CN109338151B - Copper alloy for electronic and electrical equipment and application - Google Patents
Copper alloy for electronic and electrical equipment and application Download PDFInfo
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- CN109338151B CN109338151B CN201811536339.8A CN201811536339A CN109338151B CN 109338151 B CN109338151 B CN 109338151B CN 201811536339 A CN201811536339 A CN 201811536339A CN 109338151 B CN109338151 B CN 109338151B
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- C22C9/04—Alloys based on copper with zinc as the next major constituent
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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Abstract
The invention relates to a copper alloy for electronic and electrical equipment and application thereof, which is characterized in that the copper alloy comprises the following components by weight: 5.01 to 15.0wt% of Zn, 0.1 to 2.0wt% of Sn, 0.01 to 2.0wt% of Fe, 0.01 to 0.5wt% of P, and the balance of Cu and unavoidable impurities. The weight percentages of Fe and P preferably satisfy: Fe/P is more than or equal to 5 and less than or equal to 100.
Description
Technical Field
The invention relates to the field of alloys, in particular to a copper alloy for electronic and electrical equipment and application thereof.
Background
As a copper alloy sheet material used for parts for electrical and electronic equipment and parts for automobiles, for example, parts such as connectors, lead frames, heat dissipation parts, relays, switches, and sockets, there are certain requirements for yield stress, tensile strength, elongation, bending workability, fatigue resistance, stress relaxation resistance, and electrical conductivity. In recent years, with miniaturization, weight reduction, high-density mounting, high temperature of use environment, and the like, higher demands have been made on the performance of copper alloys used for electronic equipment parts and automobile parts.
Among materials used in electronic and electrical equipment, copper alloy materials currently used in many cases include brass, phosphor bronze, beryllium bronze, and copper nickel silicon alloy, but these conventional copper alloy materials have the following problems: the brass has insufficient comprehensive performance, and is difficult to simultaneously meet the fields with high requirements on strength of more than or equal to 500MPa, electric conductivity of more than or equal to 30IACS, stress relaxation resistance (the heat preservation is carried out for 1000 hours at 150 ℃, the residual stress is more than or equal to 60 percent) and bending processing performance. The phosphor bronze is an alloy with strength improved by work hardening, the phosphor bronze is insulated for 1000 hours at 150 ℃, the residual stress is less than or equal to 60 percent, the stress relaxation resistance is poor, the content of Sn added in the phosphor bronze is high, the price of Sn is high, the material cost is improved, the electrical conductivity of the phosphor bronze is low, the electrical conductivity is only below 20IACS percent, the requirement on the working condition with high electrical conductivity cannot be met, and the application of the phosphor bronze is limited to a certain extent. And highly toxic substances are easily generated in the production process of beryllium bronze, and the beryllium bronze is expensive, so the beryllium bronze is generally only applied to certain military fields with higher requirements on elasticity and strength. The copper nickel silicon alloy is developed as an aging precipitation strengthening alloy to replace beryllium bronze, but the cost of the copper nickel silicon alloy is greatly higher than that of phosphor bronze, and the copper nickel silicon alloy is generally applied to the field of high-end connectors with the requirements of strength being more than or equal to 650MPa and electric conductivity being more than or equal to 40IACS percent. Therefore, such a general copper alloy material cannot satisfy the requirements of electronic and electrical components that tend to be miniaturized, lightweight, and high-performance to some extent, and it is important to develop a copper alloy material that satisfies the requirements.
Disclosure of Invention
The invention aims to solve the technical problem of providing a copper alloy material for electronics and electrical equipment with excellent yield strength, conductivity, stress relaxation resistance and bending processability aiming at the current situation of the prior art so as to meet the use requirements of the electronics and electrical equipment under different working conditions.
Another object of the present invention is to provide a use of a copper alloy for electronic and electrical purposes, which has excellent yield strength, conductivity, and stress relaxation resistance, and has excellent bending workability, in view of the current state of the art.
