CN109300950A - Flexible display apparatus - Google Patents

Flexible display apparatus Download PDF

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Publication number
CN109300950A
CN109300950A CN201811151707.7A CN201811151707A CN109300950A CN 109300950 A CN109300950 A CN 109300950A CN 201811151707 A CN201811151707 A CN 201811151707A CN 109300950 A CN109300950 A CN 109300950A
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CN
China
Prior art keywords
layer
hole
display apparatus
electrode
flexible display
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Granted
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CN201811151707.7A
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Chinese (zh)
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CN109300950B (en
Inventor
邢振华
刘金强
刘亚伟
刘东坤
宋玉华
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Guangzhou Guoxian Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Priority to CN201811151707.7A priority Critical patent/CN109300950B/en
Publication of CN109300950A publication Critical patent/CN109300950A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present invention provides a kind of flexible display apparatus, the flexible display apparatus includes the array substrate being stacked, multiple luminescence units, first electrode layer and encapsulated layer, wherein, display device further includes luminous zone corresponding with multiple luminescence units, the non-light-emitting area adjacent with luminous zone, non-light-emitting area is provided with through-hole, and through-hole runs through first electrode layer, and at least one metal layer between first electrode layer and the underlay substrate of array substrate;Flexible display apparatus further includes the insulated column for being threaded through in through-hole and cooperating with through-hole swelling.By running through first electrode layer in the present invention, and insulated column is set in the through-hole of at least one metal layer between first electrode layer and underlay substrate, attachment force between first electrode layer and other perforative each film layers of through-hole is improved using insulated column connection, it avoids film layer from removing or separate, improves the service life of flexible display apparatus.

Description

Flexible display apparatus
Technical field
The present invention relates to field of display technology more particularly to a kind of flexible display apparatus.
Background technique
With the development of display technology, with Organic Light Emitting Diode (Organic Light-Emitting Diode, abbreviation OLED the flexible display apparatus of new generation centered on) is gradually applied to multiple fields, such as: television set, portable computer, Mobile phone, Intelligent bracelet, smartwatch etc..The advantage of OLED is that it can be made into flexible or folding Flexible Displays and produce Product.
When flexible display apparatus is in multiple bending or curly course, it is easy to happen removing between film layer or separation is existing As influencing the service life of flexible display apparatus.
Summary of the invention
In order to solve the above technical problem, the present invention provides a kind of flexible display apparatus, soft for appearance to be reduced or avoided Property display device film layer between it is peeling-off or separation, improve the service life of flexible display apparatus.
To achieve the goals above, the present invention provides a kind of flexible display apparatus, including the array substrate, more being stacked A luminescence unit, first electrode layer and encapsulated layer, wherein the display device further includes corresponding with the multiple luminescence unit Luminous zone, and the non-light-emitting area adjacent with the luminous zone, which is characterized in that the non-light-emitting area is provided with through-hole, described Through-hole runs through the first electrode layer, and between the first electrode layer and the underlay substrate of the array substrate extremely A few metal layer;The flexible display apparatus further includes the insulation for being threaded through in the through-hole and cooperating with the through-hole swelling Column.
Flexible display apparatus provided by the invention, through-hole runs through first electrode layer, and runs through first electrode layer and substrate At least one metal layer between substrate, and there is the insulated column that cooperate with through-hole swelling in through-hole so that first electrode layer and It is attached to each other outside between other perforative each film layers of through-hole except through Van der Waals force, is also connected by insulated column, due to insulation Column and through-hole swelling cooperate, i.e., each film layer that insulated column passes through can hold insulated column tightly.Therefore, pass through model moral with the prior art Hua Li is attached to each other each film layer and compares, and the present invention significantly improves between first electrode layer and other perforative each film layers of through-hole Attachment force is reduced or avoided between film layer in the process of bending and the case where removing or separating occurs, and improves Flexible Displays dress The service life set.
Optionally, the array substrate includes source/drain, and the through-hole runs through the source/drain.
It optionally, further include the second electrode lay being arranged between the array substrate and the first electrode layer, it is described The second electrode lay is electrically connected with the source/drain, and the through-hole runs through the second electrode lay.
Optionally, the array substrate includes storage capacitance, the storage capacitance include the top electrode that is oppositely arranged and under Electrode;
The through-hole runs through at least one of the top electrode and the lower electrode.
Optionally, the array substrate includes source/drain and storage capacitance, and the storage capacitance includes being oppositely arranged Top electrode and lower electrode;
The through-hole includes: the first through hole through the source/drain, and runs through the top electrode and the lower electrode At least one of the second through-hole.
Optionally, the through-hole is through to the underlay substrate, and the insulated column is connected to the underlay substrate towards institute It states on the upper surface of encapsulated layer.
Optionally, the through-hole is multiple, and multiple through-holes are located at the two sides of the luminous zone, and is located at described shine The inclined direction of the through-hole of area side is opposite with the inclined direction of the through-hole of the luminous zone other side is located at.
Optionally, the insulated column and the encapsulated layer are integrally formed.
Optionally, there is in the insulated column hole, be embedded in the hole make the outer wall of the insulated column with it is described The hold-down column of the hole wall swelling cooperation of through-hole.
Optionally, the encapsulated layer includes first layer encapsulated layer and the second layer that is covered on the first layer encapsulated layer Encapsulated layer;
The insulated column and the first layer encapsulated layer are integrally formed;
The hold-down column and the second layer encapsulated layer are integrally formed.
