 25 Gbps) while also providing high pin densities in certain embodiments (e.g., up to about 50 pairs of electrical connectors per inch). In one embodiment, as shown in the first figure, the backplane connector system 102 is used to connect a first substrate 104 (eg, a printed circuit board) and a second substrate 106 (eg, another A printed circuit board). Embodiments of such disclosed connector systems include pairs of electrical devices that can be substantially in a three-dimensional manner between a backplane footprint, a backplane connector, and/or a daughtercard footprint. The connector (which is the differential pair of electrical connectors) is sealed into the internal ground shield structure. The internal ground structure and the dielectric filler surrounding the differential chambers surrounding the pair of electrical connectors themselves can avoid non-transverse, longitudinal periods during operation of the high speed backplane connector systems Useless propagation with higher order modes.

第二圖為用於連接多個基板之電氣連接器系統202的立體圖。在一實作例中,電氣連接器系統202具有連接於第一基板之一固定端204以及連接於第二基板之一匹配端206。與該第一基板或該第二基板之該等連接係可為直接連接或是透過一介面連接器。當接合於電氣連接器系統202時,該等第一與第二基板是以實質上垂直的關係排列。電氣連接器系統202可包含一或多個薄片殼體208、一或多個薄片組件210、一或多個接地屏蔽部212以及一或多個整線器214。此外,電氣連接器系統202包含一或多個接地電位連接組件,其於多個薄片組件210與該基板之間提供一共同接地電位。舉例而言,電氣連接器系統202包含一或多個接地片,其於電氣連接器系統202之固定端204處耦接於薄片裝置210與該基板之間,如美國專利申請號12/641,904中所描述者。The second figure is a perspective view of an electrical connector system 202 for connecting a plurality of substrates. In one embodiment, the electrical connector system 202 has a fixed end 204 coupled to one of the first substrates and a mating end 206 coupled to the second substrate. The connection to the first substrate or the second substrate may be a direct connection or an interface connector. When joined to electrical connector system 202, the first and second substrates are arranged in a substantially perpendicular relationship. The electrical connector system 202 can include one or more wafer housings 208, one or more wafer assemblies 210, one or more ground shields 212, and one or more wire organizers 214. In addition, electrical connector system 202 includes one or more ground potential connection assemblies that provide a common ground potential between the plurality of wafer assemblies 210 and the substrate. For example, electrical connector system 202 includes one or more ground lugs that are coupled between sheet device 210 and the substrate at a fixed end 204 of electrical connector system 202, as in U.S. Patent Application Serial No. 12/641,904. Described.

薄片殼體208用於在電氣連接器系統202內容置及定位彼此相鄰的多個薄片組件210。在一實作例中,薄片殼體208於匹配端206處接合薄片組件210。在薄片殼體208中的一或多個孔洞216之大小使自薄片組件210延伸的匹配連接器可通過薄片殼體208,使得該等匹配連接器連接於與一基板相關的對應匹配連接器或另一匹配裝置(例如美國專利申請號12/474,568中所描述的該等頂蓋模組)。The wafer housing 208 is used to position and position a plurality of sheet assemblies 210 adjacent one another in the electrical connector system 202. In one embodiment, the foil housing 208 engages the wafer assembly 210 at the mating end 206. One or more apertures 216 in the foil housing 208 are sized such that mating connectors extending from the foil assembly 210 can pass through the foil housing 208 such that the mating connectors are coupled to corresponding mating connectors associated with a substrate or Another matching device (such as the cap modules described in U.S. Patent Application Serial No. 12/474,568).

接地屏蔽部212係耦接至一或多個薄片組件210的側面或整合至其中一個薄片組件210的殼體。當電氣連接器系統202固定至該基板時,接地屏蔽部212於電氣連接器系統202的固定端204處可包含基板接合元件(例如接地固定接腳)以與基板接合。The ground shield 212 is coupled to the side of one or more of the sheet assemblies 210 or to the housing of one of the sheet assemblies 210. When the electrical connector system 202 is secured to the substrate, the ground shield 212 can include a substrate bonding component (eg, a grounding fixed pin) at the fixed end 204 of the electrical connector system 202 to engage the substrate.

整線器214係繪示為位於電氣連接器系統202的固定端204處。整線器214包含孔洞,其大小可使基板接合元件(例如該等電氣接點固定接腳)通過整線器214並連接於基板。The aligner 214 is shown as being located at the fixed end 204 of the electrical connector system 202. The aligner 214 includes a hole sized to pass a substrate bonding component (e.g., the electrical contact fixing pins) through the splicer 214 and to the substrate.

第三圖為電氣連接器系統202的另一視圖,其中薄片殼體208與整線器214已經被移除,以暴露出薄片組件210的匹配連接器302和固定連接器304。每一個薄片組件210在多個基板間提供了一或多個電氣路徑陣列。該等電氣路徑可為訊號傳輸路徑、電力傳輸路徑或接地電位路徑。其中一個匹配連接器302係位於一陣列之各電氣路徑的一端,而其中一個固定連接器304係位於一陣列之各電氣路徑的另一端。The third view is another view of electrical connector system 202 in which sheet housing 208 and splicer 214 have been removed to expose mating connector 302 and fixed connector 304 of sheet assembly 210. Each of the sheet assemblies 210 provides one or more arrays of electrical paths between the plurality of substrates. The electrical paths can be signal transmission paths, power transmission paths, or ground potential paths. One of the mating connectors 302 is located at one end of each electrical path of an array, and one of the fixed connectors 304 is located at the other end of each of the electrical paths of an array.

匹配連接器302從電氣連接器系統202的匹配端206延伸出來,以耦接於一第一基板或另一匹配裝置,例如一頂蓋模組。匹配連接器302為封閉式帶狀、三樑(tri-beam)形、雙樑形、圓形、公性、母性、雙性或另一匹配連接器類型。同樣地,固定連接器304從電氣連接器系統202的固定端204延伸出來,以耦接於一第二基板或另一匹配裝置。固定連接器304可為電氣接點接腳,其大小係可安裝於該基板的對應孔洞或貫孔中,以產生與該基板之連接。The mating connector 302 extends from the mating end 206 of the electrical connector system 202 for coupling to a first substrate or another matching device, such as a cap module. The mating connector 302 is a closed band, tri-beam, double beam, circular, male, maternal, amphoteric or another mating connector type. Similarly, the fixed connector 304 extends from the fixed end 204 of the electrical connector system 202 for coupling to a second substrate or another matching device. The fixed connector 304 can be an electrical contact pin that can be mounted in a corresponding hole or through hole of the substrate to create a connection with the substrate.

