201145706 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於互連電路板或其他基板的 電氣連接器系統。 【先前技術】 ，氣連接器系統一般係用於以平行或垂直關係連 接一第一基板（例如一印刷電路板）與一第二基板（例 如另一印刷電路板）。由於電子組件的尺寸減小且電子 組件普遍變得更為複雜’通常需要在電路板或其他基板 上，小空間中安裝更多組件；因此，已經變成需要減少 ，氣連接器系統内電氣終端之間的該間隔，並增加該等 系統内所包圍之電氣終端的數量。據此，需發展一種可 以增加速度運作，同時增加該電氣連接器系統内所包圍 之電氣終端數量的電氣連接器系統。 【發明内容】 ±根據本發明，一種電氣連接器系統包含一第一中央 f體，其界定在該第—_央殼體之ϋ面上的複數 固第電氣接點通道以及在該第一中央殼體之一第二 H ΐ的複數個第二電氣接點通道。—第—電氣接點陣 :了質上位於該第一中央殼體之該第一側面上的前 Ζ ^個第"""電氣接點通勒。—第二巾央殼體界定在 i、画Τ中央殼體之—第—側面上的複數個第—電氣接 點通道以及在該第二中央殼體之一第二側面上的複數 201145706 個第二 於該第 一電轨接點通道。一第二電氣接點陣列係實質上位 雷=萆—中央殼體之該第二側面上的前述複數個第二 點通道内。該等一與第二中央殼體係於該電氣連 ，器，统中彼此相鄰，使得該第〆電氣接點陣列與該第 一電氣接點陣列相鄰以形成複數個電氣接點差動對。 【實施方式】 本發明係與連接於一或多個基板的背板連接器系 : 關。该等背板連接器系統係f以咼速（例如達至少 = =5Gbps)運作，同時在某些實作例中也可提供高接腳 f X (例如達至少每英吋有約5〇對電氣連接器）。在— 貫作例中’如第一圖所示，背板連接器系統102係用於 =平仃或垂直關係連接一第一基板104 (例如一印刷電 ^' 第一基板106 (例如另一印刷電路板）。該等 】揭，之連接器系統的實作例包含可實質上以三維方 :者板覆蓋區（backplane footprint)、背板連接器、 2 ^或子卡覆蓋區（daughtercard footPrint)間將成對的 -氣連接器（其係電氣連接器差動對）隹肉刹夕技认201145706 VI. Description of the Invention: [Technical Field] The present invention relates to an electrical connector system for interconnecting circuit boards or other substrates. [Prior Art] A gas connector system is generally used to connect a first substrate (e.g., a printed circuit board) and a second substrate (e.g., another printed circuit board) in a parallel or vertical relationship. Due to the reduced size of electronic components and the increasing complexity of electronic components, it is often necessary to mount more components in a small space on a circuit board or other substrate; therefore, it has become a need to reduce the electrical terminals in the gas connector system. This interval between and increases the number of electrical terminals enclosed within the systems. Accordingly, there is a need to develop an electrical connector system that can increase speed operation while increasing the number of electrical terminals enclosed within the electrical connector system. SUMMARY OF THE INVENTION According to the present invention, an electrical connector system includes a first central f body defining a plurality of electrical contact passages on a face of the first central housing and in the first center a plurality of second electrical contact channels of the second H 之一 of the housing. - a first electrical contact array: a front end of the first central casing on the first side of the first """"" The second central casing defines a plurality of first electrical contact passages on the first side of the central casing of the drawing frame and a plurality of 201145706 of the second side of the second central casing Second, the first rail contact channel. A second array of electrical contacts is substantially in the plurality of second point channels on the second side of the central housing. The first and second central housings are adjacent to each other in the electrical connection, such that the second electrical contact array is adjacent to the first electrical contact array to form a plurality of electrical contact differential pairs . [Embodiment] The present invention is related to a backplane connector that is connected to one or more substrates. The backplane connector systems operate at idle speeds (e.g., up to at least == 5 Gbps), while in some implementations, high pins fX are also provided (e.g., up to at least about 5 inches per inch). Connector). In the first example, as shown in the first figure, the backplane connector system 102 is used to connect a first substrate 104 (eg, a printed circuit) to a first substrate 106 (eg, another printing). Circuit board). The implementation of the connector system includes a substantially three-dimensional square: backplane footprint, backplane connector, 2^ or daughtercard footPrint Paired-gas connectors (which are electrical connector differential pairs)
縱向與高階模式的無用傳播。Useless propagation of vertical and high-order modes.
固疋端204以及連接於第二基板之- 201145706 匹配端206。與該第一基板或該第二基板之該等連接係 可為直接連接或是透過一介面連接器。當接合於電氣連 接器系統202時，該等第一與第二基板是以實質上垂直 的關係排列。電氣連接器系統202可包含一或多個薄片 殼體208、一或多個薄片組件21〇、一或多個接地屏蔽 部212以及一或多個整線器214。此外，電氣連接器系 統202包含一或多個接地電位連接組件，其於多個薄片 ，件210與該基板之間提供一共同接地電位。舉例而 δ，電氣連接器系統202包含一或多個接地片，其於電 氣連接器系統202之固定端204處耦接於薄片裝置21〇 與該基板之間，如美國專利申請號12/641，9〇4中所描述 者0 —薄片殼體2〇8用於在電氣連接器系統202内容置2 定，彼此相鄰的多個薄片組件21〇。在一實作例中，〜 ^殼體208於匹配端206處接合薄片組件21〇。在j 細中的一或多個孔洞216之大小使自薄片組^ rjc t伸的匹配連接器可通過薄片殼體208，使得該1 另一己連接器連接於與一基板相關的對應匹配連接器j 述的美國專利申請號Μ74,568中咐 側面212係耦接至一或多個薄片組件21“ 接器系：：其中一個薄片組件210的殼體。