CN208984030U - A kind of notebook computer casing thermal deformation measurement device - Google Patents
A kind of notebook computer casing thermal deformation measurement device Download PDFInfo
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- CN208984030U CN208984030U CN201821979517.XU CN201821979517U CN208984030U CN 208984030 U CN208984030 U CN 208984030U CN 201821979517 U CN201821979517 U CN 201821979517U CN 208984030 U CN208984030 U CN 208984030U
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- substrate
- notebook computer
- computer casing
- heating module
- simulation
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Abstract
The utility model relates to a kind of notebook computer casing thermal deformation measurement devices, including substrate, profile scan device, crane, simulation heating module and temperature detecting module；Positioning seat is provided on the substrate, the profile scan device is flexibly connected with substrate upper surface；It is additionally provided with support frame on the substrate, the crane is flexibly connected by going up and down mould group with support frame, and the simulation heating module is located on crane and to simulate heating module corresponding with the upper and lower position of profile scan device；The temperature detecting module is flexibly connected with crane.A kind of notebook computer casing thermal deformation measurement device of the utility model can be after integrally positioning notebook computer casing sample, the limit heating temperature of simulation CPU heats the privileged site of crust sample, whether in allowed limits to detect the heat distortion amount of crust sample at this temperature.
Description
Technical field
The utility model relates to thermal deformation detection fields, and in particular to a kind of notebook computer casing thermal deformation measurement dress
It sets.
Background technique
CPU is the kernel component of laptop, in the case where it works long hours state, can generate more heat, especially
It is CPU when running more or biggish program.If because ambient air temperature problem or radiating module problem lead to CPU
Calorific value be greater than heat dissipation capacity, then will lead to the lasting raising of cpu temperature.
Under normal circumstances, the temperature highest of CPU does not exceed 85 degree, and best temperature control is considered safety at 75 degree or less
's.Temperature is more than 80 degree or more and is easy to cause computer crash or automatic shutdown etc., and cpu temperature can reach 100 under extreme case
Degree or more, it is bad just to belong to computer heat radiation at this time.The problem of problem for causing computer temperature high is usually heat dissipation, such as generally
The temperature of laptop CPU will be apparently higher than the cpu temperature of desktop computer, be primarily due to notebook due to by volume
Small influence.
The raising of cpu temperature, the temperature that can directly result in notebook computer casing increase.Therefore, outside laptop
It in the selection and structured design process of shell, needs to detect the heat distortion amount of crust sample, so that in CPU limit temperature
In the case where degree, heat distortion amount still be can control within the allowable range.
But in the prior art, it is not exclusively used in the device of detection notebook computer shell heat distortion amount.
Utility model content
The purpose of this utility model is: a kind of notebook computer casing thermal deformation measurement device is provided, it can be by shell sample
After product integrally position, the limit heating temperature of CPU is simulated, and detects the heat distortion amount of crust sample at this temperature.
To achieve the goals above, the utility model provides the following technical solution:
A kind of notebook computer casing thermal deformation measurement device, including substrate, profile scan device, crane, simulation hair
Thermal modules and temperature detecting module；Positioning seat is provided on the substrate, the profile scan device and substrate upper surface are living
Dynamic connection；Support frame is additionally provided on the substrate, the crane is flexibly connected by going up and down mould group with support frame, the mould
Send out that thermal modules are located on crane and to simulate heating module corresponding with the upper and lower position of profile scan device；The temperature
Detection module is flexibly connected with crane.
Further, the simulation heating module is particularly located at the one end of crane far from lifting mould group, the temperature inspection
It is specifically hinged with the middle section of crane to survey module.
Further, the bottom surface of the simulation heating module is plane and the plane is parallel with substrate, the simulation
Heating module is specially heating resistor；The test side of the temperature detecting module is opposite with the simulation basal surface position of heating module
It answers, the temperature detecting module is specially non-contact infrared detector.
Further, the profile scan device below the simulation heating module is especially by XY mould group and substrate upper surface
It is flexibly connected；The Scanning Detction end of the profile scan device is located at the top of profile scan device.
Further, what four positioning seats that the XY mould group where the profile scan device is particularly located on substrate surrounded
In region；The profile scan device is specially laser profile scanner.