如第三圖所示,電氣連接器系統202與薄片組件210係由數種不同殼體組件所形成。舉例而言,該電氣連接器系統係包含一或多個第一端部殼體306、一或多個中央殼體308與一或多個第二端部殼體310。第三圖中所示之電氣連接器系統202係由一個第一端部殼體306、五個中央殼體308以及一個第二端部殼體310所形成。在其他實作例中也可使用不同的殼體配置,例如包含多個第一端部殼體306、包含多個第二端部殼體308、使用較少的中央殼體308、使用較多的中央殼體308等。在電氣連接器系統202中,該等殼體組件的數量與配置係可被客製化以符合該應用之該等需求。As shown in the third figure, electrical connector system 202 and sheet assembly 210 are formed from a number of different housing assemblies. For example, the electrical connector system includes one or more first end housings 306, one or more central housings 308, and one or more second end housings 310. The electrical connector system 202 shown in the third figure is formed by a first end housing 306, five center housings 308, and a second end housing 310. Different housing configurations may also be used in other implementations, including, for example, a plurality of first end housings 306, a plurality of second end housings 308, fewer central housings 308, and more Central housing 308 and the like. In the electrical connector system 202, the number and configuration of the housing components can be customized to meet the needs of the application.

第四圖更詳細繪示了電氣連接器系統202的第一端部殼體306、中央殼體308以及第二端部殼體310。在一實作例中,該等殼體組件之每一者包含界定複數個通道之一傳導表面,通道的大小係可容置一或多個電氣接點陣列。舉例而言,第一端部殼體306可包含在第一端部殼體306之第一側面上,而非在該第二側面上的複數個通道402。同樣地,第二端部殼體310可包含在第二端部殼體310之一第一側面上,但非在該第二側面上的複數個通道404。因此,端部殼體306與310僅可容納一側上的一電氣接點陣列。另一方面,中央殼體308可包含在中央殼體308之各側面上的複數個通道。舉例而言,中央殼體308可包含在中央殼體308之第一側面上的第一複數個通道406以及在中央殼體308之第二側面上的第二複數個通道408。因此,中央殼體308可容納在每一側上的一電氣接點陣列。在中央殼體308之該第一側面上的通道406係實質上類似於在中央殼體308之該第二側面上的通道408。The fourth diagram illustrates the first end housing 306, the central housing 308, and the second end housing 310 of the electrical connector system 202 in greater detail. In one embodiment, each of the housing assemblies includes a conductive surface defining a plurality of channels, the channels being sized to receive one or more electrical contact arrays. For example, the first end housing 306 can be included on a first side of the first end housing 306 rather than a plurality of channels 402 on the second side. Likewise, the second end housing 310 can include a plurality of channels 404 on one of the first sides of the second end housing 310, but not on the second side. Thus, end housings 306 and 310 can only accommodate an array of electrical contacts on one side. In another aspect, the central housing 308 can include a plurality of channels on each side of the central housing 308. For example, the central housing 308 can include a first plurality of channels 406 on a first side of the central housing 308 and a second plurality of channels 408 on a second side of the central housing 308. Thus, the central housing 308 can accommodate an array of electrical contacts on each side. The passage 406 on the first side of the central housing 308 is substantially similar to the passage 408 on the second side of the central housing 308.

第一端部殼體306、中央殼體308及/或第二端部殼體310係形成以具有一傳導表面。舉例而言,該等殼體係形成為鍍製之塑膠接地殼殼體;在某些實作例中,該等殼體之每一者包含鍍製之塑膠或壓鑄接地薄片,例如鍍鎳(Ni)或鋅(Zn)壓鑄件上覆錫(Sn)。在其他實作例中,該等殼體係包含鋁(Al)壓鑄件、傳導性聚合物、金屬射出成型(injection molding)或任何其他類型之金屬。 The first end housing 306, the central housing 308, and/or the second end housing 310 are formed to have a conductive surface. For example, the housings are formed as a plated plastic grounded housing; in some embodiments, each of the housings comprises a plated plastic or die cast ground foil, such as nickel (Ni) Or zinc (Zn) die castings are coated with tin (Sn). In other embodiments, the housings comprise aluminum (Al) die castings, conductive polymers, metal injection molding, or any other type of metal.

第五圖繪示了第一電氣接點陣列502(如第一引線框組件)與第二電氣接點陣列504(如第二引線框組件)。電氣接點陣列502與504之每一者包含該等基板間之多個電氣路徑;舉例而言,第一接點陣列502包含複數個電氣路徑506,而第二接點陣列504包含複數個電氣路徑508。電氣路徑506、508提供了第三圖所示之薄片組件210之該等訊號傳輸路徑、電力傳輸路徑或接地電位路徑。如第五圖所示,一匹配連接器302係位於一陣列之各電氣接點的一端,而一固定連接器304係位於一陣列之各電氣路徑的另一端。 The fifth figure depicts a first electrical contact array 502 (such as a first leadframe assembly) and a second electrical contact array 504 (such as a second leadframe assembly). Each of the electrical contact arrays 502 and 504 includes a plurality of electrical paths between the substrates; for example, the first contact array 502 includes a plurality of electrical paths 506, and the second contact array 504 includes a plurality of electrical Path 508. The electrical paths 506, 508 provide the signal transmission path, power transmission path or ground potential path of the sheet assembly 210 shown in the third figure. As shown in the fifth figure, a mating connector 302 is located at one end of each electrical contact of an array, and a fixed connector 304 is located at the other end of each electrical path of an array.

電氣接點陣列502、504係由傳導性材料形成。在某些實作例中,電氣接點陣列502、504包含磷青銅及鎳(Ni)鍍層上覆金(Au)或錫(Sn)。在其他實作例中,電氣接點陣列502、504包含任何銅(Cu)合金材料。該等鍍層可為任何貴重金屬,例如鈀(Pd)或合金,如鈀-鎳(Pd-Ni)或在該接觸區中鍍金(Au)之鈀(Pd)、在該固定區域有錫(Sn)或鎳(Ni)、在該下方鍍層或基底鍍層中有鎳(Ni)。電氣接點陣列502、504之每一 者係繪示於第五圖中,其具有在運作之前可被移除之一製造框體510。 Electrical contact arrays 502, 504 are formed from a conductive material. In some implementations, the electrical contact arrays 502, 504 comprise phosphor bronze and nickel (Ni) coatings coated with gold (Au) or tin (Sn). In other implementations, the electrical contact arrays 502, 504 comprise any copper (Cu) alloy material. The plating layer may be any precious metal such as palladium (Pd) or an alloy such as palladium-nickel (Pd-Ni) or palladium (Pd) plated with gold (Au) in the contact region, and tin in the fixed region (Sn Or nickel (Ni), nickel (Ni) in the underlying plating or underlying plating. Each of the electrical contact arrays 502, 504 The figure is depicted in the fifth figure, which has a frame 510 that can be removed prior to operation.