Optionally, the first layer encapsulated layer is inorganic encapsulated layer, and the second layer encapsulated layer is organic encapsulation layer.
It optionally, further include being arranged between the encapsulated layer and the array substrate, and be used to separate each described luminous The pixel confining layer of unit;The pixel confining layer towards having support portion on the face of the first electrode layer, it is described First electrode layer covers at least partly described support portion, and the through-hole runs through the support portion.
In addition to it is described above present invention solves the technical problem that, constitute technical solution technical characteristic and by these Outside beneficial effect brought by the technical characteristic of technical solution, flexible display apparatus provided by the invention and preparation method thereof institute energy The other technical characteristics and these technical characteristic brings for including in the other technologies problem of solution, technical solution are beneficial to effect Fruit will make further details of explanation in a specific embodiment.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram one for the flexible display apparatus that one embodiment of the invention provides;
Fig. 2 is the structural schematic diagram two for the flexible display apparatus that one embodiment of the invention provides;
Fig. 3 is the structural schematic diagram three for the flexible display apparatus that one embodiment of the invention provides;
Fig. 4 is the structural schematic diagram four for the flexible display apparatus that one embodiment of the invention provides;
Fig. 5 is structural schematic diagram of the flexible display apparatus that provides of one embodiment of the invention in bending;
Fig. 6 is the structural schematic diagram five for the flexible display apparatus that one embodiment of the invention provides;
Fig. 7 is the top view of Fig. 6;
Fig. 8 is the flow diagram of the production method for the flexible display apparatus that one embodiment of the invention provides.
Description of symbols:
1-flexible display apparatus;
100-underlay substrates;
200-array substrates;
201-buffer layers;
202-semiconductor layers;
203-gate insulation layers;
204-grid layers;
205-source/drains;
206-interlayer insulating films;
261-the first interlayer insulating film;
262-the second interlayer insulating film;
207-storage capacitances;
271-lower electrodes;
272-top electrodes;
208-planarization layers;
209-the second electrode lays;
301-pixel confining layers;
302-luminescence units;
303-support portions;
400-first electrode layers;
401-through-holes;
500-encapsulated layers;
501-first layer encapsulated layers;
502-second layer encapsulated layers;
600-insulated columns;
601-hold-down columns;
602-insulator caps.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
The characteristics of in order to more fully hereinafter understand the embodiment of the present invention and technology contents, with reference to the accompanying drawing to this public affairs The realization for opening embodiment is described in detail, appended attached drawing purposes of discussion only for reference, is not used to limit the embodiment of the present disclosure. In technical description below, for convenience of explanation for the sake of, disclosed embodiment is fully understood with providing by multiple details. However, one or more embodiments still can be implemented in the case where without these details.It in other cases, is simplification Attached drawing, well known construction and device can simplify displaying.
Existing flexible display apparatus includes: the array substrate being stacked, pixel confining layer, cathode layer and encapsulation Layer, when flexible display apparatus is in multiple bending or curly course, between array substrate, pixel confining layer and cathode layer It is easy by stress influence, causes to be partially stripped or segregation phenomenon, influence the service life of flexible display apparatus.
Fig. 1 is the structural schematic diagram one for the flexible display apparatus that one embodiment of the invention provides;Fig. 2 is that the present invention one is implemented The structural schematic diagram two for the flexible display apparatus that example provides;Fig. 3 is the knot for the flexible display apparatus that one embodiment of the invention provides Structure schematic diagram three;Fig. 4 is the structural schematic diagram four for the flexible display apparatus that one embodiment of the invention provides;Fig. 5 is the present invention one Structural schematic diagram of the flexible display apparatus that embodiment provides in bending;Fig. 6 is that the flexibility that one embodiment of the invention provides is aobvious The structural schematic diagram five of showing device;Fig. 7 is the top view of Fig. 6.
Please refer to Fig. 1-Fig. 7.The present embodiment provides a kind of flexible display apparatus 1, flexible show occur for being reduced or avoided Peeling-off or separation, improves the service life of flexible display apparatus 1 between the film layer of showing device 1.
To achieve the goals above, the present embodiment provides a kind of flexible display apparatus 1, including the array substrate being stacked 200, multiple luminescence units 302, first electrode layer 400 and encapsulated layer 500, wherein flexible display apparatus 1 further include with it is multiple The corresponding luminous zone of luminescence unit 302, and the non-light-emitting area adjacent with luminous zone, non-light-emitting area are provided with through-hole 401, through-hole 401 run through first electrode layer 400, and between first electrode layer 400 and the underlay substrate 100 of array substrate 200 extremely A few metal layer;Flexible display apparatus 1 further includes the insulated column for being threaded through in through-hole 401 and cooperating with 401 swelling of through-hole 600。
Through-hole 401 runs through first electrode layer 400, and between first electrode layer 400 and underlay substrate 100 at least One metal layer, and there is the insulated column 600 that cooperate with 401 swelling of through-hole in through-hole 401 so that first electrode layer 400 with lead to Hole 401 is closed and is attached to each other outside between other film layers of window except through Van der Waals force, is also connected by insulated column 600, due to exhausted Edge column 600 and 401 swelling of through-hole cooperate, i.e., each film layer that insulated column 600 passes through can hold insulated column tightly.Therefore, with it is existing Technology is attached to each other each film layer by Van der Waals force and compares, and the present invention significantly improves first electrode layer 400 and through-hole 401 passes through Each film layer between attachment force, be reduced or avoided between film layer in the process of bending and occur the case where removing or separating, mentioning The high service life of flexible display apparatus.