Further, the top of the positioning seat is provided with locating slot, and the locating slot on four positioning seats is towards substrate
Center at arrange；Heat insulating mattress is provided in the locating slot.
The utility model has the following beneficial effects: a kind of notebook computer casing thermal deformation measurement device, passes through positioning seat, wheel
Wide scanning means, XY mould group, lifting mould group, crane, simulation heating module and temperature detecting module are used cooperatively, can be
After notebook computer casing sample is integrally positioned, the limit heating temperature for simulating CPU carries out the privileged site of crust sample
Heating, whether in allowed limits to detect the heat distortion amount of crust sample at this temperature.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of notebook computer casing thermal deformation measurement device of the utility model.
Fig. 2 is a kind of partial structure diagram of notebook computer casing thermal deformation measurement device of the utility model.
In figure: 1, substrate；2, positioning seat；21, locating slot；22, heat insulating mattress；3, profile scan device；4, XY mould group；5, it props up
Support；6, mould group is gone up and down；7, crane；8, heating module is simulated；9, temperature detecting module.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the utility model is described in further detail.It should be appreciated that specific embodiment described herein is only to explain this
Utility model is not used to limit the utility model.
With reference to Fig. 1 and Fig. 2, a kind of notebook computer casing thermal deformation measurement device, including substrate 1, profile scan device
3, crane 7, simulation heating module 8 and temperature detecting module 9；Positioning seat 2 is provided on the substrate 1, the profile is swept
Imaging apparatus 3 is flexibly connected with 1 upper surface of substrate；Support frame 5 is additionally provided on the substrate 1, the crane 5 passes through lifting mould
Group 6 is flexibly connected with support frame 5, and the simulation heating module 8 is located on crane 5 and simulates heating module 8 to be swept with profile
The upper and lower position of imaging apparatus 3 is corresponding；The temperature detecting module 9 is flexibly connected with crane 7.
The simulation heating module 8 is particularly located at the one end of crane 7 far from lifting mould group 6, the temperature detecting module 9
Specifically hinged with the middle section of crane 7, the temperature detecting module 9 can be overturn relative to crane 7.
The bottom surface of the simulation heating module 8 is plane and the plane is parallel with substrate 1, the simulation heating module
8 be specially heating resistor, for simulating fever phenomenon of the CPU in intensive work；The test side of the temperature detecting module 9
Corresponding with the simulation basal surface position of heating module 8, the temperature detecting module 8 is specially non-contact infrared detector, is used
In the temperature for measuring specific region on notebook computer casing in the non-contact case.
The profile scan device 3 of 8 lower section of simulation heating module is especially by XY mould group 4 and the activity of 1 upper surface of substrate
Connection；The Scanning Detction end of the profile scan device 3 is located at the top of profile scan device 3.
The region that four positioning seats 2 that XY mould group 4 where the profile scan device 3 is particularly located on substrate 1 surround
It is interior；The profile scan device 3 is specially laser profile scanner, is swept for carrying out profile to notebook computer casing from below
It retouches, to detect deflection.
The top of the positioning seat 2 is provided with locating slot 21, and the locating slot 21 on four positioning seats 2 is towards substrate 1
It is arranged at center, four locating slots 21 realize the positioning to notebook computer casing；Heat insulating mattress is provided in the locating slot 21
22, the heat insulating mattress 22 is for avoiding the temperature on notebook computer casing from being transferred to positioning seat 2.
The lifting mould group 6 is specially screw rod sliding rail mould group, is driven by servo motor, for driving about 7 crane to rise
Drop movement.
The profile scan device 3, XY mould group 4, lifting mould group 6, simulation heating module 8 and temperature detecting module 9 are equal
Be electrically connected with external computer, external computer show for Data Analysis Services and data, and be used to control XY mould group 4,
It goes up and down the movement of mould group 6 and simulates the heating temperature of heating module 8.
