CN109400134A - 高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法 - Google Patents

高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法 Download PDF

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CN109400134A
CN109400134A CN201811383166.0A CN201811383166A CN109400134A CN 109400134 A CN109400134 A CN 109400134A CN 201811383166 A CN201811383166 A CN 201811383166A CN 109400134 A CN109400134 A CN 109400134A
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silver
carbon fiber
plated carbon
preparation
layer
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董雄伟
陈悟
朱立成
唐彬
王训该
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Wuhan Textile University
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Wuhan Textile University
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Abstract

本发明涉及高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征是首先将碳纤维进行镀银，制备了镀银碳纤维；然后，采用一体压胚和烧结成型技术，制备了镀银碳纤维电热陶瓷板。该电热陶瓷板由表面层、镀银碳纤维发热层、微孔隔热基底层组成，其中，表面层含有碳化硅，其具有很好的导热和绝缘性能；镀银碳纤维发热层含有导热性能优异的石墨烯，有利于热量传递；隔热基底层采用造孔剂工艺制备很多微孔，隔热效果好。本发明制备的电热陶瓷板安装使用方便，镀银碳纤维传热效率高，具有广阔的市场前景。

Description

高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法
技术领域
本发明涉及电热陶瓷板的制造方法，具体涉及高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法。
背景技术
陶瓷越来越多地被应用到建筑行业中，随着人们对生活质量需求的提高，陶瓷制品的新功能的开发与设计日益成为研究的焦点。陶瓷地板是一种应用最广泛的地板之一，其具有很多优点，如：耐久、易打扫和易清洗等，设计出具有保温放热等特性的功能性陶瓷成为当前研究的热点。
目前，市场上具有保温放热的陶瓷地板较多，其多采用将发热体置于发热管内，将发热管嵌于瓷砖体内部，如：中国专利申请号201611002581.8公布了碳素纤维发热片瓷砖及其生产方法，该瓷砖包括墙砖本体、碳纤维发热片和发热管、聚氨酯泡沫层。此外，有的发热瓷砖采用将瓷砖板与发热层、保温层等通过粘结的方式结合，将发热体置于发热层内部凹槽，如：中国专利申请号201720123171.X公布了一种碳纤维发热瓷砖，其是将碳纤维发热丝置于发热层的凹槽内。这种将发热体置于发热管或置于发热层凹槽内的方式对于热的传递是不利的，因为这种排布方式导致在发热体的周围存有大量的空气，空气的传热效率非常差，从而，严重影响了传热的速率和质量。因此，急需寻求一种新的发热体与瓷砖相结合的方式来实现热量传递的最高效率。
