CN109343160B - Micro-lens forming method based on electrowetting effect and liquid drop suction - Google Patents

Micro-lens forming method based on electrowetting effect and liquid drop suction Download PDF

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CN109343160B
CN109343160B CN201811289310.4A CN201811289310A CN109343160B CN 109343160 B CN109343160 B CN 109343160B CN 201811289310 A CN201811289310 A CN 201811289310A CN 109343160 B CN109343160 B CN 109343160B
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lens
layer
array structure
silicon wafer
doped silicon
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CN109343160A (en
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黎相孟
祝锡晶
崔学良
王建青
冯昕宇
赵韡
于瑞恩
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North University of China
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North University of China
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

The invention relates to a micro-lens manufacturing technology, in particular to a micro-lens forming method based on an electrowetting effect and liquid drop suction. The invention solves the problem that the traditional microlens manufacturing method can not manufacture the microlens with controllable numerical aperture. A micro-lens forming method based on electrowetting effect and droplet suction is realized by adopting the following steps: s1: selecting a thermal oxidation highly-doped silicon wafer; s2: forming a first nanocone array structure; s3: preparing a polydimethylsiloxane imprinting mold; s4: forming a second nanocone array structure; s5: coating a Teflon thin layer; s6: applying a photo-curable resin droplet; s7: the photocuring resin liquid drop is deformed into a liquid lens under the action of an electric field; s8: disconnecting the alternating current power supply; s9: accurately regulating and controlling the numerical aperture of the liquid lens; s10: irradiating the liquid lens; s11: the solid lens is peeled off. The invention is suitable for manufacturing the micro lens.

Description

Micro-lens forming method based on electrowetting effect and liquid drop suction
Technical Field
The invention relates to a micro-lens manufacturing technology, in particular to a micro-lens forming method based on an electrowetting effect and liquid drop suction.
Background
The micro lens is a commonly used micro optical element and is widely applied to the fields of optical communication, integrated imaging, solar cells, light emitting diode display and the like. Under the condition of the prior art, the manufacturing method of the micro lens mainly comprises a mechanical finish milling method, a photoetching thermal reflux method, a wet etching method, a laser etching method, a two-photon interference exposure method and the like. However, practice shows that the conventional microlens manufacturing method cannot manufacture microlenses with controllable numerical apertures due to the principle of the method, so that the application range of the microlenses is limited. Therefore, it is necessary to invent a novel microlens manufacturing method to solve the problem that the conventional microlens manufacturing method cannot manufacture a microlens with a controllable numerical aperture.
Disclosure of Invention
The invention provides a micro-lens forming method based on electrowetting effect and liquid drop suction, aiming at solving the problem that the existing micro-lens manufacturing method can not manufacture micro-lenses with controllable numerical apertures.
The invention is realized by adopting the following technical scheme:
a micro-lens forming method based on electrowetting effect and droplet suction is realized by adopting the following steps:
s1: selecting a thermal oxidation highly-doped silicon wafer, and pretreating the thermal oxidation highly-doped silicon wafer; then, coating the nano particles in the nano particle suspension on the surface of the thermal oxidation highly-doped silicon wafer by adopting a stepping blade coating method, thereby forming a single-layer nano particle film on the surface of the thermal oxidation highly-doped silicon wafer;
s2: drying the single-layer nano particle film at 200 ℃; then, with the single-layer nano particle film as a masking layer, carrying out submicron etching processing on the surface of the thermal oxidation highly-doped silicon wafer, thereby forming a first nanocone array structure on the surface of the thermal oxidation highly-doped silicon wafer;
s3: removing the single-layer nano particle film; then, pouring polydimethylsiloxane on the surface of the first nanocone array structure to prepare a polydimethylsiloxane imprinting mold;
s4: selecting a transparent conductive glass substrate, and coating a photocuring resin structure layer on the surface of the transparent conductive glass substrate; then, carrying out contact imprinting on the polydimethylsiloxane imprinting mould and the light-cured resin structure layer, thereby forming a second nanocone array structure on the surface of the light-cured resin structure layer;
s5: coating a Teflon thin layer on the surface of the second nanocone array structure by adopting a spin-coating method;
s6: applying a photo-curing resin liquid drop on the surface of the second nano-cone array structure coated with the Teflon thin layer by adopting a first digital micro-injector;
s7: selecting an alternating current power supply and an electrode, and respectively connecting two ends of the alternating current power supply with the electrode and the conductive surface of the transparent conductive glass substrate; then, inserting an electrode into the photocuring resin liquid drop, and switching on an alternating current power supply, so that the photocuring resin liquid drop is deformed into a liquid lens under the action of an electric field, and meanwhile, the liquid lens realizes micro-infiltration on the surface of the second nano-cone array structure coated with the Teflon thin layer, and the second nano-cone array structure coated with the Teflon thin layer is embedded into the plane of the liquid lens;
s8: disconnecting the alternating current power supply and extracting the electrode from the liquid lens;
s9: absorbing a certain amount of light-cured resin from the liquid lens by adopting a second digital micro-injector, so that the contact area of the liquid lens and the second nano-cone array structure coated with the Teflon thin layer is not changed but only the curvature radius of the liquid lens is changed through the energy barrier effect of the surface of the second nano-cone array structure coated with the Teflon thin layer, thereby accurately regulating and controlling the numerical aperture of the liquid lens;
s10: irradiating the liquid lens by adopting an ultraviolet lamp box, so that the liquid lens is solidified into a solid lens, and forming a nano-cone hole array structure on the plane of the solid lens;
s11: the solid lens was peeled off by vacuum adsorption, thereby completing the production of the microlens.
Compared with the existing microlens manufacturing method, the microlens forming method based on the electrowetting effect and the liquid drop suction disclosed by the invention manufactures the microlens with the controllable numerical aperture based on a brand-new principle and process, so that the application range of the microlens is not limited any more.
The invention effectively solves the problem that the traditional microlens manufacturing method can not manufacture the microlens with controllable numerical aperture, and is suitable for manufacturing the microlens.
Drawings
Fig. 1 is a schematic diagram of step S1 in the present invention.
Fig. 2 is a schematic diagram of step S2 in the present invention.
Fig. 3 is a schematic diagram of step S3 in the present invention.
Fig. 4 is a schematic diagram of step S4 in the present invention.
Fig. 5 is a schematic diagram of step S5 in the present invention.
Fig. 6 is a schematic diagram of step S6 in the present invention.
Fig. 7 is a schematic diagram of step S7 in the present invention.
Fig. 8 is a schematic diagram of step S8 in the present invention.
Fig. 9 is a schematic diagram of step S9 in the present invention.
Fig. 10 is a schematic diagram of step S10 in the present invention.
Fig. 11 is a schematic diagram of step S11 in the present invention.
In the figure: 1-thermally oxidizing a highly doped silicon wafer, 2-a nanoparticle suspension, 3-a single-layer nanoparticle film, 4-a first nanocone array structure, 5-a polydimethylsiloxane imprint mold, 6-a transparent conductive glass substrate, 7-a light-cured resin structure layer, 8-a second nanocone array structure, 9-a Teflon thin layer, 10-a first digital microinjector, 11-a light-cured resin droplet, 12-an alternating current power supply, 13-an electrode, 14-a liquid lens, 15-a second digital microinjector and 16-a solid lens.
Detailed Description
A micro-lens forming method based on electrowetting effect and droplet suction is realized by adopting the following steps:
s1: selecting a thermal oxidation highly-doped silicon wafer 1, and pretreating the thermal oxidation highly-doped silicon wafer 1; then, coating the nano particles in the nano particle suspension 2 on the surface of the thermal oxidation highly-doped silicon wafer 1 by adopting a stepping blade coating method, thereby forming a single-layer nano particle film 3 on the surface of the thermal oxidation highly-doped silicon wafer 1;
s2: drying the single-layer nano particle film 3 at 200 ℃; then, with the single-layer nano particle film 3 as a masking layer, performing submicron etching processing on the surface of the thermally oxidized highly doped silicon wafer 1, thereby forming a first nanocone array structure 4 on the surface of the thermally oxidized highly doped silicon wafer 1;
s3: removing the single-layer nano particle film 3; then, pouring polydimethylsiloxane on the surface of the first nanocone array structure 4 to prepare a polydimethylsiloxane imprinting mold 5;
s4: selecting a transparent conductive glass substrate 6, and coating a photocuring resin structure layer 7 on the surface of the transparent conductive glass substrate 6; then, carrying out contact imprinting on the polydimethylsiloxane imprinting mold 5 and the light-cured resin structure layer 7, thereby forming a second nanocone array structure 8 on the surface of the light-cured resin structure layer 7;
s5: coating a Teflon thin layer 9 on the surface of the second nanocone array structure 8 by adopting a spin-coating method;
s6: applying a photo-curing resin droplet 11 on the surface of the second nanocone array structure 8 coated with the teflon thin layer 9 by using a first digital micro-injector 10;
s7: selecting an alternating current power supply 12 and an electrode 13, and respectively connecting two ends of the alternating current power supply 12 with the electrode 13 and the conductive surface of the transparent conductive glass substrate 6; then, inserting an electrode 13 into the photo-curing resin droplet 11, and switching on an alternating current power supply 12, so that the photo-curing resin droplet 11 is deformed into a liquid lens 14 under the action of an electric field, and simultaneously, the liquid lens 14 realizes micro-infiltration on the surface of the second nano-cone array structure 8 coated with the teflon thin layer 9, so that the second nano-cone array structure 8 coated with the teflon thin layer 9 is embedded into the plane of the liquid lens 14;
s8: disconnecting the AC power supply 12 and drawing the electrode 13 out of the liquid lens 14;
s9: a certain amount of light-cured resin is absorbed from the liquid lens 14 by using the second digital micro-injector 15, so that the contact area between the liquid lens 14 and the second nano-cone array structure 8 coated with the teflon thin layer 9 is not changed, but only the curvature radius of the liquid lens 14 is changed by the energy barrier effect of the surface of the second nano-cone array structure 8 coated with the teflon thin layer 9, thereby accurately regulating and controlling the numerical aperture of the liquid lens 14;
s10: irradiating the liquid lens 14 by using an ultraviolet lamp box, so that the liquid lens 14 is solidified into a solid lens 16, and forming a nano-cone hole array structure on the plane of the solid lens 16;
s11: the solid lens 16 is peeled off by vacuum adsorption, thereby completing the production of the microlens.
In step S1, the preprocessing steps are as follows: firstly, carrying out water bath heating on a thermal oxidation highly doped silicon wafer 1 for 1h by using piranha solution; then, washing the thermal oxidation highly doped silicon wafer 1 by using deionized water; then, the thermally oxidized highly doped silicon wafer 1 is dried by nitrogen and then baked at 150 ℃ for 1 h.
In the step S10, the wavelength of the ultraviolet light is 350-450 nm, and the irradiation intensity is 200W/cm2And the irradiation time is 3-5 min.
The thickness of the thermal oxidation highly doped silicon wafer 1 is 500 μm, and the thickness of the thermal oxidation layer is 300-1000 nm.
The transparent conductive glass substrate 6 is an indium tin oxide transparent conductive glass substrate or fluorine-doped SnO2A transparent conductive glass substrate.
The light-cured resin structure layer 7 is an NOA61 ultraviolet light-cured resin structure layer; the photo-curable resin droplets 11 are NOA61 uv-curable resin droplets.
The electrode 13 is a copper wire electrode or a platinum wire electrode, and the diameter of the electrode is 50-200 mu m.