The technical scheme adopted by the invention for solving the technical problems is as follows: according to the invention, Cu, Zn and Sn are used as matrixes, and the performance is improved by adding elements such as Fe and P, so that on one hand, Fe element is directly precipitated out to improve the material strength; on the other hand, Fe-P compounds are separated out through Fe and P, the material matrix is purified, and the strength of the material is further improved while the electric conductivity is not remarkably reduced. Furthermore, the invention controls the microstructure such as the size of precipitated phase, crystal orientation and the like of the alloy by controlling the proportion of Fe and P and the processing technology, and realizes the balance of conductivity, yield strength and bending processing performance. The alloy of the invention is added with elements such as Fe, P and the like, thus improving the utilization of waste materials such as iron bronze, tin phosphor bronze and the like and reducing the material cost. The specific technical scheme is as follows:
a copper alloy material for electronic and electric use comprises the following components by weight: 5.01 to 15.0wt% of Zn, 0.1 to 2.0wt% of Sn, 0.01 to 2.0wt% of Fe, 0.01 to 0.5wt% of P, and the balance of Cu and unavoidable impurities.
The copper alloy material is added with 5.01-15.0 wt% of Zn. Zn has high solid solubility in the copper matrix, can improve the strength of the alloy when being dissolved in the copper matrix, promotes the work hardening effect in the cold working process, and can improve the casting performance and the welding performance of the alloy and improve the stripping resistance of a coating. However, when the Zn content is more than 15 wt%, the adverse effect on the electrical conductivity of the material is greatly increased, and when the Zn content is less than 5.01 wt%, the effect of Zn in promoting work hardening of the alloy is not good. Therefore, the Zn content is controlled to be 5.01-15.0 wt%.
The copper alloy material is added with 0.1-2.0 wt% of Sn. Sn exists in a copper alloy in a solid solution form, so that the degree of lattice distortion caused by crystals is large, and the material performance is better improved. The addition of the Sn element ensures that the alloy has better work hardening effect in the subsequent processing process of the alloy. Sn can also increase the thermal stability of the alloy, further improve the stress relaxation resistance of the alloy, and simultaneously increase the corrosion resistance of the alloy, thereby improving the reliability of the performance of downstream products such as subsequently prepared connectors and the like in moist and corrosive media. However, when the Sn content is less than 0.1 wt%, the effect is insufficient; when it exceeds 2.0wt%, the conductivity of the alloy deteriorates. Therefore, the content of Sn is controlled to be 0.1-2.0 wt%.
The copper alloy material is added with 0.01-2.0 wt% of Fe. After Fe is added, on one hand, Fe can prevent recrystallized grains from growing up and obviously refine the grains, so that the yield strength and the hardness of the copper alloy are improved, on the other hand, Fe can form Fe simple substance or separate out Fe-P compound with P, and the material matrix is purified, so that the material strength is further improved under the condition of not influencing the electric conductivity. However, the content of Fe element in the brass alloy is generally not more than 2.0wt%, otherwise, the Fe-rich phase segregation is caused, the corrosion resistance of the brass alloy is reduced, and meanwhile, the difficulty is increased during casting, and the yield is reduced. When the Fe content is less than 0.01 wt%, precipitated phases are insufficient, and the material performance is not improved enough, so that the Fe content is controlled to be 0.01-2.0 wt%, the phenomenon of iron segregation can be avoided, the casting difficulty is reduced, and the grain refining effect is optimal.
The copper alloy material of the invention is added with 0.01-0.5 wt% of P, and the P element is a good degasifier and deoxidizer of the copper alloy. In the invention, P and Fe can form Fe-P precipitated phase, and the precipitated phase can effectively improve the strength of the material and simultaneously moderately improve the recrystallization temperature and the electric conductivity of the material. P has the ability of promoting the copper solution to flow in the copper solution, so that the Fe-P precipitated phase is distributed more uniformly and dispersedly. When the amount of P added is less than 0.01 wt%, an effective compound cannot be formed, and when it exceeds 0.5wt%, not only an adverse effect on the electrical conductivity is increased but also the plasticity of the material is easily lowered. Therefore, the content of P is controlled to be 0.01 to 0.5 wt%.
