CN109390449B - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
CN109390449B
CN109390449B CN201810869572.1A CN201810869572A CN109390449B CN 109390449 B CN109390449 B CN 109390449B CN 201810869572 A CN201810869572 A CN 201810869572A CN 109390449 B CN109390449 B CN 109390449B
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CN
China
Prior art keywords
light emitting
emitting device
disposed
package
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810869572.1A
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Chinese (zh)
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CN109390449A (en
Inventor
李太星
金元中
宋俊午
任仓满
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
Original Assignee
Suzhou Liyu Semiconductor Co ltd
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Filing date
Publication date
Priority claimed from KR1020170097970A external-priority patent/KR102369237B1/en
Priority claimed from KR1020170107566A external-priority patent/KR102379834B1/en
Application filed by Suzhou Liyu Semiconductor Co ltd filed Critical Suzhou Liyu Semiconductor Co ltd
Publication of CN109390449A publication Critical patent/CN109390449A/en
Application granted granted Critical
Publication of CN109390449B publication Critical patent/CN109390449B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Telephone Function (AREA)
  • Container Filling Or Packaging Operations (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)

Abstract

The present invention relates to a light emitting device package. The light emitting device package according to the embodiment includes: packaging the main body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings through the package body on an upper surface of the package body and a recess recessed from the upper surface of the package body in a direction of a lower surface of the package body. The light emitting device includes a first bonding portion disposed on the first opening and a second bonding portion disposed on the second opening. An adhesive is disposed at the recess.

Description

Light emitting device package
Technical Field
The present embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus.
Background
A semiconductor device including a compound such as GaN and AlGaN has many advantages such as a wide and easily adjustable band gap energy, and thus the device can be used as a light emitting device, a light receiving device, and various diodes in various ways.
In particular, light emitting devices such as light emitting diodes and laser diodes obtained by using III-V or II-VI compound semiconductor substances are capable of realizing light having various wavelength bands such as red, green, blue, and ultraviolet rays due to the development of thin film growth techniques and device materials. In addition, light emitting devices such as light emitting diodes and laser diodes obtained by using group III-V or group II-VI compound semiconductor substances can realize a white light source having high efficiency by using a fluorescent substance or combining colors. Such a light emitting device has advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness, compared to conventional light sources such as fluorescent lamps and incandescent lamps.
Further, when a light receiving device such as a photodetector or a solar cell is manufactured using a group III-V or group II-VI compound semiconductor substance, a photocurrent is generated by absorbing light having various wavelength domains with the development of device materials, so that light having various wavelength domains, for example, from gamma rays to radio waves can be used. In addition, the light receiving device has the advantages of high response speed, safety, environmental protection, easiness in controlling device materials and the like, so that the light receiving device can be conveniently used for power supply control, ultrahigh frequency circuits or communication modules.
Accordingly, the semiconductor device has been applied to and expanded to a transmission module of an optical communication tool, a light emitting diode backlight source replacing a Cold Cathode Fluorescent Lamp (CCFL) constituting a backlight of a Liquid Crystal Display (LCD), a white light emitting diode lighting device replacing a fluorescent lamp or an incandescent bulb, a vehicle headlight, a traffic light, and a sensor for detecting gas or fire. In addition, the application of the semiconductor device can be extended to a high-frequency application circuit, a power control device, or a communication module.
For example, a light-emitting device can be provided as a pn junction diode having a characteristic of converting electric energy into light energy by using a group III-V element or a group II-VI element in the periodic table, and various wavelengths can be realized by adjusting the composition ratio of a compound semiconductor substance.
For example, since nitride semiconductors have high thermal stability and wide band gap energy, they have received great attention in the field of development of optical devices and high-power electronic devices. In particular, blue light emitting devices, green light emitting devices, ultraviolet (UV) light emitting devices, and red light emitting devices using nitride semiconductors are commercialized and widely used.
For example, the ultraviolet light emitting device refers to a light emitting diode that generates light distributed in a wavelength range of 200nm to 400 nm. In the above wavelength range, a short wavelength may be used for sterilization, purification, etc., and a long wavelength may be used for a lithography machine, a curing apparatus, etc.
Ultraviolet rays may be classified into UV-A (315 nm to 400 nm), UV-B (280 nm to 315 nm), and UV-C (200 nm to 280 nm) in order of long wavelength. The UV-Sup>A (315 nm to 400 nm) field is applied to various fields such as industrial UV curing, printing ink curing, exposure machine, counterfeit money discrimination, photocatalytic sterilization, special lighting (such as aquarium/agriculture), the UV-B (280 nm to 315 nm) domain is applied to medical use, and the UV-C (200 nm to 280 nm) domain is applied to air purification, water purification, sterilization products, and the like.
Meanwhile, since a semiconductor device capable of providing high output has been demanded, research into a semiconductor device capable of increasing output power by applying a high power source is being conducted.
In addition, for semiconductor device packaging, research into methods of improving light extraction efficiency of a semiconductor device and improving light intensity in a packaging stage has been conducted. In addition, with respect to semiconductor device packaging, research into methods of improving the bonding strength between package electrodes and semiconductor devices has been conducted.
In addition, for semiconductor device packages, research into methods of reducing manufacturing costs and improving manufacturing yield by improving process efficiency and changing structures has been conducted.
Disclosure of Invention
The embodiment may provide a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus capable of improving light extraction efficiency and electrical characteristics.
The embodiment may provide a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus capable of reducing manufacturing costs and improving manufacturing yield.
Embodiments provide a semiconductor device package and a method of manufacturing the same, which can prevent a re-melting phenomenon from occurring in a bonding region of the semiconductor device package during a process of re-bonding a semiconductor device to a substrate or the like.
The light emitting device package according to the embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device, wherein the package body includes first and second openings passing through the package body on an upper surface thereof; and a recess provided to be recessed from an upper surface of the package body in a direction of a lower surface of the package body, wherein the light emitting device includes a first adhesive part disposed on the first opening and a second adhesive part disposed on the second opening, and wherein the adhesive is provided at the recess.
According to an embodiment, the recess may be provided at a periphery (periphery) of the first and second openings in a closed loop shape.
According to the embodiment, the size of the light emitting device may be set to be larger than the inner area of the closed loop provided by the recess when viewed from the upward direction of the light emitting device.
According to an embodiment, the closed loop provided by the recess may be arranged in a contour (outline) connecting four side surfaces of the light emitting device, when viewed from an upward direction of the light emitting device.
According to the embodiment, the profile connecting the four side surfaces of the light emitting device may be disposed to overlap on the recess when viewed from the upward direction of the light emitting device.
According to an embodiment, the package body may include a first frame, a second frame, and a body disposed between the first frame and the second frame, wherein the first opening may be provided at the first frame, wherein the second opening may be provided at the second frame, and wherein the recess may be provided to be connected with an upper surface of the first frame, an upper surface of the body, and an upper surface of the second frame.
The light emitting device package according to the embodiment may further include an upper recess disposed to be recessed from the upper surface of the package body in a direction of the lower surface of the package body, wherein the upper recess may be disposed between the first opening and the second opening.
According to an embodiment, the adhesive may be arranged at the periphery of the first and second bonds.
The light emitting device package according to the embodiment may include: a first conductive layer disposed at the first opening and electrically connected to the first bonding portion; and a second conductive layer disposed at the second opening and electrically connected to the second bonding portion.
The light emitting device package according to the embodiment may include a first conductor disposed between the first bonding part and the first conductive layer and a second conductor disposed between the second bonding part and the second conductive layer.
According to an embodiment, the adhesive may be disposed in direct contact with the upper surface of the package body and the lower surface of the light emitting device, and may surround and seal the peripheries of the first and second bonding portions.
According to an embodiment, the first and second bonding portions may include at least one material selected from the group consisting of Ti, al, in, ir, ta, pd, co, cr, mg, zn, ni, si, ge, ag alloy, au, hf, pt, ru, rh, sn, cu, znO, irOx, ruOx, niO, ruOx/ITO, ni/IrOx/Au and Ni/IrOx/Au/ITO, or alloys thereof.
According to an embodiment, the first conductive layer and the second conductive layer may include at least one material selected from the group consisting of Ag, au, pt, sn, cu, and SAC (Sn-Ag-Cu) or an alloy thereof.
According to an embodiment, the first conductor may be arranged in the first opening and the second conductor may be arranged in the second opening.
According to an embodiment, the first conductor may be arranged to overlap the first bonding portion in the vertical direction, and the second conductor may be disposed to overlap the second bonding portion in the vertical direction.
The light emitting device package according to the embodiment includes: a package body comprising: a first frame including a first opening; a second frame including a second opening; and a main body disposed between the first frame and the second frame; a light emitting device disposed on the package body and including a first bonding portion and a second bonding portion; and an adhesive disposed between an upper surface of the package body and a lower surface of the light emitting device, wherein the package body includes a recess provided to be recessed from the upper surface of the package body in a direction of the lower surface of the package body, and wherein the recess is disposed at peripheries of the first and second openings in a closed loop shape.
According to an embodiment, the recess may be provided to be connected with an upper surface of the first frame, an upper surface of the body, and an upper surface of the second frame.
The light emitting device package according to the embodiment may include: a first conductive layer disposed at the first opening and electrically connected to the first bonding portion; and a second conductive layer disposed at the second opening and electrically connected to the second bonding portion.
The light emitting device package according to the embodiment may include: a first conductor disposed in the first opening and disposed between the first bonding portion and the first conductive layer; and a second conductor disposed in the second opening and between the second bond and the second conductive layer.
According to an embodiment, the first conductive layer may be disposed in direct contact with a lower surface of the first bonding portion and a side surface of the first conductor, and the second conductive layer may be disposed in direct contact with a lower surface of the second bonding portion and a side surface of the second conductor.
The light emitting device package according to the embodiment includes: a main body; first and second frames spaced apart from each other at the body; a light emitting device including a light emitting structure, a first bonding portion disposed under the light emitting structure, and a second bonding portion disposed under the light emitting structure to be spaced apart from the first bonding portion; a molding member surrounding the light emitting device; and a heat dissipation member disposed between the first and second frames, wherein the lower surface of the main body and the lower surfaces of the first and second frames form the same plane, the first bonding portion includes a first side surface close to the second bonding portion and a second side surface facing the first side surface, the second bonding portion includes a third side surface close to the first bonding portion and a fourth side surface facing the third side surface, wherein the first and third side surfaces contact the heat dissipation member, and the second and fourth sides contact the molding member, an upper surface of the heat dissipation member contacts the light emitting device and extends in a first direction, wherein the first direction is a direction from an upper surface of the light emitting device toward the lower surface of the main body, and a first distance from the upper surface of the light emitting device to the lower surface of the first frame is set to be equal to or greater than a second distance from the upper surface of the light emitting device to the lower surface of the heat dissipation member.
According to an embodiment, the body may include an opening passing through a lower surface of the body in the first direction at an upper surface of the body, and the heat discharging member may be disposed at the opening.
The light emitting device package according to the embodiment may further include a first conductive layer disposed between the first bonding part and the first frame; and a second conductive layer disposed between the second coupling portion and the second frame.
According to the embodiment, the molding member (molding member) may include a reflective resin portion disposed under the light emitting device and a molding part (molding part) disposed at the periphery of the light emitting device.
According to an embodiment, an area of a lower surface of the first bonding portion or an area of a lower surface of the second bonding portion may be smaller than an area of an upper region of the opening.
According to an embodiment, the heat dissipation member may include an epoxy-based resin (epoxy-based resin) or a silicone-based resin (silicone-based resin), and may include a material selected from the group consisting of Al 2 O 3 And AlN.
According to an embodiment, the heat dissipation member may be provided as an insulating adhesive, and the first conductive layer and the second conductive layer may be provided as a conductive adhesive.
The light emitting device package according to the embodiment may further include: a first conductor disposed between the first bonding portion and the first conductive layer; and a second conductor disposed between the second junction and the second conductive layer.
The method of manufacturing a light emitting device package according to the embodiment includes: providing a first frame, a second frame, and a package body including a body disposed between the first frame and the second frame and including an opening passing through upper and lower surfaces thereof; providing a light emitting device including a first bonding portion and a second bonding portion disposed on a lower surface thereof on a package body, wherein the first bonding portion is disposed on a first frame and the second bonding portion is disposed on a second frame; and disposing a heat dissipation member disposed through the opening, the heat dissipation member being in direct contact with a lower surface of the light emitting device.
According to an embodiment, the method may further include providing a molding member at a periphery of the light emitting device.
According to an embodiment, the providing of the molding member may include: a reflective resin portion is provided under the light emitting device and a molding portion is provided at a periphery of the light emitting device.
According to an embodiment, when the heat dissipation member is provided, the heat dissipation member may be disposed in direct contact with the first coupling portion and the second coupling portion.
The semiconductor device package and the method of manufacturing the semiconductor device package according to the embodiment may improve light extraction efficiency, electrical characteristics, and reliability.
The semiconductor device package and the method of manufacturing the semiconductor device package according to the embodiment can improve process efficiency and propose a new package structure, thereby reducing manufacturing costs and improving manufacturing yield.
According to the embodiment, the semiconductor device package is provided with the body having high reflectivity, so that the discoloration of the reflector can be prevented, thereby improving the reliability of the semiconductor device package.
According to the embodiments, the semiconductor device package and the method of manufacturing the semiconductor device can prevent a re-melting phenomenon from occurring in a bonding region of the semiconductor device package during a process of re-bonding the semiconductor device package to a substrate or the like.
Drawings
Fig. 1 is a plan view of a light emitting device package according to an embodiment of the present invention.
Fig. 2 is a bottom view of the light emitting device package shown in fig. 1.
Fig. 3 is a cross-sectional view taken along line D-D of the light emitting device package shown in fig. 1.
Fig. 4 is a view explaining an arrangement relationship of a first frame, a second frame, and a main body applied to a light emitting device package according to an embodiment of the present invention.
Fig. 5a and 5b are views explaining a state in which a package body is set by the method of manufacturing a light emitting device package according to an embodiment of the present invention.
Fig. 6a and 6b are views explaining a state where a light emitting device is set by the method of manufacturing a light emitting device package according to an embodiment of the present invention.
Fig. 7a and 7b are views explaining a state in which a heat dissipation member is provided at an opening by the method of manufacturing a light emitting device package according to an embodiment of the present invention.
Fig. 8a and 8b are views explaining a state in which a molding member is provided by the method of manufacturing a light emitting device package according to an embodiment of the present invention.
Fig. 9 is a view illustrating another example of a light emitting device package according to an embodiment of the present invention.
Fig. 10 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 11 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 12 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 13 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 14 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 15 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 16 is an exploded perspective view explaining a light emitting device package according to an embodiment of the present invention.
Fig. 17 is a view explaining an arrangement relationship of a package body, a recess, and an opening of a light emitting device package according to an embodiment of the present invention.
Fig. 18 to 21 are views explaining a method of manufacturing a light emitting device package according to an embodiment of the present invention.
Fig. 22 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 23 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 24 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 25 is a view explaining an arrangement relationship of a package body, a recess, an opening, and an upper recess of the light emitting device package shown in fig. 24.
Fig. 26 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 27 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 28 is a plan view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 29 is a bottom view of the light emitting device package shown in fig. 28.
Fig. 30 is a cross-sectional view taken along line F-F of the light emitting device package shown in fig. 29.
Fig. 31 is a view explaining an arrangement relationship of a package body, a recess, and an opening of the light emitting device package shown in fig. 28.
Fig. 32 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 33 is a view explaining an arrangement relationship of a package body, a recess, an opening, and an upper recess of the light emitting device package shown in fig. 32.
Fig. 34 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 35 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 36 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Fig. 37 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments will be described with reference to the drawings. In the description of the embodiments, it will be understood that when a layer (or film), a region, a pattern, or a structure is referred to as being "on" or "under" another layer (or film), region, pattern, or structure, the terms "on" and "under" include the meanings of "directly" or "indirectly" by interposing another layer. Further, reference will be made to "upper" and "lower" with respect to each layer based on the drawings, but the embodiment is not limited thereto.
Hereinafter, a semiconductor device package and a method of manufacturing the semiconductor device package according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, description will be made based on a case of applying a light emitting device as an example of a semiconductor device.
First, a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 1 to 4.
The light emitting device package 100 according to the embodiment may include a package body 110 and a light emitting device 120, as shown in fig. 1 to 4.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line. The main body 113 may also be referred to as an insulating member.
For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
The body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
The body 113 may provide an inclined surface disposed on the first frame 111 and the second frame 112. The cavity C may be disposed on the first and second frames 111 and 112 through the inclined surface of the body 113.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the body 113 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychloroterphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al), and the like 2 O 3 ) And the like. In addition, the body 113 may include a high refractive index filler, such as TiO 2 And SiO 2 。
The first frame 111 and the second frame 112 may be provided as conductive frames. The first and second frames 111 and 112 may stably provide structural strength of the package body 110 and may be electrically connected to the light emitting device 120.
According to an embodiment, as shown in fig. 2 to 4, the body 113 may include an opening TH1. The opening TH1 may be disposed between the first frame 111 and the second frame 112. The opening TH1 may be disposed under the light emitting device 120.
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124, as shown in fig. 3. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the package body 110.
The light emitting structure 123 may include a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer. The first bonding portion 121 may be electrically connected to the first conductive type semiconductor layer. In addition, the second junction 122 may be electrically connected to the second conductive type semiconductor layer.
The light emitting device 120 may be disposed on the package body 110. The light emitting device 120 may be disposed on the first frame 111 and the second frame 112. The light emitting device 120 may be disposed in the cavity C provided by the package body 110.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding part 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling part 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
The first and second bonding portions 121 and 122 may be formed as a single layer or a multi-layer by using at least one material selected from the group consisting of Ti, al, in, ir, ta, pd, co, cr, mg, zn, ni, si, ge, ag alloy, au, hf, pt, ru, rh, sn, cu, znO, irOx, ruOx, niO, ruOx/ITO and Ni/IrOx/Au, ni/IrOx/Au/ITO, or alloys thereof.
In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductive layer 321 may be disposed on the first frame 111. The first conductive layer 321 may be disposed under the first bonding part 121.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding part 121. The first conductive layer 321 may provide a function of fixing the first coupling part 121 and the first frame 111.
The second conductive layer 322 may be disposed on the second frame 112. The second conductive layer 322 may be disposed under the second bonding part 122.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may provide a function of fixing the second coupling portion 122 and the second frame 112.
The first and second conductive layers 321 and 322 may include one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may be at least one selected from the group consisting of solder paste, silver paste, and the like.
According to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be referred to as a conductive adhesive. The first and second conductive layers 321 and 322 may fix the first and second coupling parts 121 and 122 to the first and second frames 111 and 112. In addition, the first and second conductive layers 321 and 322 may electrically connect the first and second coupling parts 121 and 122 to the first and second frames 111 and 112.
In the lower surface regions of the first and second frames 111 and 112, a width W3 between the first and second conductive layers 321 and 322 may be set to several hundred micrometers. In the lower surface regions of the first and second frames 111 and 112, a width W3 between the first and second conductive layers 321 and 322 may be selected to be set to exceed a predetermined distance in order to prevent a short circuit from occurring between pads when the light emitting device package 100 according to the embodiment is mounted on a circuit board, a submount, or the like after that.
The light emitting device package 100 according to the embodiment may include a heat dissipation member 133.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be arranged at the same plane.
The upper surface of the heat discharging member 133 may be disposed to be in contact with the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from the upper surface of the light emitting device 120 toward the lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat dissipation member 133.
In addition, the light emitting device package 100 according to the embodiment may include an opening TH1 as shown in fig. 1 to 4.
The opening TH1 may be provided at the body 113. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction. The opening TH1 may be disposed under the light emitting device 120. The opening TH1 may be disposed to overlap the light emitting device 120 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat dissipation member 133 may be disposed to contact a side surface of the first coupling portion 121 and a side surface of the second coupling portion 122.
The first coupling portion 121 may include a first side surface adjacent to the second coupling portion 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface adjacent to the first coupling portion 121 and a fourth side surface facing the third side surface.
According to an embodiment, the heat discharging member 133 may be disposed to be in contact with the first side surface of the first coupling part 121 and the third side surface of the second coupling part 122. As an example, the heat discharging member 133 may be disposed in direct contact with the first side surface of the first coupling portion 121 and the third side surface of the second coupling portion 122.
In addition, the heat dissipation member 133 may be disposed between the light emitting device 120 and the package body 110. The heat dissipation member 133 may be disposed between the light emitting device 120 and the first frame 111. The heat dissipation member 133 may be disposed between the light emitting device 120 and the second frame 112. The heat discharging member 133 may be disposed to be surrounded by the body 113.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat discharging member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space (empty space) in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material (epoxy-based material), a silicone-based material (silicone-based material), and a mixed material including an epoxy-based material and a silicone-based material. Further, as an example, when the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, heat dissipationThe member 133 may include a material composed of Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device 120. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
In addition, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package 100 by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
The opening TH1 may provide an appropriate space in which an under-filling process may be performed at a lower portion of the light emitting device 120. Here, the underfill process may be a process of mounting the light emitting device 120 on the package body 110 and then disposing the heat dissipation member 133 under the light emitting device 120. The opening TH1 may be disposed at a first depth or more so that the heat discharging member 133 may be sufficiently disposed between the lower surface of the light emitting device 120 and the upper surface of the body 113.
The depth and width W4 of the opening TH1 may affect the formation position and the fixing force of the heat discharging member 133. The depth and width W4 of the opening TH1 may be determined such that the fixing force may be sufficiently provided by the heat discharging member 133 disposed between the body 113 and the light emitting device 120.
As an example, the depth of the opening TH1 may be set to correspond to the thickness of the first frame 111 or the second frame 112. The depth of the opening TH1 may be set with a stable strength capable of maintaining the first frame 111 or the second frame 112.
In addition, the depth of the opening TH1 may be set to correspond to the thickness of the body 113. The depth of the opening TH1 may be set at a thickness capable of maintaining stable strength of the body 113.
As an example, the depth of the opening TH1 may be set to several hundred micrometers. The depth of the opening TH1 may be set to 180 to 220 μm. As an example, the depth of the opening TH1 may be set to 200 micrometers.
In addition, the width W4 of the opening TH1 may be set to several tens micrometers to several hundreds micrometers. Here, the width W4 of the opening TH1 may be disposed in the major axis direction of the light emitting device 120.
The width W4 of the opening TH1 may be set narrower than a gap between the first and second coupling portions 121 and 122. The width W4 of the opening TH1 may be set to 140 to 400 micrometers.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package of the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As an example, the area of the first bonding portion 121 may be set smaller than the area of the upper region of the opening TH1, as shown in fig. 4. In addition, the area of the second coupling portion 122 may be set smaller than the area of the upper region of the opening TH1, as shown in fig. 4.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light emitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
In addition, the light emitting device package 100 according to the embodiment may include a molding member, as shown in fig. 1 to 3. As an example, the molding member according to the embodiment may include a resin portion 135 and a molding part 140.
The molding member according to the embodiment may include at least one of the resin portion 135 and the molding part 140. First, in the following embodiments, description is made based on a case in which the molding member includes the resin portion 135 and the molding part 140.
However, according to another embodiment, the molding member may include only the resin portion 135, or may include only the molding part 140.
The resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be disposed at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be reflectiveThe reflector of the light emitted from the light emitting device 120, for example, includes a material such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving the reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package 100 according to the embodiment may include a molding part 140, as shown in fig. 1 and 3.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to incident light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. As an example, the molding part 140 may be referred to as a wavelength conversion molding member.
In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
According to an embodiment, as described above, the first coupling part 121 may include a first side surface adjacent to the second coupling part 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
As an example, the first side surface of the first bonding portion 121 and the third side surface of the second bonding portion 122 may be disposed to be in contact with the heat discharging member 133. In addition, the second side surface of the first bonding portion 121 and the fourth side surface of the second bonding portion 122 may be disposed to be in contact with a molding member such as the resin part 135 and the molding portion 140.
Meanwhile, as described above, according to another example of the light emitting device package according to the embodiment of the present invention, the resin portion 135 may not be separately provided, and the molding part 140 may be disposed to be in direct contact with the first and second frames 112. In addition, the molding part 140 is not separately provided, and the resin part 135 may be provided at the periphery and the upper portion of the light emitting device 120.
In addition, according to an embodiment, the light emitting structure 123 may be provided as a compound semiconductor. The light emitting structure 123 may be provided as, for example, a II-VI or III-V compound semiconductor. As an example, the light emitting structure 123 may be provided with at least two or more elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N).
The light emitting structure 123 may include a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer.
The first and second conductive type semiconductor layers may be implemented as at least one of II-VI or III-V compound semiconductors. Of the first conductivity typeThe semiconductor layer and the second conductive type semiconductor layer may be formed of a material having an empirical formula of In x Al y Ga 1-x-y N (x is more than or equal to 0 and less than or equal to 1, y is more than or equal to 0 and less than or equal to 1, and x + y is more than or equal to 0 and less than or equal to 1). For example, the first and second conductive type semiconductor layers may include at least one selected from the group consisting of GaN, alN, alGaN, inGaN, inN, inAlGaN, alInN, alGaAs, gaP, gaAs, gaAsP, alGaInP, and the like. The first conductive type semiconductor layer may be an n-type semiconductor layer doped with an n-type dopant such as Si, ge, sn, se, or Te. The second conductive type semiconductor layer may be a p-type semiconductor layer doped with a p-type dopant such as Mg, zn, ca, sr, or Ba.