當電氣ϋThe solid end 204 is coupled to the second substrate - 201145706 mating end 206. The connections to the first substrate or the second substrate may be direct or through an interface connector. When joined to electrical connector system 202, the first and second substrates are arranged in a substantially perpendicular relationship. Electrical connector system 202 can include one or more wafer housings 208, one or more sheet assemblies 21A, one or more ground shields 212, and one or more wire organizers 214. In addition, electrical connector system 202 includes one or more ground potential connection assemblies that provide a common ground potential between the plurality of sheets, member 210 and the substrate. By way of example, the electrical connector system 202 includes one or more ground lugs that are coupled between the sheet device 21 and the substrate at the fixed end 204 of the electrical connector system 202, such as U.S. Patent Application Serial No. 12/641. The one described in 9.4 is a sheet housing 2 〇 8 for a plurality of sheet assemblies 21 彼此 adjacent to each other in the electrical connector system 202. In one embodiment, the housing 208 engages the tab assembly 21 at the mating end 206. The size of the one or more holes 216 in the j-shape allows the mating connector extending from the stack of sheets to pass through the sheet housing 208 such that the other connector is connected to a corresponding mating connector associated with a substrate The side surface 212 of the U.S. Patent Application Serial No. 74,568 is coupled to one or more of the sheet assemblies 21 "connector system: the housing of one of the sheet assemblies 210.
連^ 、备〇2固定至該基板時，接地屏蔽部212於電I (例ΓαΜ2的蚊端2G4處可包含基板接合元千 接地固定接腳）以與基板接合。 6 201145706 214係繪示為位於電氣連接器系統202的固 人04處。整線器214包含孔洞，其大小可使基板接 =件（例如該等電氣接點固定接腳）通過整線器214 亚連接於基板。 ±第三圖為電氣連接器系統202的另一視圖，其中薄 =體208與整線器214已經被移除，以暴露出薄片組 = 210的匹配連接器3〇2和固定連接器3〇4。每一個薄 片組件21G在多個基板間提供了—或多個電氣路徑陣 列。該等電氣路徑可為訊號傳輸路徑、電力傳輸路徑或 接地電位路徑。其中一個匹配連接器3〇2係位於一陣列 之各電氣路徑的一端，而其中一個固定連接器3〇4係位 於一陣列之各電氣路徑的另一端。 匹配連接器302從電氣連接器系統202的匹配端 206延伸出來，以麵接於一第一基板或另一匹配裝置， 例如一頂蓋模組。匹配連接器302為封閉式帶狀、三樑 (tH-beam)形、雙樑形、圓形、公性、母性、雙性或另 一 ^配連接器類型。同樣地，固定連接器304從電氣連 接器系統202的固定端204延伸出來，以耦接於一第二 基板或另—匹配裝置。固定連接器304可為電氣接點接 腳，其大小係可安裝於該基板的對應孔洞或貫孔中，以 產生與該基板之連接。 ,如第三圖所示，電氣連接器系統202與薄片組件21〇 ，由數種不同殼體組件所形成。舉例而言，該電氣連接 态，統係包含一或多個第一端部殼體306、一或多個中 央殼體308與一或多個第二端部殼體31〇。第三圖中所 201145706 示之電氣連接器系統202係由一個第一端部殼體306、 五個中央殼體308以及一個第二端部殼體310所形成。· 在其他實作例中也可使用不同的殼體配置，例如包含多 . 個第一端部殼體306、包含多個第二端部殼體308、使 用較少的中央殼體308、使用較多的中央殼體308等。 在電氣連接器系統202中，該等殼體組件的數量與配置 係可被客製化以符合該應用之該等需求。 第四圖更詳細繪示了電氣連接器系統202的第一端 部殼體306、中央殼體308以及第二端部殼體310。在 一實作例中，該等殼體組件之每一者包含界定複數個通 道之一傳導表面，通道的大小係可容置一或多個電氣接 點陣列。舉例而言，第一端部殼體306可包含在第一端 部殼體306之第一側面上，而非在該第二側面上的複數 個通道402。同樣地，第二端部殼體310可包含在第二 端部殼體310之一第一侧面上，但非在該第二側面上的 複數個通道404。因此，端部殼體306與310僅可容納 一側上的一電氣接點陣列。另一方面，中央殼體308可 包含在中央殼體308之各側面上的複數個通道。舉例而 言，中央殼體308可包含在中央殼體308之第一側面上 的第一複數個通道406以及在中央殼體308之第二側面 上的第二複數個通道408。因此，中央殼體308可容納 在每一側上的一電氣接點陣列。在中央殼體308之該第 一側面上的通道406係實質上類似於在中央殼體308之 該第二側面上的通道408。 第一端部殼體306、中央殼體308及/或第二端部殼 8 201145706 形成以具有一傳導表面。舉例而言，該等殼體 ，，成為鍍製之塑膠接地殼殼體；在某些實作例中，該 等殼體之每-者包讀製之歸或輯接地 二 鍍鎳（Ni)或辞（Zn)壓鑄件上覆錫（％)。在其他 作例中，該等殼體係包含鋁（A1)壓鑄件、傳導^聚合 物、金屬射出成型（injection molding)或任何其他類型 I。 >、、 之 金屬 第五圖繪示了第一電氣接點陣列5〇2 (如 2件）與第二電氣接點㈣5G4 (如第二引線框誕 間：多個電氣路徑;舉例而言，第一接點陣; 稷數個電氣路徑5G6’而第二接點陣列5G4包含複數個 ί 508。電氣路徑506、508提供了第三圖所示之 地電之該等訊號傳輸路徑、電力傳輸路徑或接 -陣列之第五圖所示，—匹配連接器3Q2係位於 電軋接點的一端，而一固定連接号 於-陣列之各電氣路徑的另一端。連接器304係位 ，氣接點陣列5。2、谢係由傳導性材料形成 ί二=上ΐ氣接點陣列502、5〇4包含麟青銅及 ’、)鍍層上覆金（Au)或錫（Sn)。在豆#管祚如 中’電氣接點陣列5〇2、賣句人紅/加在其他貫作例 料。料仰τΓ 包含何銅（Cu)合金材 斗"專鑛層可為任何貴重金屬，例如纪（ 3固^ΐϊ)或在該接觸區帽金㈤德⑽、 基底鍍芦“镡„η)或鎳（Ν0、在該下方鍍層或 層中有鎳（Ni)。電氣接點陣列502、504之每- 201145706 者係繪示於第五圖中，其具有在運作之前可被移除之一 製造框體510。 第/、圖綠示了在加入包覆成型（〇verm〇lded)之絕緣 層602 (例如包覆成型之塑膠介電質）後的電氣接點陣 列502、504。在第六圖中’第五圖所示之電氣路徑5〇6、 508之陣列係至少部分由包覆成型之絕緣層6〇2予以環 繞。包覆成型之絕緣層6〇2係使電氣路徑5〇6、5〇8之 陣列與其他傳導表面隔離。第六圖也綠示了在移除第五 圖所示之製造框體51〇後的電氣接點陣列502、504。 第七圖繪示了置於殼體組件306、308與310之通 ，中的多個電氣接點陣列。在第七圖中，第—電氣接點 二車，702係實質上位於中央殼體則之一第一側面上的 °亥等通道内，第二電氣接點陣列704係實質上位於中央 ，體308之一第二側面上的該等通道内。在一實作例 7Π4’ 電氣接點陣列7G2係不同於第二電氣接點陣列 、差動對陣列的一部分。在此實作例中，第一電氣 if，702 #與—第三電氣接點陣列706成對，以形 數個電驗點差動對。第三電氣接點陣列 當国^立於第一端部殼體3〇6的該等通道内，如 點瞌f所示。第二電氣接點陣列爾係與一第四電氣接 對。第四7Π對’以形成H數個電氣接點差動 二的甬氣Γ車列708係實質上位於第二端部殼體 的5亥專通道内，如第七圖所示。 的兮點陣列702實質上位於中央殼體期 ㈣第-側面上之料複數個通道中時，第三電氣接點 201145706 陣列706係實質上位於第一端部殼體306之該等複數個 通道内，且第一端部殼體306係耦接於中央殼體308， 第一電氣接點陣列702的各電氣接點係與第三電氣接點 陣列706的一電氣接點相鄰。在某些實作例中，第一與 第三電氣接點陣列7〇2、706係位於該等複數個通道内， 使得在整個薄片組件210上相鄰電氣接點之間的距離係 實質相等。同時，第一與第三電氣接點陣列702、706 的該等相鄰電氣接點係形成連續的電氣接點對。在某些 實作例中，該等電氣接點對係電氣接點差動對，舉例而 言，該等電氣接點對可用於差動發訊。 同樣地，當第二電氣接點陣列704實質上位於中央 殼體308的該第二側面上之該等複數個通道内時，第四 電氣接點陣列708係實質上位於第二端部殼體310的該 等複數個通道内，且第二端部殼體310係耦接於中央殼 體308，第二電氣接點陣列704的各電氣接點係實質上 與第四電氣接點陣列706之一電氣接點相鄰。在某些實 作例中，第二與第四電氣接點陣列704、708的該等相 鄰電氣接點形成連續的電氣接點對，例如電氣接點之差 動發訊對。 在某些實作例中，對於各電氣接點對而言，該一電 氣接點陣列的該電氣接點鏡射（mirror )另一電氣接點 陣列之該相鄰電氣接點。鏡射該電氣接點對之該等電氣 接點可提供製造上的優勢以及高速電氣性能之行對行 一致性，同時仍於成對的兩行中提供獨特結構。 殼體組件306、308和310中的該等電氣接點通道 201145706 係襯以一絕緣層’例如包覆成型之塑膠介電質，因此當 電氣接點陣列702、704、706、708實質上位於其各別 通道内時’該絕緣層使該等電氣接點與殼體組件3〇6、 308、310的該傳導表面電氣隔離。在其他實作例中，該 絕緣層係直接施加至電氣接點陣列7〇2、704、706、708， 以使該等陣列的傳導性部分與該等電氣接點通道的該 等導電表面電氣隔離。在電氣接點陣列702、704、706、 708已經位於殼體組件306、308、310之後，殼體306、 308、310係接合在一起以形成電氣連接器系統2〇2的多 個薄片組件210。 電氣接點陣列702、704、706、708係各界定複數 個訊號基板接合元件（例如固定連接器3〇4)，其大小可 延伸通過該等殼體的一固定端，並連接於基板的複數個 第一訊號貫孔。陣列702、704、706、708之每一者也 界定複數個匹配連接器302，其大小可延伸通過該等殼 體的匹配端，並接合於基板的對應匹配連接器或中間連 接器。 在某些實作例中’中央殼體308包含一接地屏蔽部 710 ’其延伸通過或嵌於中央殼體308的一部分。接地 屏敝部710係固定至中央殼體308的一外表面或成為中 央设體308的一整體部分。s亥接地屏蔽部係包含複^個 接地垂片712,其大小可延伸通過中央殼體3〇8的該匹 配端，並阻擔電氣接點陣列之各匹配連接器302之間的 視線(line-of-sight)。在某些實作例中，其中一個接地匹 配垂片712係位於一對匹配連接器上方，而另一接地匹 201145706 配垂片712係位於該對匹配連接器下方。舉例而言，接 ，，片712係彼此隔開，使得一對匹配連接器可裝配於 相鄉匹配垂片712間的空間中。 