Claims (7)

1. A micro-lens forming method based on electrowetting effect and droplet suction is realized by adopting the following steps:
s1: selecting a thermal oxidation highly-doped silicon wafer (1), and pretreating the thermal oxidation highly-doped silicon wafer (1); then, coating the nano particles in the nano particle suspension (2) on the surface of the thermally oxidized highly doped silicon wafer (1) by adopting a step blade coating method, thereby forming a single-layer nano particle film (3) on the surface of the thermally oxidized highly doped silicon wafer (1); then, drying the single-layer nano particle film (3) at 200 ℃;
the method is characterized in that: the method also includes the steps of:
s2: carrying out submicron etching processing on the surface of the thermally oxidized highly doped silicon wafer (1) by taking the single-layer nano particle film (3) as a masking layer, thereby forming a first nanocone array structure (4) on the surface of the thermally oxidized highly doped silicon wafer (1);
s3: removing the single-layer nano particle film (3); then, pouring polydimethylsiloxane on the surface of the first nanocone array structure (4) to prepare a polydimethylsiloxane imprinting mold (5);
s4: selecting a transparent conductive glass substrate (6), and coating a photocuring resin structure layer (7) on the surface of the transparent conductive glass substrate (6); then, carrying out contact imprinting on the polydimethylsiloxane imprinting mould (5) and the light-cured resin structure layer (7), thereby forming a second nanocone array structure (8) on the surface of the light-cured resin structure layer (7);
s5: coating a Teflon thin layer (9) on the surface of the second nanocone array structure (8) by adopting a spin-coating method;
s6: applying a photo-curing resin drop (11) on the surface of the second nano-cone array structure (8) coated with the Teflon thin layer (9) by using a first digital micro-injector (10);
s7: selecting an alternating current power supply (12) and an electrode (13), and respectively connecting two ends of the alternating current power supply (12) with the electrode (13) and the conductive surface of the transparent conductive glass substrate (6); then, inserting an electrode (13) into the light-cured resin liquid drop (11), and switching on an alternating current power supply (12), so that the light-cured resin liquid drop (11) is deformed into a liquid lens (14) under the action of an electric field, and meanwhile, the liquid lens (14) realizes micro-infiltration on the surface of the second nano-cone array structure (8) coated with the Teflon thin layer (9), and further, the second nano-cone array structure (8) coated with the Teflon thin layer (9) is embedded into the plane of the liquid lens (14);
s8: disconnecting the AC power supply (12) and drawing the electrode (13) out of the liquid lens (14);
s9: a certain amount of light-cured resin is absorbed from the liquid lens (14) by using a second digital micro-injector (15), so that the contact area of the liquid lens (14) and the second nano-cone array structure (8) coated with the Teflon thin layer (9) is not changed by the energy barrier effect of the surface of the second nano-cone array structure (8) coated with the Teflon thin layer (9), and only the curvature radius of the liquid lens (14) is changed, so that the numerical aperture of the liquid lens (14) is accurately regulated;
s10: irradiating the liquid lens (14) by using an ultraviolet lamp box, so that the liquid lens (14) is solidified into a solid lens (16), and forming a nano-cone hole array structure on the plane of the solid lens (16);
s11: the solid lens (16) is peeled off by vacuum suction, thereby completing the production of the microlens.
2. A microlens shaping method based on electrowetting effect and droplet suction as claimed in claim 1, wherein: in step S1, the preprocessing steps are as follows: firstly, carrying out water bath heating on a thermal oxidation highly doped silicon wafer (1) for 1h by using piranha solution; then, washing the thermal oxidation highly-doped silicon wafer (1) by using deionized water; then, the thermal oxidation highly doped silicon wafer (1) is dried by nitrogen and then baked for 1h at 150 ℃.
3. A microlens shaping method based on electrowetting effect and droplet suction as claimed in claim 1, wherein: in the step S10, the wavelength of the ultraviolet light is 350-450 nm, and the irradiation intensity is 200W/cm2And the irradiation time is 3-5 min.
4. A microlens shaping method based on electrowetting effect and droplet suction as claimed in claim 1, wherein: the thickness of the thermal oxidation highly doped silicon wafer (1) is 500 mu m, and the thickness of the thermal oxidation layer is 300-1000 nm.
5. A method according to claim 1 based on the electrowetting effect anda method for forming a microlens by droplet suction, comprising: the transparent conductive glass substrate (6) is an indium tin oxide transparent conductive glass substrate or fluorine-doped SnO2A transparent conductive glass substrate.
6. A microlens shaping method based on electrowetting effect and droplet suction as claimed in claim 1, wherein: the light-cured resin structure layer (7) is an NOA61 ultraviolet light-cured resin structure layer; the light-cured resin droplets (11) are NOA61 ultraviolet light-cured resin droplets.
7. A microlens shaping method based on electrowetting effect and droplet suction as claimed in claim 1, wherein: the electrode (13) is a copper wire electrode or a platinum wire electrode, and the diameter of the electrode is 50-200 mu m.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1975467A (en) * 2006-08-21 2007-06-06 厦门大学 Extremely micro optical lens based on micro-pore diffraction
CN102681046A (en) * 2012-05-17 2012-09-19 中北大学 Method for preparing large-area NOA73 curved-surface micro lens array
CN103885102A (en) * 2012-12-21 2014-06-25 李诚浩 Micro-lens array device, manufacturing method thereof and solar battery module comprising the same
CN104678465A (en) * 2015-02-10 2015-06-03 华南理工大学 Integrated preparation method for microstructure lens and mold of microstructure lens
CN107797268A (en) * 2017-12-01 2018-03-13 中北大学 A kind of electrowetting regulation and control manufacturing process of complete anti-reflection embedded nano combined lens
CN108663730A (en) * 2018-05-09 2018-10-16 中国科学院长春光学精密机械与物理研究所 A kind of preparation method for the fly's-eye lens that curvature is controllable

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1975467A (en) * 2006-08-21 2007-06-06 厦门大学 Extremely micro optical lens based on micro-pore diffraction
CN102681046A (en) * 2012-05-17 2012-09-19 中北大学 Method for preparing large-area NOA73 curved-surface micro lens array
CN103885102A (en) * 2012-12-21 2014-06-25 李诚浩 Micro-lens array device, manufacturing method thereof and solar battery module comprising the same
CN104678465A (en) * 2015-02-10 2015-06-03 华南理工大学 Integrated preparation method for microstructure lens and mold of microstructure lens
CN107797268A (en) * 2017-12-01 2018-03-13 中北大学 A kind of electrowetting regulation and control manufacturing process of complete anti-reflection embedded nano combined lens
CN108663730A (en) * 2018-05-09 2018-10-16 中国科学院长春光学精密机械与物理研究所 A kind of preparation method for the fly's-eye lens that curvature is controllable

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