第六圖繪示了在加入包覆成型(overmolded)之絕緣層602(例如包覆成型之塑膠介電質)後的電氣接點陣列502、504。在第六圖中,第五圖所示之電氣路徑506、508之陣列係至少部分由包覆成型之絕緣層602予以環繞。包覆成型之絕緣層602係使電氣路徑506、508之陣列與其他傳導表面隔離。第六圖也繪示了在移除第五圖所示之製造框體510後的電氣接點陣列502、504。 The sixth figure depicts the electrical contact arrays 502, 504 after the overmolded insulating layer 602 (eg, overmolded plastic dielectric). In the sixth diagram, the array of electrical paths 506, 508 shown in FIG. 5 is at least partially surrounded by an overmolded insulating layer 602. The overmolded insulating layer 602 isolates the array of electrical paths 506, 508 from other conductive surfaces. The sixth diagram also depicts the electrical contact arrays 502, 504 after removal of the fabrication frame 510 shown in FIG.

第七圖繪示了置於殼體組件306、308與310之通道中的多個電氣接點陣列。在第七圖中,第一電氣接點陣列702係實質上位於中央殼體308之一第一側面上的該等通道內;第三電氣接點陣列704係實質上位於中央殼體308之一第二側面上的該等通道內。在一實作例中,第一電氣接點陣列702係不同於第三電氣接點陣列704的差動對陣列的一部分。在此實作例中,第一電氣接點陣列702係與一電氣接點陣列706成對,以形成一第一複數個電氣接點差動對。電氣接點陣列706係實質上位於第一端部殼體306的該等通道內,如第七圖所示。第三電氣接點陣列704係與一第五電氣接點陣列708成對,以形成一第二複數個電氣接點差動對。第五電氣接點陣列708係實質上位於第二端部殼體310的該等通道內,如第七圖所示。 The seventh diagram depicts a plurality of electrical contact arrays disposed in the channels of housing assemblies 306, 308, and 310. In the seventh diagram, the first electrical contact array 702 is substantially located in the channels on one of the first sides of the central housing 308; the third electrical contact array 704 is substantially located in the central housing 308. Within the channels on the second side. In one implementation, the first electrical contact array 702 is different from a portion of the differential pair array of the third electrical contact array 704. In this embodiment, the first electrical contact array 702 is paired with an electrical contact array 706 to form a first plurality of electrical contact differential pairs. Electrical contact array 706 is located substantially within the channels of first end housing 306, as shown in FIG. The third electrical contact array 704 is paired with a fifth electrical contact array 708 to form a second plurality of electrical contact differential pairs. The fifth electrical contact array 708 is substantially within the channels of the second end housing 310, as shown in the seventh diagram.

當第一電氣接點陣列702實質上位於中央殼體308的該第一側面上之該等複數個通道中時,電氣接點 陣列706係實質上位於第一端部殼體306之該等複數個通道內,且第一端部殼體306係耦接於中央殼體308,第一電氣接點陣列702的各電氣接點係與電氣接點陣列706的一電氣接點相鄰。在某些實作例中,第一電氣接點陣列702與電氣接點陣列706係位於該等複數個通道內,使得在整個薄片組件210上相鄰電氣接點之間的距離係實質相等。同時,第一電氣接點陣列702與電氣接點陣列706的該等相鄰電氣接點係形成連續的電氣接點對。在某些實作例中,該等電氣接點對係電氣接點差動對,舉例而言,該等電氣接點對可用於差動發訊。 When the first electrical contact array 702 is substantially located in the plurality of channels on the first side of the central housing 308, the electrical contacts The array 706 is substantially located in the plurality of channels of the first end housing 306, and the first end housing 306 is coupled to the central housing 308, and the electrical contacts of the first electrical contact array 702 It is adjacent to an electrical contact of the electrical contact array 706. In some implementations, the first electrical contact array 702 and the electrical contact array 706 are located within the plurality of channels such that the distance between adjacent electrical contacts on the entire wafer assembly 210 is substantially equal. At the same time, the first electrical contact array 702 and the adjacent electrical contacts of the electrical contact array 706 form a continuous electrical contact pair. In some implementations, the electrical contacts are differential pairs of electrical contacts, for example, the electrical contact pairs can be used for differential signaling.

同樣地,當第三電氣接點陣列704實質上位於中央殼體308的該第二側面上之該等複數個通道內時,第五電氣接點陣列708係實質上位於第二端部殼體310的該等複數個通道內,且第二端部殼體310係耦接於中央殼體308,第三電氣接點陣列704的各電氣接點係實質上與第五電氣接點陣列708之一電氣接點相鄰。在某些實作例中,第三與第五電氣接點陣列704、708的該等相鄰電氣接點形成連續的電氣接點對,例如電氣接點之差動發訊對。 Similarly, when the third electrical contact array 704 is substantially within the plurality of channels on the second side of the central housing 308, the fifth electrical contact array 708 is substantially located in the second end housing In the plurality of channels of the 310, the second end housing 310 is coupled to the central housing 308, and the electrical contacts of the third electrical contact array 704 are substantially opposite to the fifth electrical contact array 708. An electrical contact is adjacent. In some implementations, the adjacent electrical contacts of the third and fifth electrical contact arrays 704, 708 form a continuous pair of electrical contacts, such as a differential signaling pair of electrical contacts.

在某些實作例中,對於各電氣接點對而言,該一電氣接點陣列的該電氣接點鏡射(mirror)另一電氣接點陣列之該相鄰電氣接點。鏡射該電氣接點對之該等電氣接點可提供製造上的優勢以及高速電氣性能之行對行一致性,同時仍於成對的兩行中提供獨特結構。 In some implementations, for each electrical contact pair, the electrical contacts of the array of electrical contacts mirror the adjacent electrical contacts of another array of electrical contacts. Mirroring the electrical contacts to the electrical contacts provides manufacturing advantages as well as high-speed electrical performance in line alignment while still providing a unique structure in pairs of two rows.

殼體組件306、308和310中的該等電氣接點通道 係襯以一絕緣層,例如包覆成型之塑膠介電質,因此當電氣接點陣列702、704、706、708實質上位於其各別通道內時,該絕緣層使該等電氣接點與殼體組件306、308、310的該傳導表面電氣隔離。在其他實作例中,該絕緣層係直接施加至電氣接點陣列702、704、706、708,以使該等陣列的傳導性部分與該等電氣接點通道的該等導電表面電氣隔離。在電氣接點陣列702、704、706、708已經位於殼體組件306、308、310之後,殼體306、308、310係接合在一起以形成電氣連接器系統202的多個薄片組件210。 The electrical contact channels in the housing assemblies 306, 308, and 310 Lining an insulating layer, such as overmolded plastic dielectric, such that when the electrical contact arrays 702, 704, 706, 708 are substantially in their respective channels, the insulating layer allows the electrical contacts to The conductive surfaces of the housing components 306, 308, 310 are electrically isolated. In other implementations, the insulating layer is applied directly to the electrical contact arrays 702, 704, 706, 708 to electrically isolate the conductive portions of the array from the electrically conductive surfaces of the electrical contact channels. After the electrical contact arrays 702, 704, 706, 708 have been located at the housing assemblies 306, 308, 310, the housings 306, 308, 310 are joined together to form a plurality of sheet assemblies 210 of the electrical connector system 202.

