CN109341561A - A kind of notebook computer casing thermal deformation measurement device - Google Patents
A kind of notebook computer casing thermal deformation measurement device Download PDFInfo
- Publication number
- CN109341561A CN109341561A CN201811430148.3A CN201811430148A CN109341561A CN 109341561 A CN109341561 A CN 109341561A CN 201811430148 A CN201811430148 A CN 201811430148A CN 109341561 A CN109341561 A CN 109341561A
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- China
- Prior art keywords
- substrate
- notebook computer
- computer casing
- heating module
- crane
- Prior art date
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- 238000005259 measurement Methods 0.000 title claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000004088 simulation Methods 0.000 claims abstract description 26
- 238000001514 detection method Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The present invention relates to a kind of notebook computer casing thermal deformation measurement devices, including substrate, profile scan device, crane, simulation heating module and temperature detecting module；Positioning seat is provided on the substrate, the profile scan device is flexibly connected with substrate upper surface；It is additionally provided with support frame on the substrate, the crane is flexibly connected by going up and down mould group with support frame, and the simulation heating module is located on crane and to simulate heating module corresponding with the upper and lower position of profile scan device；The temperature detecting module is flexibly connected with crane.A kind of notebook computer casing thermal deformation measurement device of the present invention can be after integrally positioning notebook computer casing sample, the limit heating temperature of simulation CPU heats the privileged site of crust sample, whether in allowed limits to detect the heat distortion amount of crust sample at this temperature.
Description
Technical field
The present invention relates to thermal deformation detection fields, and in particular to a kind of notebook computer casing thermal deformation measurement device.
Background technique
CPU is the kernel component of laptop, in the case where it works long hours state, can generate more heat, especially
It is CPU when running more or biggish program.If because ambient air temperature problem or radiating module problem lead to CPU
Calorific value be greater than heat dissipation capacity, then will lead to the lasting raising of cpu temperature.
Under normal circumstances, the temperature highest of CPU does not exceed 85 degree, and best temperature control is considered safety at 75 degree or less
's.Temperature is more than 80 degree or more and is easy to cause computer crash or automatic shutdown etc., and cpu temperature can reach 100 under extreme case
Degree or more, it is bad just to belong to computer heat radiation at this time.The problem of problem for causing computer temperature high is usually heat dissipation, such as generally
The temperature of laptop CPU will be apparently higher than the cpu temperature of desktop computer, be primarily due to notebook due to by volume
Small influence.
The raising of cpu temperature, the temperature that can directly result in notebook computer casing increase.Therefore, outside laptop
It in the selection and structured design process of shell, needs to detect the heat distortion amount of crust sample, so that in CPU limit temperature
In the case where degree, heat distortion amount still be can control within the allowable range.
But in the prior art, it is not exclusively used in the device of detection notebook computer shell heat distortion amount.
Summary of the invention
The object of the present invention is to provide a kind of notebook computer casing thermal deformation measurement devices, can be whole by crust sample
After body positioning, the limit heating temperature of CPU is simulated, and detect the heat distortion amount of crust sample at this temperature.
To achieve the goals above, the present invention provides the following technical solution:
A kind of notebook computer casing thermal deformation measurement device, including substrate, profile scan device, crane, simulation hair
Thermal modules and temperature detecting module；Positioning seat is provided on the substrate, the profile scan device and substrate upper surface are living
Dynamic connection；Support frame is additionally provided on the substrate, the crane is flexibly connected by going up and down mould group with support frame, the mould
Send out that thermal modules are located on crane and to simulate heating module corresponding with the upper and lower position of profile scan device；The temperature
Detection module is flexibly connected with crane.
Further, the simulation heating module is particularly located at the one end of crane far from lifting mould group, the temperature inspection
It is specifically hinged with the middle section of crane to survey module.
Further, the bottom surface of the simulation heating module is plane and the plane is parallel with substrate, the simulation
Heating module is specially heating resistor；The test side of the temperature detecting module is opposite with the simulation basal surface position of heating module
It answers, the temperature detecting module is specially non-contact infrared detector.
Further, the profile scan device below the simulation heating module is especially by XY mould group and substrate upper surface
It is flexibly connected；The Scanning Detction end of the profile scan device is located at the top of profile scan device.
Further, what four positioning seats that the XY mould group where the profile scan device is particularly located on substrate surrounded
In region；The profile scan device is specially laser profile scanner.
Further, the top of the positioning seat is provided with locating slot, and the locating slot on four positioning seats is towards substrate
Center at arrange；Heat insulating mattress is provided in the locating slot.
The invention has the benefit that a kind of notebook computer casing thermal deformation measurement device, is swept by positioning seat, profile
Imaging apparatus, XY mould group, lifting mould group, crane, simulation heating module and temperature detecting module are used cooperatively, can be by pen
After remembering that this computer casing sample integrally positions, the limit heating temperature for simulating CPU heats the privileged site of crust sample,
Whether in allowed limits to detect the heat distortion amount of crust sample at this temperature.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of notebook computer casing thermal deformation measurement device of the present invention.
Fig. 2 is a kind of partial structure diagram of notebook computer casing thermal deformation measurement device of the present invention.
In figure: 1, substrate；2, positioning seat；21, locating slot；22, heat insulating mattress；3, profile scan device；4, XY mould group；5, it props up
Support；6, mould group is gone up and down；7, crane；8, heating module is simulated；9, temperature detecting module.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is described in further detail.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
With reference to Fig. 1 and Fig. 2, a kind of notebook computer casing thermal deformation measurement device, including substrate 1, profile scan device
3, crane 7, simulation heating module 8 and temperature detecting module 9；Positioning seat 2 is provided on the substrate 1, the profile is swept
Imaging apparatus 3 is flexibly connected with 1 upper surface of substrate；Support frame 5 is additionally provided on the substrate 1, the crane 5 passes through lifting mould
Group 6 is flexibly connected with support frame 5, and the simulation heating module 8 is located on crane 5 and simulates heating module 8 to be swept with profile
The upper and lower position of imaging apparatus 3 is corresponding；The temperature detecting module 9 is flexibly connected with crane 7.
The simulation heating module 8 is particularly located at the one end of crane 7 far from lifting mould group 6, the temperature detecting module 9
Specifically hinged with the middle section of crane 7, the temperature detecting module 9 can be overturn relative to crane 7.
The bottom surface of the simulation heating module 8 is plane and the plane is parallel with substrate 1, the simulation heating module
8 be specially heating resistor, for simulating fever phenomenon of the CPU in intensive work；The test side of the temperature detecting module 9
Corresponding with the simulation basal surface position of heating module 8, the temperature detecting module 8 is specially non-contact infrared detector, is used
In the temperature for measuring specific region on notebook computer casing in the non-contact case.
The profile scan device 3 of 8 lower section of simulation heating module is especially by XY mould group 4 and the activity of 1 upper surface of substrate
Connection；The Scanning Detction end of the profile scan device 3 is located at the top of profile scan device 3.
The region that four positioning seats 2 that XY mould group 4 where the profile scan device 3 is particularly located on substrate 1 surround
It is interior；The profile scan device 3 is specially laser profile scanner, is swept for carrying out profile to notebook computer casing from below
It retouches, to detect deflection.
The top of the positioning seat 2 is provided with locating slot 21, and the locating slot 21 on four positioning seats 2 is towards substrate 1
It is arranged at center, four locating slots 21 realize the positioning to notebook computer casing；Heat insulating mattress is provided in the locating slot 21
22, the heat insulating mattress 22 is for avoiding the temperature on notebook computer casing from being transferred to positioning seat 2.
The lifting mould group 6 is specially screw rod sliding rail mould group, is driven by servo motor, for driving about 7 crane to rise
Drop movement.
The profile scan device 3, XY mould group 4, lifting mould group 6, simulation heating module 8 and temperature detecting module 9 are equal
Be electrically connected with external computer, external computer show for Data Analysis Services and data, and be used to control XY mould group 4,
It goes up and down the movement of mould group 6 and simulates the heating temperature of heating module 8.
The operation principle of the present invention is that: it is fixed that the bottom surface shell (i.e. D plate) of the laptop of pending detection is placed on
On the seat 2 of position, in the locating slot 21 that is located at four edges of shell on four positioning seats 2, until riding over heat insulating mattress 22
On, realize that the support to notebook computer casing positions；Then lifting mould group 6 drives crane 7 to decline, and makes to simulate heating module
8 touch the place the location of CPU on notebook computer casing, then adjust folder of the temperature detecting module 9 relative to crane 7
Angle, so that the notebook computer casing relevant range of 8 lower section of test side alignment simulation heating module of temperature detecting module 9；With
Rear mold sends out 8 heating power of thermal modules, simulates fever of the CPU in intensive work, and XY mould group 4 drives profile scanning means 3
It is mobile relative to notebook computer casing, so that the bottom end profile to notebook computer casing is precisely scanned, and will scanning
Data are transferred to external computer, and temperature detecting module 9 detects the temperature of heat affected zone on notebook computer casing, and temperature is believed
Number it is transferred to external computer, finally calculates the heat distortion amount of notebook computer casing.
In the present invention unless specifically defined or limited otherwise, the terms such as term " connected ", " connection ", " fixation " are answered
It is interpreted broadly, for example, it may be being fixedly connected, may be a detachable connection, or is integral；It can be mechanical connection,
It can be electrical connection；It can be directly connected, the company inside two elements can also be can be indirectly connected through an intermediary
Logical or two elements interaction relationship.For the ordinary skill in the art, can understand as the case may be
The concrete meaning of above-mentioned term in the present invention.
Above-described embodiment does not limit the invention to these specific implementations for the present invention is further illustrated
Mode.Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be understood as at this
Within the protection scope of invention.
Claims (6)
1. a kind of notebook computer casing thermal deformation measurement device, it is characterised in that: including substrate (1), profile scan device
(3), crane (7), simulation heating module (8) and temperature detecting module (9)；Positioning seat is provided on the substrate (1)
(2), the profile scan device (3) is flexibly connected with substrate (1) upper surface；Support frame is additionally provided on the substrate (1)
(5), the crane (5) is flexibly connected by going up and down mould group (6) with support frame (5), and the simulation heating module (8), which is located at, to rise
In drop frame (5) and to simulate heating module (8) corresponding with the upper and lower position of profile scan device (3)；The temperature detection mould
Block (9) is flexibly connected with crane (7).
2. a kind of notebook computer casing thermal deformation measurement device according to claim 1, it is characterised in that: the simulation
Heating module (8) be particularly located at crane (7) far from lifting mould group (6) one end, the temperature detecting module (9) specifically with liter
The middle section for dropping frame (7) is hinged.
3. a kind of notebook computer casing thermal deformation measurement device according to claim 2, it is characterised in that: the simulation
The bottom surface of heating module (8) is plane and the plane is parallel with substrate (1), and the simulation heating module (8) is specially to send out
Thermal resistance；The test side of the temperature detecting module (9) is corresponding with the simulation basal surface position of heating module (8), the temperature
Detection module (8) is specially non-contact infrared detector.
4. a kind of notebook computer casing thermal deformation measurement device according to claim 3, it is characterised in that: the simulation
Profile scan device (3) below heating module (8) is flexibly connected especially by XY mould group (4) with substrate (1) upper surface；It is described
The Scanning Detction end of profile scan device (3) is located at the top of profile scan device (3).
5. a kind of notebook computer casing thermal deformation measurement device according to claim 4, it is characterised in that: the profile
In the region that four positioning seats (2) that XY mould group (4) where scanning means (3) is particularly located on substrate (1) surround；The wheel
Wide scanning means (3) is specially laser profile scanner.
6. a kind of notebook computer casing thermal deformation measurement device according to claim 5, it is characterised in that: the positioning
The top of seat (2) is provided with locating slot (21), and the locating slot (21) on four positioning seats (2) is towards at the center of substrate (1)
Arrangement；Heat insulating mattress (22) are provided in the locating slot (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811430148.3A CN109341561A (en) | 2018-11-28 | 2018-11-28 | A kind of notebook computer casing thermal deformation measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811430148.3A CN109341561A (en) | 2018-11-28 | 2018-11-28 | A kind of notebook computer casing thermal deformation measurement device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109341561A true CN109341561A (en) | 2019-02-15 |
Family
ID=65318579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811430148.3A Pending CN109341561A (en) | 2018-11-28 | 2018-11-28 | A kind of notebook computer casing thermal deformation measurement device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109341561A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08233543A (en) * | 1995-02-28 | 1996-09-13 | Hitachi Ltd | Thermal deformation measuring apparatus |
| US20040169716A1 (en) * | 2002-12-12 | 2004-09-02 | Keiichi Serizawa | Optical scanner and image forming apparatus |
| JP2004252250A (en) * | 2003-02-21 | 2004-09-09 | Ricoh Co Ltd | Optical scanning device and image forming device |
| KR200397136Y1 (en) * | 2005-07-08 | 2005-09-28 | 주식회사 지음 | Cooling apparatus for a note book computer |
| CN206990480U (en) * | 2017-06-26 | 2018-02-09 | 东莞市诺尔检测科技有限公司 | A kind of heat deformations test machine |
| CN108592819A (en) * | 2018-05-09 | 2018-09-28 | 燕山大学 | A kind of plain bending sheet metal component section flexure contour detecting device and method |
| CN208984030U (en) * | 2018-11-28 | 2019-06-14 | 昆山久茂电子科技有限公司 | A kind of notebook computer casing thermal deformation measurement device |
-
2018
- 2018-11-28 CN CN201811430148.3A patent/CN109341561A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08233543A (en) * | 1995-02-28 | 1996-09-13 | Hitachi Ltd | Thermal deformation measuring apparatus |
| US20040169716A1 (en) * | 2002-12-12 | 2004-09-02 | Keiichi Serizawa | Optical scanner and image forming apparatus |
| JP2004252250A (en) * | 2003-02-21 | 2004-09-09 | Ricoh Co Ltd | Optical scanning device and image forming device |
| KR200397136Y1 (en) * | 2005-07-08 | 2005-09-28 | 주식회사 지음 | Cooling apparatus for a note book computer |
| CN206990480U (en) * | 2017-06-26 | 2018-02-09 | 东莞市诺尔检测科技有限公司 | A kind of heat deformations test machine |
| CN108592819A (en) * | 2018-05-09 | 2018-09-28 | 燕山大学 | A kind of plain bending sheet metal component section flexure contour detecting device and method |
| CN208984030U (en) * | 2018-11-28 | 2019-06-14 | 昆山久茂电子科技有限公司 | A kind of notebook computer casing thermal deformation measurement device |
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