CN104521021A - Encapsulated components comprising an organic layer, and method for the production thereof - Google Patents

Encapsulated components comprising an organic layer, and method for the production thereof Download PDF

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Publication number
CN104521021A
CN104521021A CN201380042541.4A CN201380042541A CN104521021A CN 104521021 A CN104521021 A CN 104521021A CN 201380042541 A CN201380042541 A CN 201380042541A CN 104521021 A CN104521021 A CN 104521021A
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China
Prior art keywords
electrode
carrier
layer
organic functional
laminar structure
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蒂洛·罗伊施
菲利普·施万布
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/81Electrodes
    • H10K30/82Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/88Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/828Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8423Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)

Abstract

In different embodiments a component (100) is provided, the component having: a support (102); a first electrode (110) on or over the support (102); an organic functional layer structure (112) on or over the first electrode (110); a second electrode (114) on or over the organic functional layer structure (112), wherein the first electrode (110) and the second electrode (114) are designed in such a manner that an electrical connection of the first electrode (110) to the second electrode (114) is established only by the organic functional layer structure (112); and an encapsulation (108), wherein the first electrode (110) and/or the second electrode (114) is/are electrically coupled to the support (102) and wherein, together with the support (102) the encapsulation (108) forms a structure which hermetically seals the organic functional layer structure (112) and the first electrode (110) or the second electrode (114) or both, in respect of water and/or oxygen.

Description

There is packaging and the manufacture method thereof of organic layer
Technical field
A kind of device and a kind of method manufactured for it are provided in different designs.
Background technology
Device, such as organic optoelectronic device, such as Organic Light Emitting Diode (organic lightemitting diode-OLED) or organic solar batteries have the first electrode and the second electrode constructs together with organic function layer in-between.
By means of electrode, in case of oleds by charge carrier by means of have the contact zones of high conductance, the contact zones of such as metal from electric supply installation be transferred to organic function layer structure.
The energising of OLED needs electric current to be distributed to equably in the face of electrode with in the face of component from the contact point the edge of OLED ceramic tile.
In the ideal case, the surface of the planar of electrode should have the surface size identical with the surface of the planar of organic functional laminar structure.
The embodiment with high conductance can be hindered to the additional requirement of electrode.
Such as, to the transparency of electrode and/or to the requirement of process time not can when any materials with in any thickness realize.
This can cause, and the electrode by planar realizes ratio usually as the less conductance in order to realize desired by uniform CURRENT DISTRIBUTION.
However, the common feasible program distributed equably in face by electric current is imported at multiple contact point distributed above seamed edge in face or (can more simple realization ground) by electric current.
In order to limit the quantity of contact point, except the active face of OLED, usually need the contact zones for CURRENT DISTRIBUTION.
Contact zones are applied on the passive edge of device usually.
In the device that another is traditional, contact zones to be applied in active face (bus) to be transferred to its face from component sidepiece by electric current.When abandoning described contact zones, total outward appearance or its size of device can be damaged, such as, by having the requirement of the light-emitting area of uneven luminous density or the raising to the conductance of electrode.
For to contact traditional method of organic functional laminar structure be in the region of active face, i.e. utilizing emitted light or the convert light of organic function layer structure or side forms contact zones and apply transparent electrode.
In the method that another is traditional, the electrode by means of packaging part insulation can be energized from outside by means of the through contact site of packaging part, and namely electricity runs.
Described method can have following shortcoming: minimizing, such as infringement are used for the protected effect of packaging part about harmful substance of organic functional laminar structure.
Harmful substance, such as solvent, such as water; And/or oxygen may can cause the degraded of organic material or service life that is aging and then restriction organic assembly.
Therefore, organic material or organic layer should be subject to the protection of waterproof and/or oxygen and then usually packed.
But, be the possible weak part for the diffuse flow about water and/or oxygen in packaging part through the through contact site of packaging part, such as VIA and then should be avoided.
To the requirement of transparency electrode limitation to for the material of electrode and the selection of layer thickness thereof.Thus, the limited and then restriction of conductance has the plane sizes of the OLED of uniform luminous density.In addition, the contact zones of OLED are macroscopic and that impact is aesthstic total outward appearances.
Summary of the invention
In various embodiments, propose a kind of device and a kind of for its manufacture method, by described Apparatus and method for it is possible that by encapsulation reduce penetrating part quantity and by CURRENT DISTRIBUTION in component face.
In the scope of this specification, can not consider that organic material is understood as carbon compound that exist with the form that chemistry is consistent, that be characterised in that distinctive physics and chemistry characteristic by corresponding state of aggregation.In addition, in the scope of this specification, can not consider corresponding state of aggregation inorganic material is understood as exist with the consistent form of chemistry, be characterised in that distinctive physics and chemistry characteristic not there is carbon compound or single carbon compound.In the scope of this specification, can not consider corresponding state of aggregation organic-inorganic material (hybrid material) is understood as exist with the consistent form of chemistry, be characterised in that distinctive physics and chemistry characteristic there is the compound comprising carbon compound part and do not have carbon compound part.In the scope of this specification, term " material " comprises whole above-mentioned material, such as organic material, inorganic material and/or hybrid material.In addition, in the scope of this specification, can understand material blends as follows: part is made up of two or more different materials, its part such as very finely distributes.The material blends be made up of one or more organic materials, one or more inorganic material or one or more hybrid materials or material are understood as material type.Term " material " synonymously can be applied with term " material ".
In the scope of this specification, harmful environmental impact can be interpreted as and all may can cause the degraded of organic material or aging and then the impact of service life of organic assembly can be limited, such as harmful substance, such as oxygen and/or such as solvent, such as water.
In the scope of this specification, ground floor can be surrounded by the second layer and be interpreted as: the common boundary face that there is the boundary face of the transverse direction about ground floor of ground floor and the second layer.In other words: ground floor and the second layer can have physical contact about the boundary face of the transverse direction of ground floor.The common boundary face of the degree of physical contact or ground floor and the second layer can determine the degree of surrounding about the share of the size of the boundary face of the transverse direction of the first substrate, such as whether the second layer partially or even wholly surrounds ground floor.If the second layer surrounds the side of the ground floor of plane, so this can be interpreted as horizontal encirclement.The side of ground floor can be such as the face with the shortest length of ground floor of ground floor.Additionally, ground floor and the second layer such as can share a boundary face in the boundary face of the plane of ground floor.
In various embodiments, provide a kind of device, described device has: carrier; The first electrode above carrier; On the first electrode or the organic functional laminar structure of top; The second electrode above organic functional laminar structure, wherein the first electrode and the second electrode are configured to, and the electrical connection of the first electrode and the second electrode is set up by means of only organic functional laminar structure; And packaging part; Wherein the first electrode and/or the second electrode and carrier electrical coupling; And wherein packaging part and carrier jointly form the structure sealed closely relative to water and/or oxygen by least one electrode in organic functional laminar structure and the first electrode and the second electrode.
In the scope of this specification, can by be only connected to each other by means of organic function layer, first electrode namely without direct physical contact and electrical contact and the second electrode be interpreted as the electrode be electrically insulated from each other.
In other words: the first electrode and the second electrode can be configured to, first electrode and the second electrode are not electrically connected to each other by other means except organic functional laminar structure, namely opto-electronic device is configured to, two electrodes are electrically insulated from each other except organic functional laminar structure, such as not physical contact with one another.
At this, the encapsulation of tight seal can be configured to that packaging part links up with the atresia of carrier, namely around, directly or be indirectly connected.
The layer of tight seal such as can have and is less than about 10 -1g/ (m 2d) the diffusivity about water and/or oxygen, the covering of tight seal and/or the carrier of tight seal such as can have and be less than about 10 -4g/ (m 2d), such as about 10 -4g/ (m 2d) to about 10 -10g/ (m 2d) in scope, such as about 10 -4g/ (m 2d) to about 10 -6g/ (m 2d) diffusivity about water and/or oxygen in scope.
In different designs, the material about water tight seal or the material blends about water tight seal can have pottery, metal and/or metal oxide or be made up of it.
