CN112338802A

CN112338802A - Sharpening plate and method for sharpening cutting tool

Info

Publication number: CN112338802A
Application number: CN202010771781.XA
Authority: CN
Inventors: 石井隆博; 坪井纱代
Original assignee: Disco Corp
Current assignee: Disco Corp
Priority date: 2019-08-06
Filing date: 2020-08-04
Publication date: 2021-02-09
Also published as: JP7378890B2; TW202107597A; SG10202006735PA; KR20210018080A; JP2021024031A

Abstract

Provided are a sharpening plate and a method of sharpening a cutting tool, which can suppress the occurrence of machining defects. A sharpening plate for cutting a cutting tool for cutting a workpiece to sharpen the cutting tool, the sharpening plate comprising: a substrate that does not contain abrasive particles; and a dressing member provided on the base plate and containing abrasive grains, the base plate and the dressing member being in contact with the cutting tool to wear the cutting tool.

Description

Sharpening plate and method for sharpening cutting tool

Technical Field

The present invention relates to a sharpening plate for sharpening a cutting tool for cutting a workpiece and a method of sharpening a cutting tool using the same.

Background

In a manufacturing process of a device chip, a wafer is used in which devices such as an IC (Integrated Circuit) and an LSI (Large Scale Integrated Circuit) are formed in each of a plurality of regions partitioned by a plurality of planned dividing lines (streets) arranged in a lattice shape. By dividing the wafer along the dividing scheduled lines, a plurality of device chips each having a device are obtained. The device chip is mounted on various electronic devices such as a mobile phone and a personal computer.

A cutting apparatus having a chuck table for holding a wafer and a cutting unit for cutting the wafer is used for dividing the wafer. An annular cutting tool for cutting a wafer is attached to a cutting unit of the cutting apparatus. The cutting tool is formed by fixing abrasive grains made of diamond with a bonding material made of metal, for example (see patent document 1). The wafer is cut and divided by rotating a cutting tool attached to the cutting unit and cutting into the wafer held by the chuck table.

Before the wafer is machined by the cutting tool, the front end of the cutting tool is abraded to expose the abrasive grains from the bonding material to a proper degree. In the sharpening step, the following operations are repeated: a cutting tool is caused to cut into a sharpening wafer (pseudo wafer) made of the same material as that of a wafer to be processed, and the pseudo wafer is cut into a linear shape. By this sharpening, the bonding material is worn and the abrasive grains protrude from the bonding material to a proper degree, and the cutting tool is in a state suitable for cutting the wafer.

However, when sharpening is performed using a dummy wafer, the cutting tool needs to be cut into the dummy wafer a plurality of times (for example, about 400 times), and the sharpening operation takes time and labor. Therefore, when the sharpening operation is performed, there is a problem that the machining of the wafer by the cutting device is stopped for a long time and the machining efficiency is lowered.

Therefore, the following method is proposed: the cutting tool is sharpened by cutting the cutting tool into a plate for sharpening (sharpening plate) containing abrasive grains (see patent document 2). When the sharpening plate is used, the amount of wear of the cutting tool increases as compared with the case where a dummy wafer is used. This can reduce the number of cuts required for sharpening the cutting tool, and can significantly reduce the number of steps and time required for the sharpening operation.

Patent document 1: japanese patent laid-open publication No. 2000-87282

Patent document 2: japanese patent laid-open publication No. 2011-11280

As described above, by using the sharpening plate containing abrasive grains for sharpening the cutting tool, it is possible to achieve an improvement in the efficiency of the sharpening operation. However, if the cutting tool is cut into the sharpening plate, the bonding material is worn drastically at the tip of the cutting tool, and the abrasive grains tend to protrude excessively from the bonding material. Further, if the wafer is cut by the cutting blade in a state where the protruding amount of the abrasive grains is large, a processing failure such as chipping (chipping) may occur in the wafer, and the quality of the device chip may be degraded.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide a sharpening plate capable of suppressing occurrence of machining defects, and a method of sharpening a cutting tool using the same.

According to one aspect of the present invention, there is provided a sharpening plate for cutting a cutting tool for cutting a workpiece to perform sharpening of the cutting tool, the sharpening plate including: a substrate that does not contain abrasive particles; and a dressing member provided on the base plate and containing abrasive grains, the base plate and the dressing member being in contact with the cutting tool to wear the cutting tool.

Preferably, the substrate is made of the same material as the workpiece. Preferably, the substrate has a thickness of 0.2mm or more and 1mm or less, and the dressing member has a thickness of 0.05mm or more and 1mm or less.

Further, according to another aspect of the present invention, there is provided a method of dressing a cutting tool for cutting a workpiece by using a dressing plate having a base plate not containing abrasive grains and a dressing member provided on the base plate and containing abrasive grains, the method comprising the steps of: a holding step of holding the substrate side of the sharpening plate by a chuck table of a cutting device; and a sharpening step of cutting the substrate and the sharpening member together with the cutting tool by cutting the cutting tool into the sharpening member side of the sharpening plate.

A dressing plate according to one embodiment of the present invention includes a base plate that does not contain abrasive grains and a dressing member that contains abrasive grains. Further, the substrate and the sharpening member are cut together by the cutting tool, whereby the cutting tool can be sharpened. At this time, when the cutting tool is caused to cut into the sharpening plate so as to reach the base plate, the wear of the tip portion of the cutting tool is alleviated. This prevents excessive sharpening of the cutting tool, and suppresses occurrence of a machining defect when the cutting tool is used to machine a workpiece.

Drawings

Fig. 1 (a) is a perspective view showing the sharpening plate, and fig. 1 (B) is a sectional view showing the sharpening plate.

Fig. 2 is a perspective view showing a sharpening plate supported by a frame.

Fig. 3 is a perspective view showing the cutting device.

Fig. 4 is a sectional view showing a state where the cutting tool cuts into the sharpening plate.

Description of the reference symbols

11: sharpening the plate; 11 a: cutting a groove; 13: substrate (1 st sharpening layer); 13 a: front side (1 st side); 13 b: a back surface (2 nd surface); 15: a sharpening member (2 nd sharpening layer); 15 a: front side (1 st side); 15 b: a back surface (2 nd surface); 17: a belt; 19: a frame; 19 a: an opening; 2: a cutting device; 4: a chuck table (holding table); 6: a cutting unit; 8: a housing; 10: a cutting tool; 10 a: a lower end; 12: a cutter cover; 14: a connecting portion; 16: and (4) a nozzle.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a configuration example of the sharpening plate of the present embodiment will be described. The sharpening plate of the present embodiment is used for sharpening (dressing) an annular cutting tool for cutting a workpiece.

The cutting tool is a machining tool that cuts a workpiece by cutting into the workpiece, and is formed by fixing abrasive grains made of diamond or the like with a bonding material. For example, as the cutting tool, a plating hub tool having a cutting edge in which abrasive grains are fixed by nickel plating or the like, or an annular tool (a washer tool) having a cutting edge in which abrasive grains are fixed by a bonding material made of metal, ceramic, resin or the like is used.

Examples of the workpiece cut by the cutting tool include a silicon wafer having devices such as an IC (Integrated Circuit) and an LSI (Large Scale Integrated Circuit) in each of a plurality of regions defined by a plurality of planned dividing lines (streets) arranged in a grid pattern. The silicon wafer is cut by a cutting tool and divided along the lines to be divided, thereby producing a plurality of device chips each having a device.

However, the material, shape, structure, size, and the like of the workpiece are not limited. For example, the workpiece may be a wafer having an arbitrary shape and size made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, or the like), glass, ceramic, resin, metal, or the like. The type, number, shape, structure, size, arrangement, and the like of the devices formed on the workpiece are not limited, and the devices may not be formed on the workpiece. The workpiece may be a Package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded Package) substrate.

When the tip end portion of the cutting tool is cut into the sharpening plate while the cutting tool is rotated, the bonding material is worn at the tip end portion of the cutting tool in contact with the sharpening plate, and the amount of protrusion of the abrasive grains from the bonding material increases. Thus, the cutting tool is sharpened, and the sharpness of the cutting tool is improved.

Fig. 1 (a) is a perspective view showing the sharpening plate 11, and fig. 1 (B) is a sectional view showing the sharpening plate 11. The sharpening plate 11 has a plate-like base plate (1 st sharpening layer) 13 and a plate-like sharpening member (2 nd sharpening layer) 15 provided on the base plate 13. The base plate 13 and the dressing member 15 are overlapped in the thickness direction of the dressing plate 11 in a manner to contact each other. In fig. 1 (a) and 1 (B), the substrate 13 and the sharpening member 15 are each rectangular in plan view, but the shapes of the substrate 13 and the sharpening member 15 are not limited.

The substrate 13 is a plate-shaped member containing no abrasive grains, and has a front surface (1 st surface) 13a and a back surface (2 nd surface) 13 b. For example, the substrate 13 is made of the same material as a predetermined workpiece cut by a cutting tool. When the workpiece cut by the cutting tool is a silicon wafer, a plate-like member made of silicon can be used as the substrate 13.

A sharpening member 15 is provided on the front surface 13a of the substrate 13. The sharpening member 15 is a plate-like member containing abrasive grains, and has a front surface (1 st surface) 15a and a back surface (2 nd surface) 15 b. For example, the dressing member 15 is made of a resin such as a phenol resin or an epoxy resin, and contains abrasive grains made of SiC or the like. The sharpening member 15 is laminated on the substrate 13 so that the rear surface 15b side is in contact with the front surface 13a side of the substrate 13.

The sharpening member 15 may be formed separately from the substrate 13 and then bonded to the substrate 13, or may be formed directly on the substrate 13. For example, the dressing member 15 is formed by impregnating abrasive grains made of SiC or the like with a resin such as a phenol resin or an epoxy resin, molding the resin into a plate shape, and firing the molded resin at a predetermined temperature (for example, 150 ℃ or higher and about 200 ℃ or lower). The sharpening member 15 thus formed is bonded to the substrate 13 with an adhesive, for example.

The sharpening member 15 may be formed directly on the front surface 13a of the substrate 13 by screen printing or the like. If screen printing is used, the sharpening member 15 can be easily formed thin (for example, 100 μm or less in thickness) on the substrate 13.

After the resin impregnated with the abrasive grains is coated on the front surface 13a of the substrate 13, the resin may be spread while being pressed against the front surface 13a of the substrate 13 by using a tool such as a squeegee, thereby forming a resin layer having a substantially uniform thickness on the front surface 13a of the substrate 13. Then, the resin layer is fired, thereby forming the sharpening member 15 on the substrate 13.

In addition, the thicknesses of the base plate 13 and the sharpening member 15 are not limited. For example, the thickness of the substrate 13 may be 0.2mm or more and 1mm or less. The thickness of the sharpening member 15 may be 0.05mm or more and 1mm or less. Specific values of the thicknesses of the substrate 13 and the dressing member 15 are appropriately set according to dressing conditions described later.

The content, particle diameter, and the like of the abrasive grains contained in the dressing member 15 are not limited. For example, the abrasive grains are contained in the dressing member 15 at a ratio of 55% by weight or more and 65% by weight or less. The particle diameter of the abrasive grains contained in the dressing member 15 is appropriately set according to the material, thickness, diameter, and the like of the cutting tool to be dressed. For example, the dressing member 15 contains abrasive grains having an average particle diameter of 0.1 μm or more and 50 μm or less.

The sharpening of the cutting tool is performed using the above-described sharpening plate 11. When sharpening the cutting tool, first, the sharpening plate 11 is supported by an annular frame. Fig. 2 is a perspective view showing the sharpening plate 11 supported by the frame 19.

A circular tape 17 is attached to the back surface side of the sharpening plate 11 (the back surface 13b side of the substrate 13). The tape 17 has a size capable of covering the entire rear surface 13b side of the substrate 13, and the rear surface 13b side of the substrate 13 is attached to a central portion of the tape 17.

In addition, the material of the belt 17 is not limited. For example, the tape 17 has a circular base material and an adhesive layer (paste layer) provided on the base material. The base material is made of resin such as polyolefin, polyvinyl chloride, and polyethylene terephthalate, and the adhesive layer is made of epoxy, acrylic, or rubber adhesive. The adhesive layer may be an ultraviolet-curable resin that is cured by irradiation of ultraviolet light.

The outer peripheral portion of the tape 17 is attached to an annular frame 19, and the frame 19 is made of metal or the like and has a circular opening 19a in the central portion. The diameter of the opening 19a is larger than the diameter of the circumscribed circle of the sharpening plate 11, and the sharpening plate 11 is disposed inside the opening 19 a. When the belt 17 is attached to the sharpening plate 11 and the frame 19, the sharpening plate 11 is supported by the frame 19 via the belt 17.

The cutting tool is sharpened by cutting the cutting tool into the sharpening plate 11 supported by the frame 19. The sharpening of the cutting tool is carried out using a cutting device. Fig. 3 is a perspective view showing the cutting device 2.

The cutting apparatus 2 includes a chuck table (holding table) 4 for holding a workpiece or a sharpening plate 11. The upper surface of the chuck table 4 is formed substantially parallel to the X-axis direction (the machining feed direction, the front-back direction, and the 1 st horizontal direction) and the Y-axis direction (the indexing feed direction, the left-right direction, and the 2 nd horizontal direction), and constitutes a holding surface for holding the workpiece or the sharpening plate 11. The holding surface is connected to a suction source (not shown) such as an injector via a suction passage (not shown) formed inside the chuck table 4.

A plurality of jigs (not shown) are provided around the chuck table 4, and grip and fix a frame 19 that supports the sharpening plate 11. The chuck table 4 is connected to a moving mechanism (not shown) for moving the chuck table 4 in the X-axis direction and a rotating mechanism (not shown) for rotating the chuck table 4 about a rotation axis substantially parallel to the Z-axis direction (vertical direction ).

A cutting unit 6 for cutting a workpiece or a sharpening plate 11 is disposed above the chuck table 4. The cutting unit 6 has a cylindrical housing 8, and a cylindrical spindle (not shown) disposed substantially parallel to the Y-axis direction is housed in the housing 8.

A tip end portion (one end portion) of the spindle is exposed to the outside of the housing 8, and an annular cutting tool 10 is attached to the tip end portion. A rotation drive source such as a motor is connected to a base end portion (the other end portion) of the main shaft. The cutting tool 10 attached to the tip of the spindle is rotated by power transmitted from a rotary drive source via the spindle.

When the cutting tool 10 is attached to the distal end portion of the spindle, the cutting tool 10 is covered with a tool cover 12 fixed to the housing 8. The tool cover 12 has: a connection portion 14 connected to a pipe (not shown) for supplying a cutting fluid such as pure water; and a pair of nozzles 16 connected to the connecting portion 14 and disposed on both side surfaces (front and back surfaces) of the cutting tool 10. The pair of nozzles 16 are respectively formed with ejection ports (not shown) that open toward the cutting tool 10.

When the cutting fluid is supplied to the connection portion 14, the cutting fluid is ejected from the ejection ports of the pair of nozzles 16 toward both side surfaces (front and back surfaces) of the cutting tool 10. The cutting fluid cools the cutting tool 10 and the workpiece or the sharpening plate 11 held on the chuck table 4, and removes chips (cutting chips) generated by the cutting process.

The cutting unit 6 is connected to a moving mechanism (not shown) for moving the cutting unit 6. The moving mechanism moves the cutting unit 6 in the Y-axis direction and raises and lowers the cutting unit 6 in the Z-axis direction. Thereby, the position of the cutting tool 10 in the Y-axis direction and the Z-axis direction is controlled.

When the cutting tool 10 is sharpened using the cutting apparatus 2, first, the sharpening plate 11 is held by the chuck table 4 of the cutting apparatus 2 (holding step). Specifically, the sharpening plate 11 is disposed on the chuck table 4 via the belt 17 such that the front surface side (front surface 15a side of the sharpening member 15) of the sharpening plate 11 is exposed upward and the back surface side (back surface 13b side of the substrate 13) of the sharpening plate 11 faces the holding surface of the chuck table 4. Further, the frame 19 supporting the sharpening plate 11 is fixed by a plurality of jigs (not shown) provided around the chuck table 4.

In this state, when the negative pressure of the suction source is applied to the holding surface of the chuck table 4, the sharpening plate 11 is sucked by the chuck table 4 via the belt 17. Thereby, the substrate 13 side of the sharpening plate 11 is held by the chuck table 4.

Next, the cutting tool 10 is cut into the sharpening member 15 side of the sharpening plate 11, and the substrate 13 and the sharpening member 15 are cut together by the cutting tool 10 (sharpening step). By cutting the cutting insert 10 into the sharpening plate 11, the tip of the cutting insert 10 is worn, and the cutting insert 10 is sharpened.

In the sharpening step, first, the chuck table 4 is rotated so that the longitudinal direction of one side of the sharpening plate 11 coincides with the X-axis direction or the Y-axis direction. The positions of the chuck table 4 and the cutting unit 6 are adjusted so that the cutting tool 10 and the sharpening plate 11 do not overlap in a plan view and overlap in a front view.

Next, the position of the cutting unit 6 in the Z-axis direction is adjusted so that the tip of the cutting tool 10 cuts into the substrate 13 of the sharpening plate 11. Specifically, the height of the cutting unit 6 is adjusted so that the lower end 10a (see fig. 4) of the cutting tool 10 is disposed below the front surface 13a of the substrate 13 and above the rear surface 13b of the substrate 13.

Then, the chuck table 4 is moved in the X-axis direction while rotating the cutting tool 10, and the sharpening plate 11 and the cutting tool 10 are relatively moved (machining feed). Thereby, the cutting tool 10 cuts into the dressing member 15 side of the dressing plate 11. As a result, the base plate 13 and the sharpening member 15 of the sharpening plate 11 come into contact with the cutting tool 10, and the cutting tool 10 is worn. Further, a linear cutting groove 11a (see fig. 3) is formed on the sharpening member 15 side of the sharpening plate 11.

For example, the chuck table 4 is moved in the direction (rearward) indicated by the arrow B while the cutting tool 10 is rotated in the direction indicated by the arrow a. In this case, the chuck table 4 and the cutting tool 10 are relatively moved so that the moving direction of the lower end of the cutting tool 10 coincides with the moving direction of the chuck table 4. Then, so-called undercutting is performed in which the cutting tool 10 cuts into the front surface side (the side of the sharpening member 15) of the sharpening plate 11 toward the back surface side (the side of the substrate 13).

Fig. 4 is a sectional view showing a state where the cutting tool 10 cuts into the sharpening plate 11. The cutting tool 10 cuts into the sharpening member 15 side of the sharpening plate 11 with the cutting depth D at which the lower end 10a reaches the base plate 13. The depth D of cut into the sharpening plate 11 by the cutting tool 10 corresponds to the difference in height between the front surface of the sharpening plate 11 (the front surface 15a of the sharpening member 15) and the lower end 10a of the cutting tool 10.

The depth D of cut into the sharpening plate 11 by the cutting tool 10 corresponds to the depth D of cut into the sharpening member 15 by the cutting tool 10₁Depth of cut D into substrate 13 by cutting tool 10₂And (4) summing. Depth of cut D₁Corresponding to the thickness of the dressing member 15, depth of cut D₂Corresponding to the height difference between the front surface 13a of the base plate 13 and the lower end 10a of the cutting insert 10.

When the cutting tool 10 is caused to cut into the sharpening plate 11, the cutting tool 10 cuts the front surface 15a side toward the rear surface 15b side to cut the sharpening member 15, and also cuts a part of the front surface 13a side of the substrate 13. As a result, the bonding material is worn at the distal end portion of the cutting insert 10.

Then, the cutting unit 6 is moved (indexed) in the Y-axis direction, and the cutting tool 10 is further cut into the region of the sharpening plate 11 where the cutting groove 11a is not formed. Then, the same procedure is repeated until the abrasive grains sufficiently protrude from the bonding material at the leading end portion of the cutting tool 10. This sharpens the cutting insert 10, thereby improving the sharpness of the cutting insert 10.

Here, the substrate 13 does not contain abrasive grains, and the dressing member 15 contains abrasive grains. Therefore, the base plate 13 is less likely to be worn by the cutting tool 10 than the sharpening member 15. When the cutting tool 10 is cut into the sharpening plate 11, the tip of the cutting tool 10 is worn by contact with the sharpening member 15 and also slightly worn by contact with the base plate 13.

In this way, when the substrate 13 containing no abrasive grains is disposed below the dressing member 15 and the cutting tool 10 is cut so as to reach the substrate 13, the wear of the tip portion of the cutting tool 10 can be reduced as compared with the case where the cutting tool 10 is cut only into the dressing member 15. Thereby, excessive wear of the bonding material of the leading end portion of the cutting tool 10 and excessive protrusion of the abrasive grains are prevented. As a result, when the workpiece is subsequently cut by the cutting tool 10, it is possible to prevent a machining defect such as chipping (chipping) from occurring in the workpiece.

On the other hand, the wear of the cutting tool 10 is mainly caused by contact with the dressing member 15 containing abrasive grains. Therefore, the wear of the cutting tool 10 is promoted as compared with the case where the cutting tool 10 is caused to cut into a sharpening wafer (pseudo wafer) having the same material as the workpiece and containing no abrasive grains as in the related art. As a result, the number of steps and time required for sharpening the cutting insert 10 are reduced.

The substrate 13 is preferably made of the same material as the workpiece to be machined by the cutting tool 10. For example, when the workpiece is a silicon wafer, the substrate 13 made of silicon is preferably used. In this case, the tip of the cutting tool 10 is worn by contacting the substrate 13 made of the same material as the workpiece. As a result, the amount of protrusion of the abrasive grains at the tip of the cutting insert 10 is optimized according to the material of the workpiece. As a result, the cutting insert 10 is sharpened so as to be suitable for cutting the workpiece, and the cutting insert 10 is brought into a state more suitable for machining the workpiece.

However, the material of the substrate 13 and the material of the workpiece may be different. In this case, it is preferable to select the material of the substrate 13 according to the properties (brittleness, ductility, toughness, etc.) of the workpiece so that the effect of the cutting tool 10 on the abrasion of the substrate 13 and the workpiece is the same. For example, when the workpiece is a GaAs wafer, the substrate 13 made of silicon may be used.

Depth of cut D and depth of cut D shown in FIG. 4₂The value of (d) is set to appropriately perform the sharpening of the cutting insert 10 depending on the material, thickness, diameter, material of the sharpening plate 11, and the like of the cutting insert 10. Then, based on the depth D and depth D₂The thickness (and the depth of cut D) of the dressing member 15 is set to be (D)₁Corresponding). For example, the depth of incision D is set to about 0.25mm to 0.3mm₂When the thickness of the sharpening member 15 is set to about 0.05mm to 0.1mm, the thickness is set to about 0.2 mm.

The thickness of the substrate 13 is set to be larger than the depth D of the cut₂Large values are not limiting. However, the thickness of the substrate 13 is preferably set so that the rigidity of the substrate 13 becomes high to some extent and the sharpening plate 11 is less likely to be deflected. For example, the thickness of the substrate 13 is set to be not less than the thickness of the sharpening member 15, preferably not less than 3 times the thickness of the sharpening member 15. Further, a support member for supporting the sharpening plate 11 may be fixed to the back surface 13b side of the base plate 13 to increase the rigidity of the sharpening plate 11.

As described above, the dressing plate 11 of the present embodiment includes the substrate 13 not containing abrasive grains and the dressing member 15 containing abrasive grains. The cutting tool 10 can be sharpened by cutting the base plate 13 and the sharpening member 15 together with the cutting tool 10. At this time, when the cutting insert 10 is caused to cut into the sharpening plate 11 so as to reach the base plate 13, the wear of the tip portion of the cutting insert 10 is alleviated. This prevents the cutting tool 10 from being excessively sharpened, and suppresses the occurrence of a machining defect when the cutting tool 10 is used to machine a workpiece.

The cutting insert 10 before sharpening is in a state in which the abrasive grains are hardly exposed at the tip end portion thereof. When the cutting tool 10 in this state is caused to cut into the sharpening plate 11, the pressure (machining load) applied to the sharpening plate 11 and the cutting tool 10 increases, and there is a possibility that cracks, chipping, or the like may occur in the sharpening plate 11 and the cutting tool 10. Therefore, the machining feed rate of the first half portion of the sharpening is preferably set to be smaller than the machining feed rate of the second half portion of the sharpening.

For example, first, the cutting tool 10 is rotated at a predetermined rotational speed (for example, 30000rmp), and the chuck table 4 is moved at a 1 st machining feed speed (for example, 10mm/s), so that the 1 st cutting is performed (the 1 st cutting step). Then, the chuck table 4 is moved at a 2 nd machining feed speed (for example, 40mm/s) higher than the 1 st machining feed speed while the rotation speed of the cutting tool 10 is maintained, and the 2 nd and subsequent cutting is performed (2 nd cutting step).

By setting the machining feed speed of the chuck table 4 at least in the 1 st cutting to be low in this way, the machining load can be reduced, and cracks, chipping, and the like can be prevented from occurring in the sharpening plate 11 and the cutting tool 10. In addition, the number of times of cutting in the 1 st cutting step and the 2 nd cutting step is not limited. For example, the number of cuts in the 1 st cutting step is set to 1, and the number of cuts in the 2 nd cutting step is set to 10 or more and 50 or less.

Further, the depth of cut into the sharpening plate 11 by the cutting tool 10 in the 1 st cutting step may be set smaller than the depth of cut into the sharpening plate 11 by the cutting tool 10 in the 2 nd cutting step. In this case, the machining load in the 1 st cutting step can also be reduced.

In addition, the structure, method, and the like of the above embodiments can be modified and implemented as appropriate within a range not departing from the object of the present invention.

Claims

1. A sharpening plate for cutting a cutting tool for cutting a workpiece and sharpening the cutting tool,

the sharpening plate has:

a substrate that does not contain abrasive particles; and

a dressing member provided on the substrate and containing abrasive grains,

the base plate and the dressing member contact the cutting tool to cause the cutting tool to wear.

2. The sharpening plate of claim 1 wherein,

the substrate is made of the same material as the workpiece.

3. The sharpening plate of claim 1 or 2,

the thickness of the substrate is 0.2mm to 1mm,

the thickness of the sharpening member is 0.05mm to 1 mm.

4. A method of sharpening a cutting tool for cutting a workpiece by using a sharpening plate having a base plate containing no abrasive grains and a sharpening member provided on the base plate and containing abrasive grains, characterized in that,

the method for sharpening a cutting tool comprises the following steps:

a holding step of holding the substrate side of the sharpening plate by a chuck table of a cutting device; and

a sharpening step of cutting the substrate and the sharpening member together with the cutting tool by cutting the cutting tool into the sharpening member side of the sharpening plate.