CN109346522A - A kind of semiconductor structure and forming method thereof - Google Patents
A kind of semiconductor structure and forming method thereof Download PDFInfo
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- CN109346522A CN109346522A CN201811387878.XA CN201811387878A CN109346522A CN 109346522 A CN109346522 A CN 109346522A CN 201811387878 A CN201811387878 A CN 201811387878A CN 109346522 A CN109346522 A CN 109346522A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
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- H—ELECTRICITY
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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Abstract
The present invention is suitable for technical field of semiconductor device, provides a kind of semiconductor structure and forming method thereof, semiconductor structure includes: substrate；Buffer layer is located at substrate surface；Channel layer, material are GaN crystal or InGaN crystal；Barrier layer, material are AlN crystal；Thick barrier layer, material InmAlnGa(1‑m‑n)N crystal, molar content 0.45 >=m >=0 of molar content 0.80 >=n >=0.15, the In component of Al component, thickness are not less than 10nm, are formed with gate electrode window in thick barrier layer, bottom is the thick barrier layer that channel layer or thickness are not more than 3nm；Thin barrier layer, material are the In of low Al componentxAlyGa(1‑x‑y)N crystal, thickness are about 0.5~5nm, and molar content 0.3 >=x >=0 of molar content 0.15 >=y >=0.01, the In component of Al component is located in gate electrode window；Gate electrode is located in gate electrode window, and side wall and bottom are contacted with thin barrier layer.The etching injury layer that groove profile grid side wall and bottom can be repaired when the thin potential barrier layer epitaxially grown of low Al component, reduces the interfacial state of gate medium, enhances gate reliability, improve process window and device yield.
Description
Technical field
The invention belongs to technical field of semiconductor device, a kind of semiconductor structure and forming method thereof is provided.
Background technique
With the development of modern weapons equipment and aerospace, nuclear energy, the communication technology, automotive electronics, Switching Power Supply, half-and-half
More stringent requirements are proposed for the performance of conductor device.As the Typical Representative of semiconductor material with wide forbidden band, GaN base material, which has, to be prohibited
Bandwidth is big, electronics saturation drift velocity is high, critical breakdown strength is high, thermal conductivity is high, stability is good, corrosion-resistant, anti-radiation etc.
Feature can be used for making high temperature, high frequency and high-power electronic device.In addition, GaN also has excellent characteristic electron, Ke Yihe
AlGaN forms the AlGaN/GaN heterojunction structure of modulation doping, which can obtain higher than 1500cm at room temperature2The electricity of/Vs
Transport factor, and up to 3 × 107The peak electron speed of cm/s and 2 × 107The saturated electrons speed of cm/s, and obtain than
The two higher two-dimensional electron gas densities of generation compound semiconductor heterostructure are known as being the ideal material for developing microwave power device
Material.Therefore, the microwave power device based on AlGaN/GaN hetero-junctions is in fields such as high-frequency, high-power wireless communication, radars
With extraordinary application prospect.
The main working parts of typical AlGaN/GaN HEMT device structure are at AlGaN/GaN heterojunction boundary
Two-dimensional electron gas (2DEG), because it is hardly by the effect of ionized impurity scattering, thus face concentration with higher and electronics
Mobility.Its working principle is to regulate and control the 2DEG density at heterojunction boundary by changing the size of gate voltage, to change
Become source-drain current.Y.Okamoto et al. reports the recessed grid-type AlGaN/GaN HFET with modulation field plate, and recessed gate technique makes
The threshold voltage of device increases to -1.7V from -4.2V, W.Saito et al. propose the enhanced AlGaN of recessed gate structure/
GaN HFET realizes the threshold voltage of+1V, and can obtain and lower compare conducting resistance by etching AlGaN potential barrier
4mΩ·cm2, pressure voltage 435V.But the etched recesses in AlGaN potential barrier, on the one hand exist to AlGaN potential barrier and damages
Wound, and it is etched after barrier layer surface defect it is more, influence device reliability, on the other hand to etching rearward recess in it is remaining
The thickness uniformity and coherence request of AlGaN potential barrier are very high, it is desirable that the thickness of residue about 3~5nm, to extension and etching work
The consistency and repeatability of skill propose harsh requirement.The factor of these two aspects causes groove grid-type GaN HEMT device to exist
The problems such as enhanced threshold value is relatively low, threshold value is unstable, reliability is poor, and etching technics is difficult to control, process window is narrow, finished product
Rate is not high, is unfavorable for large-scale production.
Summary of the invention
The purpose of the present invention aims to solve at least one of above-mentioned technological deficiency, and especially solution groove gate technique is right
The etching injury of caused AlGaN potential barrier and surface defect and etching technics window when AlGaN potential barrier etched recesses
It is narrow, it is difficult to the relevant issues such as large-scale production.
