WO2020082717A1

WO2020082717A1 - Edge exposure machine and substrate edge exposure method

Info

Publication number: WO2020082717A1
Application number: PCT/CN2019/085582
Authority: WO
Inventors: 王威
Original assignee: 武汉华星光电技术有限公司
Priority date: 2018-10-23
Filing date: 2019-05-05
Publication date: 2020-04-30
Also published as: CN109375472A

Abstract

An edge exposure machine and a substrate edge exposure method. The edge exposure machine comprises a machine platform (10), a plurality of photographic apparatuses (20) disposed on the machine platform (10), and a control unit (30) connected to both the machine platform (10) and the plurality of photographic apparatuses (20); when the substrate (40) enters the edge exposure machine, the photographic apparatuses (20) acquire the position of the substrate (40), calculate a position compensation value on the basis of the position of the substrate (40) and a preset exposure position, and feed back the position compensation value to the control unit (30); and the control unit (30), on the basis of the position compensation value, controls the machine platform (10) to adjust the position of the substrate (40) to the preset exposure position; the edge exposure precision is thereby improved, ensuring that the residual photoresist on the four edges of the substrate (40) is removed without requiring the operator to enter inside the exposure machine to adjust the position of the substrate (40), preventing the risk of the substrate (40) breaking and the edge exposure machine being damaged; in addition, the photographic apparatuses (20) are mounted above the machine platform (10), and the photographic apparatuses (20) also will not be damaged or displaced by being touched by the operator.

Description

Edge exposure machine and substrate exposure method

Technical field

The invention relates to the technical field of display, in particular to an edge exposure machine and a substrate exposure method.

Background technique

Thin Film Transistor (TFT) is the current Liquid Crystal Display (LCD) and Active Matrix Organic Light-Emitting The main driving element in Diode, AMOLED) is directly related to the display performance of the flat panel display device.

Most of the liquid crystal displays on the existing market are backlight type liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is based on the thin film transistor array substrate (Thin Film Transistor Array Substrate, TFT Array Substrate) and the color filter (Color Filter, CF) is filled with liquid crystal molecules between the substrates, and pixel voltage and common voltage are applied to the two substrates respectively. The electric field formed between the pixel voltage and the common voltage controls the rotation direction of the liquid crystal molecules to change the backlight module ’s The light is transmitted out to produce the picture.

In the manufacturing process of LCD display panels and OLED display panels, a photolithography process is often used. In the photolithography process, there is often photoresist residue around the edges of the substrate, so the edges of the substrate are exposed by the edge exposure machine Exposure is performed to remove residual photoresist (ie, edge washing). The machine of the existing edge exposure machine has an alignment sensor (alignment sensor), after the substrate is fed into the edge exposure machine from the upstream, the cylinder of the edge exposure machine starts to move, and then the probe of the positioning sensor is pushed to the edge of the substrate, and the position of the substrate is sensed through the feedback of the positioning sensor, which is normal in a certain range Edge washing is performed, but the positioning sensor can only feed back the position without compensating and adjusting the position, resulting in no guarantee of edge washing accuracy. And once the position of the substrate exceeds the sensing range of the positioning sensor, the machine cannot recognize the substrate and cause a direct shutdown. After the shutdown, the operator needs to enter the machine and manually pull the substrate to reset the substrate. The substrate is easy to reset during the reset process Broken in the middle, and because the probe is connected with a loose spring and the cylinder, the positioning sensor is easy to be touched by the operator during the board reset process, which causes the position deviation of the positioning sensor, which leads to abnormal edge washing.

technical problem

The object of the present invention is to provide an edge-exposure machine, which can improve the accuracy of edge-exposure and ensure the removal of residual photoresist around the edges of the substrate.

The object of the present invention is also to provide a substrate edge exposure method, which can improve the edge exposure accuracy and ensure that the photoresist remaining on the periphery of the substrate is removed.

Technical solution

In order to achieve the above object, the present invention provides an edge exposure machine, including: a machine platform, a plurality of shooting devices provided on the machine platform, and a control unit connected to the machine platform and the plurality of shooting devices;

The machine is used for placing substrates;

The shooting device is used to obtain the position of the substrate and calculate the position compensation value according to the preset exposure position;

The control unit is used to control the machine to adjust the position of the substrate to a preset exposure position according to the position compensation value.

The shooting device has exposure coordinates corresponding to preset exposure positions.

An alignment mark corresponding to the exposure coordinates is provided on the substrate; the photographing device aligns the alignment mark with the exposure coordinates and calculates the position compensation value.

The number of the shooting devices is three, and the number of the alignment marks is three. The exposure coordinates corresponding to the three shooting devices correspond to the three alignment marks one-to-one.

The control unit controls the machine to adjust the position of the substrate to a preset exposure position by rotation.