在电热陶瓷板的制备中，发热材料(元件)的选择是关键，发热材料的优劣决定着电热陶瓷板的好坏。碳纤维作为发热元件被广泛使用，但是，碳纤维作为发热元件通常是单独使用，它与其它基材的相容性尚不十分清楚。银具有非常好的导电和导热性能，其通常作为电镀材料被广泛应用，其与很多材料均具有很好的相容性。镀银碳纤维的发热性能研究对碳纤维作为发热元件领域的开拓是一件很有意义的工作。
发明内容
本发明的目的是克服以往技术的不足，提供一种高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，所述的陶瓷板由表面层S1、镀银碳纤维发热层S2、微孔隔热基底层S3组成，如附图1所示。碳纤维本身是一种重要的发热材料，其经常被单独拿来用于作发热元件使用，本发明中采用电镀方法使其发热性能更进一步，具有重要理论和应用意义。本发明制备的电热陶瓷板采用一体压胚和烧结成型技术，将镀银碳纤维嵌在陶瓷里面，实现镀银碳纤维与陶瓷无缝接触，制备的电热陶瓷板使用方便，镀银碳纤维传热效率高，具有广阔的市场前景。
本发明所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于，所述方法包含如下步骤：
步骤一、微孔隔热基底层S3的制备：通过造孔剂工艺配置的微孔隔热基底层陶泥(粉)，然后平铺于胚体模具底层，其厚度为胚体模具总厚度的0.4～0.6倍，优选的，微孔隔热基底层陶泥(粉)料主要成分及含量为：60～80％的SiO2，10～15％的TiO2，5～8％的三聚磷酸钠，5～10％的一水合草酸铵，3～5％的聚甲基丙烯酸甲酯；
步骤二、镀银碳纤维发热层S2的制备：将镀银碳纤维直接铺设在微孔隔热基底层陶泥(粉)S3上，并用胚体粉料均匀覆盖，其施料厚度为胚体模具总厚度的0.4～0.6倍，平整后压胚；优选的，镀银碳纤维发热层S2陶泥(粉)料主要成分及含量为：45～55％的SiO2，25～35％的Al2O3，10～15％的石墨烯，1～2％的Fe2O3，2～5％的TiO2，1～2％的CaO，1～2％的MgO；
步骤三、铺设方式与结构设计：镀银碳纤维的铺设方式如附图2所示，把镀银碳纤维以方环形绕线方式盘绕在微孔隔热基底层S3平面上；镀银碳纤维电热层中的温度传感器预留空腔及导线槽规格及设计如图3所示，针孔状温度传感器置于空腔内部，镀银碳纤维电热线的两端预埋至电极端子孔位置，并由外接铜丝导线沿导线槽连接至智能数据控制装置；
步骤四、压胚与烧结成型：分层布料完成后，在模具中进行压胚或定型，其中粉料胚体压胚条件为压强不低于30MPa，压胚或定型完成后出模得半成品，干燥后放入窑炉烧结得到成品，其烧结温度为1000～1400℃，烧结时间为1～3h；
步骤五、表面层S1的制备：称取适量陶瓷釉料的原料，其组成为：22～24％的钾长石，3～5％的烧滑石，10～15％的碳化硅，7～9％的方解石，3～6％的球土，20～22％的烧高岭土，24～26％的熔块，0.8～1.2％的烧氧化锌，0.8～1.2％的烧氧化铝，将称量好的陶瓷釉料原料放入到球磨机中进行球磨，球磨时间1～3h，然后加入占釉料总量2～4％的葡萄糖，再次球磨1～3h，得到的釉浆施加在步骤四制备的陶瓷坯体上，经干燥后在1000～1400℃下烧结获得陶瓷板，优选地，烧成制度为常温～850℃，升温时长为10min，850℃～1100℃，升温时长为7min，1100℃保温10min，最后冷却15min，制得电热陶瓷板；
