CN109309026A - Wafer method for adhering film and jig - Google Patents
Wafer method for adhering film and jig Download PDFInfo
- Publication number
- CN109309026A CN109309026A CN201710630622.6A CN201710630622A CN109309026A CN 109309026 A CN109309026 A CN 109309026A CN 201710630622 A CN201710630622 A CN 201710630622A CN 109309026 A CN109309026 A CN 109309026A
- Authority
- CN
- China
- Prior art keywords
- wafer
- loop
- lining paper
- pad pasting
- limit plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a kind of wafer method for adhering film and jig.Wherein, which is applied to the wafer film adhering jig comprising pedestal, lining paper, loop and the loop limit plate with hollow-out parts, and wafer method for adhering film includes: that lining paper is layed in pedestal；Loop, loop limit plate and wafer with pad pasting are placed in lining paper；Wherein, wafer is located in loop, and loop is bonded with the edge of hollow-out parts.By wafer method for adhering film provided by the embodiments of the present application and jig, the working efficiency and precision of wafer pad pasting can be improved.
Description
Technical field
This application involves technical field of semiconductors more particularly to a kind of wafer method for adhering film and jig.
Background technique
Wafer cutting is essential process in semiconductor manufacturing process, and the crystal grain (chip) after cutting can add
Work is fabricated to various circuit component structures, and becomes the IC products for having specific electrical functionality.
It needs before wafer cutting first to wafer pad pasting, the chip after just can guarantee cutting so is both completely separated
It opens, and does not fall.And existing wafer film process is generally divided into automatic coating and artificial pad pasting.Automatic coating needs are purchased complete
Automatic equipment, it is expensive, at high cost.Therefore general enterprises can select artificial pad pasting one to reduce cost.
Existing artificial pad pasting efficiency is lower, and is easy to patch partially, not only causes the waste of pad pasting, is also easy to cause to draw
The problems such as edge is locally escaped being classified when piece, and postorder can not encapsulate.
Summary of the invention
The application provides a kind of wafer method for adhering film and jig.The working efficiency and precision of wafer pad pasting can be improved.
A kind of wafer method for adhering film is provided according to the first aspect of the embodiment of the present application.The wafer method for adhering film is applied to
Wafer film adhering jig comprising pedestal, lining paper, loop and the loop limit plate with hollow-out parts, the wafer method for adhering film packet
It includes:
The lining paper is layed in the pedestal；By the loop with pad pasting, the loop limit plate and wafer
It is placed in the lining paper；Wherein, the wafer is located in the loop, and the loop is bonded with the edge of the hollow-out parts.
Further, the wafer film adhering jig further includes wafer positioning plate, and the wafer positioning plate has and the crystalline substance
The identical through-hole of circle size；
It is described the loop with pad pasting, the loop limit plate and wafer are placed in the lining paper before, also
It include: the wafer positioning plate to be placed in the lining paper, and the wafer is drawn on the lining paper according to the through-hole
Position line；It is described that the loop with pad pasting, the loop limit plate and wafer are placed in the lining paper, comprising: will
The loop with pad pasting, the loop limit plate and wafer are placed in the lining paper, and the edge of the wafer with extremely
The fitting of position line described in small part.
Further, the lining paper has shiny surface and rough surface, described to be drawn on the lining paper according to the through-hole
The position line of the wafer, comprising: draw the position line of the wafer on the rough surface of the lining paper according to the through-hole；
It is described that the loop with pad pasting, the loop limit plate and wafer are placed in the lining paper, comprising: will
The loop with pad pasting, the loop limit plate and wafer are placed in the shiny surface of the lining paper.
Further, described that the loop with pad pasting, the loop limit plate and wafer are placed in the lining
Paper, comprising: the loop limit plate with pad pasting is placed in the lining paper；The wafer is placed in the lining paper and position
In the hollow-out parts；By pad pasting it is smooth be covered on the loop；The back side of the wafer is covered in the patch of the loop
On film.
Further, there are vacuum absorption holes on the pedestal, it is described that the lining paper is layed in the pedestal, comprising:
The lining paper is adsorbed in the pedestal.