Specifically, first electrode layer 400 can be cathode layer or first electrode layer 400 is anode layer.
Flexible display apparatus 1 includes luminous zone and the non-light-emitting area being disposed adjacent with luminous zone, wherein luminous zone and setting The region where multiple luminescence units 302 in viewing area is corresponding, and viewing area is used to show the picture of video or picture.
Non-light-emitting area includes non-light-emitting area and the non-display area of viewing area;There are spaced multiple hairs in viewing area Light unit 302, and the pixel confining layer 301 for separating each luminescence unit 302, the non-light-emitting area of viewing area are pixel restriction 301 corresponding region of layer;Non-light-emitting area further includes the non-display area positioned at non-display area, and non-display area is for being arranged and showing Metal wire and setting that multiple luminescence units 302 in area connect are convenient for the peripheral dykes and dams of encapsulation.
Embodiment one
Non-light-emitting area is located at non-display area in the present embodiment, i.e. through-hole 401 is arranged in non-display area, and through-hole 401 can at this time To be used to wrap up the film layer of metal wire in the metal wire and non-display area of first electrode layer 400, non-display area;Or it is logical Hole 401 is through first electrode layer 400, the metal wire and peripheral dykes and dams of non-display area;Certainly, through-hole 401 may also extend through One electrode layer 400, the metal wire of non-display area, in non-display area for wrap up metal wire film layer and peripheral dykes and dams.
Insulated column 600 is equipped in through-hole 401, insulated column 600 and 401 swelling of through-hole cooperate, that is to say, that insulated column 600 diameter is more bigger than the diameter of through-hole 401, is interference fitted between insulated column 600 and the side wall of through-hole 401, so that through-hole 401 Inner wall can hold insulated column 600 tightly;It is designed in this way, the binding force between 401 side wall of insulated column 600 and through-hole can be enhanced, Insulated column 600 is prevented to be detached from through-hole 401.And it is mutually attached except through Van der Waals force between the 401 perforative each film layer of institute of through-hole It is outer, also connected by insulated column 600, improve through-hole 401 across each film layer attachment force.It is reduced or avoided curved Occur the case where removing or separating during folding between film layer, improves the service life of flexible display apparatus 1.
Embodiment two
The present embodiment provides a kind of flexible display apparatus 1, including luminous zone and the non-hair being disposed adjacent with the luminous zone Light area, luminous zone is corresponding with the region where multiple luminescence units that viewing area is arranged in, and viewing area is for showing video or figure The picture in face;Non-light-emitting area is corresponding to the pixel confining layer that is arranged between spaced multiple luminescence units of viewing area Region.
In the present embodiment, flexible display apparatus 1 includes the array substrate 200 being stacked, multiple luminescence units 302, the One electrode layer 400 and encapsulated layer 500.Wherein, it is provided between luminescence unit 302 for separating the aobvious of each luminescence unit 302 Pixel confining layer 301.It when specific production, for example can be, patterned process carried out to pixel confining layer 301, to limit in pixel Opening is formed in given layer 301, and the luminous organic material for being used to form luminescence unit 302 is then filled into opening.
Pixel confining layer 301 positioned at viewing area is provided with through-hole 401, and through-hole 401 runs through first electrode layer 400, and Through at least one metal layer between first electrode layer 400 and the underlay substrate 100 of array substrate 200.Wherein, will lead to Hole 401 is arranged in the corresponding non-light-emitting area of pixel confining layer 301, through-hole 401 can be made to avoid luminous zone, to avoid through-hole 401 and the insulated column 600 that is arranged in through-hole 401 influence the display effect of flexible display apparatus.Underlay substrate 100 is array The flexible base board of the bottom in substrate 200.
Insulated column 600 is equipped in through-hole 401, insulated column 600 and 401 swelling of through-hole cooperate, that is to say, that insulated column 600 diameter is more bigger than the diameter of through-hole 401, is interference fitted between insulated column 600 and the side wall of through-hole 401, so that through-hole 401 Inner wall can hold insulated column 600 tightly;It is designed in this way, the binding force between insulated column 600 and through-hole 401 can be enhanced, prevent Insulated column 600 is detached from through-hole 401.By taking flexible display apparatus shown in FIG. 1 as an example, upper end and 500 phase of encapsulated layer of insulated column 600 Even, the lower end of insulated column 600 is abutted with the bottom hole of through-hole 401.By the both ends of insulated column 600 respectively with encapsulated layer 500 and hole Bottom surface is connected, and insulated column 600 can be made to fill up entire through-hole 401, reinforced insulation column 600 to its across each film layer connect Relay.