電氣接點陣列702、704、706、708係各界定複數個訊號基板接合元件(例如固定連接器304),其大小可延伸通過該等殼體的一固定端,並連接於基板的複數個第一訊號貫孔。陣列702、704、706、708之每一者也界定複數個匹配連接器302,其大小可延伸通過該等殼體的匹配端,並接合於基板的對應匹配連接器或中間連接器。 The electrical contact arrays 702, 704, 706, 708 each define a plurality of signal substrate bonding components (eg, fixed connectors 304) sized to extend through a fixed end of the housing and to connect to the plurality of substrates A signal through hole. Each of the arrays 702, 704, 706, 708 also defines a plurality of mating connectors 302 sized to extend through mating ends of the housings and to engage corresponding mating connectors or intermediate connectors of the substrate.

在某些實作例中,中央殼體308包含一接地屏蔽部710,其延伸通過或嵌於中央殼體308的一部分。接地屏蔽部710係固定至中央殼體308的一外表面或成為中央殼體308的一整體部分。該接地屏蔽部係包含複數個接地垂片712,其大小可延伸通過中央殼體308的該匹配端,並阻擋電氣接點陣列之各匹配連接器302之間的視線(line-of-sight)。在某些實作例中,其中一個接地匹配垂片712係位於一對匹配連接器上方,而另一接地匹配垂片712係位於該對匹配連接器下方。舉例而言,接地垂片712係彼此隔開,使得一對匹配連接器可裝配於相鄰匹配垂片712間的空間中。In some implementations, the central housing 308 includes a ground shield 710 that extends through or is embedded in a portion of the central housing 308. The ground shield 710 is secured to an outer surface of the central housing 308 or becomes an integral part of the central housing 308. The ground shield includes a plurality of ground tabs 712 sized to extend through the mating end of the central housing 308 and to block line-of-sight between the mating connectors 302 of the array of electrical contacts. . In some implementations, one of the ground-matching tabs 712 is above a pair of mating connectors and the other ground-matching tab 712 is below the pair of mating connectors. For example, the ground tabs 712 are spaced apart from one another such that a pair of mating connectors can fit into the space between adjacent mating tabs 712.

如第八圖所示,某些實作例也可包含一接地屏蔽部802,其耦接於其中一個端部殼體。第八圖繪示了耦接於端部殼體310的接地屏蔽部802。接地屏蔽部802係固定至端部殼體310的外表面或成為端部殼體310的一整體部分。與第七圖中繪示為耦接於中央殼體308之接地屏蔽部710類似,接地屏蔽部802係包含複數個接地垂片804,其大小可延伸通過端部殼體310的該匹配端,且阻擋了電氣接點陣列的各匹配連接器302之間的視線。As shown in the eighth embodiment, some embodiments may also include a ground shield 802 coupled to one of the end housings. The eighth figure illustrates the ground shield 802 coupled to the end housing 310. The ground shield 802 is secured to the outer surface of the end housing 310 or becomes an integral part of the end housing 310. Similar to the ground shield 710 illustrated in FIG. 7 as being coupled to the central housing 308, the ground shield 802 includes a plurality of ground tabs 804 sized to extend through the mating end of the end housing 310. And the line of sight between the mating connectors 302 of the electrical contact array is blocked.

第七圖繪示了具有一個中央殼體與兩個端部殼體的一個實作例,其會產生兩個差動對陣列(由四個電氣接點陣列702、704、706、708所形成)。或者是,中央殼體308的多個實例可用以形成具有更大量陣列,因而可產生更大量差動對陣列之電氣連接器。在此替代實作例中,一電氣接點陣列係實質上位於類似於中央殼體308之另一雙側中央殼體的該等通道內。此額外陣列係具有陣列702、704、706、708其中之一之差動對的一半;舉例而言,若該額外中央殼體係位於第一端部殼體306與中央殼體308之間,則位於該額外中央殼體之該陣列係與陣列702或陣列706其中一個成對,端視該額外陣列是位於該額外中央殼體的哪一側而定。同樣地,若該額外中央殼體係位於第二端部殼體310與中央殼體308之間,則位於該額外中央殼體中的該陣列係與陣列704或陣列708其中一個成對,端視該額外陣列是位於該額外中央殼體的哪一側而定。The seventh diagram depicts an embodiment having a central housing and two end housings that create two differential pair arrays (formed by four electrical contact arrays 702, 704, 706, 708) . Alternatively, multiple instances of the central housing 308 can be used to form an electrical connector having a larger number of arrays, thus creating a larger number of differential pair arrays. In this alternative embodiment, an array of electrical contacts is located substantially within the channels of the other two-sided central housing of the central housing 308. This additional array has half of the differential pair of one of the arrays 702, 704, 706, 708; for example, if the additional central housing is between the first end housing 306 and the central housing 308, then The array located in the additional central housing is paired with one of the arrays 702 or arrays 706, depending on which side of the additional central housing the additional array is located on. Likewise, if the additional central housing is between the second end housing 310 and the central housing 308, the array in the additional central housing is paired with one of the array 704 or array 708. The additional array is depending on which side of the additional central housing.

某些實作例則包含了位於中央殼體308兩側上的中央殼體308之實例。在有三個中央殼體308及兩個端部殼體306、310的實作例中,可容納八個電氣接點陣列以形成四對陣列。在該第一端部殼體中的一第一電氣接點陣列係與該第一中央殼體的該第一側上的第二電氣接點陣列成對;在該第一中央殼體的該第二側上的第三電氣接點陣列係與該第二中央殼體的該第一側上的第四電氣接點陣列成對;在該第二中央殼體的該第二側上的第五電氣接點陣列係與在該第三中央殼體的該第一側上的第六電氣接點陣列成對;最後,在該第三中央殼體的該第二側上的第七電氣接點陣列係與在該第二端部殼體中的第八電氣接點陣列成對。其他的替代例可包含更多的中央殼體,如第三圖所示之該電氣連接器系統,其包含了五個中央殼體。Some implementations include an example of a central housing 308 located on either side of the central housing 308. In an embodiment with three central housings 308 and two end housings 306, 310, eight electrical contact arrays can be accommodated to form four pairs of arrays. A first electrical contact array in the first end housing is paired with a second electrical contact array on the first side of the first central housing; a third electrical contact array on the second side is paired with a fourth electrical contact array on the first side of the second central housing; on the second side of the second central housing The fifth electrical contact array is paired with the sixth electrical contact array on the first side of the third central housing; and finally, the seventh electrical connection on the second side of the third central housing The array of dots is paired with an array of eighth electrical contacts in the second end housing. Other alternatives may include more central housings, such as the electrical connector system shown in Figure 3, which includes five central housings.

