CN110035607B

CN110035607B - Ethernet port communication method based on laminated welding of DIP pins of finished circuit board

Info

Publication number: CN110035607B
Application number: CN201910375823.5A
Authority: CN
Inventors: 刘子龙; 刘毅
Original assignee: Kunming Enersun Technology Co Ltd
Current assignee: Kunming Enersun Technology Co Ltd
Priority date: 2019-05-07
Filing date: 2019-05-07
Publication date: 2022-04-01
Anticipated expiration: 2039-05-07
Also published as: CN110035607A

Abstract

The invention discloses an Ethernet port communication method based on laminated welding of DIP pins of a finished circuit board. In the integrated light integration, two devices/modules are packaged by DIP, and the interface is RJ 45; pins of the device/module interface penetrate from a Top layer to a Bottom layer of the PCB through holes, and protrude after penetrating through the Bottom layer; utilizing the protruded pins as connecting pins to manufacture an Ethernet adapter plate for welding at the bottom of an RJ45 interface; an Ethernet adapter plate is provided with a packaging piece for packaging an interface RJ45 in a left-right reverse direction and an FPC flat flip lower connector; the top layers of the two FPC flat flip lower connectors are connected in a one-to-one correspondence mode through connecting wires, and the interfaces are connected with each other through flexible flat cables with 8P intervals of 1 mm. The flexible flat cable has the characteristics of thinness, softness and folding, is flexible and reliable in connection, and realizes data communication of the board-level Ethernet. The invention can be used flexibly, does not need to change and specially customize a circuit board, reduces the development cost, shortens the period and has more universality in use.

Description

Ethernet port communication method based on laminated welding of DIP pins of finished circuit board

Technical Field

The invention belongs to the field of electronic equipment manufacturing, and particularly relates to an Ethernet port communication method based on laminated welding of pins of a DIP (dual in-line package) of a finished circuit board.

Background

Aiming at mature electronic products, the hardware core of the electronic products is a Printed Circuit Board Assembly (PCBA) for completing the welding of components, and the universal peripheral interfaces of the PCBA are solidified and are presented in a certain package at a specified position. If data is to be communicated, a corresponding interface meeting international standards, such as an ethernet port, is required to be used, and data exchange needs to be completed by using a standard network cable.

In the actual use process, the assembled integration does not need to integrate all equipment or modules in a miniaturized structural member, the structures and the shapes of all the equipment or modules are relatively independent, the connection can be completed by using a standard peripheral interface under the condition, and the plugging and unplugging are convenient, flexible and reliable.

However, in another integration, each finished module with a certain function needs to be integrated into a specific miniaturized structural member, and each device and module removes the original structural member, thereby realizing board-level communication and completing the product packaging. Especially, ethernet interfaces are common in electronic devices and modules, and due to the fact that the joints of network cables are too large, integration of light integration is difficult, previous solutions often customize each device or module according to needs, and the defects are obvious, cost is high, and operation period is long.

Disclosure of Invention

The invention aims to provide an Ethernet port communication method based on Dual Inline-pin Package (DIP) pin lamination welding of a finished product circuit board, wherein an interface is in the form of RJ45, the packaging form is DIP packaging, an FPC seat is welded through the DIP pin lamination, a flexible flat cable is used as a data channel, the communication of the Ethernet port is realized, and integrated light integration is completed.

In order to achieve the purpose, the technical scheme of the invention is as follows: the Ethernet port communication method based on the lamination welding of the pins of the DIP of the finished circuit board comprises the following steps:

s01: in the integrated light integration, two devices/modules are packaged by DIP, and the interface of the two devices/modules is an RJ45 interface;

s02: pins of the device/module interface penetrate from a Top layer to a Bottom layer of the PCB through holes, and protrude after penetrating through the Bottom layer;

s03: utilizing the protruded pins as connecting pins to manufacture an Ethernet adapter plate for welding at the bottom of an RJ45 interface;

s04: an Ethernet adapter plate is provided with a packaging piece for packaging an interface RJ45 in a left-right reverse direction and an FPC flat flip lower connector;

s05: the top layers of the two FPC flat flip lower connectors are connected in a one-to-one correspondence mode through connecting wires, and the interfaces are connected with each other through flexible flat cables with 8P intervals of 1 mm. Because the flexible flat cable is thinner, flexible and foldable, the connection is flexible and reliable, and the data communication of the board-level Ethernet is realized.

Preferably, in step S02, the pins protrude a distance of 1-2mm after passing through the Bottom layer.

Preferably, in step S03, the ethernet adapter plate has a thickness of 0.4-0.6 mm.

Preferably, in step S04, the pin pitch of the FPC flat flip lower socket is 1 mm.