A kind of wafer film adhering jig is provided according to the second aspect of the embodiment of the present application.The wafer film adhering jig includes:
Pedestal, lining paper, loop and the loop limit plate with hollow-out parts；The outer ring of the marginal dimension of the hollow-out parts and the loop
Size is coincide, and the interior ring size of the loop is greater than the size of the wafer.
Further, the wafer film adhering jig further include: wafer positioning plate；The wafer positioning plate has and the crystalline substance
The identical through-hole of circle size, for drawing the position line of the wafer on the lining paper according to the through-hole.
Further, the lining paper has shiny surface and rough surface, and the rough surface is described for drawing the position line
Shiny surface is for carrying the loop, loop limit plate and the wafer.
Further, the lining paper is leaching membrane paper
Further, there are vacuum absorption holes, for the lining paper to be adsorbed in the pedestal on the pedestal.
The wafer method for adhering film and jig of the embodiment of the present application, due to the marginal dimension and piece of the hollow-out parts of loop limit plate
The outer ring size of ring is coincide, and loop limit plate can be used and position to loop, convenient for carrying out pad pasting operation to wafer.And
And due to having pad pasting on loop, the empty film on loop can be directly covered on wafer when carrying out pad pasting to wafer, no
It is easy patch partially, the precision of pad pasting can be improved.In addition, convenient for removing wafer after wafer pad pasting, can be mentioned in this way by loop
The efficiency of high pad pasting.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The application can be limited.
Detailed description of the invention
Fig. 1 is a kind of flow chart of wafer method for adhering film shown in one exemplary embodiment of the application；
Fig. 2 is the flow chart of another wafer method for adhering film shown in one exemplary embodiment of the application；
Fig. 3 is a kind of structural schematic diagram of wafer film adhering jig shown in one exemplary embodiment of the application；
Fig. 4 is a kind of structural schematic diagram of loop shown in one exemplary embodiment of the application；
Fig. 5 is a kind of structural schematic diagram of wafer positioning plate shown in one exemplary embodiment of the application；
Fig. 6 is the structural schematic diagram of another wafer positioning plate shown in one exemplary embodiment of the application.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the application.
It is only to be not intended to be limiting the application merely for for the purpose of describing particular embodiments in term used in this application.
It is also intended in the application and the "an" of singular used in the attached claims, " described " and "the" including majority
Form, unless the context clearly indicates other meaning.It is also understood that term "and/or" used herein refers to and wraps
It may be combined containing one or more associated any or all of project listed.
With reference to the accompanying drawing, the wafer method for adhering film and jig of the embodiment of the present application are described in detail.Do not conflicting
In the case where, the feature in following embodiment and embodiment can be combined with each other.
As shown in Figure 1, Fig. 1 is a kind of wafer method for adhering film that one exemplary embodiment of the application provides, this method application
In the wafer film adhering jig comprising pedestal, lining paper, loop and the loop limit plate with hollow-out parts.The method comprising the steps of 11
With step 12.As shown in Figure 1, specific as follows:
In a step 11, lining paper is layed in pedestal.
In step 12, loop, loop limit plate and wafer with pad pasting are placed in lining paper；Wherein, wafer position
In in loop, and loop is bonded with the edge of hollow-out parts.
In the embodiment of the present application, lining paper being layed in pedestal can adhere on pedestal to avoid when carrying out pad pasting to wafer,
It thereby may be ensured that the cleannes of pedestal.In an optional embodiment, there are vacuum absorption holes on pedestal, be laid with by lining paper
When pedestal, lining paper can be adsorbed in by pedestal by the suction-operated of vacuum absorption holes, so that the paving that lining paper is more firm
It is located on pedestal.It, can when loop, loop limit plate and wafer with pad pasting are placed in lining paper in the embodiment of the present application
With first film releasing ring limit plate, then wafer is put, then puts the loop with pad pasting.Wafer, then film releasing ring limit plate can also be first put,
Then the loop with pad pasting is put, so that the empty film on loop is covered in backside of wafer.To with patch in the embodiment of the present application
The placement order of the loop of film, loop limit plate and wafer is not construed as limiting.Due in the embodiment of the present application, when having pad pasting
Loop, loop limit plate and wafer when being placed in lining paper, wafer is located in loop, and loop and the edge of hollow-out parts paste
It closes, in this way when to wafer pad pasting, loop limit plate can be used, loop is positioned, convenient for carrying out pad pasting behaviour to wafer
Make, it is ensured that the precision of pad pasting.Moreover, the effect of pad pasting can be improved in this way convenient for removing wafer after wafer pad pasting by loop
Rate.In addition, the empty film on loop can be directly covered in wafer when carrying out pad pasting to wafer due to having pad pasting on loop
On, it is not easy to patch partially, can be further improved the precision of pad pasting.