In order to achieve the above objectives, one aspect of the present invention proposes a kind of semiconductor structure, the semiconductor structure from bottom to up according to
Secondary includes: substrate；Buffer layer is located on the substrate surface；Channel layer, the channel layer materials are that GaN crystal or InGaN are brilliant
Body；Barrier layer, the barrier material are AlN crystal；Thick barrier layer, the thickness abarrier layer material is InmAlnGa(1-m-n)N is brilliant
Body, and molar content 0.45 >=m >=0 of molar content 0.80 >=n >=0.15, the In component of Al component, the thickness potential barrier thickness
Degree is not less than 10nm, is formed with gate electrode window in the thick barrier layer, the bottom of the gate electrode window is the channel layer
Or thickness is not more than the thick barrier layer of 3nm；Thin barrier layer, the thin barrier layer are the In of low Al componentxAlyGa(1-x-y)N crystal,
Thickness is about 0.5~5nm, and molar content 0.3 >=x >=0 of molar content 0.15 >=y >=0.01, the In component of Al component is located at
Side wall and the bottom of the concave grid groove are covered in the gate electrode window；Gate electrode, the gate electrode are located in gate electrode window, side
Wall and bottom are contacted with thin barrier layer.
In one embodiment of the invention, the semiconductor structure further include: be located at the gate electrode window two
The bottom of the source electrode window and drain electrode window of side, the source electrode window and the drain electrode window be the channel layer or
Thickness is not more than the thick barrier layer of 3nm；Thin barrier layer in the source electrode window and drain electrode window；It is located at institute
State the source electrode and drain electrode that in source electrode window and drain electrode window and side wall and bottom are contacted with thin barrier layer.
In one embodiment of the invention, the semiconductor structure further include: gate dielectric layer, the gate dielectric layer are located at
Between the thin barrier layer and the gate electrode.
In one embodiment of the invention, the thin barrier layer extends to table on the thick barrier layer of gate electrode window two sides
Face.
In one embodiment of the invention, the semiconductor structure further include: passivation layer, the passivation layer are located at source electricity
On thin barrier layer or thick barrier layer between pole and gate electrode, between drain electrode and gate electrode.
In one embodiment of the invention, the thin barrier layer is N-type conductive crystal.
In one embodiment of the invention, the buffer layer is AlN layers, the AlGaN layer of Al content gradually variational, AlN/
One of AlGaN lamination, AlGaN/GaN lamination or several combinations.
In one embodiment of the invention, part adjacent with channel layer in the buffer layer is resistive formation, the height
Resistance layer is one of GaN layer with high resistivity, AlN/GaN lamination, AlGaN/GaN lamination or several combinations.
In one embodiment of the invention, the gate dielectric layer is SiO2Single layer, Al2O3Single layer, Sc2O3Single layer, HfO2
Single layer, Ta2O5One of single layer, ZnO single layer, nitridation silicon single-layer, silicon oxynitride single layer or a variety of composite laminates.
In one embodiment of the invention, the passivation layer is SiN or AlN material.
On the other hand the embodiment of the present invention also proposed a kind of forming method of semiconductor structure, the shape of the semiconductor structure
Include the following steps: step S0 at method, substrate is provided；Step S1, successively epitaxial growth buffer, material over the substrate
For the channel layer of GaN crystal or InGaN crystal, the barrier layer that material is AlN crystal and thick barrier layer, the thickness barrier layer
Material is InmAlnGa(1-m-n)N crystal, and the molar content 0.45 of molar content 0.80 >=n >=0.15, the In component of Al component
>=m >=0, the thickness barrier layer thickness are not less than 10nm；Step S2, thick barrier layer is performed etching, be etched to channel layer or away from
In place of thick barrier layer of the channel layer no more than 3nm, gate electrode window is formed；Step S3, thin potential barrier is formed in gate electrode window
Layer, the thin barrier layer are the In of low Al componentxAlyGa(1-x-y)N crystal, thickness are about 0.5~5nm, and Al component mole contains
Measure 0.15 >=y >=0.01, molar content 0.3 >=x >=0 of In component；Step S4, it is formed on the thin barrier layer of gate electrode window
Gate electrode.
In one embodiment of the invention, after step s 3, before step S 4 further include: step S31, described
Gate dielectric layer is formed on thin barrier layer.
In one embodiment of the invention, in step s 2, it while etching thick barrier layer formation gate electrode window, carves
The partial region for losing gate electrode two sides forms source electrode window and drain electrode window, the bottom of source electrode window and drain electrode window
It is not more than the thick barrier layer of 3nm for channel layer or away from channel layer；In step s3, thin barrier layer is formed in gate electrode window
Meanwhile thin barrier layer is also formed in source electrode window and drain electrode window；In step s 4, before forming gate electrode or it
Afterwards, source electrode and drain electrode are respectively formed on the thin barrier layer in source electrode window and drain electrode window.
In one embodiment of the invention, the buffer layer is AlN layers, the AlGaN layer of Al content gradually variational, AlN/
One of AlGaN lamination, AlGaN/GaN lamination or several combinations.
In one embodiment of the invention, part adjacent with channel layer in the buffer layer is resistive formation, the height
Resistance layer is one of GaN layer with high resistivity, AlN/GaN lamination, AlGaN/GaN lamination or several combinations.