Preferably, in the alloy of the invention, the weight percentages of Fe and P satisfy: Fe/P is more than or equal to 5 and less than or equal to 100. According to the invention, elements such as Fe and P are simultaneously added on a Cu-Zn-Sn matrix, wherein Fe is beneficial to improving the strength, and Fe-P compound and Fe simple substance are precipitated through aging precipitation treatment, so that the recrystallization temperature of the copper alloy is improved, the dislocation migration is hindered, the material is strengthened, and the matrix is purified by the precipitation of the Fe-P compound, the conductivity of the material is improved, but excessive Fe is easy to form an iron-rich phase in the alloy, so that the surface peeling defect of the material is easy to cause, or the mechanical property or the bending property of the material is weakened; the P alloy element forms a Fe-P compound refined grain phase with Fe on one hand, and effectively deoxidizes the copper matrix on the other hand, so that the fluidity of the alloy is increased, hydrogen embrittlement is prevented, and the surface performance of the copper alloy is improved, but the conductivity of the copper matrix is reduced by P, and therefore, the using amounts of Fe and P are closely related to the quality of the material performance. In the range of Fe and P, the preferable Fe/P ratio is more than or equal to 5 and less than or equal to 100, and P can be promoted to be dispersed and precipitated as a Fe-P second phase in the range, so that the precipitation amount of the Fe simple substance is indirectly controlled, and the precipitation phase aggregation caused by excessive precipitation of the Fe simple substance is prevented. When Fe/P is more than or equal to 100, Fe and P can not fully react to generate less Fe-P precipitated phases, and simultaneously, Fe simple substances are precipitated too much and are aggregated on the surface of the material, so that the precipitated phases are too coarse and are easy to become fracture starting points in the stretching process to influence the performance of the material, and when Fe/P is less than or equal to 5, free P exists in the alloy to seriously reduce the conductivity of the material, so the weight percentage of Fe and P meets the following requirements: Fe/P is more than or equal to 5 and less than or equal to 100.
The precipitated phases comprise Fe simple substance and Fe-P compound, and the precipitated phases are dispersed and precipitated in the material, and the average grain diameter of the precipitated phases is less than or equal to 0.6 mu m. According to the invention, elements such as Fe and P are added, and a Fe simple substance and a Fe-P compound are precipitated through solid solution aging treatment, so that the existence of precipitated phases in the alloy improves the recrystallization temperature of the copper alloy, hinders dislocation migration, and strengthens the material; on the other hand, the Fe-P compound is precipitated to purify the matrix, so that the conductivity of the material is improved, and the alloy strength is further improved. The grain size of the precipitated phase has an important influence on the material performance, the finer and dispersed the precipitated phase is, the better the strength and bending processing performance of the alloy is, and the too coarse the precipitated phase is, the performance of the material is reduced, and the precipitated phase is easy to become a fracture point during stretching to influence the use of the material. Research shows that when the average grain size of the precipitated phase is larger than 0.6 μm, the material performance is reduced, and the material is easy to break in the using process, so the invention controls the average grain size of the precipitated phase to be less than or equal to 0.6 μm.
