CN109306474A - 用于化学和/或电解表面处理的分配系统 - Google Patents

用于化学和/或电解表面处理的分配系统 Download PDF

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Publication number
CN109306474A
CN109306474A CN201810845817.7A CN201810845817A CN109306474A CN 109306474 A CN109306474 A CN 109306474A CN 201810845817 A CN201810845817 A CN 201810845817A CN 109306474 A CN109306474 A CN 109306474A
Authority
CN
China
Prior art keywords
process fluid
substrate
channel
electrolytic surface
chemistry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810845817.7A
Other languages
English (en)
Chinese (zh)
Inventor
赫伯特·奥茨林格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsik Co Ltd
Original Assignee
Samsik Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsik Co Ltd filed Critical Samsik Co Ltd
Priority to CN202511953100.0A priority Critical patent/CN121915392A/zh
Publication of CN109306474A publication Critical patent/CN109306474A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
CN201810845817.7A 2017-07-27 2018-07-27 用于化学和/或电解表面处理的分配系统 Pending CN109306474A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202511953100.0A CN121915392A (zh) 2017-07-27 2018-07-27 用于化学和/或电解表面处理的分配系统、装置和分配方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1712064.3A GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment
GB1712064.3 2017-07-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202511953100.0A Division CN121915392A (zh) 2017-07-27 2018-07-27 用于化学和/或电解表面处理的分配系统、装置和分配方法

Publications (1)

Publication Number Publication Date
CN109306474A true CN109306474A (zh) 2019-02-05

Family

ID=59778879

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201810845817.7A Pending CN109306474A (zh) 2017-07-27 2018-07-27 用于化学和/或电解表面处理的分配系统
CN202511953100.0A Pending CN121915392A (zh) 2017-07-27 2018-07-27 用于化学和/或电解表面处理的分配系统、装置和分配方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202511953100.0A Pending CN121915392A (zh) 2017-07-27 2018-07-27 用于化学和/或电解表面处理的分配系统、装置和分配方法

Country Status (4)

Country Link
JP (2) JP6539390B2 (https=)
CN (2) CN109306474A (https=)
GB (1) GB2564893B (https=)
TW (2) TWI759514B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114599823A (zh) * 2019-11-26 2022-06-07 塞姆西斯科有限责任公司 用于基底的化学和/或电解表面处理的工艺流体的分配系统
TWI788832B (zh) * 2019-11-22 2023-01-01 奧地利商勝思科技有限公司 用於一基板之化學及/或電解表面處理之一製程流體之分配本體
CN115667590A (zh) * 2020-06-25 2023-01-31 塞姆西斯科有限责任公司 用于对基底进行化学和/或电解表面处理的工艺流体的屏蔽体系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4286560A1 (en) * 2022-05-31 2023-12-06 Semsysco GmbH Module kit for a chemical and/or electrolytic surface treatment of a substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060102213A1 (en) * 2002-11-29 2006-05-18 Atotech Deutschland Gmbh Nozzle arrangement
CN100436643C (zh) * 2003-03-11 2008-11-26 株式会社荏原制作所 镀覆装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208092A (ja) * 1983-05-11 1984-11-26 Hitachi Ltd 貴金属メツキ法
JPS6393897A (ja) * 1986-10-03 1988-04-25 C Uyemura & Co Ltd めつき液噴射式めつき処理装置
CN1116449C (zh) * 1994-05-11 2003-07-30 比利时西门子公司 电路板的处理设备
JP4560181B2 (ja) * 2000-06-30 2010-10-13 アイシン高丘株式会社 燃料電池セパレータの製造方法および製造装置
WO2002079548A1 (fr) 2001-03-28 2002-10-10 Fujitsu Limited Cuve de galvanoplastie
US20040262150A1 (en) * 2002-07-18 2004-12-30 Toshikazu Yajima Plating device
JP4624738B2 (ja) * 2003-08-21 2011-02-02 株式会社荏原製作所 めっき装置
JP2006111976A (ja) * 2006-01-19 2006-04-27 Ebara Udylite Kk 酸性銅めっき方法および酸性銅めっき装置
KR100906662B1 (ko) * 2007-09-14 2009-07-07 강원대학교산학협력단 스러스트 자기베어링 시스템
US8366884B2 (en) * 2008-04-30 2013-02-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US8043434B2 (en) * 2008-10-23 2011-10-25 Lam Research Corporation Method and apparatus for removing photoresist
EP2746433B1 (en) * 2012-12-20 2016-07-20 ATOTECH Deutschland GmbH Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
CH710741A2 (it) 2015-01-30 2016-08-15 Acrom S A Procedimento ecologico per la cromatura in continuo di barre e relativa apparecchiatura.
CN104862767B (zh) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 镀铜槽

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060102213A1 (en) * 2002-11-29 2006-05-18 Atotech Deutschland Gmbh Nozzle arrangement
CN100436643C (zh) * 2003-03-11 2008-11-26 株式会社荏原制作所 镀覆装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
金斯伯格（GINSBERG，J.H.）等: "《动力学》", 30 June 1990, 高等教育出版社 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI788832B (zh) * 2019-11-22 2023-01-01 奧地利商勝思科技有限公司 用於一基板之化學及/或電解表面處理之一製程流體之分配本體
US12351921B2 (en) 2019-11-22 2025-07-08 Semsysco Gmbh Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate
CN114599823A (zh) * 2019-11-26 2022-06-07 塞姆西斯科有限责任公司 用于基底的化学和/或电解表面处理的工艺流体的分配系统
CN115667590A (zh) * 2020-06-25 2023-01-31 塞姆西斯科有限责任公司 用于对基底进行化学和/或电解表面处理的工艺流体的屏蔽体系统

Also Published As

Publication number Publication date
JP6539390B2 (ja) 2019-07-03
JP7161445B2 (ja) 2022-10-26
GB201712064D0 (en) 2017-09-13
TWI759514B (zh) 2022-04-01
GB2564893B (en) 2020-12-16
JP2019049046A (ja) 2019-03-28
TW201911408A (zh) 2019-03-16
JP2019167628A (ja) 2019-10-03
GB2564893A (en) 2019-01-30
TWI800356B (zh) 2023-04-21
TW202230507A (zh) 2022-08-01
CN121915392A (zh) 2026-04-24

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