In the integrated development of the selected mature electronic module as a component, because the interface and the customized electronic module cannot be modified, the communication of a universal interface such as an Ethernet port is very difficult to handle, on one hand, because the universal interface is a high-speed peripheral interface, and because the signal line is 2 pairs or 4 pairs of high-speed differential lines, the manual welding of the lines is inconvenient; on the other hand, the connection standard for ethernet ports is to use cross-wires, which are generally too bulky and not easily bent. This makes it difficult to integrate 2 devices or modules that are to communicate with each other using portal communication in a lightweight integrated device. The inability to modify and customize electronic modules and interfaces requires the introduction of communication interfaces on the original PCB. The invention uses a patch panel which is laminated and welded under the RJ45 seat of DIP to lead out a signal interface; the invention uses the FPC seat and the flexible flat cable to complete the connection, which is flexible and reliable.

The invention has the beneficial effects that:

1) the invention provides another method for product integration besides the connection by a standard network cable, so that the integrated light integration is possible.

2) The invention can be flexibly used in integrated light integration, and because the lower part of the DIP packaging device is laminated and welded, a circuit board does not need to be changed and specially customized, the development cost is reduced, the period is shortened, and the use is more universal. The connecting channel uses flexible flat cables, the connection is flexible, the mutual positions of the modules are not limited, and the integration in a specific structural member is easier.

Drawings

Fig. 1 is a schematic diagram of a first embodiment of the invention.

Detailed Description

The invention is further described below with reference to the accompanying drawings.

Examples

As shown in fig. 1, the invention discloses an ethernet port communication method based on the lamination welding of DIP pins of a finished circuit board. In an integrated lightweight integrated system, A, B two modules have DIP-packaged RJ45 interfaces, interface RJ45-a and interface RJ45-B, respectively, for ethernet connections. The packaging form is RJ45 seat of DIP, the pin of the device passes from the Top layer of PCB to the Bottom layer through the through hole, and the pin protrudes 1.5mm after passing through the Bottom layer due to the requirement of welding process.

And utilizing the protruded pins as connecting pins to manufacture an Ethernet adapter plate PJ-A and an Ethernet adapter plate PJ-B with the thickness of 0.5mm for welding at the bottom of the interface RJ45-A and the interface RJ 45-B.

2 devices are respectively arranged on an Ethernet adapter plate PJ-A and an Ethernet adapter plate PJ-B, one device is ｃA packaging piece J-A and ｃA packaging piece J-B which are used for reversely packaging ｃA port RJ45-A and ｃA port RJ45-B of ｃA module A, B from left to right, and the other device is an FPC flat flip lower connector P-A and an FPC flat flip lower connector P-B with ｃA pin pitch of 1 mm.

Packages J-a and J-B on ethernet patch panel PJ-a and PJ-B are reversed from left to right of the ethernet interface package of module A, B because after soldering, the Bottom layer of the PCB in module A, B makes contact with the Bottom layers of packages J-a and J-B, completing the flip in space.

The Ethernet adapter plate PJ-A and the FPC flat flip lower connector P-A on the Ethernet adapter plate PJ-B and the FPC flat flip lower connector P-B are connected in ｃA one-to-one correspondence mode through connecting wires on the top layer, the interfaces are outward, and then the flexible flat cables L with the 8P spacing of 1mm are used for being connected with each other, and datｃA communication of board-level Ethernet is achieved.

The above disclosure is not intended to limit the scope of the invention, which is defined by the claims, but is intended to cover all modifications within the scope and spirit of the invention.

Claims

1. An Ethernet port communication method based on lamination welding of pins of a DIP (dual in-line package) of a finished circuit board is characterized by comprising the following steps of:

s02: pins of each equipment/module interface penetrate through the Bottom layer from the Top layer of the PCB corresponding to each equipment/module interface through the through holes respectively, and the pins protrude after penetrating through the Bottom layer;

s04: an Ethernet adapter plate is provided with a packaging piece for packaging an interface RJ45 in a left-right reverse direction and an FPC flat flip cover lower connector;

s05: the top layers of the two FPC flat flip lower connectors are connected in a one-to-one correspondence mode through connecting wires, and the interfaces are connected with each other through flexible flat cables with 8P intervals of 1 mm.

2. The ethernet port connectivity method based on-board DIP pin stack soldering of claim 1, wherein: in step S02, the pins protrude 1-2mm after passing through the Bottom layer.

3. The ethernet port connectivity method based on-board DIP pin stack soldering of claim 1, wherein: in step S03, the thickness of the ethernet adapter plate is 0.4-0.6 mm.

4. The ethernet port connectivity method based on-board DIP pin stack soldering of claim 1, wherein: in step S04, the pitch of the pins of the FPC flat flip lower socket is 1 mm.