In one embodiment of the invention, the thin barrier layer is by metal-organic chemical vapor deposition equipment technology or atom
Layer deposition techniques are formed.
In one embodiment of the invention, the gate dielectric layer is SiO2Single layer, Al2O3Single layer, Sc2O3Single layer, HfO2
Single layer, Ta2O5One of single layer, ZnO single layer, nitridation silicon single-layer, silicon oxynitride single layer or a variety of composite laminates.
The thin barrier layer tool of GaN HEMT device in the embodiment of the present invention low Al component of epitaxial growth on thick barrier layer
It has the advantages that:
1, the GaN HEMT device of usual groove grid structure wants strict control to cause due to etching when carrying out slot grid etching
Material damage, and the technique controlling difficulty of the not damaged etching of GaN is big；It can be using the low thin barrier layer of Al component of epitaxial growth
The etching injury layer of grid groove sidewall and base material is repaired in outer delay, reduces the interface state density at grid interface, and it is reliable to improve device
Property.
2, the device of usual groove grid structure will retain the barrier layer of 3~5nm when carrying out slot grid etching, need accurate
Control etching depth, this proposes harsh requirement to the consistency of extension and etching technics and repeatability, leads to scale
The difficulty of production is big, can etch completely barrier layer by using the mode of the low thin barrier layer of Al component of epitaxial growth, can lack
Quarter was measured to channel layer, the barrier layer within 3nm can also be retained, this widens etching technics window significantly, and technique is easy
Control, it is easy to accomplish large-scale production；
3, the low thin barrier layer of Al component of epitaxial growth realizes GaN HEMT device, can pass through the thickness of the thin barrier layer of control
Grid-control ability is modulated, so that the size of adjusting threshold voltage, improves device performance.
Detailed description of the invention
Fig. 1 is the semiconductor structure schematic diagram provided in an embodiment of the present invention with gate electrode window；
Fig. 2 is the semiconductor provided in an embodiment of the present invention with gate electrode window, source electrode window and drain electrode window
Structural schematic diagram；
Fig. 3 is that gate electrode window provided in an embodiment of the present invention two sides extension has the semiconductor structure of thin barrier layer to illustrate
Figure；
Fig. 4 is provided in an embodiment of the present invention with gate electrode window, source electrode window and drain electrode window, and in grid electricity
Pole window two sides extension has the semiconductor structure schematic diagram of thin barrier layer；
Fig. 5 is the semiconductor structure schematic diagram provided in an embodiment of the present invention with dielectric layer；
Fig. 6 is provided in an embodiment of the present invention with gate electrode window, source electrode window and drain electrode window, and has and be situated between
The semiconductor structure schematic diagram of matter layer；
Fig. 7 is the flow chart of semiconductor forming method provided in an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.For convenience of explanation, the size for the different layer and region that zoomed in or out, so figure
Shown in size and ratio might not represent actual size, do not reflect the proportionate relationship of size yet.It should be appreciated that this place
The specific embodiment of description is only used to explain the present invention, is not intended to limit the present invention.In the description of the present invention, it needs to manage
Solution, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear",
The orientation or position of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " clockwise ", " counterclockwise "
Setting relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, rather than
The device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot
It is interpreted as limitation of the present invention.
As shown in Figure 1, being the diagrammatic cross-section of semiconductor structure provided in an embodiment of the present invention, the semiconductor structure is under
Supreme successively includes: substrate；Positioned at the buffer layer of upper surface of substrate；Channel layer, material are GaN crystal or InGaN crystal；Stop
Layer, material are AlN crystal；Thick barrier layer, material InmAlnGa(1-m-n)N crystal, and 0.80 >=n of molar content of Al component >=
Molar content 0.45 >=m >=0 of 0.15, In component, and n+m≤1, thick barrier layer thickness is not less than 10nm, in thick barrier layer shape
At there is gate electrode window, the bottom of gate electrode window is the thick barrier layer that channel layer or thickness are not more than 3nm；Thin barrier layer, material
Material is the In of low Al componentxAlyGa(1-x-y)N crystal, thickness are about 0.5~5nm, and 0.15 >=y of molar content of Al component >=
Molar content 0.3 >=x >=0 of 0.01, In component is located in gate electrode window, i.e., positioned at the side wall of gate electrode window and bottom；
Gate electrode, gate electrode are located in gate electrode window, and side wall and bottom are contacted with thin barrier layer.
In one embodiment of the invention, substrate can be Si, SiC, the sapphire crystal with a thickness of 300~1500 μm
One of or several combinations, or indium antimonide, lead telluride, indium arsenide, indium phosphide, GaAs or gallium antimonide etc. close
Metal-semiconductor or combinations thereof can also be the epitaxial wafer of one or more layers semiconductive thin film grown on a semiconductor substrate.It is excellent
Selection of land, the substrate in the present embodiment can be Si or SiC substrate.
