CN107068648A - A kind of flexible substrate of two-sided " I " type composite construction - Google Patents
A kind of flexible substrate of two-sided " I " type composite construction Download PDFInfo
- Publication number
- CN107068648A CN107068648A CN201710419790.0A CN201710419790A CN107068648A CN 107068648 A CN107068648 A CN 107068648A CN 201710419790 A CN201710419790 A CN 201710419790A CN 107068648 A CN107068648 A CN 107068648A
- Authority
- CN
- China
- Prior art keywords
- cylinder
- substrate
- island body
- flexible substrate
- composite construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 239000002131 composite material Substances 0.000 title claims abstract description 22
- 238000010276 construction Methods 0.000 title claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 238000004132 cross linking Methods 0.000 claims abstract description 8
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 5
- 229920005570 flexible polymer Polymers 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 239000011159 matrix material Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000002146 bilateral effect Effects 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polydimethylsiloxanes Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
Abstract
The present invention discloses a kind of flexible substrate of two-sided " I " type composite construction, including substrate, groove, connection cylinder and island body；Equally box formation is arranged in the upper and lower surface of substrate to connection cylinder；Connection cylinder positioned at substrate lower surface and the connection cylinder positioned at upper surface of substrate are in specular；Separated between connection cylinder and connection cylinder by groove；Island body is placed on connection cylinder；The lateral dimension of island body is more than or slightly larger than the lateral dimension of connection cylinder；Separated between the body of Dao Tiyu islands by groove；Electronic device is sticked on the body of island, and the crosslinking conductor of connection of electronic devices is hidden among groove.The present invention not only has under large deformation behavior strains completely isolated effect, significantly extend the service life of electronic device, and electronic device can be attached in both sides simultaneously, the surface utilisation of flexible substrate is increased, so as to meet the two sides flexible electronic device of particular demands.
Description
Technical field
The present invention relates to the technology of flexible extending electronics (Flexible and Stretchable Electronics)
A kind of field, and in particular to flexible substrate of two-sided " I " type composite construction.
Background technology
Flexible extending electronics (Flexible and Stretchable Electronics) technology is by electronic component
The new electronic technology on flexible extending matrix is fully integrated into the crosslinking conductor of connecting electronic component.With traditional integrated electricity
Sub- technology is compared, and key electronic device is exactly integrated on flexible substrate by the characteristics of it is most prominent.Flexible substrate includes various
The top layer of soft material, such as plastics with super elastic properties and organism.Flexible substrate replaces conventional rigid substrate,
So that the large scale being applied on whole electronic device deforms the substantially all deformation by flexible substrate and is crosslinked conductor
Unstability or distortion large deformation are digested outside face, and comparatively core electron component deforms very little.Therefore flexible electronic device
Design breaches the limitation of conventional rigid substrate, whole device is being born the same of the deformations such as the tension and compression, folding, distortion of large scale
When and keep original function to be basically unchanged.
The applicant is proposed based on flexible substrate knot in Chinese patent application (number of patent application 2017103362864)
The matrix design with optimal distortion isolation effect of the space thin-film solar cells device of structureization design, manufacture is a kind of
The flexible substrate of " I " type structure, the matrix is realized to be had under the large deformation behavior such as uniaxial tension, biaxial stretch-formed, torsion, bending
Complete strain isolating effect, but the flexible substrates for being somebody's turn to do " I " type structure can not meet the flexible electronic device with bilateral structure
Demand, it is impossible to reach and matrix surface made full use of, do not meet advanced micro-nano system property miniature to part and densification
Requirement.
The content of the invention
The technical problems to be solved by the invention are that the flexible substrate of one side " I " type structure can not be met with bilateral structure
Flexible electronic device demand there is provided a kind of flexible substrate of two-sided " I " type composite construction, and add flexible substrate table
The electronic device occupation rate in face.