In the present embodiment, since through-hole 401 runs through first electrode layer 400, and run through first electrode layer 400 and substrate At least one metal layer between substrate 100, and there is the insulated column 600 cooperated with 401 swelling of through-hole in through-hole 401, so that First electrode layer 400 and pixel confining layer 301 and by between other the perforative film layers of through-hole 401 except through Van der Waals force phase Mutually attachment is outer, is also connected by insulated column 600, and since insulated column 600 and 401 swelling of through-hole cooperate, i.e., insulated column 600 passes through Each film layer can hold insulated column 600 tightly, and therefore, compared with prior art, the embodiment of the present invention significantly improves first electrode Layer 400 and pixel confining layer 301 and by the attachment force between other the perforative film layers of through-hole 401, are reduced or avoided and are bending Occur the case where removing or separating between film layer in the process, improves the service life of flexible display apparatus 1.
In the present embodiment, through-hole 401 runs through first electrode layer 400, and runs through first electrode layer 400 and underlay substrate At least one metal layer between 100, wherein as shown in Figure 1, array substrate 200 is specific can include: underlay substrate 100, and It is stacked buffer layer 201, semiconductor layer 202, gate insulation layer 203, grid layer 204, layer insulation on underlay substrate 100 Layer 206, source/drain 205, planarization layer 208.It further include being arranged in array substrate 200 and first electrode layer in the present embodiment The second electrode lay 209 between 400;Further planarization layer 208 is arranged in towards encapsulated layer 500 in the second electrode lay 209 On face.Wherein, the second electrode lay 209 is provided through the extension of planarization layer 208, and the second electrode lay 209 passes through the extension Portion is electrically connected with source/drain 205.It is understood that source/drain 205 and the second electrode lay 209 in array substrate 200 Belong to metal layer.
Array substrate 200 can also include: the storage capacitance being arranged between underlay substrate 100 and pixel confining layer 301 207.Storage capacitance 207 specifically includes: the top electrode 272 being oppositely arranged and lower electrode 271, and top electrode 272 is located at lower electrode 271 Top.It is understood that top electrode 272 and lower electrode 271 are metal layer.
In the present embodiment, the metal layer between first electrode layer 400 and underlay substrate 100 include the second electrode lay 209, The top electrode 272 of source/drain 205 and storage capacitance 207 in array substrate 200 and lower electrode 271.Through-hole 401 is in addition to passing through It wears outside first electrode layer 400, may also extend through one or more of source/drain 205, top electrode 272 or lower electrode 271, under Face will be illustrated in conjunction with attached drawing.
Fig. 1 is please referred to, array substrate 200 includes the source/drain being arranged between underlay substrate 100 and pixel confining layer 301 Pole 205, through-hole 401 run through source/drain 205.Specifically, the direction of underlay substrate 100, through-hole are directed toward along first electrode layer 400 401 run through: first electrode layer 400, pixel confining layer 301, planarization layer 208, source/drain 205.Correspondingly, insulated column 600 is worn Cross first electrode layer 400, pixel confining layer 301, planarization layer 208, source/drain 205, and by its passed through first electrode layer 400, pixel confining layer 301, planarization layer 208, source/drain 205 connect, therefore, first electrode layer 400, pixel confining layer 301, it is attached to each other outside between planarization layer 208, source/drain 205 except through Van der Waals force, is also connected by insulated column 600, Compared with these film layers are attached to each other by Van der Waals force in the prior art, hence it is evident that the attachment force between these film layers is improved, So that in 1 bending process of flexible display apparatus, first electrode layer 400, pixel confining layer 301, flat is reduced or avoided Change between layer 208, source/drain 205 and the case where removing or separating occur, improves the service life of flexible display apparatus 1.
Further, flexible display apparatus 1 further includes be arranged between array substrate 200 and first electrode layer 400 Two electrode layers 209, the second electrode lay 209 are electrically connected with source/drain 205, and through-hole 401 runs through the second electrode lay 209.Specifically, Fig. 1 is please referred to, through-hole 401 from top to bottom at least runs through first electrode layer 400, pixel confining layer 301, the second electrode lay 209, puts down Smoothization layer 208, source/drain 205.That is, through-hole 401 has at least run through between first electrode layer 400 and underlay substrate 100 Two metal layers: source/drain 205 and the second electrode lay 209, correspondingly, insulated column 600 also has passed through first electrode layer 400 Two metal layers between underlay substrate 100, using insulated column 600 improve first electrode layer 400, pixel confining layer 301, The second electrode lay 209, planarization layer 208, the attachment force between source/drain 205, so that being bent in flexible display apparatus 1 In the process, first electrode layer 400, pixel confining layer 301, the second electrode lay 209, planarization layer 208, source/drain is reduced or avoided Occur removing between pole 205 or separate.Specifically, first electrode layer 400 can be cathode layer, corresponding the second electrode lay 209 be anode layer;Or first electrode layer 400 is anode layer, corresponding the second electrode lay 209 is cathode layer.
Referring to Fig. 3, array substrate 200 includes the storage capacitance being arranged between underlay substrate 100 and pixel confining layer 301 207, storage capacitance 207 includes the top electrode 272 being oppositely arranged and lower electrode 271;Through-hole 401 runs through top electrode 272 and lower electricity At least one of pole 271.
Specifically, through-hole 401 is directed toward the direction of underlay substrate 100 along first electrode layer 400, and through-hole 401 is through the first electricity Pole layer 400, pixel confining layer 301, planarization layer 208, the second interlayer insulating film 262 and top electrode 272;Alternatively, through-hole 401 Along first electrode layer 400 be directed toward underlay substrate 100 direction, through-hole 401 through first electrode layer 400, pixel confining layer 301, Planarization layer 208, the second interlayer insulating film 262, top electrode 272, the first interlayer insulating film 261 and lower electrode 271.Certainly, In other implementations, through-hole 401 can also only run through lower electrode 271.
The insulated column 600 being threaded through in through-hole 401 can extend to top electrode 272 and/or lower electrode 271.Storage capacitance It is attached to each other outside between each film layer of array substrate 200 near 207 except through Van der Waals force, is also connected by insulated column 600, Compared with these film layers are attached to each other by Van der Waals force in the prior art, the attachment force between these film layers is improved;In addition, Film layer and first electrode of the array substrate 200 at corresponding 207 region of storage capacitance are also improved under the action of insulated column 600 Attachment force between layer 400 and pixel confining layer 301.
Further, through-hole 401 includes the first through hole through source/drain 205, and runs through top electrode 272 and lower electricity Second through-hole of at least one of pole 271.It is equipped with insulated column 600 in first through hole and the second through-hole, setting can in this way Further increase the connection between the film layer and first electrode layer 400 and pixel confining layer 301 at 200 different location of array substrate Power.
In addition, with continued reference to Fig. 1-Fig. 4, through-hole 401 can also be through first electrode layer 400 and array substrate 200 After at least one metal layer between underlay substrate 100, continue to extend downward into underlay substrate 100, insulated column 600 is connected to On the upper surface of underlay substrate 100.By making through-hole 401 be through to underlay substrate 100, insulated column 600 is by first electrode layer 400 The bottom for extending downward into array substrate 200 always increases the contact area between array substrate 200 and insulated column 600, Further improve the attachment force between array substrate 200 and first electrode layer 400 and pixel confining layer 301.For example, lead to First electrode layer 400, pixel confining layer 301, the second electrode lay 209, planarization layer 208, source/drain are from top to bottom run through in hole 401 Pole 205, interlayer insulating film 206, gate insulation layer 203;Or through-hole 401 is from top to bottom limited through first electrode layer 400, pixel Layer 301, the second electrode lay 209, planarization layer 208, the second interlayer insulating film 262, top electrode 272, the first interlayer insulating film 261, lower electrode 271, gate insulation layer 203.
When specific implementation, in order to stop moisture or impurity diffusion, it is arranged between gate insulation layer 203 and underlay substrate 100 There is buffer layer 201, in the present embodiment, buffer layer 201 can specifically be formed by the layer that silicon nitride layer and silicon oxide layer stack.When When being provided with buffer layer 201 on underlay substrate 100, shown referring to Fig.1, through-hole 401 can specifically be through to buffer layer 201 at this time, Insulated column 600 is connected to the upper surface of buffer layer 201.
In the present embodiment, above-mentioned through-hole 401 can be formed by way of laser boring, it can also be by way of etching Form above-mentioned through-hole 401.After through-hole 401 is formed, it can be led to by modes fill insulant into through-hole 401 such as depositing, being deposited Insulating materials can fill up through-hole 401 in normal situation.Into through-hole 401 in the technical process of fill insulant, insulation material The temperature of material is higher (for example, temperature can reach 80~100 DEG C when being deposited using PECVD), so that being located at the through-hole 401 of metal layer Partial hole wall can be heated outside expansion, and insulating materials temperature declines after deposition, and the hole wall of through-hole 401 is inwardly received at this time Contracting, so that the insulated column 600 being formed in through-hole 401 be held tightly;In other words, the 401 perforative metal layer of institute of through-hole is fastened on absolutely On edge column 600, to improve the attachment force between first electrode layer 400 and pixel confining layer 301, prevent bending process from insulating Column 600 in through-hole 401 by extracting, in order to avoid first electrode layer 400, pixel confining layer 301 and array substrate 200 and/or the second electricity Occur removing, separation between pole layer 209.
It should be noted that the expansion rate that the insulating materials for constituting insulated column 600 is heated need to be swollen less than what metal layer was heated The swell increment of swollen rate, i.e., heated rear insulated column 600 is less than the swell increment of metal layer, so that the shrinkage of metal layer is greater than after cooling The shrinkage of insulated column 600, and then the inner wall of through-hole 600 is enable to hold insulated column 600 tightly.
In the present embodiment, with continued reference to 5, through-hole 401 can be it is multiple, an insulation is equipped in each through-hole 401 Column 600.In an achievable mode, the distribution density of the through-hole 401 in the pliable region of flexible display apparatus 1 is greater than flexibility The distribution density of the through-hole 401 in the region except the pliable region of display device 1.When flexible display apparatus 1 is bent, due to The quantity of the insulated column 600 in the pliable region of flexible display apparatus 1 is more than the insulated column outside the pliable region of flexible display apparatus 1 Therefore 600 quantity can be further improved the attachment force between each film layer in the pliable region of flexible display apparatus 1, thus It is reduced or avoided and film layer removing or separation occurs;In addition it is also possible to which the bending for dispersing the pliable region of flexible display apparatus 1 is answered Power is further reduced or avoids that film layer removing or separation occurs.
In the present embodiment, (first electrode in pixel confining layer 301 is not shown in the figure with continued reference to Fig. 6 and Fig. 7 Layer 400 and encapsulated layer 500), through-hole 401 be it is multiple, multiple through-holes 401 are located at the two sides of luminous zone, and are located at and shine The inclined direction of the through-hole 401 of area side is opposite with the inclined direction of through-hole 401 of the luminous zone other side is located at.