The invention also provides a substrate edge exposure method, including the following steps:

Step S1: Provide an edge exposure machine; the edge exposure machine includes: a machine, a plurality of shooting devices provided on the machine, and a control unit connected to the machine and the plurality of shooting devices;

Step S2: Place the substrate on the machine table, the photographing device obtains the position of the substrate and calculates the position compensation value according to the preset exposure position;

Step S3: The control unit controls the machine to adjust the position of the substrate to a preset exposure position according to the position compensation value.

An alignment mark corresponding to the exposure coordinates is provided on the substrate; in step S2, the photographing device aligns the alignment mark with the exposure coordinates and calculates a position compensation value.

In the step S3, the control unit controls the machine to adjust the position of the substrate to a preset exposure position by rotation.

Beneficial effect

Beneficial effect of the present invention: The edge exposure machine of the present invention includes a machine, a plurality of shooting devices provided on the machine, and a control unit connected to the machine and the plurality of shooting devices. When the substrate enters the edge exposure When the camera is in operation, the shooting device obtains the position of the substrate, calculates the position compensation value according to the position of the substrate and the preset exposure position, and then feeds back the position compensation value to the control unit. The control unit controls the machine to adjust the position of the substrate according to the position compensation value. Position to the preset exposure position, so the edge exposure machine of the present invention can improve the edge exposure accuracy, ensure that the photoresist remaining around the edges of the substrate is removed, and the operator does not need to enter the edge exposure machine to manually adjust the position of the substrate to avoid There is a risk of chipping of the substrate and damage to the edge exposure machine. In addition, the camera is installed above the machine, and there will be no damage or deviation of the camera by human touch. The substrate edge exposure method of the invention can improve the edge exposure accuracy and ensure that the photoresist remaining around the edges of the substrate is removed.

BRIEF DESCRIPTION

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.

In the drawings,

Figure 1 is a schematic top view of the edge exposure machine of the present invention;

2 is a schematic side view of the edge exposure machine of the present invention;

FIG. 3 is a flowchart of the substrate edge exposure method of the present invention.

Embodiments of the invention

In order to further elaborate on the technical means adopted by the present invention and its effects, the following will be described in detail with reference to the preferred embodiments of the present invention and the accompanying drawings.

Please refer to FIG. 1 and FIG. 2, the present invention provides an edge exposure machine, including: a machine 10, a plurality of shooting devices 20 provided on the machine 10, and the machine 10 and the multiple shooting devices 20 Control unit 30 all connected;

The machine 10 is used to place the substrate 40;

The shooting device 20 is used to obtain the position of the substrate 40 and calculate the position compensation value according to the preset exposure position;

The control unit 30 is used to control the machine 10 to adjust the position of the substrate 40 to a preset exposure position according to the position compensation value.

It should be noted that in the present invention, by setting a plurality of imaging devices 20 on the machine 10, when the substrate 40 enters the edge exposure machine, the imaging device 20 obtains the position of the substrate 40, and according to the position of the substrate 40 and the preset exposure The position compensation value is calculated, and then the position compensation value is fed back to the control unit 30. The control unit 30 controls the machine 10 to adjust the position of the substrate 40 to the preset exposure position according to the position compensation value, so the edge exposure machine of the present invention can be improved The edge exposure accuracy ensures that the photoresist remaining on the edges of the substrate is removed, and the operator is not required to enter the edge exposure machine to manually adjust the position of the substrate 40, thereby avoiding the risk of chipping of the substrate 40 and damage to the edge exposure machine. In addition, the photographing device 20 is installed above the machine table 10, and there is no possibility that the photographing device 20 is damaged or deviated due to human touch.

Specifically, the photographing device 20 has exposure coordinates corresponding to preset exposure positions.

Further, the substrate 40 is provided with an alignment mark corresponding to the exposure coordinates. The photographing device 20 aligns the alignment mark with the exposure coordinates and calculates the position compensation value.

Specifically, the edge exposure machine uses a three-point alignment method to align the imaging device 20 with the substrate 40, that is, the number of the imaging device 20 is three, and the number of alignment marks of the substrate 40 is also three, three The exposure coordinates corresponding to the two shooting devices 20 correspond to the three alignment marks, respectively.

Further, two of the three alignment marks of the substrate 40 are located on the long side of the substrate 40, and the remaining one is located on the short side of the substrate 40.

Specifically, the control unit 30 controls the machine 10 to adjust the position of the substrate 40 to a preset exposure position by rotation.

Referring to FIG. 3, based on the above-mentioned edge exposure machine, the present invention also provides a substrate edge exposure method, including the following steps:

Step S1: Provide an edge exposure machine; the edge exposure machine includes: a machine 10, a plurality of shooting devices 20 provided on the machine 10, and a control connected to the machine 10 and the plurality of shooting devices 20 Unit 30;

Step S2: Place the substrate 40 on the machine table 10, the photographing device 20 obtains the position of the substrate 40 and calculates the position compensation value according to the preset exposure position;

Step S3. The control unit 30 controls the machine 10 to adjust the position of the substrate 40 to a preset exposure position according to the position compensation value.