Direct connection can be configured to physical contact.Indirectly connects and can have other layer between packaging part and carrier, but described layer itself is tight seal about water and/or oxygen that such as there is insulating barrier or the first electrode or the second electrode.
In a design, carrier can have the material or material blends that are selected from following material group or be made up of it: organic material; Inorganic material, such as steel, aluminium, copper; Or hybrid inorganic-organic materials, such as organically-modified pottery; Such as organic material, such as plastics, such as polyolefin (such as there is high density or low-density polyethylene (PE) or polypropylene (PP)), polyvinyl chloride (PVC), polystyrene (PS), polyester, Merlon (PC), PETG (PET), polyether sulfone (PES), PEN (PEN), polymethyl methacrylate (PMMA), polyimides (PI), colourless polyimides (colorless Polyimid-CPI), polyether-ether-ketone (PEEK).
In another design, carrier can be formed by plane earth.
In another design, carrier can be formed flexibly.
In another design, carrier can be formed pellucidly.
In another design, carrier can be formed conductively.
In another design, carrier can be configured to the electric conductor of intrinsic, such as, be configured to the metallic plate that is made up of aluminium, copper, steel or film.
The material of intrinsic conduction can have the diffusion barrier of the intrinsic about water and/or oxygen simultaneously.Thus, this limits the thickness of carrier in the following cases: the thin carrier with the thickness of about 10nm to about 300nm be such as made up of organic and/or inorganic material reliably can not form tight seal, such as implement.But the structure of the layer cross section of concrete thickness and concrete material or material blends and carrier is relevant.
Carrier also can have the material identical with the second electrode or identical material blends.
In another design, carrier can have the region of at least one electric insulation and the region of at least one conduction.
The thickness in the region of at least one conduction should be chosen as, and the region of described conduction can not or extremely be passed by material such as water, oxygen or the solvent of infringement OLED to small part at the most.But concrete thickness can be relevant to the structure of the concrete material in region of conduction or the layer cross section of material blends and carrier.
When carrier self is non-conductive or the conductivity of carrier is not enough, or when carrier should not conduct electricity, the region of conduction can be set to, such as be applied on carrier.Such as can use nonconducting carrier, to make the element on carrier, the region of such as conducting electricity relative to ambient dielectric.
In the region of the multiple conductions be not directly communicated with of carrier, the first electrode can from the region electrical coupling of the conduction different with the second electrode of carrier.
In another design, the region of conduction can be configured to the conductor layer on the region of electric insulation, such as nonconducting film, such as, have the coating of conduction or the plastic film of conductor layer structure, such as copper, silver, aluminium, chromium, nickel or similar material.
In order to apply the coating, the such as copper that conduct electricity, can will increase attached dose, such as the layers of chrome of the thickness such as with about 1nm to about 50nm is applied on region that is nonconducting, that namely insulate.Metal level can such as be applied on nonconducting region by means of evaporation or sputter.
In another design, insulating barrier can be formed between the first electrode and carrier.
Insulating barrier can be configured to electrical insulator, namely be configured to electric insulation layer.
In addition, insulating barrier can be configured to the surface roughness for reducing such as carrier, namely for planarization.
In addition, insulating barrier can be configured to, by the layer above insulating barrier relative to harmful substance, such as water and/or oxygen tight seal.
In a design, insulating barrier can have the material or material blends that are selected from following material group or be made up of it: organic material, inorganic material, the such as product of oxide, nitride and/or sol gel process, such as spin-coating glass, or hybrid inorganic-organic materials, such as organically-modified pottery, such as organic material, such as plastics, such as polyolefin (such as there is high density or low-density polyethylene (PE) or polypropylene (PP)), polyvinyl chloride (PVC), polystyrene (PS), polyester, Merlon (PC), PETG (PET), polyether sulfone (PES), PEN (PEN), polymethyl methacrylate (PMMA), polyimides (PI), colourless polyimides (colorless Polyimid-CPI), polyether-ether-ketone (PEEK), epoxides, acrylate, pitch, the individual layer (selfassembled monolayer-SAM) of self-organizing, such as silane compound or mercaptan compound.
In a design, insulating barrier can have in the scope of about 0.1nm to about 1mm, such as in the scope of about 1nm to about 100 μm thickness.
There is the insulation layers of the thickness of about 0.1nm if the individual layer by means of self-organizing is formed.
In a design, insulating barrier can have organic material or organic material mixture and inorganic material or inorganic material mixture or be formed by it.Thus, the water be such as diffused in insulating barrier can be included in, such as be stored in the organic moiety of insulating barrier.
Insulating barrier also can to have with organic functional laminar structure same or similar material or be made up of it.
In other words: when having the insulating barrier optional time of electric insulation effect about carrier, the first electrode can fully be surrounded by organic functional laminar structure.
At this, insulating barrier can be configured to for carrier planarization and/or for carrier with the electric insulation of the first electrode.
In another design, insulating barrier can be transparent or semi-transparently form.
In another design, insulating barrier can surround the first electrode at least in part, makes insulating barrier form the electric insulation part of the transverse direction between the first electrode and the second electrode and the first electrode and organic functional laminar structure electrical coupling.
In another design, the first electrode can be formed pellucidly.
In another design, organic functional laminar structure can be formed pellucidly.
In another design, the second electrode can be formed pellucidly.
In another design, packaging part can be formed pellucidly.
In another design, organic functional laminar structure can surround the first electrode, makes organic functional laminar structure make the first electrode and the horizontal physical insulation of the second electrode.
In another design, packaging part can surround multiple Rotating fields together with carrier, makes single Rotating fields have following layers: insulating barrier; First electrode; Organic functional laminar structure; With the second electrode.
But, at this, such as when with the region that the mode of carrier physical contact applies the first electrode or carrier or carrier be configured to the first electrode, i.e. the first electrode can consistent with the carrier of conduction time, insulating barrier can be optional with the specific design scheme of carrier relatively.
In another design, multiple Rotating fields can be configured to, and makes different Rotating fields have the first common electrode and/or the second common electrode.
In another design, the first common electrode of multiple Rotating fields and/or the second common electrode can between multiple Rotating fields with common carrier electrical contact.
In another design, different Rotating fields can be arranged each other abreast.
In another design, different Rotating fields can be arranged each other stackedly.
In another design, the electrical coupling of the first electrode and carrier or the electrical coupling of the second electrode and carrier can have through contact site.
In another design, the first electrode can be configured to, and makes the first electrode and carrier electrical coupling and the first electrode laterally surrounds insulating barrier at least in part.
In another design, the second electrode can be configured to, and makes the second electrode and carrier electrical coupling and the second electrode surrounds organic functional laminar structure or organic functional laminar structure and insulating barrier at least in part.
In another design, device can be configured to opto-electronic device, preferably be configured to Organic Light Emitting Diode or be configured to organic solar batteries.
In various embodiments, provide a kind of method for the manufacture of device, described method has: above carrier, form the first electrode; On the first electrode or top formed organic functional laminar structure; The second electrode is formed above organic functional laminar structure; Wherein the first electrode and the second electrode are configured to, and the electrical connection of the first electrode and the second electrode is set up by means of only organic functional laminar structure; And formation packaging part; Wherein packaging part and carrier jointly form the structure making at least one electrode in organic functional laminar structure and the first electrode and the second electrode relative to water and/or oxygen tight seal.
In a design of method, carrier can have the material or material blends that are selected from following material group or be formed by it: organic material; Inorganic material; Or hybrid inorganic-organic materials.
In another design of method, carrier can be formed by plane earth.
In another design of method, carrier can be formed flexibly.
In another design of method, carrier can be formed pellucidly.
In another design of method, carrier can be formed conductively.
In another design of method, carrier can be configured to the electric conductor of intrinsic.
In a design of method, carrier can have the region of at least one electric insulation and the region of at least one conduction.
In another design of method, the region of conduction can be configured to the conductor layer on the region of electric insulation.
In another design of method, before the first electrode is applied on carrier, insulating barrier can be applied to above carrier.
In another design of method, insulating barrier can be formed between the first electrode and carrier.
Insulation layers is if be configured to electrical insulator, be namely configured to electric insulation layer.
In addition, insulating barrier can be configured to surface roughness for reducing such as carrier, namely for planarization.
