CN207636817U - The optical module of SFP+ encapsulation - Google Patents

Abstract

This application discloses a kind of optical modules of SFP+ encapsulation, including shell, first in shell, second emitting module, first, second receiving unit and Interleave muiltiplexing component element, ranging from 1,575 1580 nanometers of the wavelength of optical signal of first emitting module transmitting, ranging from 1,260 1280 nanometers of the wavelength of optical signal that first receiving unit receives, ranging from 1,480 1500 nanometers of the wavelength of optical signal of second emitting module transmitting, ranging from 1,290 1330 nanometers of the wavelength of optical signal that second receiving unit receives, Interleave muiltiplexing component element is by first, the light that second emitting module is sent out is launched after carrying out multiplex, Interleave muiltiplexing component element will be sent to first after the external light partial wave transmitted, second receiving unit.The application can reduce optical mode block size, on same veneer, can insert the SFP+ optical modules of 16pcs, relatively the XFP optical modules of slotting 8pcs originally, and port density and overall bandwidth all improve one times.

Description

The optical module of SFP+ encapsulation

Technical field

This application involves the optical modules that optical communication device manufacturing technology field more particularly to a kind of SFP+ encapsulate.

Background technology

In recent years, with the wide continuous improvement of access guipure, GPON networks start to develop to the directions XGPON.Upgrading Cheng Zhong, XGPON want and the public ODN networks of GPON, must just use wave multiplexer, this can be such that the difficulty of upgrading greatly increases, and And increase cost.

Combo-PON modules (i.e. the combination module of GPON and XGPON) are realized in module by GPON and XGPON two Kind wavelength carries out multiplex, and carries out independent optical signal and send and receive.That eliminates the uses of wave multiplexer, have at low cost A little.

Common Combo-PON modules are the XFP modules of TO encapsulation, and XFP module package dimensions are larger, are unfavorable for optical module Miniaturization.XFP modules when in use, since its volume is larger, it is larger to occupy third party's machine (server, interchanger etc.) Volume, the port density of such third party's machine will be relatively low, and the message transmission rate of unit volume is also just less high.

Utility model content

One embodiment of the application provides a kind of optical module, can greatly reduce module size, improves port density.It is described SFP+ encapsulation optical module include shell, be set to shell in the first emitting module, the first receiving unit, the second emitting module, The wavelength of optical signal ranging from 1575-1580 of second receiving unit and Interleave muiltiplexing component element, the first emitting module transmitting receives Rice, ranging from 1260-1280 nanometers of the wavelength of optical signal that first receiving unit receives, the second emitting module transmitting Ranging from 1480-1500 nanometers of wavelength of optical signal, the wavelength of optical signal ranging from 1290-1330 that second receiving unit receives Nanometer, the Interleave muiltiplexing component element are launched after the light that the first emitting module and the second emitting module are sent out is carried out multiplex, The Interleave muiltiplexing component element will be sent to the first receiving unit and the second receiving unit after the external light partial wave transmitted.

In one embodiment, the optical module of the SFP+ encapsulation includes the optical port of grafting optical fiber connector, substrate and printing electricity Road plate, first emitting module, first receiving unit, second emitting module and second receiving unit are located at Substrate, and be mutually electrically connected with the printed circuit board, first emitting module, first receiving unit, described second The connection of light path is realized between emitting module and second receiving unit and the optical port by the Interleave muiltiplexing component element.

In one embodiment, the optical module of the SFP+ encapsulation further includes flexible PCB and several contact pins, the flexible electrical Road plate one end is electrically connected with the printed circuit board, and the other end is mutually electrically connected with several contact pins；Several contact pins One end and the flexible PCB are electrically connected, the other end and first emitting module, first receiving unit, described the Two emitting modules and second receiving unit are mutually electrically connected.

In one embodiment, the flexible PCB is bent into U-shaped, and several contact pins are inserted in the U-shaped flexible circuit The bottom of plate, two ends and the printed circuit board of the U-shaped circuit board are electrically connected.

In one embodiment, several contact pins are arranged in two rows.

In one embodiment, the optical module of the SFP+ encapsulation includes a box, and the box has an accommodation space, described Interleave muiltiplexing component element, first emitting module, first receiving unit, second emitting module and described second receive Component is located in the accommodation space.

In one embodiment, the substrate is located in the accommodation space or a part for the composition box.

In one embodiment, the optical port is fixed on the side wall of the box.

In one embodiment, the substrate is ceramic circuit board.

Compared with prior art, the technical solution of the application realizes the work(of Combo-PON under the encapsulation of SFP+ optical modules Can, it can greatly reduce optical mode block size, on same veneer, the SFP+ optical modules of 16pcs can be inserted, relatively originally slotting 8pcs XFP optical modules, veneer port density improve one times, and overall bandwidth also improves one times.

Description of the drawings

Fig. 1 is the optical module schematic diagram of one embodiment of the application；

Fig. 2 is the optical module members schematic diagram of one embodiment of the application；

Fig. 3 is that the substrate of one embodiment of the application and flexible PCB interconnect schematic diagram.

Specific implementation mode

The application is described in detail below with reference to specific implementation mode shown in the drawings.But these embodiments are simultaneously The application is not limited, structure that those skilled in the art are made according to these embodiments, method or functionally Transformation is all contained in the protection domain of the application.

In each diagram of the application, for the ease of illustration, structure or partial certain sizes can be relative to other knots Structure or part are exaggerated, and therefore, are only used for the basic structure of the theme of diagram the application.

In addition, the term of the representation space relative position used herein such as "upper", " top ", "lower", " lower section " is A unit as shown in the drawings or feature are described relative to another unit or feature for the purpose convenient for explanation Relationship.The term of relative space position can be intended to include equipment in use or work other than orientation as shown in the figure not Same orientation.For example, if the equipment in figure overturn, it is described as being located at other units or feature " below " or " under " Unit will be located at other units or feature " top ".Therefore, exemplary term " lower section " can include above and below both Orientation.Equipment can otherwise be directed (be rotated by 90 ° or other directions), and be interpreted accordingly it is used herein with it is empty Between relevant description.

Join Fig. 1, is the schematic diagram of the optical module 100 of one embodiment of the application.

Optical module 100 includes shell 10.

Shell 10 includes mutually matched upper shell 11 and lower casing 12.

Optical module 100 further includes that (Electro Magnetic Interference, electromagnetism are dry by the EMI that coordinates with shell 10 Disturb) shrapnel 40, adapter 50, springlock 60 and dust cover 70.

In the present embodiment, optical module 100 is SPF+ optical modules 100.

In conjunction with Fig. 2, optical module 100 further includes the first emitting module 21 being located in shell 10, the first receiving unit 22, the Two emitting modules 23, the second receiving unit 24 and Interleave muiltiplexing component element 27.

Ranging from 1575-1580 nanometers of the wavelength of optical signal of first emitting module 21 transmitting, the first receiving unit 22 receive Ranging from 1260-1280 nanometers of wavelength of optical signal, the second emitting module 23 transmitting wavelength of optical signal ranging from 1480-1500 Nanometer, ranging from 1290-1330 nanometers of the wavelength of optical signal that the second receiving unit 24 receives, Interleave muiltiplexing component element 27 are sent out first It penetrates after the light that component 21 and the second emitting module 23 are sent out carries out multiplex and launches, Interleave muiltiplexing component element 27 transmits outside The first receiving unit 22 and the second receiving unit 24 are sent to after light partial wave.

Here, the first emitting module 21 and the first receiving unit 22 correspond to XGPON, and the second emitting module 23 and second receives Component 24 corresponds to GPON, it can be seen that the application realizes the function of Combo-PON under the encapsulation of SFP+ optical modules, can be significantly Reduce optical mode block size, on same veneer, the SFP+ optical modules of 16pcs can be inserted, relatively the XFP optical modules of slotting 8pcs originally, Veneer port density improves one times, and overall bandwidth also improves one times.

Wherein, XGPON patterns are single fiber bi-directional asymmetric data link, downstream rate 9.95328Gbps, upper scanning frequency Rate is 2.488Gbps；GPON patterns are single fiber bi-directional asymmetric data link, downstream rate 2.488Gbps, upstream rate For 1.244Gbps, SPF+ optical modules 100 mainly complete the conversion function of GPON-XGPON photoelectricity/electric light.

In the present embodiment, optical module 100 further includes optical port 28, substrate 25 and the printed circuit of grafting optical fiber connector Plate 30.

First emitting module 21, the first receiving unit 22, the second emitting module 23 and the second receiving unit 24 are located at substrate 25, and with 30 phase of printed circuit board be electrically connected, the first emitting module 21, the first receiving unit 22, the second emitting module 23 and The connection of light path is realized between second receiving unit 24 and optical port 28 by Interleave muiltiplexing component element 27.

Substrate 25 is ceramic circuit board.

Optical module 100 includes a box 26, and box 26 has an accommodation space S, the first emitting module 21, the first reception group Part 22, the second emitting module 23, the second receiving unit 24 and Interleave muiltiplexing component element 27 are located in accommodation space S.

Here, using the box mode ceramic board design of four tunnels one, four tunnels envelope is realized in a smaller space Dress.

Specifically, box 26 include hollow type shell 261, positioned at 261 opposite sides of shell heat sink 262, capping 263.

Hollow type shell 261, heat sink 262, capping 263 enclose and set to form accommodation space S.

Substrate 25 is located in accommodation space S or a part for composition box 26.

Substrate 25 and Interleave muiltiplexing component element 27 are contacted with heat sink 262 to realize heat dissipation.

Optical port 28 is fixed on the side wall of box 26.

Specifically, being also formed with an impenetrating mouth 2611 on the shell 261 of box 26, optical port is provided at impenetrating mouth 2611 28, to realize the transmission of reception/transmitting light.

In the present embodiment, in conjunction with Fig. 3, the optical module 100 of SFP+ encapsulation further includes flexible PCB 29 and several inserts Needle 80.

29 one end of flexible PCB is electrically connected with printed circuit board 30, and the other end is electrically connected with 80 phase of several contact pins.