、 如第八圖所示’某些實作例也可包含—接地屏蔽部 其耦接於其中—個端部殼體。第人輯示了搞接 部殼體310的接地屏蔽部802。接地屏蔽部8〇2係 敕疋至端部殼體310的外表面或成為端部殼體的一 體邻分。與第七圖中繪示為耦接於中央殼體3⑽之接 屏蔽部710類似，接地屏蔽部802係包含複數個接地 片804’其大小可延伸通過端部殼體31〇的該匹配端， 且随擒了電氣接點陣列的各匹配連接器3〇2之間的視 線。 第七圖繪示了具有一個中央殼體與兩個端部殼體 垃〜個實作例，其會產生兩個差動對陣列（由四個電氣 =點陣列702、704、706、708所形成）。或者是，中央 ^體308的多個實例可用以形成具有更大量陣列，因而 可產生更大量差動對陣列之電氣連接器。在此替代實作 3 J中，一電氣接點陣列係實質上位於類似於中央殼體 之另雙側中央设體的5亥荨通道内。此額外陣列係 ^有陣列702、704、706、708其中之一之差動對的_： ，舉例而言，若該額外中央殼體係位於第一端部殼體 與中央殼體遞之間，則位於該額外中央殼體之該 =係與陣列702《陣列706其中一個成對，端視該額 —車列是位於該額外中央殼體的哪一側而定。同樣地， 右該額外中央殼體係位於第二端部殼體31〇與中央殼體 13 201145706 :’則位於該額外中央殼體中的該陣列係與陣列 今額Vt^7G8其中—個成對，端視該額外陣列是位於 δ亥額外中央殼體的哪一側而定。 央私作，包含了位於中央殼體308兩側上的中 之貫例。在有三個中央殼體308及兩個端部 31。的實作例中，可容納八個電氣接點陣列 >成四對陣列。在該第一端部殼體中的一第一電氣 點陣列係與該第-中央殼體的該第一側上的第二電氣 接點陣列成對，·在該第—中央殼體的該第二側上的第三 電氣接點陣列係與該第二中央殼體的該第一側上的第 2乳接點陣列成對；在該第二中央殼體的該第二侧上 的第五電氣接點陣列係與在該第三一 側上的第六電氣接點陣列成對；最後，在該^中= Λ 體的該第二側上的第七電氣接點陣列係與在該第^端 #體中的第八電氣接點陣列成對。其他的替代例可包 含更多的中央殼體，如第三圖所示之該 統，其包含了五個中央殼體。 于 j九圖為可連接多個基板之另—電氣連接器系統 902的立體圖。在一實作例中，電氣連接器系統搬具 有連接於一第一基板之一固定端9〇4以及連接於一第二 ，板之-匹配端9G6°與該第—基板或該第二基板的該 等連接可為直接或可透過-介面連接器。當接合於電氣 連接器系統902時，該等第一與第二基板是以實質上垂 直的關係排列。 、 電氣連接器系統902包含一或多個薄片殼體霞、 201145706 件910、一或多個接地屏蔽物以及 人二d為914。此外’電氣連接器系統9〇2係包 個接地電位連接組件，其於多個薄片組件910 :、Μ基板之間提供一共同接地電位。舉例而言， f器系統902包含一或多個接地片，其係於“連接當 =ί端9〇4編於薄片組件910與該基板 之間，如^國專利申請號12純，9〇4中所描述者。 替始Ϊ —實作财’薄片殼體_、接地屏蔽部912盘 914係實質上與上述之電氣連接器系統搬的薄 片广體208、接地屏蔽部212及整線器214相似。電氣 連接益系統202與電氣連接器系統9〇2的該等各 ^ ^個差異處在於：電氣連接器⑽9()2的該 2具有不同於電氣連接器系統2〇2之大小或配置。該 ^小或配置差異係用以容納電氣連接器系統搬 二=21〇與電氣連接器系統9〇2之薄片組件91〇之| ^亥專大小及/或配置差異。舉例而言，第九圖中所 溥片組件9H)可包含較寬的殼體 額外的電氣接點陣列。 ，、幻係了令、··内 -第十圖為電氣連接器系統902之部分分解圖， 不了自薄片殼體908脫離的其中-個薄片組件910。第 =圖所不之電氣連接器系統9G2包含三個薄片組件 910 ’在其他實作财，電氣連接㈣、統可包含不 】數量的薄:組件9U)。電氣連接㈣統搬中薄片組 910的數:可客製化以符合該應用之該等需求。薄片 组件910之每-者可包含—殼體組件·2、多個電氣接 201145706 點陣列（在第十圖中僅可見該等電氣接點陣列的匹配連 接益302與固定連接器304)以及一或多個接地屏蔽部 912。 第十一圖更詳細繪示了殼體組件1〇02。在一實作例 中，妓部組件1002包含一傳導表面，其界定複數個通 道，通道的大小係可容置一或多個電氣接點陣列。殼體 組件1002包含在殼體組件1〇〇2之每一側面上的複數個 通道。舉例而言，殼體組件1002包含在殼體組件1〇〇2 之第一側面上的第一複數個通道u〇2以及在殼體組件 1〇〇2之第二側面上的第二複數個通道1104。因此，殼 體組件1002可於每一側上容納一電氣接點陣列。在殼 體組件1002之該第一側面上的通道11〇2實質上類似於 在殼體組件1002的該第二側面上的通道ι1〇4。殼體組 件1002係由與上述殼體組件306、308與310之類似材 料所形成。 第十二圖繪示了置於殼體組件1002之通道1102、 1104中的多個電氣接點陣列1202、1204、1206、1208。 電氣接點陣列1202、1204、1206、1208係與上述如第 七圖所示之電氣接點陣列702、704、706、708相同、 或實質上類似。舉例而言，電氣接點陣列1202、1204、 1206、1208之每一者係包含複數個電氣路徑、可包含一 包覆成型之絕緣層、且可包含基板接合元件（例如匹配 連接器302與固定連接器304)。 在第十二圖中，電氣接點陣列1202與電氣接點陣 列1204係實質上位於殼體組件1〇〇2之該第一側面上的 16 201145706 通道1102内’殼體組件1()()2之該第一側面上的通道 1102之大小係可包圍多個 接點陣 陣列12。2與電氣接點陣歹"2。4兩者。^同樣地電接 點陣列1206與電氣接點陣列12〇8係實質上位於殼體組 件1〇=之該第二側面上的通道UG4内，殼體組件腦 之該^-側面上的通道_之大小係可包圍多個電氣 接f陣列’例如電氣接點陣列1篇與電氣接點陣列1208 兩者。 以 件1〇02中的電氣接點通道1102與11〇4係襯 、，，巴、.彖層，例如一包覆成型之塑膠 ，於其各別通道中時:該絕^ 5亥4陣狀料電氣接點與殼體組件刪的該傳導表 =隔Γ在其他實作例中’該絕緣層係直接施加至 陣列，以電氣隔離該等陣列的傳導性部分 與邊#電乳接點通道的該等導電表面。 陣列f氣接畴们2G2係與電氣接點 = 成對’以形成-第一複數個電氣接點差動對。 電札接點陣列係與電氣接點㈣題成對，以形 成一第二複數個電氣接點差動對。 y 當電氣接點陣列1202與電氣接點陣列12〇4备所 位於殼體組件觀之該第—侧上的複數個通道^:内 時，電氣接點陣列1202的各電氣接點係與電氣接點陣 列1204的一電氣接點相鄰。在某些實作例中，氣 點陣列1202與1204係位於該等複數個通道内，使得在 該整個薄片組件間’相鄰電氣接點之間的距離係實質相 201145706 等。同時’電氣接點陣列1202、1204的該等相鄰電氣 接點形成了連續的電氣接點對。在某些實作例中，電氣. 接點對係電氣接點差動對。舉例而言，該等電氣接點對 可用於差動發訊。 ' 同樣地’當電氣接點陣列1206與電氣接點陣列12〇8 實質上位於殼體組件10〇2之該第二側上的複數個通道 U04内時，電氣接點陣列1206的各電氣接點係與電氣 接點陣列1208的一電氣接點相鄰。在某些實作例中， 電氣接點陣列1206、1208的該等相鄰電氣接點係形成 連續的電氣接點對，例如電氣接點之差動發訊對。 第十二圖繪示了裝配至殼體組件1 002中該等通道 内的多個電氣接點陣列。施加至該等電氣接點陣列之一 絕緣層（例如該包覆成型之絕緣層）係使一電氣接點陣 列的至少一部分與該相鄰的電氣接點陣列電氣隔離。第 十二圖也繪示了在殼體組件10〇2之兩側上耦接於殼體 ^件1002之接地屏蔽部912與接地屏蔽部13〇2 ^或者 疋，接地屏蔽部係僅耦接於殼體組件1〇〇2的一側。接 地屏蔽部912與1302可固定至殼體1〇〇2的外表面或可 成為殼體組件1002的整體部分。在一實作例中，接地 屏蔽部1302包含-表面，其分隔電氣接點陣列12〇2、 j2(H以及—相諫餘件巾所包_電氣接點陣列。同 列，，接地屏蔽部912包含-表面，其分隔電氣接點陣 =1206、謂以及-不同相鄰殼體組件中所包圍的電 ^點陣列。與第七圖切不之搞接於中央殼體308的 接地屏蔽部頂類似，第十王圖中的接地屏蔽部犯與 201145706 1302可包含複數個接地垂片1304,其大小可延伸通過 殼體組件1002的該匹配端且阻擋—電氣接點陣列的各 匹配連接器302之間的視線。 【圖式簡單說明】 第-圖為連接一第一基板至一第二基板之背板連 接器糸統的圖式。 J二圖為包含多個薄片組件之電氣連接器系統的 立體圖。 第三圖為第二圖之該電氣連接器系統的另一視圖。 央殼圖之該錢軸Μ統的一中 覆 接點LI圖繪示了第二圖之該電氣連接㈣統的電氣 成型圖之該電氣連接器系統的包 道内圖之該等殼體組件中的通 第八圖繪示了盥篦岡甘 的接地屏蔽部。個端部殼體輕接 圖 統的=為包含多個薄片組件的另-電氣連接器系 十圖為第九圖之該電氣連接器系統的部分分解 第十一圖繪示了第九 圖之該電氣連接器系統的一 19 201145706 殼體組件。 第十二圖繪示了置於第十一圖之該殼體組件中的 通道内之電氣接點陣列。 第十三圖繪示了與第十一圖之該殼體組件耦接的 兩接地屏蔽部。 【主要元件符號說明】 102 背板連接器系統 104 第一基板 106 第二基板 202 電氣連接器系統 204 固定端 206 匹配端 208 薄片殼體 210 薄片組件 212 接地屏蔽部 214 整線器 216 孔洞 302 匹配連接器 304 固定連接器 306 第一端部殼體 308 中央殼體 310 第二端部殼體 402 通道 404 通道 201145706 406 408 502 504 506 508 510 602 702 704 706 708 710 712 802 804 902 904 906 908 910 912 914 1002 1102 第一電氣接點通道 第二電氣接點通道 第一電氣接點陣列 第二電氣接點陣列 電氣路徑 電氣路徑 製造框體 包覆成型的絕緣層 第一電氣接點陣列 第二電氣接點陣列 第三電氣接點陣列 第四電氣接點陣列 接地屏蔽部 接地垂片 接地屏蔽部 接地垂片 電氣連接器系統 固定端 匹配端 薄片殼體 薄片組件 接地屏蔽部 整線器 殼體組件/殼體 通道 201145706 1104 1202 1204 1206 1208 1302 通道 電氣接點陣列 電氣接點陣列 電氣接點陣列 電氣接點陣列 接地屏蔽部 22When the substrate 2 is fixed to the substrate, the ground shield 212 can be bonded to the substrate by the substrate I (which may include the substrate bonding ground fixed pin 2A4). 6 201145706 214 is shown at the solid 04 of the electrical connector system 202. The aligner 214 includes apertures sized such that the substrate contacts (e.g., the electrical contact fixed pins) are sub-connected to the substrate by the splicer 214. The third view is another view of the electrical connector system 202 in which the thin = body 208 and the splicer 214 have been removed to expose the mating connector 3 〇 2 of the lamellae group = 210 and the fixed connector 3 〇 4. Each of the wafer assemblies 21G provides - or a plurality of electrical path arrays between the plurality of substrates. The electrical paths can be signal transmission paths, power transmission paths, or ground potential paths. One of the mating connectors 3〇2 is located at one end of each electrical path of an array, and one of the fixed connectors 3〇4 is located at the other end of each of the electrical paths of an array. The mating connector 302 extends from the mating end 206 of the electrical connector system 202 to interface with a first substrate or another mating device, such as a cap module. The mating connector 302 is a closed band, three-beam (tH-beam), double beam, circular, male, maternal, amphoteric or another connector type. Similarly, the fixed connector 304 extends from the fixed end 204 of the electrical connector system 202 for coupling to a second substrate or another matching device. The fixed connector 304 can be an electrical contact pin sized to fit in a corresponding hole or through hole of the substrate to create a connection to the substrate. As shown in the third figure, the electrical connector system 202 and the sheet assembly 21 are formed from a number of different housing assemblies. For example, the electrical connection includes one or more first end housings 306, one or more central housings 308, and one or more second end housings 31A. The electrical connector system 202 shown in Fig. 201145706 is formed by a first end housing 306, five center housings 308, and a second end housing 310. • Different housing configurations may be used in other implementations, including, for example, multiple first end housings 306, multiple second end housings 308, fewer central housings 308, and more A plurality of central housings 308 and the like. In the electrical connector system 202, the number and configuration of the housing components can be customized to meet the needs of the application. The fourth diagram illustrates the first end housing 306, the central housing 308, and the second end housing 310 of the electrical connector system 202 in greater detail. In one embodiment, each of the housing assemblies includes a conductive surface defining a plurality of channels, the channels being sized to receive one or more electrical contact arrays. For example, the first end housing 306 can be included on a first side of the first end housing 306 rather than a plurality of channels 402 on the second side. Likewise, the second end housing 310 can include a plurality of channels 404 on one of the first sides of the second end housing 310, but not on the second side. Thus, end housings 306 and 310 can only accommodate an array of electrical contacts on one side. Alternatively, central housing 308 can include a plurality of channels on each side of central housing 308. For example, the central housing 308 can include a first plurality of channels 406 on a first side of the central housing 308 and a second plurality of channels 408 on a second side of the central housing 308. Thus, the central housing 308 can accommodate an array of electrical contacts on each side. The passage 406 on the first side of the central housing 308 is substantially similar to the passage 408 on the second side of the central housing 308. The first end housing 306, the central housing 308, and/or the second end housing 8 201145706 are formed to have a conductive surface. For example, the housings are plated plastic grounded housings; in some embodiments, each of the housings is read or grounded by two nickel plating (Ni) or Word (Zn) die-casting parts are covered with tin (%). In other embodiments, the housings comprise aluminum (A1) die castings, conductive polymers, injection molding, or any other type I. The fifth diagram of the metal of the >,, shows the first electrical contact array 5〇2 (such as 2) and the second electrical contact (4) 5G4 (such as the second lead frame: multiple electrical paths; for example a first contact array; a plurality of electrical paths 5G6' and a second contact array 5G4 comprising a plurality of 508. The electrical paths 506, 508 provide the signal transmission paths and power of the ground electricity shown in the third figure. As shown in the fifth diagram of the transmission path or the array, the matching connector 3Q2 is located at one end of the electrical rolling contact, and a fixed connection number is at the other end of each electrical path of the array. Contact array 5.2, Xie is formed of a conductive material ί 2 = upper ΐ gas contact array 502, 5 〇 4 containing lin bronze and ',) coated with gold (Au) or tin (Sn). In the bean #管祚如中' electrical contact array 5〇2, sell sentence red / added in other examples. Material τΓ Contains any copper (Cu) alloy material bucket " Special ore layer can be any precious metal, such as Ji (3 solid ^ ΐϊ) or in the contact area cap gold (five) de (10), base plated reed "镡 η η) Or nickel (Ν0, there is nickel (Ni) in the underlying plating or layer. Each of the electrical contact arrays 502, 504 - 201145706 is shown in the fifth figure, which has one of can be removed before operation The frame 510 is manufactured. The green image shows the electrical contact arrays 502 and 504 after the overmolding of the insulating layer 602 (for example, overmolded plastic dielectric). The array of electrical paths 5〇6, 508 shown in the fifth figure in Fig. 6 is at least partially surrounded by an overmolded insulating layer 6〇2. The overmolded insulating layer 6〇2 makes the electrical path 5〇 6, the array of 5〇8 is isolated from other conductive surfaces. The sixth figure also shows the electrical contact arrays 502, 504 after removing the manufacturing frame 51 shown in the fifth figure. A plurality of electrical contact arrays disposed in the communication between the housing assemblies 306, 308 and 310. In the seventh diagram, the first electrical contact two cars, the 702 series The second electrical contact array 704 is substantially centrally located in the central portion of the first side of the central housing, and is located in the channels on the second side of the body 308. The 7Π4' electrical contact array 7G2 is different from the second electrical contact array, a portion of the differential pair array. In this embodiment, the first electrical if, 702 # and the third electrical contact array 706 are paired to A plurality of electrical point differential pairs are formed. The third electrical contact array is located in the channels of the first end housing 3〇6, as shown by the point f. The second electrical contact array It is connected to a fourth electrical device. The fourth 7 Π pair 以 以 以 708 708 形成 形成 形成 形成 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 708 The third electrical contact 201145706 array 706 is substantially located in the first end housing 306 when the array of points 702 is substantially located in a plurality of channels on the first side of the central housing period (four). The first end housing 306 is coupled to the central housing 308, the first electrical contact The electrical contacts of column 702 are adjacent to an electrical contact of third electrical contact array 706. In some embodiments, first and third electrical contact arrays 7〇2, 706 are located at the plurality of electrical contacts. Within the channels, the distance between adjacent electrical contacts on the entire sheet assembly 210 is substantially equal. At the same time, the adjacent electrical contacts of the first and third electrical contact arrays 702, 706 are continuous. Electrical contact pairs. In some implementations, the electrical contacts are differential pairs of electrical contacts, for example, the electrical contact pairs can be used for differential signaling. Similarly, when the second electrical When the contact array 704 is substantially located in the plurality of channels on the second side of the central housing 308, the fourth electrical contact array 708 is substantially located in the plurality of channels of the second end housing 310 The second end housing 310 is coupled to the central housing 308. The electrical contacts of the second electrical contact array 704 are substantially adjacent to one of the fourth electrical contact arrays 706. In some embodiments, the adjacent electrical contacts of the second and fourth electrical contact arrays 704, 708 form a continuous pair of electrical contacts, such as differential signaling pairs of electrical contacts. In some embodiments, for each electrical contact pair, the electrical contacts of the array of electrical contacts mirror the adjacent electrical contacts of the other electrical contact array. Mirroring the electrical contacts to these electrical contacts provides manufacturing advantages and line-alignment of high-speed electrical performance while still providing a unique structure in pairs of two rows. The electrical contact channels 201145706 in the housing assemblies 306, 308, and 310 are lined with an insulating layer 'eg, overmolded plastic dielectric, such that when the electrical contact arrays 702, 704, 706, 708 are substantially The insulating layer in the respective channels electrically isolates the electrical contacts from the conductive surface of the housing components 3, 6, 308, 310. In other embodiments, the insulating layer is applied directly to the electrical contact arrays 7〇, 704, 706, 708 such that the conductive portions of the arrays are electrically isolated from the conductive surfaces of the electrical contact channels. . After the electrical contact arrays 702, 704, 706, 708 have been located at the housing assemblies 306, 308, 310, the housings 306, 308, 310 are joined together to form a plurality of sheet assemblies 210 of