In an optional embodiment, wafer film adhering jig further includes wafer positioning plate, and wafer positioning plate has and wafer
The identical through-hole of size.In the present embodiment, by the loop, loop limit plate and wafer that have pad pasting be placed in lining paper it
Before, first wafer positioning plate can be placed on lining paper, the position line of wafer is then drawn according to the through-hole on wafer positioning plate.This
Sample can be placed when wafer to be placed on lining paper according to the position line, so that the edge of wafer and at least partly position line
Fitting.It is relatively more fixed relative to the position of loop and loop limit plate to make wafer in this way, so that the positioning of wafer is more accurate,
Further increase the precision of pad pasting.
In another optional embodiment, lining paper can have shiny surface and rough surface, which can be lamination face,
Rough surface can be paper fibre.In the present embodiment, when drawing the position line of wafer according to the through-hole on wafer positioning plate,
The position line of wafer can be drawn on the rough surface of lining paper, then by lining paper overturning make it is smooth up, then pad pasting will be had
Loop, loop limit plate and wafer be placed on the shiny surface of lining paper.In the present embodiment, since rough surface has infiltration
Effect, therefore the position line drawn in rough surface can be shown in shiny surface, and shiny surface will not be made by pen and ink again
Pollution.When wafer to be placed on the shiny surface of lining paper, wafer can be placed according to the position of position line, so that wafer
Edge is bonded with position line.Both make the positioning of wafer more accurate in this way, and further increased the precision of pad pasting, and can guarantee crystalline substance
Round clean degree.
Fig. 2 is another wafer method for adhering film that one exemplary embodiment of the application provides, including step 21- step 25.
As shown in Fig. 2, specific as follows:
In step 21, lining paper is layed in pedestal.
In step 22, loop limit plate is placed in lining paper.
In step 23, wafer is placed in lining paper and is located in hollow-out parts.
In step 24, by pad pasting it is smooth be covered on loop.
In step 25, the back side of wafer is covered on the pad pasting of loop.
In the present embodiment, loop limit plate first can be placed in lining paper, then places wafer, loop is then sticked into patch
It is placed in the hollow-out parts of loop limit plate again after film, in this way after loop is placed, loop is bonded with the edge of hollow-out parts,
Wafer is located in loop, and the back side of wafer is covered on the pad pasting of loop.The work of pad pasting is fixed and supported since loop plays
With allowing the pad pasting at the back side for being attached to wafer to keep smooth, can achieve the effect of easily and fast pad pasting, improve pad pasting
Efficiency.On the other hand, when pad pasting to be attached on loop, pad pasting can be cut according to the outer ring edge of loop, and on loop
Pad pasting the back side of the wafer to pad pasting can be completely covered, it is possible to reduce the waste of pad pasting, save the cost improve the benefit of pad pasting
With rate.
Corresponding with the embodiment of aforementioned wafer method for adhering film, present invention also provides the embodiments of wafer film adhering jig.
The embodiment of the application wafer film adhering jig can be applied on wafer method for adhering film.
Referring to FIG. 3, Fig. 3 is a kind of structural representation of wafer film adhering jig shown in one exemplary embodiment of the application
Figure.As shown in figure 3, wafer film adhering jig includes pedestal 1, lining paper 2, loop 3 and the loop limit plate 4 with hollow-out parts 41.
The marginal dimension of hollow-out parts 41 and the outer ring size of loop 3 are coincide, and the interior ring size of loop 3 is greater than the size of wafer.