It in one embodiment of the invention, is buffer layer with a thickness of 1~5 μm, cushioning layer material AlN on substrate
One of layer, the AlGaN layer of Al content gradually variational, AlN/AlGaN lamination, AlGaN/GaN lamination or several combinations.At this
In one preferred embodiment of invention, the part adjacent with channel layer is resistive formation in buffer layer, resistive formation with a thickness of 0.5~
3.5 μm, resistive formation can be the GaN layer with high resistivity, AlN/GaN lamination, one of AlGaN/GaN lamination or several
The combination of kind.Resistive formation effectively can block or reduce the current direction buffer layer of device, improve device performance, especially close
State electric leakage.
In one embodiment of the invention, channel layer is the GaN crystal or InGaN crystal of 200~300nm thickness.InGaN
With mobility more higher than GaN, the high frequency performance of device is more excellent, but when using InGaN as channel layer, the forbidden bandwidth of energy band
Narrower than GaN, the pressure-resistant performance of device can decline, meanwhile, the AlGaN compared with GaN, in InGaN and buffer layer and thick barrier layer
Differences between lattice constant become larger, be unfavorable for the high quality extension of semiconductor structure, therefore, in a preferred embodiment of the present invention
In, channel layer is GaN crystal.The Al of low Al componenttGa1-tN crystal (t≤0.1) can also be used as channel layer, at this time because of its energy
The difference very little of band structure and lattice constant and GaN can be considered actual GaN channel layer, also in protection scope of the present invention
Within.
In one embodiment of the invention, barrier layer is the AlN crystal of 0.5nm~2nm thickness, it is preferable that stops thickness
Degree is 1nm.The barrier layer AlN can effectively improve conduction band discontinuity and polarity effect at heterojunction boundary, improve
2DEG surface density；In addition, the barrier layer AlN greatly reduces the scattering of the alloy disorder from thick barrier layer, effectively improve
2DEG mobility.
In one embodiment of the invention, thick barrier layer with a thickness of 10~30nm, it is preferable that barrier layer thickness 15
~20nm.
Gate electrode window can use " photoetching+etching " technology and be formed on thick barrier layer, first with lithographic definition grid
Then electrode window through ray region is carried out using chloro reactive ion etching (RIE) or inductively coupled plasma etching (ICP etching)
Grid are groove etched, form gate electrode window.
In one embodiment of the invention, thin barrier layer can use metal-organic chemical vapor deposition equipment technology
(MOCVD) or technique for atomic layer deposition (ALD) is formed.MOCVD can generate the thin barrier layer of high quality with extension, utilize ALD skill
Art can also deposit to form thin barrier layer, and since the technological temperature of ALD is lower, the crystal quality of the thin barrier layer formed is not
Such as MOCVD technique, the post-depositional high-temperature annealing process of thin barrier layer can use to improve the crystal quality of thin barrier layer.In order to
Bring etching injury when repairing the formation of gate electrode window can be repaired before the formation of thin barrier layer using the high temperature anneal
Multiple damaging layer, annealing temperature is about 1000~1200 DEG C.Optionally, high-temperature annealing process carries out under the atmosphere containing chlorine, such as
Containing chlorine or hydrogen chloride gas, chlorine can etch nitride at high temperature, remove surface damage layer.Optionally, high annealing
Technique carries out under hydrogeneous atmosphere, and nitrogen atmosphere can promote the atomic migration on element nitride crystal surface, accelerates surface damage layer
It repairs.In a preferred embodiment of the invention, right in MOCVD furnace before forming thin barrier layer using MOCVD epitaxy
Semiconductor structure carries out in-situ high temperature annealing, repairs etching bring damaging layer.When in order to repair the formation of gate electrode window
Bring etching injury can also carry out wet-chemical treatment to semiconductor structure, such as utilize king before the formation of thin barrier layer
Aqueous corrosion removes damaging layer.
Gate electrode can be formed in gate electrode window using electron beam evaporation technique or magnetron sputtering technique, optionally
Gate electrode metal is Ni/Pt/Au/Ti.
It in one embodiment of the invention, further include source electrode and drain electrode, source electrode and electric leakage in semiconductor structure
Pole is located at the two sides of gate electrode, and bottom is contacted with thick barrier layer, as shown in Figure 1.In a preferred embodiment of the invention,
Gate electrode window, source electrode window and drain electrode window, source electrode window and drain electrode window are respectively formed on thick barrier layer
Mouth is located at the two sides of gate electrode window, and the bottom of gate electrode window, source electrode window and drain electrode window is channel layer
Or thickness be not more than 3nm thick barrier layer, correspondingly, in source electrode window and drain electrode window be equipped with thin barrier layer, it is thin
Barrier layer covers source electrode window, the side wall of drain electrode window and bottom, and source electrode and drain electrode are respectively arranged at source electricity
In the window of pole and in drain electrode window, and the side wall of source electrode, drain electrode and bottom are contacted with thin barrier layer, as shown in Figure 2.
Source electrode window and drain electrode window can be formed while preparing gate electrode window, without the additional processing step of increase.