the electrical connector system 2〇2 . The electrical contact arrays 702, 704, 706, 708 each define a plurality of signal substrate bonding components (eg, fixed connectors 3〇4) sized to extend through a fixed end of the housing and to a plurality of substrates The first signal is a through hole. Each of the arrays 702, 704, 706, 708 also defines a plurality of mating connectors 302 sized to extend through the mating ends of the mats and to engage corresponding mating connectors or intermediate connectors of the substrate. In some implementations, the central housing 308 includes a ground shield 710' that extends through or is embedded in a portion of the central housing 308. The grounding screen portion 710 is secured to an outer surface of the central housing 308 or as an integral part of the central housing 308. The s-grounding shield includes a plurality of grounding tabs 712 sized to extend through the mating ends of the central housing 3〇8 and to block the line of sight between the mating connectors 302 of the array of electrical contacts (line) -of-sight). In some embodiments, one of the grounding tabs 712 is positioned over a pair of mating connectors, and the other grounding strap 201145706 mating tabs 712 are located below the pair of mating connectors. For example, the tabs 712 are spaced apart from one another such that a pair of mating connectors can fit within the space between the matching tabs 712. As shown in the eighth figure, some embodiments may also include a grounding shield coupled to one of the end housings. The first person has shown the ground shield 802 of the joint housing 310. The ground shield 8 〇 2 is tied to the outer surface of the end housing 310 or becomes an integral part of the end housing. Similar to the shield portion 710 illustrated in FIG. 7 as being coupled to the central housing 3 (10), the ground shield portion 802 includes a plurality of grounding strips 804 ′ sized to extend through the mating ends of the end housings 31 . And the line of sight between the mating connectors 3〇2 of the electrical contact array is followed. The seventh figure illustrates a central housing and two end housings that implement two differential pair arrays (formed by four electrical = point arrays 702, 704, 706, 708). ). Alternatively, multiple instances of the central body 308 can be used to form electrical connectors having a larger number of arrays, thus producing a larger number of differential pair arrays. In this alternative implementation 3J, an array of electrical contacts is located substantially in a 5 荨 channel similar to the other two-sided central body of the central housing. The additional array is _: having a differential pair of one of the arrays 702, 704, 706, 708, for example, if the additional central housing is between the first end housing and the central housing, The one of the additional central housings is then paired with the array 702, one of the arrays 706, depending on which side of the additional central housing. Similarly, the right central housing is located at the second end housing 31 and the central housing 13 201145706: 'The array in the additional central housing is paired with the array Vt^7G8 It depends on which side of the additional central housing is located. The private operation includes a central example located on both sides of the central casing 308. There are three central housings 308 and two end portions 31. In a practical example, eight electrical contact arrays can be accommodated in a four-pair array. a first electrical point array in the first end housing is paired with a second electrical contact array on the first side of the first central housing, in the first central housing a third electrical contact array on the second side is paired with the second breast contact array on the first side of the second central housing; on the second side of the second central housing The fifth electrical contact array is paired with the sixth electrical contact array on the third side; finally, the seventh electrical contact array on the second side of the body is The eighth electrical contact array in the body is paired. Other alternatives may include more central housings, such as the one shown in Figure 3, which includes five central housings. Figure 9 is a perspective view of another electrical connector system 902 to which a plurality of substrates can be connected. In one embodiment, the electrical connector system is coupled to a fixed end 9〇4 of a first substrate and to a second, board-matching end 9G6° and the first substrate or the second substrate. These connections may be direct or permeable-interface connectors. When joined to electrical connector system 902, the first and second substrates are arranged in a substantially vertical relationship. The electrical connector system 902 includes one or more sheet housings, a 201145706 piece 910, one or more ground shields, and a human d. Further, the 'electrical connector system 9' includes a ground potential connection assembly that provides a common ground potential between the plurality of wafer assemblies 910: and the substrate. For example, the f-system 902 includes one or more grounding strips, which are tied between the sheet assembly 910 and the substrate, such as the patent application number 12, 9 The one described in 4. The starting sheet - the solid sheet 'sheet shell _', the grounding shield portion 912, the disk 914 is substantially the sheet body 208, the grounding shield portion 212, and the wire aligner that are substantially moved with the above-described electrical connector system. 214 is similar. The difference between the electrical connection benefit system 202 and the electrical connector system 9〇2 is that the 2 of the electrical connector (10) 9() 2 has a different size than the electrical connector system 2〇2 or Configuration. The small or configuration difference is used to accommodate the electrical connector system to move two = 21 〇 and the electrical connector system 9 〇 2 of the sheet assembly 91 ^ ^ ^ ^ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The cymbal assembly 9H) in the ninth figure may include an additional array of electrical contacts for the wider housing. The phantom system, the inner-tenth diagram is a partial exploded view of the electrical connector system 902. One of the sheet assemblies 910 that are detached from the sheet housing 908. The electrical connector system 9 of FIG. G2 includes three sheet assemblies 910 'in other implementations, electrical connections (four), system can contain no number of thin: component 9U). Electrical connection (four) number of integrated sheet groups 910: can be customized to meet the The requirements of the application. Each of the sheet assemblies 910 may include a housing assembly 2, a plurality of electrical connections 201145706 point array (only the matching connection benefits 302 and fixing of the electrical contact arrays can be seen in the tenth figure The connector 304) and the one or more ground shields 912. The eleventh figure illustrates the housing assembly 1 02 in more detail. In one embodiment, the ankle assembly 1002 includes a conductive surface that defines a plurality of channels The size of the channel can accommodate one or more arrays of electrical contacts. The housing assembly 1002 includes a plurality of channels on each side of the housing assembly 112. For example, the housing assembly 1002 is included a first plurality of channels u〇2 on a first side of the housing assembly 1〇〇2 and a second plurality of channels 1104 on a second side of the housing assembly 1〇〇2. Thus, the housing assembly 1002 can Storing an array of electrical contacts on each side. The channel 11〇2 on the first side of the 1002 is substantially similar to the channel ι1〇4 on the second side of the housing assembly 1002. The housing assembly 1002 is comprised of the housing assemblies 306, 308 and 310 described above. A similar material is formed. Figure 12 illustrates a plurality of electrical contact arrays 1202, 1204, 1206, 1208 disposed in channels 1102, 1104 of housing assembly 1002. Electrical contact arrays 1202, 1204, 1206, 1208 It is the same as, or substantially similar to, the electrical contact arrays 702, 704, 706, 708 as described above in FIG. For example, each of the electrical contact arrays 1202, 1204, 1206, 1208 includes a plurality of electrical paths, may include an overmolded insulating layer, and may include substrate bonding components (eg, mating connectors 302 and fixed) Connector 304). In the twelfth figure, the electrical contact array 1202 and the electrical contact array 1204 are substantially located on the first side of the housing assembly 1〇〇2 in the 201145706 channel 1102 'housing assembly 1()() The channel 1102 on the first side of the 2 is sized to surround the plurality of contact arrays 12. 2 and the electrical contact array "2.4. ^ Similarly, the electrical contact array 1206 and the electrical contact array 12〇8 are substantially located in the channel UG4 on the second side of the housing assembly 1〇, the channel on the side of the brain of the housing assembly _ The size can encompass a plurality of electrical connections f arrays, such as both an electrical contact array 1 and an electrical contact array 1208. The electrical contact channels 1102 and 11〇4 in the piece 1〇02 are lined, and the ba, the layer, such as a overmolded plastic, in its respective channels: the The conductive contact of the electrical contact and the housing assembly = the barrier in other embodiments, the insulating layer is applied directly to the array to electrically isolate the conductive portion of the array from the edge The conductive surfaces. The array of gas contacts 2G2 and the electrical contacts = paired to form - the first plurality of electrical contact differential pairs. The electrical contact array is paired with the electrical contacts (4) to form a second