In the embodiment of the present application, since the outer ring size of the marginal dimension of hollow-out parts 41 and loop 3 is coincide, loop 3
Interior ring size is greater than the size of wafer, so wafer is located at loop 3 when carrying out pad pasting to wafer using wafer film adhering jig
It is interior, and the outer ring of loop 3 is bonded with the edge of hollow-out parts 41.Loop limit plate 4 can be used in this way to position loop, just
In carrying out pad pasting operation to wafer, pad pasting precision is improved.Moreover, by loop 3 convenient for removing wafer after wafer pad pasting, in this way
The efficiency of pad pasting can be improved.In an optional embodiment, the outer ring of loop 3 can be circle, as shown in Figure 3.Another
In one optional embodiment, the outer ring of loop 3 can be the circle including four horizontal edges.That is, the outer ring of loop 3 is based on circle
The polygon for symmetrically cutting off four circular arcs therein after eight equal parts and being formed, as shown in Figure 4.In this way after wafer pad pasting,
In the subsequent processing process of wafer, wafer can be made to adapt to the fixation of all directions.
In an optional embodiment, wafer film adhering jig can also include wafer positioning plate 5.As shown in Figure 5, wafer
Positioning plate 5 has the through-hole 51 coincideing with wafer size, for drawing the position line of wafer on lining paper 2 according to the through-hole 51.
For example, the through-hole 51 of wafer positioning plate 5 is the hole suitable for 5 cun of wafers when wafer is 5 cun, then determined according to what through-hole 51 was drawn
Bit line is the position line of 5 cun of wafers.In this way, when carrying out pad pasting to wafer wafer can be placed according to the position line, so that brilliant
Round edge is bonded at least partly position line.Make wafer more solid relative to the position of loop 3 and loop limit plate 4 in this way
It is fixed, so that the positioning of wafer is more accurate, further increase the precision of pad pasting.
In the present embodiment, the shape of through-hole 51 can be the circle (as shown in Figure 5) comprising a straight flange, through-hole 51
Shape corresponds to the shape of wafer, then is also the circle comprising a straight flange according to the position line that through-hole 51 is drawn.According to positioning
When line places wafer, the straight flange that the straight flange of wafer can be aligned in position line, so that the edge of wafer be made to be bonded with position line.
In another optional embodiment, the shape of through-hole 51 can be the circle (as shown in Figure 6) comprising four straight flanges,
In the present embodiment, it is also the circle comprising four straight flanges according to the position line that through-hole 51 is drawn, wafer is being placed according to position line
When, it can be according to wafer manufacturing direction, by one of straight flange in the straight flange alignment position line of wafer, to make its of wafer
He is bonded at edge with the round edge of position line, to achieve positioning.In the present embodiment, the same wafer positioning can be used
The wafer of 5 pairs of plate different production demands positions, and improves the utilization rate of wafer film adhering jig.
In an optional embodiment, the lining paper 2 in the present embodiment can be leaching membrane paper, and the film surface of leaching membrane paper is for holding
Slide glass ring 3, loop limit plate 4 and wafer.In this way, when carrying out pad pasting to wafer, even if pad pasting is sticked on lining paper 2,
Also easily pad pasting and lining paper 2 are peeled away, lining paper 2 can be enabled to be used for multiple times, improve the utilization of wafer film adhering jig
Rate.
In another optional embodiment, lining paper 2 has shiny surface and rough surface, and rough surface is for drawing position line, light
Sliding surface is for carrying loop 3, loop limit plate 4 and wafer.In the present embodiment, since rough surface has osmosis, because
This can show in the position line that rough surface is drawn in shiny surface, and shiny surface will not be made by the pollution of pen and ink again.
When carrying out pad pasting to wafer, wafer can be placed according to the position line, both make the positioning of wafer more accurate in this way, into one
Step improves the precision of pad pasting, and can guarantee the clean degree of wafer.
In an optional embodiment, referring to FIG. 3, having vacuum absorption holes 11 on pedestal 1.For lining paper 2 to be adsorbed
In on pedestal 1, it is laid on pedestal 1 so that lining paper 2 is more firm.
In another optional embodiment, pedestal 1, lining paper 2, loop limit plate 4 and wafer positioning plate 5 all can be four
Rectangular, and the length on corresponding side is identical, the through-hole 51 in hollow-out parts 41 and wafer positioning plate 5 on loop limit plate 4 can be with
It is centrally-disposed, so that wafer to be located in the center of pedestal 1, convenient for carrying out pad pasting to wafer.