The active layer may be implemented as a compound semiconductor. The active layer may be implemented as at least one of a group III-V or group II-VI compound semiconductor. When the active layer is implemented as a multi-well structure, the active layer may include a plurality of well layers and a plurality of barrier layers alternately arranged, and the active layer may be regarded as having an empirical formula In x Al y Ga 1-x-y N (x is more than or equal to 0 and less than or equal to 1, y is more than or equal to 0 and less than or equal to 1, and x + y is more than or equal to 0 and less than or equal to 1). For example, the active layer may include at least one selected from the group consisting of InGaN/GaN, gaN/AlGaN, alGaN/AlGaN, inGaN/InGaN, alGaAs/GaAs, inGaAs/GaAs, inGaP/GaP, alInGaP/InGaP, and InP/GaAs.
In the light emitting device package 100 according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second bonding parts 121 and 122. In addition, light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
Meanwhile, the light emitting device package 100 according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in a reflow process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device disposed in the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding part and the second bonding part of the light emitting device according to the embodiment may provide the driving power through the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers disposed at the first and second openings may be selected to have a higher value than that of a general bonding material.
Therefore, since the light emitting device package 100 according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of polyphthalamide (PPA) resin, polycyclohexylenedimethylene terephthalate (PCT) resin, epoxy Molding Compound (EMC) resin, and Silicone Molding Compound (SMC) resin.
Next, referring to the drawings, a method of manufacturing a light emitting device package according to an embodiment of the present invention will be described.
In describing the method of manufacturing a light emitting device package according to an embodiment of the present invention with reference to the accompanying drawings, a description of contents overlapping with those described with reference to fig. 1 to 4 may be omitted.
First, according to a method of manufacturing a light emitting device package according to an embodiment of the present invention, as shown in fig. 5a and 5b, a package body 110 may be provided.
Fig. 5a and 5b are a plan view and a cross-sectional view illustrating a state in which a package body is provided by a method of manufacturing a light emitting device package according to an embodiment of the present invention.
The package body 110 may include a first frame 111 and a second frame 112, as shown in fig. 5a and 5 b. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112.
The body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
The body 113 may provide an inclined surface disposed on the first frame 111 and the second frame 112. The cavity C may be disposed on the first and second frames 111 and 112 through the inclined surface of the body 113.
For example, the first frame 111 and the second frame 112 may be arranged to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
The body 113 may include an opening TH1. The opening TH1 may be disposed between the first frame 111 and the second frame 112. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
Then, according to the method of manufacturing the light emitting device package according to the embodiment, as shown in fig. 6a and 6b, the light emitting device 120 may be disposed on the package body 110.
Fig. 6a and 6b are a plan view and a cross-sectional view illustrating a state in which a light emitting device is disposed by a method of manufacturing a light emitting device package according to an embodiment of the present invention.
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may be disposed on the first frame 111 and the second frame 112. The light emitting device 120 may be disposed on the body 113. The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
As an example, the first and second coupling parts 121 and 122 may be fixed on the first and second frames 111 and 112 through the first and second conductive layers 321 and 322.
The first conductive layer 321 may be disposed on the first frame 111. The first conductive layer 321 may be disposed under the first bonding part 121.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may provide a function of fixing the first coupling part 121 and the first frame 111.
The second conductive layer 322 may be disposed on the second frame 112. The second conductive layer 322 may be disposed under the second bonding portion 122.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may provide a function of fixing the second coupling portion 122 and the second frame 112.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may be at least one selected from the group consisting of solder paste, silver paste, and the like.
According to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be referred to as a conductive adhesive. The first and second conductive layers 321 and 322 may fix the first and second coupling parts 121 and 122 to the first and second frames 111 and 112. In addition, the first and second conductive layers 321 and 322 may electrically connect the first and second coupling parts 121 and 122 to the first and second frames 111 and 112.
According to an embodiment, the light emitting device 120 may be disposed on the opening TH 1. The opening TH1 may be disposed between the first and second coupling parts 121 and 122 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed to overlap with a lower surface of the light emitting structure 123 in a direction from the lower surface of the body 113 toward the upper surface thereof.
As an example, a curing process for the first conductive layer 321 and the second conductive layer 322 may be performed. The first and second coupling parts 121 and 122 of the light emitting device 120 may be stably fixed on the first and second frames 111 and 112 through a curing process.
Then, in the method of manufacturing the light emitting device package according to the embodiment, the heat discharging member 133 may be disposed at the opening TH1, as shown in fig. 7a and 7 b.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be arranged at the same plane.
The upper surface of the heat discharging member 133 may be disposed to be in contact with the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from the upper surface of the light emitting device 120 toward the lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat dissipation member 133 may be disposed to contact a side surface of the first coupling portion 121 and a side surface of the second coupling portion 122.
The first coupling portion 121 may include a first side surface adjacent to the second coupling portion 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface adjacent to the first coupling portion 121 and a fourth side surface facing the third side surface.
According to an embodiment, the heat discharging member 133 may be disposed to be in contact with the first side surface of the first coupling part 121 and the third side surface of the second coupling part 122. As an example, the heat discharging member 133 may be disposed in direct contact with the first side surface of the first coupling portion 121 and the third side surface of the second coupling portion 122.
In addition, the heat dissipation member 133 may be disposed between the light emitting device 120 and the package body 110. The heat dissipation member 133 may be disposed between the light emitting device 120 and the first frame 111. The heat dissipation member 133 may be disposed between the light emitting device 120 and the second frame 112. The heat discharging member 133 may be disposed to be surrounded by the body 113.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat discharging member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. Further, as an example, when the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, the heat discharging member 133 may include Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device 120. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
In addition, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package 100 by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
As an example, a curing process for the heat discharging member 133 may be performed. The heat dissipation member 133 may be stably fixed between the light emitting device 120 and the package body 110 through a curing process.
Further, according to the method of manufacturing the light emitting device package according to the embodiment, as shown in fig. 8a and 8b, a molding member may be formed.
Fig. 8a and 8b are a plan view and a sectional view explaining a state in which a molding member is provided by the method of manufacturing a light emitting device package according to an embodiment of the present invention.
As described with reference to fig. 1 to 4, the molding member according to the embodiment may include at least one of the resin portion 135 and the molding part 140. Here, the description is made based on the case where the molding member includes both the resin portion 135 and the molding portion 140.
According to an embodiment, the resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be provided at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be a reflector that reflects light emitted from the light emitting device 120, for example, including materials such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package 100 according to the embodiment may include a molding part 140.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to input light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. As an example, the molding part 140 may be referred to as a wavelength conversion molding member.
In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
According to an embodiment, as described above, the first coupling part 121 may include a first side surface adjacent to the second coupling part 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
As an example, the first side surface of the first bonding portion 121 and the third side surface of the second bonding portion 122 may be disposed to be in contact with the heat discharging member 133. In addition, the second side surface of the first bonding portion 121 and the fourth side surface of the second bonding portion 122 may be disposed to be in contact with a molding member such as the resin part 135 and the molding portion 140.
Meanwhile, as described above, according to another example of the light emitting device package according to the embodiment of the present invention, the resin portion 135 may not be separately provided, and the molding part 140 may be disposed to be in direct contact with the first and second frames 112. In addition, the molding part 140 is not separately provided, and the resin part 135 may be provided at the periphery and the upper portion of the light emitting device 120.
As described above, according to the method of manufacturing the light emitting device package according to the embodiment, the peripheries of the first and second bonding parts 121 and 122 may be stably sealed by the heat dissipation member 133 and the molding members such as the resin part 135 and the molding part 140.
Therefore, according to the method of manufacturing the light emitting device package according to the embodiment, the first and second conductive layers 321 and 322 can be prevented from being diffused from the lower surfaces of the first and second bonding parts 121 and 122 in the side surface direction of the light emitting device 120, and a short circuit due to the light emitting device 120 can be prevented, thereby improving the reliability of the light emitting device package.
Meanwhile, in the above description, the description is made based on the case where the molding member such as the resin portion 135 and the molding part 140 is formed as shown in fig. 8a and 8b after the heat dissipation member 133 is formed as shown in fig. 7a and 7 b.
However, according to another example of the method of manufacturing the light emitting device package according to the embodiment, the molding member such as the resin part 135 and the molding part 140 may be formed first, and the heat dissipation member 133 may be formed later.
In addition, according to another example of the method of manufacturing a light emitting device package according to the embodiment, the resin portion 135 may not be formed, and the molding part 140 may be formed only in the cavity of the package body.
In the light emitting device package 100 according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second bonding parts 121 and 122. In addition, light emitted from the light emitting device 120 may be disposed in an upward direction of the package body 110.
Meanwhile, the light emitting device package 100 according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the frame and the light emitting device disposed at the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired. Accordingly, the position of the light emitting device can be changed, and the optical and electrical characteristics and reliability of the light emitting device package can be reduced.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding part and the second bonding part of the light emitting device according to the embodiment may provide the driving power through the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers arranged at the first and second openings may be selected to have a higher value than a common bonding material.
Therefore, since the light emitting device package 100 according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As an example, the area of the first coupling portion 121 may be set smaller than the area of the upper region of the opening TH 1. In addition, the area of the second coupling portion 122 may be set smaller than the area of the upper region of the opening TH 1.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 9.
In describing the light emitting device package according to the embodiment with reference to fig. 9, a description of contents overlapping with those described with reference to the drawings may be omitted.
The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in fig. 9.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line.
For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
The first frame 111 and the second frame 112 may be provided as conductive frames. The first and second frames 111 and 112 may stably provide structural strength of the package body 110 and may be electrically connected to the light emitting device 120.
According to an embodiment, the body 113 may include an opening TH1. The opening TH1 may be disposed between the first frame 111 and the second frame 112. The opening TH1 may be disposed under the light emitting device 120.
In addition, according to the embodiment, a stepped step shape may be provided at the upper surface of the first frame 111 and the upper surface of the second frame 112. For example, the upper surface of the body 113 may be provided in a flat shape, the upper surface of the first frame 111 may be provided in a stepped step shape having different heights, and the upper surface of the second frame 112 may be provided in a stepped step shape having different heights.
According to the embodiment, a recess structure recessed from the upper surface of the package body 110 toward the lower surface thereof may be provided by the flat upper surface of the body 113, the upper surface of the stepped step shape of the first frame 111, and the upper surface of the stepped step shape of the second frame 112.
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124, as shown in fig. 9. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the package body 110.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling part 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductive layer 321 may be disposed on the first frame 111. The first conductive layer 321 may be disposed under the first bonding part 121.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may provide a function of fixing the first coupling part 121 and the first frame 111.
The second conductive layer 322 may be disposed on the second frame 112. The second conductive layer 322 may be disposed under the second bonding part 122.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may provide a function of fixing the second coupling portion 122 and the second frame 112.
The first and second conductive layers 321 and 322 may include one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may be at least one selected from the group consisting of solder paste, silver paste, and the like.
According to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be referred to as a conductive adhesive. The first and second conductive layers 321 and 322 may fix the first and second coupling parts 121 and 122 to the first and second frames 111 and 112. In addition, the first and second conductive layers 321 and 322 may electrically connect the first and second coupling parts 121 and 122 to the first and second frames 111 and 112.
The light emitting device package according to the embodiment may include a heat dissipation member 133 as shown in fig. 9.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. The heat dissipation member 133 may be disposed at a stepped step-shaped recess structure disposed between the first frame 111 and the second frame 112. The heat discharging member 133 may be disposed on a flat surface of the body 113.
As described above, according to the embodiment, the heat dissipation member 133 may be disposed at the wide recess region provided by the upper surface of the first frame 111, the upper surface of the body 113, and the upper surface of the second frame 112. Accordingly, the heat dissipation characteristics of the light emitting device package according to the embodiment may be further improved.
In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be arranged on the same plane.
The upper surface of the heat discharging member 133 may be disposed to be in contact with the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from the upper surface of the light emitting device 120 toward the lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
In addition, the light emitting device package according to the embodiment may include an opening TH1, as shown in fig. 9.
The opening TH1 may be provided at the body 113. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction. The opening TH1 may be disposed under the light emitting device 120. The opening TH1 may be disposed to overlap the light emitting device 120 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat dissipation member 133 may be disposed to contact a side surface of the first coupling portion 121 and a side surface of the second coupling portion 122.
The first coupling portion 121 may include a first side surface adjacent to the second coupling portion 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
According to an embodiment, the heat discharging member 133 may be disposed to be in contact with the first side surface of the first coupling part 121 and the third side surface of the second coupling part 122. As an example, the heat discharging member 133 may be disposed in direct contact with the first side surface of the first coupling portion 121 and the third side surface of the second coupling portion 122.
In addition, the heat dissipation member 133 may be disposed between the light emitting device 120 and the package body 110. The heat dissipation member 133 may be disposed between the light emitting device 120 and the first frame 111. The heat dissipation member 133 may be disposed between the light emitting device 120 and the second frame 112. The heat discharging member 133 may be disposed to be surrounded by the body 113.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat dissipation member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. Further, as an example, when the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, the heat discharging member 133 may include Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device 120. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
In addition, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package 100 by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As an example, the area of the first bonding portion 121 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4. In addition, the area of the second coupling portion 122 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
In addition, the light emitting device package according to the embodiment may include a molding member, as shown in fig. 9. As an example, the molding member according to the embodiment may include a resin portion 135 and a molding part 140.
The resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be disposed at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be a reflector that reflects light emitted from the light emitting device 120, for example, including materials such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package 100 according to the embodiment may include a molding part 140, as shown in fig. 9.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to incident light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. As an example, the molding part 140 may be referred to as a wavelength conversion molding member.
In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
According to an embodiment, as described above, the first coupling part 121 may include a first side surface adjacent to the second coupling part 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
As an example, the first side surface of the first bonding portion 121 and the third side surface of the second bonding portion 122 may be disposed to be in contact with the heat discharging member 133. In addition, the second side surface of the first bonding portion 121 and the fourth side surface of the second bonding portion 122 may be disposed to be in contact with a molding member such as the resin part 135 and the molding portion 140.
In the light emitting device package according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second bonding parts 121 and 122. In addition, light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding part and the second bonding part of the light emitting device according to the embodiment may provide the driving power through the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers disposed at the first and second openings may be selected to have a higher value than that of a general bonding material.
Therefore, since the light emitting device package 100 according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 10.
In describing the light emitting device package according to the embodiment with reference to fig. 10, a description of contents overlapping with those described with reference to fig. 1 to 9 may be omitted.
The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in fig. 10.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line.
For example, the first frame 111 and the second frame 112 may be arranged to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
According to an embodiment, the body 113 may include an opening TH1. The opening TH1 may be disposed between the first frame 111 and the second frame 112. The opening TH1 may be disposed under the light emitting device 120.
The light emitting device package according to the embodiment shown in fig. 10 may further include a first recess R1 and a second recess R2, compared to the light emitting device package described with reference to fig. 3.
The first recess R1 may be disposed on an upper surface of the first frame 111. The first recess R1 may be provided to be recessed in the lower surface direction from the upper surface of the first frame 111. The first recess R1 may be disposed to be spaced apart from the opening TH1.
The second recess R2 may be provided on an upper surface of the second frame 112. The second recess R2 may be provided to be recessed in the lower surface direction from the upper surface of the second frame 112. The second upper recess R4 may be disposed to be spaced apart from the opening TH1.
According to an embodiment, the first conductive layer 321 may be disposed at the first recess R1. In addition, the first coupling portion 121 may be disposed at the first recess R1 region. In addition, the second conductive layer 322 may be disposed at the second recess R2. In addition, the second coupling portion 122 2 may be disposed at the second recess R2 region. The first recess R1 and the second recess R2 may provide a sufficient space in which the first conductive layer 321 and the second conductive layer 322 may be disposed.
The first conductive layer 321 may be disposed on the first frame 111. The first conductive layer 321 may be disposed under the first bonding part 121.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may provide a function of fixing the first coupling part 121 and the first frame 111.
The second conductive layer 322 may be disposed on the second frame 112. The second conductive layer 322 may be disposed under the second bonding part 122.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may provide a function of fixing the second coupling portion 122 and the second frame 112.
The first and second conductive layers 321 and 322 may include one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may be at least one selected from the group consisting of solder paste, silver paste, and the like.
According to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be referred to as a conductive adhesive. The first and second conductive layers 321 and 322 may fix the first and second coupling parts 121 and 122 to the first and second frames 111 and 112. In addition, the first and second conductive layers 321 and 322 may electrically connect the first and second coupling parts 121 and 122 to the first and second frames 111 and 112.
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124, as shown in fig. 10. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the package body 110.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling part 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
The light emitting device package according to the embodiment may include a heat dissipation member 133 as shown in fig. 10.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. According to an embodiment, the heat dissipation member 133 may be disposed on the upper surface of the first frame 111, the upper surface of the body 113, and the upper surface of the second frame 112.
In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be arranged on the same plane.
The upper surface of the heat discharging member 133 may be disposed to be in contact with the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from an upper surface of the light emitting device 120 toward a lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
In addition, the light emitting device package according to the embodiment may include an opening TH1, as shown in fig. 10.
The opening TH1 may be provided at the body 113. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction. The opening TH1 may be disposed under the light emitting device 120. The opening TH1 may be disposed to overlap the light emitting device 120 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat dissipation member 133 may be disposed to contact a side surface of the first coupling portion 121 and a side surface of the second coupling portion 122.
The first coupling portion 121 may include a first side surface adjacent to the second coupling portion 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
According to an embodiment, the heat discharging member 133 may be disposed to be in contact with the first side surface of the first coupling part 121 and the third side surface of the second coupling part 122. As an example, the heat discharging member 133 may be disposed in direct contact with the first side surface of the first coupling portion 121 and the third side surface of the second coupling portion 122.
In addition, the heat dissipation member 133 may be disposed between the light emitting device 120 and the package body 110. The heat dissipation member 133 may be disposed between the light emitting device 120 and the first frame 111. The heat dissipation member 133 may be disposed between the light emitting device 120 and the second frame 112. The heat discharging member 133 may be disposed to be surrounded by the body 113.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat dissipation member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. Further, as an example, whenWhen the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, the heat discharging member 133 may include Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device 120. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
In addition, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As an example, the area of the first coupling portion 121 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4. In addition, the area of the second coupling portion 122 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
In addition, the light emitting device package according to the embodiment may include a molding member, as shown in fig. 10. As an example, the molding member according to the embodiment may include a resin portion 135 and a molding part 140.
The resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be disposed at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be reflectiveThe reflector of the light emitted from the light emitting device 120, for example, includes a material such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package according to the embodiment may include a molding part 140, as shown in fig. 10.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to incident light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. As an example, the molding part 140 may be referred to as a wavelength conversion molding member.
In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
According to an embodiment, as described above, the first coupling part 121 may include a first side surface adjacent to the second coupling part 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
As an example, the first side surface of the first bonding portion 121 and the third side surface of the second bonding portion 122 may be disposed to be in contact with the heat discharging member 133. In addition, the second side surface of the first bonding portion 121 and the fourth side surface of the second bonding portion 122 may be disposed to be in contact with a molding member such as the resin part 135 and the molding portion 140.
In the light emitting device package according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second bonding parts 121 and 122. In addition, light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device provided in the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding part and the second bonding part of the light emitting device according to the embodiment may provide the driving power through the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers arranged at the first and second openings may be selected to have a higher value than a common bonding material.
Therefore, since the light emitting device package 100 according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Accordingly, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 11.
In describing the light emitting device package according to the embodiment with reference to fig. 11, a description of contents overlapping with those described with reference to fig. 1 to 10 may be omitted.
The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in fig. 11.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line.
For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
According to an embodiment, the body 113 may include an opening TH1. The opening TH1 may be disposed between the first frame 111 and the second frame 112. The opening TH1 may be disposed under the light emitting device 120.
Compared to the light emitting device package described with reference to fig. 9, the light emitting device package according to the embodiment shown in fig. 11 may further include a first recess R1 and a second recess R2.
The first recess R1 may be provided on an upper surface of the first frame 111. The first recess R1 may be provided to be recessed from the upper surface of the first frame 111 in the lower surface direction. The first recess R1 may be arranged to be spaced apart from the recess R.
The second recess R2 may be provided on an upper surface of the second frame 112. The second recess R2 may be provided to be recessed in the lower surface direction from the upper surface of the second frame 112. The second upper recess R4 may be disposed to be spaced apart from the recess R.
The second recess R2 may be provided on an upper surface of the second frame 112. The second recess R2 may be provided to be recessed in the lower surface direction from the upper surface of the second frame 112. The second upper recess R4 may be disposed to be spaced apart from the opening TH1.
According to an embodiment, the first conductive layer 321 may be disposed at the first recess R1. In addition, the first coupling portion 121 may be disposed at the first recess R1 region. In addition, the second conductive layer 322 may be disposed at the second recess R2. In addition, the second coupling portion 122 2 may be disposed at the second recess R2 region. The first and second recesses R1 and R2 may provide a sufficient space in which the first and second conductive layers 321 and 322 may be disposed.
The first conductive layer 321 may be disposed on the first frame 111. The first conductive layer 321 may be disposed under the first bonding part 121.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may provide a function of fixing the first coupling part 121 and the first frame 111.
The second conductive layer 322 may be disposed on the second frame 112. The second conductive layer 322 may be disposed under the second bonding part 122.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may provide a function of fixing the second coupling portion 122 and the second frame 112.
The first and second conductive layers 321 and 322 may include one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may be at least one selected from the group consisting of solder paste, silver paste, and the like.
According to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be referred to as a conductive adhesive. The first and second conductive layers 321 and 322 may fix the first and second coupling parts 121 and 122 to the first and second frames 111 and 112. In addition, the first and second conductive layers 321 and 322 may electrically connect the first and second coupling parts 121 and 122 to the first and second frames 111 and 112.
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124, as shown in fig. 11. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the package body 110.
The first bonding portion 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling part 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
The light emitting device package according to the embodiment may include a heat dissipation member 133 as shown in fig. 11.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. The heat dissipation member 133 may be disposed at a stepped step-shaped recess structure disposed between the first frame 111 and the second frame 112. The heat discharging member 133 may be disposed on a flat surface of the body 113.
As described above, according to the embodiment, the heat dissipation member 133 may be disposed at the wide recess region provided by the upper surface of the first frame 111, the upper surface of the body 113, and the upper surface of the second frame 112. Accordingly, the heat dissipation characteristics of the light emitting device package according to the embodiment may be further improved.
In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be arranged on the same plane.
An upper surface of the heat discharging member 133 may be disposed to contact the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from the upper surface of the light emitting device 120 toward the lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat dissipation member 133.
In addition, the light emitting device package according to the embodiment may include an opening TH1, as shown in fig. 11.
The opening TH1 may be provided at the body 113. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction. The opening TH1 may be disposed under the light emitting device 120. The opening TH1 may be disposed to overlap the light emitting device 120 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat dissipation member 133 may be disposed to contact a side surface of the first coupling portion 121 and a side surface of the second coupling portion 122.
The first coupling portion 121 may include a first side surface adjacent to the second coupling portion 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
According to an embodiment, the heat dissipation member 133 may be disposed to contact the first side surface of the first bonding part 121 and the third side surface of the second bonding part 122. As an example, the heat discharging member 133 may be disposed in direct contact with the first side surface of the first coupling portion 121 and the third side surface of the second coupling portion 122.
In addition, the heat dissipation member 133 may be disposed between the light emitting device 120 and the package body 110. The heat dissipation member 133 may be disposed between the light emitting device 120 and the first frame 111. The heat dissipation member 133 may be disposed between the light emitting device 120 and the second frame 112. The heat discharging member 133 may be disposed to be surrounded by the body 113.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat discharging member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. Further, as an example, when the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, the heat discharging member 133 may include Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device 120. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
In addition, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package 100 by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. In the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As an example, the area of the first bonding portion 121 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4. In addition, the area of the second coupling portion 122 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light emitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
In addition, the light emitting device package according to the embodiment may include a molding member, as shown in fig. 11. As an example, the molding member according to the embodiment may include a resin portion 135 and a molding part 140.
The resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be disposed at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be a reflector that reflects light emitted from the light emitting device 120, for example, including materials such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package according to the embodiment may include a molding part 140, as shown in fig. 11.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to incident light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of phosphors, quantum dots, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. As an example, the molding part 140 may be referred to as a wavelength conversion molding member.
In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
According to an embodiment, as described above, the first coupling part 121 may include a first side surface adjacent to the second coupling part 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface adjacent to the first coupling portion 121 and a fourth side surface facing the third side surface.
As an example, the first side surface of the first bonding portion 121 and the third side surface of the second bonding portion 122 may be disposed to be in contact with the heat discharging member 133. In addition, the second side surface of the first bonding portion 121 and the fourth side surface of the second bonding portion 122 may be disposed to be in contact with a molding member such as the resin part 135 and the molding portion 140.
In the light emitting device package according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second bonding parts 121 and 122. In addition, light emitted from the light emitting device 120 may be disposed in an upward direction of the package body 110.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device disposed in the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding part and the second bonding part of the light emitting device according to the embodiment may provide the driving power through the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers arranged at the first and second openings may be selected to have a higher value than a common bonding material.
Therefore, since the light emitting device package 100 according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Meanwhile, the light emitting device package 100 according to the embodiment described above with reference to fig. 1 to 11 may be supplied and mounted on a submount, a circuit board, or the like.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 12.
