CN109287135B - Organic light emitting device and method of manufacturing the same - Google Patents
Organic light emitting device and method of manufacturing the same Download PDFInfo
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- CN109287135B CN109287135B CN201780004392.0A CN201780004392A CN109287135B CN 109287135 B CN109287135 B CN 109287135B CN 201780004392 A CN201780004392 A CN 201780004392A CN 109287135 B CN109287135 B CN 109287135B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000002950 deficient Effects 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000010410 layer Substances 0.000 claims description 279
- 238000000034 method Methods 0.000 claims description 41
- 238000009792 diffusion process Methods 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 21
- 239000012044 organic layer Substances 0.000 description 21
- 239000010408 film Substances 0.000 description 15
- 239000010409 thin film Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- -1 polyethylene naphthalate Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KZNRNQGTVRTDPN-UHFFFAOYSA-N 2-chloro-1,4-dimethylbenzene Chemical group CC1=CC=C(C)C(Cl)=C1 KZNRNQGTVRTDPN-UHFFFAOYSA-N 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/16—Electron transporting layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
- H10K50/171—Electron injection layers
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- Optics & Photonics (AREA)
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- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to an organic light emitting device and a method of manufacturing the same, and more particularly, to an organic light emitting device for preventing an expansion of a defective region of the organic light emitting device and a method of manufacturing the same. According to an exemplary embodiment, an organic light emitting device includes: a substrate; an organic light emitting member provided by stacking a plurality of layers including an organic light emitting layer on the substrate, the organic light emitting layer including a defective region; and an insulating member disposed on an interface between two adjacent layers of the plurality of layers of the organic light emitting member to control a current introduced into the defect region.
Description
Technical Field
The present invention relates to an organic light emitting device and a method of manufacturing the same, and more particularly, to an organic light emitting device for preventing an expansion of a defective region of the organic light emitting device and a method of manufacturing the same.
Background
An organic light emitting device includes two electrodes and a plurality of organic thin film layers having semiconductor characteristics and disposed between the two electrodes. The organic light emitting device having the above-described configuration uses a phenomenon in which electric energy is converted into light energy by using an organic material, that is, an organic light emitting phenomenon. In detail, in a structure in which an organic light emitting layer is disposed between an anode and a cathode, holes from the anode and electrons from the cathode may be injected into the organic light emitting layer when a voltage is applied between the two electrodes. The injected holes and electrons meet to form excitons, and light is emitted when the excitons drop to the ground state again.
That is, light generated from the organic light emitting layer may be emitted through a light transmitting electrode in the organic light emitting device, and the organic light emitting device may be generally classified into a top emission type, a bottom emission type, and a double-sided emission type. One of the two electrodes is a light transmitting electrode if of the top or bottom emission type, and both electrodes are light transmitting electrodes if of the double-sided emission type.
As described above, the organic light emitting device is a self-emission device that allows the organic light emitting layer to emit light by re-coupling electrons and holes. The organic light emitting device may be applied to various application products because it may have high brightness and low driving voltage and be manufactured as an ultra thin film type.
However, in general, an organic light emitting device may be manufactured by sequentially stacking an anode, an organic light emitting layer, and a cathode. During the process of stacking the anode, the organic light emitting layer, and the cathode, conductive particles may be introduced. The conductive particles introduced into the organic light emitting device act as defective nodes (which cause a short circuit between the anode and the cathode), and a phenomenon occurs in which current is concentrated on the defective nodes. Since the defective node affects its surrounding organic light emitting layer due to the above-described current concentration, a defective region grows, and when current is continuously supplied to significantly degrade emission characteristics, the defective region gradually expands to the surrounding region.
(existing literature)
(patent literature)
Disclosure of Invention
Technical problem
The present invention provides an organic light emitting device capable of interrupting a current supplied to a defective region in the organic light emitting device to prevent the defective region from expanding to a surrounding region, and a method of manufacturing the same.
Technical solution
According to an exemplary embodiment, an organic light emitting device includes: a substrate; an organic light emitting member provided by stacking a plurality of layers including an organic light emitting layer on the substrate, the organic light emitting layer including a defective region; and an insulating member disposed on an interface between two adjacent layers of the plurality of layers of the organic light emitting member to control a current introduced into the defect region.
The insulating member may block the flow of current introduced into the defective region.
The insulating member may be disposed on a flow path of the current introduced into the defective region.
According to another exemplary embodiment, an organic light emitting device includes: a first electrode layer configured to allow a current to flow in; a second electrode layer configured to allow the induced current to flow out of the first electrode layer; an organic light emitting layer including a plurality of organic layers for providing a current flow path between the first electrode layer and the second electrode layer; and an insulating member disposed on at least one of an interface between the first electrode layer and the organic light emitting layer, an interface between the organic light emitting layer and the second electrode layer, and an interface between two adjacent organic layers of the plurality of organic layers to control a current introduced into a defective region in the organic light emitting layer.
The insulating means may allow the first and second electrode layers shorted by the defective region to be disconnected.
The organic light emitting member may include: a first electrode layer disposed on the substrate; an organic light emitting layer disposed on the first electrode layer; and a second electrode layer disposed on the organic light emitting layer. Here, the insulating member may be disposed on at least one of an interface between the first electrode layer and the organic light emitting layer and an interface between the organic light emitting layer and the second electrode layer.
The organic light emitting member may include: a first electrode layer disposed on the substrate; an organic light emitting layer comprising a plurality of organic layers and disposed on the first electrode layer; and a second electrode layer disposed on the organic light emitting layer. Here, the insulating member may be disposed on an interface between two adjacent organic layers of the plurality of organic layers.
The insulating member may have a flat surface area equal to or greater than that of the defective region.
The insulating member may have a flat surface area of 110% to 200% of the flat surface area of the defective region.
The insulating member may include a cavity formed such that the two adjacent layers of the plurality of layers are partially separated.
The organic light emitting device may further include an encapsulation member disposed on the organic light emitting member.
The organic light emitting device may further include a light diffusing member disposed on a light emitting surface of the substrate.
According to yet another exemplary embodiment, a method for manufacturing an organic light emitting device includes: forming an organic light emitting member by stacking a plurality of layers on a substrate; forming an encapsulation member on the organic light emitting member; detecting a defective region in the organic light emitting member; and forming an insulating member on an interface between two adjacent layers of the plurality of layers of the organic light emitting member when the defective region is detected.
Forming the insulating member may separate the two adjacent layer portions of the plurality of layers of the organic light emitting member to form the insulating member.
Forming the insulating member may include: electromagnetic waves are radiated to the organic light emitting member through the substrate.
The electromagnetic waves may include laser light or ultraviolet light.
The method may further comprise: the electromagnetic waves are treated before being radiated to the organic light emitting member. Here, processing the electromagnetic wave may include: controlling a radiation surface area of the electromagnetic wave; adjusting the energy of the electromagnetic wave; and determining a location of a focal point of the electromagnetic wave.
Controlling the radiation surface area of the electromagnetic wave may control the radiation surface area of the electromagnetic wave to be equal to or greater than a flat surface area of the defect region.
Adjusting the energy of the electromagnetic wave may control the energy of the electromagnetic wave to be greater than an energy required to partially separate the two adjacent layers of the plurality of layers of the organic light emitting member and less than an energy required to partially remove at least one layer of the plurality of layers.
Determining the focus of the electromagnetic wave may determine that the focus of the electromagnetic wave is disposed on an interface between the first electrode layer and the organic light emitting layer in the organic light emitting member or an interface between the organic light emitting layer and the second electrode layer in the organic light emitting member.
Determining the focus of the electromagnetic wave may determine that the focus of the electromagnetic wave is disposed in the organic light emitting layer in the organic light emitting member.
The method may further comprise: after the insulating member is formed, a light diffusion member is formed on the light emitting surface of the substrate.
Advantageous effects
According to the organic light emitting device and the method of manufacturing the same according to exemplary embodiments, since the insulating member is formed at a position projected by overlapping with the defective region in the organic light emitting member to electrically separate the defective region, it is possible to prevent the defective region from expanding to a surrounding region due to continuous supply of power to the defective region.
Further, since two adjacent layers of the plurality of layers of the organic light emitting member are separated to form the insulating member, the defective region can be electrically separated economically and easily by using a small amount of energy, and no by-products are generated in the organic light emitting device at all to ensure the reliability of the organic light emitting device.
Drawings
Fig. 1 is a view illustrating a state in which a defective region is generated in an organic light emitting device;
fig. 2 is a view illustrating a state in which an insulating member is formed on an interface between a first electrode layer and an organic light emitting layer;
fig. 3 is a view illustrating a state in which an insulating member is formed on an interface between an organic light emitting layer and a second electrode layer;
fig. 4 is a view illustrating a state in which an insulating member is formed on an interface between adjacent organic layers among organic light emitting layers;
fig. 5 is a view illustrating a state in which a defective region and an insulating member are projected onto a substrate;
fig. 6 is a schematic diagram illustrating a method for manufacturing an organic light emitting device according to an exemplary embodiment; and
Fig. 7 is a view illustrating a state in which electromagnetic waves are radiated to the organic light emitting member through the substrate.
Detailed Description
The organic light emitting device and the method of manufacturing the same according to exemplary embodiments provide technical characteristics capable of interrupting a current supplied to a defective region in the organic light emitting device to prevent the defective region from expanding to a surrounding region.
Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the disclosure to those skilled in the art.
It will be understood that when an element is referred to as being "on," "connected to," or "stacked on," or "coupled to," another element, it can be directly on, connected to, stacked directly on, or coupled to the other element or intervening elements may be present.
For ease of description, spatially relative terms, such as "above" or "upper," "lower" or "lower," and the like, may be used herein to describe one element or feature's relationship to another element(s) or feature(s), as illustrated in the figures. It will be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. Like reference symbols in the drawings indicate like elements.
Fig. 1 is a view illustrating a state in which a defective region is generated in an organic light emitting device.
An organic light emitting device includes two electrodes and a plurality of organic thin films having semiconductor characteristics and disposed between the two electrodes and is used for various display apparatuses and lighting apparatuses. That is, the organic light emitting device may be divided into a plurality of pixels and used as a display apparatus, and may be composed of substantially a single large pixel on a substrate and used as a lighting apparatus.
The above-described organic light emitting device may emit light by using a phenomenon in which electric energy is converted into light energy by using an organic material. In general, an organic light emitting device may be manufactured by sequentially stacking an anode, an organic light emitting layer, and a cathode. Here, the conductive particles may be introduced during a process of stacking the anode, the organic light emitting layer, and the cathode. The conductive particles introduced into the organic light emitting device act as defective nodes (which cause a short circuit between the anode and the cathode), and a phenomenon occurs in which current is concentrated on the defective nodes. The defective node may affect its surrounding organic light emitting layer by current concentration or heating due to current concentration. As illustrated in fig. 1, the defective node is grown as a defective region D (e.g., a dark spot), and when current is continuously supplied, the defective region D is continuously enlarged to a surrounding region and the light emission characteristics are significantly degraded to significantly reduce the lifetime of the device.
Fig. 2 to 4 are exemplary diagrams illustrating states of an organic light emitting device according to exemplary embodiments. Here, fig. 2 is a view illustrating a state in which an insulating member is provided on an interface between a first electrode layer and an organic light emitting layer, fig. 3 is a view illustrating a state in which an insulating member is provided on an interface between an organic light emitting layer and a second electrode layer, and fig. 4 is a view illustrating a state in which an insulating member is provided on an interface between mutually adjacent organic layers in the organic light emitting layer. Further, fig. 5 is a view illustrating a state in which a defective region and an insulating member are projected onto a substrate.
Referring to fig. 2 to 5, an organic light emitting device according to an exemplary embodiment includes: a substrate 100; an organic light emitting member 200 provided by stacking a plurality of layers including an organic light emitting layer 220 on a substrate 100, the organic light emitting layer 220 having a defective region D; and an insulating member 400 provided on an interface between two adjacent layers of the plurality of layers of the organic light emitting member 200 to control a current introduced into the defect region D.
The substrate 100 may be an insulating transparent substrate made of various materials such as glass, quartz, ceramic, plastic, and metal. Further, the substrate 100 may be a transparent substrate having flexibility to realize a flexible display that has been attracting attention as a new technology in the display field in recent years. In this case, the substrate 100 may be made of polymer plastics having excellent heat resistance, such as Polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PET), and polyethylene terephthalate (PET).
Further, the substrate 100 may be a thin film substrate having a thickness equal to or less than 0.1mm, desirably equal to or less than 50 μm to 100 μm. As described above, when the substrate 100 is a transparent substrate (e.g., thin plastic having flexibility), a flexible display, which is not damaged even if folded or rolled up like paper, can be realized as a next-generation display device.
Although not shown in the figures, a barrier layer may be provided to prevent the introduction of moisture or oxygen from beneath the substrate 100 and also to flatten the surface of the substrate 100. For example, a silicon nitride (SiNx) film, a silicon oxide (SiO) 2 ) One of a film and a silicon oxynitride (SiOxNy) film may be used for the barrier layer. However, the barrier layer is not a necessary component and thus may be omitted as desired.
The organic light emitting member 200 is formed by stacking a plurality of layers. Here, the organic light emitting member 200 may include: a first electrode layer 210; an organic light emitting layer 220 disposed on the first electrode layer 210; and a second electrode layer 230 disposed on the organic light emitting layer 220.
The first electrode layer 210 and the second electrode layer 230 may extend in the lateral direction and be divided into a plurality of. The first electrode layer 210 may be an anode electrode, and the second electrode layer 230 may be a cathode electrode. Thus, the first electrode layer 210 may allow current to flow in, and the second electrode layer 230 may allow the introduced current to flow out.
In addition, when the organic light emitting device is used in a display apparatus, the first electrode layer 210 and the second electrode layer 230 may provide data lines and scan lines, respectively. In this case, the first electrode layer 210 or the second electrode layer 230 may be electrically connected to a thin film transistor (not shown) disposed on the substrate. The thin film transistor may include a data line, a switching TFT, a driving TFR, a storage capacitor, a power supply voltage supply wiring, and a ground power supply wiring and be implemented as a structure of an N-type MOSFET or a P-type MOSFET. Since the structure of the thin film transistor is well known, a detailed description of the structure will be omitted.
In addition, at least one of the first electrode layer 210 and the second electrode layer 230 may be made of a transparent conductive material, such as Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), and Indium Tin Zinc Oxide (ITZO). The first electrode layer 210 may be made of a transparent conductive material to emit light generated from the organic light emitting layer 220 under the substrate 100 without being interfered by the first electrode layer 210.
Further, when the first electrode layer 210 or the second electrode layer 230 is divided into a plurality, the first electrode layer 210 disposed under the organic light emitting layer 220 may extend to a position adjacent to the second electrode layer 230 disposed over the organic light emitting layer 220, or the electrode layer 230 disposed over the organic light emitting layer 220 may extend to a position adjacent to the first electrode layer 210 disposed under the organic light emitting layer 220. In this case, power may be applied only from above the organic light emitting layer 220 or below the organic light emitting layer 220, and a terminal portion of each of the electrode layers may be exposed to only one side surface of the organic light emitting layer to simplify wiring.
The organic light emitting layer 220 is disposed on the first electrode layer 210. The organic light emitting layer 220 provides a current flow path between the first electrode layer 210 and the second electrode layer 230, and although not shown, the organic light emitting layer may be formed by stacking a plurality of organic layers. That is, the organic light emitting layer 220 may be formed by stacking a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer.
When a driving signal is applied to the first electrode layer 210 and the second electrode layer 230, electrons or holes are emitted from the first electrode layer 210 and the second electrode layer 230, respectively, and the emitted electrons and holes are re-coupled with each other, so that the organic light emitting layer 220 emits light. The emitted light may be visible light, and the emitted visible light may be emitted under the substrate 100 through the first electrode layer 210 made of a transparent conductive material to illuminate an object or display a predetermined image or video.
The encapsulation member 300 may be disposed on the organic light emitting member 200 to cover the organic light emitting member 200. The encapsulation member 300 may be made of various known materials and extends from the organic light emitting member 200 to the substrate 100 to cover the organic light emitting member 200 and a portion of the substrate 100, thereby encapsulating the organic light emitting member 200.
For example, the encapsulation member 300 may be formed of one or more layers of at least one inorganic film or at least one organic film or by alternately stacking inorganic films and organic films. Although the inorganic film may include SiNx, siOx, alxOy, siCxNy, siOxNy, amorphous carbon, inOx, and YbOx, exemplary embodiments are not limited to materials that are inorganic films. Although the organic film may include PPX (poly-p-xylene), PCPX (poly-2-chloro-p-xylene), and poly [ 2-methoxy-r- (2' -ethylhexyl oxy) -1, 4-phenylenediene ], exemplary embodiments are not limited to materials that are organic films.