For device embodiment, since it corresponds essentially to embodiment of the method, so related place is referring to method reality
Apply the part explanation of example.The apparatus embodiments described above are merely exemplary, wherein described be used as separation unit
The unit of explanation may or may not be physically separated, and component shown as a unit can be or can also be with
It is not physical unit, it can it is in one place, or may be distributed over multiple network units.It can be according to actual
The purpose for needing to select some or all of the modules therein to realize application scheme.Those of ordinary skill in the art are not paying
Out in the case where creative work, it can understand and implement.
The foregoing is merely the preferred embodiments of the application, not to limit the application, all essences in the application
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the application protection.
Claims (10)
1. a kind of wafer method for adhering film, which is characterized in that the wafer method for adhering film be applied to comprising pedestal, lining paper, loop with
And the wafer film adhering jig of the loop limit plate with hollow-out parts, the wafer method for adhering film include:
The lining paper is layed in the pedestal；
The loop, the loop limit plate and wafer with pad pasting are placed in the lining paper；Wherein, the wafer position
In in the loop, and the loop is bonded with the edge of the hollow-out parts.
2. wafer method for adhering film according to claim 1, which is characterized in that the wafer film adhering jig further includes that wafer is fixed
Position plate, the wafer positioning plate have the through-hole coincideing with the wafer size；It is described by the loop with pad pasting, it is described
Loop limit plate and wafer are placed in front of the lining paper, further includes:
The wafer positioning plate is placed in the lining paper, and determining for the wafer is drawn on the lining paper according to the through-hole
Bit line；
It is described that the loop with pad pasting, the loop limit plate and wafer are placed in the lining paper, comprising:
The loop with pad pasting, the loop limit plate and wafer are placed in the lining paper, and the side of the wafer
Edge is bonded at least partly described position line.
3. wafer method for adhering film according to claim 2, which is characterized in that the lining paper has shiny surface and rough surface,
The position line for drawing the wafer on the lining paper according to the through-hole, comprising:
The position line of the wafer is drawn on the rough surface of the lining paper according to the through-hole；
It is described that the loop with pad pasting, the loop limit plate and wafer are placed in the lining paper, comprising:
The loop with pad pasting, the loop limit plate and wafer are placed in the shiny surface of the lining paper.
4. wafer method for adhering film according to claim 1, which is characterized in that described by the loop with pad pasting, institute
It states loop limit plate and wafer is placed in the lining paper, comprising:
The loop limit plate is placed in the lining paper；
The wafer is placed in the lining paper and is located in the hollow-out parts；
By pad pasting it is smooth be covered on the loop；
The back side of the wafer is covered on the pad pasting of the loop.
5. wafer method for adhering film according to claim 1, which is characterized in that have vacuum absorption holes, institute on the pedestal
It states and the lining paper is layed in the pedestal, comprising:
The lining paper is adsorbed in the pedestal.
6. a kind of wafer film adhering jig, which is characterized in that the wafer film adhering jig includes: pedestal, lining paper, loop and has
The loop limit plate of hollow-out parts；
The outer ring size of the marginal dimension of the hollow-out parts and the loop is coincide, and the interior ring size of the loop is greater than wafer
Size.
7. wafer film adhering jig according to claim 6, which is characterized in that the wafer film adhering jig further include: wafer
Positioning plate；
The wafer positioning plate has the through-hole coincideing with the wafer size, for being drawn on the lining paper according to the through-hole
The position line of the wafer out.
8. wafer film adhering jig according to claim 7, which is characterized in that the lining paper has shiny surface and rough surface,
The rough surface is for drawing the position line, and the shiny surface is for carrying the loop, loop limit plate and the crystalline substance
Circle.
9. the wafer film adhering jig according to claim 6 or 8, which is characterized in that the lining paper is leaching membrane paper.