It should be noted that when the substrate 40 enters the edge exposure machine, the shooting device 20 obtains the position of the substrate 40, calculates the position compensation value according to the position of the substrate 40 and the preset exposure position, and then feeds back the position compensation value to the control Unit 30, the control unit 30 controls the machine 10 to adjust the position of the substrate 40 to the preset exposure position according to the position compensation value, so the edge exposure machine of the present invention can improve the edge exposure accuracy and ensure that the photoresist remaining around the edges of the substrate is removed And, the operator is not required to enter the edge exposure machine to manually adjust the position of the substrate 40, so as to avoid the risk of chipping of the substrate 40 and damage to the edge exposure machine. In addition, the photographing device 20 is installed above the machine table 10, and there is no possibility that the photographing device 20 is damaged or deviated due to human touch.

Further, an alignment mark corresponding to the exposure coordinates is provided on the substrate 40. In step S2, the photographing device 20 performs alignment with the alignment mark through the exposure coordinates, and calculates a position compensation value.

Specifically, in step S3, the control unit 30 controls the machine 10 to adjust the position of the substrate 40 to a preset exposure position by rotation.

In summary, the edge exposure machine of the present invention includes a machine, a plurality of shooting devices provided on the machine, and a control unit connected to the machine and the plurality of shooting devices. When the substrate enters the edge exposure machine At the time, the shooting device obtains the position of the substrate, calculates the position compensation value according to the position of the substrate and the preset exposure position, and then feeds back the position compensation value to the control unit, and the control unit controls the machine to adjust the position of the substrate according to the position compensation value To the preset exposure position, so the edge exposure machine of the present invention can improve the edge exposure accuracy, ensure that the photoresist remaining around the edges of the substrate is removed, and the operator does not need to enter the edge exposure machine to manually adjust the position of the substrate to avoid the substrate Fragmentation and the risk of damage to the edge exposure machine. In addition, the camera is installed above the machine, and there will be no damage or deviation of the camera by human touch. The substrate edge exposure method of the invention can improve the edge exposure accuracy and ensure that the photoresist remaining around the edges of the substrate is removed.

As mentioned above, for those of ordinary skill in the art, various other corresponding changes and modifications can be made according to the technical solutions and technical concepts of the present invention, and all these changes and modifications should fall within the protection scope of the claims of the present invention .

Claims

An edge exposure machine includes: a machine platform, a plurality of shooting devices provided on the machine platform, and a control unit connected to the machine platform and the plurality of shooting devices;

The machine is used for placing substrates;

The shooting device is used to obtain the position of the substrate and calculate the position compensation value according to the preset exposure position;

The control unit is used to control the machine to adjust the position of the substrate to a preset exposure position according to the position compensation value.
The edge exposure machine according to claim 1, wherein the shooting device has an exposure coordinate corresponding to a preset exposure position.
The edge exposure machine according to claim 2, wherein the substrate is provided with an alignment mark corresponding to the exposure coordinates; the photographing device aligns the alignment mark with the exposure coordinates and calculates the position compensation value.
The edge exposure machine according to claim 3, wherein the number of the shooting devices is three, the number of the alignment marks is three, and the exposure coordinates corresponding to the three shooting devices are respectively one of the three alignment marks One correspondence.
The edge exposure machine according to claim 1, wherein the control unit controls the machine to adjust the position of the substrate to a preset exposure position by rotation.
A substrate exposure method includes the following steps:

Step S1: Provide an edge exposure machine; the edge exposure machine includes: a machine, a plurality of shooting devices provided on the machine, and a control unit connected to the machine and the plurality of shooting devices;

Step S2: Place the substrate on the machine table, the photographing device obtains the position of the substrate and calculates the position compensation value according to the preset exposure position;

Step S3: The control unit controls the machine to adjust the position of the substrate to a preset exposure position according to the position compensation value.
The substrate edge exposure method according to claim 6, wherein the photographing device has exposure coordinates corresponding to preset exposure positions.
The substrate edge exposure method according to claim 7, wherein the substrate is provided with an alignment mark corresponding to the exposure coordinates; in step S2, the photographing device performs alignment with the alignment mark through the exposure coordinates, And calculate the position compensation value.
The substrate edge exposure method according to claim 8, wherein the number of the shooting devices is three, the number of the alignment marks is three, and the exposure coordinates corresponding to the three shooting devices are respectively different from the three alignment marks One to one correspondence.
The substrate edge exposure method according to claim 6, wherein in the step S3, the control unit controls the machine to adjust the position of the substrate to a preset exposure position by rotation.