The light emitting device package 300 according to the embodiment of the present invention shown in fig. 12 is an example in which the light emitting device package described with reference to fig. 1 to 11 is mounted on a circuit board 310 and supplied.
In the method of manufacturing the light emitting device package 300 according to the embodiment of the present invention described with reference to fig. 12, a description overlapping with that described with reference to fig. 1 to 11 may be omitted.
The light emitting device package 300 according to the embodiment may include a circuit board 310, a package body 110, and a light emitting device 120, as shown in fig. 12.
The circuit board 310 may include a first pad 311, a second pad 312, and a support substrate 313. The support substrate 313 may be provided with a power supply circuit configured to control driving of the light emitting device 120.
The package body 110 may be disposed on the circuit board 310. The first pad 311 and the first pad electrode 121 may be electrically connected to each other. The second pad 312 and the second pad electrode 122 may be electrically connected to each other.
The first and second pads 311 and 312 may include a conductive material. For example, the first and second pads 311 and 312 may include one material selected from the group consisting of Ti, cu, ni, au, cr, ta, pt, sn, ag, P, fe, sn, zn, and Al or an alloy thereof. The first pad 311 and the second pad 312 may be provided as a single layer or a plurality of layers.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line. The main body 113 may also be referred to as an insulating member.
For example, the first frame 111 and the second frame 112 may be arranged to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
The body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
The body 113 may provide an inclined surface disposed on the first and second frames 111 and 112. The cavity C may be disposed on the first and second frames 111 and 112 through the inclined surface of the body 113.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the body 113 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychloroterphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al) 2 O 3 ) And the like. In addition, the body 113 may include a high refractive index filler, such as TiO 2 and SiO 2 。
The first frame 111 and the second frame 112 may be provided as conductive frames. The first and second frames 111 and 112 may stably provide structural strength of the package body 110 and may be electrically connected to the light emitting device 120.
According to an embodiment, as shown in fig. 12, the body 113 may include an opening TH1. The opening TH1 may be disposed between the first frame 111 and the second frame 112. The opening TH1 may be disposed under the light emitting device 120.
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124, as shown in fig. 12. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the package body 110.
The light emitting structure 123 may include a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer. The first bonding portion 121 may be electrically connected to the first conductive type semiconductor layer. In addition, the second junction 122 may be electrically connected to the second conductive type semiconductor layer.
The light emitting device 120 may be disposed on the package body 110. The light emitting device 120 may be disposed on the first frame 111 and the second frame 112. The light emitting device 120 may be disposed in the cavity C provided by the package body 110.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling part 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
In addition, the light emitting device package according to the embodiment may include the first conductive layer 321 and the second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductive layer 321 may be disposed on the first frame 111. The first conductive layer 321 may be disposed under the first bonding part 121.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding part 121. The first conductive layer 321 may provide a function of fixing the first coupling part 121 and the first frame 111.
The second conductive layer 322 may be disposed on the second frame 112. The second conductive layer 322 may be disposed under the second bonding part 122.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may provide a function of fixing the second coupling portion 122 and the second frame 112.
The first and second conductive layers 321 and 322 may include one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may be at least one selected from the group consisting of solder paste, silver paste, and the like.
According to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be referred to as a conductive adhesive. The first and second conductive layers 321 and 322 may fix the first and second coupling parts 121 and 122 to the first and second frames 111 and 112. In addition, the first and second conductive layers 321 and 322 may electrically connect the first and second coupling parts 121 and 122 to the first and second frames 111 and 112.
The light emitting device package according to the embodiment may include a heat dissipation member 133.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be disposed at the same plane.
The upper surface of the heat discharging member 133 may be disposed to be in contact with the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from the upper surface of the light emitting device 120 toward the lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
In addition, the light emitting device package according to the embodiment may include an opening TH1, as shown in fig. 12.
The opening TH1 may be provided at the body 113. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction. The opening TH1 may be disposed under the light emitting device 120. The opening TH1 may be disposed to overlap the light emitting device 120 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat dissipation member 133 may be disposed to contact a side surface of the first coupling portion 121 and a side surface of the second coupling portion 122.
The first coupling portion 121 may include a first side surface adjacent to the second coupling portion 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
According to an embodiment, the heat discharging member 133 may be disposed to be in contact with the first side surface of the first coupling part 121 and the third side surface of the second coupling part 122. As an example, the heat discharging member 133 may be disposed in direct contact with the first side surface of the first coupling portion 121 and the third side surface of the second coupling portion 122.
In addition, the heat dissipation member 133 may be disposed between the light emitting device 120 and the package body 110. The heat dissipation member 133 may be disposed between the light emitting device 120 and the first frame 111. The heat dissipation member 133 may be disposed between the light emitting device 120 and the second frame 112. The heat discharging member 133 may be disposed to be surrounded by the body 113.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat discharging member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. Further, as an example, when the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, the heat discharging member 133 may include Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device 120. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
Further, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package of the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As an example, the area of the first bonding portion 121 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4. In addition, the area of the second coupling portion 122 may be set smaller than the area of the upper region of the opening TH1, as described above with reference to fig. 4.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
In addition, the light emitting device package according to the embodiment may include a molding member, as shown in fig. 12. As an example, the molding member according to the embodiment may include a resin portion 135 and a molding part 140.
The resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be disposed at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be a reflector that reflects light emitted from the light emitting device 120, for example, including materials such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package according to the embodiment may include a molding part 140, as shown in fig. 12.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to incident light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. As an example, the molding part 140 may be referred to as a wavelength conversion molding member.
In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
According to an embodiment, as described above, the first coupling part 121 may include a first side surface adjacent to the second coupling part 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
As an example, the first side surface of the first bonding portion 121 and the third side surface of the second bonding portion 122 may be disposed to contact the heat dissipation member 133. In addition, the second side surface of the first bonding portion 121 and the fourth side surface of the second bonding portion 122 may be disposed to be in contact with a molding member such as the resin part 135 and the molding portion 140.
In the light emitting device package according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second bonding parts 121 and 122. In addition, light emitted from the light emitting device 120 may be disposed in an upward direction of the package body 110.
According to an embodiment, the first pad 311 and the first conductive layer 321 of the circuit board 310 may be electrically connected. In addition, the second pad 312 and the second conductive layer 322 of the circuit board 310 may be electrically connected.
Meanwhile, according to an embodiment, a separate bonding layer may be additionally disposed between the first pad 311 and the first conductive layer 321. In addition, a separate bonding layer may be additionally disposed between the second pad 312 and the second conductive layer 322.
In addition, according to another embodiment, the first and second conductive layers 321 and 322 may be mounted on the circuit board 310 by eutectic bonding.
As described above, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, driving power may be provided through the first and second bonding parts of the light emitting device according to the embodiment by the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers arranged at the first and second openings may be selected to have a higher value than a common bonding material.
Therefore, since the light emitting device package according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Accordingly, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
In addition, according to the light emitting device package according to the above-described embodiment, the package body 110 includes only the support member in which the upper surface is flat, and may be provided with the reflection part arranged to be inclined.
As another example, according to the light emitting device package of the embodiment, the package body 110 may be provided with a structure in which the cavity C is disposed. In addition, the package body 110 may be provided with a structure in which the upper surface is flat without providing the cavity C.
As described with reference to fig. 1 to 12, light emitted between the first and second coupling parts 121 and 122 may be incident to the heat dissipation member 133 disposed at the region of the body 113. Light emitted in a downward direction of the light emitting device may be optically diffused by the heat dissipation member 133, and thus light extraction efficiency may be improved.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
For example, the width of the first coupling part 121 according to the major axis direction of the light emitting device may be several tens of micrometers. The width of the first bonding portion 121 may be, for example, 70 to 90 micrometers. In addition, the area of the first bonding portion 121 may be several thousands of square micrometers.
Further, the width of the second coupling portion 122 according to the major axis direction of the light emitting device may be several tens of micrometers. The width of the second bonding portion 122 may be, for example, 70 to 90 micrometers. In addition, the area of the second bonding portion 122 may be several thousands of square micrometers.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
Meanwhile, the light emitting device package according to the above-described embodiment is described based on the case where the first and second bonding parts 121 and 122 are in direct contact with the first and second conductive layers 321 and 322.
However, according to still another example of the light emitting device package according to the embodiment, another conductive member may be further disposed between the first and second bonding parts 121 and 122 and the first and second conductive layers 321 and 322.
Next, another example of the light emitting device package according to an embodiment of the present invention will be described with reference to fig. 13.
In describing the light emitting device package according to the embodiment with reference to fig. 13, a description of contents overlapping with those described with reference to fig. 1 to 12 may be omitted.
The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in fig. 13.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line. The body 113 may also be referred to as an insulating member.
For example, the first frame 111 and the second frame 112 may be arranged to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
The body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
The body 113 may provide an inclined surface disposed on the first and second frames 111 and 112. The cavity C may be disposed on the first and second frames 111 and 112 through the inclined surface of the body 113.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the body 113 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychlorinated terphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al) 2 O 3 ) And the like. In addition, the body 113 may include a high refractive index filler, such as TiO 2 And SiO 2 。
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124, as shown in fig. 13. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the body 113.
The light emitting structure 123 may include a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer. The first bonding portion 121 may be electrically connected to the first conductive type semiconductor layer. In addition, the second junction 122 may be electrically connected to the second conductive type semiconductor layer.
The light emitting device 120 may be disposed on the package body 110. The light emitting device 120 may be disposed on the first frame 111 and the second frame 112. The light emitting device 120 may be disposed in the cavity C provided by the package body 110.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling part 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
The light emitting device package according to the embodiment, as shown in fig. 13, may include a first conductor 221 and a second conductor 222. In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductor 221 may be disposed under the first coupling portion 121. The first conductor 221 may be electrically connected to the first coupling portion 121. The first conductor 221 may be arranged to overlap the first coupling portion 121 in the first direction.
The first conductor 221 may be disposed on the first frame 111. The first conductor 221 may be disposed between the first bonding portion 121 and the first conductive layer 321. The first conductor 221 may be electrically connected to the first bonding portion 121 and the first conductive layer 321.
In addition, the second conductor 222 may be disposed under the second junction 122. The second conductor 222 may be electrically connected to the second junction 122. The second conductor 222 may be arranged to overlap 122 the second junction in the first direction.
The second conductor 222 may be disposed on the second frame 112. The second conductor 222 may be disposed between the second junction 122 and the second conductive layer 322. The second conductor 222 may be electrically connected to the second junction 122 and the second conductive layer 322.
According to an embodiment, the first conductive layer 321 may be disposed on the lower surface and the side surface of the first conductor 221. The first conductive layer 321 may be disposed in direct contact with the lower surface and the side surface of the first conductor 221.
As described above, according to the light emitting device package of the embodiment, the contact area between the first conductive layer 321 and the first conductor 221 is increased, so that the electrical connection between the first conductive layer 321 and the first bonding part 121 may be more stably disposed by the first conductor 221.
In addition, according to an embodiment, the second conductive layer 322 may be disposed at the lower surface and the side surface of the second conductor 222. The second conductive layer 322 may be disposed in direct contact with the lower surface and the side surface of the second conductor 222.
As described above, according to the light emitting device package 200 of the embodiment, the contact area between the second conductive layer 322 and the second conductor 222 is increased, so that the electrical connection between the second conductor 322 and the second bonding part 122 may be stably provided by the second conductor 222.
As an example, the first and second conductors 221 and 222 may be stably coupled to the first and second coupling parts 121 and 122, respectively, via separate coupling materials. In addition, side surfaces and lower surfaces of the first and second conductors 221 and 222 may be in contact with the first and second conductive layers 321 and 322, respectively.
Therefore, an area in which the first and second conductive layers 321 and 322 contact the first and second conductors 221 and 222, respectively, may be further increased as compared to a case in which the first and second conductive layers 321 and 322 are directly contacted to the first and second junctions 121 and 122, respectively.
Accordingly, power can be stably supplied from the first and second conductive layers 321 and 322 to the first and second bonding portions 121 and 122 via the first and second conductors 221 and 222.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may include solder paste, silver paste, etc., and may be composed of multiple layers composed of different materials or multiple layers or a single layer composed of alloys thereof.
In addition, the first and second conductors 221 and 222 may include at least one material selected from the group consisting of Ag, au, pt, sn, al, etc., or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductor 221 and the second conductor 222.
In addition, the light emitting device package according to the embodiment may include a heat dissipation member 133.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be arranged at the same plane.
The upper surface of the heat discharging member 133 may be disposed to be in contact with the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from the upper surface of the light emitting device 120 toward the lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
In addition, the light emitting device package according to the embodiment may include an opening TH1, as shown in fig. 13.
The opening TH1 may be provided at the body 113. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction. The opening TH1 may be disposed under the light emitting device 120. The opening TH1 may be disposed to overlap the light emitting device 120 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat dissipation member 133 may be disposed to contact a side surface of the first coupling portion 121 and a side surface of the second coupling portion 122.
The first coupling portion 121 may include a first side surface adjacent to the second coupling portion 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface adjacent to the first coupling portion 121 and a fourth side surface facing the third side surface.
According to an embodiment, the heat discharging member 133 may be disposed to be in contact with the first side surface of the first coupling part 121 and the third side surface of the second coupling part 122. As an example, the heat discharging member 133 may be disposed in direct contact with the first side surface of the first coupling portion 121 and the third side surface of the second coupling portion 122.
In addition, the heat dissipation member 133 may be disposed between the light emitting device 120 and the package body 110. The heat dissipation member 133 may be disposed between the light emitting device 120 and the first frame 111. The heat dissipation member 133 may be disposed between the light emitting device 120 and the second frame 112. The heat discharging member 133 may be disposed to be surrounded by the body 113.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat discharging member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. Further, as an example, when the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, the heat discharging member 133 may include Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device 120. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
In addition, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set at 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
According to the light emitting device package of the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124, so that the first and second conductors 221 and 222 may be stably arranged.
As an example, the area of the first bonding portion 121 may be set smaller than the area of the upper region of the opening TH1, as shown in fig. 4. In addition, the area of the second coupling portion 122 may be set smaller than the area of the upper region of the opening TH1, as shown in fig. 4.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
In addition, the light emitting device package 200 according to the embodiment may include a molding member, as shown in fig. 13. As an example, the molding member according to the embodiment may include a resin portion 135 and a molding part 140.
The molding member according to the embodiment may include at least one of the resin portion 135 and the molding part 140. First, in the following embodiments, description is made based on a case in which the molding member includes the resin portion 135 and the molding part 140.
However, according to another embodiment, the molding member may include only the resin portion 135, or may include only the molding part 140.
The resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be disposed at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be reflectiveThe reflector of the light emitted from the light emitting device 120, for example, includes such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package according to the embodiment may include a molding part 140, as shown in fig. 13.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to incident light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. As an example, the molding part 140 may be referred to as a wavelength conversion molding member.
In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
According to an embodiment, as described above, the first coupling part 121 may include a first side surface adjacent to the second coupling part 122 and a second side surface facing the first side surface. The second coupling portion 122 may include a third side surface close to the first coupling portion 121 and a fourth side surface facing the third side surface.
As an example, the first side surface of the first bonding portion 121 and the third side surface of the second bonding portion 122 may be disposed to be in contact with the heat discharging member 133. In addition, the second side surface of the first bonding portion 121 and the fourth side surface of the second bonding portion 122 may be disposed to be in contact with a molding member such as the resin part 135 and the molding portion 140.
Meanwhile, as described above, according to another example of the light emitting device package according to the embodiment of the present invention, the resin portion 135 may not be separately provided, and the molding part 140 may be disposed to be in direct contact with the first and second frames 112. In addition, the molding part 140 is not separately provided, and the resin part 135 may be provided at the periphery and the upper portion of the light emitting device 120.
In the light emitting device package according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second coupling parts 121 and 122. In addition, light emitted from the light emitting device 120 may be disposed in an upward direction of the package body 110.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device disposed in the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding part and the second bonding part of the light emitting device according to the embodiment may provide the driving power through the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers disposed at the first and second openings may be selected to have a higher value than that of a general bonding material.
Therefore, since the light emitting device package according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 14.
In describing the light emitting device package according to the embodiment with reference to fig. 14, a description of contents overlapping with those described with reference to fig. 1 to 14 may be omitted.
The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in fig. 14.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line. The main body 113 may also be referred to as an insulating member.
For example, the first frame 111 and the second frame 112 may be arranged to be spaced apart from each other at the body 113. For example, the first frame 111 and the second frame 112 may be disposed to be spaced apart from each other with the body 113 interposed therebetween.
The body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
The body 113 may provide an inclined surface disposed on the first and second frames 111 and 112. The cavity C may be disposed on the first and second frames 111 and 112 through the inclined surface of the body 113.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the body 113 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychlorinated terphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al) 2 O 3 ) And the like. In addition, the body 113 may include a high refractive index filler, such as TiO 2 And SiO 2 。
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124, as shown in fig. 13. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the body 113.
The light emitting device package according to the embodiment may include a first conductor 221 and a second conductor 222. In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductor 221 may be disposed under the first coupling portion 121. The first conductor 221 may be electrically connected to the first coupling portion 121. The first conductor 221 may be arranged to overlap the first coupling portion 121 in the first direction.
The first conductor 221 may be disposed on the first frame 111. The first conductor 221 may be disposed between the first bonding portion 121 and the first conductive layer 321. The first conductor 221 may be electrically connected to the first bonding portion 121 and the first conductive layer 321.
In addition, the second conductor 222 may be disposed under the second junction 122. The second conductor 222 may be electrically connected to the second junction 122. The second conductor 222 may be arranged to overlap 122 the second junction in the first direction.
The second conductor 222 may be disposed on the second frame 112. The second conductor 222 may be disposed between the second junction 122 and the second conductive layer 322. The second conductor 222 may be electrically connected to the second junction 122 and the second conductive layer 322.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au, pt, and the like or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may be at least one selected from the group consisting of solder paste, silver paste, and the like.
According to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be referred to as a conductive adhesive. The first and second conductive layers 321 and 322 may fix the first and second coupling parts 121 and 122 to the first and second frames 111 and 112. In addition, the first and second conductive layers 321 and 322 may electrically connect the first and second coupling parts 121 and 122 to the first and second frames 111 and 112.
In addition, the first conductor 221 and the second conductor 222 may include at least one material selected from the group consisting of Ag, au, pt, sn, al, etc., or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductor 221 and the second conductor 222.
According to an embodiment, the areas of the lower surfaces of the first and second conductors 221 and 222 may be set to be larger than the areas of the lower surfaces of the first and second coupling parts 121 and 122. Accordingly, an area in which the first conductive layer 321 and the second conductive layer 322 are in direct contact with the first and second conductors 221 and 222 may be set to be larger than an area in which the first conductive layer 321 and the second conductive layer 322 are in direct contact with the first and second junctions 121 and 122. Therefore, according to the light emitting device package of the present embodiment, when the first and second conductors 221 and 222 are provided, the power supplied from the first and second frames 111 and 112 to the light emitting device 120 can be more stably supplied.
In addition, the light emitting device package according to the embodiment may include a heat dissipation member 133.
The heat dissipation member 133 may be disposed between the package body 110 and the light emitting device 120. The heat dissipation member 133 may be disposed between the upper surface of the package body 110 and the lower surface of the light emitting device 120. The heat discharging member 133 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
The heat dissipation member 133 may be disposed between the first frame 111 and the second frame 112. In addition, the lower surface of the body 113 and the lower surfaces of the first and second frames 111 and 112 may be disposed at the same plane.
The upper surface of the heat discharging member 133 may be disposed to be in contact with the light emitting device 120 and extend in the first direction. The first direction may be defined as a direction from the upper surface of the light emitting device 120 toward the lower surface of the body 113.
According to the embodiment, a first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than a second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
In addition, the light emitting device package according to the embodiment may include an opening TH1, as shown in fig. 14.
The opening TH1 may be provided at the body 113. The opening TH1 may be provided by passing through the body 113. The opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction. The opening TH1 may be disposed under the light emitting device 120. The opening TH1 may be disposed to overlap the light emitting device 120 in the first direction.
As an example, the opening TH1 may be provided to be surrounded by the body 113. The opening TH1 may be disposed to be surrounded by the body 113 when viewed from an upward direction of the light emitting device 120. The opening TH1 may be disposed at a central region of the body 113.
According to an embodiment, the heat discharging member 133 may be disposed at the opening TH 1. The heat discharging member 133 may be disposed between the light emitting device 120 and the body 113. The heat dissipation member 133 may be disposed between the first and second coupling parts 121 and 122. As an example, the heat discharging member 133 may be disposed to be surrounded by the resin portion 135 under the light emitting device 120.
The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the package body 110. The heat discharging member 133 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the heat discharging member 133 may be disposed in direct contact with the upper surface of the body 113. In addition, the heat dissipation member 133 may be disposed in direct contact with the lower surface of the light emitting device 120.
According to the embodiment, as described above, the first distance from the upper surface of the light emitting device 120 to the lower surface of the first frame 111 may be set to be equal to or greater than the second distance from the upper surface of the light emitting device 120 to the lower surface of the heat discharging member 133.
As an example, the heat discharging member 133 may be disposed to be spaced apart from the lower surface of the opening TH1 by a predetermined distance in the upward direction. An upper region of the opening TH1 may be filled with the heat dissipation member 133, and a lower region of the opening TH1 may be provided as an empty space in which the heat dissipation member 133 is not filled.
As an example, the heat dissipation member 133 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. Further, as an example, when the heat discharging member 133 includes a reflection function, the heat discharging member 133 may include white silicone. In addition, the heat discharging member 133 may include Al having good thermal conductivity 2 O 3 AlN, and the like.
According to the embodiment, when the heat dissipation member 133 includes a material having good thermal conductivity, it is possible to stably fix the light emitting device 120 to the package body 110 and effectively dissipate heat generated from the light emitting device. Accordingly, the light emitting device 120 may be stably fixed to the package body 110, and heat may be effectively dissipated, and thus light extraction efficiency of the light emitting device 120 may be improved.
Further, when the heat discharging member 133 includes a reflective material, the heat discharging member 133 may provide a stable fixing force between the body 113 and the light emitting device 120, and the heat discharging member 133 may provide a light diffusion function between the light emitting device 120 and the body 113 with respect to light emitted to the lower surface of the light emitting device 120. The heat dissipation member 133 may improve light extraction efficiency of the light emitting device package by providing a light diffusion function when light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120.
According to the embodiment, the heat discharging member 133 may reflect light emitted from the light emitting device 120. When the heat discharging member 133 includes a reflection function, the heat discharging member 133 may be formed of a material including TiO 2 Silicone, and the like.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, a heat dissipation member 133 having good reflection characteristics and heat dissipation characteristics may be disposed under the light emitting device 120. Accordingly, light emitted in a downward direction of the light emitting device 120 is reflected at the heat discharging member 133 and is effectively emitted toward an upward direction of the light emitting device package 100, and thus light extraction efficiency may be improved.
In addition, the light emitting device package 200 according to the embodiment may include a molding member, as shown in fig. 13. As an example, the molding member according to the embodiment may include a resin portion 135 and a molding part 140.
The molding member according to the embodiment may include at least one of the resin portion 135 and the molding part 140. First, in the following embodiments, description is made based on a case in which the molding member includes the resin portion 135 and the molding part 140.
However, according to another embodiment, the molding member may include only the resin portion 135, or may include only the molding part 140.
The resin portion 135 may be disposed between the first frame 111 and the light emitting device 120. The resin portion 135 may be disposed between the second frame 112 and the light emitting device 120. The resin portion 135 may be disposed at a lower surface of the cavity C provided in the package body 110.
As an example, the resin portion 135 may be disposed under the light emitting device 120. The resin portion 135 may be referred to as a reflective resin portion. In addition, the resin portion 135 may be referred to as a reflective molding member.
The resin portion 135 may be disposed at a side surface of the first coupling portion 121. In addition, the resin portion 135 may be disposed at a side surface of the second coupling portion 122. The resin portion 135 may be disposed under the light emitting structure 123. The resin portion 135 may be disposed at the periphery of the heat dissipation member 133 under the light emitting device 120.
As an example, the resin portion 135 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the resin portion 135 may be a reflector that reflects light emitted from the light emitting device 120, for example, including materials such as TiO 2 Or may comprise white silicone.
The resin portion 135 may be disposed under the light emitting device 120 and may perform a sealing function. In addition, the resin portion 135 may improve adhesion between the light emitting device 120 and the first frame 111. The resin portion 135 may improve adhesion between the light emitting device 120 and the second frame 112.
The resin portion 135 may be sealed around the first and second bonding portions 121 and 122. The resin portion 135 may prevent the first and second conductive layers 321 and 322 from being separated from the regions under the first and second bonding parts 121 and from being diffused and moved in the direction of the light emitting device 120.
When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be in contact with the active layer of the light emitting device 120, thereby causing a malfunction due to a short circuit. Accordingly, when the resin portion 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, thereby improving reliability of the light emitting device package according to the embodiment.
In addition, when the resin portion 135 includes a material having a reflective property such as white silicone, the resin portion 135 may reflect light provided from the light emitting device 120 toward an upward direction of the package body 110, thereby improving light extraction efficiency of the light emitting device package 100.
In addition, the light emitting device package according to the embodiment may include a molding part 140, as shown in fig. 14.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to input light emitted from the light emitting device 120 and provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
The molding part 140 may be disposed at the periphery of the light emitting device 120. In addition, according to an embodiment, the molding part 140 may be disposed on the resin part 135.