The insulating member 400 is disposed on an interface between two adjacent layers of the plurality of layers of the organic light emitting member 200 to control a current introduced into the defect region D. Here, two adjacent layers represent two layers that are in contact with each other before the insulating member 400 is formed. Further, the insulating member 400 may be disposed on a flow path of the current introduced into the defect region D between the first electrode layer 210 and the second electrode layer 230. In this case, the insulating member 400 may be provided above the defective region D, below the defective region D, or within the defective region D. Here, as illustrated in fig. 5, the defect region D and the insulating member 400 provide a light emitting surface (e.g., a flat surface area projected onto the substrate 100), and the flat surface area provided by the defect region D is contained in the flat surface area provided by the insulating member 400. Accordingly, the insulating member 400 may have a flat surface area equal to or greater than that of the defective region. In this case, the insulating member 400 may have a flat surface area equal to or greater than 110% of the flat surface area of the defective region D and equal to or less than 200% of the flat surface area of the defective region D. Fig. 5 illustrates a state in which the defective region D is projected onto the substrate 100 in a circular shape and the insulating member 400 is projected onto the substrate 100 in a circular shape. Alternatively, the projected shape of the insulating member 400 may be variously changed within a range in which the projected shape has a flat surface area equal to or larger than that of the defective region D.
The insulating member 400 has an electrical insulating property, and the flow of current introduced from the first electrode layer 210 or the second electrode layer 230 to the defective region D is blocked. For example, the first electrode layer 210 and the second electrode layer 230 are shorted because the defective region D has conductivity in the organic light emitting device. When the first electrode layer 210 and the second electrode layer 230 are shorted as described above, current is concentrated on the defective region D. Here, since the insulating member 400 is provided on the flow path of the current introduced into the defect region D between the first electrode layer 210 and the second electrode layer 230 (i.e., above the defect region D, below the defect region D, and within the defect region D), the current flow path between the first electrode layer 210 and the second electrode layer 230 is blocked, and the first electrode layer 210 and the second electrode layer 230 are shorted to open therebetween.
That is, since the current flows in one direction of the first electrode layer 210 or the second electrode layer 230 and along the shortest path between the first electrode layer 210 and the second electrode layer 230, the insulating member 400 is provided above or below the defect region D or in the defect region D to block the current from flowing through the defect region and electrically separate the defect region D. Accordingly, although the region corresponding to the insulating member 400 does not emit light, if the organic light emitting device has the defective region D, the defective region D is prevented from continuously expanding. Further, since the current introduced into the defective region D is prevented when the generation starts from the defective region D, the organic light emitting device having the defective region D can maintain the same characteristic level as that of the organic light emitting device having no defective region D.
Here, as illustrated in fig. 2 and 3, an insulating member 400 may be provided on at least one of an interface between the first electrode layer 210 and the organic light emitting layer 220 and an interface between the organic light emitting layer 220 and the second electrode layer 230. Alternatively, as illustrated in fig. 4, the insulating member 400 may be provided in the organic light emitting layer 220, that is, when the organic light emitting layer includes the above-described organic layers, the insulating member 400 is provided on an interface of two adjacent organic layers of the plurality of organic layers.
The defect region D may be electrically separated to remove a portion of the first electrode layer 210 disposed below the defect region D or a portion of the second electrode layer 230 disposed above the defect region D. Alternatively, a portion or all of the organic light emitting layer 220 including the defective region D may be removed. However, to remove a portion of the first electrode layer 210, the second electrode layer 230, or the organic light emitting layer 220 as described above, an additional energy supply is required to remove the portion of the first electrode layer 210, the second electrode layer 230, or the organic light emitting layer 220. In addition, byproducts may be generated by removing the first electrode layer 210, the second electrode layer 230, or the organic light emitting layer 220 to degrade the characteristics of the device.
Accordingly, the organic light emitting device according to the exemplary embodiment includes the insulating member 400 positioned at an interface between two adjacent layers of the plurality of layers of the organic light emitting member 200. In this case, the insulating member 400 may include a cavity formed by partial separation between two adjacent layers of the plurality of layers. That is, an interface between the first electrode layer 210 and the organic light emitting layer 220 or an interface between the organic light emitting layer 220 and the second electrode layer 230 may be selectively separated, or in addition thereto, an interface between two adjacent organic layers selected from a plurality of organic layers constituting the organic light emitting layer 220 may be selectively separated. As described above, since the insulating member 400 is formed by selectively separating two adjacent layers of the plurality of layers of the organic light emitting member 200, the insulating member 400 can be economically and easily formed by using a small amount of energy, and no sub-band effect is generated in the organic light emitting device at all to ensure the reliability of the organic light emitting device.
