CN101941185B - Sharpening board - Google Patents
Sharpening board Download PDFInfo
- Publication number
- CN101941185B CN101941185B CN201010220404.3A CN201010220404A CN101941185B CN 101941185 B CN101941185 B CN 101941185B CN 201010220404 A CN201010220404 A CN 201010220404A CN 101941185 B CN101941185 B CN 101941185B
- Authority
- CN
- China
- Prior art keywords
- sharpening
- cutting
- board
- sharpening board
- cutting tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 109
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 238000005452 bending Methods 0.000 claims abstract description 18
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 10
- 239000010432 diamond Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 238000001354 calcination Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 43
- 239000002173 cutting fluid Substances 0.000 description 7
- 239000006061 abrasive grain Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Dicing (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention provides a sharpening board, which is capable of efficiently providing an effect same as a pre-cutting effect while sharpening a cutting tool. The sharpening board sharpens the cutting tool, the cutting tool is peripherally provided with a cutting blade, which is formed by diamond grits fixed by a nickel-plate, the sharpening board is characterized in that the sharpening board is formed through mixing super-hard grits with a resin in proper mixing rate and forming into a board, in the case of providing a 1mm-thick (H) and 15mm-wide (W) test piece of the sharpening board, when a the test piece of the sharpening board is supported by a first tool in two-point support form, of which a span distance (Sd) is 30mm, and a force G (N)is applied on the test piece of the sharpening board supported as above by a second tool, of which a span distance (Su) is 10mm, bending strength of the test piece is less than 140N/mm calculated via 3(Sd-sU)G/2WH2.
Description
Technical field
The present invention relates to the sharpening board (finishing board) cutting tool cutting machined object being carried out to dressing.
Background technology
The semiconductor wafer of multiple devices such as IC (Integrated Circuit: integrated circuit), LSI (Large Scale Integration: large scale integrated circuit) is formed on surface about being divided to turn up the soil by the segmentation preset lines formed in lattice shape, be divided into device one by one by the topping machanism possessing cutting tool, split the device obtained and be widely used in the various electrical equipment such as mobile phone, PC.
Topping machanism at least has: chuck table, and described chuck table is for keeping wafer; Cutting member, described cutting member supports cutting tool in the mode that can rotate, and described cutting tool cuts the wafer being held in this chuck table; And calibrated component, described calibrated component detects the region that should cut, and wafer can be divided into device one by one by topping machanism accurately.
The cutting edge of cutting tool is generally formed by utilizing nickel coating fixed diamond abrasive particle.Along with machined objects such as cutting semiconductor wafers, the aged diamond abrasive grain of cutting tool end comes off from cutting tool, result makes new diamond abrasive grain protrude, by such sharping by oneself affect, make cutting tool can carry out cutting and sharpness can not be deteriorated while wearing and tearing always.
But, at abrasion of cutting tool when new cutting tool installed by main shaft or abrasion of cutting tool and when needing to carry out dressing, need to carry out such dressing operation: cut sharpening board with cutting tool, diamond abrasive grain is protruded from nickel coating.
By means of only the dressing operation of this cutting sharpening board, the cutting edge of cutting tool cannot abundant accommodate wafer, therefore the applicant once proposed following automatic cutting system (Japan Patent No. 2628256 publication): cut the substitute wafer not forming device before cutting the wafer being formed with device, make the abundant accommodate wafer of cutting edge, diamond abrasive grain is suitably protruded from nickel coating, automatically precuts by this way.
Patent document 1: Japan Patent No. 2628256 publication
But, in the automatic cutting system that patent document 1 is recorded, until the cutting edge accommodate wafer of cutting tool, the cutting of about about 400 times must be carried out substitute wafer, expend the time of about 20 minutes, there is the problem of production efficiency difference.
Summary of the invention
The present invention makes in view of this problem just, and its object is to provides a kind of sharpening board, and this sharpening board can provide efficiently and precut identical effect while carrying out dressing to cutting tool.