plurality of electrical contact differential pairs. y When the electrical contact array 1202 and the electrical contact array 12 are located in a plurality of channels on the first side of the housing assembly, the electrical contacts of the electrical contact array 1202 are electrically An electrical contact of the contact array 1204 is adjacent. In some embodiments, the array of gas points 1202 and 1204 are located in the plurality of channels such that the distance between adjacent electrical contacts between the entire sheet assemblies is substantially 201145706 and the like. At the same time, the adjacent electrical contacts of the electrical contact arrays 1202, 1204 form a continuous pair of electrical contacts. In some implementations, the electrical contacts are differential pairs of electrical contacts. For example, the pairs of electrical contacts can be used for differential signaling. 'When the electrical contact array 1206 and the electrical contact array 12〇8 are substantially located within a plurality of channels U04 on the second side of the housing assembly 10〇2, the electrical connections of the electrical contact array 1206 The dots are adjacent to an electrical contact of the electrical contact array 1208. In some implementations, the adjacent electrical contacts of the electrical contact arrays 1206, 1208 form a continuous pair of electrical contacts, such as differential signaling pairs of electrical contacts. A twelfth diagram depicts a plurality of electrical contact arrays assembled into the channels in housing assembly 002. An insulating layer (e.g., the overmolded insulating layer) applied to one of the array of electrical contacts electrically isolates at least a portion of an array of electrical contacts from the array of adjacent electrical contacts. The twelfth figure also shows that the ground shield 912 and the ground shield 13 〇 2 ^ or 耦 are coupled to the housing member 100 2 on both sides of the housing assembly 10 〇 2 , and the ground shield is only coupled On one side of the housing assembly 1〇〇2. The ground shields 912 and 1302 can be secured to the outer surface of the housing 1〇〇2 or can be an integral part of the housing assembly 1002. In a practical example, the ground shield portion 1302 includes a surface that separates the electrical contact arrays 12 〇 2, j 2 (H and the 谏 谏 谏 谏 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ a surface that separates the electrical contact array = 1206, and the array of electrical points enclosed in different adjacent housing assemblies. Similar to the ground shield portion of the central housing 308, which is similar to the seventh diagram. The ground shield portion of the tenth king diagram and 201145706 1302 may include a plurality of ground tabs 1304 sized to extend through the mating end of the housing assembly 1002 and block each mating connector 302 of the electrical contact array 。 。 。 。 。 。 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图The third view is another view of the electrical connector system of the second figure. The middle cover point LI of the central axis diagram shows the electrical connection of the second figure (four) The inside diagram of the electrical connector system of the electrical molding diagram The eighth figure in the housing assemblies shows the grounding shield of the 盥篦Ganggan. The end housings are lightly connected to the other. Partial exploded view of the electrical connector system of the ninth diagram. Figure 11 shows a 19 201145706 housing assembly of the electrical connector system of the ninth diagram. Figure 12 is a diagram showing the eleventh figure. An array of electrical contacts in the channel in the housing assembly. Figure 13 illustrates two grounded shields coupled to the housing assembly of Figure 11. [Main Symbol Description] 102 Backplane Connection System 104 first substrate 106 second substrate 202 electrical connector system 204 fixed end 206 mating end 208 foil housing 210 foil assembly 212 ground shield 214 aligner 216 hole 302 mating connector 304 fixed connector 306 first end Part housing 308 central housing 310 second end housing 402 channel 404 passage 201145706 406 408 502 504 506 510 510 702 704 706 708 710 712 802 804 902 904 906 908 912 912 914 1002 1102 First electrical Point channel second electrical contact channel first electrical contact array second electrical contact array electrical path electrical path manufacturing frame overmolded insulating layer first electrical contact array second electrical contact array third electrical contact Array fourth electrical contact array grounding shield grounding tab grounding shield grounding tab electrical connector system fixed end mating end sheet housing foil assembly grounding shield completer housing assembly/housing channel 201145706 1104 1202 1204 1206 1208 1302 Channel Electrical Contact Array Electrical Contact Array Electrical Contact Array Electrical Contact Array Ground Shield 22