The invention controls the crystal face intensity of {111}, {200}, {220}, and {311}, so that the crystal face intensity meets the conditions that { I {111} + I {311} +0.5 } I {200} }/I {220} < 5. The yield strength and the bending processability of the material play a crucial role in material application, but in experiments, the yield strength of the material is usually improved along with the bending processability, so that the yield strength and the bending processability of the material are balanced, which is particularly important. The invention mainly controls the crystal face orientation of the material through the processes of solid solution aging, rolling and the like. In the invention, the X-ray diffraction crystal planes of the copper alloy strip in the range of 0 < 2 theta < 90 DEG are mainly {111}, {200}, {220}, and {311}, wherein the changes of the crystal planes {111}, {200}, {220}, and {311} have great influence on the yield strength and bending processability of the material, so that the crystal plane strengths of the {111}, {200}, {220}, and {311} are controlled in order to realize the balance of the yield strength and the bending processability. The invention carries out tests through different processes, and analyzes and discovers the results: the {311} crystal face has an important influence on the yield strength of the material, the diffraction strength of the {311} crystal face is enhanced along with the increase of the cold-working deformation rate, the yield strength of the material is also obviously increased, but the increase of the {220} crystal face is unfavorable for the bending processing performance of the material; the {200} crystal face has an important influence on the bending processing performance of the material, the diffraction intensity of the crystal face is enhanced after solid solution, the bending processing performance of the material is good, but the increase of the {200} crystal face is not beneficial to the increase of the yield strength of the material; after the solution treatment, the {111} crystal plane diffraction peak is enhanced, and the bending performance of the material is good, but with the increase of the cold working deformation rate, the {311} crystal plane is increased, the {200} crystal plane is gradually decreased, the {111} crystal plane is decreased first and then increased, and the bending performance of the material is also reduced. The control of the crystal plane orientation of {111}, {200}, {220} and {311} plays an important role in obtaining ideal bending processability and yield strength (the value R/t in the GW direction is less than or equal to 1, the value R/t in the BW direction is less than or equal to 2 and the yield strength is more than or equal to 500MPa), and the crystal plane orientation of the copper alloy provided by the invention meets the following requirements: 0.2 ≦ { I {111} + I {311} +0.5 ≦ I {200} }/I {220} ≦ 5, where I {111} is the X-ray diffraction intensity of the {111} crystal plane, I {200} is the X-ray diffraction intensity of the {200} crystal plane, I {220} is the X-ray diffraction intensity of the {220} crystal plane, and I {311} is the X-ray diffraction intensity of the {311} crystal plane. When { I {111} + I {311} +0.5 x I {200} }/I {220} < 0.2, the yield strength of the alloy is below 500MPa, the value R/t in the GW direction is less than or equal to 1 in a 90-degree bending test, and the value R/t in the BW direction is less than or equal to 1; when { I {111} + I {311} + 0.5X I {200} }/I {220} > 5, the yield strength of the alloy is 500MPa or more, but the bending workability is not satisfactory when the value R/t > 2 in the BW direction in the 90 DEG bending test is used, and therefore, in order to achieve both the yield strength and the bending workability, I {111}, I {200}, I {220} and I {311} are defined to be 0.2 ≦ { I {111} + I {311} + 0.5X I {200} }/I {220} ≦ 5.
The copper alloy material also contains 0.001-1.0 wt% of Ni and/or 0.001-1.0 wt% of Co.
Ni can be infinitely dissolved in Cu to improve the strength of the alloy when dissolved in a copper matrix, and the influence of Ni on the conductivity of the copper alloy is smaller than that of other elements such as Sn, P and the like. Meanwhile, Ni and P elements can form a precipitated phase of a Ni-P compound through heat treatment, so that the strength and the conductivity of the alloy are improved. However, when the Ni content is too large, the conductivity is greatly reduced, and the material requirement is not met, so the Ni content is controlled to be 0.001-1.0 wt% in the invention.
Co can be dissolved in a matrix in a solid state, the strength of the material is improved by the solid solution strengthening effect, Co and P form a CoP phase, the influence on the electric conductivity is small when the strength of the alloy is improved by the precipitation strengthening phase, but when the content of Co is excessively added, Co elements remained in the matrix are increased, the electric conductivity of the alloy is influenced, and the bending performance is unfavorable. Therefore, the invention controls the Co content to be 0.001-1.0 wt% of Co.