第九圖為可連接多個基板之另一電氣連接器系統902的立體圖。在一實作例中,電氣連接器系統902具有連接於一第一基板之一固定端904以及連接於一第二基板之一匹配端906。與該第一基板或該第二基板的該等連接可為直接或可透過一介面連接器。當接合於電氣連接器系統902時,該等第一與第二基板是以實質上垂直的關係排列。The ninth view is a perspective view of another electrical connector system 902 that can connect multiple substrates. In one embodiment, the electrical connector system 902 has a fixed end 904 coupled to a first substrate and a mating end 906 coupled to a second substrate. The connections to the first substrate or the second substrate may be direct or permeable to an interface connector. When joined to electrical connector system 902, the first and second substrates are arranged in a substantially perpendicular relationship.

電氣連接器系統902包含一或多個薄片殼體908、一或多個薄片組件910、一或多個接地屏蔽部912以及一或多個整線器914。此外,電氣連接器系統902係包含一或多個接地電位連接組件,其於多個薄片組件910與該基板之間提供一共同接地電位。舉例而言,電氣連接器系統902包含一或多個接地片,其係於電氣連接器系統902的固定端904處耦接於薄片組件910與該基板之間,如美國專利申請號12/641,904中所描述者。Electrical connector system 902 includes one or more sheet housings 908, one or more sheet assemblies 910, one or more ground shields 912, and one or more liners 914. In addition, electrical connector system 902 includes one or more ground potential connection assemblies that provide a common ground potential between a plurality of wafer assemblies 910 and the substrate. For example, electrical connector system 902 includes one or more ground lugs that are coupled between sheet assembly 910 and the substrate at a fixed end 904 of electrical connector system 902, such as U.S. Patent Application Serial No. 12/641,904 Described in the article.

在一實作例中,薄片殼體908、接地屏蔽部912與整線器914係實質上與上述之電氣連接器系統202的薄片殼體208、接地屏蔽部212及整線器214相似。電氣連接器系統202與電氣連接器系統902的該等各種組件之間的一個差異處在於:電氣連接器系統902的該等組件可具有不同於電氣連接器系統202之大小或配置。該等大小或配置差異係用以容納電氣連接器系統202之薄片組件210與電氣連接器系統902之薄片組件910之間的該等大小及/或配置差異。舉例而言,第九圖中所示之薄片組件910可包含較寬的殼體組件,其大小係可容納額外的電氣接點陣列。In one embodiment, the sheet housing 908, the ground shield 912, and the splicer 914 are substantially similar to the sheet housing 208, ground shield 212, and aligner 214 of the electrical connector system 202 described above. One difference between the electrical connector system 202 and the various components of the electrical connector system 902 is that the components of the electrical connector system 902 can have a different size or configuration than the electrical connector system 202. The size or configuration differences are used to accommodate such size and/or configuration differences between the sheet assembly 210 of the electrical connector system 202 and the sheet assembly 910 of the electrical connector system 902. For example, the sheet assembly 910 shown in the ninth figure can include a wider housing assembly sized to accommodate an additional array of electrical contacts.

第十圖為電氣連接器系統902之部分分解圖,其繪示了自薄片殼體908脫離的其中一個薄片組件910。第十圖所示之電氣連接器系統902包含三個薄片組件910,在其他實作例中,電氣連接器系統902可包含不同數量的薄片組件910。電氣連接器系統902中薄片組件910的數量可客製化以符合該應用之該等需求。薄片組件910之每一者可包含一殼體組件1002、多個電氣接點陣列(在第十圖中僅可見該等電氣接點陣列的匹配連接器302與固定連接器304)以及一或多個接地屏蔽部912。The tenth view is a partially exploded view of electrical connector system 902 showing one of the sheet assemblies 910 detached from sheet housing 908. The electrical connector system 902 shown in the tenth diagram includes three wafer assemblies 910. In other embodiments, the electrical connector system 902 can include a different number of wafer assemblies 910. The number of sheet assemblies 910 in the electrical connector system 902 can be customized to meet the needs of the application. Each of the sheet assemblies 910 can include a housing assembly 1002, a plurality of electrical contact arrays (only the mating connectors 302 and the fixed connectors 304 of the electrical contact array are visible in the tenth figure), and one or more Ground shield 912.

第十一圖更詳細繪示了殼體組件1002。在一實作例中,殼部組件1002包含一傳導表面,其界定複數個通道,通道的大小係可容置一或多個電氣接點陣列。殼體組件1002包含在殼體組件1002之每一側面上的複數個通道。舉例而言,殼體組件1002包含在殼體組件1002之第一側面上的第一複數個通道1102以及在殼體組件1002之第二側面上的第二複數個通道1104。因此,殼體組件1002可於每一側上容納一電氣接點陣列。在殼體組件1002之該第一側面上的通道1102實質上類似於在殼體組件1002的該第二側面上的通道1104。殼體組件1002係由與上述殼體組件306、308與310之類似材料所形成。The eleventh figure illustrates the housing assembly 1002 in more detail. In one embodiment, the shell assembly 1002 includes a conductive surface that defines a plurality of channels that are sized to receive one or more arrays of electrical contacts. The housing assembly 1002 includes a plurality of passages on each side of the housing assembly 1002. For example, the housing assembly 1002 includes a first plurality of channels 1102 on a first side of the housing assembly 1002 and a second plurality of channels 1104 on a second side of the housing assembly 1002. Thus, the housing assembly 1002 can house an array of electrical contacts on each side. The channel 1102 on the first side of the housing assembly 1002 is substantially similar to the channel 1104 on the second side of the housing assembly 1002. Housing assembly 1002 is formed from a similar material to housing assemblies 306, 308 and 310 described above.

第十二圖繪示了置於殼體組件1002之通道1102、1104中的多個電氣接點陣列1202、1204、1206、1208。電氣接點陣列1202、1204、1206、1208係與上述如第七圖所示之電氣接點陣列702、704、706、708相同、或實質上類似。舉例而言,電氣接點陣列1202、1204、1206、1208之每一者係包含複數個電氣路徑、可包含一包覆成型之絕緣層、且可包含基板接合元件(例如匹配連接器302與固定連接器304)。A twelfth diagram depicts a plurality of electrical contact arrays 1202, 1204, 1206, 1208 disposed in channels 1102, 1104 of housing assembly 1002. Electrical contact arrays 1202, 1204, 1206, 1208 are identical or substantially similar to electrical contact arrays 702, 704, 706, 708 as described above in FIG. For example, each of the electrical contact arrays 1202, 1204, 1206, 1208 includes a plurality of electrical paths, may include an overmolded insulating layer, and may include substrate bonding components (eg, mating connectors 302 and fixed) Connector 304).