Thin barrier layer in source electrode window and drain electrode window can also while preparing the thin barrier layer in gate electrode window shape
At without the additional processing step of increase.Source electrode and drain electrode can use electron beam evaporation technique or magnetron sputtering skill
Art deposited metal, again annealed formation Ohmic contact and obtain, optional source and drain metal be Ti/Al/Ni.Source electrode and drain electrode
In need metal and semiconductor contact is Ohmic contact, the Al component of thick barrier layer is higher, Ohmic contact formation process difficulty
It is bigger, so, compared with forming source/drain electrode directly on thick barrier layer, deposited metal has on the low thin barrier layer of Al component
Conducive to the production of source/drain electrode ohmic contact craft, the contact resistance and source-drain series resistance of device are reduced.
In another embodiment of the present invention, source electrode window and drain electrode window are not formed, but in thick barrier layer
There are also one layer of gallium nitride films for upper surface.Since aluminium constituent content is higher in thick barrier layer, it is unfavorable for source electrode and drain electrode
The formation of required Ohmic contact, therefore can surface passes through epitaxial growth one in situ on it after epitaxial growth thickness barrier layer
Layer is about the gallium nitride film of 1~10nm thickness, this is conducive to the formation of the Ohmic contact of source-drain electrode.
In yet another embodiment of the present invention, as shown in figure 3, thin barrier layer to be extended to the thickness of gate electrode window two sides
Barrier layer upper surface, when etching only forms gate electrode window (without forming source electrode window and drain electrode on thick barrier layer
Window) when, source electrode and drain electrode are set on the thin barrier layer extended.The bottom of source electrode and drain electrode connects with thin barrier layer
Touching, because Al constituent content is low in thin barrier layer, be conducive to the production of source and drain ohmic contact craft, reduce device contact resistance and
Source-drain series resistance.
In yet another embodiment of the present invention, when on thick barrier layer etching be respectively formed gate electrode window, source electrode
When window and drain electrode window, thin barrier layer extends to entire semiconductor structure upper surface, forms continuous thin barrier layer, including
There is thin barrier layer on thick barrier layer between gate electrode window and source electrode window, between gate electrode window and electric leakage window,
As shown in Figure 4.Without additional photoetching and masking process when continuous thin barrier layer formation, processing step can simplify.
In one embodiment of the invention, gate dielectric layer is equipped between thin barrier layer and gate electrode, such as Fig. 5 and Fig. 6
It is shown.Gate electrode window only is formd in gate electrode region etch in Fig. 5, and in Fig. 6 other than being formed with gate electrode window, also
Gate dielectric layer can be arranged between thin barrier layer and gate electrode under both situations in active electrode window and drain electrode window.
Gate dielectric layer is about 1~50nm thickness, material SiO2Single layer, Al2O3Single layer, Sc2O3Single layer, HfO2Single layer, Ta2O5Single layer,
ZnO single layer, nitridation silicon single-layer, one of silicon oxynitride single layer or a variety of composite laminates, wherein silicon nitride, silicon oxynitride can be with
For the film layer of standard stoichiometry ratio or deviation standard stoichiometry ratio.Gate dielectric layer can generally be formed using ALD deposition.It is logical
Setting gate dielectric layer is crossed, grid leak electricity can be reduced while guaranteeing that grid controls channel layer, to reduction device power consumption right and wrong
Chang Youyi's.
In one embodiment of the invention, the thick potential barrier between source electrode and gate electrode, between drain electrode and gate electrode
Layer or thin barrier layer are equipped with passivation layer.Passivation layer is the insulating materials that can be reduced barrier layer upper surface and move charge density,
Such as SiN or AlN material, passivation layer thickness are about 1~10nm.If thin barrier layer to be extended to the thick barrier layer of gate electrode two sides
On, then passivation layer is set on thin barrier layer, if the thin barrier layer of extension, passivation layer are not set on the thick barrier layer of gate electrode two sides
In on thick barrier layer.Passivation layer can be heavy by Plasma Enhanced Chemical Vapor Deposition (PECVD), metal-organic chemical vapor
Product technology or technique for atomic layer deposition are formed.
In one embodiment of the invention, thin barrier layer is the crystal with N-type conduction type, can be unintentional mix
In miscellaneous or that the low Al component of N-type is formed by adulteratingxAlyGa(1-x-y)N crystal.Thin barrier layer, can also either N-type is conductive
To be P-type conduction.When thin barrier layer is N-type conduction, gate electrode bottom of window can be etched to channel layer, can also retain
Thick barrier layer within 3nm, etching technics window are wide；When thin barrier layer is P-type conduction, the thick potential barrier of gate electrode bottom of window
Layer will retain 3~5nm, need to be accurately controlled etching depth, process window is narrow.Therefore, using the thin barrier layer of N-type conduction,
The process window of etching can be widened.
As shown in fig. 7, being method for forming semiconductor structure flow chart provided in an embodiment of the present invention, this method includes as follows
Step:
Step S0, substrate is provided, wherein substrate can be one of Si, SiC, sapphire crystal or several groups
It closes, or alloy semiconductors such as indium antimonide, lead telluride, indium arsenide, indium phosphide, GaAs or gallium antimonide or combinations thereof, also
It can be the epitaxial wafer of one or more layers semiconductive thin film grown on a semiconductor substrate.Preferably, the lining in the present embodiment
Bottom can be Si or SiC substrate.