The copper alloy can also comprise at least one element of Al, Mg, Cr, Ti, Zr, B, Ag, Mn, Si and RE with the total amount not more than 2.0wt%, wherein the Al, Cr, Zr, Ti and RE have the function of improving the strength, the addition of the B is favorable for refining crystal grains, the addition of the element can form a large amount of fine and dispersed crystal nucleation in the process of solution solidification to play a role of refining the crystal grains, the Mn can play a role of deoxidation in the smelting process to improve the purity of the alloy, the hot workability of the alloy can be improved, the basic mechanical property of the alloy is improved, the elastic modulus of the alloy is reduced, the improvement of the solid solution strengthening effect of the Ag is realized under the condition that the electric conductivity is not greatly reduced, but the addition of the elements is excessive, the material property is reduced, the improvement of the comprehensive performance of the material is not favorable, and the Si is mainly used for improving the casting fluidity of the alloy, the oxidation of copper liquid in the casting process is reduced, the forming performance is improved, and Mg has the effects of deoxidizing, desulfurizing and improving the stress relaxation resistance of the alloy, but the addition of the elements is excessive.
In conclusion, the invention takes Cu-Zn-Sn as a matrix, and adds elements such as Fe, P and the like, by combining solid solution strengthening and aging strengthening, on one hand, the strength of the material is improved and the crystal grains are refined by precipitating Fe simple substance and Fe-P compound, on the other hand, by controlling the ratio of Fe and P and the processing technology, the precipitated phase grain size and the crystal face orientation are controlled, so that the balance of conductivity, yield strength and bending processing performance is realized, the material performance of yield strength more than or equal to 500MPa, conductivity more than or equal to 30% IACS, excellent bending processing performance (the value R/t in the GW direction is less than or equal to 1, the value R/t in the BW direction is less than or equal to 2) and excellent stress relaxation resistance (the temperature is kept at 150 ℃ for 1000 hours, and the residual stress is more than or equal to 70%) is met, and the conductive element can be suitable for connectors of semiconductor devices, other terminals, movable conductive sheets of electromagnetic relays, lead frames and other electronic and electrical equipment.
The copper alloy can be processed into plate strips, bars, wires and the like according to different application requirements. Taking a plate and a strip as an example, the preparation process of the copper alloy comprises the following steps:
(1) casting: melting the copper alloy raw material, and then producing an ingot by horizontal continuous casting or semi-continuous casting, wherein the casting temperature is controlled to be 1050-1300 ℃.
(2) Hot rolling: in order to ensure that coarse precipitated phases existing in the cast ingot are dissolved in the matrix again in a solid mode, the hot rolling temperature of the alloy is controlled to be 750-900 ℃, the heat preservation time is 3-6 h, the alloy can achieve the purpose of homogenization under the process, in order to reduce the precipitation of phase particles after hot rolling as much as possible, the final rolling temperature of the alloy is controlled to be more than 650 ℃, and online water cooling is carried out after the hot rolling. The rolling rate is more than 85%.
(3) Milling a surface: the surface oxide skin is thicker after hot rolling, and the upper and lower milling surfaces of the hot rolled plate are 0.5-1.0 mm in order to ensure the surface quality of the later-stage strip.
(4) Primary cold rolling: in the cold rolling process, the total rolling rate is required to be more than or equal to 70 percent, so that the later solid solution process is facilitated, and an ideal recrystallization structure is formed.
(5) Solution treatment/aging treatment: the method and the process of the solution treatment or the aging treatment can be selected according to the configuration and the requirements of different equipment.