在第十二圖中,電氣接點陣列1202與電氣接點陣列1204係實質上位於殼體組件1002之該第一側面上的通道1102內,殼體組件1002之該第一側面上的通道1102之大小係可包圍多個電氣接點陣列,例如電氣接點陣列1202與電氣接點陣列1204兩者。同樣地,電氣接點陣列1206與電氣接點陣列1208係實質上位於殼體組件1002之該第二側面上的通道1104內,殼體組件1002之該第二側面上的通道1104之大小係可包圍多個電氣接點陣列,例如電氣接點陣列1206與電氣接點陣列1208兩者。In the twelfth figure, the electrical contact array 1202 and the electrical contact array 1204 are substantially located in the channel 1102 on the first side of the housing assembly 1002, and the channel 1102 on the first side of the housing assembly 1002 The size can encompass a plurality of electrical contact arrays, such as both electrical contact array 1202 and electrical contact array 1204. Similarly, the electrical contact array 1206 and the electrical contact array 1208 are substantially located within the channel 1104 on the second side of the housing assembly 1002, and the size of the channel 1104 on the second side of the housing assembly 1002 is A plurality of electrical contact arrays are enclosed, such as both electrical contact array 1206 and electrical contact array 1208.

殼體組件1002中的電氣接點通道1102與1104係襯以一絕緣層,例如一包覆成型之塑膠介電質,因此當該等電氣接點陣列實質位於其各別通道中時,該絕緣層使該等陣列之該等電氣接點與殼體組件1002的該傳導表面電氣隔離。在其他實作例中,該絕緣層係直接施加至該等電氣接點陣列,以電氣隔離該等陣列的傳導性部分與該等電氣接點通道的該等導電表面。The electrical contact channels 1102 and 1104 in the housing assembly 1002 are lined with an insulating layer, such as a overmolded plastic dielectric, such that when the electrical contact arrays are substantially in their respective channels, the insulation The layers electrically isolate the electrical contacts of the array from the conductive surface of the housing assembly 1002. In other embodiments, the insulating layer is applied directly to the array of electrical contacts to electrically isolate the conductive portions of the array from the conductive surfaces of the electrical contact channels.

在一實作例中,電氣接點陣列1202係與電氣接點陣列1204成對,以形成一第一複數個電氣接點差動對。電氣接點陣列1206係與電氣接點陣列1208成對,以形成一第二複數個電氣接點差動對。In one embodiment, the electrical contact array 1202 is paired with the electrical contact array 1204 to form a first plurality of electrical contact differential pairs. Electrical contact array 1206 is paired with electrical contact array 1208 to form a second plurality of electrical contact differential pairs.

當電氣接點陣列1202與電氣接點陣列1204實質上位於殼體組件1002之該第一側上的複數個通道1102內時,電氣接點陣列1202的各電氣接點係與電氣接點陣列1204的一電氣接點相鄰。在某些實作例中,電氣接點陣列1202與1204係位於該等複數個通道內,使得在該整個薄片組件間,相鄰電氣接點之間的距離係實質相等。同時,電氣接點陣列1202、1204的該等相鄰電氣接點形成了連續的電氣接點對。在某些實作例中,電氣接點對係電氣接點差動對。舉例而言,該等電氣接點對可用於差動發訊。When the electrical contact array 1202 and the electrical contact array 1204 are substantially located in the plurality of channels 1102 on the first side of the housing assembly 1002, the electrical contacts of the electrical contact array 1202 and the electrical contact array 1204 An electrical contact is adjacent. In some implementations, electrical contact arrays 1202 and 1204 are located within the plurality of channels such that the distance between adjacent electrical contacts is substantially equal between the entire sheet assemblies. At the same time, the adjacent electrical contacts of the electrical contact arrays 1202, 1204 form a continuous pair of electrical contacts. In some implementations, the electrical contacts are differential pairs of electrical contacts. For example, the pairs of electrical contacts can be used for differential signaling.

同樣地,當電氣接點陣列1206與電氣接點陣列1208實質上位於殼體組件1002之該第二側上的複數個通道1104內時,電氣接點陣列1206的各電氣接點係與電氣接點陣列1208的一電氣接點相鄰。在某些實作例中,電氣接點陣列1206、1208的該等相鄰電氣接點係形成連續的電氣接點對,例如電氣接點之差動發訊對。Similarly, when the electrical contact array 1206 and the electrical contact array 1208 are substantially located within the plurality of channels 1104 on the second side of the housing assembly 1002, the electrical contacts of the electrical contact array 1206 are electrically connected. An electrical contact of the dot array 1208 is adjacent. In some implementations, the adjacent electrical contacts of the electrical contact arrays 1206, 1208 form a continuous pair of electrical contacts, such as differential signaling pairs of electrical contacts.

第十三圖繪示了裝配至殼體組件1002中該等通道內的多個電氣接點陣列。施加至該等電氣接點陣列之一絕緣層(例如該包覆成型之絕緣層)係使一電氣接點陣列的至少一部分與該相鄰的電氣接點陣列電氣隔離。第十三圖也繪示了在殼體組件1002之兩側上耦接於殼體組件1002之接地屏蔽部912與接地屏蔽部1302。或者是,接地屏蔽部係僅耦接於殼體組件1002的一側。接地屏蔽部912與1302可固定至殼體1002的外表面或可成為殼體組件1002的整體部分。在一實作例中,接地屏蔽部1302包含一表面,其分隔電氣接點陣列1202、1204以及一相鄰殼體組件中所包圍的電氣接點陣列。同樣地,接地屏蔽部912包含一表面,其分隔電氣接點陣列1206、1208以及一不同相鄰殼體組件中所包圍的電氣接點陣列。與第七圖中繪示之耦接於中央殼體308的接地屏蔽部710類似,第十三圖中的接地屏蔽部912與1302可包含複數個接地垂片1304,其大小可延伸通過殼體組件1002的該匹配端且阻擋一電氣接點陣列的各匹配連接器302之間的視線。A thirteenth diagram depicts a plurality of electrical contact arrays assembled into the channels in the housing assembly 1002. An insulating layer (e.g., the overmolded insulating layer) applied to one of the array of electrical contacts electrically isolates at least a portion of an array of electrical contacts from the array of adjacent electrical contacts. The thirteenth figure also illustrates the ground shield 912 and the ground shield 1302 coupled to the housing assembly 1002 on both sides of the housing assembly 1002. Alternatively, the ground shield is coupled to only one side of the housing assembly 1002. The ground shields 912 and 1302 can be secured to an outer surface of the housing 1002 or can be an integral part of the housing assembly 1002. In one embodiment, the ground shield 1302 includes a surface that separates the array of electrical contacts 1202, 1204 and an array of electrical contacts enclosed in an adjacent housing assembly. Similarly, ground shield 912 includes a surface that separates electrical contact arrays 1206, 1208 and an array of electrical contacts that are enclosed within a different adjacent housing assembly. Similar to the ground shield 710 coupled to the central housing 308, the ground shields 912 and 1302 of the thirteenth diagram may include a plurality of ground tabs 1304 that extend in size through the housing. The mating end of assembly 1002 also blocks the line of sight between each mating connector 302 of an array of electrical contacts.

102...背板連接器系統102. . . Backplane connector system

104...第一基板104. . . First substrate

106...第二基板106. . . Second substrate

202...電氣連接器系統202. . . Electrical connector system

204...固定端204. . . Fixed end

206...匹配端206. . . Matching end

208...薄片殼體208. . . Sheet shell

210...薄片組件210. . . Sheet assembly

212...接地屏蔽部212. . . Ground shield

214...整線器214. . . Wire conditioner

216...孔洞216. . . Hole

302...匹配連接器302. . . Matching connector

304...固定連接器304. . . Fixed connector

306...第一端部殼體306. . . First end housing

308...中央殼體308. . . Central housing

310...第二端部殼體310. . . Second end housing

402...通道402. . . aisle

404...通道404. . . aisle

406‧‧‧第一電氣接點通道 406‧‧‧First electrical contact channel

408‧‧‧第二電氣接點通道 408‧‧‧Second electrical contact channel

502‧‧‧第一電氣接點陣列 502‧‧‧First electrical contact array

504‧‧‧第二電氣接點陣列 504‧‧‧Second electrical contact array

506‧‧‧電氣路徑 506‧‧‧Electrical Path

508‧‧‧電氣路徑 508‧‧‧Electrical Path

510‧‧‧製造框體 510‧‧‧Manufacture of frames

602‧‧‧包覆成型的絕緣層 602‧‧‧Overmolded insulation

702‧‧‧第一電氣接點陣列 702‧‧‧First electrical contact array

704‧‧‧第三電氣接點陣列 704‧‧‧ Third electrical contact array

706‧‧‧電氣接點陣列 706‧‧‧Electrical contact array

708‧‧‧第五電氣接點陣列 708‧‧‧ Fifth electrical contact array

710‧‧‧接地屏蔽部 710‧‧‧Ground shield

712‧‧‧接地垂片 712‧‧‧ Grounding tabs

802‧‧‧接地屏蔽部 802‧‧‧ Grounding Shield

804‧‧‧接地垂片 804‧‧‧ Grounding tabs

902‧‧‧電氣連接器系統 902‧‧‧Electrical connector system

904‧‧‧固定端 904‧‧‧Fixed end

906‧‧‧匹配端 906‧‧‧Matching end

908‧‧‧薄片殼體 908‧‧‧Sheet shell

910‧‧‧薄片組件 910‧‧‧Sheet assembly

912‧‧‧接地屏蔽部 912‧‧‧Ground shield

914‧‧‧整線器 914‧‧‧ Threader

1002‧‧‧殼體組件/殼體 1002‧‧‧Shell assembly/housing

1102‧‧‧通道 1102‧‧‧ channel

1104‧‧‧通道 1104‧‧‧ channel

1202‧‧‧電氣接點陣列 1202‧‧‧Electrical contact array

1204‧‧‧電氣接點陣列 1204‧‧‧Electrical contact array

1206‧‧‧電氣接點陣列 1206‧‧‧Electrical contact array

1208‧‧‧電氣接點陣列 1208‧‧‧Electrical contact array

1302‧‧‧接地屏蔽部 1302‧‧‧Ground shield

第一圖為連接一第一基板至一第二基板之背板連接器系統的圖式。The first figure is a diagram of a backplane connector system connecting a first substrate to a second substrate.

第二圖為包含多個薄片組件之電氣連接器系統的立體圖。The second figure is a perspective view of an electrical connector system including a plurality of wafer assemblies.

第三圖為第二圖之該電氣連接器系統的另一視圖。The third view is another view of the electrical connector system of the second figure.

第四圖繪示了第二圖之該電氣連接器系統的一中央殼體與兩個端部殼體。The fourth figure depicts a central housing and two end housings of the electrical connector system of the second figure.

第五圖繪示了第二圖之該電氣連接器系統的電氣接點陣列。The fifth figure depicts the electrical contact array of the electrical connector system of the second figure.

第六圖繪示了第二圖之該電氣連接器系統的包覆成型之電氣接點陣列。Figure 6 is a diagram showing the overmolded electrical contact array of the electrical connector system of the second figure.

第七圖繪示了置於第四圖之該等殼體組件中的通道內之電氣接點陣列。The seventh figure depicts an array of electrical contacts disposed in the channels in the housing assemblies of the fourth figure.

第八圖繪示了與第四圖之其中一個端部殼體耦接的接地屏蔽部。The eighth figure illustrates a ground shield coupled to one of the end housings of the fourth figure.

第九圖為包含多個薄片組件的另一電氣連接器系統的立體圖。The ninth diagram is a perspective view of another electrical connector system including a plurality of wafer assemblies.

第十圖為第九圖之該電氣連接器系統的部分分解圖。Figure 11 is a partially exploded view of the electrical connector system of the ninth diagram.

第十一圖繪示了第九圖之該電氣連接器系統的一殼體組件。An eleventh drawing illustrates a housing assembly of the electrical connector system of the ninth embodiment.

第十二圖繪示了置於第十一圖之該殼體組件中的通道內之電氣接點陣列。Figure 12 illustrates an array of electrical contacts disposed in a channel in the housing assembly of Figure 11.

第十三圖繪示了與第十一圖之該殼體組件耦接的兩接地屏蔽部。Figure 13 illustrates two ground shields coupled to the housing assembly of Figure 11.

202...電氣連接器系統202. . . Electrical connector system

204...固定端204. . . Fixed end

206...匹配端206. . . Matching end

208...薄片殼體208. . . Sheet shell

210...薄片組件210. . . Sheet assembly

212...接地屏蔽部212. . . Ground shield

214...整線器214. . . Wire conditioner

216...孔洞216. . . Hole

Claims (4)