10. wafer film adhering jig according to claim 6, which is characterized in that there are vacuum absorption holes on the pedestal, use
It is adsorbed on the pedestal in by the lining paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710630622.6A CN109309026B (en) | 2017-07-28 | 2017-07-28 | Method and tool for sticking film on wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710630622.6A CN109309026B (en) | 2017-07-28 | 2017-07-28 | Method and tool for sticking film on wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109309026A true CN109309026A (en) | 2019-02-05 |
| CN109309026B CN109309026B (en) | 2021-03-23 |
Family
ID=65205223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710630622.6A Active CN109309026B (en) | 2017-07-28 | 2017-07-28 | Method and tool for sticking film on wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109309026B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201408327Y (en) * | 2009-04-21 | 2010-02-17 | 海力力江·木合买提 | Copying template card |
| CN203055884U (en) * | 2012-12-04 | 2013-07-10 | 赖守亮 | Chip substrate bearing device used for vacuum plasma technology |
| CN103342041A (en) * | 2013-07-18 | 2013-10-09 | 南昌欧菲光学技术有限公司 | Device and method for silkscreen |
| CN204315522U (en) * | 2014-12-03 | 2015-05-06 | 南通富士通微电子股份有限公司 | Wafer paster detects tool |
| KR20160044499A (en) * | 2013-08-07 | 2016-04-25 | 인터내셔널 테스트 솔루션즈, 인코포레이티드 | Working surface cleaning system and method |
| CN105789013A (en) * | 2014-12-25 | 2016-07-20 | 中微半导体设备(上海)有限公司 | Plasma etching device for slicing wafer and method for loading and unloading wafer |
| CN205686674U (en) * | 2016-06-17 | 2016-11-16 | 旭丰（天津）电子设备有限公司 | A kind of novel blue film machine |
-
2017
- 2017-07-28 CN CN201710630622.6A patent/CN109309026B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201408327Y (en) * | 2009-04-21 | 2010-02-17 | 海力力江·木合买提 | Copying template card |
| CN203055884U (en) * | 2012-12-04 | 2013-07-10 | 赖守亮 | Chip substrate bearing device used for vacuum plasma technology |
| CN103342041A (en) * | 2013-07-18 | 2013-10-09 | 南昌欧菲光学技术有限公司 | Device and method for silkscreen |
| KR20160044499A (en) * | 2013-08-07 | 2016-04-25 | 인터내셔널 테스트 솔루션즈, 인코포레이티드 | Working surface cleaning system and method |
| KR101883311B1 (en) * | 2013-08-07 | 2018-07-31 | 인터내셔널 테스트 솔루션즈, 인코포레이티드 | Working surface cleaning system and method |
| CN204315522U (en) * | 2014-12-03 | 2015-05-06 | 南通富士通微电子股份有限公司 | Wafer paster detects tool |
| CN105789013A (en) * | 2014-12-25 | 2016-07-20 | 中微半导体设备(上海)有限公司 | Plasma etching device for slicing wafer and method for loading and unloading wafer |
| CN205686674U (en) * | 2016-06-17 | 2016-11-16 | 旭丰（天津）电子设备有限公司 | A kind of novel blue film machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109309026B (en) | 2021-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102421865B (en) | Adhesive agent, adhesive sheet, and process for production of electronic component | |
| WO2011065589A3 (en) | Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method | |
| EP1701215A3 (en) | Coating and developing system | |
| JP2012009852A5 (en) | ||
| EP2434548A3 (en) | Solar cell and method for manufacturing the same | |
| EP2604420A3 (en) | Methods of forming an ophthalmic lens | |
| CN101941185B (en) | Sharpening board | |
| CN207166450U (en) | A kind of terminal box stopping means | |
| DE10350176A1 (en) | Process for processing a semiconductor wafer | |
| WO2002029856A3 (en) | A testing device for semiconductor components and a method of using the same | |
| CN102653661B (en) | Wafer processing tape | |
| CN102582954A (en) | Transportation pallet | |
| CN109175713A (en) | A kind of four station inspection marking equipments | |
| CN104465430A (en) | Method for detecting dies on wafer | |
| CN103488064B (en) | Substrate pasting method is aimed at a kind of backside alignment device and the back side | |
| CN109309026A (en) | Wafer method for adhering film and jig | |
| CN104716094A (en) | Device wafer processing method | |
| CN106935678B (en) | Preparation method of solar battery and system | |
| CN104658888A (en) | Wafer processing technology and wafer processing device | |
| CN103543044A (en) | Preparation method for section shape analyzing sample of MEMS (micro electro mechanical systems) device | |
| TW200705512A (en) | Protective film forming method | |
| CN103465190B (en) | Workpiece positioning component and there is its laminator | |
| EP2477211A3 (en) | Method for selective deposition of a semiconductor material | |
| JP2013021109A (en) | Adhesive sheet and method for processing disk-like workpiece using adhesive sheet | |
| CN209087795U (en) | For the load plate device in chip metal removing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |