CN109273366A - A kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix - Google Patents
A kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix Download PDFInfo
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- CN109273366A CN109273366A CN201810780279.8A CN201810780279A CN109273366A CN 109273366 A CN109273366 A CN 109273366A CN 201810780279 A CN201810780279 A CN 201810780279A CN 109273366 A CN109273366 A CN 109273366A
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- substrate
- preparation
- island body
- fexible film
- connection cylinder
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- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 33
- 239000011159 matrix material Substances 0.000 title claims abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 239000010703 silicon Substances 0.000 claims abstract description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000001301 oxygen Substances 0.000 claims abstract description 8
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 8
- 239000012528 membrane Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 239000010408 film Substances 0.000 claims description 28
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 15
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 15
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 15
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 15
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 12
- 238000004528 spin coating Methods 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 239000005357 flat glass Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000009776 industrial production Methods 0.000 abstract description 3
- 238000003698 laser cutting Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix, " island body-connection cylinder-substrate " includes the structural unit for connecting cylinder and the polygon membrane structure island body composition for being disposed thereon surface；Multiple building block array formulas are arranged in substrate；Preparation method is the following steps are included: step 1: using with the fexible film with the silicon mould preparation surface for connecting the concave point structure that column structure matches with bump structure；Step 2: fexible film prepared by step 1 is carried out laser cutting and form structural unit according to being sized for island body and connection cylinder；Step 3: preparation required thickness fexible film is as substrate；Step 4: structural unit and substrate are pre-processed by oxygen plasma；Step 5: bonding together to form required structure.Cost, and high yield rate is greatly lowered in the present invention, provides possibility to meet industrial production application.
Description
Technical field
The present invention relates to flexible extending electronics preparation technical fields, and in particular to a kind of " island body-connection cylinder-substrate "
The preparation method of structural flexibility matrix.
Background technique
Flexible extending electronics (Flexible and Stretchable Electronics) technology is by electronic component
The new electronic technology on flexible extending matrix is fully integrated into the crosslinking conductor of connecting electronic component；Flexible extending electricity
Sub- device has biggish mechanical flexibility, can adapt to different working environments to a certain extent, meet convex-concave surface pair
In the deformation requirement of equipment；Therefore the design of flexible extending electronic device breaches the limitation of conventional rigid substrate, makes entire
Device keeps original function to be basically unchanged while bearing the deformation such as tension and compression, folding, distortion of large scale.
Such as a kind of manufacturing method (201710403949X) of " I " type structure PDMS matrix of current existing preparation method, mentions
A kind of manufacturing method and a kind of manufacturing method of " I " type structure PDMS matrix based on reverse of " I " type structure PDMS matrix out；
But this manufacturing approach craft process is complicated, and the yield rate of flexible substrate is low, is not able to satisfy the requirement of batch production.
Summary of the invention
The present invention provides " island body-connection cylinder-substrate " structural flexibility matrixes that cost, high yield rate can be greatly reduced
Preparation method.
The technical solution adopted by the present invention is that: a kind of preparation side of " island body-connection cylinder-substrate " structural flexibility matrix
Method, " island body-connection cylinder-substrate " include connecting cylinder to constitute with the polygon membrane structure island body for being disposed thereon surface
Structural unit；Multiple building block array formulas are arranged in substrate；Preparation method the following steps are included:
Step 1: using having and connect the silicon mould preparation surface for the concave point structure that column structure matches with salient point
The fexible film of structure；
Step 2: fexible film prepared by step 1 is subjected to laser cutting shape according to island body and being sized for cylinder of connection
At structural unit；
Step 3: preparation required thickness fexible film is as substrate；
Step 4: the structural unit that step 2 obtains and substrate prepared by step 3 are pre-processed by oxygen plasma；
Step 5: the structural unit obtained after step 4 pretreatment and substrate are bonded together to form into required structure.
Further, fexible film preparation process is as follows in the step 1:
S1: the host agent of DOW CORNING 184 and curing agent are uniformly mixed with volume ratio for the ratio of 10:1, vacuumize 30~
40min obtains liquid PDMS, and liquid PDMS is instilled in silicon mould；
S2: silicon mould is placed on sol evenning machine, and liquid PDMS spin coating is added dropwise, until obtaining identical with island body thickness thin
Film；
S3: vacuumizing 20~30min, and 1h is placed under the conditions of 120 DEG C, and required fexible film can be obtained in solidification, demoulding.
Further, in the step 3 fexible film the preparation method is as follows:
The silicon mould for being used to prepare substrate is placed on sol evenning machine, liquid PDMS is added dropwise, until obtaining required thickness；
1h is placed under the conditions of 120 DEG C, required fexible film can be obtained in solidification, demoulding.
Further, the connection cylinder is one of polygon column body and cylindrical body.
Further, the silicon mould in the step 1 obtains required concave point by reactive ion deep etching using silicon wafer
Structure.
Further, detailed process is as follows in the step 2: fexible film bump structure prepared by step 1 is face-up,
Being affixed on spin coating has on the sheet glass of sacrificial layer；Then it is cut by laser according to the size of setting.
The beneficial effects of the present invention are:
(1) cost, and high yield rate is greatly lowered in preparation method of the present invention, can to meet that industrial production application provides
Energy；
(2) present invention pre-processes laggard line unit by oxygen plasma and closes the seamless company, it can be achieved that connection cylinder and substrate
It connects；
(3) present invention is cut by laser to form island body, convenient for preparing the island body of various shapes；
(4) by control spin coating speed and time, the island body and substrate of different-thickness are prepared.
Detailed description of the invention
Fig. 1 is flow diagram of the present invention.
Fig. 2 is composite construction schematic diagram of the present invention.
Fig. 3 is scanning electron microscope (SEM) photograph of the structure prepared by the present invention under the conditions of torsional deformation.
Fig. 4 is scanning electron microscope (SEM) photograph of the structure prepared by the present invention under the conditions of bending deformation.
In figure: the island 1- body, 2- connection cylinder, 3- substrate.
Specific embodiment
In the following with reference to the drawings and specific embodiments to the left further explanation of the present invention.
As shown in Figs. 1-2, a kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix, " island body-connection
Cylinder-substrate " includes the structural unit for connecting cylinder 2 and the composition of polygon membrane structure island body 1 for being disposed thereon surface；
Multiple building block array formulas are arranged in substrate 3；Island body 1 uses square structure in the present embodiment, it is specifically used in can be with
Its structure is set as needed, is usually arranged as polygonized structure.
Preparation method the following steps are included:
Step 1: using having and connect the silicon mould preparation surface for the concave point structure that 2 structure of cylinder matches with salient point
The fexible film of structure；
Fexible film preparation process is as follows:
S1: the host agent of DOW CORNING 184 and curing agent are uniformly mixed with volume ratio for the ratio of 10:1, vacuumize 30~
40min obtains liquid PDMS, and liquid PDMS is instilled in silicon mould；Silicon mould is by carrying out reactive ion depth to silicon wafer
Etching obtains；
S2: silicon mould is placed on sol evenning machine, and liquid PDMS spin coating is added dropwise, until obtaining identical with 1 thickness of island body
Film；By controlling revolving speed and the time of spin coating, 1 fexible film of island body for needing thickness can be obtained；
S3: being put into vacuum tank and vacuumize 20~30min, and 1h is placed in 120 DEG C of baking oven, and solidification, demoulding can be obtained
Required fexible film.
Step 2: fexible film prepared by step 1 is cut by laser according to island body 1 and being sized for cylinder 2 of connection
Form structural unit；
The salient point for the fexible film that step 1 is obtained is face-up, and burnishing surface lower surface is affixed on the glass that spin coating has sacrificial layer
Piece, sacrificial layer are AZ4620 photoresist；
Fexible film is cut by laser, cutting penetrates, and fexible film is patterned and is divided, and obtains patterning block, i.e.,
Island body 1 with connection cylinder 2.
Step 3: preparation required thickness fexible film is as substrate 3；
The silicon mould for being used to prepare substrate 3 is placed on sol evenning machine, be added dropwise liquid PDMS, control spin coating revolving speed and when
Between, required thickness can be obtained；
1h is placed under the conditions of in 120 DEG C of baking oven, required fexible film can be obtained in solidification, demoulding.
Step 4: the structural unit that step 2 obtains and substrate 3 prepared by step 3 are crossed into oxygen plasma pretreatment；
Step 5: the structural unit obtained after step 4 pretreatment and substrate 3 are bonded together to form into institute at room temperature
Need structure.
Connecting cylinder 2 is one of polygon column body and cylindrical body.
The present invention in step 1 and step 3, by controlling speed and the time of spin coating, obtains the island of different-thickness respectively
Body 1 and substrate 3, so that " island body-connection cylinder-substrate " composite construction flexible substrate of different-thickness size be made；In laser
In cutting action, fexible film is cut using Multifunctional ultraviolet laser system, multiple patternsization cutting can be carried out and set
Meter；In oxygen plasma bond sequence, using oxygen plasma bonding technology, the seamless company of connection cylinder 2 and substrate 3 is realized
It connects；Laser cutting parameter and oxygen plasma bonding technology are combined, manufacturing method is simplified, considerably reduce manufacture at
This, and the high yield rate of flexible substrate, possibility is provided to meet industrial production application.
Claims (6)
1. a kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix, which is characterized in that " island body-connecting column
Body-substrate " includes the structural unit for connecting cylinder (2) and polygon membrane structure island body (1) composition for being disposed thereon surface；
Multiple building block array formulas are arranged on substrate (3)；Preparation method the following steps are included:
Step 1: using having and connect the silicon mould preparation surface for the concave point structure that cylinder (2) structure matches with salient point knot
The fexible film of structure；
Step 2: fexible film prepared by step 1 is cut by laser according to island body (1) and being sized for cylinder (2) of connection
Form structural unit；
Step 3: preparation required thickness fexible film is as substrate (3)；
Step 4: the structural unit that step 2 obtains and substrate (3) prepared by step 3 are pre-processed by oxygen plasma；
Step 5: the structural unit obtained after step 4 pretreatment and substrate (3) are bonded together to form into required structure.
2. the preparation method of one kind " island body-connection cylinder-substrate " structural flexibility matrix according to claim 1, special
Sign is that fexible film preparation process is as follows in the step 1:
S1: the host agent of DOW CORNING 184 and curing agent are uniformly mixed with volume ratio for the ratio of 10:1,30~40min is vacuumized
Liquid PDMS is obtained, liquid PDMS is instilled in silicon mould；
S2: silicon mould is placed on sol evenning machine, and liquid PDMS spin coating is added dropwise, until obtaining identical with island body (1) thickness thin
Film；
S3: vacuumizing 20~30min, and 1h is placed under the conditions of 120 DEG C, and required fexible film can be obtained in solidification, demoulding.
3. the preparation method of one kind " island body-connection cylinder-substrate " structural flexibility matrix according to claim 2, special
Sign is, fexible film in the step 3 the preparation method is as follows:
The silicon mould for being used to prepare substrate (3) is placed on sol evenning machine, liquid PDMS is added dropwise, until obtaining required thickness；
1h is placed under the conditions of 120 DEG C, required fexible film can be obtained in solidification, demoulding.
4. the preparation method of one kind " island body-connection cylinder-substrate " structural flexibility matrix according to claim 1, special
Sign is that the connection cylinder (2) is one of polygon column body and cylindrical body.
5. the preparation method of one kind " island body-connection cylinder-substrate " structural flexibility matrix according to claim 1, special
Sign is that the silicon mould in the step 1 obtains required concave point structure by reactive ion deep etching using silicon wafer.
6. the preparation method of one kind " island body-connection cylinder-substrate " structural flexibility matrix according to claim 1, special
Sign is that detailed process is as follows in the step 2:
Fexible film bump structure prepared by step 1 is face-up, and being affixed on spin coating has on the sheet glass of sacrificial layer；Then according to setting
Fixed size is cut by laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780279.8A CN109273366B (en) | 2018-07-17 | 2018-07-17 | Preparation method of island-connecting column-substrate-structured flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780279.8A CN109273366B (en) | 2018-07-17 | 2018-07-17 | Preparation method of island-connecting column-substrate-structured flexible substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109273366A true CN109273366A (en) | 2019-01-25 |
| CN109273366B CN109273366B (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810780279.8A Active CN109273366B (en) | 2018-07-17 | 2018-07-17 | Preparation method of island-connecting column-substrate-structured flexible substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111319177A (en) * | 2020-03-01 | 2020-06-23 | 西南交通大学 | Bionic adhesion material with mushroom-shaped end and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140144480A1 (en) * | 2012-11-29 | 2014-05-29 | Gwangju Institute Of Science And Technology | Stretchable substrate, stretchable photovoltaic apparatus, and stretchable device |
| CN106185782A (en) * | 2016-09-12 | 2016-12-07 | 桂林电子科技大学 | A kind of flexible substrates towards extending electronics |
| CN107068648A (en) * | 2017-06-06 | 2017-08-18 | 西南交通大学 | A kind of flexible substrate of two-sided " I " type composite construction |
| CN107195716A (en) * | 2017-05-13 | 2017-09-22 | 西南交通大学 | A kind of space thin-film solar cells device based on flexible substrate Structured Design |
-
2018
- 2018-07-17 CN CN201810780279.8A patent/CN109273366B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140144480A1 (en) * | 2012-11-29 | 2014-05-29 | Gwangju Institute Of Science And Technology | Stretchable substrate, stretchable photovoltaic apparatus, and stretchable device |
| CN106185782A (en) * | 2016-09-12 | 2016-12-07 | 桂林电子科技大学 | A kind of flexible substrates towards extending electronics |
| CN107195716A (en) * | 2017-05-13 | 2017-09-22 | 西南交通大学 | A kind of space thin-film solar cells device based on flexible substrate Structured Design |
| CN107068648A (en) * | 2017-06-06 | 2017-08-18 | 西南交通大学 | A kind of flexible substrate of two-sided " I " type composite construction |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111319177A (en) * | 2020-03-01 | 2020-06-23 | 西南交通大学 | Bionic adhesion material with mushroom-shaped end and preparation method thereof |
| CN111319177B (en) * | 2020-03-01 | 2021-05-18 | 西南交通大学 | Bionic adhesion material with mushroom-shaped end and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN109273366B (en) | 2020-02-21 |
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