Step S1, successively epitaxial growth buffer, material are GaN crystal or channel layer, the material of InGaN crystal on substrate
Material is the barrier layer of AlN crystal and thick barrier layer, thick abarrier layer material are InmAlnGa(1-m-n)N crystal, and Al component is rubbed
Molar content 0.45 >=m >=0 of your content 0.80 >=n >=0.15, In component, and m+n≤1, thick barrier layer thickness are not less than
10nm.Wherein, buffer layer thickness be 1~5 μm, material be AlN layers, the AlGaN layer of Al content gradually variational, AlN/AlGaN lamination,
One of AlGaN/GaN lamination or several combinations；Channel layer is with a thickness of 200~300nm；Thick barrier layer with a thickness of 10
~30nm.In a preferred embodiment of the invention, part adjacent with channel layer in buffer layer is resistive formation, high resistant thickness
Degree is 0.5~3.5 μm, resistive formation can for high resistivity GaN layer, AlN/GaN lamination, in AlGaN/GaN lamination
One or several kinds of combinations.Resistive formation effectively can block or reduce the current direction buffer layer of device, improve device
Can, especially OFF state is leaked electricity.
Step S2, thick barrier layer is performed etching, be etched to channel layer or away from channel layer no more than 3nm thick barrier layer it
Place forms gate electrode window.The step can use the realization of " photoetching+etching " technology: first with photoetching technique in thick potential barrier
It is defined on layer and forms gate electrode window area, it is then groove etched using chloro RIE or ICP etching progress grid, it is etched to channel
Layer is not more than in place of the thick barrier layer of 3nm away from channel layer, forms gate electrode window；
Step S3, thin barrier layer is formed in gate electrode window, thin barrier layer is the In of the low Al component of N-typexAlyGa(1-x-y)
N crystal, thickness are about 0.5~5nm, and 0.3 >=x of molar content of molar content 0.15 >=y >=0.01, the In component of Al component >=
0.Wherein, thin barrier layer covers side wall and the bottom of the gate electrode window, can be formed with MOCVD or ALD technique.MOCVD can
The thin barrier layer that high quality is generated with extension, can also deposit to form thin barrier layer using ALD technique, due to the process warm of ALD
Spend it is lower, therefore formed thin barrier layer crystal quality be not so good as MOCVD technique, can use the post-depositional high temperature of thin barrier layer
Annealing process improves the crystal quality of thin barrier layer.Bring etching injury when in order to repair the formation of gate electrode window, can be with
Before the formation of thin barrier layer, damaging layer is repaired using the high temperature anneal, annealing temperature is about 1000~1200 DEG C.It is optional
Ground, high-temperature annealing process carry out under the atmosphere containing chlorine, such as containing chlorine or hydrogen chloride gas, chlorine can etch at high temperature
Nitride removes surface damage layer.Optionally, high-temperature annealing process carries out under hydrogeneous atmosphere, and nitrogen atmosphere can promote to nitrogenize
The atomic migration of object plane of crystal accelerates the reparation of surface damage layer.In a preferred embodiment of the invention, it is utilizing
MOCVD epitaxy is formed before thin barrier layer, carries out in-situ high temperature annealing to semiconductor structure in MOCVD furnace, is repaired and is carved
Lose bring damaging layer.Bring etching injury when in order to repair the formation of gate electrode window, can also form it in thin barrier layer
Before, wet-chemical treatment is carried out to semiconductor structure, such as utilize chloroazotic acid erosion removal damaging layer.
Step S4, gate electrode is formed on the thin barrier layer of gate electrode window.Wherein, which can be steamed using electron beam
Hair technology or magnetron sputtering technique realize that optional gate electrode metal is Ni/Pt/Au/Ti.
In one embodiment of the invention, before gate electrode formation, source electrode and leakage are formed in the two sides of gate electrode
Electrode, wherein source electrode and drain electrode are contacted with thick barrier layer.Source/drain electrode needs to form Ohmic contact with barrier layer, can be with
Using electron beam evaporation technique or magnetron sputtering technique deposited metal, Ohmic contact, optional source and drain are formed using annealing
Metal is Ti/Al/Ni.
In one embodiment of the invention, in step s 2, thick barrier layer is being etched to form the same of gate electrode window
When, the partial region of gate electrode two sides is etched to form source electrode window and drain electrode window, source electrode window and drain electrode window
The bottom of mouth is channel layer or is not more than the thick barrier layer of 3nm away from channel layer；In step s3, it is formed in gate electrode window thin
While barrier layer, thin barrier layer is also formed in source electrode window and drain electrode window；In step s 4, gate electrode is being formed
Before or after, source electrode and drain electrode are respectively formed on the thin barrier layer in source electrode window and drain electrode window.Wherein,
Source electrode and drain electrode generally uses the metal different from gate electrode, can be formed before or after gate electrode formation.In this hair
In a bright preferred embodiment, it is initially formed source electrode and drain electrode, then forms gate electrode in gate electrode window again, in this way
Influence of the required high-temperature annealing process to gate electrode structure and performance when can be to avoid source/drain electrode formation.Source electrode window
It is formed while with drain electrode window with gate electrode window, the thin barrier layer in source electrode window and drain electrode window can also be
It is formed while preparing the thin barrier layer in gate electrode window, without additional processing step is increased, can simplify technique in this way.
