JP7378890B2 - How to sharpen sharpening boards and cutting blades - Google Patents

Description

The present invention relates to a sharpening board for sharpening a cutting blade for cutting a workpiece, and a method for sharpening a cutting blade using the sharpening board.

In the device chip manufacturing process, devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed in multiple regions divided by multiple dividing lines (street) arranged in a grid pattern on a wafer. is used. By dividing this wafer along the planned dividing line, a plurality of device chips each having a device are obtained. Device chips are installed in various electronic devices such as mobile phones and personal computers.

A cutting device that includes a chuck table that holds the wafer and a cutting unit that cuts the wafer is used to divide the wafer. The cutting unit of this cutting device is equipped with an annular cutting blade for cutting the wafer. The cutting blade is formed, for example, by fixing abrasive grains made of diamond with a bond material made of metal (see Patent Document 1). The wafer is cut and divided by rotating a cutting blade attached to the cutting unit and cutting into the wafer held by the chuck table.

Before processing a wafer with a cutting blade, a sharpening process is performed in which the tip of the cutting blade is worn to expose a suitable amount of abrasive grains from the bond material. In this dressing process, a cutting blade is cut into a dressing wafer (dummy wafer) made of the same material as the wafer to be processed, and the process of cutting the dummy wafer into a linear shape is repeated. By performing this sharpening, the bond material is worn, the abrasive grains are appropriately protruded from the bond material, and the cutting blade becomes suitable for cutting the wafer.

However, when dressing is performed using a dummy wafer, it is necessary to cut the dummy wafer with a cutting blade many times (for example, about 400 times), which takes time and effort. Therefore, when the dressing operation is performed, processing of the wafer by the cutting device is delayed for a long time, resulting in a problem that processing efficiency is reduced.

Therefore, a method has been proposed in which a cutting blade is sharpened by cutting the cutting blade into a sharpening board (sharpening board) containing abrasive grains (see Patent Document 2). When this dressing board is used, the amount of wear on the cutting blade increases compared to when a dummy wafer is used. As a result, the number of cuts required for sharpening the cutting blade is reduced, and the number of steps and time required for the sharpening work can be significantly reduced.

Japanese Patent Application Publication No. 2000-87282 Japanese Patent Application Publication No. 2011-11280

As described above, by using a sharpening board containing abrasive grains to sharpen the cutting blade, it is possible to improve the efficiency of the sharpening work. However, when a cutting blade is cut into this sharpening board, the bond material is severely worn at the tip of the cutting blade, and the abrasive grains tend to protrude excessively from the bond material. If a wafer is cut with a cutting blade with a large protrusion of abrasive grains, processing defects such as chipping may occur in the wafer, and the quality of device chips may deteriorate.

The present invention has been made in view of this problem, and aims to provide a sharpening board that can suppress the occurrence of machining defects, and a method for sharpening a cutting blade using the sharpening board.

According to one aspect of the present invention, there is provided a sharpening board for sharpening the cutting blade by cutting a cutting blade into the workpiece, the board being made of the same material as the workpiece and containing abrasive grains. and a sharpening member provided on the substrate and containing abrasive grains, wherein the substrate and the sharpening member contact the cutting blade to wear the cutting blade. .

Preferably , the thickness of the substrate is 0.2 mm or more and 1 mm or less, and the thickness of the dressing member is preferably 0.05 mm or more and 1 mm or less.

According to another aspect of the present invention, a workpiece is cut using a sharpening board that includes a substrate that does not contain abrasive grains and a sharpening member that is provided on the substrate and contains abrasive grains. A cutting blade sharpening method for sharpening a cutting blade, the method includes a holding step of holding the substrate side of the sharpening board with a chuck table of a cutting device, and cutting the cutting blade into the sharpening member side of the sharpening board. There is provided a method for sharpening a cutting blade, comprising a sharpening step of cutting the substrate made of the same material as the workpiece with the cutting blade together with the sharpening member.

A dressing board according to one aspect of the present invention includes a substrate that does not contain abrasive grains and a dressing member that contains abrasive grains. Then, by cutting the substrate together with the dressing member with the cutting blade, the dressing of the cutting blade can be carried out. At this time, if the cutting blade is cut into the dressing board so as to reach the substrate, wear at the tip of the cutting blade is alleviated. This prevents excessive sharpening of the cutting blade, and suppresses the occurrence of machining defects when machining a workpiece with the cutting blade.

FIG. 1(A) is a perspective view showing a dressing board, and FIG. 1(B) is a sectional view showing the dressing board. FIG. 3 is a perspective view of a dressing board supported by a frame; It is a perspective view showing a cutting device. FIG. 3 is a cross-sectional view showing how the cutting blade cuts into the dressing board.

Embodiments of the present invention will be described below with reference to the accompanying drawings. First, a configuration example of the dressing board according to the present embodiment will be described. The dressing board according to this embodiment is used for dressing an annular cutting blade that cuts a workpiece.

A cutting blade is a processing tool that cuts into a workpiece to cut the workpiece, and is formed by fixing abrasive grains made of diamond or the like with a bond material. For example, as cutting blades, there are electroformed hub blades that have a cutting edge with abrasive grains fixed by nickel plating, etc., and annular blades that have a cutting edge that has abrasive grains fixed with a bond material made of metal, ceramics, resin, etc. (washer blade) is used.

An example of a workpiece to be cut by a cutting blade is an IC (Integrated Circuit), an LSI (Large Scale Integration), etc. ) and the like can be mentioned. By cutting this silicon wafer with a cutting blade and dividing it along the planned dividing line, a plurality of device chips each having a device are manufactured.

However, there are no restrictions on the material, shape, structure, size, etc. of the workpiece. For example, the workpiece may be a wafer of any shape and size made of a material other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, or the like. Furthermore, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of devices formed on the workpiece, and the workpiece does not need to have any devices formed thereon. Further, the workpiece may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate.

If the tip of the cutting blade cuts into the sharpening board while rotating the cutting blade, the bond material will wear out at the tip of the cutting blade that comes into contact with the sharpening board, and the amount of abrasive grains that protrude from the bond material will increase. . In this way, the cutting blade is sharpened, and the sharpness of the cutting blade is improved.

FIG. 1(A) is a perspective view showing the dressing board 11, and FIG. 1(B) is a sectional view showing the dressing board 11. The dressing board 11 includes a plate-shaped substrate (first dressing layer) 13 and a plate-shaped dressing member (second dressing layer) 15 provided on the substrate 13. The substrate 13 and the dressing member 15 are stacked in the thickness direction of the dressing board 11 so as to be in contact with each other. Note that although FIGS. 1A and 1B show an example in which the substrate 13 and the dressing member 15 are each rectangular in plan view, the shapes of the substrate 13 and the dressing member 15 are not limited.

The substrate 13 is a plate-shaped member that does not contain abrasive grains, and has a front surface (first surface) 13a and a back surface (second surface) 13b. For example, the substrate 13 is made of the same material as the workpiece to be cut by the cutting blade. When the workpiece to be cut by the cutting blade is a silicon wafer, a plate-shaped member made of silicon can be used as the substrate 13.

A dressing member 15 is provided on the surface 13a of the substrate 13. The sharpening member 15 is a plate-shaped member containing abrasive grains, and has a front surface (first surface) 15a and a back surface (second surface) 15b. For example, the sharpening member 15 is made of resin such as phenol resin or epoxy resin, and contains abrasive grains made of SiC or the like. The dressing member 15 is laminated on the substrate 13 so that the back surface 15b side is in contact with the front surface 13a side of the substrate 13.

The dressing member 15 may be formed separately from the substrate 13 and then bonded to the substrate 13, or may be formed directly on the substrate 13. For example, the sharpening member 15 is made by impregnating abrasive grains made of SiC or the like in a resin such as phenol resin or epoxy resin, and then molding this resin into a plate shape at a predetermined temperature (for example, 150°C or more and about 200°C or less). It is formed by firing. The dressing member 15 formed in this manner is bonded to the substrate 13 using, for example, an adhesive.

Further, the dressing member 15 may be formed directly on the surface 13a of the substrate 13 by screen printing or the like. When screen printing is used, it becomes easier to form a thin dressing member 15 (for example, thickness of 100 μm or less) on the substrate 13.

Further, after applying a resin impregnated with abrasive grains onto the surface 13a of the substrate 13, the resin is stretched while being pressed against the surface 13a of the substrate 13 using a tool such as a squeegee. A resin layer having a generally uniform thickness may be formed. Thereafter, by firing this resin layer, a dressing member 15 is formed on the substrate 13.

Note that there is no limit to the thickness of the substrate 13 and the dressing member 15. For example, the thickness of the substrate 13 can be 0.2 mm or more and 1 mm or less. Further, the thickness of the dressing member 15 can be set to 0.05 mm or more and 1 mm or less. Specific values of the thicknesses of the substrate 13 and the dressing member 15 are appropriately set according to the dressing conditions as described later.

Further, there are no restrictions on the content, particle size, etc. of abrasive grains contained in the sharpening member 15. For example, the abrasive grains are contained in the sharpening member 15 at a weight ratio of 55% to 65%. Further, the grain size of the abrasive grains included in the sharpening member 15 is appropriately set according to the material, thickness, diameter, etc. of the cutting blade to be sharpened. For example, the sharpening member 15 contains abrasive grains having an average particle size of 0.1 μm or more and 50 μm or less.

The cutting blade is sharpened using the sharpening board 11 described above. When sharpening a cutting blade, first, the sharpening board 11 is supported by an annular frame. FIG. 2 is a perspective view of the dressing board 11 supported by the frame 19.

A circular tape 17 is attached to the back side of the dressing board 11 (the back side 13b side of the substrate 13). The tape 17 has a size that can cover the entire back surface 13b side of the substrate 13, and the back surface 13b side of the substrate 13 is attached to the center of the tape 17.

Note that there is no restriction on the material of the tape 17. For example, the tape 17 includes a circular base material and an adhesive layer (glue layer) provided on the base material. The base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive layer is made of an epoxy, acrylic, or rubber adhesive. Further, the adhesive layer may be an ultraviolet curing resin that is cured by irradiation with ultraviolet rays.

The outer periphery of the tape 17 is attached to an annular frame 19 made of metal or the like and having a circular opening 19a in the center. Note that the diameter of the opening 19a is larger than the diameter of the circumscribed circle of the dressing board 11, and the dressing board 11 is arranged inside the opening 19a. When the tape 17 is attached to the dressing board 11 and the frame 19, the dressing board 11 is supported by the frame 19 via the tape 17.

The cutting blade is sharpened by cutting the cutting blade into the sharpening board 11 supported by the frame 19. This sharpening of the cutting blade is performed using a cutting device. FIG. 3 is a perspective view showing the cutting device 2. As shown in FIG.

The cutting device 2 includes a chuck table (holding table) 4 that holds a workpiece or a dressing board 11 . The upper surface of the chuck table 4 is formed approximately parallel to the X-axis direction (processing feed direction, front-rear direction, first horizontal direction) and the Y-axis direction (indexing feed direction, left-right direction, second horizontal direction). Alternatively, it constitutes a holding surface that holds the dressing board 11. This holding surface is connected to a suction source (not shown) such as an ejector via a suction path (not shown) formed inside the chuck table 4.

A plurality of clamps (not shown) are provided around the chuck table 4 to grip and fix a frame 19 that supports the dressing board 11. The chuck table 4 also includes a moving mechanism (not shown) that moves the chuck table 4 along the X-axis direction, and a movement mechanism (not shown) that moves the chuck table 4 around a rotation axis that is generally parallel to the Z-axis direction (vertical direction, vertical direction). It is connected to a rotation mechanism (not shown) for rotation.

A cutting unit 6 for cutting a workpiece or a dressing board 11 is arranged above the chuck table 4. The cutting unit 6 includes a cylindrical housing 8, and a cylindrical spindle (not shown) arranged approximately parallel to the Y-axis direction is accommodated within the housing 8.

A tip (one end) of the spindle is exposed outside the housing 8, and an annular cutting blade 10 is attached to this tip. Further, a rotational drive source such as a motor is connected to the base end (other end) of the spindle. The cutting blade 10 attached to the tip of the spindle is rotated by power transmitted via the spindle from a rotational drive source.

Further, when the cutting blade 10 is attached to the tip of the spindle, the cutting blade 10 is covered by a blade cover 12 fixed to the housing 8. The blade cover 12 has a connection part 14 connected to a tube (not shown) to which cutting fluid such as pure water is supplied, and a connection part 14 connected to the connection part 14 and arranged on both sides (front and back sides) of the cutting blade 10. A pair of nozzles 16 are provided. Each of the pair of nozzles 16 is formed with an injection port (not shown) that opens toward the cutting blade 10 .

When the cutting fluid is supplied to the connecting portion 14, the cutting fluid is sprayed from the injection ports of the pair of nozzles 16 toward both sides (front and back surfaces) of the cutting blade 10. This cutting fluid cools the cutting blade 10 and the workpiece or dressing board 11 held by the chuck table 4, and also washes away debris generated by the cutting process.

Further, the cutting unit 6 is connected to a moving mechanism (not shown) that moves the cutting unit 6. This moving mechanism moves the cutting unit 6 along the Y-axis direction and raises and lowers it along the Z-axis direction. Thereby, the position of the cutting blade 10 in the Y-axis direction and the Z-axis direction is controlled.

When sharpening the cutting blade 10 using the cutting device 2, first, the sharpening board 11 is held by the chuck table 4 of the cutting device 2 (holding step). Specifically, the front surface side of the sharpening board 11 (the surface 15a side of the sharpening member 15) is exposed upward, and the back surface side of the sharpening board 11 (the back surface 13b side of the substrate 13) faces the holding surface of the chuck table 4. The sharpening board 11 is placed on the chuck table 4 with the tape 17 in between. Further, a frame 19 that supports the dressing board 11 is fixed by a plurality of clamps (not shown) provided around the chuck table 4.

In this state, when negative pressure from a suction source is applied to the holding surface of the chuck table 4, the dressing board 11 is suctioned by the chuck table 4 through the tape 17. Thereby, the substrate 13 side of the dressing board 11 is held by the chuck table 4.

Next, the cutting blade 10 is cut into the dressing member 15 side of the dressing board 11, and the substrate 13 is cut together with the dressing member 15 by the cutting blade 10 (sharpening step). By cutting the cutting blade 10 into the sharpening board 11, the tip of the cutting blade 10 is worn out, and the cutting blade 10 is sharpened.

In the dressing process, first, the chuck table 4 is rotated to align the length direction of one side of the dressing board 11 with the X-axis direction or the Y-axis direction. Further, the positions of the chuck table 4 and the cutting unit 6 are adjusted so that the cutting blade 10 and the sharpening board 11 do not overlap in a plan view and overlap in a front view.

Further, the position of the cutting unit 6 in the Z-axis direction is adjusted so that the tip of the cutting blade 10 cuts into the substrate 13 of the dressing board 11. Specifically, the height of the cutting unit 6 is adjusted such that the lower end 10a (see FIG. 4) of the cutting blade 10 is located below the front surface 13a of the substrate 13 and above the back surface 13b of the substrate 13. Adjust.

Then, while rotating the cutting blade 10, the chuck table 4 is moved in the X-axis direction to relatively move the sharpening board 11 and the cutting blade 10 (processing feed). As a result, the cutting blade 10 cuts into the dressing board 11 on the dressing member 15 side. As a result, the substrate 13 of the dressing board 11 and the dressing member 15 come into contact with the cutting blade 10, causing the cutting blade 10 to wear out. Moreover, a linear cutting groove 11a is formed on the dressing member 15 side of the dressing board 11 (see FIG. 3).

For example, while rotating the cutting blade 10 in the direction shown by arrow A, the chuck table 4 is moved in the direction shown by arrow B (backward). In this case, the chuck table 4 and the cutting blade 10 move relatively so that the moving direction of the lower end of the cutting blade 10 and the moving direction of the chuck table 4 match. Then, a so-called down cut is performed in which the cutting blade 10 cuts from the front side (dressing member 15 side) of the dressing board 11 toward the back side (substrate 13 side).

FIG. 4 is a cross-sectional view showing how the cutting blade 10 cuts into the dressing board 11. The cutting blade 10 cuts into the dressing member 15 side of the dressing board 11 at a cutting depth D such that the lower end 10a reaches the substrate 13. Note that the cutting depth D of the cutting blade 10 into the dressing board 11 corresponds to the difference in height between the surface of the dressing board 11 (the surface 15a of the dressing member 15) and the lower end 10a of the cutting blade 10.

Further, the cutting depth D of the cutting blade 10 into the dressing board 11 is the sum of the cutting depth _D1 of the cutting blade 10 into the dressing member 15 and the cutting depth _D2 of the cutting blade 10 into the substrate 13. Equivalent to. The cut depth _D1 corresponds to the thickness of the dressing member 15, and the cut depth _D2 corresponds to the difference in height between the surface 13a of the substrate 13 and the lower end 10a of the cutting blade 10.

When the cutting blade 10 cuts into the dressing board 11, the cutting blade 10 cuts the dressing member 15 from the front surface 15a side toward the back surface 15b side, and also cuts a part of the front surface 13a side of the substrate 13. do. As a result, the bond material wears out at the tip of the cutting blade 10.

Thereafter, the cutting unit 6 is moved in the Y-axis direction (indexing feed), and the cutting blade 10 is further cut into the region of the dressing board 11 where the cutting groove 11a is not formed. Then, the same procedure is repeated until the abrasive grains sufficiently protrude from the bond material at the tip of the cutting blade 10. As a result, the cutting blade 10 is sharpened, and the sharpness of the cutting blade 10 is improved.

Here, the substrate 13 does not contain abrasive grains, and the sharpening member 15 contains abrasive grains. Therefore, the substrate 13 is less likely to cause wear of the cutting blade 10 than the dressing member 15. Then, when the cutting blade 10 is cut into the dressing board 11, the tip of the cutting blade 10 comes into contact with the dressing member 15 and is worn, and also comes into contact with the substrate 13 and is slightly worn.

In this way, if the substrate 13 that does not contain abrasive grains is placed below the sharpening member 15 and the cutting blade 10 is made to cut so as to reach the substrate 13, the case where the cutting blade 10 is made to cut only into the sharpening member 15 is different. In comparison, wear at the tip of the cutting blade 10 is alleviated. This prevents excessive wear of the bond material at the tip of the cutting blade 10 and excessive protrusion of the abrasive grains. As a result, when the workpiece is later cut with the cutting blade 10, processing defects such as chipping can be prevented from occurring in the workpiece.

On the other hand, wear of the cutting blade 10 is mainly caused by contact with the sharpening member 15 containing abrasive grains. Therefore, compared to the conventional case where the cutting blade 10 cuts into a dressing wafer (dummy wafer) that is made of the same material as the workpiece and does not contain abrasive grains, the wear of the cutting blade 10 is accelerated. . As a result, the number of steps and time required for sharpening the cutting blade 10 are reduced.

Note that the substrate 13 is preferably made of the same material as the workpiece to be processed later by the cutting blade 10. For example, when the workpiece is a silicon wafer, it is preferable to use the substrate 13 made of silicon. In this case, the tip of the cutting blade 10 comes into contact with the substrate 13 made of the same material as the workpiece and wears out. As a result, the amount of abrasive grain protrusion at the tip of the cutting blade 10 is optimized depending on the material of the workpiece. As a result, the cutting blade 10 is sharpened so that it is suitable for cutting the workpiece, and the cutting blade 10 is brought into a state more suitable for machining the workpiece.

However, the material of the substrate 13 and the material of the workpiece may be different. In this case, the material of the substrate 13 is selected based on the properties of the workpiece (brittleness, ductility, toughness, etc.) so that the effect of wearing the cutting blade 10 on the substrate 13 and the workpiece is equivalent. is preferred. For example, if the workpiece is a GaAs wafer, the substrate 13 made of silicon may be used.

The values of the cutting depth D and the cutting depth _D2 shown in FIG. 4 are determined according to the material, thickness, diameter of the cutting blade 10, material of the sharpening board 11, etc., so that the sharpening of the cutting blade 10 is appropriately carried out. It is set as follows. Then, the thickness of the dressing member 15 (corresponding to the cutting depth _D1 ) is set based on the values of the cutting depth D and the cutting depth _D2 . For example, when the cut depth D is set to about 0.25 to 0.3 mm and the cut depth _D2 is set to about 0.05 to 0.1 mm, the thickness of the dressing member 15 is set to about 0.2 mm. Set.

The thickness of the substrate 13 is not limited as long as it is larger than the cutting depth _D2 . However, it is preferable that the thickness of the substrate 13 is set so that the rigidity of the substrate 13 is increased to some extent and the sharpening board 11 is less likely to be bent. For example, the thickness of the substrate 13 is set to be greater than or equal to the thickness of the dressing member 15, preferably at least three times the thickness of the dressing member 15. Further, the rigidity of the dressing board 11 may be increased by fixing a support member that supports the dressing board 11 to the back surface 13b side of the substrate 13.

As described above, the dressing board 11 according to the present embodiment includes the substrate 13 that does not contain abrasive grains, and the dressing member 15 that contains abrasive grains. Then, by cutting the substrate 13 with the cutting blade 10 together with the dressing member 15, the cutting blade 10 can be dressed. At this time, if the cutting blade 10 is cut into the dressing board 11 so as to reach the substrate 13, wear on the tip of the cutting blade 10 is alleviated. This prevents excessive sharpening of the cutting blade 10, and suppresses the occurrence of machining defects when machining a workpiece with the cutting blade 10.

Note that the cutting blade 10 before sharpening has almost no abrasive grains exposed at its tip. If the cutting blade 10 in this state is cut into the dressing board 11, the pressure (processing load) applied to the dressing board 11 and the cutting blade 10 will increase, and there is a risk that the dressing board 11 and the cutting blade 10 may crack or chip. There is. Therefore, it is preferable that the machining feed rate in the first half of sharpening is set lower than the machining feed rate in the second half of sharpening.

For example, first, the cutting blade 10 is rotated at a predetermined rotation speed (for example, 30,000 rpm), and the chuck table 4 is moved at a first machining feed rate (for example, 10 mm/s) to perform the first cutting (first cutting step). Thereafter, while maintaining the rotational speed of the cutting blade 10, the chuck table 4 is moved at a second machining feed rate (for example, 40 mm/s) faster than the first machining feed rate, and the second and subsequent cutting is performed ( 2nd cutting step).

In this way, by setting the machining feed rate of the chuck table 4 low in at least the first cutting, the machining load can be reduced, and cracks, chips, etc. can be prevented from occurring in the dressing board 11 and the cutting blade 10. Note that there is no limit to the number of times of cutting in the first cutting step and the second cutting step. For example, the number of cuttings in the first cutting step is set to one, and the number of cuttings in the second cutting step is set to about 10 to 50 times.

Further, the cutting depth of the cutting blade 10 into the dressing board 11 in the first cutting step may be set smaller than the cutting depth of the cutting blade 10 into the dressing board 11 in the second cutting step. Also in this case, the processing load in the first cutting step can be reduced.

In addition, the structure, method, etc. according to the above embodiments can be modified and implemented as appropriate without departing from the scope of the objective of the present invention.

11 Dressing board 11a Cutting groove 13 Substrate (first dressing layer)
13a Surface (first side)
13b Back side (second side)
15 Dressing member (second dressing layer)
15a Surface (first side)
15b Back side (second side)
17 Tape 19 Frame 19a Opening 2 Cutting device 4 Chuck table (holding table)
6 Cutting unit 8 Housing 10 Cutting blade 10a Lower end 12 Blade cover 14 Connection part 16 Nozzle

Claims (3)

A sharpening board for sharpening a cutting blade by cutting a cutting blade into the workpiece,
a substrate made of the same material as the workpiece and containing no abrasive grains;
A sharpening member provided on the substrate and containing abrasive grains,
A sharpening board, wherein the substrate and the sharpening member contact the cutting blade to wear the cutting blade. The thickness of the substrate is 0.2 mm or more and 1 mm or less,
The dressing board according to claim 1, wherein the dressing member has a thickness of 0.05 mm or more and 1 mm or less. A cutting blade sharpening method for sharpening a cutting blade for cutting a workpiece using a sharpening board comprising a substrate containing no abrasive grains and a sharpening member provided on the substrate and containing abrasive grains. hand,
a holding step of holding the substrate side of the dressing board with a chuck table of a cutting device;
A sharpening step of cutting the cutting blade into the sharpening member side of the sharpening board and cutting the substrate made of the same material as the workpiece with the cutting blade together with the sharpening member. How to sharpen cutting blades.

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