上述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于，步骤二中所述镀银碳纤维的制备方法为：
电化学沉积镀银在室温下进行，采用经打磨并酸洗处理的7～9mm电解银棒为阴极，100mm×20mm×3mm电解银板为阳极，两极间距70～80mm；称取适量碳纤维放入电镀液中，并用玻璃棒搅拌使其均匀分散；利用电动搅拌器机械搅拌，在5V直流电压下沉积包覆Ag，沉积时间为10min；将镀Ag的碳纤维用蒸馏水多次清洗即可；优选地，电镀液的组成为20～40g/LAgNO3，5～10g/LKNO3，40～50g/LC6H5Na3O7·2H2O。
本发明具有如下显著特点：
(1)本发明通过一体压胚和烧结成型技术，实现电热陶瓷板的发热元件与陶瓷之间无缝衔接，实现升温迅速，效率高，具有优良的电-热转换性能。
(2)本发明制备的电热陶瓷板在通电30～45秒之后表面温度可以达到55～58℃，在持续通电80～100秒后，样品的表面温度达到了88～91℃，而2～3分钟后样品的表面温度达到了116～119℃。
(3)本发明制备的电热陶瓷板的发热元件选用镀银碳纤维，而不是简单的碳纤维；对比实施例表明：采用镀银碳纤维作为发热元件，相比较普通的碳纤维，镀银碳纤维在电热陶瓷板中的传热效率更高。
(4)本发明制备的电热陶瓷板的隔热基底层含有很多微孔，隔热效果好；镀银碳纤维发热层含有导热性能优异的石墨烯，有利于热量向上传递；表面层含有碳化硅，其具有很好的导热和绝缘性能。通过在不同层内添加不同的添加剂，实现电热陶瓷板具有优异的传热性能，热损失小；
(5)本发明采用了分层布料，一次压胚、一次性烧结工艺，整个制造流程工艺简单且一体完成，易于产业化生产，而且安装铺设简单，便于市场普及。
附图说明
图1本发明电热陶瓷板纵向剖面结构示意图(1.温度传感器空腔；2.镀银碳纤维；S1.表面层；S2.镀银碳纤维发热层；S3.微孔隔热基底层)；
图2本发明电热陶瓷板内部镀银碳纤维束的平面排布示意图(1.电极端子；2.镀银碳纤维)；
图3本发明电热陶瓷板的温度传感器孔腔、导线槽和电极端子规格及结构示意图(1.导线槽；2.电极端子；3.温度传感器孔腔；S1.表面层；S3.微孔隔热基底层)。
具体实施方式
以下所述实施例详细说明了本发明。
实施例1
在本实施例中，高导热电绝缘一体成型镀银碳纤维电热陶瓷板采用如下方法制备而成，包括如下步骤：
步骤一、微孔隔热基底层S3的制备：通过造孔剂工艺配置的微孔隔热基底层陶泥(粉)，然后平铺于胚体模具底层，其厚度为胚体模具总厚度的0.5倍，优选的，微孔隔热基底层陶泥(粉)料主要成分及含量为：70％的SiO2，12％的TiO2，7％的三聚磷酸钠，7％的一水合草酸铵，4％的聚甲基丙烯酸甲酯；
步骤二、镀银碳纤维发热层S2的制备：将镀银碳纤维直接铺设在微孔隔热基底层陶泥(粉)S3上，并用胚体粉料均匀覆盖，其施料厚度为胚体模具总厚度的0.5倍，平整后压胚；优选的，镀银碳纤维发热层S2陶泥(粉)料主要成分及含量为：50％的SiO2，30％的Al2O3，12％的石墨烯，1.5％的Fe2O3，4％的TiO2，1.5％的CaO，1％的MgO；
步骤三、铺设方式与结构设计：镀银碳纤维的铺设方式如附图2所示，把镀银碳纤维以方环形绕线方式盘绕在微孔隔热基底层S3平面上；镀银碳纤维电热层中的温度传感器预留空腔及导线槽规格及设计如图3所示，针孔状温度传感器置于空腔内部，镀银碳纤维电热线的两端预埋至电极端子孔位置，并由外接铜丝导线沿导线槽连接至智能数据控制装置；
步骤四、压胚与烧结成型：分层布料完成后，在模具中进行压胚或定型，其中粉料胚体压胚条件为压强为40MPa，压胚或定型完成后出模得半成品，干燥后放入窑炉烧结得到成品，其烧结温度为1200～1300℃，烧结时间为2h；