The solution treatment is a heat treatment for forming a solid solution of solute elements again in the matrix and performing recrystallization. After the copper alloy is subjected to solution treatment, the diffraction intensity of crystal faces of 111 and 200 is increased, the plasticity of the alloy can be improved, and a foundation is provided for subsequent cold working deformation. The solution treatment is preferably performed at a temperature of 700 to 980 ℃ for 1min to 1h, more preferably 10min to 50 min. If the solution treatment temperature is lower than 700 ℃, recrystallization of the alloy is incomplete, the difficulty of subsequent processing is increased, and the re-dissolution of solute elements in solid solution is insufficient. Further, if the solution treatment temperature is higher than 980 ℃, crystal grains become coarse, and the bending workability of the material tends to be poor.
The aging treatment mainly achieves the purposes of second phase precipitation and tissue softening. Compared with the cold rolled state, the intensity of the diffraction peak of the aged alloy along the crystal face {200} of the rolling face is increased by more than 30%, and the plasticity of the alloy is improved. The aging temperature is controlled to be 350-600 ℃, the holding time is 6-12 h, more preferably, the temperature is controlled to be 400-550 ℃, and the holding time is 4-10 h, so that Fe and P form a compound which is dispersed and precipitated in a copper matrix phase in a micro shape, and the compound can have high strength and excellent bending processability, if the aging temperature is too high and the time is long, precipitates are coarse, the particle size of the precipitates cannot be effectively controlled, and the bending processability is deteriorated; on the contrary, if the temperature is low and the time is short, the precipitation process is not sufficiently performed, and the bending workability and the material strength cannot reach the expected values.
(6) Secondary cold rolling: the copper alloy material after heat treatment is subjected to cold rolling, and as the cold rolling is carried out, the diffraction peak intensity of the {111} plane and the {311} plane along the rolling surface is increased, the energy storage of the material and the lattice defects which are beneficial to the continuous precipitation of precipitates are increased, so that the continuous desolventization and the uniform and fine distribution of the precipitates can be promoted in the subsequent aging treatment, and the electric conductivity, the yield strength and the bending processability of the material are improved. Therefore, the secondary cold rolling has a strain amount of 60% or more, and the strain amount is too small, resulting in poor uniform dispersion of precipitated phases and small precipitated phases, which is not favorable for the completion of the later-stage aging structure complete recrystallization, and is unfavorable for the bending of the final strip.
(7) Aging treatment: the key process for realizing precipitation strengthening of the alloy is that the aging temperature is controlled to be 350-550 ℃, the heat preservation time is 6-12 hours, and the preferable aging temperature is controlled to be 400-500 ℃ and the time is 4-10 hours. High temperature is beneficial to complete recrystallization of the structure and precipitation of a second phase, but the problems of precipitate aggregation and overaging are easy to occur when the temperature is too high. The low-temperature aging is not beneficial to the recrystallization of the strip and the precipitation of a second phase, and has great influence on the bending processing of the strip.
(8) And (3) cold rolling for three times: the cold deformation applied to the aged alloy is beneficial to further improving the strength of the strip, but the deformation amount is not too large, obvious anisotropy is easily formed due to the too large deformation amount, the diffraction strength of the {220} crystal face is increased, and the bending processing energy of the strip in the BW direction is not beneficial. As the working ratio increases, dislocations accumulate near the precipitates, the deformation compatibility of the crystal deteriorates, the precipitates are likely to be a crack source during bending deformation, and the bending properties of the alloy deteriorate. Wherein the BW direction deterioration is more pronounced. Therefore, the deformation amount is controlled to 60% or less.
(9) Low-temperature annealing: for copper alloy with high zinc content, low-temperature annealing after cold deformation is beneficial to improving yield strength and bending processing performance, and simultaneously, a small amount of compound is separated out to improve the conductivity of the alloy and release certain residual stress. Therefore, the copper alloy plate after the third cold rolling is annealed at low temperature, and the low-temperature annealing temperature is controlled between 200 ℃ and 250 ℃ and is kept for 1h to 5 h. When the temperature is too high, the copper alloy plate is softened in a short time, the alloy strength characteristic is reduced, and the use is not facilitated. If the temperature is too low, the effect of improving the above characteristics cannot be sufficiently obtained.
Compared with the prior art, the invention has the advantages that:
(1) the invention adds elements such as Fe, P and the like on a Cu-Zn-Sn matrix, and controls the weight ratio of Fe to P to satisfy: Fe/P is more than or equal to 5 and less than or equal to 100, so that a proper amount of Fe simple substance and Fe-P precipitated phase are generated in the alloy, and the precipitated phase is dispersed and precipitated.
(2) In order to improve and balance the bending workability and yield strength of the material, the present invention defines the crystal orientations of I {111}, I {200}, I {220} and I {311} which are determined by the X-ray diffraction intensity. The X-ray diffraction intensity of the crystal face of the copper alloy meets the following requirements: the alloy material has the advantages that { I {111} + I {311} +0.5 { I {200} }/I {220} ≦ 5 is larger than or equal to 0.2, so that the material realizes excellent comprehensive performance of the copper alloy including yield strength, conductivity and bending processability;
(3) the average grain diameter of the alloy Fe simple substance and the Fe-P compound is less than or equal to 0.6 mu m;
(4) the copper alloy can realize the yield strength of more than or equal to 500MPa and the electric conductivity of more than or equal to 30 percent IACS; the 90 ° bend workability of the produced strip was: the value R/t in the GW direction is less than or equal to 1, and the value R/t in the BW direction is less than or equal to 2; the heat preservation is carried out for 1000 hours at the temperature of 150 ℃, the residual stress is more than 70 percent, and the stress relaxation resistance is excellent;
(5) the invention solves the problem of recycling various wastes such as tin-phosphor bronze, iron bronze, brass and the like, improves the material utilization rate, saves the material cost and promotes the recycling of the wastes.
(6) The alloy of the present invention can be processed into products such as a bar wire, a plate strip, etc., and widely used as a conductive element for electronic and electrical equipment such as a connector of a semiconductor device, other terminals, or a movable conductive sheet or a lead frame of an electromagnetic relay.
Drawings
FIG. 1 is a 1000 Xmetallographic photograph obtained in example 1 of the present invention, in which black dots indicate precipitated phases of the present copper alloy and the other phases indicate a matrix structure. As can be seen from FIG. 1, the precipitated phase of the copper alloy is dispersed uniformly, the grain size of the precipitated phase is obviously less than 0.6 μm, and the horizontal line at the lower right corner is a size scale.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
The compositions in Table 1 were mixed and melted at 1150 ℃ to produce ingots of 170mm by 320 mm. Keeping the temperature of the cast ingot at 850 ℃ for 5 hours, and then carrying out hot rolling to enable the thickness of the cast ingot to be 16.5 mm; then, milling the surface to enable the thickness of the plate to reach 15mm, and cold-rolling the plate into a plate with the thickness of 2mm at one time; then heating the cold-rolled plate to 440 ℃, preserving heat for 8 hours, and carrying out first aging; carrying out secondary cold rolling on the material subjected to primary aging until the material is 0.35mm, and then carrying out secondary aging treatment for keeping the temperature at 400 ℃ for 8 hours; finally, carrying out finish cold rolling, namely three times of cold rolling, wherein the target plate thickness is 0.2 mm; after the finish cold rolling, the temperature is kept for 4 hours at 210 ℃ for low-temperature annealing, and strip samples are obtained.
For 20 prepared example alloys, mechanical properties, conductivity, stress relaxation resistance, bending properties, and crystal orientation were measured, respectively.
Tensile test at room temperature according to GB/T228.1-2010 Metal Material tensile test part 1: room temperature test method was performed on an electronic universal mechanical property tester using a tape head specimen having a width of 12.5mm and a drawing speed of 5 mm/min.
Conductivity testing according to GB/T3048.2-2007 test method for electric properties of wires and cables part 2: resistivity test of metal material, the tester is ZFD microcomputer bridge DC resistance tester, sample width is 20mm, length is 500 mm.
The stress relaxation resistance test is as per JCBA T309: 2004 copper and copper alloy thin plate strip bending stress relaxation test method, sampling along the direction parallel to the rolling direction, the width of the sample is 10mm, the length is 100mm, the initial loading stress value is 70% of 0.2% yield strength, the test temperature is 150 ℃, and the time is 1000 h.
The bending performance test is carried out on a bending tester according to the bending test method of GBT 232-.
The X-ray diffraction intensities I {111}, I {200}, I {220} and I {311} of the {111}, {200}, {220} and {311} planes of each sample surface were measured, respectively, to obtain a value of 0.2. ltoreq. { I {111} + I {311} + 0.5. multidot. I {200} }/I {220 }. ltoreq.5.
The ingredients and performance results for each example and comparative example are shown in tables 1 and 2.
TABLE 1 ingredients of examples and comparative examples
TABLE 2 results of performance test of examples and comparative examples
Claims (6)
1. The copper alloy for the electronic and electrical equipment is characterized by comprising the following components in parts by weight: 5.01 to 15.0wt% of Zn, 0.1 to 2.0wt% of Sn, 0.61 to 2.0wt% of Fe, 0.01 to 0.5wt% of P, and the balance of Cu and unavoidable impurities; the X-ray diffraction intensity of the crystal face of the copper alloy meets the following requirements: 0.2 ≦ { I {111} + I {311} +0.5 ≦ I {200} }/I {220} ≦ 5; wherein:
i {111} is the X-ray diffraction intensity of the {111} crystal plane;
i {200} is the X-ray diffraction intensity of the {200} crystal plane;
i {220} is the X-ray diffraction intensity of the {220} crystal plane;
i {311} is the X-ray diffraction intensity of the {311} crystal plane;
the yield strength of the copper alloy is more than or equal to 500MPa, the electric conductivity is more than or equal to 30% IACS, and the 90-degree bending processing performance of the strip of the copper alloy is as follows: the value R/t in the GW direction is less than or equal to 1, and the value R/t in the BW direction is less than or equal to 2.
2. The copper alloy for electronic and electrical equipment according to claim 1, wherein the weight percentages of Fe and P are as follows: Fe/P is more than or equal to 5 and less than or equal to 100.
3. The copper alloy for electronic and electrical equipment according to claim 2, wherein the average grain size of precipitated phases of the copper alloy is 0.6 μm or less.
4. The copper alloy for electronic and electrical equipment according to any one of claims 1 to 3, further comprising 0.001 to 1.0wt% of Ni and/or 0.001 to 1.0wt% of Co.
5. The copper alloy for electrical and electronic equipment as claimed in any one of claims 1 to 3, wherein the copper alloy further comprises at least one element selected from the group consisting of Al, Cr, Ti, Zr, B, Ag, Mn, Mg, Si and RE in a total amount of not more than 2.0wt% in terms of the composition in percentage by weight.
6. Use of the copper alloy for electronic and electrical equipment according to any one of claims 1 to 3 as a raw material for producing a connector, a terminal, an electromagnetic relay lead or a lead frame of a semiconductor device.
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| CN109735739B (en) * | 2019-03-01 | 2020-08-07 | 东莞市时运佳实业投资有限公司 | Material for shielding sheet, preparation method of material and shielding sheet |
| CN112063883B (en) * | 2020-09-16 | 2021-12-03 | 宁波博威合金材料股份有限公司 | Aluminum bronze and preparation method thereof |
| CN114347586B (en) * | 2022-01-25 | 2024-05-03 | 宁波博威合金材料股份有限公司 | Copper-copper composite strip, preparation method and application |
| CN114507828B (en) * | 2022-02-17 | 2022-12-02 | 贵溪奥泰铜业有限公司 | Phosphor bronze alloy with excellent conductivity and production method thereof |
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