CN109304922A - 一种背光源的贴膜工艺 - Google Patents
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Abstract
本发明公开了一种背光源的贴膜工艺,包括以下步骤:S1:采用超声波清洗背光模组外框,然后在50‑55℃下烘干背光模组外框;S2:将背光模组外框放置在模具上,然后进行除尘和除静电处理;S3:准备氧化锆和二氧化硅,然后将氧化锆和二氧化硅混合,制得混合物,以混合物为靶材,利用射频磁控溅射技术将混合物涂装于背光模组外框上;S4:在背光模组外框上贴扩散膜,然后进行除尘和除静电处理,接着贴下增光膜,再进行除尘和除静电处理,然后贴上增光膜,接着进行除尘和除静电处理,最后贴遮光膜。本发明能够增强背光模组外框与光学膜之间的附着力,且能够便于在贴膜时因对位不准而进行的贴膜位置调整,能够提高成品的合格率,工艺简单,使用方便。
Description
技术领域
本发明涉及背光源技术领域,尤其涉及一种背光源的贴膜工艺。
背景技术
背光源是位于液晶显示器背后的一种光源,它的发光效果将直接影响到液晶显示模块视觉效果,背光源的贴膜工艺是将小型背光模组的扩散膜、增光膜、黑白胶等光学膜按顺序贴合组立的工艺,随着科技的进步,人们对背光源的贴膜工艺有了更高的要求。
现有的背光源的贴膜工艺大多不能够增强背光模组与光学膜之间的附着力,导致光学膜容易产生裂痕或者脱落,而且不方便在贴膜时因对位不准而进行的贴膜位置调整,容易影响合格率,因此,我们提出了一种背光源的贴膜工艺用于解决上述问题。
发明内容
基于背景技术存在的技术问题,本发明提出了一种背光源的贴膜工艺。
本发明提出的一种背光源的贴膜工艺,包括以下步骤:
S1:采用超声波清洗背光模组外框,然后在50-55℃下烘干背光模组外框;
S2:将背光模组外框放置在模具上,然后进行除尘和除静电处理;
S3:准备氧化锆和二氧化硅,然后将氧化锆和二氧化硅混合,制得混合物,以混合物为靶材,利用射频磁控溅射技术将混合物涂装于背光模组外框上;
S4:在背光模组外框上贴扩散膜,然后进行除尘和除静电处理,接着贴下增光膜,再进行除尘和除静电处理,然后贴上增光膜,接着进行除尘和除静电处理,最后贴遮光膜;
S5:进行压合,完成背光源的贴膜。
优选地,所述S1中,采用超声波清洗背光模组外框,然后在51-54℃下烘干背光模组外框。
优选地,所述S3中,准备氧化锆,以氧化锆为靶材,利用射频磁控溅射技术将氧化锆涂装于背光模组外框上,在背光模组外框上涂装氧化锆层。
优选地,所述S3中,准备二氧化硅,以二氧化硅为靶材,利用射频磁控溅射技术将二氧化硅涂装于背光模组外框上,在背光模组外框上涂装二氧化硅层。
优选地,所述S4中,在背光模组外框上贴扩散膜,然后进行除尘,接着用喷雾器在扩散膜上均匀喷上去离子水,再贴下增光膜,用膜刮将扩散膜与下增光膜之间的水慢慢的刮出,然后用胶刮朝四个方向刮干净扩散膜与下增光膜之间的水分,直至无气泡、无折痕。
优选地,所述S4中,贴上增光膜,然后进行除尘,接着用喷雾器在上增光膜上均匀喷上去离子水,再贴遮光膜,用膜刮将上增光膜与遮光膜之间的水慢慢的刮出,然后用胶刮朝四个方向刮干净上增光膜与遮光膜之间的水分,直至无气泡、无折痕。
本发明中,所述一种背光源的贴膜工艺通过采用超声波清洗背光模组外框和利用射频磁控溅射技术将混合物涂装于背光模组外框上使得背光模组外框表面更致密光滑,能够减少气体的渗透,使得光学膜不易产生裂痕或者脱落,能够增强背光模组外框与光学膜之间的附着力,通过用喷雾器均匀喷上去离子水、用膜刮将水慢慢的刮出、用胶刮刮干净水分能够便于在贴膜时因对位不准而进行的贴膜位置调整,能够提高成品的合格率,通过进行除尘和除静电处理能够在贴膜时保持清洁,提高合格率,本发明能够增强背光模组外框与光学膜之间的附着力,且能够便于在贴膜时因对位不准而进行的贴膜位置调整,能够提高成品的合格率,工艺简单,使用方便。
具体实施方式
下面结合具体实施例对本发明作进一步解说。
实施例
本实施例提出了一种背光源的贴膜工艺,包括以下步骤:
S1:采用超声波清洗背光模组外框,然后在50-55℃下烘干背光模组外框;
S2:将背光模组外框放置在模具上,然后进行除尘和除静电处理;
S3:准备氧化锆和二氧化硅,然后将氧化锆和二氧化硅混合,制得混合物,以混合物为靶材,利用射频磁控溅射技术将混合物涂装于背光模组外框上;
S4:在背光模组外框上贴扩散膜,然后进行除尘和除静电处理,接着贴下增光膜,再进行除尘和除静电处理,然后贴上增光膜,接着进行除尘和除静电处理,最后贴遮光膜;
S5:进行压合,完成背光源的贴膜。
本实施例中,S1中,采用超声波清洗背光模组外框,然后在51-54℃下烘干背光模组外框,S3中,准备氧化锆,以氧化锆为靶材,利用射频磁控溅射技术将氧化锆涂装于背光模组外框上,在背光模组外框上涂装氧化锆层,S3中,准备二氧化硅,以二氧化硅为靶材,利用射频磁控溅射技术将二氧化硅涂装于背光模组外框上,在背光模组外框上涂装二氧化硅层,S4中,在背光模组外框上贴扩散膜,然后进行除尘,接着用喷雾器在扩散膜上均匀喷上去离子水,再贴下增光膜,用膜刮将扩散膜与下增光膜之间的水慢慢的刮出,然后用胶刮朝四个方向刮干净扩散膜与下增光膜之间的水分,直至无气泡、无折痕,S4中,贴上增光膜,然后进行除尘,接着用喷雾器在上增光膜上均匀喷上去离子水,再贴遮光膜,用膜刮将上增光膜与遮光膜之间的水慢慢的刮出,然后用胶刮朝四个方向刮干净上增光膜与遮光膜之间的水分,直至无气泡、无折痕,一种背光源的贴膜工艺通过采用超声波清洗背光模组外框和利用射频磁控溅射技术将混合物涂装于背光模组外框上使得背光模组外框表面更致密光滑,能够减少气体的渗透,使得光学膜不易产生裂痕或者脱落,能够增强背光模组外框与光学膜之间的附着力,通过用喷雾器均匀喷上去离子水、用膜刮将水慢慢的刮出、用胶刮刮干净水分能够便于在贴膜时因对位不准而进行的贴膜位置调整,能够提高成品的合格率,通过进行除尘和除静电处理能够在贴膜时保持清洁,提高合格率,本发明能够增强背光模组外框与光学膜之间的附着力,且能够便于在贴膜时因对位不准而进行的贴膜位置调整,能够提高成品的合格率,工艺简单,使用方便。
本实施例的贴膜工艺的成品合格率比较常规的贴膜工艺的成品合格率提高了11.5%。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
Claims (6)
1.一种背光源的贴膜工艺,其特征在于,包括以下步骤:
S1:采用超声波清洗背光模组外框,然后在50-55℃下烘干背光模组外框;
S2:将背光模组外框放置在模具上,然后进行除尘和除静电处理;
S3:准备氧化锆和二氧化硅,然后将氧化锆和二氧化硅混合,制得混合物,以混合物为靶材,利用射频磁控溅射技术将混合物涂装于背光模组外框上;
S4:在背光模组外框上贴扩散膜,然后进行除尘和除静电处理,接着贴下增光膜,再进行除尘和除静电处理,然后贴上增光膜,接着进行除尘和除静电处理,最后贴遮光膜;
S5:进行压合,完成背光源的贴膜。
2.根据权利要求1所述的一种背光源的贴膜工艺,其特征在于,所述S1中,采用超声波清洗背光模组外框,然后在51-54℃下烘干背光模组外框。
3.根据权利要求1所述的一种背光源的贴膜工艺,其特征在于,所述S3中,准备氧化锆,以氧化锆为靶材,利用射频磁控溅射技术将氧化锆涂装于背光模组外框上,在背光模组外框上涂装氧化锆层。
4.根据权利要求1所述的一种背光源的贴膜工艺,其特征在于,所述S3中,准备二氧化硅,以二氧化硅为靶材,利用射频磁控溅射技术将二氧化硅涂装于背光模组外框上,在背光模组外框上涂装二氧化硅层。
5.根据权利要求1所述的一种背光源的贴膜工艺,其特征在于,所述S4中,在背光模组外框上贴扩散膜,然后进行除尘,接着用喷雾器在扩散膜上均匀喷上去离子水,再贴下增光膜,用膜刮将扩散膜与下增光膜之间的水慢慢的刮出,然后用胶刮朝四个方向刮干净扩散膜与下增光膜之间的水分,直至无气泡、无折痕。
6.根据权利要求1所述的一种背光源的贴膜工艺,其特征在于,所述S4中,贴上增光膜,然后进行除尘,接着用喷雾器在上增光膜上均匀喷上去离子水,再贴遮光膜,用膜刮将上增光膜与遮光膜之间的水慢慢的刮出,然后用胶刮朝四个方向刮干净上增光膜与遮光膜之间的水分,直至无气泡、无折痕。
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CN105538877A (zh) * | 2016-01-22 | 2016-05-04 | 广东长天精密设备科技有限公司 | 一种背光源组装设备 |
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