The working principle of the utility model are as follows: place the bottom surface shell (i.e. D plate) of the laptop of pending detection
On positioning seat 2, in the locating slot 21 that is located at four edges of shell on four positioning seats 2, until riding over heat-insulated
On pad 22, realize that the support to notebook computer casing positions；Then lifting mould group 6 drives crane 7 to decline, and simulation is made to generate heat
Module 8 touches the place the location of CPU on notebook computer casing, then adjusts temperature detecting module 9 relative to crane 7
Angle so that the notebook computer casing correlation zone of test side alignment simulation heating module 8 lower section of temperature detecting module 9
Domain；Then simulation 8 heating power of heating module, simulates fever of the CPU in intensive work, and XY mould group 4 drives profile scan
Device 3 is mobile relative to notebook computer casing, so that the bottom end profile to notebook computer casing is precisely scanned, and will
Scan data is transferred to external computer, and temperature detecting module 9 detects the temperature of heat affected zone on notebook computer casing, and will be warm
Degree signal is transferred to external computer, finally calculates the heat distortion amount of notebook computer casing.
In the present invention unless specifically defined or limited otherwise, the arts such as term " connected ", " connection ", " fixation "
Language shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
The utility model is not confined to these for being further described to the utility model by above-described embodiment
Specific embodiment.Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention etc.,
It is interpreted as being within the protection scope of the utility model.
Claims (6)
1. a kind of notebook computer casing thermal deformation measurement device, it is characterised in that: including substrate (1), profile scan device
(3), crane (7), simulation heating module (8) and temperature detecting module (9)；Positioning seat is provided on the substrate (1)
(2), the profile scan device (3) is flexibly connected with substrate (1) upper surface；Support frame is additionally provided on the substrate (1)
(5), the crane (7) is flexibly connected by going up and down mould group (6) with support frame (5), and the simulation heating module (8), which is located at, to rise
In drop frame (7) and to simulate heating module (8) corresponding with the upper and lower position of profile scan device (3)；The temperature detection mould
Block (9) is flexibly connected with crane (7).
2. a kind of notebook computer casing thermal deformation measurement device according to claim 1, it is characterised in that: the simulation
Heating module (8) be particularly located at crane (7) far from lifting mould group (6) one end, the temperature detecting module (9) specifically with liter
The middle section for dropping frame (7) is hinged.
3. a kind of notebook computer casing thermal deformation measurement device according to claim 2, it is characterised in that: the simulation
The bottom surface of heating module (8) is plane and the plane is parallel with substrate (1), and the simulation heating module (8) is specially to send out
Thermal resistance；The test side of the temperature detecting module (9) is corresponding with the simulation basal surface position of heating module (8), the temperature
Detection module (9) is specially non-contact infrared detector.
4. a kind of notebook computer casing thermal deformation measurement device according to claim 3, it is characterised in that: the simulation
Profile scan device (3) below heating module (8) is flexibly connected especially by XY mould group (4) with substrate (1) upper surface；It is described
The Scanning Detction end of profile scan device (3) is located at the top of profile scan device (3).
5. a kind of notebook computer casing thermal deformation measurement device according to claim 4, it is characterised in that: the profile
In the region that four positioning seats (2) that XY mould group (4) where scanning means (3) is particularly located on substrate (1) surround；The wheel
Wide scanning means (3) is specially laser profile scanner.
6. a kind of notebook computer casing thermal deformation measurement device according to claim 5, it is characterised in that: the positioning
The top of seat (2) is provided with locating slot (21), and the locating slot (21) on four positioning seats (2) is towards at the center of substrate (1)
Arrangement；Heat insulating mattress (22) are provided in the locating slot (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821979517.XU CN208984030U (en) | 2018-11-28 | 2018-11-28 | A kind of notebook computer casing thermal deformation measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821979517.XU CN208984030U (en) | 2018-11-28 | 2018-11-28 | A kind of notebook computer casing thermal deformation measurement device |
Publications (1)
| Publication Number | Publication Date |
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| CN208984030U true CN208984030U (en) | 2019-06-14 |
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| CN201821979517.XU Active CN208984030U (en) | 2018-11-28 | 2018-11-28 | A kind of notebook computer casing thermal deformation measurement device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109341561A (en) * | 2018-11-28 | 2019-02-15 | 昆山久茂电子科技有限公司 | A kind of notebook computer casing thermal deformation measurement device |
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2018
- 2018-11-28 CN CN201821979517.XU patent/CN208984030U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109341561A (en) * | 2018-11-28 | 2019-02-15 | 昆山久茂电子科技有限公司 | A kind of notebook computer casing thermal deformation measurement device |
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