CN110649176A - Anode plate, display panel and display device - Google Patents
Anode plate, display panel and display device Download PDFInfo
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- CN110649176A CN110649176A CN201910871388.5A CN201910871388A CN110649176A CN 110649176 A CN110649176 A CN 110649176A CN 201910871388 A CN201910871388 A CN 201910871388A CN 110649176 A CN110649176 A CN 110649176A
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- 238000005452 bending Methods 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000010410 layer Substances 0.000 claims description 200
- 239000010408 film Substances 0.000 claims description 77
- 239000000463 material Substances 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 5
- 230000005525 hole transport Effects 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 239000012044 organic layer Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 abstract description 6
- 239000003990 capacitor Substances 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides an anode plate, a display panel and a display device. The anode plate comprises a substrate, an array film layer arranged on the substrate and a plurality of bending resistant pieces, wherein the bending resistant pieces are embedded in the array film layer along the laminating direction from the substrate to the array film layer or along the laminating direction from the array film layer to the substrate.
Description
Technical Field
The invention belongs to the technical field of display panels, and particularly relates to an anode plate, a display panel and a display device.
Background
An organic light emitting semiconductor (OLED) belongs to a current type organic light emitting device, and emits light by injecting and recombining carriers, and the intensity of light emission is proportional to the injected current. Under the action of an electric field, holes generated by an anode and electrons generated by a cathode move, are respectively injected into a hole transport layer and an electron transport layer, and migrate to a light emitting layer. When the two meet at the light emitting layer, energy excitons are generated, thereby exciting the light emitting molecules to finally generate visible light.
At present, organic light emitting semiconductors are increasingly widely applied to flexible display panels, the flexible display panels have the characteristic of being bendable, and in the process of being bent for many times, functional film layers in the display panels are prone to peeling or separating, or functional film layers are prone to breaking or cracking.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is that the functional film layers of the existing display panel are easily peeled or separated, or the functional film layers are cracked or cracked during the bending process, and further, an anode plate, a display panel and a display device are provided.
The anode plate provided by the invention comprises a substrate and an array film layer arranged on the substrate, and is characterized by further comprising a plurality of bending-resistant pieces, wherein the bending-resistant pieces are embedded in the array film layer along the laminating direction from the substrate to the array film layer or along the laminating direction from the array film layer to the substrate.
Furthermore, in the thickness direction of the array film layer, the bending-resistant piece is provided with a first extending end and a second extending end which are oppositely arranged, the distance between the first extending end and the second extending end is d, and the distance d between the adjacent bending-resistant pieces is different.
Further, the first extending end is flush with the surface of one side of the array film layer far away from the substrate, and the second extending end extends towards the side of the array film layer close to the substrate;
the distance d gradually increases or gradually decreases along the arrangement direction of the anti-bending pieces;
preferably, the bending-resistant pieces are arranged at equal intervals along the arrangement direction of the bending-resistant pieces.
Further, the first extending end is flush with the surface of one side, close to the substrate, of the array film layer, and the second extending end extends towards the side, far away from the substrate, of the array film layer;
the distance d gradually increases or gradually decreases along the arrangement direction of the bending-resistant pieces.
Furthermore, a plurality of grooves are arranged on the array film layer at intervals, and the anti-bending pieces are arranged in the grooves; preferably, the anti-bending piece is made of organic glue and is columnar; the substrate is a flexible substrate; preferably, the organic glue is polyimide;
preferably, the depth of adjacent grooves is different; preferably, along the arrangement direction of the grooves, the depth of the grooves is gradually increased or gradually decreased, and the length of the bending-resistant piece is the same as the depth of the grooves.
Further, the array film layer comprises a pixel circuit layer, a planarization layer, an anode layer and a pixel limiting layer which are sequentially stacked, wherein the pixel circuit layer is arranged on the substrate; preferably, the bending-resistant member is disposed perpendicular to the array film layer.
In addition, a display panel is also provided, and the display panel comprises the anode plate.
Further, an organic light emitting material layer is arranged on the pixel defining layer of the array film layer; preferably, the organic light emitting material layer includes a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer, which are sequentially stacked, and the hole injection layer is disposed on the pixel defining layer and is in contact with the anti-bending member.
Further, an encapsulation layer is arranged on one side, away from the array film layer, of the organic light-emitting material layer; preferably, the encapsulation layer is a thin film encapsulation layer; preferably, the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially stacked, and the first inorganic layer is disposed on and covers the organic light emitting material layer.
Further, a display device including any of the above display panels is also provided.
The technical scheme of the invention has the following advantages: the anode plate comprises a substrate, an array film layer arranged on the substrate and a plurality of bending resistant pieces, wherein the bending resistant pieces are embedded in the array film layer along the laminating direction from the substrate to the array film layer or along the laminating direction from the array film layer to the substrate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of an anode plate according to the present invention;
FIG. 2 is a top view of the array film of FIG. 1;
FIG. 3 is a schematic view of another construction of the anode plate of the present invention;
FIG. 4 is a schematic view of another construction of an anode plate according to the present invention;
FIG. 5 is a schematic view of another alternative construction of the anode plate of the present invention;
FIG. 6 is a schematic view of another alternative construction of the anode plate of the present invention;
reference numerals:
1-a substrate; 2-array film layer; 3-a layer of organic light emitting material; 4-an anti-buckling member; 4 a-a first extension end; 4 b-second extension end.
Detailed Description
The technical solutions of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 to 6, the anode plate provided by the present invention includes a substrate 1, an array film layer 3 disposed on the substrate 1, and a plurality of bending-resistant members 4 embedded in the array film layer 2 along the stacking direction from the substrate 1 to the array film layer 2 or along the stacking direction from the array film layer 2 to the substrate 1.
In the anode plate, the anti-bending piece 4 can improve the binding force among the membrane layers in the array membrane layer 2, thereby preventing the stripping or separation among the membrane layers in the array membrane layer 2 or the fracture or cracking in the array membrane layer in the bending process. When the bending times is 60K times in the reliability test of the soft screen, the bending radius is as follows: 5R, bending rate: after being bent for 3 tens of thousands of times at 30rpm, the film layers in the array film layer 2 can not be stripped or separated, and the film layers can not be broken or cracked.
In an optional embodiment, as shown in fig. 1, 2, 3, 4, and 6, in the thickness direction of the array film layer 2, the bending-resistant member 4 has a first extending end 4a and a second extending end 4b that are oppositely disposed, a distance between the first extending end 4a and the second extending end 4b is d, and distances d between adjacent bending-resistant members 4 are different, that is, by adjusting sizes of adjacent bending-resistant members 4 to be different, an effect of inserting into the array film layer 2 at intervals is formed, so that stress decomposition between the film layers in the array film layer 2 is facilitated during bending, and thus, a bonding force between the film layers is improved. Furthermore, a plurality of grooves are arranged on the array film layer 2 at intervals, the anti-bending pieces 4 are arranged in the grooves, and the depths of the adjacent grooves are different; preferably, the anti-bending piece 4 is made of organic glue and is columnar, and the organic glue is non-conductive, strong in flexibility and capable of effectively increasing the bonding force among the film layers; preferably, the substrate 1 is a flexible substrate; preferably, the organic glue is polyimide; in this embodiment, when each film layer in the array film layer 2 is prepared, a Mask is designed to etch and form holes at a plurality of fixed positions of each film layer, the holes do not affect signal transmission in the film layer, then the corresponding holes are filled with organic glue, the corresponding holes in each layer correspond to each other, and the organic glue in the corresponding holes are connected with each other to form the bending-resistant member 4.
As shown in fig. 1, 2 and 3, as a specific embodiment, the first extending end 4a is flush with a surface of a side of the array film layer 2 away from the substrate 1, and the second extending end 4b extends toward a side of the array film layer 2 close to the substrate 1; in the arrangement direction of the bending-resistant members 4, the distance d gradually decreases as shown in fig. 1, or gradually increases as shown in fig. 3. Preferably, the bending-resistant pieces are arranged at equal intervals along the arrangement direction of the bending-resistant pieces, so that the manufacturing process is simplified. Further, a plurality of grooves are arranged on the array film layer 2 at intervals, the anti-bending pieces 4 are arranged in the grooves, the depths of adjacent grooves are different, specifically, as shown in fig. 1, the depths of the grooves are gradually reduced in the arrangement direction of the grooves, and the lengths of the anti-bending pieces are the same as the depths of the grooves; as shown in fig. 3, along the arrangement direction of the grooves, the depth of the grooves is gradually increased, and the length of the bending-resistant piece is the same as the depth of the grooves; as shown in fig. 4, the depths of the adjacent grooves are different, and the length of the bending-resistant member is the same as the depth of the groove.
In an alternative embodiment, as shown in fig. 6, the first extending end 4a is flush with a surface of the array film layer 2 close to the substrate 1, and the second extending end 4b extends towards a side of the array film layer 2 away from the substrate 1; the distance d between the first extension end 4a and the second extension end 4b is gradually decreased (as shown in fig. 6) or gradually increased along the arrangement direction of the bending resistant members 4.
Certainly, as a deformable implementation manner, as shown in fig. 5, the distances d between adjacent bending-resistant members 4 are the same, further, a plurality of grooves are arranged at intervals on the array film layer 2, the bending-resistant members 4 are arranged in the grooves, the depths of the adjacent grooves are the same, and the lengths of the bending-resistant members 4 are the same as the depths of the grooves; preferably, the anti-bending piece 4 is made of organic glue and is columnar, and the organic glue is non-conductive, strong in flexibility and capable of effectively increasing the bonding force among the film layers; preferably, the substrate 1 is a flexible substrate; preferably, the organic glue is polyimide; in the embodiment, the array film layer 2 is firstly prepared, then the Mask design is adopted to directly form the grooves at a plurality of fixed positions of the array film layer 2 through one-time etching by exposure and development, and finally organic glue (such as polyimide) is adopted for one-time filling, so that the bonding force between the film layers is increased, the operation is simple and convenient, and the complicated steps caused by respectively etching holes between the film layers and then aligning are avoided.
In an alternative embodiment, the array film layer 2 includes a pixel circuit layer, a planarization layer, an anode layer, and a pixel defining layer, which are sequentially stacked, and the pixel circuit layer is disposed on the substrate 1; preferably, the bending-resistant piece 4 is perpendicular to the array film layer 2, so that organic glue is conveniently filled in the groove, the groove can be filled with the organic glue, and the bonding force between the film layers is improved.
Further, the pixel circuit layer forms each film layer of the thin film transistor, such as a semiconductor layer (P-Si) formed on the substrate 1, a gate insulating layer formed on the semiconductor layer, a capacitor insulating layer located above the gate insulating layer, and an interlayer dielectric layer located above the capacitor insulating layer, wherein the planarization layer is located above the interlayer dielectric layer, and the pixel defining layer is located on the planarization layer. The pixel circuit layer includes a source electrode, a drain electrode, and a gate electrode in a Thin Film Transistor (TFT), the gate electrode being positioned between the gate insulating layer and the capacitor insulating layer, the source electrode and the drain electrode being in contact with the semiconductor layer (P-Si). The capacitor of the pixel circuit layer comprises a first polar plate and a second polar plate, the first polar plate is positioned between the capacitor insulating layer and the interlayer dielectric layer, and the second polar plate is positioned between the grid insulating layer and the capacitor insulating layer.
In an optional embodiment, the substrate 1 includes a first flexible layer, a first barrier layer and a second flexible layer, which are sequentially stacked, an array film layer is formed on one side of the second flexible layer, which is far away from the first barrier layer, and the first barrier layer is disposed between the first flexible layer and the second flexible layer, so that the ability of the substrate to block water and oxygen can be improved. Specifically, the material of the first flexible layer and the second flexible layer includes a Polyimide (PI) material, the first barrier layer is an inorganic layer, and the material of the inorganic layer includes a material such as silicon oxide (SiOx) or silicon nitride (SiNx). Of course, the substrate 1 may be a non-flexible substrate, such as a glass substrate, as needed.
In addition, the invention also provides a display panel which comprises the anode plate.
In an alternative embodiment, an organic light emitting material layer is disposed on the pixel defining layer of the array film layer 2; preferably, the organic light emitting material layer comprises a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer and an electron injection layer which are sequentially stacked, the hole injection layer is arranged on the pixel limiting layer and is in contact with the anti-bending piece 4, further, the anti-bending piece 4 is made of organic glue, the anti-bending piece 4 is in contact with the hole injection layer, the combination tightness between the anti-bending piece 4 and the hole injection layer is favorably improved, and the combination tightness between the array film layer 2 and the organic light emitting material layer and the combination tightness between the array film layer and the organic light emitting material layer are finally improved,
Further, an encapsulation layer is arranged on one side, away from the array film layer, of the organic light-emitting material layer; preferably, the encapsulation layer is a thin film encapsulation layer; preferably, the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially stacked, and the first inorganic layer is disposed on and covers the organic light emitting material layer. Preferably, the materials of the first inorganic layer and the second inorganic layer are both silicon oxide or silicon nitride. The inorganic layer can improve the adhesive force of the film layer and can improve the packaging effect.
In addition, the invention also provides a display device which comprises the display panel. For example, the display device may be a cell phone, a television, a tablet, a computer, or a camera.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. An anode plate comprises a substrate and an array film layer arranged on the substrate, and is characterized by also comprising,
and the bending-resistant pieces are embedded in the array film layer along the lamination direction from the substrate to the array film layer or along the lamination direction from the array film layer to the substrate.
2. The anode plate of claim 1, wherein the anti-buckling members have a first extending end and a second extending end which are opposite to each other in the thickness direction of the array film layer, the distance between the first extending end and the second extending end is d, and the distances d between the adjacent anti-buckling members are different.
3. The anode plate of claim 2, wherein the first extended end is flush with a surface of a side of the array film layer away from the substrate, and the second extended end extends toward a side of the array film layer adjacent to the substrate;
the distance d gradually increases or gradually decreases along the arrangement direction of the anti-bending pieces;
preferably, the bending-resistant pieces are arranged at equal intervals along the arrangement direction of the bending-resistant pieces.
4. The anode plate of claim 2, wherein the first extended end is flush with a side surface of the array film layer near the substrate, and the second extended end extends toward a side of the array film layer away from the substrate;
the distance d gradually increases or gradually decreases along the arrangement direction of the bending-resistant pieces.
5. The anode plate of claim 1, wherein a plurality of grooves are spaced on the array film layer, and the anti-bending members are disposed in the grooves; preferably, the anti-bending piece is made of organic glue and is columnar; the substrate is a flexible substrate; preferably, the organic glue is polyimide;
preferably, the depth of adjacent grooves is different; preferably, along the arrangement direction of the grooves, the depth of the grooves is gradually increased or gradually decreased, and the length of the bending-resistant piece is the same as the depth of the grooves.
6. The anode plate of claim 1, wherein the array film layer comprises a pixel circuit layer, a planarization layer, an anode layer, and a pixel defining layer, which are sequentially stacked, the pixel circuit layer being disposed on the substrate; preferably, the bending-resistant member is disposed perpendicular to the array film layer.
7. A display panel comprising the anode plate of any one of claims 1-6.
8. The display panel according to claim 7, wherein an organic light emitting material layer is disposed on the pixel defining layer of the array film layer; preferably, the organic light emitting material layer includes a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer, which are sequentially stacked, and the hole injection layer is disposed on the pixel defining layer and is in contact with the anti-bending member.
9. The display panel according to claim 8, wherein an encapsulation layer is disposed on a side of the organic light emitting material layer away from the array film layer; preferably, the encapsulation layer is a thin film encapsulation layer; preferably, the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially stacked, and the first inorganic layer is disposed on and covers the organic light emitting material layer.
10. A display device comprising the display panel of any one of claims 7-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910871388.5A CN110649176A (en) | 2019-09-16 | 2019-09-16 | Anode plate, display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910871388.5A CN110649176A (en) | 2019-09-16 | 2019-09-16 | Anode plate, display panel and display device |
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| CN110649176A true CN110649176A (en) | 2020-01-03 |
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| CN201910871388.5A Pending CN110649176A (en) | 2019-09-16 | 2019-09-16 | Anode plate, display panel and display device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111383535A (en) * | 2020-03-25 | 2020-07-07 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN111477674A (en) * | 2020-05-22 | 2020-07-31 | 昆山国显光电有限公司 | Array substrate, display panel and display device |
| CN111509015A (en) * | 2020-04-27 | 2020-08-07 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
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| CN109300950A (en) * | 2018-09-29 | 2019-02-01 | 云谷（固安）科技有限公司 | Flexible display apparatus |
| CN109427818A (en) * | 2017-08-31 | 2019-03-05 | 昆山国显光电有限公司 | A kind of foldable array substrate and display device |
| KR20190081475A (en) * | 2017-12-29 | 2019-07-09 | 엘지디스플레이 주식회사 | Display apparatus |
-
2019
- 2019-09-16 CN CN201910871388.5A patent/CN110649176A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109427818A (en) * | 2017-08-31 | 2019-03-05 | 昆山国显光电有限公司 | A kind of foldable array substrate and display device |
| KR20190081475A (en) * | 2017-12-29 | 2019-07-09 | 엘지디스플레이 주식회사 | Display apparatus |
| CN109300950A (en) * | 2018-09-29 | 2019-02-01 | 云谷（固安）科技有限公司 | Flexible display apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111383535A (en) * | 2020-03-25 | 2020-07-07 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN111383535B (en) * | 2020-03-25 | 2022-07-08 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN111509015A (en) * | 2020-04-27 | 2020-08-07 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111477674A (en) * | 2020-05-22 | 2020-07-31 | 昆山国显光电有限公司 | Array substrate, display panel and display device |
| CN111477674B (en) * | 2020-05-22 | 2022-08-30 | 昆山国显光电有限公司 | Array substrate, display panel and display device |
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Application publication date: 20200103 |