一種電氣連接器系統,其特徵在於:一第一中央殼體,其界定在該第一中央殼體之一第一側面上的複數個第一電氣接點通道以及在該第一中央殼體之一第二側面上的複數個第二電氣接點通道;一第一電氣接點陣列,其實質上位於該第一中央殼體之該第一側面上的前述複數個第一電氣接點通道內,且該第一電氣接點陣列界定複數個匹配連接器,其大小係可延伸通過該第一中央殼體之一匹配端且接合於一基板的對應匹配連接器;一第二中央殼體,其界定在該第二中央殼體之一第一側面上的複數個第一電氣接點通道以及在該第二中央殼體之一第二側面上的複數個第二電氣接點通道;一第二電氣接點陣列,其實質上位於該第二中央殼體之該第二側面上的前述複數個第二電氣接點通道內;以及一接地屏蔽部,其耦接於該第一中央殼體,其中該接地屏蔽部包含複數個接地垂片,其大小係可延伸通過該第一中央殼體的該匹配端且阻擋該第一電氣接點陣列之各匹配連接器之間的一視線;其中該等第一與第二中央殼體係於該電氣連接器系統中彼此相鄰,使得該第一電氣接點陣列與該第二電氣接點陣列相鄰以形成複數個電氣接點差動對。 An electrical connector system characterized by: a first central housing defining a plurality of first electrical contact channels on a first side of the first central housing and in the first central housing a plurality of second electrical contact channels on a second side; a first electrical contact array substantially located in the plurality of first electrical contact channels on the first side of the first central housing And the first electrical contact array defines a plurality of mating connectors sized to extend through a matching end of the first central housing and to engage a corresponding mating connector of a substrate; a second central housing, a plurality of first electrical contact channels defined on a first side of the second central housing and a plurality of second electrical contact channels on a second side of the second central housing; An electrical contact array substantially in the plurality of second electrical contact channels on the second side of the second central housing; and a ground shield coupled to the first central housing Where the ground shield contains a plurality of grounding tabs sized to extend through the mating end of the first central housing and to block a line of sight between the mating connectors of the first array of electrical contacts; wherein the first and second The central housings are adjacent one another in the electrical connector system such that the first electrical contact array is adjacent to the second electrical contact array to form a plurality of electrical contact differential pairs. 如申請專利範圍第1項之電氣連接器系統,更包含:一第三電氣接點陣列,其實質上位於該第一中央殼體之該第二側面的前述複數個第二電氣接點通道內;以及一第四電氣接點陣列,其實質上位於該第二中央殼體之該第一側面的前述複數個第一電氣接點通道內;其中該第三電氣接點陣列係與一第五電氣接點陣列成對以形成一第二複數個電氣接點差動對,且其中該第四電氣接點陣列係與一第六電氣接點陣列成對以形成一第三複數個電氣接點差動對。 The electrical connector system of claim 1, further comprising: a third electrical contact array substantially located in the plurality of second electrical contact channels of the second side of the first central housing And a fourth electrical contact array substantially in the plurality of first electrical contact channels of the first side of the second central housing; wherein the third electrical contact array is coupled to a fifth The electrical contact arrays are paired to form a second plurality of electrical contact differential pairs, and wherein the fourth electrical contact array is paired with a sixth electrical contact array to form a third plurality of electrical contacts Differential pair. 如申請專利範圍第2項之電氣連接器系統,更包含一第三中央殼體,其界定在該第三中央殼體之一第一側面上的複數個第一電氣接點通道以及在該第三中央殼體之一第二側面上的複數個第二電氣接點通道,其中該第三中央殼體設置在該第三中央殼體之該第一側面上的前述複數個第一電氣接點通道中的該第五電氣接點陣列。 The electrical connector system of claim 2, further comprising a third central housing defining a plurality of first electrical contact passages on a first side of the third central housing and at the a plurality of second electrical contact channels on a second side of the third central housing, wherein the third central housing is disposed on the first plurality of first electrical contacts on the first side of the third central housing The fifth electrical contact array in the channel. 如申請專利範圍第2項之電氣連接器系統,更包含一端部殼體,其界定在該端部殼體之一側面上的複數個電氣接點通道,其中該端部殼體設置在該端部殼體之該側面上的前述複數個電氣接點通道中的該第五電氣接點陣列。 The electrical connector system of claim 2, further comprising an end housing defining a plurality of electrical contact passages on one side of the end housing, wherein the end housing is disposed at the end The fifth electrical contact array of the plurality of electrical contact channels on the side of the housing.
TW100106153A 2010-02-26 2011-02-24 Electrical connector system TWI580122B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/713,741 US8157591B2 (en) 2008-12-05 2010-02-26 Electrical connector system

Publications (2)

Publication Number Publication Date
TW201145706A TW201145706A (en) 2011-12-16
TWI580122B true TWI580122B (en) 2017-04-21

Family

ID=44982229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100106153A TWI580122B (en) 2010-02-26 2011-02-24 Electrical connector system

Country Status (2)

Country Link
CN (1) CN102255158A (en)
TW (1) TWI580122B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8535065B2 (en) * 2012-01-09 2013-09-17 Tyco Electronics Corporation Connector assembly for interconnecting electrical connectors having different orientations
US9812817B1 (en) * 2017-01-27 2017-11-07 Te Connectivity Corporation Electrical connector having a mating connector interface

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070155239A1 (en) * 2004-01-09 2007-07-05 Kouji Nakada Connector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6231391B1 (en) * 1999-08-12 2001-05-15 Robinson Nugent, Inc. Connector apparatus
US6116926A (en) * 1999-04-21 2000-09-12 Berg Technology, Inc. Connector for electrical isolation in a condensed area
CA2381145A1 (en) * 1999-08-17 2001-02-22 Litton Systems, Inc. High density electrical interconnect system having enhanced grounding and cross-talk reduction capability
US6224432B1 (en) * 1999-12-29 2001-05-01 Berg Technology, Inc. Electrical contact with orthogonal contact arms and offset contact areas
US6293827B1 (en) * 2000-02-03 2001-09-25 Teradyne, Inc. Differential signal electrical connector
DE202005020474U1 (en) * 2005-12-31 2006-02-23 Erni Elektroapparate Gmbh Connectors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070155239A1 (en) * 2004-01-09 2007-07-05 Kouji Nakada Connector

Also Published As

Publication number Publication date
CN102255158A (en) 2011-11-23
TW201145706A (en) 2011-12-16

Similar Documents

Publication Publication Date Title
US8157591B2 (en) Electrical connector system
US7931500B2 (en) Electrical connector system
TWI583067B (en) Electrical connector system
US7967637B2 (en) Electrical connector system
TWI583076B (en) Electrical connector system
CN109411957B (en) High speed interconnect assembly
CN107623202B (en) Mating interface for high speed high density electrical connector
US8187034B2 (en) Electrical connector system
TWI424638B (en) Performance enhancing contact module assemblies
TWI614948B (en) Orthogonal connector system with power connection
CN101427613B (en) Substrate joining member and three-dimensional structure using the same
US10559930B2 (en) Interconnection system
TWI519011B (en) Electrical connector system
US20110306244A1 (en) Cable connector assembly having an adapter plate for grounding
EP3471216B1 (en) Electrical connector
US9748697B2 (en) Pluggable connector and interconnection system configured for resonance control
CN108963512B (en) Connector module and manufacturing method thereof
US11616328B2 (en) Mating module and cable connector
JP2004164993A (en) Electric connector
TWI556518B (en) Electrical connector system
JP2015220230A (en) Electrical connector having leadframe
US10958001B2 (en) Connectors for low cost, high speed printed circuit boards
US10868392B2 (en) Ground commoning conductors for electrical connector assemblies
TWI580122B (en) Electrical connector system
US9065213B2 (en) Electrical connector for transmitting data signals