It is equipped with insulated column 600 in each through-hole 401, the insulated column 600 in the through-hole 401 of luminous zone two sides, Can be improved luminous zone two sides pixel confining layer 301 and first electrode layer 400 and array substrate 200 and the second electrode lay 209 it Between attachment force.
It should be noted that the through-hole 401 for being located at the luminous zone other side can be with the through-hole 401 positioned at the luminous zone other side Through identical film layer or different film layers.
For example, being located at the through-hole 401 of luminous zone side can from top to bottom limit through first electrode layer 400, pixel Given layer 301, the second electrode lay 209, planarization layer 208, source/drain 205, interlayer insulating film 206, gate insulation layer 203;Positioned at hair The through-hole 401 of the other side Guang Qu from top to bottom can through first electrode layer 400, pixel confining layer 301, the second electrode lay 209, Planarization layer 208, the second interlayer insulating film 262, top electrode 272, the first interlayer insulating film 261, lower electrode 271, gate insulation layer 203。
Further, in luminous zone side through-hole 401 inclined direction and the through-hole 401 that is located at the luminous zone other side Inclined direction is opposite.The through-hole 401 being obliquely installed can increase the contact area between insulated column 600 and through-hole 401, to improve The bonding strength between each film layer where insulated column 600 and through-hole 401;In addition, the through-hole 401 being obliquely installed can insulate When column 600 is by along active force perpendicular to array substrate 100, prevent insulated column 600 to the external mobile of through-hole 401, in turn Avoid insulated column 600 by extracting in through-hole 401.
Specifically, through-hole 401 has towards the bottom end of underlay substrate 100 and away from the top of underlay substrate 100, is located at It may include: to be located at hair that the through-hole 401 of luminous zone side tilts towards one another with the through-hole 401 for being located at the luminous zone other side The top of one side through hole 401 of light area tilts towards one another with the top for being located at another side through hole 401 in luminous zone, or is located at The bottom end of one side through hole 401 of luminous zone tilts towards one another with the bottom end for being located at another side through hole 401 in luminous zone.
In the present embodiment, insulated column 600 can be integrally formed with encapsulated layer 500.In production, through-hole is opened up first 401, encapsulated layer 500 is formed by modes such as inkjet printing, deposition, vapor depositions later, while forming encapsulated layer 500, part Material is filled in through-hole 401 to form insulated column 600.Encapsulation can be improved with the integrally formed insulated column 600 of encapsulated layer 500 Attachment force between layer 500, first electrode layer 400 and pixel confining layer 301 and array substrate 200 and the second electrode lay 209.
Further, continue according to Fig. 2 and Fig. 4, insulated column 600 is interior to have hole, and being embedded in hole makes insulated column 600 Outer wall and through-hole 401 hole wall swelling cooperate hold-down column 601.The outer wall of insulated column 600 can be pressed on by hold-down column 601 On the hole wall of through-hole 401, to guarantee that insulated column 600 and 401 swelling of through-hole cooperate, to further increase 400 He of first electrode layer Attachment force between pixel confining layer 301 and array substrate 200 and the second electrode lay 2099.
Specifically, the hole on insulated column 600 can for into through-hole 401 packing material to form insulated column 600 In the process, material is not filled up completely through-hole 401 and is formed;Alternatively, the hole on insulated column 600 is to form insulated column After 600, formed on insulated column 600 by modes such as laser boring or etchings.
Further, encapsulated layer 500 include first layer encapsulated layer 501 and be covered on first layer encapsulated layer 501 the Two layers of encapsulated layer 502;Insulated column 600 and first layer encapsulated layer 501 are integrally formed;Hold-down column 601 and second layer encapsulated layer 502 1 It is body formed.When production, it is initially formed through-hole 401, passes through the side such as inkjet printing, deposition, vapor deposition in first electrode layer 400 later Formula forms the first encapsulated layer 501, and while forming the first encapsulated layer 501, some materials are filled in through-hole 401 to form insulation Column 600;The second encapsulated layer 502 is formed by modes such as inkjet printing, deposition, vapor depositions on the first encapsulated layer 501 later, in shape While at the second encapsulated layer 502, some materials are filled in the hole on insulated column 600, to form hold-down column 601.Insulation Column 600 and first layer encapsulated layer 501 are integrally formed, and hold-down column 601 and second layer encapsulated layer 502 are integrally formed, and simplify insulation The manufacture difficulty of column 600 and hold-down column 601 facilitates processing.
Further, the first encapsulated layer 501 can be inorganic encapsulated layer, and the second encapsulated layer 502 is organic encapsulation layer.Insulation The material of column 600 is identical as the material of the first encapsulated layer 501, at this time by the inorganic layer meeting in the perforative each film layer of insulated column 600 It is preferably combined with insulated column 600, for example, gate insulation layer 203 and interlayer insulating film 206 are generally inorganic layer, to improve Insulated column 600 and by the attachment force between the perforative inorganic layer of insulated column 600.
In other implementations, the first encapsulated layer 501 can be organic encapsulation layer, and the second encapsulated layer 502 is inorganic Encapsulated layer.The material of insulated column 600 is identical as the material of the first encapsulated layer 501, at this time by the perforative each film layer of insulated column 600 Organic layer can preferably be combined with insulated column 600, for example, pixel confining layer 301 and planarization layer 208 are generally organic layer, To improve insulated column 600 and by the attachment force between the perforative organic layer of insulated column 600.
With continued reference to Fig. 6, in other implementations, can also first in through-hole 401 formed insulated column 600, then again Form encapsulated layer 500, i.e. insulated column 600 and 500 separate machined of encapsulated layer.It is possible to further filled absolutely into through-hole 401 When edge material is to form insulated column 600, the insulator cap being covered in first electrode layer 400 is formed on the top of insulated column 600 602, encapsulated layer 500 is formed in first electrode layer 400 later, i.e. encapsulated layer 500 is covered on insulator cap 602 and first electrode On layer 400, insulator cap 602 can increase the connection area between insulated column 600 and encapsulated layer 500, and then improve insulated column 600 With the bonding strength between encapsulated layer 500.
In the present embodiment, pixel confining layer 301 towards having support portion 303 on the face of first electrode layer 400, first The covering of electrode layer 400 at least partly support portion 303, through-hole 401 run through support portion 303.Can further increase insulated column 600 with Contact area between film layer, to improve the attachment force between insulated column 600 and film layer.
Embodiment three
Fig. 8 is the flow diagram of the production method for the flexible display apparatus that one embodiment of the invention provides.Extremely in conjunction with Fig. 1 Shown in Fig. 8, the present embodiment provides a kind of production method of flexible display apparatus, which can be used for making above-described embodiment The flexible display apparatus of offer.
The production method includes:
S101, offer one include the soft of array substrate 200, pixel confining layer 301 and the cathode layer 400 being cascading Property display panel, wherein organic luminous layer 302 is provided in pixel confining layer 301.
Array substrate 200 generally includes: the secondary buffer layer 201 being stacked on underlay substrate 100, semiconductor layer 202, Gate insulation layer 203, grid layer 204, interlayer insulating film 206, source/drain 205, planarization layer 208, anode layer 209, wherein sun Pole layer 209 is provided through the extension of planarization layer 208, and anode layer 209 is electrically connected by the extension with source/drain 205. It is understood that the source/drain 205, anode layer 209 in array substrate 200 belong to metal layer.
Array substrate 200 can also include: the storage capacitance being arranged between underlay substrate 100 and pixel confining layer 301 207.Storage capacitance 207 specifically includes: the top electrode 272 being oppositely arranged and lower electrode 271, and top electrode 272 is located at lower electrode 271 Top.It is understood that top electrode 272 and lower electrode 271 are metal layer.
S102, through-hole 401 is formed in the non-light-emitting area of pixel confining layer 301, through-hole 401 runs through cathode layer 400, and passes through Wear at least one metal layer between cathode layer 400 and the underlay substrate 100 of array substrate 200.
Metal layer between cathode layer 400 and underlay substrate 100 includes anode layer 209, the source/drain in array substrate 200 The top electrode 272 and lower electrode 271 of pole 205 and storage capacitance 207.Through-hole 401, can be in addition to other than the cathode layer 400 Through one or more of source/drain 205, top electrode 272 and lower electrode 271.
Through-hole 401 can be formed by way of laser opening, can also be formed by modes such as etchings.
S103, the fill insulant into through-hole 401, formation abutted with the bottom hole of through-hole 401, and in through-hole 401 The insulated column of wall swelling cooperation.
Wherein it is possible to generally be needed using modes fill insulant, insulating materials into through-hole 401 such as vapor deposition or deposition Fill up through-hole 401.
S104, encapsulated layer 500 is formed on cathode layer 400.Wherein, encapsulated layer 500 can pass through inkjet printing, coating etc. Mode is formed.
In the production method for the flexible display apparatus that embodiment provided in an embodiment of the present invention provides, it is initially formed through yin Pole layer 400, and through at least one metal layer between cathode layer 400 and the underlay substrate 100 of array substrate 200 Through-hole, then the fill insulant into through-hole 401, formation are abutted with the bottom hole of through-hole 401, and swollen with the inner wall of through-hole 401 The insulated column 600 of tight fit;The temperature of insulating materials is higher during due to fill insulant, so that being located at metal layer The hole wall of 401 part of through-hole can be heated outside expansion, and insulating materials temperature declines after end-of-fill, at this time the hole of through-hole 401 Wall is to contract, so that the insulated column 600 being formed in through-hole 401 be held tightly;Using this across cathode layer 400 and cathode layer The insulated column 600 of at least one metal layer between 400 and the underlay substrate 100 of array substrate 200 passes through model moral with the prior art Hua Li is attached to each other each film layer and compares, and each film layer is attached to each other outer in the present invention except through Van der Waals force, also passes through insulated column 600 connections, therefore, the present invention significantly improves the connection between cathode layer 400, pixel confining layer 301 and array substrate 200 Power is reduced or avoided between above-mentioned film layer in the process of bending and the case where removing or separating occurs, and improves Flexible Displays dress Set 1 service life.
In a kind of feasible implementation, insulated column 600 specifically can be with first layer encapsulated layer 501 by primary depositing technique It is formed.For example, when first layer encapsulated layer 501 is inorganic material, at this point, in 400 disposed thereon first layer encapsulated layer 501 of cathode layer The some materials of material, first layer encapsulated layer 501 can be packed into through-hole 401, and insulated column 600 is formed in through-hole 401, that is, After first layer encapsulated layer 501 is formed well, insulated column 600 has been formed simultaneously in through-hole 401.
Further, after deposition, if having hole in insulated column 600, in order to guarantee the outer wall of insulated column 600 and lead to Between the hole wall in hole 401 swelling cooperation, guarantee insulated column 600 and its across layer fastening force, the system of the present embodiment Make method further include: be embedded in hold-down column 601 into the hole of insulated column 600, insulated column is further ensured that by hold-down column 601 Swelling cooperation between 600 outer wall and the hole wall of through-hole 401.
The specific production method includes: that second layer encapsulated layer 502 and insertion hole are formed on first layer encapsulated layer 501 In hold-down column 601.It is understood that during forming second layer encapsulated layer 502, the portion of second layer encapsulated layer 502 Point material can be packed into hole, to form hold-down column 601 in hole so that encapsulated layer 500 and insulated column 600 this A overall structure is more stable, and attachment force is stronger, and then improves encapsulated layer 500, cathode layer 400, pixel confining layer 301, battle array Attachment force between column substrate 200 improves the stability of total.
The production method of flexible display apparatus provided in this embodiment can be used for making provided by the above embodiment flexible aobvious Showing device, implements principle and technical effect is same as the previously described embodiments, for same or similar this implementation of concept Example no longer repeats one by one, specifically can refer to the description of above-described embodiment.Finally, it should be noted that the above various embodiments is only to say Bright technical solution of the present invention, rather than its limitations;Although present invention has been described in detail with reference to the aforementioned embodiments, Those skilled in the art should understand that: it can still repair technical solution documented by foregoing embodiments Change, or equivalent substitution of some or all of the technical features;And these are modified or replaceed, and do not make corresponding skill The essence of art scheme departs from the scope of the technical solutions of the embodiments of the present invention.

Claims (12)

1. a kind of flexible display apparatus, including array substrate, multiple luminescence units, first electrode layer and the encapsulation being stacked Layer, wherein the display device further includes luminous zone corresponding with the multiple luminescence unit, and adjacent with the luminous zone Non-light-emitting area, which is characterized in that the non-light-emitting area is provided with through-hole, and the through-hole runs through the first electrode layer, and passes through Wear at least one metal layer between the first electrode layer and the underlay substrate of the array substrate;
The flexible display apparatus further includes the insulated column for being threaded through in the through-hole and cooperating with the through-hole swelling.
2. flexible display apparatus according to claim 1, which is characterized in that the array substrate includes source/drain, described Through-hole runs through the source/drain.
3. flexible display apparatus according to claim 2, which is characterized in that further include being arranged in the array substrate and institute The second electrode lay between first electrode layer is stated, the second electrode lay is electrically connected with the source/drain, and the through-hole runs through institute State the second electrode lay.
4. flexible display apparatus according to claim 1, which is characterized in that the array substrate includes storage capacitance, institute Stating storage capacitance includes the top electrode being oppositely arranged and lower electrode;
The through-hole runs through at least one of the top electrode and the lower electrode.
5. flexible display apparatus according to claim 1, which is characterized in that the array substrate include source/drain and Storage capacitance, the storage capacitance include the top electrode being oppositely arranged and lower electrode;
The through-hole includes: the first through hole through the source/drain, and in the top electrode and the lower electrode The second through-hole of at least one.
6. flexible display apparatus according to claim 1, which is characterized in that the through-hole is through to the underlay substrate, The insulated column is connected to the underlay substrate towards on the upper surface of the encapsulated layer.
7. flexible display apparatus according to claim 1, which is characterized in that the through-hole is multiple, multiple through-hole difference Positioned at the two sides of the luminous zone, and it is located at the inclined direction of the through-hole of the luminous zone side and is located at the luminous zone The inclined direction of the through-hole of the other side is opposite.
8. flexible display apparatus according to claim 1-7, which is characterized in that the insulated column and the encapsulation Layer is integrally formed.
9. flexible display apparatus according to claim 8, which is characterized in that have hole, the hole in the insulated column The hold-down column for cooperating the hole wall swelling of the outer wall and the through-hole of the insulated column is embedded in gap.
10. flexible display apparatus according to claim 9, which is characterized in that the encapsulated layer includes first layer encapsulated layer And it is covered on the second layer encapsulated layer on the first layer encapsulated layer;
The insulated column and the first layer encapsulated layer are integrally formed;
The hold-down column and the second layer encapsulated layer are integrally formed.
11. flexible display apparatus according to claim 10, which is characterized in that the first layer encapsulated layer is inorganic encapsulated Layer, the second layer encapsulated layer are organic encapsulation layer.
12. flexible display apparatus according to claim 1-7, which is characterized in that further include being arranged in the envelope It fills between layer and the array substrate, and the pixel confining layer for separating each luminescence unit;The pixel confining layer There is support portion, the first electrode layer covers at least partly described support portion, described on towards the face of the first electrode layer Through-hole runs through the support portion.
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CN110649176A (en) * 2019-09-16 2020-01-03 合肥维信诺科技有限公司 Anode plate, display panel and display device
CN112909057A (en) * 2021-01-27 2021-06-04 京东方科技集团股份有限公司 Display substrate, manufacturing method thereof and display device
TWI735241B (en) * 2020-01-14 2021-08-01 友達光電股份有限公司 Flexible display panel

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