Insulating barrier can additionally be configured to, and makes on the insulating layer or the layer of top carries out tight seal about harmful substance, such as water and/or oxygen.
In a design of method, insulating barrier can have the material or material blends that are selected from following material group or be formed by it: organic material, inorganic material, the such as product of oxide, nitride and/or sol gel process, such as spin-coating glass, or hybrid inorganic-organic materials, such as organically-modified pottery, such as organic material, such as plastics, such as polyolefin (such as there is high density or low-density polyethylene (PE) or polypropylene (PP)), polyvinyl chloride (PVC), polystyrene (PS), polyester, Merlon (PC), PETG (PET), polyether sulfone (PES), PEN (PEN), polymethyl methacrylate (PMMA), polyimides (PI), colourless polyimides (colorless Polyimid-CPI), polyether-ether-ketone (PEEK), epoxides, acrylate, pitch, the individual layer (selfassembled monolayer-SAM) of self-organizing, be such as silane compound or mercaptan compound.
In a design of method, insulating barrier can be configured to have the thickness in the scope of about 0.1nm to about 1mm, such as in the scope of about 1nm to about 100 μm.
There is the insulation layers of the thickness of about 0.1nm if the individual layer by means of self-organizing is formed.
In a design of method, insulating barrier can have organic material or organic material mixture and inorganic material or inorganic material mixture or be formed by it.Thus, the water be such as diffused in insulating barrier can be included in, such as be stored in the organic moiety of insulating barrier.
In a design of method, insulating barrier can be formed by means of print process and/or cladding process, such as by means of blade coating, spraying, flexible printing, mould printing, silk screen printing, showering, dip-coating, rotary coating, seam type spraying, physics and/or the vapour deposition process of chemistry, atomic layer deposition method and/or molecular-layer deposition method.
In another design of method, insulating barrier can be formed pellucidly or semi-transparently.
In another design of method, can insulating barrier be applied, make insulating barrier surround the first electrode, to such an extent as to insulating barrier forms the electric insulation part of the transverse direction between the first electrode and the second electrode and the first electrode and organic functional laminar structure electrical coupling.
In another design of method, the first electrode can be formed pellucidly.
In another design of method, organic functional laminar structure can be formed pellucidly.
In another design of method, the second electrode can be formed pellucidly.
In another design of method, packaging part can be formed pellucidly.
In another design of method, can organic functional laminar structure be applied, make organic functional laminar structure surround the first electrode, to such an extent as to organic functional laminar structure makes the first electrode and the horizontal physical insulation of the second electrode.
In another design of method, packaging part can be formed in above carrier, and make packaging part surround multiple Rotating fields on common carrier, wherein single Rotating fields has following layers: insulating barrier; First electrode; Organic functional laminar structure; With the second electrode.
In another design of method, different Rotating fields can be applied, make different Rotating fields have the first common electrode and/or the second common electrode.
In another design of method, different Rotating fields can be arranged each other abreast.
In another design of method, different Rotating fields can be arranged each other stackedly.
In another design of method, the electrical coupling of the first electrode and carrier or the second electrode can be configured to the electrical coupling of carrier that VIA is connected, the through contact site of such as insulating barrier.
In another design of method, the first electrode can be applied, make the first electrode and carrier electrical coupling and the first electrode laterally surrounds insulating barrier.
In another design of method, the second electrode can be applied, make the second electrode and carrier electrical coupling and the second electrodes surrounding organic functional laminar structure or organic functional laminar structure and insulating barrier.
In a design of method, device can as opto-electronic device, preferably as Organic Light Emitting Diode or as organic solar batteries manufacture.
Accompanying drawing explanation
Shown in the drawings and elaborate embodiments of the invention hereinafter.
Accompanying drawing illustrates:
Fig. 1 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments;
Fig. 2 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments;
Fig. 3 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments;
Fig. 4 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments;
Fig. 5 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments;
Fig. 6 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments;
Fig. 7 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments; And
Fig. 8 illustrates the diagrammatic top view of the opto-electronic device according to different embodiments.
Embodiment
With reference to accompanying drawing in description detailed below, described accompanying drawing forms a part for described description, and illustrates in the drawing and can implement concrete execution mode of the present invention for explanation.In this regard, be relevant to the orientation of described (multiple) accompanying drawing and user to term such as " on ", D score, "front", "rear", " front portion ", " rear portion " etc.Because the part of execution mode can be located with multiple different orientation, thus direction term only for illustration of and be restricted never in any form.It being understood that the execution mode that can use other and change structural or in logic can be carried out, and not departing from protection scope of the present invention.It being understood that as long as no distinguishingly illustrating in addition, just the feature of different exemplary execution mode described here can be combined mutually.Therefore, the following detailed description can not be interpreted as restricted meaning, and protection scope of the present invention is limited by the claim of enclosing.
In the scope of this specification, term " connection ", " connection " and " being coupled " for describe directly and be indirectly connected, directly or indirectly connection and directly or being indirectly coupled.In the accompanying drawings, as long as suitable, identical or similar element is just provided with identical Reference numeral.
Fig. 1 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments.
The luminescent device 100 of the form of Organic Light Emitting Diode 100 can have carrier 102.Carrier 102 such as can be used as electronic component or layer, such as the load-carrying unit of light-emitting component.Such as, substrate 102 can have glass, quartz and/or semi-conducting material or arbitrarily other be applicable to materials or formed by it, such as steel, aluminium, copper.
In addition, carrier 102 can have plastic film or has with the lamination of one or more plastic film or formed by it.Plastics can have one or more polyolefin (such as having high density or low-density polyethylene (PE) or polypropylene (PP)) or be formed by it.In addition, plastics can have polyvinyl chloride (PVC), polystyrene (PS), polyester and/or Merlon (PC), PETG (PET), polyimides (PI), polyether sulfone (PES) and/or PEN (PEN), colourless polyimides (CPI), polymethyl methacrylate (PMMA), polyimides (PI), polyether-ether-ketone (PEEK) or be formed by it.
Carrier 102 can have one or more materials in above-mentioned material.
Carrier 102 can semi-transparently or even pellucidly be formed.
Term " translucent " or " semitransparent layer " can be interpreted as in various embodiments: layer is for only transparent, only transparent such as the such as one or more wave-length coverages produced by luminescent device, such as, for only transparent (such as at least in the subrange of the wave-length coverage of 380nm to 780nm) in the wave-length coverage of visible ray.Such as, term " semitransparent layer " is interpreted as in various embodiments: whole couplings is input to light quantity in structure (such as layer) also coupling output from this structure (such as layer) substantially, and wherein a part for light can be scattered at this.
Term " transparent " or " hyaline layer " can be interpreted as in various embodiments: layer is for only transparent (such as at least in the subrange of the wave-length coverage of 380nm to 780nm), and wherein coupling is input to light in structure (such as layer) the also coupling output from this structure (such as layer) when not having scattering or light conversion substantially.Therefore, " transparent " can regard as the special circumstances of " translucent " in various embodiments.
For the situation of monochromatic luminous or that emission spectrum is limited electronic device such as should be provided be sufficient that: the Rotating fields of optical translucent in the subrange of the monochromatic wave-length coverage expected or for limited emission spectrum is at least translucent.
In various embodiments, Organic Light Emitting Diode 100 luminescent device of embodiment that is hereinbefore with good grounds or that also will describe hereinafter (or also) can be built into so-called top and bottom emitter.Top and bottom emitter also can be referred to as optical clear device, such as transparent organic light emitting diode.
In various embodiments, barrier thin layer 104 can be provided with alternatively above carrier 102.Barrier thin layer 104 can have one or more materials in following material or be made up of it: the zinc oxide of aluminium oxide, zinc oxide, zirconia, titanium oxide, hafnium oxide, tantalum oxide, lanthana, silica, silicon nitride, silicon oxynitride, indium tin oxide, indium-zinc oxide, aluminium doping and their mixture and alloy.In addition, barrier thin layer 104 can have the layer thickness in the scope of about 0.1nm (atomic layer) to about 5000nm in various embodiments, layer thickness such as in the scope of about 10nm to about 200nm is such as the layer thickness of about 40nm.
Insulating barrier 218 can be provided with above barrier thin layer 104.
In a design, barrier thin layer 104 can be configured to a part for insulating barrier 218 or be configured to insulating barrier 218.
In other words: in some designs, barrier thin layer 104 can be identical with insulating barrier.
Insulating barrier 218 can be configured to electrical insulator, namely be configured to electric insulation layer.
In addition, insulating barrier 218 can be configured to surface roughness for reducing such as carrier, namely for planarization.
In addition, insulating barrier 218 can be configured to, and makes the layer above insulating barrier 218 be tight seal relative to harmful substance, such as water and/or oxygen.
In a design, insulating barrier 218 can have the material or material blends that are selected from following material group or be formed by it: organic material, inorganic material, the such as product of oxide, nitride and/or sol gel process, such as spin-coating glass, or hybrid inorganic-organic materials, such as organically-modified pottery, such as organic material, such as plastics, such as polyolefin (such as there is high density or low-density polyethylene (PE) or polypropylene (PP)), polyvinyl chloride (PVC), polystyrene (PS), polyester, Merlon (PC), PETG (PET), polyether sulfone (PES), PEN (PEN), polymethyl methacrylate (PMMA), polyimides (PI), colourless polyimides (colorless Polyimid-CPI), polyether-ether-ketone (PEEK), epoxides, acrylate, pitch, the individual layer (selfassembled monolayer-SAM) of self-organizing, be such as silane compound or mercaptan compound.
In a design, insulating barrier 218 can have the thickness in the scope of about 0.1nm to about 1mm, such as in the scope of about 1nm to about 100 μm.
The insulating barrier 218 with the thickness of about 0.1nm such as can be formed by means of the individual layer of self-organizing.
In a design, insulating barrier 218 can be formed by means of print process and/or cladding process, such as by means of blade coating, spraying, flexible printing, mould printing, silk screen printing, showering, dip-coating, rotary coating, seam type spraying, physics and/or the vapour deposition process of chemistry, atomic layer deposition method and/or molecular-layer deposition method.
In a design, insulating barrier 218 can have organic material or organic material mixture and inorganic material or inorganic material mixture or be formed by it.Thus, the water be such as diffused in insulating barrier 218 can be included in, such as be stored in the organic moiety of insulating barrier 218.
The electric active region 106 of luminescent device 100 can be provided with above insulating barrier 218.Electricity active region 106 can be interpreted as the region wherein having the current flowing for running luminescent device 100 of luminescent device 100.In various embodiments, electric active region 106 can have the first electrode 110, second electrode 114 and organic functional laminar structure 112, as it is illustrated below more in detail.
Therefore, in various embodiments, above insulating barrier 218 (or, when insulating barrier 218 does not exist or be identical with barrier thin layer 104, above barrier thin layer 104; Or when barrier thin layer 104 does not exist, above carrier 102) the first electrode 110 (such as with the form of the first electrode layer 110) can be applied with.First electrode 110 (hereinafter also referred to as bottom electrode 110) can be formed or electric conducting material by electric conducting material, such as formed by metal or transparent conductive oxide (transparent conductive oxide, TCO) or by same metal or different metal and/or identical TCO's or different TCO's multiple layers layer pile formed.Transparent conductive oxide is material that is transparent, conduction, such as metal oxide, such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indium tin oxide (ITO).Except metal oxide such as ZnO, SnO of binary 2or In 2o 3in addition, the metal oxide of ternary such as AlZnO, Zn 2snO 4, CdSnO 3, ZnSnO 3, Mgln 2o 4, GaInO 3, Zn 2in 2o 5or In 4sn 3o 12or the mixture of different transparent conductive oxides also belongs to TCO race and can use in various embodiments.In addition, TCO does not force to meet stoichiometric component and can be p-type doping or N-shaped doping.
In various embodiments, the first electrode 110 can have metal; The compound of such as Ag, Pt, Au, Mg, Al, Ba, In, Ag, Au, Mg, Ca, Sm, Cu, Cr or Li and these materials, combination or alloy.
In various embodiments, can be piled by the layer of the combination of the metal level on tco layer and form the first electrode 110, otherwise or.Example is applied to silver layer (Ag on ITO) on indium tin oxide layer (ITO) or ITO-Ag-ITO cladding.
In various embodiments, alternative in or be additional to above-mentioned material, the first electrode 110 can be provided with in following material one or more: the network be made up of nano wire and the nanoparticle of the metal be such as made up of Ag; The network be made up of carbon nano-tube; Graphite particulate and graphite linings; The network be made up of semiconductor nanowires.
In addition, the first electrode 110 can have conducting polymer or transition metal oxide or conductive transparent oxide.
In various embodiments, the first electrode 110 and carrier 102 can be configured to be translucent or transparent.When the first electrode 110 is formed by metal, the first electrode 110 such as can have the layer thickness being less than or equal to about 25nm, the layer thickness being such as less than or equal to about 20nm, such as be less than or equal to the layer thickness of about 18nm.In addition, the first electrode 110 such as can have the layer thickness being more than or equal to about 10nm, the layer thickness being such as more than or equal to about 15nm.In various embodiments, the first electrode 110 can have layer thickness, such as, layer thickness within the scope of about 10nm extremely about 18nm, the layer thickness such as within the scope of about 15nm to about 18nm within the scope of about 10nm to about 25nm.
In addition, for the situation that the first electrode 110 is formed by transparent conductive oxide (TCO), the first electrode 110 such as has layer thickness, such as, layer thickness within the scope of about 75nm extremely about 250nm, the layer thickness such as within the scope of about 100nm to about 150nm within the scope of about 50nm to about 500nm.
In addition, for the situation that the network that the network be such as made up of the nano wire of the metal that can combine with conducting polymer be such as made up of Ag for the first electrode 110 is formed, be made up of the carbon nano-tube that can combine with conducting polymer is formed or formed by graphite linings and composite material, the first electrode 110 such as can have layer thickness, such as, layer thickness within the scope of about 10nm extremely about 400nm, the layer thickness such as within the scope of about 40nm to about 250nm within the scope of about 1nm to about 500nm.
First electrode 110 can be configured to anode, namely be configured to the electrode of injected hole, or is configured to negative electrode, is namely configured to inject the electrode of electronics.
First electrode 110 can have the first electric terminal, and the first electromotive force (by energy source (not shown), such as being provided by current source or voltage source) can be applied on described first electric terminal.As an alternative, the first electromotive force can be applied on carrier 102 or is applied on carrier 102 and then indirectly flows to the first electrode 110 via this or flow to the first electrode 110.The reference potential that first electromotive force can be such as ground potential or differently preset.
In addition, the electric active region 106 of luminescent device 100 can have organic electro luminescent layer structure 112, and described organic electro luminescent layer structure is applied to above the first electrode 110 or is applied to above the first electrode 110.
Organic electro luminescent layer structure 112 can have one or more emitter layer 118, such as have the emitter layer of fluorescigenic and/or phosphorescent emitter, and one or more hole-conductive layer 120 (also referred to as hole transmission layer 120).In various embodiments, alternatively or additionally, one or more electronic conductive layer 116 (also referred to as electron transfer layer 116) can be provided with.
In a design, the order of the layer of electric active region 106 can be put upside down.In other words: the second electrode 114 can be applied to above (optionally) insulating barrier 218, one or more hole-conductive layer 120 can be applied to above the second electrode 114, one or more emitter layer 118 can be applied to above one or more hole-conductive layer 120, one or more electron transfer layer 116 can be applied to above one or more emitter layer 118, and membrane encapsulation devices 108 can be applied to above one or more electron transfer layer 116.
Can comprise according to the example for the emitter material of emitter layer 118 in the luminescent device 100 of different embodiment: organic or organometallic compound, as the derivative (the poly-p-phenylene vinylene that such as 2-or 2,5-replace) of polyfluorene, polythiophene and polyphenylene; And metal complex, such as iridium complex, as sent out the FIrPic (Ir (ppy) of two (the fluoro-2-of 3,5-bis-(2-pyridine radicals) phenyl-(2-carboxyl pyridine base)-iridium III), green-emitting phosphorescence of blue phosphorescent 3the Ru (dtb-bpy) of (three (2-phenylpyridine) iridium III), red-emitting phosphorescent 3* 2 (PF 6)) (three [4,4 '-two-tert-butyl-(2,2 ')-bipyridine] ruthenium (III) complex compound) and send out the DPAVBi (4 of blue-fluorescence, two [4-(two-p-Tolylamino) styryl] biphenyl of 4-), the TTPA (9 of fluoresced green, two [N, N-bis--(the p-tolyl)-amino] anthracene of 10-) and DCM2 (4-the dicyano methylene)-2-methyl-6-julolidine groups-9-thiazolinyl-4H-pyrans of a red fluorescence) as nonpolymeric emitter.This nonpolymeric emitter such as can deposit by means of hot evaporation.In addition, can use polymeric emitters, described polymeric emitters especially can deposit by means of wet chemistry method, such as spin-coating method (also referred to as Spin Coating).
Emitter material can be embedded in basis material in a suitable manner.
It is pointed out that the emitter material being provided with other in other examples equally and being applicable to.
The emitter material of one or more emitter layer 118 of luminescent device 100 such as can be chosen as, and makes luminescent device 100 transmitting white.One or more emitter layer 118 can have the emitter material of multiple transmitting different colours (such as blue and yellow or blue, green and red), as an alternative, emitter layer 118 also can be made up of multiple sublayer, as sent out the emitter layer 118 of blue-fluorescence or sending out the emitter layer 118 of the emitter layer 118 of blue phosphorescent, the emitter layer 118 of green-emitting phosphorescence and red-emitting phosphorescent.By the mixing of different colours, the transmitting of the light of the color impression with white can be obtained.As an alternative, also can propose, transition material is provided with in the light path of the primary emission produced by these layers, described transition material absorbs primary radiation at least in part and launches the secondary radiation of other wavelength, makes from (not being also white) primary radiation by primary radiation and secondary radiation combination being obtained the color impression of white.
Organic electro luminescent layer structure 112 can have one or more electroluminescence layer usually.One or more electroluminescence layer can have organic polymer, organic oligomer, organic monomer, organically, the little molecule (" Small molecular (small molecules) ") of non-polymer or the combination of these materials.Such as, organic electro luminescent layer structure 112 can have the one or more electroluminescence layers being configured to hole transmission layer 120, makes hole such as can be realized in case of oleds to be effectively injected into carry out electroluminescent layer or carry out in electroluminescent region.As an alternative, in various embodiments, organic functional laminar structure 112 can have the one or more functional layers being configured to electron transfer layer 116, makes electronics such as can be realized in OLED to be effectively injected into carry out electroluminescent layer or carry out in electroluminescent region.The polyaniline of tertiary amine, carbazole derivates, conduction or polyethylene dioxythiophene such as can be used as the material for hole transmission layer 120.In various embodiments, one or more electroluminescence layer can be configured to carry out electroluminescent layer.
In various embodiments, hole transmission layer 120 can apply, be such as deposited on above the first electrode 110, and emitter layer 118 can apply, such as be deposited on above hole transmission layer 120.In various embodiments, electron transfer layer 116 can apply, such as be deposited on above emitter layer 118.
In various embodiments, organic electro luminescent layer structure 112 (i.e. the summation of the such as thickness of hole transmission layer 120 and emitter layer 118 and electron transfer layer 116) have be about 1.5 μm to the maximum layer thickness, be such as to the maximum about 1.2 μm layer thickness, be such as to the maximum about 1 μm layer thickness, be such as to the maximum about 800nm layer thickness, be such as to the maximum about 500nm layer thickness, be such as the layer thickness of about 400nm to the maximum, be such as the layer thickness of about 300nm to the maximum.In various embodiments, organic electro luminescent layer structure 112 such as can have multiple heap being directly stacked the Organic Light Emitting Diode (OLED) of setting each other, wherein each OLED such as can have be about 1.5 μm to the maximum layer thickness, be such as to the maximum about 1.2 μm layer thickness, be such as to the maximum about 1 μm layer thickness, be such as to the maximum about 800nm layer thickness, be such as to the maximum about 500nm layer thickness, be such as the layer thickness of about 400nm to the maximum, be such as the layer thickness of about 300nm to the maximum.In various embodiments, organic electro luminescent layer structure 112 such as can have the heap that two, three or four are directly stacked the OLED of setting each other, in the case, organic electro luminescent layer structure 112 such as can have the layer thickness being about 3 μm to the maximum.
Luminescent device 100 can have other organic function layer alternatively usually, described other organic function layer is such as arranged on above one or more emitter layer 118 or is arranged on above one or more electron transfer layer 116, for improving the functional of luminescent device 100 and then efficiency further.
Above organic electro luminescent layer structure 110 or the second electrode 114 (such as with the form of the second electrode lay 114) can be applied with if desired above one or more other organic function layer.
In various embodiments, the second electrode 114 can have the material identical with the first electrode 110 or be formed by it, and wherein metal is especially applicable in various embodiments.
In various embodiments, second electrode 114 (such as the situation of the second electrode 114 of metal) can have the layer thickness being such as less than or equal to about 50nm, such as be less than or equal to the layer thickness of about 45nm, such as be less than or equal to the layer thickness of about 40nm, such as be less than or equal to the layer thickness of about 35nm, such as be less than or equal to the layer thickness of about 30nm, such as be less than or equal to the layer thickness of about 25nm, such as be less than or equal to the layer thickness of about 20nm, such as be less than or equal to the layer thickness of about 15nm, such as be less than or equal to the layer thickness of about 10nm.
Second electrode 114 usually can with from the first electrode 110 similar or different mode formed or formed like this.Second electrode 114 can be formed by one or more materials and with corresponding layer thickness or be formed so in various embodiments, as above in conjunction with described by the first electrode 110.In various embodiments, both the first electrode 110 and the second electrode 114 are formed all pellucidly or semi-transparently.Therefore, luminescent device 100 shown in Figure 1 can be built into top and bottom emitter (in other words as transparent luminescent device 100).
Second electrode 114 can be configured to anode, namely be configured to the electrode of injected hole, or is configured to negative electrode, is namely configured to inject the electrode of electronics.
Second electrode 114 can have the second electric terminal, and the second electromotive force (described second electromotive force is different from the first electromotive force) provided by energy source can be applied on described second electric terminal.Second electromotive force such as can have certain numerical value, makes the numerical value, such as, numerical value within the scope of about 2.5V extremely about 15V, the numerical value such as within the scope of about 3V to about 12V that have with the difference of the first electromotive force within the scope of about 1.5V to about 20V.
Over second electrode 114 or top and then can also form or be formed with packaging part 108 alternatively above electric active region 106, the such as packaging part of the form of thin-layer encapsulation part 108.
In various embodiments, the packaging part of tight seal can have covering and/or membrane encapsulation devices.
" thin-layer encapsulation part " 108 such as can be understood as following layers or Rotating fields in the scope of the application, and described layer or Rotating fields are suitable for being formed relative to chemical impurity or atmospheric substance, especially relative to the stop of water (moisture) and oxygen.In other words, thin-layer encapsulation part 108 is configured to, make its can not or at the most extremely small part passed by material such as water, oxygen or the solvent damaging OLED.
According to a design, thin-layer encapsulation part 108 can be configured to independent layer (in other words, being configured to individual layer).According to the design of an alternative, thin-layer encapsulation part 108 can have multiple sublayer be stacked to constitute each other.In other words, according to a design, thin-layer encapsulation part 108 can be configured to layer heap (Stack).One or more sublayers of thin-layer encapsulation part 108 or thin-layer encapsulation part 108 such as can be formed by means of the deposition process be applicable to, such as formed by means of Atomic layer deposition method (Atomic Layer Deposition (ALD)) according to a design, such as the Atomic layer deposition method (Plasma Enhanced AtomicLayer Deposition (PEALD)) of plasma enhancing or without isoionic Atomic layer deposition method (Plasma-less Atomic Layer Deposition (PLALD)), or formed by means of chemical gaseous phase depositing process (Chemical Vapor Deposition (CVD)) according to another design, such as the CVD (Chemical Vapor Deposition) method (Plasma EnhancedChemical Vapor Deposition (PECVD)) of plasma enhancing or without isoionic CVD (Chemical Vapor Deposition) method (Plasma-less Chemical Vapor Deposition (PLCVD)), or formed by means of the deposition process be applicable in addition as an alternative.
Extremely thin layer can be deposited by application Atomic layer deposition method (ALD).Especially, the layer of atomic layer scope can be positioned at by deposit thickness.
According to a design, in the thin-layer encapsulation part 108 with multiple sublayer, whole sublayer can be formed by means of Atomic layer deposition method.The sequence of layer only with ALD layer also can be referred to as " nano-stack (Nanolaminat) ".
According to the design of an alternative, in the thin-layer encapsulation part 108 with multiple sublayer, one or more sublayers of stringer packaging part 108 can be come by means of the deposition process being different from Atomic layer deposition method, such as, deposit by means of CVD (Chemical Vapor Deposition) method.
Thin-layer encapsulation part 108 can have about 0.1nm (atomic layer) to the layer thickness of about 1000nm according to a design, such as according to a design be about 10nm to about 100nm layer thickness, be such as the layer thickness of about 40nm according to a design.
Have the design of multiple sublayer according to thin-layer encapsulation part 108, whole sublayer can have identical layer thickness.According to another design, each sublayer of thin-layer encapsulation part 108 can have different layer thicknesses.In other words, at least one sublayer can have the layer thickness being different from other sublayers one or more.
According to a design, each sublayer of thin-layer encapsulation part 108 or thin-layer encapsulation part 108 can be configured to translucent or transparent layer.In other words, thin-layer encapsulation part 108 (or each sublayer of thin-layer encapsulation part 108) can be made up of translucent or transparent material (translucent or transparent combination of materials).
According to a design, thin-layer encapsulation part 108 or (when having the layer heap of multiple sublayer) one or more sublayers of thin-layer encapsulation part 108 have a kind of in following material or are made up of the one in following material: the zinc oxide of aluminium oxide, zinc oxide, zirconia, titanium oxide, hafnium oxide, tantalum oxide, lanthana, silica, silicon nitride, silicon oxynitride, indium tin oxide, indium-zinc oxide, aluminium doping and their mixture and alloy.In various embodiments, one or more sublayers of thin-layer encapsulation part 108 or (when having the layer heap of multiple sublayer) thin-layer encapsulation part 108 have the material of one or more highs index of refraction, in other words there is the material that one or more have high index of refraction, such as, there is the material of the refractive index being at least 2.
In various embodiments; bonding agent and/or protective paint 124 can be provided with above packaging part 108, such as by means of described bonding agent and/or protective paint covering 126 (such as glass covering 126, plastic cladding element 126, metal covering 126) be fixed, is such as pasted onto on packaging part 108.In various embodiments, the optical translucent layer be made up of bonding agent and/or protective paint 124 can have the layer thickness being greater than 1 μm, such as, to the layer thickness of about 1000 μm.In various embodiments, bonding agent can have laminating adhesive or laminating adhesive.
In various embodiments, the particle of scattered light can also be embedded in the layer (also referred to as adhesive linkage) of bonding agent, the particle of described scattered light can cause improvement look angular distortion and coupling efficiency further.In various embodiments, such as the scattering particles of dielectric can be set to the particle of scattered light, such as metal oxide, as silica (SiO 2), zinc oxide (ZnO), zirconia (ZrO 2), indium tin oxide (ITO) or indium-zinc oxide (IZO), gallium oxide (Ga 2o a), aluminium oxide or titanium oxide.Other particles also can be applicable, as long as it has the refractive index different from the effective refractive index of the matrix of translucent Rotating fields, such as, are bubble, acrylates or glass hollow ball.In addition, such as can by the nano particle of metal, metals like gold, silver, iron nano-particle etc. are set to the particle of scattered light.
In various embodiments; can also apply or be applied with electric insulation layer (not shown) between the second electrode 114 and the layer be made up of bonding agent and/or protective paint 124; be such as SiN; such as have at about 300nm to the layer thickness within the scope of about 1.5 μm; such as have at about 500nm to the layer thickness within the scope of about 1 μm, such as to protect the material of electricity instability during wet chemical process.
In various embodiments, bonding agent can be configured to, and himself is had be less than the refractive index of the refractive index of covering 126.Such bonding agent can be such as the bonding agent of low-refraction, such as, for having the acrylates of the refractive index being approximately 1.3.In addition, can be provided with multiple different bonding agent, described multiple different bonding agent forms bond layer sequence.
Also it is pointed out that and also can fully abandon bonding agent 124 in various embodiments, such as, the covering be made up of glass 126 is being applied to by means of plasma spraying in the embodiment on packaging part 108.
In various embodiments, covering 126 and/or bonding agent 124 have the refractive index (such as when the wavelength of 633nm) of 1.55.
In addition, in various embodiments, one or more anti-reflecting layer (such as combining with packaging part 108, as thin-layer encapsulation part 108) can be additionally provided with in luminescent device 100.
Fig. 2 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiment.
What illustrate is the first concrete design 200 of opto-electronic device 100, and described opto-electronic device has carrier 102, insulating barrier 218, first electrode 110, organic functional laminar structure 112, second electrode 114 and packaging part 108.
Not by the restriction of generality, the layer cross section of the signal illustrated is Mirror Symmetry to describe Fig. 2 supposition.In order to better general view, the boundary face of each adjacent layer illustrates as the projection of boundary face 202,206,208,210,212,214,216.
About the material composition of each shown in Fig. 2 to Fig. 8 layer and thickness explanation in various embodiments with in FIG described by the described explanation of embodiment be identical.
Carrier 102 can have the intrinsic conductivity such as in the scope of about 1MS/m to about 62MS/m.
Carrier 102 can have about 30 μ Ω/to about 1 Ω/scope in sheet resistance.
In addition, carrier 102 can be tight seal about water and/or oxygen, and namely water and/or oxygen can not spread through carrier 102.
Carrier 102 can planar ground and mechanical flexibility ground be formed, such as, be metal film and have the surface of the planar that size is approximately 1m × 100m, such as size is approximately 0.6m × 0.6m, such as size is approximately 0.2m × 0.2m, such as size is approximately 0.2m × 0.05m; Thickness in the scope of about 10 μm to about 3000 μm, such as in the scope of about 20 μm to about 1000 μm, such as in the scope of about 50 μm to about 500 μm.
The region of at least one electric insulation can have identical with carrier 102 or insulating barrier 218 or similar material or identical or similar material blends.
The region of at least one conduction can have identical with the first electrode 110 or the second electrode 114 or similar material or identical or similar material blends.
Insulating barrier 218 can be applied on carrier 102 and the first electrode 110 can with carrier 102 electric insulation in region 216.
Insulating barrier 218 can reduce the surface roughness of the first electrode 110.In other words: insulating barrier 218 can make the surface planarisation of the first electrode 110.
Insulating barrier 218 can cover the surface except fringe region 202 of carrier 102, and wherein fringe region 202 can have the expansion in the scope of about 50nm to about 5mm, such as in the scope of about 5 μm to about 2 μm.
First electrode 110 can cover insulating barrier 218 as layer except fringe region 210, and wherein fringe region 210 can have the expansion in about 2 μm of scopes to about 2mm.
Organic functional laminar structure 112 can be applied on the first electrode 110, make organic functional laminar structure 112 in layer cross section, surround the first electrode 110 at least in part, namely cover the fringe region 210 of insulating barrier 218 and the first electrode 110 and the second electrode 114 physical insulation.
The side 204 of the first electrode 110 has the contact site 204 with the physics of organic functional laminar structure 112 in layer cross section 200.Organic functional laminar structure 112 can not have with the direct electricity of carrier 102 or the contact site of physics.
Therefore, in layer cross section 200, the first electrode 110 can fully surround by means of insulating barrier 218 and organic functional laminar structure 112 at least in part.
Insulating barrier 218 also can be made up of material or material blends or have identical with organic functional laminar structure 112 or similar layer cross section 112.
In other words: when having insulating barrier 218 optional time of the electric insulation effect about carrier 102, the first electrode 110 can fully be surrounded by organic functional laminar structure 112.
Second electrode 114 can be applied in organic functional laminar structure 112 as layer.Second electrode 114 can have with the physics of carrier 102 with the contact site 208 of electricity, make the fringe region 206 of carrier keep not covering.At this, the second electrode 114 can surround organic functional laminar structure 112 and insulating barrier 218 by means of the contact site 208 of physics.
Second electrode 114 also can have the material identical with carrier 102 or identical material blends.
Membrane encapsulation devices 108 can be applied on the second electrode 114 and can to surround or around described second electrode.At this, membrane encapsulation devices 108 can and carrier be in the contact site 214 of direct physics and then about water and oxygen and tightly encapsulate the layer between packaging part 108 and carrier 102, the diffusion namely through membrane encapsulation devices 108 is impossible.In other words: by means of the contact site 214 of direct physics, can by the common boundary face of membrane encapsulation devices 108 and carrier 102 about harmful environmental impact tight seal.
The fringe region 212 of carrier 102 can with 0mm to about 10mm, such as in the scope of about 0.1mm to about 2mm, the thickness that is such as approximately 1mm formed, wherein the expansion of 0mm is corresponding to there is not fringe region 212.
It is also shown that such as according to the barrier thin layer 104 above carrier 102 of the design of the description of Fig. 1.
In the different design of the description of Fig. 3 to Fig. 8, barrier thin layer 104 can be applied above carrier 102, even without also like this when at large illustrating or at large describe barrier thin layer 104.
Fig. 3 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments.
The difference of the embodiment in Fig. 3 and Fig. 2 is, the insulating barrier 218 being applied with the first electrode 110 surrounds the first electrode 110 from the side, and namely contact site 204 also can be formed between insulating barrier 218 and the first electrode 110.
Fig. 4 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments.
Be with the difference of Fig. 2 and Fig. 3, the first electrode 110 also can be electrically connected with carrier 102, as can be released in embodiment in the diagram.
First electrode 110 can surround or around insulating barrier 218.Organic functional laminar structure 112 makes the second electrode 114 and the first electrode 114 physical insulation, and namely the second electrode 114 does not stretch out the electrical contacts of organic functional laminar structure 112 and then formation and the first electrode 110 with not answering planar.Layer in layer cross section 400 tightly can be encapsulated in the space between membrane encapsulation devices 108 and carrier 102 about water and/or oxygen in conjunction with carrier 102 by membrane encapsulation devices 108.
Fig. 5 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments.
In Figure 5, the sequence of layer of similar Fig. 2 shown in layer cross section 500.Carrier 102 can have electric insulated region and conductive region, such as electric insulated region 502 and conductive region 504, the conductor layer 504 such as conducted electricity.
At least one electric insulated region can have identical with carrier 102 or insulating barrier 218 or similar material or identical or similar material blends.
At least one conductive region can have identical with the first electrode 110 or the second electrode 114 or similar material or identical or similar material blends.
When carrier 502 itself is non-conductive or when not having enough conductivity, conductor layer 504 can be required.
Conductor layer 504 can have identical with the first electrode 110 or the second electrode 114 or similar material or identical or similar material blends.
Systemic vectors 502 by electric insulation such as can reduce or avoid leakage current.
In other words: the systemic vectors 502 by electric insulation can provide the electric insulation relative to environment.
The systemic vectors 502 of electric insulation such as also can be configured to Machine guarding and/or for mechanically stablizing conductor layer 504.
Therefore, in order to electrical contact opto-electronic device 100, the layer 504 of conduction can be applied on carrier 502.
In order to form the carrier 102 of tight seal, conductive layer can be formed with the thickness being approximately thicker than 5 μm, such as thickness in the scope of about 5 μm to about 200 μm, be such as the layers of copper of 30 μm.
Fig. 6 illustrates the schematic cross-sectional view of the opto-electronic device according to different embodiments.
The layer cross section of the sequence of layer of similar Fig. 5 shown in Figure 6.
In order to the diffuse flow (diffuse flow shows by means of arrow 602) of material, such as water and/or oxygen such as reducing harmful environmental impact with the contact site of the physics of adjacent layer by the sidepiece of conductive layer 504 or its, be such as harmful to, membrane encapsulation devices 108 can around the sidepiece 604 of insulating barrier 218 and/or the layer 504 conducted electricity.
Fig. 7 illustrates the schematic cross-sectional view of two opto-electronic devices 702,704 according to different embodiments.
The layer cross section of the sequence of layer of similar Fig. 2 or Fig. 5 shown in Figure 7, described sequence of layer has two or more the opto-electronic device 702,704 surrounded by packaging part 108.
At this, carrier 102 can have intrinsic conductivity (Fig. 2) or have the insulating regions (Fig. 5) with conductive region.
First opto-electronic device 702 and the second opto-electronic device 704 such as can arrange abreast each other and have common electrode, the second such as common electrode 114.Second electrode 114 can surround the first opto-electronic device 702 with the insulating barrier 218 of the second opto-electronic device 704 and organic functional laminar structure 112.
The electrical contacts 706 of the second electrode 114 and carrier 102 can be formed, such as, for via the substrate conduction current concurrently with high conductance and then little pressure drop between opto-electronic device 702,704.
By means of electrical contacts 706, the current flowing passing the sidepiece of the planar of the second electrode 114 from carrier 102 can be promoted, because carrier 102 can have the conductivity higher than the second electrode 114 and/or less sheet resistance.
In the region of the electrical contacts 706 of common electrode 114, current delivery can on the side, face of the planar of the second electrode 114, such as perpendicular to form.
By means of the electrical contacts 706 of multiple the second that there is first common electrode 110 (not shown) of the opto-electronic device 702,704 of common carrier 102 and/or common electrode (not shown), the contact area of the carrier 102 of common electrode 110,114 and conduction can be reduced.
Electrical contacts 706 can have the width in the scope of about 10nm to about 1cm, such as in the scope of about 200nm to about 2mm, such as in the scope of about 10 μm to about 500 μm.Spacing 706 between the first electrode 110 between two opto-electronic devices 702,704 can have the width in the scope of about 10nm to about 1cm, such as in the scope of about 200nm to about 2mm, such as in the scope of about 10 μm to about 500 μm.
Electrical contacts 706 can extend in plotting planes, namely forms continuously or interruptedly consistently, such as along both direction perpendicular to the section illustrated.The interruption of electrical contacts 706 in plotting planes such as can be formed by means of the insulating barrier 218 of two opto-electronic devices 702,704 connects when through contact site, such as VIA vertically interrupt in the common insulating barrier 218 of two opto-electronic devices 702,704 or the region of electrical contacts 706.
The width of the spacing 706 between two opto-electronic devices 702,704 can be configured to, make spacing 706 device carry out radiation and/or do not carry out radiation state under can not or almost can not with the naked eye feel.
Visible region of not carrying out radiation between two opto-electronic devices 702,704 can have the width in the scope between the absolute value and the absolute value of spacing 708 of about spacing 706.
Packaging part 108 can surround together with carrier 102, such as atresia is consistently around the second electrode 114.
Opto-electronic device 702,704 can have layer cross section 100 identical or different in thickness and the material composition of each layer of Rotating fields 100.
Fig. 8 illustrates the diagrammatic top view of the opto-electronic device according to different embodiments.
The vertical view 800 of multiple opto-electronic device 802,804 is shown in fig. 8 in the following manner: such as similar or identical with a design in the design of the description of Fig. 7; Such as from two or more opto-electronic devices of the identical or different design of the description of Fig. 2 to Fig. 6, the combination of two opto-electronic devices of the design of the description of such as Fig. 2 is similar or identical.Carrier 102 and packaging part 108 are shown, described carrier and packaging part jointly at least atresia surround organic functional laminar structure 112 and (optionally) insulating barrier 218 consistently.
Also illustrate the first electrode 110 or the second electrode 114 connects through the electricity of packaging part 108.
(very little) spacing 806 between the organic functional laminar structure 112 of opto-electronic device 802,804 is also shown.
The width of spacing 806 can by the width of the electrical connection width of opto-electronic device 802,804, in the design of Fig. 2 such as such as drawing for spacing 214 in spacing 208 and membrane encapsulation devices 108 and the contact-making surface of carrier 102, design at Fig. 2.
In various embodiments, propose device, described device has: carrier; The first electrode above carrier; On the first electrode or the organic functional laminar structure of top; The second electrode above organic functional laminar structure, wherein the first electrode and the second electrode are configured to, and the electrical connection of the first electrode and the second electrode is set up by means of only organic functional laminar structure; With the covering of self-supporting; Wherein the first electrode and/or the second electrode and carrier electrical coupling; And wherein covering and carrier are jointly formed the structure of at least one in organic functional laminar structure and the first electrode and the second electrode about water and/or oxygen tight seal, the region wherein between carrier and covering is laterally tight seal by means of metallic structure.The covering of self-supporting is the covering not needing substrate or carrier, can keep the structural integration of covering.
Metallic structure example is if having metal and/or metal oxide.According to a design in the design of the first electrode or the second electrode, metallic structure example is if having metal or be made up of it.
Laterally, namely metallic structure laterally can be applied on the region between covering and carrier or form thereon.
Metallic structure can the arranging or form of region on the sidepiece of opto-electronic device and/or between carrier and covering on the sidepiece of opto-electronic device.Such as, metallic structure example such as, if form, in the fringe region of device as the indirectly connecting portion of carrier and covering between covering and carrier.
Metallic structure can be electrically connected with the electrode of in the electrode of device and/or with at least one electrode electric insulation.Such as, metallic structure can at least one region with the Electrode connection of in the electrode of device and at least one region with the electrode electric insulation of in the electrode of device.Such as, metallic structure can not have the electrical connection with the electrode of in electrode at least one region.
Metallic structure can be configured to be connected with the atom of carrier for covering, such as, be configured to bonding agent or solder; And/or by the region between carrier and covering about water and/or oxygen tight seal.
Metallic structure can---with the concrete design of metallic structure relatively---to spray, the mode of evaporation; Apply in the mode of solvent, cream, dispersant or emulsion.
In various embodiments, a kind of device and a kind of method manufactured for it are proposed, by described Apparatus and method for can manufacture any thickness, can very well process, the organic optoelectronic device of tight seal, described organic optoelectronic device has the active area larger than traditional opto-electronic device on carrier.Thereby, it is possible to planar ground contacts organic optoelectronic device and then do not damage total outward appearance when the device of emitted radiation, and when the device of radiation-absorbing, the surface of radiation-absorbing increases.Meanwhile, through contact site, such as VIA can be cancelled by packaging part or reduce its quantity.Thereby, it is possible to prevent or reduce water and/or the oxygen possible diffuse flow through packaging part.

Claims (18)

1. a device (100), described device has:
Carrier (102);
The first electrode (110) above described carrier (102);
Organic functional laminar structure (112) above described first electrode (110);
The second electrode (114) above described organic functional laminar structure (112), wherein said first electrode (110) and described second electrode (114) are configured to, and described first electrode (110) is set up by means of only described organic functional laminar structure (112) with the electrical connection of described second electrode (114); With
Thin-layer encapsulation part (108);
Wherein said first electrode (110) and/or described second electrode (114) and described carrier (102) electrical coupling; And
Wherein said thin-layer encapsulation part (108) and described carrier (102) are formed jointly by the structure of at least one electrode in described organic functional laminar structure (112) and described first electrode (110) and described second electrode (114) about water and/or oxygen tight seal.
2. device according to claim 1 (100),
Wherein said carrier (102) is formed conductively.
3. device according to claim 1 (100),
Wherein said carrier (102) has the region of at least one electric insulation and the region of at least one conduction.
4. device according to claim 3 (100),
The region of wherein said conduction is formed on the region (504) of described electric insulation as conductor layer (502).
5. device according to any one of claim 1 to 4 (100),
Wherein insulating barrier (218) is formed between described first electrode (110) and described carrier (102).
6. device according to claim 5 (100),
Wherein said insulating barrier (218) is formed pellucidly or semi-transparently.
7. the device (100) according to claim 5 or 6,
Wherein said thin-layer encapsulation part (108) and described carrier (102) surround multiple Rotating fields, make Rotating fields described in each have following layers: insulating barrier (218); First electrode (110); Organic functional laminar structure (112) and the second electrode (114); Wherein multiple described Rotating fields is configured to, and multiple described Rotating fields is configured to, and multiple described Rotating fields has common the first electrode (110) and/or common the second electrode (114).
8. device according to claim 7 (100),
Wherein common described first electrode (110) and/or common described second electrode (114) have the common electrical contacts (706) with common described carrier (102) between multiple described Rotating fields.
9. device according to any one of claim 1 to 8 (100),
Wherein said first electrode (110) is formed pellucidly.
10. device according to any one of claim 1 to 9 (100),
Wherein said second electrode (114) is formed pellucidly.
11. devices according to any one of claim 1 to 10 (100),
Wherein said organic functional laminar structure (112) surrounds described first electrode (110), makes described organic functional laminar structure (112) make described first electrode (110) and the horizontal physical insulation of described second electrode (114).
12. devices (100) according to any one of claim 1 to 11,
Wherein said device (100) is configured to opto-electronic device (100), is preferably configured to Organic Light Emitting Diode (100) or is configured to organic solar batteries (100).
13. 1 kinds of methods for the manufacture of device (100), described method has:
The first electrode (110) is formed above carrier (102); Organic functional laminar structure (112) is formed above described first electrode (110);
The second electrode (114) is formed above described organic functional laminar structure (112); And wherein
Described first electrode (110) and described second electrode (114) are configured to, and described first electrode (110) is set up by means of only described organic functional laminar structure (112) with the electrical connection of described second electrode (114);
Described first electrode (110) or described second electrode (114) are configured to form with described carrier (102) electrical coupling ground; And
Form thin-layer encapsulation part (108);
Wherein said thin-layer encapsulation part (108) and described carrier (102) are formed jointly by the structure of at least one electrode in described organic functional laminar structure (112) and described first electrode (110) and described second electrode (114) about harmful environmental impact tight seal.
14. methods according to claim 13,
Wherein before described first electrode (110) being applied on described carrier (102), insulating barrier (218) is applied to above described carrier (102).
15. methods according to claim 13 or 14,
Wherein described thin-layer encapsulation part (108) is configured to above described carrier (102), described thin-layer encapsulation part (108) is made to be enclosed in multiple Rotating fields (702 on common carrier (102), 704), wherein Rotating fields described in each (702,704) has following layers: insulating barrier (218); First electrode (110); Organic functional laminar structure (112); With the second electrode (114).
16. according to claim 13 to the method according to any one of 15,
Wherein multiple described Rotating fields (702,704) is configured to, makes multiple described Rotating fields (702,704) have common the first electrode (110) and/or common the second electrode (114).
17. methods according to claim 16,
Wherein utilize and to be formed in common described first electrode (110) between multiple described Rotating fields (702,704) and/or common described second electrode (114) with the electrical contacts (706) of common described carrier (102).
18. 1 kinds of devices (100), described device has:
Carrier (102);
The first electrode (110) above described carrier (102);
Organic functional laminar structure (112) above described first electrode (110);
The second electrode (114) above described organic functional laminar structure (112), wherein said first electrode (110) and described second electrode (114) are configured to, and described first electrode (110) is set up by means of only described organic functional laminar structure (112) with the electrical connection of described second electrode (114); With
The covering (126) of-self-supporting;
-wherein said first electrode (110) and/or described second electrode (114) and described carrier (102) electrical coupling; And
-wherein said covering (126) and described carrier (102) are jointly formed the structure of at least one electrode in described organic functional laminar structure (112) and described first electrode (110) and described second electrode (114) about water and/or oxygen tight seal, and the region wherein between described carrier and described covering is laterally tight seal by means of metallic structure.
CN201380042541.4A 2012-08-10 2013-08-08 Encapsulated components comprising an organic layer, and method for the production thereof Pending CN104521021A (en)

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