80 one end of several contact pins is electrically connected with flexible PCB 29, and the other end and the first emitting module 21, first receive Component 22, the second emitting module 23 and 24 phase of the second receiving unit are electrically connected.

Specifically, flexible PCB 29 is bent into U-shaped, the bottom of U-shaped flexible PCB 29 has several jacks 291, if Dry contact pin 80 is inserted in several jacks 291 of the bottom of U-shaped flexible PCB 29, two ends and the print of U-shaped circuit board 29 Printed circuit board 30 is electrically connected.

Here, the aperture of jack 291 is mutually matched with contact pin 80, and several jacks 291 are located at the middle part of flexible PCB 29, Several jacks 291 are arranged in two rows of, one end connecting substrate 25 of several contact pins 80, and the other end is inserted into several jacks 291 and passes through Interconnection is realized in welding.

Flexible PCB 29 further includes the first pad 292 and the second pad 293, the first pad 292 and the second pad 293 In the both ends of flexible PCB 29, and the first pad 292 and the second pad 293 are connected with printed circuit board 30.

First pad 292 and the second pad 293 are mutually matched with the circuit diagram pad on printed circuit board 30, and pad it Between also by welding realize interconnection.

Here, between substrate 25 and printed circuit board 30 that four tunnels one is just realized by a piece of flexible PCB 29 Interconnection, it is simple in structure.

In addition, optical module 100 further includes the reinforcing plate 90 between substrate 25 and flexible PCB 29, several contact pins 80 Through reinforcing plate 90, the setting of reinforcing plate 90 can effectively improve the interconnection reliability between substrate 25 and flexible PCB 29.

In the present embodiment, in order to reduce the crosstalk between transmitting-receiving process as possible, when design, pass through that refine modeling high The means such as frequency emulation, special ground connection, ground level isolation, microstrip line and strip line gradual change designing impedance matching, it is ensured that receiving and transmitting signal, Between full link CROSSTALK in -30dB hereinafter, to be reacted in final actual product, module sensitivity -31dBm@10E- 10 or more.

It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book With the other embodiment of understanding.

The series of detailed descriptions listed above only for the application feasible embodiment specifically Bright, they are all without departing from equivalent implementations made by the application skill spirit not to limit the protection domain of the application Or change should be included within the protection domain of the application.

Claims (9)

1. a kind of optical module of SFP+ encapsulation, the optical module of the SFP+ encapsulation includes shell, the first transmitting being set in shell Component, the first receiving unit, the second emitting module, the second receiving unit and Interleave muiltiplexing component element, which is characterized in that described first Ranging from 1575-1580 nanometers of the wavelength of optical signal of emitting module transmitting, the wavelength of optical signal that first receiving unit receives Ranging from 1260-1280 nanometers, ranging from 1480-1500 nanometers of the wavelength of optical signal of the second emitting module transmitting is described Ranging from 1290-1330 nanometers of the wavelength of optical signal that second receiving unit receives, the Interleave muiltiplexing component element is by the first transmitting group The light that part and the second emitting module are sent out is launched after carrying out multiplex, the light partial wave that the Interleave muiltiplexing component element transmits outside After be sent to the first receiving unit and the second receiving unit.

2. the optical module of SFP+ according to claim 1 encapsulation, which is characterized in that the optical module of the SFP+ encapsulation includes Optical port, substrate and the printed circuit board of grafting optical fiber connector, it is first emitting module, first receiving unit, described Second emitting module and second receiving unit are located at substrate, and are mutually electrically connected with the printed circuit board, described first Lead between emitting module, first receiving unit, second emitting module and second receiving unit and the optical port Cross the connection that the Interleave muiltiplexing component element realizes light path.

3. the optical module of SFP+ encapsulation according to claim 2, which is characterized in that the optical module of the SFP+ encapsulation also wraps Flexible PCB and several contact pins are included, described flexible PCB one end is electrically connected with the printed circuit board, the other end and institute Several contact pins are stated mutually to be electrically connected；Described several contact pin one end and the flexible PCB are electrically connected, the other end and described the One emitting module, first receiving unit, second emitting module and second receiving unit are mutually electrically connected.

4. the optical module of SFP+ encapsulation according to claim 3, which is characterized in that the flexible PCB is bent into U-shaped, Several contact pins are inserted in the bottom of the U-shaped flexible PCB, two ends and the printing electricity of the U-shaped circuit board Road plate is electrically connected.

5. the optical module of SFP+ encapsulation according to claim 4, which is characterized in that several contact pins are arranged in two rows.

6. the optical module of SFP+ according to claim 5 encapsulation, which is characterized in that the optical module of the SFP+ encapsulation includes There is an accommodation space, the Interleave muiltiplexing component element, first emitting module, described first to receive for one box, the box Component, second emitting module and second receiving unit are located in the accommodation space.

7. the optical module of SFP+ encapsulation according to claim 6, which is characterized in that the substrate is located at the accommodation space Interior or the composition box a part.

8. the optical module of SFP+ encapsulation according to claim 7, which is characterized in that the optical port is fixed on the box On side wall.

9. the optical module of SFP+ encapsulation according to claim 8, which is characterized in that the substrate is ceramic circuit board.