步骤五、表面层S1的制备：称取适量陶瓷釉料的原料，其组成为：23％的钾长石，4％的烧滑石，12％的碳化硅，8％的方解石，5％的球土，21％的烧高岭土，25％的熔块，1％的烧氧化锌，1％的烧氧化铝，将称量好的陶瓷釉料原料放入到球磨机中进行球磨，球磨时间2h，然后加入占釉料总量3％的葡萄糖，再次球磨2h，得到的釉浆施加在步骤四制备的陶瓷坯体上，经干燥后在1300～1400℃下烧结获得陶瓷板，优选地，烧成制度为常温～850℃，升温时长为10min，850℃～1100℃，升温时长为7min，1100℃保温10min，最后冷却15min，制得电热陶瓷板a；
上述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于，步骤二中所述镀银碳纤维的制备方法为：
电化学沉积镀银在室温下进行，采用经打磨并酸洗处理的8mm电解银棒为阴极，100mm×20mm×3mm电解银板为阳极，两极间距75mm；称取适量碳纤维放入电镀液中，并用玻璃棒搅拌使其均匀分散；利用电动搅拌器机械搅拌，在5V直流电压下沉积包覆Ag，沉积时间为10min；将镀Ag的碳纤维用蒸馏水多次清洗即可；优选地，电镀液的组成为30g/LAgNO3，8g/LKNO3，45g/LC6H5Na3O7·2H2O。
实施例2
在本实施例中，高导热电绝缘一体成型镀银碳纤维电热陶瓷板采用如下方法制备而成，包括如下步骤：
步骤一、微孔隔热基底层S3的制备：通过造孔剂工艺配置的微孔隔热基底层陶泥(粉)，然后平铺于胚体模具底层，其厚度为胚体模具总厚度的0.45倍，优选的，微孔隔热基底层陶泥(粉)料主要成分及含量为：63％的SiO2，14％的TiO2，8％的三聚磷酸钠，10％的一水合草酸铵，5％的聚甲基丙烯酸甲酯；
步骤二、镀银碳纤维发热层S2的制备：将镀银碳纤维直接铺设在微孔隔热基底层陶泥(粉)S3上，并用胚体粉料均匀覆盖，其施料厚度为胚体模具总厚度的0.55倍，平整后压胚；优选的，镀银碳纤维发热层S2陶泥(粉)料主要成分及含量为：45％的SiO2，35％的Al2O3，11％的石墨烯，1％的Fe2O3，4％的TiO2，2％的CaO，2％的MgO；
步骤三、铺设方式与结构设计：镀银碳纤维的铺设方式如附图2所示，把镀银碳纤维以方环形绕线方式盘绕在微孔隔热基底层S3平面上；镀银碳纤维电热层中的温度传感器预留空腔及导线槽规格及设计如图3所示，针孔状温度传感器置于空腔内部，镀银碳纤维电热线的两端预埋至电极端子孔位置，并由外接铜丝导线沿导线槽连接至智能数据控制装置；
步骤四、压胚与烧结成型：分层布料完成后，在模具中进行压胚或定型，其中粉料胚体压胚条件为压强为40MPa，压胚或定型完成后出模得半成品，干燥后放入窑炉烧结得到成品，其烧结温度为1300～1400℃，烧结时间为3h；
步骤五、表面层S1的制备：称取适量陶瓷釉料的原料，其组成为：24％的钾长石，5％的烧滑石，10％的碳化硅，7％的方解石，6％的球土，20％的烧高岭土，26％的熔块，0.8％的烧氧化锌，1.2％的烧氧化铝，将称量好的陶瓷釉料原料放入到球磨机中进行球磨，球磨时间2h，然后加入占釉料总量2％的葡萄糖，再次球磨1h，得到的釉浆施加在步骤四制备的陶瓷坯体上，经干燥后在1000～1100℃下烧结获得陶瓷板，优选地，烧成制度为常温～850℃，升温时长为10min，850℃～1000℃，升温时长为7min，1100℃保温10min，最后冷却15min，制得电热陶瓷板b；
上述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于，步骤二中所述镀银碳纤维的制备方法为：
电化学沉积镀银在室温下进行，采用经打磨并酸洗处理的7mm电解银棒为阴极，100mm×20mm×3mm电解银板为阳极，两极间距80mm；称取适量碳纤维放入电镀液中，并用玻璃棒搅拌使其均匀分散；利用电动搅拌器机械搅拌，在5V直流电压下沉积包覆Ag，沉积时间为10min；将镀Ag的碳纤维用蒸馏水多次清洗即可；优选地，电镀液的组成为25g/LAgNO3，8g/LKNO3，40～50g/LC6H5Na3O7·2H2O。
实施例3
在本实施例中，高导热电绝缘一体成型镀银碳纤维电热陶瓷板采用如下方法制备而成，包括如下步骤：
步骤一、微孔隔热基底层S3的制备：通过造孔剂工艺配置的微孔隔热基底层陶泥(粉)，然后平铺于胚体模具底层，其厚度为胚体模具总厚度的0.4倍，优选的，微孔隔热基底层陶泥(粉)料主要成分及含量为：73％的SiO2，10％的TiO2，5％的三聚磷酸钠，9％的一水合草酸铵，3％的聚甲基丙烯酸甲酯；
步骤二、镀银碳纤维发热层S2的制备：将镀银碳纤维直接铺设在微孔隔热基底层陶泥(粉)S3上，并用胚体粉料均匀覆盖，其施料厚度为胚体模具总厚度的0.6倍，平整后压胚；优选的，镀银碳纤维发热层S2陶泥(粉)料主要成分及含量为：45％的SiO2，35％的Al2O3，15％的石墨烯，1％的Fe2O3，2％的TiO2，1％的CaO，2％的MgO；
步骤三、铺设方式与结构设计：镀银碳纤维的铺设方式如附图2所示，把镀银碳纤维以方环形绕线方式盘绕在微孔隔热基底层S3平面上；镀银碳纤维电热层中的温度传感器预留空腔及导线槽规格及设计如图3所示，针孔状温度传感器置于空腔内部，镀银碳纤维电热线的两端预埋至电极端子孔位置，并由外接铜丝导线沿导线槽连接至智能数据控制装置；
步骤四、压胚与烧结成型：分层布料完成后，在模具中进行压胚或定型，其中粉料胚体压胚条件为压强为50MPa，压胚或定型完成后出模得半成品，干燥后放入窑炉烧结得到成品，其烧结温度为1300～1400℃，烧结时间为3h；
步骤五、表面层S1的制备：称取适量陶瓷釉料的原料，其组成为：24％的钾长石，3％的烧滑石，15％的碳化硅，7％的方解石，3％的球土，20％的烧高岭土，26％的熔块，1％的烧氧化锌，1％的烧氧化铝，将称量好的陶瓷釉料原料放入到球磨机中进行球磨，球磨时间1h，然后加入占釉料总量2％的葡萄糖，再次球磨3h，得到的釉浆施加在步骤四制备的陶瓷坯体上，经干燥后在1000～1400℃下烧结获得陶瓷板，优选地，烧成制度为常温～850℃，升温时长为10min，850℃～1100℃，升温时长为7min，1100℃保温10min，最后冷却15min，制得电热陶瓷板c；
上述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于，步骤二中所述镀银碳纤维的制备方法为：
电化学沉积镀银在室温下进行，采用经打磨并酸洗处理的7mm电解银棒为阴极，100mm×20mm×3mm电解银板为阳极，两极间距70mm；称取适量碳纤维放入电镀液中，并用玻璃棒搅拌使其均匀分散；利用电动搅拌器机械搅拌，在5V直流电压下沉积包覆Ag，沉积时间为10min；将镀Ag的碳纤维用蒸馏水多次清洗即可；优选地，电镀液的组成为20～40g/LAgNO3，5～10g/LKNO3，40～50g/LC6H5Na3O7·2H2O。
实施例4
本实施例为对比实施例，采用碳纤维作为发热元件，碳纤维的用量与镀银碳纤维的用量相同，采用实施例3的方法制备电热陶瓷板，具体步骤如下：
步骤一、微孔隔热基底层S3的制备：通过造孔剂工艺配置的微孔隔热基底层陶泥(粉)，然后平铺于胚体模具底层，其厚度为胚体模具总厚度的0.4倍，优选的，微孔隔热基底层陶泥(粉)料主要成分及含量为：73％的SiO2，10％的TiO2，5％的三聚磷酸钠，9％的一水合草酸铵，3％的聚甲基丙烯酸甲酯；
步骤二、碳纤维发热层S2的制备：将碳纤维直接铺设在微孔隔热基底层陶泥(粉)S3上，并用胚体粉料均匀覆盖，其施料厚度为胚体模具总厚度的0.6倍，平整后压胚；优选的，碳纤维发热层S2陶泥(粉)料主要成分及含量为：45％的SiO2，35％的Al2O3，15％的石墨烯，1％的Fe2O3，2％的TiO2，1％的CaO，2％的MgO；
步骤三、铺设方式与结构设计：碳纤维的铺设方式如附图2所示，把碳纤维以方环形绕线方式盘绕在微孔隔热基底层S3平面上；碳纤维电热层中的温度传感器预留空腔及导线槽规格及设计如图3所示，针孔状温度传感器置于空腔内部，碳丝束电热线的两端预埋至电极端子孔位置，并由外接铜丝导线沿导线槽连接至智能数据控制装置；
步骤四、压胚与烧结成型：分层布料完成后，在模具中进行压胚或定型，其中粉料胚体压胚条件为压强为50MPa，压胚或定型完成后出模得半成品，干燥后放入窑炉烧结得到成品，其烧结温度为1300～1400℃，烧结时间为3h；
步骤五、表面层S1的制备：称取适量陶瓷釉料的原料，其组成为：24％的钾长石，3％的烧滑石，15％的碳化硅，7％的方解石，3％的球土，20％的烧高岭土，26％的熔块，1％的烧氧化锌，1％的烧氧化铝，将称量好的陶瓷釉料原料放入到球磨机中进行球磨，球磨时间1h，然后加入占釉料总量2％的葡萄糖，再次球磨3h，得到的釉浆施加在步骤四制备的陶瓷坯体上，经干燥后在1000～1400℃下烧结获得陶瓷板，优选地，烧成制度为常温～850℃，升温时长为10min，850℃～1100℃，升温时长为7min，1100℃保温10min，最后冷却15min，制得电热陶瓷板d；
性能评价实施例：
发热性能参数检测：根据预先设计的胚体模具，实施例1～4制得4种规格的陶瓷板小样品，分别为电热陶瓷板a、b、c和d，其厚度为8～10mm，面积为50mm*40mm。经检测，烧结成陶瓷板后碳丝发热导线的电阻为5.0～40.0Ω之间，复合实验预期。
测试电热陶瓷板a、b、c和d的发热性能。使用FLIR one红外相机与稳压电源对所制得的材料电热转换性能进行了表征。将烧制形成的陶瓷板碳丝束两端接上7.5～12v的恒定电源(电流0.5～1.5A)，并使用红外热成像相机对材料表面的温度进行实时测量，测试结果如表1所示：
表1实施例1～4制备的电热陶瓷板a、b、c和d在不同的通电时间下的表面温度
通电时间 电热陶瓷板a 电热陶瓷板b 电热陶瓷板c 电热陶瓷板d
30～45秒 55.3℃ 58.4℃ 56.4℃ 45.1℃
80～100秒 89.5℃ 91.5℃ 88.6℃ 73.4℃
2～3分钟 116.5℃ 115.3℃ 119.8℃ 103.8℃
由表1可知，陶瓷板的表面温度随着通电时间的增加而增加，热量由碳丝束的中心向两侧扩散，其中，电热陶瓷板a在通电30～45秒之后表面温度可以达到55.3℃，在持续通电80～100秒后，样品的表面温度达到了89.5℃，而2～3分钟后样品的表面温度达到了116.5℃。电热陶瓷板b和电热陶瓷板c在相同的通电时间时，其表面温度与电热陶瓷板a的表面温度十分接近；电热陶瓷板d的表面温度在相同的通电时间时要明显弱于电热陶瓷板a、b、c，这表明，碳纤维表面镀银后，其传热效率明显提高。

Claims (9)

1.高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于，所述方法包含如下步骤：
步骤一、微孔隔热基底层的制备：通过造孔剂工艺配置的微孔隔热基底层陶泥(粉)，然后平铺于胚体模具底层；
步骤二、发热层的制备：将镀银碳纤维直接铺设在微孔隔热基底层陶泥(粉)上，并用胚体粉料均匀覆盖，其施料厚度为胚体模具总厚度的0.4～0.6倍，平整后压胚；
所述镀银碳纤维的制备方法为：
电化学沉积镀银在室温下进行，采用经打磨并酸洗处理的7～9mm电解银棒为阴极，100mm×20mm×3mm电解银板为阳极，两极间距70～80mm；称取适量碳纤维放入电镀液中，并用玻璃棒搅拌使其均匀分散；利用电动搅拌器机械搅拌，在5V直流电压下沉积包覆Ag，沉积时间为10min；将镀Ag的碳纤维用蒸馏水多次清洗即可；
步骤三、铺设方式与结构设计：把镀银碳纤维以方环形绕线方式盘绕在微孔隔热基底层平面上；镀银碳纤维电热层中的温度传感器预留空腔及导线槽，针孔状温度传感器置于空腔内部，镀银碳纤维电热线的两端预埋至电极端子孔位置，并由外接铜丝导线沿导线槽连接至智能数据控制装置；
步骤四、压胚与烧结成型：分层布料完成后，在模具中进行压胚或定型，其中粉料胚体压胚条件为压强不低于30MPa，压胚或定型完成后出模得半成品，干燥后放入窑炉烧结得到成品；
步骤五、表面层的制备：称取适量陶瓷釉料的原料，将称量好的陶瓷釉料原料放入到球磨机中进行球磨，球磨时间1～3h，然后加入适量的葡萄糖，再次球磨1～3h，得到的釉浆施加在步骤四制备的陶瓷坯体上，经干燥后在1000～1400℃下烧结获得陶瓷板，优选地，烧成制度为常温～850℃，升温时长为10min，850℃～1100℃，升温时长为7min，1100℃保温10min，最后冷却15min，制得电热陶瓷板。
2.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤一中所述微孔隔热基底层厚度为胚体模具总厚度的0.4～0.6倍。
3.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤一中所述微孔隔热基底层陶泥(粉)料主要成分及含量为：60～80％的SiO2，10～15％的TiO2，5～8％的三聚磷酸钠，5～10％的一水合草酸铵，3～5％的聚甲基丙烯酸甲酯。
4.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤二中所述发热层的发热元件为镀银碳纤维。
5.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤二中所述镀银碳纤维发热层陶泥(粉)料主要成分及含量为：45～55％的SiO2，25～35％的Al2O3，10～15％的石墨烯，1～2％的Fe2O3，2～5％的TiO2，1～2％的CaO，1～2％的MgO。
6.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤二中所述电镀液的组成为20～40g/LAgNO3，5～10g/LKNO3，40～50g/LC6H5Na3O7·2H2O。
7.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤四中所述窑炉烧结温度为1000～1400℃，结时间为1～3h。
8.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤五中所述陶瓷釉料的原料组成为：22～24％的钾长石，3～5％的烧滑石，10～15％的碳化硅，7～9％的方解石，3～6％的球土，20～22％的烧高岭土，24～26％的熔块，0.8～1.2％的烧氧化锌，0.8～1.2％的烧氧化铝。
9.根据权利要求1所述的高导热电绝缘一体成型镀银碳纤维电热陶瓷板的制备方法，其特征在于：步骤五中所述葡萄糖的用量为占釉料总量2～4％。
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Application publication date: 20190301