According to the present invention, a kind of sharpening board is provided, this sharpening board carries out dressing to cutting tool, described cutting tool has cutting edge in periphery, described cutting edge is formed by utilizing nickel coating fixed diamond abrasive particle, the feature of this sharpening board is, described sharpening board is by mixing super-hard abrasive and resin with suitable ratio and being configured as tabular and being formed, be 1mm at the thickness H of the test film making described sharpening board, when width W is 15mm, the test film of be 30mm utilizing point-to-point transmission span Sd two point-supported first tool support sharpening boards, and the second instrument utilizing point-to-point transmission span Su to be 10mm is to when being applied with the power of G newton (N) by the test film of the sharpening board supported as described above, by 3 (Sd-Su) G/2WH
2the bending strength of trying to achieve is at 140N/mm
2below.
Preferably, the bending strength of sharpening board is at 60N/mm
2above and at 140N/mm
2below.Preferably, the composition of sharpening board comprise weight ratio be 55% ~ 65% super-hard abrasive and weight ratio be 45% ~ 35% containing Packed resin.Preferably, super-hard abrasive is carborundum, and resin is phenolic resins.
According to the present invention, to make bending strength at lower 140N/mm
2super-hard abrasive to mix with suitable ratio with containing Packed resin and is configured as tabular by following mode, and carry out calcining at low temperature and form sharpening board, therefore, as long as carry out the cutting of about about 20 times to sharpening board, namely the abundant accommodate wafer of the cutting edge of cutting tool can be made while carrying out suitable dressing, thus be about 1 minute by the time shorten of about 20 minutes required when cutting substitute wafer in advance to make the prior art of the cutting edge accommodate wafer of cutting tool, can enhance productivity significantly.
Accompanying drawing explanation
Fig. 1 is the stereoscopic figure of topping machanism.
Fig. 2 be through cutting belt the stereogram of semiconductor wafer that supports by ring-shaped frame.
Fig. 3 is the exploded perspective view of cutting member (cutting unit).
Fig. 4 is the stereogram of cutting member.
Fig. 5 illustrates exploded perspective view hub-like cutter (hub blade) being assemblied in the situation of main shaft.
Fig. 6 is the stereogram that hub-like cutter is assemblied in the state of main shaft.
Fig. 7 illustrates exploded perspective view annular cutter (packing ring shape cutter (washer blade)) being assemblied in the situation of main shaft.
Fig. 8 illustrates sharpening board to be pasted onto the exploded perspective view that peripheral part is assemblied in the situation of the cutting belt of ring-shaped frame.
Fig. 9 is the use of the key diagram of the dressing operation of sharpening board.
Figure 10 is the Sketch figure of bending strength testing apparatus.
Label declaration
28: cutting tool (hub-like cutter); 74: packing ring shape cutter; 78: sharpening board; 78 ': sharpening board test film; 80: bending strength testing apparatus; 82: the first instruments; 84: the second instruments; 90,96: ball.
Detailed description of the invention
Below, with reference to accompanying drawing, embodiments of the present invention are described in detail.Fig. 1 shows the outward appearance of topping machanism 2, and this topping machanism 2 has and is suitable for utilizing sharpening board of the present invention to carry out the cutting tool of dressing, and this topping machanism 2 can utilize this cutting tool semiconductor wafer to be divided into chip (device) one by one.
Be provided with in the front-surface side of topping machanism 2 and input the control member 4 to the instruction of device such as processing conditions for operator.Be provided with the display member 6 of CRT (cathode-ray tube) etc. on device top, described display member 6 shows the guide picture guided operator or the image photographed by imaging member described later.
As shown in Figure 2, cutting object and wafer W surface normal be formed with the first spacing track (street) S1 and the second spacing track S2, divided to turn up the soil by the first spacing track S1 and the second spacing track S2 and be formed with a large amount of device D on the waferw.
Wafer W is pasted on splicing tape and cutting belt T, and the edge, periphery of cutting belt T is pasted on ring-shaped frame F.Thus, wafer W becomes the state supported by framework F through cutting belt T, is accommodated with polylith (such as 25 pieces) wafer in the wafer case 8 shown in Fig. 1.Wafer case 8 is placed on the box lift 9 that can move up and down.
Be equipped with moved member 10 at the rear of wafer case 8, the wafer W before cutting takes out of from wafer case 8 by described moved member 10, and is moved in wafer case 8 by the wafer after cutting.Interim put area 12 is provided with between wafer case 8 and moved member 10, this interim put area 12 loads the region as taking out of the wafer moving into object provisionally, is equipped with the position alignment component 14 that wafer W is aimed at fixed position at interim put area 12.
Conveyance component 16 is equipped near interim put area 12, described conveyance component 16 has the revoliving arm adsorbing and transport the framework F becoming to be integrated with wafer W, the wafer W being moved to interim put area 12 is transported component 16 and adsorbs and transport on chuck table 18, this wafer W is attracted by this chuck table 18, and by multiple fixed component (clamping element) 19 fixed frame F, this wafer W is held on chuck table 18 thus.
Chuck table 18 is configured to rotate and can moves back and forth along X-direction, is equipped with the calibrated component 20 of the spacing track that should cut detecting wafer W above the mobile route of the X-direction of chuck table 18.
Calibrated component 20 has the imaging member 22 on the surface of shooting wafer W, and this calibrated component 20 based on the image obtained by shooting, can detect the spacing track that should cut by process such as pattern match.The image obtained by imaging member 22 is shown in display member 6.
The cutting member 24 wafer W being held in chuck table 18 being implemented to machining is equipped in the left side of calibrated component 20.Cutting member 24 and calibrated component 20 are integrally constituted, and both move along Y direction and Z-direction in linkage.
Cutting member 24 is by being assemblied in the end of the main shaft 26 that can rotate by cutting tool 28 and forming, and cutting member 24 can move along Y direction and Z-direction.Cutting tool 28 is positioned on the extended line of the X-direction of imaging member 22.
Label 25 is be transported to the conveyance component of cleaning device 27 by cutting the wafer W after terminating, and in cleaning device 27, cleaning wafer W also makes air from air nozzle ejection to make wafer W dry.
The exploded perspective view of cutting member 24 is shown with reference to Fig. 3, Fig. 3.Fig. 4 is the stereogram of cutting member 24.Label 25 is main shaft housings of cutting member 24, is accommodated with by the main shaft 26 of not shown servo motor rotary actuation in main shaft housing 25 in the mode that can rotate.Cutting tool 28 is electroforming cutter, has make diamond abrasive grain be distributed to the cutting edge 28a formed in nickel mother metal at its peripheral part.
Label 30 is the cutter hood covering cutting tool 28, and the nozzle of cutting fluid 32 that the side along cutting tool 28 extends is installed on this cutter hood 30.Cutting fluid is supplied to nozzle of cutting fluid 32 via pipeline 34.Cutter hood 30 has screwed hole 36,38.
Label 40 is handling cover, and this handling cover 40 has when being installed on cutter hood 30 along the nozzle of cutting fluid 42 that the side of cutting tool 28 is extended.Cutting fluid is supplied to nozzle of cutting fluid 42 via pipeline 44.
By screw 48 is run through be inserted into handling cover 40 circular hole 46 in and screw togather with the screwed hole 36 of cutter hood 30, thus handling cover 40 be fixed in cutter hood 30.Thus, as shown in Figure 4, the half portion haply of cutting tool 28 by cutter hood 30 and handling cover 40 cover.
As shown in Figure 5, knives rack (blade mount) 56 is equipped with at the terminal part of the main shaft 26 of cutting member 24 in the mode that can load and unload.Knives rack 56 is formed by boss portion 58 with the holding flange 60 that boss portion 58 forms, and is formed with external screw thread 62 in boss portion 58.Knives rack 56 is fixed on the terminal part of main shaft 26 by nut 64.
Cutting tool 28 is referred to as hub-like cutter, and this cutting tool 28 passes through the periphery electro-deposition cutting edge 28a at the round base 66 with circular hub portion 68 and forms, and this cutting edge 28a is dispersed with diamond abrasive grain in nickel mother metal.The pilot hole 70 of cutting tool 28 is inserted in the boss portion 58 of knives rack 56, and the external screw thread 62 of hold-down nut 72 with boss portion 58 is screwed togather and tighten, as illustrated in fig. 6 cutting tool 28 is installed on main shaft 26 thus.
The exploded perspective view that the cutting tool 74 represented ring-type or washer-shaped is assemblied in the situation of main shaft 26 is shown with reference to Fig. 7, Fig. 7.The cutting edge (electroforming grinding tool) that cutting tool 74 entirety is formed by electroforming is formed.
Cutting tool 74 is inserted in the boss portion 58 of knives rack 56, again handling flange 76 is inserted in boss portion 58, then hold-down nut 72 and external screw thread 62 are screwed togather and tightened, thus, be fixed flange 60 and mounting flange 76 of cutting tool 74 is installed on main shaft 26 from sandwich.
When needing to carry out dressing when hub-like cutter 28 or packing ring shape cutter 74 being replaced by the situation of new cutter or described tool wear, sharpening board is used to implement the dressing operation of hub-like cutter 28 or packing ring shape cutter 74.In this dressing operation, use the sharpening board 78 being pasted on splicing tape (cutting belt) T as illustrated in fig. 8, the peripheral part of described splicing tape (cutting belt) T is pasted on ring-shaped frame F.
As shown in Figure 9, this dressing operation is implemented as described below: attracting holding is moved in the sharpening board 78 of chuck table 18 along arrow X-direction, and make cutting tool 28 to the direction High Rotation Speed shown in arrow A while make cutting member 24 decline, make cutting tool 28 cut sharpening board 78, thus sharpening board 78 is cut.
The sharpening board 78 of present embodiment is impregnated in by the super-hard abrasive be made up of carborundum (SiC) (super whetstone grain) in phenolic resins and is configured as tabular and carries out calcining and the sharpening board formed at the low temperature of about 150 DEG C ~ about 200 DEG C, and this sharpening board has the characteristic softer than sharpening board in the past.Preferably, in sharpening board 78, the weight ratio with 55% ~ 65% contains the super-hard abrasive be made up of carborundum, and contains with the weight ratio of 45% ~ 35% phenolic resins comprising filler.
And then, because the sharpening board 78 of present embodiment forms at lower temperature calcination, therefore there is the characteristic that bending strength is lower than sharpening board in the past.Bending strength is at 140N (newton)/mm
2below, preferably at 60N/mm
2above and at 140N/mm
2below.
Because sharpening board 78 has such characteristic, therefore, if cut sharpening board 78 about about 20 times with cutting tool 28, then the cutting that cutting edge 28a is adapted to semiconductor wafer W can be made while dressing is carried out to the cutting edge 28a of cutting tool 28.Thereby, it is possible to omission is in the past necessary carry out the precut of the cutting of the substitute wafer of about 400 times.
Following with reference to Figure 10, the anti-reflecting bending strength test method of the bending strength of the sharpening board 78 of test embodiment of the present invention is described.The second instrument 84 that first instrument 82 of bending strength testing apparatus 80 by the test film 78 ' of support sharpening board and the test film 78 ' to sharpening board apply pressing force is formed.
In the first instrument 82, a pair support portion 88 erects and is arranged in plate portion 86, and diameter is that the cylinder 90 such as formed by stainless steel (SUS) of 5mm is assemblied in each support portion 88.The point-to-point transmission span Sd supporting the test film 78 ' of sharpening board is set to 30mm.The size of test film 78 ' is: thickness H is 1mm, width W be 15mm, length L is 40mm.
In the second instrument 84, a pair support portion 94 erects and is arranged in plate portion 92, and diameter is that the cylinder 96 such as formed by stainless steel (SUS) of 4mm is assemblied in each support portion 94.The point-to-point transmission span Su formed by a pair cylinder 96 of the second instrument 84 is 10mm.
Fixing the second instrument 84, making the first instrument 82 increase along arrow Z-direction, and when utilizing a pair ball, 96 pairs of test films 78 ' to apply the power of G newton (N), bending strength F is defined as: F=3 (Sd-Su) G/2WH
2.Bending strength testing apparatus 80 is four-point bending test device.
The sharpening board 78 of present embodiment needs to make by 3 (Sd-Su) G/2WH
2the bending strength of trying to achieve is at 140N/mm
2below, preferred bending strength is at 140N/mm
2below and at 60N/mm
2above.
[embodiment 1]
The sharpening board that making thickness is 1mm, vertical and horizontal length is 75mm, makes the cutting tool that diameter is 52mm, cutting edge thickness is 30 μm rotate with the speed of 30000rpm, and with the ratio of 2 liters/min supply cutting fluid, carries out dressing according to following condition.
Thick centering step: penetraction depth is 400 μm, feed speed is 10mm/ second, cut number of times for once;
Essence centering step: penetraction depth is 400 μm, feed speed 40mm/ second, to cut number of times be 10 times;
Dressing step: penetraction depth 200 μm, feed speed 70mm/ second, to cut number of times be 10 times.
The time needed for dressing comprising centering is about 1 minute.After cutting silicon wafer with this cutting tool, the breach produced in the both sides of cutting slot is also little, can form good cutting slot.
In the above-described embodiment, to make bending strength at lower 140N/mm
2the super-hard abrasive be made up of carborundum to mix with suitable ratio with containing Packed phenolic resins and is configured as tabular by following mode, and carry out calcining to form sharpening board 78 in lower temperature, therefore, as long as namely cutting sharpening board 78 being carried out to about about 20 times can carry out suitable dressing, thus be about 1 minute by cutting the time shorten of about 20 minutes required when substitute wafer carries out dressing in prior art, improve production efficiency significantly.
Claims (1)
1. a sharpening board, this sharpening board carries out dressing to cutting tool, and described cutting tool has cutting edge in periphery, and described cutting edge is formed by utilizing nickel coating fixed diamond abrasive particle, and the feature of described sharpening board is,
Described sharpening board by super-hard abrasive and resin being mixed with suitable ratio and being configured as tabular and carrying out calcining at the low temperature of 150 DEG C ~ 200 DEG C and formed, when the thickness H of the test film making described sharpening board be 1mm, width W be 15mm,
The test film of be 30mm utilizing point-to-point transmission span Sd two point-supported first tool support sharpening boards, and the second instrument utilizing point-to-point transmission span Su to be 10mm is to when being applied with the power of G newton (N) by the test film of the sharpening board supported as described above, by 3 (Sd-Su) G/2WH
2the bending strength of trying to achieve is at 140N/mm
2below,
The bending strength of this sharpening board is at 60N/mm
2above,
This sharpening board has following composition: the weight ratio of described super-hard abrasive is 55% ~ 65%, and the weight ratio comprising filler of described resin is 45% ~ 35%,
Described super-hard abrasive is carborundum, and described resin is phenolic resins.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-156548 | 2009-07-01 | ||
| JP2009156548A JP5541657B2 (en) | 2009-07-01 | 2009-07-01 | Sharpening board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101941185A CN101941185A (en) | 2011-01-12 |
| CN101941185B true CN101941185B (en) | 2015-04-08 |
Family
ID=43433487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010220404.3A Active CN101941185B (en) | 2009-07-01 | 2010-07-01 | Sharpening board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5541657B2 (en) |
| CN (1) | CN101941185B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6153452B2 (en) * | 2013-11-15 | 2017-06-28 | 株式会社東京精密 | Sharpening tools |
| JP6576135B2 (en) * | 2015-07-14 | 2019-09-18 | 株式会社ディスコ | Cutting blade tip shape forming method |
| JP6873712B2 (en) | 2017-01-17 | 2021-05-19 | 株式会社ディスコ | Dressing board, cutting blade dressing method and cutting equipment |
| JP6351134B2 (en) * | 2017-05-29 | 2018-07-04 | 株式会社東京精密 | Sharpening tools |
| JP6967386B2 (en) * | 2017-07-12 | 2021-11-17 | 株式会社ディスコ | Dressing method |
| JP6957096B2 (en) | 2017-08-22 | 2021-11-02 | 株式会社ディスコ | Dressing board, how to use it and cutting equipment |
| JP2019139096A (en) * | 2018-02-13 | 2019-08-22 | 株式会社ディスコ | Method for forming optical fiber connector |
| JP7378890B2 (en) | 2019-08-06 | 2023-11-14 | 株式会社ディスコ | How to sharpen sharpening boards and cutting blades |
| JP2024036739A (en) | 2022-09-06 | 2024-03-18 | 株式会社ディスコ | Fixing method of dressing tool and dressing tool |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1239467A (en) * | 1997-09-08 | 1999-12-22 | 北美埃尔夫爱托化学股份有限公司 | Strengthening flat glass by edge coating |
| CN201098844Y (en) * | 2007-08-23 | 2008-08-13 | 青岛理工大学 | Ultra-hard abrasive grinding wheel dresser |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1030383C (en) * | 1992-06-15 | 1995-11-29 | 杨万旭 | Abrasive block and its making method |
| US6685755B2 (en) * | 2001-11-21 | 2004-02-03 | Saint-Gobain Abrasives Technology Company | Porous abrasive tool and method for making the same |
| JP2006218571A (en) * | 2005-02-10 | 2006-08-24 | Disco Abrasive Syst Ltd | Dressing board and dressing method |
| JP2007152440A (en) * | 2005-11-30 | 2007-06-21 | Kyocera Kinseki Corp | Method for machining hard and brittle material |
| JP2007203429A (en) * | 2006-02-03 | 2007-08-16 | Disco Abrasive Syst Ltd | Dressing/truing board and dressing truing method |
-
2009
- 2009-07-01 JP JP2009156548A patent/JP5541657B2/en active Active
-
2010
- 2010-07-01 CN CN201010220404.3A patent/CN101941185B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1239467A (en) * | 1997-09-08 | 1999-12-22 | 北美埃尔夫爱托化学股份有限公司 | Strengthening flat glass by edge coating |
| CN201098844Y (en) * | 2007-08-23 | 2008-08-13 | 青岛理工大学 | Ultra-hard abrasive grinding wheel dresser |
Non-Patent Citations (2)
| Title |
|---|
| 万能工具磨床砂轮的修整;吴广辉等;《精密制造与自动化》;20090331(第1期);第60-61页 * |
| 可提高生产率及加工柔性的CNC砂轮修整器;任大力;《磨床与磨削》;19980630(第2期);第24+28页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011011280A (en) | 2011-01-20 |
| JP5541657B2 (en) | 2014-07-09 |
| CN101941185A (en) | 2011-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101941185B (en) | Sharpening board | |
| US7598156B2 (en) | Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension | |
| US9437439B2 (en) | Processing method for wafer having chamfered portion along the outer circumference thereof followed by thinning and separating | |
| KR102432506B1 (en) | Wafer processing method and intermediate member | |
| KR20150131963A (en) | Wafer processing method | |
| CN102398228A (en) | Cutting Grinding Wheel | |
| KR20170030035A (en) | Wafer machining method | |
| CN104769704A (en) | Method for processing semiconductor wafer | |
| CN102452047A (en) | Cutting grindstone | |
| CN101850538A (en) | Support jig of wafer and method for grinding, transferring and cutting wafer | |
| KR20170008672A (en) | Dresser tool and tip shape molding method of cutting blade using the dresser tool | |
| US8895326B2 (en) | Method of attaching wafer to sheet | |
| JPH11111653A (en) | Manufacture of semiconductor wafer | |
| JP5148925B2 (en) | Frame clamp | |
| KR102243872B1 (en) | Method of grinding workpiece | |
| JP5410917B2 (en) | Laminated dressing board and dressing method and cutting method using the same | |
| JP2018060912A (en) | Processing method | |
| JP6847512B2 (en) | Cutting equipment and cutting method | |
| JP2006339373A (en) | Groove forming method | |
| CN102157446A (en) | Method for processing wafer | |
| CN109478506A (en) | The grinding method of grinding device and wafer | |
| JP7152882B2 (en) | How to hold the workpiece unit | |
| CN101890668A (en) | Grinding attachment | |
| JP6812068B2 (en) | Processing method | |
| CN109571199A (en) | A kind of Sapphire Substrate cutting sheet process for regenerating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |