CN109375472A - Expose the method when machine and substrate expose - Google Patents
Expose the method when machine and substrate expose Download PDFInfo
- Publication number
- CN109375472A CN109375472A CN201811240142.XA CN201811240142A CN109375472A CN 109375472 A CN109375472 A CN 109375472A CN 201811240142 A CN201811240142 A CN 201811240142A CN 109375472 A CN109375472 A CN 109375472A
- Authority
- CN
- China
- Prior art keywords
- substrate
- filming apparatus
- exposure
- board
- control unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
Abstract
The present invention provides a kind of exposure method when machine and substrate expose.The exposure side machine includes board, multiple filming apparatus on the board and the control unit being all connected with the board and multiple filming apparatus, when substrate, which enters, exposes side machine, the position of filming apparatus acquisition substrate, and according to the position of substrate and preset exposure position calculating position offset, then the position compensation value is fed back into control unit, control unit controls board according to position compensation value and adjusts the position of substrate to preset exposure position, therefore the exposure of the invention precision when exposure can be improved in machine, ensure to remove the remaining photoresist in edge of substrate, and it does not need operating personnel and enters the position for exposing manual adjustment substrate inside the machine of side, substrate fragmentation and damage is avoided to expose the risk of side machine, furthermore, filming apparatus is mounted on the top of board, personnel's touching will not occur causes filming apparatus to damage or deviate.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of expose the method when machine and substrate expose.
Background technique
Thin film transistor (TFT) (Thin Film Transistor, TFT) is current liquid crystal display device (Liquid Crystal
Display, LCD) and active matrix drive type organic electroluminescence display device and method of manufacturing same (Active Matrix Organic Light-
Emitting Diode, AMOLED) in main driving element, the display performance of direct relation panel display apparatus.
Liquid crystal display on existing market is largely backlight liquid crystal display comprising liquid crystal display panel and back
Optical mode group (backlight module).The working principle of liquid crystal display panel is in thin-film transistor array base-plate (Thin
Film Transistor Array Substrate, TFT Array Substrate) and colored filter (Color
Filter, CF) liquid crystal molecule is poured between substrate, and apply pixel voltage and common voltage respectively on two plate bases, pass through
The direction of rotation of the electric field controls liquid crystal molecule formed between pixel voltage and common voltage transmits the light of backlight module
Picture is generated out.
In the manufacturing process of LCD display panel and OLED display panel, lithographic process can be often used, in lithographic process
In, the edge of substrate often has photoresist residual, therefore can be exposed by exposing side machine to the edge of substrate,
To remove remaining photoresist (i.e. side washing).The existing board for exposing side machine has alignment sensor (alignment sensor),
After substrate is sent into from upstream exposes side machine, the cylinder for exposing side machine starts actuation, and the probe of alignment sensor is then pushed to base
Edges of boards edge perceives substrate position by the feedback of alignment sensor, is then normally carried out side washing in certain range, but positions
Sensor can only feedback position, compensation and adjusting without will do it position cause side washing precision not can guarantee.And substrate position
It sets once being more than the sensing range of alignment sensor, board can not identify that substrate leads to direct delay machine, operation people is needed after delay machine
Member enters inside board, and substrate is pulled by the way of artificial, resets substrate, and substrate is easy to break during reset processing
It is broken, and since probe uses more loose spring to be connected with cylinder, alignment sensor is easy in sheet reset treatment process, is made
Industry personnel touch the position deviation for leading to alignment sensor, and then cause side washing abnormal.
Summary of the invention
The purpose of the present invention is to provide a kind of exposure side machine, it can be improved and expose side precision, it is ensured that remove the surrounding of substrate
The remaining photoresist of edge.
The object of the invention is also to provide a kind of substrates to expose side method, can be improved and exposes side precision, it is ensured that removal substrate
The remaining photoresist in edge.
To achieve the above object, the present invention provides a kind of exposure side machines, comprising: board, multiple on the board
Filming apparatus and the control unit being all connected with the board and multiple filming apparatus；
The board is for placing substrate；
The filming apparatus is for obtaining the position of substrate and according to preset exposure position calculating position offset；
Described control unit, which is used to control board according to position compensation value, adjusts the position of substrate to preset exposure position.
The filming apparatus has exposure coordinates corresponding with preset exposure position.
The substrate is equipped with alignment mark corresponding with exposure coordinates；The filming apparatus passes through exposure coordinates and contraposition
Label is aligned, and position compensation value is calculated.
The quantity of the filming apparatus is three, and the quantity of the alignment mark is three, and three filming apparatus are corresponding
Exposure coordinates are corresponded with three alignment marks respectively.
Described control unit control board, which passes through, rotates the position for adjusting substrate to preset exposure position.
The present invention also provides a kind of substrates to expose side method, includes the following steps:
Step S1, it provides and exposes side machine；The exposure side machine include: board, multiple filming apparatus on the board with
And the control unit being all connected with the board and multiple filming apparatus；
Step S2, substrate is placed on board, the filming apparatus obtains the position of substrate and according to preset exposure
Position calculating position offset；
Step S3, described control unit controls position to the preset exposure position that board adjusts substrate according to position compensation value
It sets.
The filming apparatus has exposure coordinates corresponding with preset exposure position.
The substrate is equipped with alignment mark corresponding with exposure coordinates；In the step S2, the filming apparatus passes through
Exposure coordinates are aligned with alignment mark, and position compensation value is calculated.
The quantity of the filming apparatus is three, and the quantity of the alignment mark is three, and three filming apparatus are corresponding
Exposure coordinates are corresponded with three alignment marks respectively.
In the step S3, described control unit controls position to the preset exposure position that board adjusts substrate by rotation
It sets.
Beneficial effects of the present invention: exposure side machine of the invention includes board, multiple filming apparatus on the board
And the control unit being all connected with the board and multiple filming apparatus, when substrate, which enters, exposes side machine, filming apparatus
The position of substrate is obtained, and according to the position of substrate and preset exposure position calculating position offset, is then mended the position
It repays value and feeds back to control unit, control unit controls position to the preset exposure position that board adjusts substrate according to position compensation value
It sets, therefore the exposure of the invention precision when exposure can be improved in machine, it is ensured that remove the remaining photoresist in edge of substrate, and not
It needs operating personnel to enter the position for exposing manual adjustment substrate inside the machine of side, substrate fragmentation and damage is avoided to expose the wind of side machine
Danger, in addition, filming apparatus is mounted on the top of board, personnel's touching will not occur causes filming apparatus to damage or deviate.This
The substrate of invention exposes side method, can be improved and exposes side precision, it is ensured that removes the remaining photoresist in edge of substrate.
Detailed description of the invention
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed
Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
In attached drawing,
Fig. 1 is the schematic top plan view of exposure side machine of the invention；
Fig. 2 is the schematic side view of exposure side machine of the invention；
Fig. 3 is the flow chart that substrate of the invention exposes side method.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example and its attached drawing are described in detail.
Fig. 1 and Fig. 2 is please referred to, the present invention provides a kind of exposure side machine, comprising: board 10, more on the board 10
A filming apparatus 20 and the control unit 30 being all connected with the board 10 and multiple filming apparatus 20；
The board 10 is for placing substrate 40；
The filming apparatus 20 is for obtaining the position of substrate 40 and according to preset exposure position calculating position offset；
Described control unit 30, which is used to control board 10 according to position compensation value, adjusts the position of substrate 40 to preset exposure
Optical position.
It should be noted that the present invention exposes side by the way that multiple filming apparatus 20 are arranged on board 10, when substrate 40 enters
When machine, filming apparatus 20 obtains the position of substrate 40, and calculates position according to the position of substrate 40 and preset exposure position
Offset is set, the position compensation value is then fed back into control unit 30, control unit 30 controls board according to position compensation value
10 adjust the position of substrates 40 to preset exposure position, therefore the exposure of the invention precision when exposure can be improved in machine, it is ensured that go
Except the remaining photoresist in the edge of substrate, and does not need operating personnel and enter the position for exposing manual adjustment substrate 40 inside the machine of side
It sets, 40 fragmentation of substrate and damage is avoided to expose the risk of side machine.In addition, filming apparatus 20 is mounted on the top of board 10, also not
Will appear personnel's touching causes filming apparatus 20 to damage or deviate.
Specifically, the filming apparatus 20 has exposure coordinates corresponding with preset exposure position.
Further, the substrate 40 is equipped with alignment mark corresponding with exposure coordinates, and the filming apparatus 20 passes through
Exposure coordinates are aligned with alignment mark, and position compensation value is calculated.
Specifically, the exposure side machine aligns filming apparatus 20 with substrate 40 by the way of 3 points of contrapositions, that is, clap
The quantity for taking the photograph device 20 is three, and the quantity of the alignment mark of substrate 40 is similarly three, three corresponding exposures of filming apparatus 20
Light coordinate is corresponded with three alignment marks respectively.
Further, two in three alignment marks of the substrate 40 are located at the long side of substrate 40, a remaining position
In the short side of substrate 40.
Specifically, described control unit 30 controls position to the preset exposure position that board 10 adjusts substrate 40 by rotation
It sets.
Referring to Fig. 3, being based on above-mentioned exposure side machine, the present invention also provides a kind of substrates to expose side method, includes the following steps:
Step S1, it provides and exposes side machine；The side machine that exposes includes: board 10, multiple shootings dress on the board 10
The control unit 30 setting 20 and being all connected with the board 10 and multiple filming apparatus 20；
Step S2, substrate 40 is placed on board 10, the filming apparatus 20 obtains the position of substrate 40 and according to pre-
If exposure position calculating position offset；
Step S3, described control unit 30 controls board 10 according to position compensation value and adjusts the position of substrate 40 to preset
Exposure position.
It should be noted that filming apparatus 20 obtains the position of substrate 40, and root when substrate 40 enters and exposes side machine
Position and preset exposure position calculating position offset according to substrate 40, then feed back to control unit for the position compensation value
30, control unit 30 controls board 10 according to position compensation value and adjusts the position of substrate 40 to preset exposure position, therefore this
The exposure of invention precision when exposure can be improved in machine, it is ensured that remove the remaining photoresist in edge of substrate, and do not need operation
Personnel enter the position for exposing manual adjustment substrate 40 inside the machine of side, and 40 fragmentation of substrate and damage is avoided to expose the risk of side machine.This
Outside, filming apparatus 20 is mounted on the top of board 10, and personnel's touching will not occur causes filming apparatus 20 to damage or deviate.
Specifically, the filming apparatus 20 has exposure coordinates corresponding with preset exposure position.
Further, the substrate 40 is equipped with alignment mark corresponding with exposure coordinates, in the step S2, the bat
It takes the photograph device 20 to be aligned by exposure coordinates and alignment mark, and position compensation value is calculated.
Specifically, the exposure side machine aligns filming apparatus 20 with substrate 40 by the way of 3 points of contrapositions, that is, clap
The quantity for taking the photograph device 20 is three, and the quantity of the alignment mark of substrate 40 is similarly three, three corresponding exposures of filming apparatus 20
Light coordinate is corresponded with three alignment marks respectively.
Further, two in three alignment marks of the substrate 40 are located at the long side of substrate 40, a remaining position
In the short side of substrate 40.
Specifically, described control unit 30 controls the position that board 10 adjusts substrate 40 by rotation in the step S3
To preset exposure position.
In conclusion exposure side machine of the invention include board, multiple filming apparatus on the board and with institute
The control unit that board and multiple filming apparatus are all connected with is stated, when substrate, which enters, exposes side machine, filming apparatus obtains substrate
Position then the position compensation value is fed back and according to the position of substrate and preset exposure position calculating position offset
To control unit, control unit controls board according to position compensation value and adjusts the position of substrate to preset exposure position, therefore
The exposure of the invention precision when exposure can be improved in machine, it is ensured that remove the remaining photoresist in edge of substrate, and do not need to make
Industry personnel enter the position for exposing manual adjustment substrate inside the machine of side, and substrate fragmentation and damage is avoided to expose the risk of side machine, in addition,
Filming apparatus is mounted on the top of board, and personnel's touching will not occur causes filming apparatus to damage or deviate.Base of the invention
Plate exposes side method, can be improved and exposes side precision, it is ensured that removes the remaining photoresist in edge of substrate.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention
Protection scope.
Claims (10)
1. a kind of exposure side machine characterized by comprising board (10), the multiple filming apparatus being set on the board (10)
(20) and with the board (10) and multiple filming apparatus (20) control unit (30) being all connected with；
The board (10) is for placing substrate (40)；
The filming apparatus (20) is for obtaining the position of substrate (40) and according to preset exposure position calculating position offset；
Described control unit (30), which is used to control board (10) according to position compensation value, adjusts the position of substrate (40) to preset
Exposure position.
2. exposing side machine as described in claim 1, which is characterized in that the filming apparatus (20) has and preset exposure position
Corresponding exposure coordinates.
3. exposing side machine as claimed in claim 2, which is characterized in that it is corresponding with exposure coordinates right that the substrate (40) is equipped with
Position label；The filming apparatus (20) is aligned by exposure coordinates and alignment mark, and position compensation value is calculated.
4. exposing side machine as claimed in claim 3, which is characterized in that the quantity of the filming apparatus (20) is three, described right
The quantity of position label is three, and the corresponding exposure coordinates of three filming apparatus (20) are corresponded with three alignment marks respectively.
5. exposing side machine as described in claim 1, which is characterized in that described control unit (30) control board (10) passes through rotation
The position of substrate (40) is adjusted to preset exposure position.
6. a kind of substrate exposes side method, which comprises the steps of:
Step S1, it provides and exposes side machine；The side machine that exposes includes: board (10), the multiple shootings being set on the board (10) dress
The control unit (30) setting (20) and being all connected with the board (10) and multiple filming apparatus (20)；
Step S2, substrate (40) is placed on board (10), the filming apparatus (20) obtains the position of substrate (40) and root
According to preset exposure position calculating position offset；
Step S3, described control unit (30) controls board (10) according to position compensation value and adjusts the position of substrate (40) to default
Exposure position.
7. substrate as claimed in claim 6 exposes side method, which is characterized in that the filming apparatus (20) has and preset exposure
The corresponding exposure coordinates of optical position.
8. substrate as claimed in claim 7 exposes side method, which is characterized in that the substrate (40) is equipped with and exposure coordinates pair
The alignment mark answered；In the step S2, the filming apparatus (20) is aligned by exposure coordinates and alignment mark, and is counted
Calculation obtains position compensation value.
9. substrate as claimed in claim 8 exposes side method, which is characterized in that the quantity of the filming apparatus (20) is three,
The quantity of the alignment mark be three, the corresponding exposure coordinates of three filming apparatus (20) respectively with three alignment marks one by one
It is corresponding.
10. substrate as claimed in claim 6 exposes side method, which is characterized in that in the step S3, described control unit (30)
Control board (10), which passes through, rotates the position for adjusting substrate (40) to preset exposure position.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811240142.XA CN109375472A (en) | 2018-10-23 | 2018-10-23 | Expose the method when machine and substrate expose |
| PCT/CN2019/085582 WO2020082717A1 (en) | 2018-10-23 | 2019-05-05 | Edge exposure machine and substrate edge exposure method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811240142.XA CN109375472A (en) | 2018-10-23 | 2018-10-23 | Expose the method when machine and substrate expose |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109375472A true CN109375472A (en) | 2019-02-22 |
Family
ID=65401702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811240142.XA Pending CN109375472A (en) | 2018-10-23 | 2018-10-23 | Expose the method when machine and substrate expose |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109375472A (en) |
| WO (1) | WO2020082717A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020082717A1 (en) * | 2018-10-23 | 2020-04-30 | 武汉华星光电技术有限公司 | Edge exposure machine and substrate edge exposure method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1221209A (en) * | 1997-12-04 | 1999-06-30 | 日本电气株式会社 | Method of implementing electron beam lithography using uniquely positioned alignment marks and wafer with such alignment marks |
| JP2003107756A (en) * | 2001-09-27 | 2003-04-09 | Nec Toppan Circuit Solutions Toyama Inc | Automatic aligner and positioning method |
| CN1422395A (en) * | 2000-12-14 | 2003-06-04 | 皇家菲利浦电子有限公司 | Self-compensating mark arrangement for stepper alignment |
| JP2004356451A (en) * | 2003-05-30 | 2004-12-16 | Howa Mach Ltd | Method for aligning exposure mask and substrate |
| CN102841505A (en) * | 2011-06-22 | 2012-12-26 | 上海微电子装备有限公司 | Substrate-precise-positioning workpiece stage |
| CN203385993U (en) * | 2013-04-11 | 2014-01-08 | 常熟晶悦半导体设备有限公司 | Four-exposure-head optical exposure machine with automatic aligning system |
| CN105116571A (en) * | 2015-09-17 | 2015-12-02 | 京东方科技集团股份有限公司 | Substrate alignment detection and calibration device and method |
| CN105372941A (en) * | 2014-08-28 | 2016-03-02 | 上海微电子装备有限公司 | Multifunctional exposure machine capable of exposing glass substrate edge |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09153538A (en) * | 1995-11-30 | 1997-06-10 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JP2008060302A (en) * | 2006-08-31 | 2008-03-13 | Sokudo:Kk | Substrate treating device |
| CN109375472A (en) * | 2018-10-23 | 2019-02-22 | 武汉华星光电技术有限公司 | Expose the method when machine and substrate expose |
-
2018
- 2018-10-23 CN CN201811240142.XA patent/CN109375472A/en active Pending
-
2019
- 2019-05-05 WO PCT/CN2019/085582 patent/WO2020082717A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1221209A (en) * | 1997-12-04 | 1999-06-30 | 日本电气株式会社 | Method of implementing electron beam lithography using uniquely positioned alignment marks and wafer with such alignment marks |
| CN1422395A (en) * | 2000-12-14 | 2003-06-04 | 皇家菲利浦电子有限公司 | Self-compensating mark arrangement for stepper alignment |
| JP2003107756A (en) * | 2001-09-27 | 2003-04-09 | Nec Toppan Circuit Solutions Toyama Inc | Automatic aligner and positioning method |
| JP2004356451A (en) * | 2003-05-30 | 2004-12-16 | Howa Mach Ltd | Method for aligning exposure mask and substrate |
| CN102841505A (en) * | 2011-06-22 | 2012-12-26 | 上海微电子装备有限公司 | Substrate-precise-positioning workpiece stage |
| CN203385993U (en) * | 2013-04-11 | 2014-01-08 | 常熟晶悦半导体设备有限公司 | Four-exposure-head optical exposure machine with automatic aligning system |
| CN105372941A (en) * | 2014-08-28 | 2016-03-02 | 上海微电子装备有限公司 | Multifunctional exposure machine capable of exposing glass substrate edge |
| CN105116571A (en) * | 2015-09-17 | 2015-12-02 | 京东方科技集团股份有限公司 | Substrate alignment detection and calibration device and method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020082717A1 (en) * | 2018-10-23 | 2020-04-30 | 武汉华星光电技术有限公司 | Edge exposure machine and substrate edge exposure method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020082717A1 (en) | 2020-04-30 |
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190222 |
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