In the light emitting device package according to the embodiment, a power source may be connected to the first bonding part 121 through the first conductive layer 321, and a power source may be connected to the second bonding part 122 through the second conductive layer 322.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second bonding parts 121 and 122. In addition, light emitted from the light emitting device 120 may be provided in an upward direction of the package body 110.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device disposed in the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding part and the second bonding part of the light emitting device according to the embodiment may provide the driving power through the first and second conductive layers disposed at the first and second frames. In addition, the melting points of the first and second conductive layers disposed at the first and second openings may be selected to have a higher value than that of a general bonding material.
Therefore, since the light emitting device package according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the main body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Next, a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 15 to 17. The light emitting device package 1100 according to the embodiment may include a package body 110 and a light emitting device 120 as shown in fig. 15 to 17.
The package body 110 may include a body 113 and a reflector 117. The reflector 117 may be disposed on the body 113. The reflector 117 may be disposed at a periphery of the upper surface of the body 113. The reflector 117 may provide a cavity C on the upper surface of the body 113.
In other words, the body 113 may be referred to as a lower body, and the reflector 117 may be referred to as an upper body. In addition, according to an embodiment, the package body 110 may not include the reflector 117 providing the cavity, but may include only the body 113 providing the flat upper surface.
The reflector 117 may reflect light emitted from the light emitting device 120 in an upward direction. The reflector 117 may be disposed to be inclined with respect to the upper surface of the body 113.
The package body 110 may include a cavity C. The cavity may include a bottom surface and a side surface inclined from the bottom surface to the upper surface of the package body 110.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the package body 110 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychloroterphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al) 2 O 3 ) And the like. In addition, the package body 110 may include a high refractive index filler, such as TiO 2 And SiO 2 。
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124. The light emitting structure 123 may include a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer. The first bonding portion 121 may be electrically connected to the first conductive type semiconductor layer. In addition, the second junction 122 may be electrically connected to the second conductive type semiconductor layer.
The light emitting device 120 may be disposed on the package body 110. The light emitting device 120 may be disposed on the body 113. The light emitting device 120 may be disposed in the cavity C provided by the reflector 117.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling part 121 may be disposed between the light emitting structure 123 and the body 113. The second bonding portion 122 may be disposed between the light emitting structure 123 and the body 113.
The first and second bonding portions 121 and 122 may be formed as a single layer or a multi-layer by using at least one material selected from the group consisting of Ti, al, sn, in, ir, ta, pd, co, cr, mg, zn, ni, si, ge, ag alloy, au, hf, pt, ru, rh, sn, cu, znO, irOx, ruOx, niO, ruOx/ITO, and Ni/IrOx/Au, ni/IrOx/Au/ITO, or alloys thereof.
Meanwhile, the light emitting device package 1100 according to the embodiment may include the first and second openings TH1 and TH2, as shown in fig. 15 to 17.
The package body 110 may include a first opening TH1 passing through a lower surface of the package body 110 from a bottom surface of the cavity C. The package body 110 may include a second opening TH2 passing through a lower surface of the package body 110 from a bottom surface of the cavity C.
The first opening TH1 may be provided at the body 113. The first opening TH1 may be provided by passing through the body 113. The first opening TH1 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction.
The first opening TH1 may be disposed under the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first coupling portion 121 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The second opening TH2 may be provided at the body 113. The second opening TH2 may be provided by passing through the body 113. The second opening TH2 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction.
The second opening TH2 may be disposed under the second bonding part 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other. The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other under the lower surface of the light emitting device 120.
According to an embodiment, the width W1 of the upper region of the first opening TH1 may be set to be less than or equal to the width of the first coupling portion 121. Further, the width of the upper region of the second opening TH2 may be set to be less than or equal to the width of the second coupling portion 122.
Further, the width W1 of the upper region of the first opening TH1 may be set to be less than or equal to the width W2 of the lower region of the first opening TH 1. Further, the width of the upper region of the second opening TH2 may be set to be less than or equal to the width of the lower region of the second opening TH 2.
The first opening TH1 may be provided in an inclined shape in which the width is gradually reduced from the lower region toward the upper region. The second openings TH2 may be provided in a slanted shape in which the width is gradually reduced from the lower region toward the upper region.
However, the present invention is not limited thereto, and the inclined surface between the upper and lower regions of the first and second openings TH1 and TH2 may have a plurality of inclined surfaces having different slopes, and the inclined surfaces may be arranged to have a curvature.
A width between the first and second openings TH1 and TH2 in the lower surface region of the body 113 may be set to several hundred micrometers. A width between the first and second openings TH1 and TH2 in the lower surface region of the body 113 may be set to, for example, 100 to 150 micrometers.
The width between the first and second openings TH1 and TH2 in the lower surface region of the body 113 may be selected to be set to exceed a predetermined distance in order to prevent a short circuit between the bonding portions from occurring when the light emitting device package 1100 according to the embodiment is subsequently mounted on a circuit board, a submount, or the like.
The light emitting device package 1100 according to the embodiment may include a recess R as shown in fig. 15 to 17. The recess R may be provided to be recessed from the bottom surface of the cavity C toward the lower surface of the package body 110.
The recess R may be provided at the main body 113. The recess R may be disposed between the first opening TH1 and the reflector 117. In addition, the recess R may be disposed between the second opening TH2 and the reflector 117. The recess R may be provided to be recessed from the upper surface of the body 113 toward the lower surface thereof. The recess R may be disposed under the light emitting device 120. As an example, the recess R may be disposed under the light emitting device 120 in a closed loop shape.
The recess R may be disposed between the first coupling portion 121 and the reflector 117 to be adjacent to the first opening TH1 when viewed from an upward direction of the light emitting device 120. In addition, the recess R may be disposed between the second coupling portion 122 and the reflector 117 to be adjacent to the second opening TH2 when viewed from the upward direction of the light emitting device 120.
The recess R may be provided in a closed loop shape at the peripheries of the first and second openings TH1 and TH 2.
The size of the light emitting device 120 may be set larger than the closed loop area set by the recess R when viewed from the upward direction of the light emitting device 120.
The closed loop formed by the recess R may be disposed in a profile connecting four side surfaces of the light emitting device 120 when viewed from an upward direction of the light emitting device 120.
The light emitting device package 1100 according to the embodiment may include the adhesive 130, as shown in fig. 15.
The adhesive 130 may be disposed at the recess R. The adhesive 130 may be disposed between the light emitting device 120 and the body 113. The adhesive 130 may be disposed between the first bonding portion 121 and the reflector 117. The adhesive 130 may be disposed between the second bonding portion 122 and the reflector 117. For example, the adhesive 130 may be disposed to contact a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
The adhesive 130 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the adhesive 130 may be disposed in direct contact with the upper surface of the body 113. In addition, the adhesive 130 may be disposed in direct contact with the lower surface of the light emitting device 120.
As an example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the adhesive 130 may reflect light emitted from the light emitting device 120. When the adhesive 130 comprises a trans-adhesiveFor the shot function, the adhesive 130 may include white silicone. When the adhesive 130 includes a reflective function, the adhesive 130 may be formed of, for example, tiO 2 Silicone, etc.
According to an embodiment, the depth of the recess R may be set to be smaller than the depth of the first opening TH1 or the depth of the second opening TH 2.
The depth of the recess R may be determined in consideration of the adhesion of the adhesive 130. In addition, the depth of the recess R may be determined by considering the stable strength of the body 113 and/or the absence of the occurrence of cracks in the light emitting device package 1100 due to heat emitted from the light emitting device 120.
The recess R may provide an appropriate space in which an underfill process may be performed at a lower portion of the light emitting device 120. The recess R may be disposed at a first depth or more so that the adhesive 130 may be sufficiently disposed between the lower surface of the light emitting device 120 and the upper surface of the body 113. In addition, the recess R may be provided at a second depth or less to provide stable strength of the body 113.
The depth and width W3 of the recess R may affect the formation position and fixing force of the adhesive 130. The depth and width W3 of the recess R may be determined such that the fixing force may be sufficiently provided by the adhesive 130 disposed between the body 113 and the light emitting device 120.
As an example, the depth of the recess R may be set to several tens of micrometers. The depth of the recess R may be set to 40 to 60 micrometers.
In addition, the width W3 of the recess R may be set to several hundred micrometers. The width W3 of the recess R may be set to 140 to 160 micrometers. As an example, the width W3 of the recess R may be set to 150 μm.
The first and second bonding portions 121 and 122 of the light emitting device 120 may be sealed from the outside by an adhesive 130 disposed at the recess R. The adhesive 130 may be disposed under the light emitting device 120 in a closed loop shape.
The adhesive 130 may be provided in a closed loop shape along the shape of the recess R, as shown in fig. 16 and 17. The recess R may be provided as a closed loop having a rectangular shape or a closed loop having a circular or elliptical shape.
The depth of the first opening TH1 may be set to correspond to the thickness of the body 113. The depth of the first opening TH1 may be set to a thickness capable of maintaining stable strength of the body 113.
As an example, the depth of the first opening TH1 may be set to several hundred micrometers. The depth of the first opening TH1 may be set to 180 to 220 micrometers. As an example, the depth of the first opening TH1 may be set to 200 micrometers.
As an example, a thickness obtained by subtracting the depth of the recess R from the depth of the first opening TH1 may be selected to be at least 100 micrometers or more. This is in view of the thickness of the implantation process that can provide a crack-free body 113.
According to an embodiment, the depth of the first opening TH1 may be set to be two to ten times the depth of the recess R. As an example, when the depth of the first opening TH1 is set to 200 micrometers, the depth of the recess R may be set to 20 to 100 micrometers.
In addition, the light emitting device package 1100 according to the embodiment may include the molding part 140, as shown in fig. 15.
The molding part 140 may be disposed on the light emitting device 120. The molding part 140 may be disposed on the body 113. The molding part 140 may be disposed at the cavity C provided by the reflector 117.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to be incident light emitted from the light emitting device 120 and configured to provide wavelength-converted light. As an example, the molding part 140 may include a phosphor, a quantum dot, and the like.
In addition, according to an embodiment, the light emitting structure 123 may be provided as a compound semiconductor. As an example, the light emitting structure 123 may be provided as a II-VI or III-V compound semiconductor. For example, the light emitting structure 123 may be provided with at least two or more elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N).
The light emitting structure 123 may include a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer.
In addition, as shown in fig. 15, the light emitting device package 1100 according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductive layer 321 may be disposed at the first opening TH 1. The first conductive layer 321 may be disposed under the first bonding part 121. The width of the first conductive layer 321 may be set to be smaller than the width of the first bonding portion 121.
The first coupling portion 121 may have a width in a second direction perpendicular to a first direction in which the first opening TH1 is formed. The width of the first coupling portion 121 may be set to be greater than the width of the first opening TH1 in the second direction.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may be disposed to be surrounded by the body 113.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed under the second bonding part 122. The width of the second conductive layer 322 may be set to be smaller than the width of the second bonding portion 122.
The second coupling portion 122 may have a width perpendicular to a second direction of the first direction in which the second opening TH2 is formed. The width of the second coupling portion 122 may be set to be greater than the width of the second opening TH2 in the second direction.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may be disposed to be surrounded by the body 113.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au and Pt, sn, cu, etc., or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may include solder paste, silver paste, etc., and may be composed of multiple layers composed of different materials or multiple layers or a single layer composed of alloys thereof. As an example, the first conductive layer 321 and the second conductive layer 322 may include a SAC (Sn-Ag-Cu) material.
According to an embodiment, the first conductive layer 321 may be electrically connected to the first bonding part 121, and the second conductive layer 322 may be electrically connected to the second bonding part 122. As an example, external power may be supplied to the first and second conductive layers 321 and 322, and thus, the light emitting device 120 may be driven.
Meanwhile, according to the light emitting device package 1100 of the embodiment, the adhesive 130 disposed at the recess R may be disposed between the lower surface of the light emitting device 120 and the upper surface of the package body 110, as shown in fig. 15 to 17. The adhesive 130 may be disposed in a closed loop shape at the peripheries of the first and second bonding parts 121 and 122 when viewed from the upward direction of the light emitting device 120. Further, the adhesive 130 may be disposed at the peripheries of the first and second openings TH1 and TH2 in a closed loop shape when viewed from the upward direction of the light emitting device 120.
The adhesive 130 may perform a function of stably fixing the light emitting device 120 in the package body 110. In addition, the adhesive 130 may be disposed at the peripheries of the first and second bonding parts 121 and 122 contacting the side surfaces of the first and second bonding parts 121 and 122. The adhesive 130 may be arranged such that the first and second openings TH1 and TH2 are isolated from an outer region in which the molding part 140 is disposed when viewed from an upward direction of the light emitting device 120.
The adhesive 130 may prevent the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 from being separated from the closed loop of the recess R and flowing in the outward direction of the light emitting device 120.
In the case where the first and second conductive layers 321 and 322 move in the outward direction of the light emitting device 120 when viewed from the upward direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be diffused along the side surface of the light emitting device 120. As described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the first and second conductive type semiconductor layers of the light emitting device 120 may be electrically shorted. In addition, as described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the light extraction efficiency of the light emitting device 120 may be reduced.
However, according to the embodiment, since the inside and the outside are isolated from each other based on the region in which the recess R is provided by the adhesive 130, the first and second conductive layers 321 and 322 can be prevented from being separated from the region in which the recess R is provided and moving in the outward direction.
Therefore, according to the light emitting device package 1100 of the embodiment, it is possible to prevent the first and second conductive layers 321 and 322 from moving to the side surfaces of the light emitting device 120 and to prevent the light emitting device 120 from being electrically shorted, thereby improving light extraction efficiency.
According to the embodiment of the present invention, the adhesive 130 disposed at the recess R may move along the lower surface of the light emitting device 120 to the first region A1 located under the light emitting device 120, and may be disposed to contact the four side surfaces of the first and second bonding parts 121 and 122. Accordingly, the first and second coupling parts 121 and 122 may be arranged to be surrounded by the adhesive 130, and the first and second openings TH1 and TH2 may be sealed by the adhesive 130.
As described above, since the first and second openings TH1 and TH2 may be sealed by the adhesive 130, the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 may be prevented from moving on the upper surface of the body 113.
Meanwhile, when the amount of the adhesive 130 is not sufficiently set, the first region A1 located under the light emitting device 120 may be unfilled with the adhesive 130, and a partial region thereof may be set as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to an embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting properties having poor adhesiveness to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
Next, a method of manufacturing a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 18 to 21.
In describing the method of manufacturing a light emitting device package according to an embodiment of the present invention with reference to fig. 18 to 21, a description of contents overlapping with those described with reference to fig. 1 to 17 may be omitted.
First, according to a method of manufacturing a light emitting device package according to an embodiment of the present invention, as shown in fig. 18, a package body 110 may be provided.
The package body 110 may include a body 113 and a reflector 117. The package body 110 may include a first opening TH1 and a second opening TH2. In addition, the package body 110 may include a recess R.
The first opening TH1 may be provided at the body 113. The first opening TH1 may be provided by passing through the body 113. The first opening TH1 may be provided by passing through upper and lower surfaces of the body 113 in the first direction.
The second opening TH2 may be provided at the body 113. The second opening TH2 may be provided by passing through the body 113. The second opening TH2 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction.
The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other.
The recess R may be provided at the main body 113. The recess R may be disposed between the first opening TH1 and the reflector 117. In addition, the recess R may be disposed between the second opening TH2 and the reflector 117. The recess R may be provided to be recessed from the upper surface of the body 113 toward the lower surface thereof. The recess R may be disposed under the light emitting device 120. As an example, the recess R may be disposed under the light emitting device 120 in a closed loop shape.
The recess R may be disposed between the first coupling portion 121 and the reflector 117. The recess R may be disposed between the second coupling portion 122 and the reflector 117.
Next, in the method of manufacturing a light emitting device package according to the embodiment, an adhesive 130 may be provided at the recess R, as shown in fig. 19.
The adhesive 130 may be disposed at the recessed area by a dot mark method or the like. For example, the adhesive 130 may be provided to an area where the recess R is formed in a predetermined amount, and may be provided to overflow the recess R.
In addition, according to the method of manufacturing the light emitting device package according to the embodiment, the light emitting device 120 may be disposed on the body 113 as shown in fig. 20.
According to an embodiment, the recess R may also serve as a kind of alignment key in the process of disposing the light emitting device 120 on the body 113.
The light emitting device 120 may be fixed at the body 113 by an adhesive 130. A portion of the adhesive 130 disposed at the recess R may move in the direction of the first and second bonding portions 121 and 122 and may be cured. Accordingly, the adhesive 130 may be disposed at a wide area between the lower surface of the light emitting device 120 and the upper surface of the body 113, and the fixing force between the light emitting device 120 and the body 113 may be improved.
According to an embodiment, the first opening TH1 may be disposed under the first bonding part 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding layer 121 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The second opening TH2 may be disposed under the second bonding part 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The adhesive 130 may perform a function of stably fixing the light emitting device 120 in the package body 110. In addition, the adhesive 130 may be disposed at the peripheries of the first and second bonding parts 121 and 122 contacting the side surfaces of the first and second bonding parts 121 and 122. The adhesive 130 may be disposed such that the first and second openings TH1 and TH2 are isolated from an outer region in which the molding part 140 is disposed when viewed from an upward direction of the light emitting device 120.
Next, according to the method of manufacturing a light emitting device package according to the embodiment, as shown in fig. 21, a molding part 140 may be provided on the light emitting device 120, and first and second conductive layers 321 and 322 may be provided at the first and second openings TH1 and TH 2.
The first conductive layer 321 may be disposed at the first opening TH 1. The first conductive layer 321 may be disposed under the first bonding part 121. The width of the first conductive layer 321 may be set to be smaller than the width of the first bonding portion 121.
The first coupling portion 121 may have a width in a second direction perpendicular to a first direction in which the first opening TH1 is formed. The width of the first coupling portion 121 may be set to be greater than the width of the first opening TH1 in the second direction.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding part 121. The first conductive layer 321 may be disposed to be surrounded by the body 113.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed under the second bonding part 122. The width of the second conductive layer 322 may be set to be smaller than the width of the second bonding portion 122.
The second coupling portion 122 may have a width perpendicular to a second direction of the first direction in which the second opening TH2 is formed. The width of the second coupling portion 122 may be set to be greater than the width of the second opening TH2 in the second direction.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may be disposed to be surrounded by the body 113.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au and Pt, sn and Cu, etc., or alloys thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may include solder paste, silver paste, etc., and may be composed of multiple layers composed of different materials or multiple layers or a single layer composed of alloys thereof. As an example, the first conductive layer 321 and the second conductive layer 322 may include a SAC (Sn-Ag-Cu) material.
The adhesive 130 may prevent the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 from being separated from the closed loop of the recess R and flowing in the outward direction of the light emitting device 120.
In the case where the first and second conductive layers 321 and 322 move in the outward direction of the light emitting device 120 when viewed from the upward direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be diffused along the side surface of the light emitting device 120. As described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the first and second conductive type semiconductor layers of the light emitting device 120 may be electrically shorted. In addition, as described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the light extraction efficiency of the light emitting device 120 may be reduced.
However, according to the embodiment, since the inside and the outside may be isolated from each other based on the region where the recess R is disposed by the adhesive 130, it is possible to prevent the first and second conductive layers 321 and 322 from being separated from the region where the recess R is disposed and moving in an outward direction.
Therefore, according to the light emitting device package 1100 of the embodiment, it is possible to prevent the first and second conductive layers 321 and 322 from moving to the side surfaces of the light emitting device 120 and to prevent the light emitting device 120 from being electrically short-circuited, thereby improving light extraction efficiency.
In addition, according to an embodiment of the present invention, the adhesive 130 disposed at the recess R may move along the lower surface of the light emitting device 120 to the first region A1 located under the light emitting device 120, and may be disposed to contact four side surfaces of the first and second bonding parts 121 and 122. Accordingly, the first and second bonding portions 121 and 122 may be disposed to be surrounded by the adhesive 130, and the first and second openings TH1 and TH2 may be sealed by the adhesive 130.
As described above, since the first and second openings TH1 and TH2 may be sealed by the adhesive 130, the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 may be prevented from moving on the upper surface of the body 113.
Meanwhile, when the amount of the adhesive 130 is not sufficiently set, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be set as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the main body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to an embodiment, a distance that the first and second conductive layers 321 and 322 are diffused from the upper surface of the main body 113 may be limited by selecting a property having poor adhesion to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
Meanwhile, according to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be formed after the molding part 140 is formed. In addition, the molding part 140 may be formed after the first conductive layer 321 and the second conductive layer 322 are formed.
In the light emitting device package 1100 according to the embodiment, a conventional lead frame is not used in forming the package body 110.
In the case of a light emitting device package to which a conventional lead frame is applied, although a process of forming the lead frame is additionally required, according to the method of manufacturing the light emitting device package according to the embodiment of the present invention, the process of forming the lead frame is not required. Therefore, according to the method of manufacturing a light emitting device package according to an embodiment of the present invention, not only a process time can be shortened but also materials can be reduced.
Further, in the case of a light emitting device package to which a conventional lead frame is applied, although a silver plating process should be added to prevent deterioration of the lead frame, according to the method of manufacturing a light emitting device package according to an embodiment of the present invention, since the lead frame is not required, an additional process such as silver plating may not be required. As described above, according to the method of manufacturing the light emitting device package according to the embodiment of the present invention, the manufacturing cost may be reduced and the manufacturing yield may be improved.
In the light emitting device package 1100 according to the embodiment, the power may be connected to the first bonding part 121 through the first conductive layer 321 disposed at the first opening TH1, and the power may be connected to the second bonding part 122 through the second conductive layer 322 disposed at the second opening TH 2.
Accordingly, the light emitting device 120 may be driven by the driving power supplied through the first and second coupling parts 121 and 122. In addition, light emitted from the light emitting device 120 may be disposed in an upward direction of the package body 110.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 22.
The light emitting device package according to the embodiment of the present invention shown in fig. 22 is an example in which the light emitting device package 1100 described with reference to fig. 15 to 21 is mounted on the circuit board 310 and supplied. For example, the light emitting device package 1100 mounted on the circuit board 310 may be used in a lighting apparatus.
In describing the method of manufacturing the light emitting device package according to the embodiment of the present invention with reference to fig. 22, a description of contents overlapping with those described with reference to fig. 1 to 22 may be omitted.
The light emitting device package according to the embodiment may include a circuit board 310, a package body 110, and a light emitting device 120, as shown in fig. 22.
The circuit board 310 may include a first pad 311, a second pad 312, and a support substrate 313. The support substrate 313 may be provided with a power supply circuit configured to control driving of the light emitting device 120.
The package body 110 may be disposed on the circuit board 310. The first pad 311 and the first pad electrode 121 may be electrically connected to each other. The second pad 312 and the second pad electrode 122 may be electrically connected to each other.
The first pad 311 and the second pad 312 may include a conductive material. For example, the first pad 311 and the second pad 312 may include one material selected from the group consisting of Ti, cu, ni, au, cr, ta, pt, sn, ag, P, fe, sn, zn, and Al or an alloy thereof. The first pad 311 and the second pad 312 may be provided as a single layer or a multi-layer.
The package body 110 may include a body 113 and a reflector 117.
The package body 110 may include first and second openings TH1 and TH2, the first and second openings TH1 and TH2 passing through from an upper surface to a lower surface in a first direction. The first and second openings TH1 and TH2 may be provided through the lower surface thereof in the first direction from the upper surface of the body 113.
The light emitting device 120 may include a first bonding part 121, a second bonding part 122, and a light emitting structure 123.
The light emitting device 120 may be disposed on the package body 110. The light emitting device 120 may be disposed on the body 113. The light emitting device 120 may be arranged in the cavity C provided by the reflector 117.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other under the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed between the light emitting structure 123 and the body 113. The second bonding portion 122 may be disposed between the light emitting structure 123 and the body 113.
The first opening TH1 may be disposed under the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first coupling portion 121 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The first opening TH1 may be disposed to overlap the first pad 311. The first bonding portion 121 and the first pad 311 may be disposed to overlap each other in a vertical direction.
The second opening TH2 may be disposed under the second bonding part 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The second opening TH2 may be disposed to overlap the second pad 312. The second bonding part 122 and the second pad 312 may be disposed to overlap each other in a vertical direction.
The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other. The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other under the lower surface of the light emitting device 120.
The light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322, as shown in fig. 22.
The first conductive layer 321 may be disposed at the first opening TH 1. The first conductive layer 321 may be disposed to be in direct contact at a lower surface of the first bonding part 121. The first conductive layer 321 may be disposed to overlap the first bonding portion 121 in a vertical direction.
An upper surface of the first conductive layer 321 may be disposed on the same plane as an upper surface of the body 113. The lower surface of the first conductive layer 321 may be disposed at the same plane as the lower surface of the body 113.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed to be in direct contact at a lower surface of the second bonding part 122. The second conductive layer 322 may be disposed to overlap the second bonding portion 122 in a vertical direction.
The upper surface of the second conductive layer 322 may be disposed on the same plane as the upper surface of the body 113. The lower surface of the second conductive layer 322 may be disposed at the same plane as the lower surface of the body 113.
As an example, the first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au, pt, sn, cu, and the like, or an alloy thereof.
The light emitting device package according to the embodiment, as shown in fig. 22, may include a first bonding layer 421 and a second bonding layer 422.
The first bonding layer 421 may be electrically connected to the first bonding part 121 in a process of mounting the package body 110 on the circuit board 310. The second bonding layer 422 may be electrically connected to the second bonding portion 122 in a process in which the package body 110 is mounted at the circuit board 310.
The first and second bonding layers 421 and 422 may be formed of at least one metal selected from the group consisting of Ti, cu, ni, au, cr, ta, pt, sn, ag, and P, and selective alloys thereof.
According to an embodiment, the first pad 311 and the first conductive layer 321 of the circuit board 310 may be electrically connected to each other by a first bonding layer 421. In addition, the second pad 312 of the circuit board 310 and the second conductive layer 322 may be electrically connected to each other by the second bonding layer 422.
Meanwhile, according to an embodiment, the first conductive layer 321 and the second conductive layer 322 may be mounted on the circuit board 310 by eutectic bonding. Further, according to the embodiment, the first and second bonding layers 421 and 422 may not be provided, and the first and second conductive layers 321 and 322 may be electrically connected to the first and second pads 311 and 312, respectively.
The light emitting device package according to the embodiment may include a recess R as shown in fig. 22.
The recess R may be provided at the main body 113. The recess R may be disposed between the first opening TH1 and the reflector 117. In addition, the recess R may be disposed between the second opening TH2 and the reflector 117. The recess R may be provided to be recessed from an upper surface of the body 113 toward a lower surface thereof. The recess R may be disposed under the light emitting device 120. As an example, the recess R may be disposed under the light emitting device 120 in a closed loop shape.
The recess R may be disposed between the first coupling portion 121 and the reflector 117. The recess R may be disposed between the second coupling portion 122 and the reflector 117.
The light emitting device package according to the embodiment may include an adhesive 130, as shown in fig. 22.
The adhesive 130 may be disposed at the recess R. The adhesive 130 may be disposed between the light emitting device 120 and the body 113. The adhesive 130 may be disposed between the first bonding portion 121 and the reflector 117. The adhesive 130 may be disposed between the second bonding portion 122 and the reflector 117. For example, the adhesive 130 may be disposed to contact a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
The adhesive 130 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the adhesive 130 may be disposed in direct contact with the upper surface of the body 113. In addition, the adhesive 130 may be disposed in direct contact with the lower surface of the light emitting device 120.
As an example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the adhesive 130 may reflect light emitted from the light emitting device 120. When the adhesive 130 includes a reflective function, the adhesive 130 may include white silicone. When the adhesive 130 includes a reflective function, the adhesive 130 may be formed of, for example, tiO 2 Silicone, etc.
According to an embodiment, the depth of the recess R may be set to be smaller than the depth of the first opening TH1 or the depth of the second opening TH 2.
The depth of the recess R may be determined in consideration of the adhesion of the adhesive 130. Further, the depth of the recess R may be determined by considering the stable strength of the body 113 and/or the absence of the occurrence of cracks in the light emitting device package 1100 due to heat emitted from the light emitting device 120.
The recess R may provide an appropriate space in which an underfill process may be performed at a lower portion of the light emitting device 120. The recess R may be disposed at a first depth or more so that the adhesive 130 may be sufficiently disposed between the lower surface of the light emitting device 120 and the upper surface of the body 113. In addition, the recess R may be provided at a second depth or less to provide stable strength of the body 113.
The depth and width W3 of the recess R may affect the formation position and fixing force of the adhesive 130. The depth and width W3 of the recess R may be determined such that the fixing force may be sufficiently provided by the adhesive 130 disposed between the body 113 and the light emitting device 120.
As an example, the depth of the recess R may be set to several tens of micrometers. The depth of the recess R may be set to 40 to 60 micrometers.
In addition, the width W3 of the recess R may be set to several hundred micrometers. The width W3 of the recess R may be set to 140 to 160 micrometers. As an example, the width W3 of the recess R may be set to 150 μm.
The first and second bonding portions 121 and 122 of the light emitting device 120 may be sealed from the outside by an adhesive 130 disposed at the recess R. The adhesive 130 may be disposed under the light emitting device 120 in a closed loop shape. The adhesive 130 may be provided in a closed loop shape along the shape of the recess R, as shown in fig. 16 and 17. The recess R may be provided as a closed loop having a rectangular shape or a closed loop having a circular or elliptical shape.
The depth of the first opening TH1 may be set to correspond to the thickness of the body 113. The depth of the first opening TH1 may be set to a thickness capable of maintaining stable strength of the body 113.
As an example, the depth of the first opening TH1 may be set to several hundred micrometers. The depth of the first opening TH1 may be set to 180 to 220 micrometers. As an example, the depth of the first opening TH1 may be set to 200 micrometers.
As an example, a thickness obtained by subtracting the depth of the recess R from the depth of the first opening TH1 may be selected to be at least 100 micrometers or more. This is in view of the thickness of the implantation process that can provide a crack-free body 113.
According to an embodiment, the depth of the first opening TH1 may be set to be two to ten times the depth of the recess R. As an example, when the depth of the first opening TH1 is set to 200 micrometers, the depth of the recess R may be set to 20 to 100 micrometers.
In addition, the light emitting device package according to the embodiment may include a molding part 140, as shown in fig. 22.
The molding part 140 may be disposed on the light emitting device 120. The molding part 140 may be disposed on the body 113. The molding part 140 may be disposed at the cavity C provided by the reflector 117.
In the light emitting device package according to the embodiment, a conventional lead frame is not used in forming the package body 110, as described above with reference to fig. 22.
In the case of a light emitting device package to which a conventional lead frame is applied, although a process of forming the lead frame is additionally required, according to the method of manufacturing the light emitting device package according to the embodiment of the present invention, the process of forming the lead frame is not required. Therefore, according to the method of manufacturing the light emitting device package according to the embodiment of the present invention, not only the process time can be shortened but also the material can be reduced.
Further, in the case of a light emitting device package to which a conventional lead frame is applied, although a silver plating process should be added to prevent deterioration of the lead frame, according to the light emitting device package according to the embodiment of the present invention, since the lead frame is not required, an additional process such as silver plating may be omitted. Accordingly, the embodiment of the light emitting device package may solve the problem of discoloration of materials such as silver plating, and may reduce manufacturing costs by omitting the process. Therefore, according to the method of manufacturing a light emitting device package according to an embodiment of the present invention, manufacturing costs may be reduced, and manufacturing yield and reliability of products may be improved.
Meanwhile, according to the light emitting device package 1100 of the embodiment, the adhesive 130 disposed at the recess R may be disposed between the lower surface of the light emitting device 120 and the upper surface of the package body 110. The adhesive 130 may be disposed in a closed loop shape at the peripheries of the first and second bonding parts 121 and 122 when viewed from the upward direction of the light emitting device 120. Further, the adhesive 130 may be disposed at the peripheries of the first and second openings TH1 and TH2 in a closed loop shape when viewed from the upward direction of the light emitting device 120.
The adhesive 130 may perform a function of stably fixing the light emitting device 120 in the package body 110. In addition, the adhesive 130 may be disposed at the peripheries of the first and second bonding parts 121 and 122 contacting the side surfaces of the first and second bonding parts 121 and 122. The adhesive 130 may be arranged such that the first and second openings TH1 and TH2 are isolated from an outer region in which the molding part 140 is disposed when viewed from an upward direction of the light emitting device 120.
The adhesive 130 may prevent the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 from being separated from the closed loop of the recess R and flowing in the outward direction of the light emitting device 120.
In the case where the first and second conductive layers 321 and 322 move in the outward direction of the light emitting device 120 when viewed from the upward direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be diffused along the side surface of the light emitting device 120. As described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the first and second conductive type semiconductor layers of the light emitting device 120 may be electrically shorted. In addition, as described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the light extraction efficiency of the light emitting device 120 may be reduced.
However, according to the embodiment, since the inside and the outside are isolated from each other based on the region in which the recess R is provided by the adhesive 130, the first and second conductive layers 321 and 322 can be prevented from being separated from the region in which the recess R is provided and moving in the outward direction.
Therefore, according to the light emitting device package 1100 of the embodiment, it is possible to prevent the first and second conductive layers 321 and 322 from moving to the side surfaces of the light emitting device 120 and to prevent the light emitting device 120 from being electrically shorted, thereby improving light extraction efficiency.
According to the embodiment of the present invention, the adhesive 130 disposed at the recess R may move along the lower surface of the light emitting device 120 to the first region A1 located under the light emitting device 120, and may be disposed to contact the four side surfaces of the first and second bonding parts 121 and 122. Accordingly, the first and second bonding portions 121 and 122 may be arranged to be surrounded by the adhesive 130, and the first and second openings TH1 and TH2 may be sealed by the adhesive 130.
As described above, since the first and second openings TH1 and TH2 may be sealed by the adhesive 130, the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 may be prevented from moving on the upper surface of the body 113.
Meanwhile, when the amount of the adhesive 130 is not sufficiently set, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be set as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to the embodiment, the distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 is limited by selecting a property having poor adhesiveness to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
Meanwhile, fig. 23 is a view illustrating still another example of a light emitting device package according to an embodiment of the present invention. As shown in fig. 23, the light emitting device package according to the embodiment may further include a metal layer 430, compared to the light emitting device packages described with reference to fig. 15 to 22.
The metal layer 430 may be disposed at the first and second openings TH1 and TH 2. The metal layer 430 may be disposed at sidewalls of the package body 110 where the first opening TH1 is disposed and sidewalls of the package body 110 where the second opening TH2 is disposed.
The metal layer 430 may be disposed between the package body 110 provided with the first opening TH1 and the first conductive layer 321. In addition, the metal layer 430 may be disposed between the package body 110 provided with the second opening TH2 and the second conductive layer 322.
In addition, according to an embodiment, the metal layer 430 may also be disposed at the lower surface of the package body 110 adjacent to the first and second openings TH1 and TH 2.
The metal layer 430 may be formed of a material having good adhesion to the package body 110. In addition, the metal layer 430 may be formed of a material having good adhesion to the first and second conductive layers 321 and 322.
Accordingly, the first and second conductive layers 321 and 322 may be stably disposed in the first and second openings TH1 and TH 2. According to the embodiment, even when the adhesion between the first and second conductive layers 321 and 322 and the package body 110 is insufficient, the first and second conductive layers 321 and 322 may be stably disposed in the first and second openings TH1 and TH2 through the metal layer 430.
Meanwhile, in the case of the light emitting device package according to the above-described embodiment, the light emitting device package is explained based on the case where one opening is provided under each bonding portion.
However, according to the light emitting device package of another embodiment, a plurality of openings may be disposed under each opening. Further, the plurality of openings may be provided as openings having different widths.
In addition, the shape of the opening according to the embodiment may be provided in various shapes.
For example, the opening according to an embodiment may be provided with the same width from an upper region to a lower region thereof.
In addition, the opening according to the embodiment may be provided in the shape of a multi-step structure. As an example, the opening may be provided in a shape having different inclination angles of two stepped structures. Further, the opening may be provided in a shape having different inclination angles of three or more stepped structures.
Further, the opening may be provided in a shape having a width varying from the upper region toward the lower region. As an example, the opening may be provided in a shape having a curvature from the upper region toward the lower region.
In addition, according to the light emitting device package of the embodiment, the package body 110 includes only the body 113, and may be provided so as not to include the reflector 117 disposed on the body 113.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 24 and 25.
In describing the light emitting device package according to the embodiment of the present invention with reference to fig. 24 and 25, a description overlapping with that described with reference to fig. 1 to 23 may be omitted.
According to the semiconductor device package of the embodiment, as shown in fig. 24 and 25, compared to the semiconductor device package described with reference to fig. 15 to 23, the upper recess R10 may be further included.
The upper recess R10 may be provided at an upper surface of the body 113. The upper recess R10 may be disposed at the first region A1 located under the lower surface of the light emitting device 120. The upper recess R10 may be provided to be recessed in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The recess R10 may be disposed under the light emitting device 120 and may be disposed between the first and second bonding portions 121 and 122. The upper recess R10 may be provided to extend under the light emitting device 120 in the minor axis direction of the light emitting device 120.
As described with reference to fig. 15 to 23, when the amount of the adhesive 130 provided to the recess R is insufficient, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be provided as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to the embodiment, the distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 is limited by selecting a property having poor adhesiveness to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
In addition, when the light emitting device package according to the embodiment includes the upper recess R10, the upper recess R10 may provide a function of further limiting the diffusion and movement of the first and second conductive layers 321 and 322 in the first region A1.
When the upper recess R10 is provided, even when a part of the first conductive layer 321 and the second conductive layer 322 is diffused to the upper portion of the body 113, a trap effect is generated in the upper recess R10, restricting the shapes of the first conductive layer 321 and the second conductive layer 322. The following phenomena occur: the first conductive layer 321 diffused through the first opening TH1 may not move in the downward direction of the upper concave portion R10 from the boundary surface of the depressed region of the upper concave portion R10. In addition, the following phenomenon occurs: the second conductive layer 322 diffused through the second opening TH2 may not move in the downward direction of the upper recess R10 from the boundary surface of the recess region of the upper recess R10. This is explained as the flow of the first conductive layer 321 and the second conductive layer 322 is restricted at the boundary surface of the depression region of the upper concave portion R10 due to the influence of surface tension or the like.
Accordingly, since the distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be stably and reliably controlled, the first conductive layer 321 and the second conductive layer 322 can be prevented from being electrically shorted in the first region A1.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 26.
In describing the light emitting device package according to the embodiment of the present invention with reference to fig. 26, a description of contents overlapping with those described with reference to fig. 1 to 25 may be omitted.
As shown in fig. 26, in the light emitting device package according to the embodiment, the size of the light emitting device 120 may be smaller than that of the semiconductor device package described with reference to fig. 15 to 25.
As described with reference to fig. 15 to 25, the lower surface of the light emitting device 120 and the upper surface of the body 113 may be connected and sealed by the adhesive 130.
In the light emitting device package described with reference to fig. 15 to 25, description is made based on a case where the light emitting device 120 is disposed to be larger than the region formed by the outer boundary surface of the recess R when viewed from the upward direction of the light emitting device 120.
However, in the light emitting device package according to the embodiment, as shown in fig. 26, the outer side surface of the light emitting device 120 may be disposed to overlap the recess R when viewed from the upward direction of the light emitting device 120.
As described above, the outer surface of the light emitting device 120 may be disposed on the region of the recess R, so that the lower surface of the light emitting device 120 and the upper surface of the body 113 may be fixed and sealed by the adhesive 130 disposed in the recess R.
In addition, the light emitting device package according to the embodiment, as shown in fig. 26, may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductive layer 321 may be disposed at the first opening TH 1. The first conductive layer 321 may be disposed under the first bonding part 121. The width of the first conductive layer 321 may be set to be smaller than the width of the first bonding portion 121.
The first coupling portion 121 may have a width in a second direction perpendicular to a first direction in which the first opening TH1 is formed. The width of the first coupling portion 121 may be set to be greater than the width of the first opening TH1 in the second direction.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may be disposed to be surrounded by the body 113.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed under the second bonding portion 122. The width of the second conductive layer 322 may be set to be smaller than the width of the second bonding portion 122.
The second coupling portion 122 may have a width perpendicular to a second direction of the first direction in which the second opening TH2 is formed. The width of the second coupling portion 122 may be set to be greater than the width of the second opening TH2 in the second direction.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may be disposed to be surrounded by the body 113.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au and Pt, sn and Cu, etc., or alloys thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may include solder paste, silver paste, etc., and may be composed of multiple layers composed of different materials or multiple layers or a single layer composed of alloys thereof. As an example, the first conductive layer 321 and the second conductive layer 322 may include a SAC (Sn-Ag-Cu) material.
According to an embodiment, the first conductive layer 321 may be electrically connected to the first bonding part 121, and the second conductive layer 322 may be electrically connected to the second bonding part 122. As an example, external power may be supplied to the first and second conductive layers 321 and 322, and thus, the light emitting device 120 may be driven.
Meanwhile, according to the light emitting device package of the embodiment, the adhesive 130 disposed at the recess R may be disposed between the lower surface of the light emitting device 120 and the upper surface of the package body 110, as shown in fig. 26. The adhesive 130 may be disposed in a closed loop shape at the peripheries of the first and second adhesive parts 121 and 122 when viewed from the upward direction of the light emitting device 120. Further, the adhesive 130 may be disposed at the peripheries of the first and second openings TH1 and TH2 in a closed loop shape when viewed from the upward direction of the light emitting device 120. The outline connecting the four side surfaces of the light emitting device 120 when viewed from the upward direction of the light emitting device 120 may be disposed to overlap on the recess R.
The adhesive 130 may perform a function of stably fixing the light emitting device 120 in the package body 110. In addition, the adhesive 130 may be disposed at the peripheries of the first and second bonding parts 121 and 122 contacting the side surfaces of the first and second bonding parts 121 and 122. The adhesive 130 may be arranged such that the first and second openings TH1 and TH2 are isolated from an outer region in which the molding part 140 is disposed when viewed from an upward direction of the light emitting device 120.
The adhesive 130 may prevent the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 from being separated from the closed loop of the recess R and flowing in the outward direction of the light emitting device 120.
In the case where the first and second conductive layers 321 and 322 move in the outward direction of the light emitting device 120 when viewed from the upward direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be diffused along the side surface of the light emitting device 120. As described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the first and second conductive type semiconductor layers of the light emitting device 120 may be electrically shorted. In addition, as described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the light extraction efficiency of the light emitting device 120 may be reduced.
However, according to the embodiment, since the inside and the outside are isolated from each other based on the region in which the recess R is provided by the adhesive 130, the first and second conductive layers 321 and 322 can be prevented from being separated from the region in which the recess R is provided and moving in an outward direction.
Therefore, according to the light emitting device package according to the embodiment, it is possible to prevent the first and second conductive layers 321 and 322 from moving to the side surfaces of the light emitting device 120 and to prevent the light emitting device 120 from being electrically shorted, thereby improving light extraction efficiency.
In addition, according to an embodiment of the present invention, the adhesive 130 disposed at the recess R may move along the lower surface of the light emitting device 120 to the first region A1 located under the light emitting device 120, and may be arranged to contact four side surfaces of the first and second bonding parts 121 and 122. Accordingly, the first and second junctions 121 and 122 may be disposed to be surrounded by the adhesive 130 and the first and second openings TH1 and TH2 may be sealed by the adhesive 130.
As described above, since the first and second openings TH1 and TH2 may be sealed by the adhesive 130, the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 may be prevented from moving on the upper surface of the body 113.
Meanwhile, when the amount of the adhesive 130 is not sufficiently set, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be set as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to an embodiment, a distance that the first and second conductive layers 321 and 322 are diffused from the upper surface of the body 113 may be limited by selecting a property having poor adhesiveness to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 27.
In describing the light emitting device package according to the embodiment of the present invention with reference to fig. 27, a description overlapping with that described with reference to fig. 1 to 26 may be omitted.
Compared to the semiconductor device package described with reference to fig. 26, the semiconductor device package according to the embodiment, as shown in fig. 27, may further include an upper recess R10.
The upper recess R10 may be provided at an upper surface of the body 113. The upper recess R10 may be disposed at the first region A1 located under the lower surface of the light emitting device 120. The upper recess R10 may be provided to be recessed in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The recess R10 may be disposed under the light emitting device 120 and may be disposed between the first and second coupling parts 121 and 122. The upper recess R10 may be provided to extend under the light emitting device 120 in the minor axis direction of the light emitting device 120.
As described with reference to fig. 15 to 23 and 26, when the amount of the adhesive 130 provided to the recess R is insufficient, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be provided as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to the embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting a property having poor adhesion to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
In addition, when the light emitting device package according to the embodiment includes the upper recess R10, the upper recess R10 may provide a function of further limiting the diffusion and movement of the first and second conductive layers 321 and 322 in the first region A1.
When the upper recess R10 is provided, even if a trap effect is generated in the upper recess R10 when a portion of the first and second conductive layers 321 and 322 is diffused to the upper portion of the body 113, the flow of the first and second conductive layers 321 and 322 is restricted. The following phenomena occur: the first conductive layer 321 diffused through the first opening TH1 may not move in the downward direction of the upper concave portion R10 from the boundary surface of the depressed region of the upper concave portion R10. In addition, the following phenomenon occurs: the second conductive layer 322 diffused through the second opening TH2 may not move in the downward direction of the upper recess R10 from the boundary surface of the recess region of the upper recess R10. This is explained as the flow of the first conductive layer 321 and the second conductive layer 322 is restricted at the boundary surface of the depression region of the upper concave portion R10 due to the influence of surface tension or the like.
Accordingly, since the distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be reliably controlled, the first conductive layer 321 and the second conductive layer 322 can be prevented from being electrically shorted in the first region A1.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 28 to 31.
In describing the light emitting device package according to the embodiment of the present invention with reference to fig. 28 to 31, a description overlapping with that described with reference to fig. 1 to 27 may be omitted.
The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line. The body 113 may also be referred to as an insulating member.
The body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
The body 113 may provide an inclined surface disposed on the first and second frames 111 and 112. The cavity C may be disposed on the first and second frames 111 and 112 through the inclined surface of the body 113.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the body 113 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychlorinated terphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al) 2 O 3 ) And the like. In addition, the body 113 may include a high refractive index filler, such as TiO 2 And SiO 2 。
The first frame 111 and the second frame 112 may be provided as an insulating frame. The first frame 111 and the second frame 112 may stably provide structural strength of the package body 110.
In addition, the first frame 111 and the second frame 112 may be provided as conductive frames. The first and second frames 111 and 112 may stably provide structural strength of the package body 110 and may be electrically connected to the light emitting device 120.
The light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may be disposed on the package body 110. The light emitting device 120 may be disposed on the first frame 111 and the second frame 112. The light emitting device 120 may be disposed on the body 113. The light emitting device 120 may be disposed in the cavity C provided by the package body 110.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be arranged to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling portion 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
Meanwhile, the light emitting device package according to the embodiment may include the first opening TH1 and the second opening TH2. The first frame 111 may include a first opening TH1. The second frame 112 may include a second opening TH2.
The first opening TH1 may be provided at the first frame 111. The first opening TH1 may be provided by passing through the first frame 111. The first opening TH1 may be provided by passing through the upper and lower surfaces of the first frame 111 in the first direction.
The first opening TH1 may be disposed under the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first coupling portion 121 of the light emitting device 120 in the first direction from the upper surface of the first frame 111 toward the lower surface thereof.
The second opening TH2 may be provided at the second frame 112. The second opening TH2 may be provided by passing through the second frame 112. The second opening TH2 may be provided by passing through the upper and lower surfaces of the second frame 113 in the first direction.
The second opening TH2 may be disposed under the second bonding part 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120 in the first direction from the upper surface of the second frame 112 toward the lower surface thereof.
The first and second openings TH1 and TH2 may be arranged to be spaced apart from each other. The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other under the lower surface of the light emitting device 120.
According to an embodiment, the width W1 of the upper region of the first opening TH1 may be set to be less than or equal to the width of the first coupling portion 121. Further, the width of the upper region of the second opening TH2 may be set to be less than or equal to the width of the second coupling portion 122.
Accordingly, the first coupling part 121 of the light emitting device 120 and the first frame 111 may be more firmly attached. In addition, the second coupling part 122 of the light emitting device 120 and the second frame 112 may be more firmly attached.
Further, the width W1 of the upper region of the first opening TH1 may be set to be less than or equal to the width W2 of the lower region of the first opening TH 1. Further, the width of the upper region of the second opening TH2 may be set to be less than or equal to the width of the lower region of the second opening TH 2.
The first opening TH1 may be provided in an inclined shape in which the width is gradually reduced from the lower region toward the upper region. The second openings TH2 may be provided in a slanted shape in which the width is gradually reduced from the lower region toward the upper region.
However, the present invention is not limited thereto, and the inclined surface between the upper and lower regions of the first and second openings TH1 and TH2 may have a plurality of inclined surfaces having different slopes, and the inclined surfaces may be arranged to have a curvature.
A width between the first and second openings TH1 and TH2 in the lower surface regions of the first and second frames 111 and 112 may be set to several hundred micrometers. As an example, the width between the first and second openings TH1 and TH2 in the lower surface regions of the first and second frames 111 and 112 may be set to 100 to 150 micrometers.
The width between the first and second openings TH1 and TH2 in the lower surface regions of the first and second frames 111 and 112 may be selected to be set to exceed a predetermined distance in order to prevent an electrical circuit from occurring between the pads when the light emitting device package according to the embodiment is later mounted on a circuit board, a submount, or the like.
The light emitting device package according to the embodiment may include an adhesive 130.
The adhesive 130 may be disposed between the body 113 and the light emitting device 120. The adhesive 130 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
In addition, the light emitting device package according to the embodiment may include a recess R.
The recess R may be provided at the main body 113. The recess R may be disposed between the first opening TH1 and the reflector 117. In addition, the recess R may be disposed between the second opening TH2 and the reflector 117. The recess R may be provided to be recessed from the upper surface of the body 113 toward the lower surface thereof. The recess R may be disposed under the light emitting device 120. As an example, the recess R may be disposed under the light emitting device 120 in a closed loop shape.
The recess R may be disposed between the first coupling portion 121 and the reflector 117 to be adjacent to the first opening TH1 when viewed from an upward direction of the light emitting device 120. In addition, the recess R may be disposed between the second coupling portion 122 and the reflector 117 disposed adjacent to the second opening TH2 when viewed from the upward direction of the light emitting device 120.
The adhesive 130 may be disposed at the recess R. The adhesive 130 may be disposed between the light emitting device 120 and the body 113. The adhesive 130 may be disposed between the first adhesive part 121 and the reflector 117. The adhesive 130 may be disposed between the second adhesive part 122 and the reflector 117. For example, the adhesive 130 may be disposed to contact a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
The adhesive 130 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the adhesive 130 may be disposed in direct contact with the upper surface of the body 113. In addition, the adhesive 130 may be disposed in direct contact with the lower surface of the light emitting device 120.
As an example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the adhesive 130 may reflect light emitted from the light emitting device 120. When the adhesive 130 includes a reflective function, the adhesive 130 may include white silicone. When the adhesive 130 includes a reflective function, the adhesive 130 may be formed of, for example, tiO 2 Silicone, etc.
According to an embodiment, the depth of the recess R may be set to be smaller than the depth of the first opening TH1 or the depth of the second opening TH 2.
The depth of the recess R may be determined in consideration of the adhesion of the adhesive 130. In addition, the depth of the recess R may be determined by considering the stable strength of the body 113 and/or the absence of the occurrence of cracks in the light emitting device package 1100 due to heat emitted from the light emitting device 120.
The recess R may provide an appropriate space in which an underfill process may be performed at a lower portion of the light emitting device 120. The recess R may be disposed at a first depth or more so that the adhesive 130 may be sufficiently disposed between the lower surface of the light emitting device 120 and the upper surface of the body 113. In addition, the recess R may be provided at a second depth or less to provide stable strength of the body 113.
The depth and width W3 of the recess R may affect the formation position and fixing force of the adhesive 130. The depth and width W3 of the recess R may be determined such that the fixing force may be sufficiently provided by the adhesive 130 disposed between the body 113 and the light emitting device 120.
As an example, the depth of the recess R may be set to several tens of micrometers. The depth of the recess R may be set to 40 to 60 micrometers.
Further, the width W3 of the recess R may be set to several hundred micrometers. The width W3 of the recess R may be set to 140 to 160 micrometers. As an example, the width W3 of the recess R may be set to 150 μm.
The first and second bonding portions 121 and 122 of the light emitting device 120 may be sealed from the outside by an adhesive 130 disposed at the recess R. The adhesive 130 may be disposed under the light emitting device 120 in a closed loop shape.
The adhesive 130 may be provided in a closed loop shape along the shape of the recess R, as shown in fig. 30 and 31. The recess R may be provided as a closed loop having a rectangular shape or a closed loop having a circular or elliptical shape.
The depth of the first opening TH1 may be set to correspond to the thickness of the first frame 111. The depth of the first opening TH1 may be set at a thickness capable of maintaining the stable strength of the first frame 111.
The depth of the second opening TH2 may be set to correspond to the thickness of the second frame 112. The depth of the second opening TH2 may be set at a thickness capable of maintaining the stable strength of the second frame 112.
As an example, the depth of the first opening TH1 may be set to several hundred micrometers. The depth of the first opening TH1 may be set to 180 to 220 micrometers. As an example, the depth of the first opening TH1 may be set to 200 micrometers.
As an example, a thickness obtained by subtracting the depth of the recess R from the depth of the first opening TH1 may be selected to be at least 100 micrometers or more. This is in view of the thickness of the implantation process that can provide a crack-free body 113.
According to an embodiment, the depth of the first opening TH1 may be set to be two to ten times the depth of the recess R. As an example, when the depth of the first opening TH1 is set to 200 micrometers, the depth of the recess R may be set to 20 to 100 micrometers.
In addition, the light emitting device package according to the embodiment may include the molding part 140.
The molding part 140 may be disposed on the light emitting device 120. The mold part 140 may be disposed on the first frame 111 and the second frame 112. The molding part 140 may be disposed at the cavity C provided by the package body 110.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to be incident to light emitted from the light emitting device 120 and configured to provide wavelength-converted light. As an example, the molding part 140 may include at least one selected from the group consisting of a phosphor, a quantum dot, and the like.
In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductive layer 321 may be disposed at the first opening TH 1. The first conductive layer 321 may be disposed under the first bonding part 121. The width of the first conductive layer 321 may be set to be smaller than the width of the first bonding portion 121.
The first coupling portion 121 may have a width in a second direction perpendicular to a first direction in which the first opening TH1 is formed. The width of the first coupling portion 121 may be set to be greater than the width of the first opening TH1 in the second direction.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may be disposed to be surrounded by the first frame 111.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed under the second bonding portion 122. The width of the second conductive layer 322 may be set to be smaller than the width of the second bonding portion 122.
The second coupling portion 122 may have a width perpendicular to a second direction of the first direction in which the second opening TH2 is formed. The width of the second coupling portion 122 may be set to be greater than the width of the second opening TH2 in the second direction.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may be disposed to be surrounded by the second frame 112.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au and Pt, sn, cu, etc., or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may include solder paste, silver paste, etc., and may be composed of multiple layers composed of different materials or multiple layers or a single layer composed of alloys thereof. As an example, the first conductive layer 321 and the second conductive layer 322 may include a SAC (Sn-Ag-Cu) material.
In addition, the light emitting device package according to the embodiment may include a first lower recess R11 and a second lower recess R12. The first and second depressed portions R11 and R12 may be arranged to be spaced apart from each other.
The first lower recess R11 may be provided at a lower surface of the first frame 111. The first lower concave portion R11 may be provided to be concave in a direction from the lower surface to the upper surface of the first frame 111. The lower recess R11 may be disposed to be spaced apart from the first opening TH 1.
The first lower concave portion R11 may be provided to have a width of several micrometers to several tens of micrometers. The resin portion may be provided at the first lower recess R11. The resin portion filled in the first lower concave portion R11 may be provided to have, for example, the same material as the main body 113.
However, the present invention is not limited thereto, and the resin portion may be provided to have a material selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion may be provided to be selected from materials having low surface tension with respect to the first and second conductive layers 321 and 322.
As an example, the resin portion filled in the first undercut R11 may be provided in a process of forming the first frame 111, the second frame 112, and the body 113 by an injection process or the like.
The resin portion filled in the first lower recess R11 may be disposed at the periphery of the lower surface area of the first frame 111 where the first opening TH1 is provided. The lower surface of the first frame 111, in which the first opening TH1 is provided, may be arranged to be separated from the lower surface of the first frame 111 formed in the periphery of the first frame 111 in the shape of an island.
As an example, as shown in fig. 15, the lower surface of the first frame 111 where the first opening TH1 is provided may be isolated from the periphery of the first frame 111 by the resin portion filled in the first lower recess R11 and the main body 113.
Therefore, when the resin portion is disposed to have a material having poor adhesion and poor wettability with the first and second conductive layers 321 and 322 or a material having low surface tension between the resin portion and the first and second conductive layers 321 and 322, the first conductive layer 321 provided at the first opening TH1 may be prevented from being separated from the first opening TH1 and from being spread on the resin portion filled in the first lower recess R11 or the main body 113.
This is based on the fact that the adhesion relationship between the first conductive layer 321 and the resin portion and the main body 113 or the wettability and surface tension between the resin portion and the first conductive layer 321 and the second conductive layer 322, etc. are not good. That is, the material constituting the first conductive layer 321 may be selected to have good adhesion characteristics with the first frame 111. In addition, a material constituting the first conductive layer 321 may be selected to have poor adhesion characteristics with the resin portion and the main body 113.
Accordingly, since the first conductive layer 321 overflows from the first opening TH1 toward the region where the resin or the body 113 is disposed, the overflow or the extension to the outside of the region where the resin or the body 113 is disposed is prevented, so that the first conductive layer 321 can be stably disposed at the region where the first opening TH1 is disposed.
When the first conductive layer 321 disposed at the first opening TH1 overflows, the first conductive layer 321 may be prevented from extending to the outside of the region in which the first lower recess R11 of the resin portion or the main body 113 is disposed. In addition, the first conductive layer 321 may be stably connected to the lower surface of the first bonding portion 121 in the first opening TH 1.
Therefore, when the light emitting device package is mounted on a circuit board, it is possible to prevent the problems of the first conductive layer 321 and the second conductive layer 322 contacting each other and short-circuiting, and to easily control the amounts of the first conductive layer 321 and the second conductive layer 322 in the process of disposing the first conductive layer 321 and the second conductive layer 322.
In addition, a second lower recess R12 may be provided at a lower surface of the second frame 112. The second lower recess R12 may be provided to be recessed in the upper surface direction from the lower surface of the second frame 112. The second lower recess R12 may be disposed to be spaced apart from the second opening TH 2.
The second lower recess R12 may be provided to have a width of several micrometers to several tens of micrometers. The resin portion may be provided at the second depressed portion R12. The resin portion filled in the second depressed portion R12 may be provided to have, for example, the same material as the main body 113.
However, the present invention is not limited thereto, and the resin portion may be provided to have a material selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion may be provided to be selected from materials having low surface tension with respect to the first and second conductive layers 321 and 322.
As an example, the resin portion filled in the second depressed portion R12 may be provided in a process of forming the first frame 111, the second frame 112, and the body 113 by an injection process or the like.
The resin portion filled in the second depressed portion R12 may be disposed at the periphery of the lower surface area of the second frame 112 where the second opening TH2 is provided. The lower surface of the second frame 112 provided with the second opening TH2 may be arranged to be separated from the lower surface of the second frame 112 formed in the periphery of the second frame 112 in the shape of an island.
As an example, as shown in fig. 29, the lower surface of the second frame 112 where the second opening TH2 is provided may be isolated from the periphery of the first frame 111 by a resin portion filled in the second depressed portion R12 and the main body 113.
Therefore, when the resin portion is disposed to have a material having poor adhesion and poor wettability with the first and second conductive layers 321 and 322 or a material having low surface tension between the resin portion and the first and second conductive layers 321 and 322, it is possible to prevent the second conductive layer 322 disposed at the second opening TH2 from being separated from the second opening TH2 and from being spread on the resin portion filled in the second lower recess R12 or the main body 113.
This is based on the fact that the adhesion relationship between the second conductive layer 322 and the resin portion and the main body 113 or the wettability and surface tension between the resin portion and the first conductive layer 321 and the second conductive layer 322, etc. are not good. That is, the material constituting the second conductive layer 322 may be selected to have good adhesion characteristics with the second frame 112. In addition, a material constituting the second conductive layer 322 may be selected to have poor adhesion characteristics with the resin portion and the main body 113.
Accordingly, since the second conductive layer 322 overflows from the second opening TH2 toward the region where the resin or the main body 113 is disposed, the second conductive layer 322 is prevented from overflowing or extending to the outside of the region where the resin portion or the main body 113 is disposed, so that the second conductive layer 322 can be stably disposed at the region where the second opening TH2 is disposed.
Therefore, when the second conductive layer 322 disposed at the second opening TH2 overflows, the second conductive layer 322 may be prevented from extending to the outside of the region in which the resin portion or the second lower recess R12 of the main body 113 is disposed. In addition, the second conductive layer 322 may be stably connected to the lower surface of the second bonding part 122 in the second opening TH 2.
Therefore, when the light emitting device package is mounted on a circuit board, it is possible to prevent the problems of the first conductive layer 321 and the second conductive layer 322 contacting each other and short-circuiting, and to easily control the amounts of the first conductive layer 321 and the second conductive layer 322 in the process of disposing the first conductive layer 321 and the second conductive layer 322.
According to an embodiment, the first conductive layer 321 may be electrically connected to the first bonding part 121, and the second conductive layer 322 may be electrically connected to the second bonding part 122. As an example, external power may be supplied to the first and second conductive layers 321 and 322, and thus, the light emitting device 120 may be driven.
Meanwhile, according to the light emitting device package 1100 according to the embodiment, the adhesive 130 disposed at the recess R may be disposed between the lower surface of the light emitting device 120 and the upper surface of the package body 110, as shown in fig. 15 to 17. The adhesive 130 may be disposed in a closed loop shape at the peripheries of the first and second coupling parts 121 and 122 when viewed from the upward direction of the light emitting device 120. Further, the adhesive 130 may be disposed at the peripheries of the first and second openings TH1 and TH2 in a closed loop shape when viewed from the upward direction of the light emitting device 120.
The adhesive 130 may perform a function of stably fixing the light emitting device 120 in the package body 110. In addition, the adhesive 130 may be disposed at the peripheries of the first and second bonding parts 121 and 122 contacting the side surfaces of the first and second bonding parts 121 and 122. The adhesive 130 may be arranged such that the first and second openings TH1 and TH2 are isolated from an outer region in which the molding part 140 is disposed when viewed from an upward direction of the light emitting device 120.
The adhesive 130 may prevent the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 from being separated from the closed loop of the recess R and flowing in the outward direction of the light emitting device 120.
In the case where the first and second conductive layers 321 and 322 move in the outward direction of the light emitting device 120 when viewed from the upward direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be diffused along the side surface of the light emitting device 120. As described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the first and second conductive type semiconductor layers of the light emitting device 120 may be electrically shorted. In addition, as described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the light extraction efficiency of the light emitting device 120 may be reduced.
However, according to the embodiment, since the inside and the outside are isolated from each other based on the region in which the recess R is provided by the adhesive 130, the first and second conductive layers 321 and 322 can be prevented from being separated from the region in which the recess R is provided and moving in the outward direction.
Therefore, according to the light emitting device package of the embodiment, it is possible to prevent the first and second conductive layers 321 and 322 from moving to the side surfaces of the light emitting device 120 and to prevent the light emitting device 120 from being electrically shorted, thereby improving light extraction efficiency.
According to the embodiment of the present invention, the adhesive 130 disposed at the recess R may move to the first region A1 located under the light emitting device 120 along the lower surface of the light emitting device 120, and may be disposed to contact four side surfaces of the first and second bonding parts 121 and 122. Accordingly, the first and second bonding portions 121 and 122 may be arranged to be surrounded by the adhesive 130, and the first and second openings TH1 and TH2 may be sealed by the adhesive 130.
As described above, since the first and second openings TH1 and TH2 may be sealed by the adhesive 130, the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 may be prevented from moving on the upper surface of the body 113.
Meanwhile, when the amount of the adhesive 130 is not sufficiently set, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be set as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to an embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting properties having poor adhesiveness to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow or heat treatment may be applied. At this time, in the reflow or heat treatment process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device disposed at the light emitting device package, so that the stability of electrical connection and physical coupling may be weakened.
However, according to the light emitting device package and the method of manufacturing the same according to the embodiment, the electrode part of the light emitting device according to the embodiment may be provided to have the driving power through the conductive layer disposed at the opening. In addition, the melting point of the conductive layer disposed in the opening may be selected to have a higher value than a general bonding material.
Therefore, since the light emitting device package according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Next, a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 32 and 33.
In describing the light emitting device package according to the embodiment of the present invention with reference to fig. 32 and 33, a description overlapping with that described with reference to fig. 1 to 31 may be omitted.
Compared to the semiconductor device package described with reference to fig. 28 to 31, the semiconductor device package according to the embodiment, as shown in fig. 32 and 33, may further include an upper recess R10.
The upper recess R10 may be provided at an upper surface of the body 113. The upper recess R10 may be disposed at the first region A1 located under the lower surface of the light emitting device 120. The upper recess R10 may be provided to be recessed in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The recess R10 may be disposed under the light emitting device 120 and may be disposed between the first and second bonding portions 121 and 122. The upper recess R10 may be provided to extend under the light emitting device 120 in the minor axis direction of the light emitting device 120.
As described with reference to fig. 28 to 31, when the amount of the adhesive 130 provided to the recess R is insufficient, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be provided as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to the embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting a property having poor adhesion to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
In addition, when the light emitting device package according to the embodiment includes the upper recess R10, the upper recess R10 may provide a function of further limiting the diffusion and movement of the first and second conductive layers 321 and 322 in the first region A1.
When the upper recess R10 is provided, even when a part of the first conductive layer 321 and the second conductive layer 322 is diffused to the upper portion of the body 113, a trap effect is generated in the upper recess R10, restricting the shapes of the first conductive layer 321 and the second conductive layer 322. The following phenomena occur: the first conductive layer 321 diffused through the first opening TH1 may not move in the downward direction of the upper recess R10 from the boundary surface of the recess region of the upper recess R10. In addition, the following phenomenon occurs: the second conductive layer 322 diffused through the second opening TH2 may not move in the downward direction of the upper recess R10 from the boundary surface of the recess region of the upper recess R10. This is explained as the flow of the first conductive layer 321 and the second conductive layer 322 is restricted at the boundary surface of the depression region of the upper concave portion R10 due to the influence of surface tension or the like.
Accordingly, since the distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be stably and reliably controlled, the first conductive layer 321 and the second conductive layer 322 can be prevented from being electrically shorted in the first region A1.
Meanwhile, in the light emitting device packages described with reference to fig. 28 to 33, when viewed from the upward direction of the light emitting device 120, description is made based on a case where the light emitting device 120 is disposed to be larger than the region formed by the outer boundary surface of the recess R.
However, in the light emitting device package according to another embodiment, similarly to the light emitting device package described with reference to fig. 26, the outer side surface of the light emitting device 120 may be disposed to overlap the recess R when viewed from the upward direction of the light emitting device 120.
As described above, the outer surface of the light emitting device 120 may be disposed on the region of the recess R, so that the lower surface of the light emitting device 120 and the upper surface of the body 113 may be fixed and sealed by the adhesive 130 disposed in the recess R.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 34.
In describing the light emitting device package according to the embodiment with reference to fig. 34, a description overlapping with that described with reference to fig. 1 to 33 may be omitted.
The light emitting device package 1100 according to the embodiment may include a package body 110 and a light emitting device 120.
The package body 110 may include a body 113 and a reflector 117. The reflector 117 may be disposed on the body 113. The reflector 117 may be disposed at a periphery of the upper surface of the body 113. The reflector 117 may provide a cavity C on the upper surface of the body 113.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the body 113 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychlorinated terphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al) 2 O 3 ) And the like. In addition, the body 113 may include a high refractive index filler, such as TiO 2 And SiO 2 。
According to an embodiment, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The light emitting device 120 may include a light emitting structure 123 disposed under a substrate 124. The first and second bonding parts 121 and 122 may be disposed between the light emitting structure 123 and the body 113.
The light emitting device 120 may be disposed on the package body 110. The light emitting device 120 may be disposed on the body 113. The light emitting device 120 may be arranged in the cavity C provided by the reflector 117.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding part 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other under the lower surface of the light emitting device 120.
The first coupling part 121 may be disposed between the light emitting structure 123 and the body 113. The second bonding portion 122 may be disposed between the light emitting structure 123 and the body 113.
Meanwhile, the light emitting device package according to the embodiment may include a first opening TH1 and a second opening TH2.
The package body 110 may include a first opening TH1 passing through a lower surface of the package body 110 from a bottom surface of the cavity C. The package body 110 may include a second opening TH2 passing through a lower surface of the package body 110 from a bottom surface of the cavity C.
The first opening TH1 may be disposed under the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first coupling portion 121 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The second opening TH2 may be provided at the body 113. The second opening TH2 may be provided by passing through the body 113. The second opening TH2 may be provided by passing through the upper and lower surfaces of the body 113 in the first direction.
The second opening TH2 may be disposed under the second bonding part 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120 in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other. The first and second openings TH1 and TH2 may be arranged to be spaced apart from each other below the lower surface of the light emitting device 120.
According to an embodiment, the width W1 of the upper region of the first opening TH1 may be set to be greater than the width of the first coupling portion 121. Further, the width of the upper region of the second opening TH2 may be set to be greater than the size of the second coupling portion 122.
According to an embodiment, a lower region of the first coupling part 121 may be disposed in an upper region of the first opening TH 1. The bottom surface of the first coupling portion 121 may be disposed lower than the upper surface of the body 113.
In addition, a lower region of the second coupling portion 122 may be disposed in an upper region of the second opening TH 2. The bottom surface of the second coupling portion 122 may be disposed lower than the upper surface of the body 113.
Further, the width W1 of the upper region of the first opening TH1 may be set to be less than or equal to the width W2 of the lower region of the first opening TH 1. Further, the width of the upper region of the second opening TH2 may be set to be less than or equal to the width of the lower region of the second opening TH 2.
The first opening TH1 may be provided in an inclined shape in which the width is gradually reduced from the lower region toward the upper region. The second openings TH2 may be provided in a slanted shape in which the width is gradually reduced from the lower region toward the upper region.
However, the present invention is not limited thereto, and the inclined surface between the upper and lower regions of the first and second openings TH1 and TH2 may have a plurality of inclined surfaces having different slopes, and the inclined surfaces may be arranged to have a curvature.
A width between the first and second openings TH1 and TH2 in the lower surface region of the body 113 may be set to several hundred micrometers. A width between the first and second openings TH1 and TH2 in the lower surface region of the body 113 may be set to, for example, 100 to 150 micrometers.
The width between the first and second openings TH1 and TH2 in the lower surface region of the body 113 may be selected to be set to exceed a predetermined distance in order to prevent a short circuit from occurring between the pads when the light emitting device package according to the embodiment is later mounted on a circuit board, a submount, or the like.
The light emitting device package according to the embodiment may include an adhesive 130.
The adhesive 130 may be disposed between the body 113 and the light emitting device 120. The adhesive 130 may be disposed between the upper surface of the body 113 and the lower surface of the light emitting device 120.
In addition, the light emitting device package according to the embodiment may include a recess R.
The recess R may be provided at the body 113. The recess R may be disposed between the first opening TH1 and the reflector 117. In addition, the recess R may be disposed between the second opening TH2 and the reflector 117. The recess R may be provided to be recessed from the upper surface of the body 113 toward the lower surface thereof. The recess R may be disposed under the light emitting device 120. As an example, the recess R may be disposed under the light emitting device 120 in a closed loop shape.
The recess R may be disposed between the first coupling portion 121 and the reflector 117 when viewed from an upward direction of the light emitting device 120, the reflector 117 being disposed adjacent to the first opening TH 1. In addition, the recess R may be disposed between the reflector 117 disposed adjacent to the second opening TH2 and the second bonding portion 122 when viewed from the upward direction of the light emitting device 120.
The adhesive 130 may be disposed at the recess R. The adhesive 130 may be disposed between the light emitting device 120 and the body 113. The adhesive 130 may be disposed between the first adhesive part 121 and the reflector 117. The adhesive 130 may be disposed between the second adhesive part 121 and the reflector 117. For example, the adhesive 130 may be disposed to contact a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
The adhesive 130 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the adhesive 130 may be disposed in direct contact with the upper surface of the body 113. In addition, the adhesive 130 may be disposed in direct contact with the lower surface of the light emitting device 120.
As an example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the adhesive 130 may reflect light emitted from the light emitting device 120. When the adhesive 130 includes a reflective function, the adhesive 130 may include white silicone. When the adhesive 130 includes a reflective function, the adhesive 130 may be formed of, for example, tiO 2 Silicone, etc.
According to an embodiment, the depth of the recess R may be set to be smaller than the depth of the first opening TH1 or the depth of the second opening TH 2.
The depth of the recess R may be determined in consideration of the adhesion of the adhesive 130. In addition, the depth of the recess R may be determined by considering the stable strength of the body 113 and/or the absence of the occurrence of cracks in the light emitting device package 1100 due to heat emitted from the light emitting device 120.
The recess R may provide an appropriate space in which an underfill process may be performed at a lower portion of the light emitting device 120. The recess R may be disposed at a first depth or more so that the adhesive 130 may be sufficiently disposed between the lower surface of the light emitting device 120 and the upper surface of the body 113. In addition, the recess R may be provided at a second depth or less to provide stable strength of the body 113.
The depth and width W3 of the recess R may affect the formation position and fixing force of the adhesive 130. The depth and width W3 of the recess R may be determined such that the fixing force may be sufficiently provided by the adhesive 130 disposed between the body 113 and the light emitting device 120.
As an example, the depth of the recess R may be set to several tens of micrometers. The depth of the recess R may be set to 40 to 60 micrometers.
Further, the width W3 of the recess R may be set to several hundred micrometers. The width W3 of the recess R may be set to 140 to 160 micrometers. As an example, the width W3 of the recess R may be set to 150 μm.
The first and second bonding portions 121 and 122 of the light emitting device 120 may be sealed from the outside by an adhesive 130 disposed at the recess R. The adhesive 130 may be disposed under the light emitting device 120 in a closed loop shape.
The adhesive 130 may be provided in a closed loop shape along the shape of the recess R as described above with reference to fig. 16 and 17. The recess R may be provided as a closed loop having a rectangular shape or a closed loop having a circular or elliptical shape.
The depth of the first opening TH1 may be set to correspond to the thickness of the body 113. The depth of the first opening TH1 may be set at a thickness capable of maintaining stable strength of the body 113.
As an example, the depth of the first opening TH1 may be set to several hundred micrometers. The depth of the first opening TH1 may be set to 180 to 220 micrometers. As an example, the depth of the first opening TH1 may be set to 200 micrometers.
As an example, a thickness obtained by subtracting the depth of the recess R from the depth of the first opening TH1 may be selected to be at least 100 micrometers or more. This is in view of the thickness of the implantation process that can provide a crack-free body 113.
According to an embodiment, the depth of the first opening TH1 may be set to 2 to 10 times the depth of the recess R. For example, when the depth of the first opening TH1 is set to 200 micrometers, the depth of the recess R may be set to 20 to 100 micrometers.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light emitted to the lower surface of the light emitting device 120 can be increased. In addition, an adhesive 130 having good reflection characteristics may be provided under the light emitting device 120. Accordingly, light emitted under the light emitting device 120 is reflected at the adhesive 130 and is effectively emitted toward an upward direction of the light emitting device package, and thus, light extraction efficiency of the light emitting device package may be improved.
In addition, the light emitting device package according to the embodiment may include the molding part 140.
The molding part 140 may be disposed on the light emitting device 120. The molding part 140 may be disposed on the body 113. The molding part 140 may be disposed at the cavity C provided by the reflector 117.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to be incident light emitted from the light emitting device 120 and configured to provide wavelength-converted light. As an example, the molding part 140 may include a phosphor, a quantum dot, and the like.
The light emitting device package according to the embodiment may include a first conductor 221 and a second conductor 222. In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductor 221 may be disposed under the first coupling portion 121. The first conductor 221 may be electrically connected to the first coupling portion 121. The first conductor 221 may be arranged to overlap the first coupling portion 121 in the first direction.
The first conductor 221 may be disposed at the first opening TH 1. The first conductor 221 may be disposed between the first bonding portion 121 and the first conductive layer 321. The first conductor 221 may be electrically connected to the first bonding portion 121 and the first conductive layer 321.
A lower surface of the first conductor 221 may be disposed lower than an upper surface of the first opening TH 1. The lower surface of the first conductor 221 may be disposed lower than the upper surface of the first conductive layer 321.
The first conductor 221 may be disposed on the first opening TH 1. In addition, the first conductor 221 may be arranged to extend from the first bonding portion 121 to the inside of the first opening TH 1.
In addition, the second conductor 222 may be disposed under the second junction 122. The second conductor 222 may be electrically connected to the second junction 122. The second conductor 222 may be arranged to overlap 122 the second junction in the first direction.
The second conductor 222 may be disposed at the second opening TH 2. The second conductor 222 may be disposed between the second junction 122 and the second conductive layer 322. The second conductor 222 may be electrically connected to the second junction 122 and the second conductive layer 322.
A lower surface of the second conductor 222 may be disposed lower than an upper surface of the second opening TH 2. The lower surface of the second conductor 222 may be disposed lower than the upper surface of the second conductive layer 322.
The second conductor 222 may be disposed on the second opening TH 2. In addition, the second conductor 222 may be arranged to extend from the second coupling portion 122 to the inside of the second opening TH 2.
According to an embodiment, the first conductive layer 321 may be disposed on the lower surface and the side surface of the first conductor 221. The first conductive layer 321 may be disposed in direct contact with the lower surface and the side surface of the first conductor 221.
The first conductive layer 321 may be disposed at the first opening TH 1. The first conductive layer 321 may be disposed under the first bonding part 121. The width of the first conductive layer 321 may be set to be greater than the width of the first bonding part 121.
As described above, according to the light emitting device package according to the embodiment, the electrical connection between the first conductive layer 321 and the first bonding part 121 may be more stably provided by the first conductor 221.
In addition, according to an embodiment, the second conductive layer 322 may be disposed at the lower surface and the side surface of the second conductor 222. The second conductive layer 322 may be disposed in direct contact with the lower surface and the side surface of the second conductor 222.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed under the second bonding part 122. The width of the second conductive layer 322 may be set to be greater than the width of the second bonding part 122.
As described above, according to the light emitting device package of the embodiment, the second conductor 222 may more stably provide the electrical connection between the second conductive layer 322 and the second bonding part 122.
As an example, the first and second conductors 221 and 222 may be stably coupled to the first and second coupling parts 121 and 122, respectively, via separate coupling materials. In addition, side surfaces and lower surfaces of the first and second conductors 221 and 222 may be in contact with the first and second conductive layers 321 and 322, respectively.
Therefore, an area in which the first and second conductive layers 321 and 322 contact the first and second conductors 221 and 222, respectively, may be further increased as compared to a case in which the first and second conductive layers 321 and 322 are directly contacted to the first and second junctions 121 and 122, respectively.
Accordingly, power can be stably supplied from the first and second conductive layers 321 and 322 to the first and second bonding portions 121 and 122 via the first and second conductors 221 and 222.
As an example, the first conductor 221 and the second conductor 222 may include at least one material selected from the group consisting of Al, au, ag, pt, and the like, or an alloy thereof. In addition, the first and second conductors 221 and 222 may be provided as a single layer or a plurality of layers.
The first coupling portion 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first coupling portion 121 may be set to be smaller than the width of the first opening TH1 in the second direction.
The first conductive layer 321 may be disposed in direct contact with the lower surface of the first bonding part 121. The first conductive layer 321 may be electrically connected to the first bonding portion 121. The first conductive layer 321 may be disposed to be surrounded by the body 113.
An upper portion of the first conductive layer 321 may be disposed at a periphery of a lower portion of the first bonding part 121 in an upper region of the first opening TH 1. An upper surface of the first conductive layer 321 may be disposed higher than a lower surface of the first bonding part 121.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed under the second bonding part 122. The width of the second conductive layer 322 may be set to be greater than the width of the second bonding part 122.
The second coupling portion 122 may have a width perpendicular to a second direction of the first direction in which the second opening TH2 is formed. The width of the second coupling portion 122 may be set to be smaller than the width of the second opening TH2 in the second direction.
The second conductive layer 322 may be disposed in direct contact with the lower surface of the second bonding part 122. The second conductive layer 322 may be electrically connected to the second bonding portion 122. The second conductive layer 322 may be disposed to be surrounded by the body 113.
An upper portion of the second conductive layer 322 may be disposed at a periphery of a lower portion of the second bonding part 122 in an upper region of the second opening TH 2. An upper surface of the second conductive layer 322 may be disposed higher than a lower surface of the second bonding portion 122.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au and Pt, sn, cu, etc., or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may include solder paste, silver paste, etc., and may be composed of multiple layers composed of different materials or multiple layers or a single layer composed of alloys thereof. As an example, the first conductive layer 321 and the second conductive layer 322 may include a SAC (Sn-Ag-Cu) material.
According to an embodiment, the first conductive layer 321 may be electrically connected to the first bonding part 121, and the second conductive layer 322 may be electrically connected to the second bonding part 122. As an example, external power may be supplied to the first and second conductive layers 321 and 322, and thus, the light emitting device 120 may be driven.
Meanwhile, according to the light emitting device package of the embodiment, the adhesive 130 disposed at the recess R may be disposed between the lower surface of the light emitting device 120 and the upper surface of the package body 110. The adhesive 130 may be disposed at the peripheries of the first and second bonding portions 121 and 122 in a closed loop shape when viewed from the upward direction of the light emitting device 120. The adhesive 130 may be disposed at the peripheries of the first and second openings TH1 and TH2 in a closed loop shape when viewed from an upward direction of the light emitting device 120.
The adhesive 130 may perform a function of stably fixing the light emitting device 120 in the package body 110. In addition, the adhesive 130 may be disposed at the peripheries of the first and second bonding parts 121 and 122 contacting the side surfaces of the first and second bonding parts 121 and 122. The adhesive 130 may be arranged such that the first and second openings TH1 and TH2 are isolated from an outer region in which the molding part 140 is disposed when viewed from an upward direction of the light emitting device 120.
The adhesive 130 may prevent the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 from being separated from the closed loop of the recess R and flowing in the outward direction of the light emitting device 120.
In the case where the first and second conductive layers 321 and 322 move in the outward direction of the light emitting device 120 when viewed from the upward direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be diffused along the side surface of the light emitting device 120. As described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the first and second conductive type semiconductor layers of the light emitting device 120 may be electrically shorted. In addition, as described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the light extraction efficiency of the light emitting device 120 may be reduced.
However, according to the embodiment, since the inside and the outside are isolated from each other based on the region in which the recess R is provided by the adhesive 130, the first and second conductive layers 321 and 322 can be prevented from being separated from the region in which the recess R is provided and moving in the outward direction.
Therefore, according to the light emitting device package of the embodiment, it is possible to prevent the first and second conductive layers 321 and 322 from moving to the side surfaces of the light emitting device 120 and to prevent the light emitting device 120 from being electrically shorted, thereby improving light extraction efficiency.
According to the embodiment of the present invention, the adhesive 130 disposed at the recess R may move to the first region A1 located under the light emitting device 120 along the lower surface of the light emitting device 120, and may be disposed to contact four side surfaces of the first and second bonding parts 121 and 122. Accordingly, the first and second bonding portions 121 and 122 may be arranged to be surrounded by the adhesive 130, and the first and second openings TH1 and TH2 may be sealed by the adhesive 130.
As described above, since the first and second openings TH1 and TH2 may be sealed by the adhesive 130, the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 may be prevented from moving on the upper surface of the body 113.
Meanwhile, when the amount of the adhesive 130 is not sufficiently set, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be set as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to an embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting properties having poor adhesiveness to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow or heat treatment may be applied. At this time, in the reflow or heat treatment process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device disposed at the light emitting device package, so that the stability of electrical connection and physical coupling may be weakened.
However, according to the light emitting device package and the method of manufacturing the same of the embodiment, the electrode part of the light emitting device according to the embodiment may be provided to have the driving power through the conductive layer disposed at the opening. In addition, the melting point of the conductive layer disposed in the opening may be selected to have a higher value than a general bonding material.
Therefore, since the light emitting device package according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package 100 and the method of manufacturing the light emitting device package according to the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device package. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Next, a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 35.
In describing the light emitting device package according to the embodiment of the present invention with reference to fig. 35, a description overlapping with that described with reference to fig. 1 to 34 may be omitted.
Compared to the semiconductor device package described with reference to fig. 34, the semiconductor device package according to the embodiment may further include an upper recess R10.
The upper recess R10 may be provided at an upper surface of the body 113. The upper recess R10 may be disposed at the first region A1 located under the lower surface of the light emitting device 120. The upper recess R10 may be provided to be recessed in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The recess R10 may be disposed under the light emitting device 120 and may be disposed between the first and second bonding portions 121 and 122. The upper recess R10 may be provided to extend under the light emitting device 120 in the minor axis direction of the light emitting device 120.
As described with reference to fig. 34, when the amount of the adhesive 130 provided to the recess R is insufficient, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be provided as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to the embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting a property having poor adhesion to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
In addition, when the light emitting device package according to the embodiment includes the upper recess R10, the upper recess R10 may provide a function of further limiting the diffusion and movement of the first and second conductive layers 321 and 322 in the first region A1.
When the upper recess R10 is provided, a trap effect is generated in the upper recess R10 even when a portion of the first conductive layer 321 and the second conductive layer 322 is diffused to the upper portion of the body 113, restricting the flow of the first conductive layer 321 and the second conductive layer 322. The following phenomena occur: the first conductive layer 321 diffused through the first opening TH1 may not be moved in the downward direction of the upper concave portion R10 from the boundary surface of the recess region of the upper concave portion R10. In addition, the following phenomenon occurs: the second conductive layer 322 diffused through the second opening TH2 may not move in the downward direction of the upper recess R10 from the boundary surface of the recess region of the upper recess R10. This is explained as the flow of the first conductive layer 321 and the second conductive layer 322 is restricted at the boundary surface of the depression region of the upper concave portion R10 due to the influence of surface tension or the like.
Accordingly, since the distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be stably and reliably controlled, the first conductive layer 321 and the second conductive layer 322 can be prevented from being electrically shorted in the first region A1.
Meanwhile, in the light emitting device packages described with reference to fig. 34 to 35, when viewed from the upward direction of the light emitting device 120, description is made based on a case where the light emitting device 120 is disposed to be larger than the region formed by the outer boundary surface of the recess R.
However, in the light emitting device package according to another embodiment, similarly to the light emitting device package described with reference to fig. 26, the outer side surface of the light emitting device 120 may be disposed to overlap the recess R when viewed from the upward direction of the light emitting device 120.
As described above, the outer surface of the light emitting device 120 may be disposed on the region of the recess R, so that the lower surface of the light emitting device 120 and the upper surface of the body 113 may be fixed and sealed by the adhesive 130 disposed in the recess R.
Next, another example of a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 36.
In describing the light emitting device package according to the embodiment with reference to fig. 36, a description of contents overlapping with those described with reference to fig. 1 to 35 may be omitted.
The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120.
The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 may be disposed to be spaced apart from each other.
The package body 110 may include a body 113. The body 113 may be disposed between the first frame 111 and the second frame 112. The body 113 may perform a function as an electrode separation line. The main body 113 may also be referred to as an insulating member.
The body 113 may be disposed on the first frame 111. In addition, the body 113 may be disposed on the second frame 112.
The body 113 may provide an inclined surface disposed on the first frame 111 and the second frame 112. The cavity C may be disposed on the first and second frames 111 and 112 through the inclined surface of the body 113.
According to an embodiment, the package body 110 may be provided in a structure having the cavity C, or may be provided in a structure having a flat upper surface without the cavity C.
For example, the body 113 may be made of a material selected from the group consisting of polyphthalamide (PPA), polychlorinated terphenyl (PCT), liquid Crystal Polymer (LCP), polyamide 9T (PA 9T), silicone, epoxy Molding Compound (EMC), silicone Molding Compound (SMC), ceramic, photosensitive glass (PSG), sapphire (Al) 2 O 3 ) And the like. In addition, the body 113 may include a high refractive index filler, such as TiO 2 And SiO 2 。
The light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.
The first bonding part 121 may be disposed on a lower surface of the light emitting device 120. The second bonding portion 122 may be disposed on a lower surface of the light emitting device 120. The first and second bonding parts 121 and 122 may be disposed to be spaced apart from each other on the lower surface of the light emitting device 120.
The first coupling portion 121 may be disposed on the first frame 111. The second coupling portion 122 may be disposed on the second frame 112.
The first coupling part 121 may be disposed between the light emitting structure 123 and the first frame 111. The second coupling portion 122 may be disposed between the light emitting structure 123 and the second frame 112.
Meanwhile, the light emitting device package according to the embodiment may include a first opening TH1 and a second opening TH2. The first frame 111 may include a first opening TH1. The second frame 112 may include a second opening TH2.
The first opening TH1 may be provided at the first frame 111. The first opening TH1 may be provided by passing through the first frame 111. The first opening TH1 may be provided by passing through the upper and lower surfaces of the first frame 111 in the first direction.
The first opening TH1 may be disposed under the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding portion 121 of the light emitting device 120. The first opening TH1 may be disposed to overlap the first bonding portion 121 of the light emitting device 120 in the first direction from the upper surface of the first frame 111 toward the lower surface thereof.
The second opening TH2 may be provided at the second frame 112. The second opening TH2 may be provided by passing through the second frame 112. The second opening TH2 may be provided by passing through the upper and lower surfaces of the second frame 113 in the first direction.
The second opening TH2 may be disposed under the second bonding part 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120. The second opening TH2 may be disposed to overlap the second coupling portion 122 of the light emitting device 120 in the first direction from the upper surface of the second frame 112 toward the lower surface thereof.
The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other. The first and second openings TH1 and TH2 may be disposed to be spaced apart from each other under the lower surface of the light emitting device 120.
According to an embodiment, the width W1 of the upper region of the first opening TH1 may be set to be greater than the width of the first coupling portion 121. In addition, the width of the upper region of the second opening TH2 may be set to be greater than the size of the second coupling portion 122.
The light emitting device package according to the embodiment may include a first conductor 221 and a second conductor 222. In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 may be disposed to be spaced apart from the second conductive layer 322.
The first conductor 221 may be disposed under the first coupling portion 121. The first conductor 221 may be electrically connected to the first coupling portion 121. The first conductor 221 may be arranged to overlap the first coupling portion 121 in the first direction.
The first conductor 221 may be disposed at the first opening TH 1. The first conductor 221 may be disposed between the first bonding portion 121 and the first conductive layer 321. The first conductor 221 may be electrically connected to the first bonding portion 121 and the first conductive layer 321.
A lower surface of the first conductor 221 may be disposed lower than an upper surface of the first opening TH 1. The lower surface of the first conductor 221 may be disposed lower than the upper surface of the first conductive layer 321.
The first conductor 221 may be disposed on the first opening TH 1. In addition, the first conductor 221 may be arranged to extend from the first bonding portion 121 to the inside of the first opening TH 1.
In addition, the second conductor 222 may be disposed under the second junction 122. The second conductor 222 may be electrically connected to the second junction 122. The second conductor 222 may be arranged to overlap 122 the second junction in the first direction.
The second conductor 222 may be disposed at the second opening TH 2. The second conductor 222 may be disposed between the second junction 122 and the second conductive layer 322. The second conductor 222 may be electrically connected to the second junction 122 and the second conductive layer 322.
A lower surface of the second conductor 222 may be disposed lower than an upper surface of the second opening TH 2. The lower surface of the second conductor 222 may be disposed lower than the upper surface of the second conductive layer 322.
The second conductor 222 may be disposed on the second opening TH 2. In addition, the second conductor 222 may be arranged to extend from the second coupling portion 122 to the inside of the second opening TH 2.
According to an embodiment, the first conductive layer 321 may be disposed on the lower surface and the side surface of the first conductor 221. The first conductive layer 321 may be disposed in direct contact with the lower surface and the side surface of the first conductor 221.
The first conductive layer 321 may be disposed at the first opening TH 1. The first conductive layer 321 may be disposed under the first bonding part 121. The width of the first conductive layer 321 may be set to be greater than the width of the first bonding part 121.
As described above, according to the light emitting device package of the embodiment, the electrical connection between the first conductive layer 321 and the first bonding part 121 may be more stably provided by the first conductor 221.
In addition, according to an embodiment, the second conductive layer 322 may be disposed at the lower surface and the side surface of the second conductor 222. The second conductive layer 322 may be disposed in direct contact with the lower surface and the side surface of the second conductor 222.
The second conductive layer 322 may be disposed at the second opening TH 2. The second conductive layer 322 may be disposed under the second bonding part 122. The width of the second conductive layer 322 may be set to be greater than the width of the second bonding part 122.
As described above, according to the light emitting device package of the embodiment, the second conductor 222 may more stably provide the electrical connection between the second conductive layer 322 and the second bonding part 122.
As an example, the first and second conductors 221 and 222 may be stably coupled to the first and second coupling parts 121 and 122, respectively, via separate coupling materials. In addition, side surfaces and lower surfaces of the first and second conductors 221 and 222 may be in contact with the first and second conductive layers 321 and 322, respectively.
Therefore, an area in which the first and second conductive layers 321 and 322 contact the first and second conductors 221 and 222, respectively, may be further increased as compared to a case in which the first and second conductive layers 321 and 322 are directly contacted to the first and second junctions 121 and 122, respectively.
Accordingly, power can be stably supplied from the first and second conductive layers 321 and 322 to the first and second bonding portions 121 and 122 via the first and second conductors 221 and 222.
The first and second conductive layers 321 and 322 may include at least one material selected from the group consisting of Ag, au and Pt, sn, cu, etc., or an alloy thereof. However, the present invention is not limited thereto, and a material capable of ensuring a conductive function may be used for the first conductive layer 321 and the second conductive layer 322.
As an example, the first conductive layer 321 and the second conductive layer 322 may be formed by using a conductive paste. The conductive paste may include solder paste, silver paste, etc., and may be composed of multiple layers composed of different materials or multiple layers or a single layer composed of alloys thereof. As an example, the first conductive layer 321 and the second conductive layer 322 may include a SAC (Sn-Ag-Cu) material.
In addition, the light emitting device package according to the embodiment may include a recess R.
The adhesive 130 may be disposed at the recess R. The adhesive 130 may be disposed between the light emitting device 120 and the body 113. The adhesive 130 may be disposed between the first adhesive part 121 and the reflector 117. The adhesive 130 may be disposed between the second adhesive part 122 and the reflector 117. For example, the adhesive 130 may be disposed to contact a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.
The adhesive 130 may provide a stable fixing force between the light emitting device 120 and the body 113. As an example, the adhesive 130 may be disposed in direct contact with the upper surface of the body 113. In addition, the adhesive 130 may be disposed in direct contact with the lower surface of the light emitting device 120.
As an example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a mixed material including the epoxy-based material and the silicone-based material. In addition, the adhesive 130 may reflect light emitted from the light emitting device 120. When the adhesive 130 includes a reflective function, the adhesive 130 may include white silicone. When the adhesive 130 includes a reflective function, the adhesive 130 may be formed of, for example, tiO 2 Silicone, etc.
According to an embodiment, the depth of the recess R may be set to be smaller than the depth of the first opening TH1 or the depth of the second opening TH 2.
The depth of the recess R may be determined in consideration of the adhesion of the adhesive 130. Further, the depth of the recess R may be determined by considering the stable strength of the body 113 and/or the absence of the occurrence of cracks in the light emitting device package 1100 due to heat emitted from the light emitting device 120.
The recess R may provide an appropriate space in which an underfill process may be performed at a lower portion of the light emitting device 120. The recess R may be disposed at a first depth or more so that the adhesive 130 may be sufficiently disposed between the lower surface of the light emitting device 120 and the upper surface of the body 113. In addition, the recess R may be provided at a second depth or less to provide stable strength of the body 113.
The depth and width W3 of the recess R may affect the formation position and fixing force of the adhesive 130. The depth and width W3 of the recess R may be determined such that the fixing force may be sufficiently provided by the adhesive 130 disposed between the body 113 and the light emitting device 120.
As an example, the depth of the recess R may be set to several tens of micrometers. The depth of the recess R may be set to 40 to 60 micrometers.
Further, the width W3 of the recess R may be set to several hundred micrometers. The width W3 of the recess R may be set to 140 to 160 micrometers. As an example, the width W3 of the recess R may be set to 150 μm.
The first and second bonding portions 121 and 122 of the light emitting device 120 may be sealed from the outside by an adhesive 130 disposed at the recess R. The adhesive 130 may be disposed under the light emitting device 120 in a closed loop shape.
The adhesive 130 may be provided in a closed loop shape along the shape of the recess R, as described above with reference to fig. 16 and 17. The recess R may be provided as a closed loop having a rectangular shape or a closed loop having a circular or elliptical shape.
The depth of the first opening TH1 may be set to correspond to the thickness of the body 113. The depth of the first opening TH1 may be set to a thickness capable of maintaining stable strength of the body 113.
As an example, the depth of the first opening TH1 may be set to several hundred micrometers. The depth of the first opening TH1 may be set to 180 to 220 micrometers. As an example, the depth of the first opening TH1 may be set to 200 micrometers.
As an example, a thickness obtained by subtracting the depth of the recess R from the depth of the first opening TH1 may be selected to be at least 100 micrometers or more. This is in view of the thickness of the implantation process that can provide a crack-free body 113.
According to an embodiment, the depth of the first opening TH1 may be set to be two to ten times the depth of the recess R. As an example, when the depth of the first opening TH1 is set to 200 micrometers, the depth of the recess R may be set to 20 to 100 micrometers.
In addition, the light emitting device package according to the embodiment may include the molding part 140.
The molding part 140 may be disposed on the light emitting device 120. The molding part 140 may be disposed on the body 113. The molding part 140 may be disposed at the cavity C provided by the reflector 117.
The molding part 140 may include an insulating material. In addition, the molding part 140 may include a wavelength conversion part configured to be incident light emitted from the light emitting device 120 and configured to provide wavelength-converted light. As an example, the molding part 140 may include a phosphor, a quantum dot, and the like.
In addition, the light emitting device package according to the embodiment may include a first lower recess R11 and a second lower recess R12. The first and second lower recesses R11 and R12 may be arranged to be spaced apart from each other.
The first lower recess R11 may be provided at a lower surface of the first frame 111. The first lower concave portion R11 may be provided to be concave in a direction from the lower surface to the upper surface of the first frame 111. The lower recess R11 may be disposed to be spaced apart from the first opening TH 1.
The first lower concave portion R11 may be provided to have a width of several micrometers to several tens of micrometers. The resin portion may be provided at the first lower recess R11. The resin portion filled in the first lower concave portion R11 may be provided to have, for example, the same material as the main body 113.
However, the present invention is not limited thereto, and the resin portion may be provided to have a material selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion may be provided to be selected from materials having low surface tension with respect to the first and second conductive layers 321 and 322.
As an example, the resin portion filled in the first undercut R11 may be provided in a process of forming the first frame 111, the second frame 112, and the body 113 through an injection process or the like.
The resin portion filled in the first lower recess R11 may be disposed at the periphery of the lower surface area of the first frame 111 where the first opening TH1 is provided. The lower surface of the first frame 111 provided with the first opening TH1 may be arranged to be separated from the lower surface of the first frame 111 formed in the periphery of the first frame 111 in the shape of an island.
Therefore, when the resin portion is disposed to have a material having poor adhesion and poor wettability with the first and second conductive layers 321 and 322 or a material having low surface tension between the resin portion and the first and second conductive layers 321 and 322, the first conductive layer 321 provided at the first opening TH1 may be prevented from being separated from the first opening TH1 and from being spread on the resin portion filled in the first lower recess R11 or the main body 113.
This is based on the fact that the adhesion relationship between the first conductive layer 321 and the resin portion and the main body 113 or the wettability and surface tension between the resin portion and the first conductive layer 321 and the second conductive layer 322, etc. are not good. That is, the material constituting the first conductive layer 321 may be selected to have good adhesion characteristics with the first frame 111. In addition, a material constituting the first conductive layer 321 may be selected to have poor adhesion characteristics with the resin portion and the main body 113.
Accordingly, since the first conductive layer 321 overflows from the first opening TH1 toward the region where the resin or the body 113 is disposed, the overflow or the extension to the outside of the region where the resin or the body 113 is disposed is prevented, so that the first conductive layer 321 can be stably disposed at the region where the first opening TH1 is disposed.
When the first conductive layer 321 disposed at the first opening TH1 overflows, the first conductive layer 321 may be prevented from extending to the outside of the region in which the first lower recess R11 of the resin portion or the main body 113 is disposed. In addition, the first conductive layer 321 may be stably connected to the lower surface of the first bonding portion 121 in the first opening TH 1.
Therefore, when the light emitting device package is mounted on a circuit board, it is possible to prevent the problems of the first conductive layer 321 and the second conductive layer 322 contacting each other and short-circuiting, and to easily control the amounts of the first conductive layer 321 and the second conductive layer 322 in the process of disposing the first conductive layer 321 and the second conductive layer 322.
In addition, a second lower recess R12 may be provided at a lower surface of the second frame 112. The second lower recess R12 may be provided to be recessed in the upper surface direction from the lower surface of the second frame 112. The second lower recess R12 may be disposed to be spaced apart from the second opening TH 2.
The second depressed portion R12 may be provided to have a width of several micrometers to several tens of micrometers. The resin portion may be provided at the second depressed portion R12. The resin portion filled in the second depressed portion R12 may be provided to have, for example, the same material as the main body 113.
However, the present invention is not limited thereto, and the resin portion may be provided to have a material selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion may be provided to be selected from materials having low surface tension with respect to the first and second conductive layers 321 and 322.
As an example, the resin portion filled in the second depressed portion R12 may be provided in a process of forming the first frame 111, the second frame 112, and the body 113 by an injection process or the like.
The resin portion filled in the second depressed portion R12 may be disposed at the periphery of the lower surface area of the second frame 112 where the second opening TH2 is provided. The lower surface of the second frame 112 provided with the second opening TH2 may be arranged to be separated from the lower surface of the second frame 112 formed at the periphery of the second frame 112 in the shape of an island.
Therefore, when the resin portion is disposed to have a material having poor adhesion and poor wettability with the first and second conductive layers 321 and 322 or a material having low surface tension between the resin portion and the first and second conductive layers, it is possible to prevent the second conductive layer 322 provided at the second opening TH2 from being separated from the second opening TH2 and from being spread on the resin portion filled in the second lower recess R12 or the main body 113.
This is based on the fact that the adhesion relationship between the second conductive layer 322 and the resin portion and the main body 113 or the wettability and surface tension between the resin portion and the first and second conductive layers 321 and 322, etc. are not good. That is, the material constituting the second conductive layer 322 may be selected to have good adhesion characteristics with the second frame 112. In addition, a material constituting the second conductive layer 322 may be selected to have poor adhesion characteristics with the resin portion and the main body 113.
Accordingly, since the second conductive layer 322 overflows from the second opening TH2 toward the region where the resin or the body 113 is disposed, the overflow or the extension to the outside of the region where the resin portion or the body 113 is disposed is prevented, so that the second conductive layer 322 can be stably disposed at the region where the second opening TH2 is disposed.
Therefore, when the second conductive layer 322 disposed at the second opening TH2 overflows, the second conductive layer 322 may be prevented from extending to the outside of the region in which the resin portion or the second lower recess R12 of the main body 113 is disposed. In addition, the second conductive layer 322 may be stably connected to the lower surface of the second bonding part 122 in the second opening TH 2.
Therefore, when the light emitting device package is mounted on a circuit board, it is possible to prevent the problems of the first conductive layer 321 and the second conductive layer 322 contacting each other and short-circuiting, and to easily control the amounts of the first conductive layer 321 and the second conductive layer 322 in the process of disposing the first conductive layer 321 and the second conductive layer 322.
Meanwhile, in the process of forming the first and second openings TH1 and TH2, the light emitting device package shown in fig. 36 illustrates a case where etching is performed in the directions of the upper and lower surfaces of the first and second frames 111 and 112, respectively.
The shapes of the first and second openings TH1 and TH2 may be set to a snowman shape as each etching process progresses in the direction of the upper and lower surfaces of the first and second frames 111 and 112.
The widths of the first and second openings TH1 and TH2 may gradually increase from the lower region toward the middle region, and then decrease again. Further, the width may gradually increase again from the middle region where the width is reduced toward the upper region, and then decrease again.
The first and second openings TH1 and TH2 may include a first region disposed on an upper surface of each of the first and second frames 111 and 112 and a second region disposed on a lower surface of each of the first and second frames 111 and 112. The width of the upper surface of the first region may be set to be smaller than the width of the lower surface of the second region.
In addition, the width of the lower region of the first opening TH1 may be set wider than the width of the upper region of the first opening TH 1. The first opening TH1 may include a first region provided with a predetermined depth at an upper region with a predetermined width and a second region provided in an inclined shape toward a lower region. In addition, the first region and the second region may be formed in a circular shape in which the side surface has a curvature, and a width of an upper surface of the first region may be narrower than a width of the second region. A portion where the first region and the second region contact each other may have a curved portion.
Further, according to an embodiment, an etching process for forming the first and second openings TH1 and TH2 is completed, and then a plating process of the first and second frames 111 and 112 may be performed. Accordingly, the first and second plated layers 111a and 112a may be formed on the surfaces of the first and second frames 111 and 112, respectively.
First and second plating layers 111a and 112a may be disposed on upper and lower surfaces of the first and second frames 111 and 112, respectively. In addition, the first and second plating layers 111a and 112a may be disposed in a boundary region contacting the first and second openings TH1 and TH 2.
As an example, the first and second frames 111 and 112 may be provided to have a Cu layer as a base support member. In addition, the first and second plating layers 111a and 112a may include at least one of a Ni layer, an Ag layer, and the like.
When the first and second plated layers 111a and 112a include the Ni layer, since a variation in thermal expansion with respect to the Ni layer is small, even when the size or arrangement position of the package body is changed by thermal expansion, the position of the light emitting device arranged at the upper region can be stably fixed by the Ni layer. When the first and second plating layers 111a and 112a include the Ag layer, the Ag layer may effectively reflect light emitted from the light emitting device disposed at the upper portion, and may increase light intensity.
According to the embodiment, when the sizes of the first and second coupling parts 121 and 122 of the light emitting device 120 may be set small to improve light extraction efficiency, the width of the upper region of the first opening TH1 may be set to be greater than the width of the first coupling part 121. In addition, the width of the upper region of the second opening TH2 may be set to be greater than or equal to the width of the second coupling portion 122.
Further, the width W1 of the upper region of the first opening TH1 may be set to be less than or equal to the width W2 of the lower region of the first opening TH 1. Further, the width of the upper region of the second opening TH2 may be set to be less than or equal to the width of the lower region of the second opening TH 2.
As an example, the width of the upper region of the first opening TH1 may be set to several tens to several hundreds of micrometers. Further, the width of the lower region of the first opening TH1 may be set to be several tens to several hundreds of micrometers larger than the width of the upper region of the first opening TH 1.
In addition, the width of the upper region of the second opening TH2 may be set to several tens to several hundreds of micrometers. Further, the width of the lower region of the second opening TH2 may be set to be several tens to several hundreds of micrometers larger than the width of the upper region of the second opening TH 2.
In addition, the width of the lower region of the first opening TH1 may be set to be wider than the width of the upper region of the first opening TH 1. The first opening TH1 may be provided at a predetermined depth to have a predetermined width in the upper region, and may be provided in an inclined shape toward the lower region.
In addition, the width of the lower region of the second opening TH2 may be set wider than the width of the upper region of the second opening TH 2. The second opening TH2 may be provided to have a predetermined width in an upper region at a predetermined depth, and may be provided in an inclined shape toward a lower region.
For example, the first openings TH1 may be provided in a slanted shape in which the width is gradually reduced from the lower region toward the upper region. Further, the second opening TH2 may be provided in an inclined shape in which the width is gradually reduced from the lower region toward the upper region.
However, the present invention is not limited thereto, and the inclined surface between the upper and lower regions of the first and second openings TH1 and TH2 may have a plurality of inclined surfaces having different slopes, and the inclined surfaces may be arranged to have a curvature.
In the light emitting device package according to the embodiment, when the areas of the first and second bonding parts 121 and 122 are small, the first and second bonding parts 121 and 122 may be disposed in the first and second openings TH1 and TH 1.
At this time, since the areas of the first and second bonding portions 121 and 122 are small, it is difficult to secure adhesion between the first and second conductive layers 321 and 322 and the first and second bonding portions 121 and 121. Accordingly, the light emitting device package according to the embodiment may include the first and second conductors 221 and 222 to further secure the areas where the first and second conductive layers 321 and 322 are in contact with the first and second bonding parts 121 and 122.
According to an embodiment, the first conductive layer 321 may be electrically connected to the first bonding part 121, and the second conductive layer 322 may be electrically connected to the second bonding part 122. As an example, external power may be supplied to the first and second conductive layers 321 and 322, and thus, the light emitting device 120 may be driven.
Meanwhile, according to the light emitting device package 1100 of the embodiment, the adhesive 130 disposed at the recess R may be disposed between the lower surface of the light emitting device 120 and the upper surface of the package body 110. The adhesive 130 may be disposed in a closed loop shape at the peripheries of the first and second coupling parts 121 and 122 when viewed from the upward direction of the light emitting device 120. Further, the adhesive 130 may be disposed at the peripheries of the first and second openings TH1 and TH2 in a closed loop shape when viewed from the upward direction of the light emitting device 120.
The adhesive 130 may perform a function of stably fixing the light emitting device 120 in the package body 110. In addition, the adhesive 130 may be disposed at the peripheries of the first and second bonding parts 121 and 122 contacting the side surfaces of the first and second bonding parts 121 and 122. The adhesive 130 may be disposed such that the first and second openings TH1 and TH2 are isolated from an outer region in which the molding part 140 is disposed, when viewed from an upward direction of the light emitting device 120.
The adhesive 130 may prevent the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 from being separated from the closed loop of the recess R and flowing in the outward direction of the light emitting device 120.
In the case where the first and second conductive layers 321 and 322 move in the outward direction of the light emitting device 120 when viewed from the upward direction of the light emitting device 120, the first and second conductive layers 321 and 322 may be diffused along the side surface of the light emitting device 120. As described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the first and second conductive type semiconductor layers of the light emitting device 120 may be electrically shorted. In addition, as described above, when the first and second conductive layers 321 and 322 move in the side surface of the light emitting device 120, the light extraction efficiency of the light emitting device 120 may be reduced.
However, according to the embodiment, since the inside and the outside are isolated from each other based on the region in which the recess R is provided by the adhesive 130, the first and second conductive layers 321 and 322 can be prevented from being separated from the region in which the recess R is provided and moving in the outward direction.
Therefore, according to the light emitting device package of the embodiment, it is possible to prevent the first and second conductive layers 321 and 322 from moving to the side surfaces of the light emitting device 120 and to prevent the light emitting device 120 from being electrically shorted, thereby improving light extraction efficiency.
According to the embodiment of the present invention, the adhesive 130 disposed at the recess R may move along the lower surface of the light emitting device 120 to the first region A1 located under the light emitting device 120, and may be disposed to contact the four side surfaces of the first and second bonding parts 121 and 122. Accordingly, the first and second coupling parts 121 and 122 may be arranged to be surrounded by the adhesive 130, and the first and second openings TH1 and TH2 may be sealed by the adhesive 130.
As described above, since the first and second openings TH1 and TH2 may be sealed by the adhesive 130, the first and second conductive layers 321 and 322 disposed at the first and second openings TH1 and TH2 may be prevented from moving on the upper surface of the body 113.
Meanwhile, when the amount of the adhesive 130 is not sufficiently set, the first region A1 positioned under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be set as an empty space. Accordingly, the first conductive layer 321 and the second conductive layer 322 may be diffused through the gap of the adhesive 130 and move to the empty space of the first area A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to the embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting a property having poor adhesion to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 10% or less based on the area of the upper surface of the substrate 124 in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency.
In addition, according to an embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124 in order to provide a stable bonding force to the light emitting device to be mounted.
According to the light emitting device package of the embodiment, the sum of the areas of the first and second bonding parts 121 and 122 may be set to 0.7% or more based on the area of the upper surface of the substrate 124, so that the first and second conductors 221 and 222 can be stably arranged.
As described above, since the areas of the first and second bonding parts 121 and 122 are set to be small, the amount of light transmitted to the lower surface of the light emitting device 120 can be increased. In addition, an adhesive 130 having good reflection and heat dissipation characteristics may be provided under the light emitting device 120. Accordingly, light emitted under the light emitting device 120 is reflected at the adhesive 130 and is effectively emitted toward an upward direction of the light emitting device package, and thus light extraction efficiency may be improved.
Meanwhile, the light emitting device package according to the above-described embodiment may be supplied and mounted on a submount, a circuit board, or the like.
However, when the conventional light emitting device package is mounted on a submount, a circuit board, or the like, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the lead frame and the light emitting device disposed in the light emitting device package, so that the stability of electrical connection and physical coupling may be impaired.
However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the bonding portion of the light emitting device according to the embodiment may be provided with driving power through the conductive layer disposed in the opening. In addition, the melting point of the conductive layer disposed in the opening may be selected to have a higher value than a general bonding material.
Therefore, since the light emitting device package according to the embodiment does not cause the re-melting phenomenon even when the light emitting device package 100 is bonded to the host substrate through the reflow process, the electrical connection and the physical bonding force may not be deteriorated.
In addition, according to the light emitting device package and the method of manufacturing the light emitting device package of the embodiment, the package body 110 does not need to be exposed to a high temperature in the manufacturing process of the light emitting device. Therefore, according to the embodiment, the package body 110 can be prevented from being damaged or discolored due to exposure to high temperature.
Therefore, the selection range of the material forming the body 113 can be widened. According to the embodiment, the body 113 may be provided by using not only an expensive material such as ceramic but also a relatively inexpensive resin material.
For example, the body 113 may include at least one material selected from the group consisting of a polyphthalamide (PPA) resin, a polycyclohexylenedimethylene terephthalate (PCT) resin, an Epoxy Molding Compound (EMC) resin, and a Silicone Molding Compound (SMC) resin.
Next, a light emitting device package according to an embodiment of the present invention will be described with reference to fig. 37.
In describing the light emitting device package according to the embodiment of the present invention with reference to fig. 37, a description overlapping with that described with reference to fig. 1 to 36 may be omitted.
Compared to the semiconductor device package described with reference to fig. 36, the semiconductor device package according to the embodiment, as shown in fig. 37, may further include an upper recess R10.
The upper recess R10 may be provided at an upper surface of the body 113. The upper recess R10 may be disposed at the first region A1 located under the lower surface of the light emitting device 120. An upper recess R10 may be provided to be recessed in the first direction from the upper surface of the body 113 toward the lower surface thereof.
The recess R10 may be disposed under the light emitting device 120 and may be disposed between the first and second bonding portions 121 and 122. The upper recess R10 may be provided to extend under the light emitting device 120 in the minor axis direction of the light emitting device 120.
As described with reference to fig. 36, when the amount of the adhesive 130 provided to the recess R is insufficient, the first region A1 located under the light emitting device 120 may not be filled with the adhesive 130, and a partial region thereof may be provided as an empty space. Accordingly, the first and second conductive layers 321 and 322 may be diffused through the voids of the adhesive 130 and move to the empty spaces of the first region A1.
However, in selecting physical characteristics of the body 113 and physical characteristics of the first and second conductive layers 321 and 322 according to an embodiment, a distance that the conductive layers 321 and 322 spread from the upper surface of the body 113 may be limited by selecting properties having poor adhesiveness to each other. Accordingly, since a distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be controlled, the first conductive layer 321 and the second conductive layer 322 in the first area A1 can be prevented from being electrically shorted.
In addition, when the light emitting device package according to the embodiment includes the upper recess R10, the upper recess R10 may provide a function of further limiting the diffusion and movement of the first and second conductive layers 321 and 322 in the first region A1.
When the upper recess R10 is provided, a trap effect is generated in the upper recess R10 even when a portion of the first conductive layer 321 and the second conductive layer 322 is diffused to the upper portion of the body 113, restricting the flow of the first conductive layer 321 and the second conductive layer 322. The following phenomena occur: the first conductive layer 321 diffused through the first opening TH1 may not move in the downward direction of the upper recess R10 from the boundary surface of the recess region of the upper recess R10. In addition, the following phenomenon occurs: the second conductive layer 322 diffused through the second opening TH2 may not move in the downward direction of the upper recess R10 from the boundary surface of the recess region of the upper recess R10. This is interpreted as the flow of the first conductive layer 321 and the second conductive layer 322 is restricted at the boundary surface of the depression region of the upper concave portion R10 due to the influence of surface tension or the like.
Accordingly, since the distance that the first conductive layer 321 and the second conductive layer 322 move at the upper surface of the body 113 can be stably and reliably controlled, the first conductive layer 321 and the second conductive layer 322 can be prevented from being electrically shorted in the first region A1.
Meanwhile, in the light emitting device package described with reference to fig. 36, when viewed from the upward direction of the light emitting device 120, description is made based on a case where the light emitting device 120 is disposed to be larger than the region formed by the outer boundary surface of the recess R.
However, in the light emitting device package according to another embodiment, similarly to the light emitting device package described with reference to fig. 26, the outer side surface of the light emitting device 120 may be disposed to overlap the recess R when viewed from the upward direction of the light emitting device 120.
As described above, the outer surface of the light emitting device 120 may be disposed on the region of the recess R, so that the lower surface of the light emitting device 120 and the upper surface of the body 113 may be fixed and sealed by the adhesive 130 disposed in the recess R.
Meanwhile, in the light emitting device package according to the above-described embodiment, when the adhesive layer 130 is disposed adjacent to the side surface of the light emitting device 120, the adhesive layer 130 may be diffused to a partial region along the side surface of the light emitting device 120.
Further, although the light emitting device package according to the above-described embodiment is described based on the case where the recess R formed at the package body is provided as a closed loop, the recess R may not necessarily be formed as a closed loop. In the case where the recesses R are disposed to be spaced apart from each other by a predetermined distance without forming a shape of a closed ring, when the recesses R are spaced apart by a small distance such that the adhesive layers disposed in the recesses R are connected to each other, the light emitting device and the package body may be stably sealed by the adhesive, and thus a desired effect can be sufficiently achieved. Further, since the adhesive has a diffusibility, the adhesive layer disposed at the recesses R spaced apart from each other may be diffused from the lower surface of the light emitting device and the upper surface of the package body, and thus the space between the lower surface of the light emitting device and the upper surface of the package body can be effectively sealed.
Meanwhile, as an example, a flip chip light emitting device may be provided in the light emitting device package described above.
As an example, the flip chip light emitting device may be provided as a transmission type flip chip light emitting device that emits light in six surface directions, or may be provided as a reflection type flip chip light emitting device that emits light in five surface directions.
The reflective type flip chip light emitting device in which light is emitted in five surface directions may have a structure in which a reflective layer is arranged in a direction close to the package body 110. For example, the reflective flip chip light emitting device may include an insulating reflective layer (e.g., a distributed bragg reflector, an omni-directional reflector, etc.) and/or a conductive reflective layer (e.g., ag, al, ni, au, etc.) between the first and second bonding parts and the light emitting structure.
Further, the flip chip light emitting device may include a first bonding part electrically connected to the first conductive type semiconductor layer, and a second bonding part electrically connected to the second conductive type semiconductor layer, and may be provided as a general horizontal light emitting device in which light is emitted between the first bonding part and the second bonding part.
Further, the flip chip light emitting device in which light is emitted in six surface directions may be provided as a transmission type flip chip light emitting device including a reflection region in which a reflection layer is disposed between first and second bonding portions and a transmission region that emits light.
Here, the transmissive type flip chip light emitting device means a device that emits light to six surfaces of an upper surface, four side surfaces, and a lower surface. In addition, the reflective type flip chip light emitting device means a device emitting light to an upper surface and four side surfaces.
Meanwhile, the light emitting device package according to the embodiment, as described above with reference to fig. 1 to 37, may be applied to a light source apparatus.
Further, the light source device may include a display device, an illumination device, a head lamp, and the like based on the industrial field.
As an example of the light source device, the display device includes a bottom cover, a reflection plate disposed on the bottom cover, a light emitting module emitting light and including a light emitting device, a light guide plate disposed in front of the reflection plate and guiding the light emitted from the light emitting module, an optical sheet including a prism sheet disposed in front of the light guide plate, a display panel disposed in front of the optical sheet, an image signal output circuit connected to the display panel and supplying an image signal to the display panel, and a color filter disposed in front of the display panel. Here, the bottom cover, the reflection plate, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit. In addition, the display apparatus may have a structure in which light emitting devices each emitting red, green, and blue light are arranged without including a color filter.
As another example of the light source device, the head lamp may include a light emitting module including a light emitting device package disposed on a substrate, a reflector for reflecting light emitted from the light emitting module in a predetermined direction, for example, a forward direction, a lens for refracting the light forward, and a shade for blocking or reflecting a portion of the light reflected by the reflector and directed to the lens to form a light distribution pattern desired by a designer.
The lighting device as another light source device may include a cover, a light source module, a heat sink, a power supply, an inner case, and a socket. In addition, the light source device according to the embodiment may further include at least one of a member and a holder. The light source module may include the light emitting device package according to the embodiment.
The features, structures, effects, and the like described in the above embodiments are included in at least one embodiment, and are not limited to only one embodiment. Further, with respect to the features, structures, effects, and the like described in the embodiments, other embodiments may be implemented by a combination or modification by a person having ordinary skill in the art. Therefore, contents related to the combination and modification should be construed as being included in the scope of the embodiments.
While preferred embodiments have been set forth and illustrated in the foregoing description, the invention should not be construed as being limited thereto. It will be apparent to those skilled in the art that various variations and modifications not illustrated in the drawings may be made without departing from the inherent features of the embodiments of the invention. For example, each component specifically illustrated in the embodiments may be executed by modification. In addition, it is apparent that differences associated with modifications and variations are included in the scope of the embodiments set forth in the appended claims of the present invention.

Claims (14)

1. A light emitting device package, comprising:
a package body;
a light emitting device disposed on the package body; and
an adhesive disposed between the package body and the light emitting device,
wherein the package body includes: a first opening and a second opening passing through the package body on an upper surface of the package body; and a recess provided to be recessed from an upper surface of the package body in a direction of a lower surface of the package body,
Wherein the light emitting device includes a first bonding portion and a second bonding portion, the first bonding portion being disposed on the first opening, the second bonding portion being disposed on the second opening, and
wherein the adhesive is provided at the recess,
wherein the recess is provided at a periphery of the first opening and a periphery of the second opening in a closed loop shape including an inner closed loop and an outer closed loop facing each other,
wherein a size of the light emitting device is larger than an inner area of the inner closed loop of the recess when viewed from an upward direction of the light emitting device, an
Wherein a profile connecting four side surfaces of the light emitting device overlaps with the recess when viewed from an upward direction of the light emitting device.
2. The light emitting device package as set forth in claim 1, wherein the adhesive is disposed at a periphery of the first and second bonding portions.
3. The light emitting device package of claim 1, comprising:
a first conductive layer disposed at the first opening and electrically connected to the first bonding portion; and
A second conductive layer disposed at the second opening and electrically connected to the second bonding portion.
4. The light emitting device package of claim 1, wherein the adhesive is disposed in direct contact with the upper surface of the package body and the lower surface of the light emitting device and surrounds and seals the perimeters of the first and second bonding portions.
5. The light emitting device package according to claim 1, wherein the first and second bonding portions comprise at least one material selected from the group consisting of Ti, al, in, ir, ta, pd, co, cr, mg, zn, ni, si, ge, ag alloy, au, hf, pt, ru, rh, sn, cu, znO, irOx, ruOx, niO, ruOx/ITO, ni/IrOx/Au, and Ni/IrOx/Au/ITO, or alloys thereof.
6. The light emitting device package of claim 3, wherein the first and second conductive layers comprise at least one material selected from the group consisting of Ag, au, pt, sn, cu, and SAC (Sn-Ag-Cu), or an alloy thereof.
7. The light emitting device package as set forth in claim 3, wherein the first and second conductive layers are spaced apart from each other.
8. The light emitting device package of claim 3, wherein the first conductive layer is disposed under the first bonding portion, and
wherein a width of an upper surface of the first conductive layer is smaller than a width of a lower surface of the first bonding portion.
9. The light emitting device package of claim 3, wherein the first conductive layer is in direct contact with a lower surface of the first bonding portion, and
wherein the first conductive layer is surrounded by the package body.
10. The light emitting device package as set forth in claim 1, wherein a width of the recess is smaller than a width of a lower portion of the first opening, and
wherein a width of the recess is smaller than a width of a lower portion of the second opening.
11. The light emitting device package as set forth in claim 1, wherein a width of an upper portion of the first opening is less than a width of a lower portion of the first opening.
12. The light emitting device package as set forth in claim 1, wherein a contour connecting four side surfaces of the light emitting device is disposed within the outer closed loop when viewed from an upward direction of the light emitting device.
13. The light emitting device package as set forth in claim 1, wherein the package body includes a cavity surrounding four side surfaces of the light emitting device.
14. The light emitting device package as set forth in claim 13, further comprising: a mold disposed in the cavity and on the light emitting device.
CN201810869572.1A 2017-08-02 2018-08-02 Light emitting device package Active CN109390449B (en)

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EP3439050A3 (en) 2019-02-27
JP7228871B2 (en) 2023-02-27
US20190044039A1 (en) 2019-02-07
TWI775911B (en) 2022-09-01
JP2019029673A (en) 2019-02-21
US10749089B2 (en) 2020-08-18
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EP3439050A2 (en) 2019-02-06
CN109390449A (en) 2019-02-26

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