In one embodiment provided by the invention, the method for forming semiconductor structure after step s 3, in step S4
Before further include: step S31, form gate dielectric layer on thin barrier layer, i.e., gate dielectric layer be located at thin barrier layer and gate electrode it
Between, gate dielectric layer SiO2Single layer, Al2O3Single layer, Sc2O3Single layer, HfO2Single layer, Ta2O5Single layer, ZnO single layer, nitridation silicon single-layer,
One of silicon oxynitride single layer or a variety of composite laminates, wherein silicon nitride, silicon oxynitride can for standard stoichiometry ratio or
Deviate the film layer of standard stoichiometry ratio.
In one embodiment of the invention, before gate electrode window in step s 2 is formed, the semiconductor structure
At method further include: step S11, form passivation layer in thick potential barrier layer surface, passivation layer is SiN or AlN material；In step S2
In, passivation layer and thick barrier layer are performed etching, channel layer or the thick barrier layer place away from channel layer no more than 3nm are etched to,
It forms gate electrode window to perform etching passivation layer in the partial region of gate electrode window two sides, is etched to thick barrier layer, grid
The etch areas of electrode window through ray two sides is used to form source electrode and drain electrode；Either in step s 2, to passivation layer and thick gesture
Barrier layer performs etching, and is etched to channel layer or the thick barrier layer place away from channel layer no more than 3nm, is respectively formed gate electrode window
Mouth, source electrode window and drain electrode window, source electrode window and drain electrode window are located at the two sides of gate electrode window.
GaN HEMT device in the embodiment of the present invention low thin barrier layer of Al component of extension on thick barrier layer has such as
It is lower the utility model has the advantages that
1, the GaN HEMT device of usual groove grid structure wants strict control to cause due to etching when carrying out slot grid etching
Material damage, and the technique controlling difficulty of the not damaged etching of GaN is big；It can be using the low thin barrier layer of Al component of epitaxial growth
The etching injury layer of grid groove sidewall and base material is repaired in outer delay, reduces the interface state density at grid interface, and it is reliable to improve device
Property.
2, the device of usual groove grid structure will retain the barrier layer of 3~5nm when carrying out slot grid etching, need accurate
Control etching depth, this proposes harsh requirement to the consistency of extension and etching technics and repeatability, leads to scale
The difficulty of production is big, can etch completely barrier layer by using the mode of the low thin barrier layer of Al component of epitaxial growth, can lack
Quarter was measured to channel layer, the barrier layer within 3nm can also be retained, this widens etching technics window significantly, and technique is easy
Control, it is easy to accomplish large-scale production；
3, the low thin barrier layer of Al component of epitaxial growth realizes GaN HEMT device, can pass through the thickness of the thin barrier layer of control
Grid-control ability is modulated, so that the size of adjusting threshold voltage, improves device performance.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (17)
1. a kind of semiconductor structure, which is characterized in that the semiconductor structure successively includes: from bottom to up
Substrate；
Buffer layer is located on the substrate surface；
Channel layer, the channel layer materials are GaN crystal or InGaN crystal；
Barrier layer, the barrier material are AlN crystal；
Thick barrier layer, the thickness abarrier layer material is InmAlnGa(1-m-n)N crystal, and 0.80 >=n of molar content of Al component >=
Molar content 0.45 >=m >=0 of 0.15, In component, the thickness barrier layer thickness are not less than 10nm, are formed in the thick barrier layer
There is gate electrode window, the bottom of the gate electrode window is the thick barrier layer that the channel layer or thickness are not more than 3nm；
Thin barrier layer, the thin barrier layer are the In of low Al componentxAlyGa(1-x-y)N crystal, thickness are about 0.5~5nm, Al group
Molar content 0.3 >=x >=0 for molar content 0.15 >=y >=0.01, the In component divided is located in the gate electrode window, covering
The side wall of gate electrode window and bottom；
Gate electrode, the gate electrode are located in gate electrode window, and side wall and bottom are contacted with thin barrier layer.
2. semiconductor structure as described in claim 1, which is characterized in that the semiconductor structure further include:
It is located at the source electrode window and drain electrode window of gate electrode window two sides, the source electrode window and the leakage
The bottom of electrode window through ray is the thick barrier layer that the channel layer or thickness are not more than 3nm；
Thin barrier layer in the source electrode window and drain electrode window；
Be located at source electrode that in the source electrode window and drain electrode window and side wall and bottom are contacted with thin barrier layer and
Drain electrode.
3. semiconductor structure as claimed in claim 1 or 2, which is characterized in that the semiconductor structure further include:
Gate dielectric layer, the gate dielectric layer is between the thin barrier layer and the gate electrode.
4. semiconductor structure as described in claim 1, which is characterized in that the thin barrier layer extends to gate electrode window two sides
Thick barrier layer upper surface.
5. the semiconductor structure as described in claim 1 or 4, which is characterized in that the semiconductor structure further include:
Passivation layer, thin barrier layer or thickness of the passivation layer between source electrode and gate electrode, between drain electrode and gate electrode
On barrier layer.
6. semiconductor structure as described in claim 1, which is characterized in that the thin barrier layer is N-type conductive crystal.
7. semiconductor structure as described in claim 1, which is characterized in that the buffer layer is AlN layers, Al content gradually variational
One of AlGaN layer, AlN/AlGaN lamination, AlGaN/GaN lamination or several combinations.
8. semiconductor structure as claimed in claim 1 or 2, which is characterized in that the part adjacent with channel layer in the buffer layer
For resistive formation, the resistive formation be one of GaN layer with high resistivity, AlN/GaN lamination, AlGaN/GaN lamination or
Several combination of person.
9. semiconductor structure as claimed in claim 3, which is characterized in that the gate dielectric layer is SiO2Single layer, Al2O3Single layer,
Sc2O3Single layer, HfO2Single layer, Ta2O5One of single layer, ZnO single layer, nitridation silicon single-layer, silicon oxynitride single layer are a variety of compound
Lamination.
10. semiconductor structure as claimed in claim 5, which is characterized in that the passivation layer is SiN or AlN material.
11. a kind of forming method of semiconductor structure, which is characterized in that the forming method of the semiconductor structure includes following step
It is rapid:
Step S0, substrate is provided；
Step S1, successively epitaxial growth buffer, material are GaN crystal or channel layer, the material of InGaN crystal over the substrate
Material is the barrier layer of AlN crystal and thick barrier layer, the thickness abarrier layer material are InmAlnGa(1-m-n)N crystal, and Al component
Molar content 0.80 >=n >=0.15, In component molar content 0.45 >=m >=0, it is described thickness barrier layer thickness be not less than
10nm；
Step S2, thick barrier layer is performed etching, is etched to channel layer or the thick barrier layer place away from channel layer no more than 3nm,
Form gate electrode window；
Step S3, thin barrier layer is formed in gate electrode window, the thin barrier layer is the In of low Al componentxAlyGa(1-x-y)N is brilliant
Body, thickness are about 0.5~5nm, molar content 0.3 >=x >=0 of molar content 0.15 >=y >=0.01, the In component of Al component；
Step S4, gate electrode is formed on the thin barrier layer of gate electrode window.
12. method for forming semiconductor structure as claimed in claim 11, which is characterized in that after step s 3, step S4 it
Before further include:
Step S31, gate dielectric layer is formed on the thin barrier layer.
13. method for forming semiconductor structure as claimed in claim 11, which is characterized in that in step s 2, etch thick barrier layer
While forming gate electrode window, the partial region of etching gate electrode two sides forms source electrode window and drain electrode window, source electricity
The bottom of pole window and drain electrode window is channel layer or is not more than the thick barrier layer of 3nm away from channel layer；
In step s3, while forming thin barrier layer in gate electrode window, in source electrode window and drain electrode window
Form thin barrier layer；
In step s 4, before or after forming gate electrode, on the thin barrier layer in source electrode window and drain electrode window
It is respectively formed source electrode and drain electrode.
14. method for forming semiconductor structure as claimed in claim 11, which is characterized in that the buffer layer is AlN layers, Al component
One of the AlGaN layer of gradual change, AlN/AlGaN lamination, AlGaN/GaN lamination or several combinations.
15. method for forming semiconductor structure as claimed in claim 11, which is characterized in that adjacent with channel layer in the buffer layer
Part be resistive formation, the resistive formation is GaN layer with high resistivity, AlN/GaN lamination, in AlGaN/GaN lamination
One or several kinds of combinations.
16. method for forming semiconductor structure as claimed in claim 11, which is characterized in that the thin barrier layer is by metallorganic
Chemical vapour deposition technique or technique for atomic layer deposition are formed.
17. method for forming semiconductor structure as claimed in claim 12, which is characterized in that the gate dielectric layer is SiO2Single layer,
Al2O3Single layer, Sc2O3Single layer, HfO2Single layer, Ta2O5One of single layer, ZnO single layer, nitridation silicon single-layer, silicon oxynitride single layer
Or a variety of composite laminates.
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| CN105932041A (en) * | 2016-05-06 | 2016-09-07 | 西安电子科技大学 | N-face GaN-based fin high electron mobility transistor and manufacturing method |
| CN107919386A (en) * | 2017-11-21 | 2018-04-17 | 中国科学院微电子研究所 | Strain regulation-based enhanced GaN-based FinFET structure |
| CN209447804U (en) * | 2018-11-21 | 2019-09-27 | 芜湖启迪半导体有限公司 | A kind of semiconductor structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021184299A1 (en) * | 2020-03-19 | 2021-09-23 | 苏州晶湛半导体有限公司 | Semiconductor structure and manufacturing method therefor |
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