As described above, the method for manufacturing the organic light emitting device according to the exemplary embodiment will be described in detail with respect to a process of forming the insulating member 400 on an interface between two adjacent layers of the plurality of layers of the organic light emitting member 200.
Further, the organic light emitting device according to an exemplary embodiment may include: a first electrode layer 210 for allowing a current to flow in; a second electrode layer 230 for allowing an induced current to flow out of the first electrode layer 210; an organic light emitting layer 220 formed by stacking a plurality of layers and providing a current flow path between the first electrode layer 210 and the second electrode layer 230; and an insulating member 400 disposed on at least one of an interface between the first electrode layer 210 and the organic light emitting layer 220, an interface between the organic light emitting layer 220 and the second electrode layer 230, and an interface between two adjacent organic layers of the plurality of organic layers. In this case, since the detailed contents about each component are the same as those described previously, overlapping descriptions will be omitted.
The organic light emitting device according to an exemplary embodiment may further include a light diffusion member 500 disposed on one surface of the substrate on which the organic light emitting member 200 is formed and the other surface. By applying a transparent epoxy resin layer with diffusion function, by coating a transparent epoxy resin layer with diffusion function with a transparent epoxy resin layer with diffusion function 2 The composed powder is added to the applied layer or the light diffusion member 500 is formed by attaching a diffusion sheet.
The light diffusion member 500 serves to ensure optical uniformity of light emitted through the light emitting surface when a dark spot where no light is emitted is generated (because the defective region D and the insulating member 400 are disposed in the organic light emitting member 200). Therefore, even if the organic light emitting device has the defective region D and the insulating member 400, the organic light emitting device can maintain the characteristics of the device by the light diffusion member 500.
A method for manufacturing an organic light emitting device according to an exemplary embodiment will be described in detail below.
Fig. 6 is a schematic view illustrating a method for manufacturing an organic light emitting device according to an exemplary embodiment, and fig. 7 is a view illustrating a state in which electromagnetic waves are radiated on an organic light emitting part through a substrate.
Referring to fig. 6 and 7, a method for manufacturing an organic light emitting device according to an exemplary embodiment includes: a step S100 of stacking a plurality of layers on the substrate 100 to form the organic light emitting member 200; a step S200 of forming the encapsulation member 300 on the organic light emitting member 200; a step S300 of detecting a defective region D in the organic light emitting member 200; and a step S400 of forming an insulating member 400 on an interface between two adjacent layers of the plurality of layers of the organic light emitting member 200 when the defective region D is detected.
First, in step S100 of forming the organic light emitting member 200, a plurality of layers are stacked on the substrate 100 to form the organic light emitting member 200. Here, the substrate 100 may include a transparent substrate having flexibility for realizing a flexible display, and the organic light emitting part 200 may be formed by stacking a plurality of layers including: a first electrode layer 210; an organic light emitting layer 220 formed on the first electrode layer 210; and a second electrode layer 230 formed on the organic light emitting layer 220.
Further, in step S200 of forming the encapsulation member 300, the encapsulation member 300 is formed on the organic light emitting member 200 to cover a portion of the surfaces of the organic light emitting member 200 and the substrate 100. Here, the encapsulation member 300 may be formed of one or more layers of at least one inorganic film or at least one organic film or by alternately stacking inorganic films and organic films. Since the process S100 of forming the organic light emitting member 200 and the process S200 of forming the encapsulation member 300 may be applied to various processes for manufacturing the organic light emitting device, a detailed description thereof will be omitted.
The process S300 of detecting the defective region D detects the defective region D of the abnormally emitted light in the organic light-emitting member 200. For this, a voltage is applied to the first electrode layer 210 and the second electrode layer 230 to check whether light is normally emitted from the light emitting surface, and a region formed by dark spots of abnormally emitted light is detected as a defective region D. When the defective area D has a diameter of less than 3 μm, the defective area generally does not grow to the surrounding area, and when the defective area D has a diameter of equal to or greater than 3 μm, the defective area D continues to grow to the surrounding area. Accordingly, in the process S300 of detecting the defective area D, the defective area D having a diameter equal to or greater than 3 μm may be detected. Further, when the defective region D has a diameter greater than 50 μm, the defective region D may be visually detected through the light emitting surface to determine the organic light emitting device failure. Accordingly, in the process S300 of detecting the defective area D, the defective area D having a diameter equal to or smaller than 50 μm may be detected.
When the defective region D is detected, a process S400 of forming the insulating member 400 is performed. The process of forming the insulating member 400 may form the insulating member 400 by separating two adjacent layer portions of the plurality of layers of the organic light emitting member 200. Here, the two adjacent layers may be the first electrode layer 210 and the organic light emitting layer 220 or the organic light emitting layer 220 and the second electrode layer 230, and when the organic light emitting layer 220 is formed of a plurality of organic layers, the two adjacent layers may be two adjacent organic layers of the plurality of organic layers.
To form the insulating member 400, the organic light emitting device may be pressed in one direction to separate two adjacent layer portions of the plurality of layers of the organic light emitting member 200. That is, a force may be applied to one surface of the organic light emitting device in the vertical and horizontal directions to form the insulating member 400, and two adjacent layer portions of the plurality of layers of the organic light emitting member 200 may be separated. However, since the organic light emitting device may be damaged when the organic light emitting device is directly pressed, in the process S400 of forming the insulating member 400, it may be desirable to radiate electromagnetic waves to the organic light emitting member 200 through the substrate 100 to separate two adjacent layer portions of the plurality of layers of the organic light emitting member 200.
Here, the electromagnetic wave may include laser or ultraviolet rays having energy sufficient to separate two adjacent layer portions of the plurality of layers of the organic light emitting member 200. Here, the laser light may be radiated by the laser radiation apparatus L, and UV laser light, IR laser light, YAG laser light, and Femto-second (Femto) laser light may be used. In this case, YAG laser, ruby laser, helium neon laser, carbon dioxide laser, and semiconductor laser may be used according to the medium of laser, IR laser or UV laser may be used according to the wavelength of laser, and femtosecond laser may be used according to the pulse width of laser. The irradiation of laser light through the substrate to form the insulating member 400 will be described below by way of example.
That is, the process S400 of forming the insulating member 400 may include: a process S410 of processing laser light; and a process S420 of radiating laser light to the organic light emitting member 200 through the substrate 100. Here, the process S410 of processing the laser may include a process of controlling a radiation surface area LA of the laser, a process of adjusting energy of the laser, and a process of determining a position of a focal point of the laser.
First, the process of controlling the radiation surface area of the laser light, which is projected onto the substrate 100, controls the radiation surface area LA to be equal to or larger than the flat surface area of the defect area D. That is, the radiation surface area LA of the laser is controlled to be larger than the flat surface area of the defective area D to solve the electrical short caused by the defective area D and to electrically separate the defective area D.
Further, the process of adjusting the energy of the laser may control the energy of the laser to be greater than the energy required to separate two adjacent layer portions of the plurality of layers of the organic light emitting member 200 and less than the energy required to remove at least one layer of the plurality of layers. That is, energy greater than that required to separate two adjacent layer portions of the plurality of layers of the organic light emitting member 200 is required to remove a portion of the regions of the first electrode layer 210, the organic light emitting layer 220, and the second electrode layer 230. In addition, when the laser is irradiated from the substrate 100, the interface between the first electrode layer 210 and the organic light emitting layer 220 may be separated using a minimum amount of energy. Accordingly, in adjusting the energy of the laser light, the energy of the laser light may be controlled to be greater than the energy required to separate the interface portion between the first electrode layer 210 and the organic light emitting layer 220 and less than the energy required to remove a portion of the first electrode layer 210, the organic light emitting layer 220, and the second electrode layer 230, thereby minimizing the output of the radiated laser light and the denaturation of each layer of the organic light emitting member 200.
The process of determining the focal point of the laser light may determine that the focal point of the laser light is disposed on an interface between the first electrode layer 210 and the organic light emitting layer 220 included in the organic light emitting member 200 or an interface between the organic light emitting layer 220 and the second electrode layer 230 included in the organic light emitting member 200. Further, the process of determining the focus of the laser light may determine that the focus of the laser light is disposed in the organic light emitting layer 220 (i.e., an interface between two adjacent organic layers of the plurality of organic layers) included in the organic light emitting member 200. Since the position of the focal point of the laser is determined to be located at the interface between two adjacent layers of the plurality of layers of the organic light emitting member 200 as described above, each layer can be easily separated.
The laser light treated as described above is irradiated to have a radiation surface area LA larger than the flat surface area of the defect region D. The processed laser light is irradiated into the organic light emitting member 200 through the transparent substrate, and a part of the region of the interface between two adjacent layers of the plurality of layers of the organic light emitting member 200 is separated thereby.
Two adjacent layers of the plurality of layers of the organic light emitting member 200 may be partially separated to form the insulating member 400 through the above-described process, and then, a process S500 of forming the light diffusion member 500 on the light emitting surface of the organic light emitting device may be further provided. Can be formed by SiO by applying a transparent epoxy resin layer with diffusion function 2 The composed powder is added to an application layer or an attached diffusion sheet to form the light diffusion member 500.
As described above, according to the organic light emitting device and the method of manufacturing the same of the exemplary embodiment, since the insulating member is formed at a position projected by overlapping with the defective region in the organic light emitting member to electrically separate the defective region, it is possible to prevent the defective region from being enlarged to a surrounding region due to continuous supply of power to the defective region.
Further, since two adjacent layers of the plurality of layers of the organic light emitting member are separated to form the insulating member, the defective region can be electrically separated economically and easily by using a small amount of energy, and no by-products are generated in the organic light emitting device at all to ensure the reliability of the organic light emitting device.
The technical terms are used herein to explain specific exemplary embodiments only, and not to limit the invention. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. Therefore, the detailed description of the invention is not intended to limit the invention to the embodiments disclosed. Furthermore, the appended claims should be construed to include steps of even another embodiment.
Claims (7)
1. A method for manufacturing an organic light emitting device, the method comprising:
forming an organic light emitting member by stacking a plurality of layers on a substrate;
forming an encapsulation member on the organic light emitting member;
detecting a defective region in the organic light emitting member;
forming an insulating member on an interface between two adjacent layers of the plurality of layers of the organic light emitting member when the defective region is detected; and
A light diffusion member is formed on a light emitting surface of the substrate,
wherein the substrate is constituted by an insulating transparent substrate having one surface and another surface, the organic light emitting member is formed on the one surface, and the other surface forms a light emitting surface on the other side of the one surface,
forming the insulating member includes radiating electromagnetic waves to the organic light emitting member through the substrate,
the radiation surface area of the electromagnetic wave is controlled to be equal to or larger than the flat surface area of the defective region, so that the flat surface area of the defective region is included in the flat surface area of the insulating member,
forming the light diffusion member by applying a transparent epoxy layer on the light emitting surface of the substrate to form a coating layer, and adding a light diffusion layer containing SiO to the coating layer 2 Powder of ingredients
Forming the light diffusion member is performed after the insulating member is formed in the organic light emitting member.
2. The method of claim 1, wherein the forming of the insulating member separates the two adjacent layer portions of the plurality of layers of the organic light emitting member to form the insulating member.
3. The method of claim 1, wherein the electromagnetic waves comprise laser light or ultraviolet light.
4. The method as recited in claim 1, further comprising: treating the electromagnetic waves before radiating the electromagnetic waves to the organic light emitting member,
wherein the processing of the electromagnetic wave comprises:
adjusting the energy of the electromagnetic wave; and
A position of a focal point of the electromagnetic wave is determined.
5. The method of claim 4, wherein the adjusting of the energy of the electromagnetic wave controls the energy of the electromagnetic wave to be greater than an energy required to partially separate the two adjacent layers of the plurality of layers of the organic light emitting component and less than an energy required to partially remove at least one layer of the plurality of layers.
6. The method of claim 4, wherein the determination of the focus of the electromagnetic wave determines that the focus of the electromagnetic wave is disposed on an interface between a first electrode layer and an organic light emitting layer in the organic light emitting component or an interface between the organic light emitting layer and a second electrode layer in the organic light emitting component.
7. The method of claim 4, wherein the determination of the focus of the electromagnetic wave determines that the focus of the electromagnetic wave is disposed in an organic light emitting layer in the organic light emitting component.
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| KR10-2017-0062138 | 2017-05-19 | ||
| KR1020170062138A KR102109000B1 (en) | 2017-05-19 | 2017-05-19 | Organic light emitting device and method for manufacturing the same |
| PCT/KR2017/005318 WO2018212388A1 (en) | 2017-05-19 | 2017-05-23 | Organic light-emitting element and method for manufacturing same |
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| TWI746556B (en) | 2021-11-21 |
| WO2018212388A1 (en) | 2018-11-22 |
| KR20180126959A (en) | 2018-11-28 |
| KR102109000B1 (en) | 2020-05-12 |
| CN109287135A (en) | 2019-01-29 |
| TW201901984A (en) | 2019-01-01 |
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