To solve the above problems, the present invention is achieved through the following technical solutions：
A kind of flexible substrate of two-sided " I " type composite construction, as the crosslinking of electronic component and connecting electronic component is led
Body synthesizes integrated extending carrier, it is characterised in that equally multiple connecting poles of box formation arrangement are connected to substrate 1
Upper and lower surface, be respectively connected between island body, the island body of same surface connection by vertical and horizontal on each connection cylinder
Trench separation come；Positioned at substrate lower surface connection cylinder and its island body with positioned at upper surface of substrate connection cylinder and its
Island body is in specular；Lateral dimension of the lateral dimension of island body not less than connection cylinder.
In integrated installation in use, electronic device is sticked on the body of island, the crosslinking conductor of connection of electronic devices is hidden in ditch
Among groove.
In such scheme, connection cylinder is in cylinder, square cylinder, rhombus cylinder or other polygon cylinders.
In such scheme, island body is in cylinder, square cylinder, rhombus cylinder or other polygon cylinders.
In such scheme, substrate, connection cylinder and island body are integrated.
In such scheme, matrix, connection cylinder and island body are all hyperelastic flexible polymer.
In such scheme, the ratio between the thickness of island body and the thickness of substrate are 0.25~1.
In such scheme, the ratio between the thickness of the thickness of island body with being connected cylinder is 0.5~1.5.
In such scheme, the depth of groove and width ratio are 0.6~2 between the body of Dao Tiyu islands.
In such scheme, the depth of groove and width ratio are 0.2~2 between connection cylinder and connection cylinder.
In such scheme, the crosslinking conductor of connection of electronic devices due to outside face unstability large deformation be hidden between groove.
Compared with prior art, the present invention is not only realizing the large deformation row such as uniaxial tension, biaxial stretch-formed, torsion, bending
There is the completely isolated effect of strain to be lower so that the large deformation being applied in substrate will not cause the large deformation of electronic device, right
Electronic device has protective effect, significantly extends the service life of electronic device, and can attach electricity in both sides simultaneously
Sub- device, increases the surface utilisation of flexible substrate, so as to meet the two sides flexible electronic device of particular demands.
Brief description of the drawings
Fig. 1 is a kind of dimensional structure diagram of the flexible substrate of two-sided " I " type composite construction.
Fig. 2 is a kind of sectional view of the flexible substrate of two-sided " I " type composite construction.
Label in figure：10th, substrate；21 and 22 be respectively longitudinal groove and lateral trench；31st, 32 connection cylinder；41st, 42 island
Body.
Embodiment
The flexible substrate embodiment of one two-sided " I " type composite construction as depicted in figs. 1 and 2, by substrate 10, is set in length and breadth
Multiple grooves, multiple connection cylinders and island body composition.The flexible substrate of composite construction is with good ductility electronic device
Basis, substrate 10 plays carrying effect to total, bears the load such as uniaxial tension, biaxial stretch-formed, torsion, bending.Island body
It is the integrated platform of electronic device.The lateral dimension of island body (41 and 42 in such as figure) is more than or slightly larger than connection cylinder (as schemed
In 31 and lateral dimension 32).Connection cylinder primarily serves the completely isolated effect of strain so that apply big change on the base 1
Shape will not cause the large deformation of electronic device.Between the island body of same surface connection by a plurality of longitudinal groove that is distributed in length and breadth (such as
21) separate with lateral trench (such as 22).Groove is realized in the loading such as uniaxial tension, biaxial stretch-formed, torsion, bending
Extension effect.
The composite construction being made up of connection cylinder and island body is distributed in the both sides of substrate, during integrated installation, electronics in mirror image
Device can be adhered on the island body of upper surface of substrate, can also be adhered on the island body of substrate lower surface, strained realizing
On the premise of full isolation, the two sides flexible electronic device of particular demands is met, the effective area of structural matrix is improved
Occupation rate.
It is in cylinder, square cylinder, rhombus cylinder or other polygon cylinders to connect cylinder, of the invention preferred real
Apply in example, each connection cylinder is in the square cylinder that the length of side is 400 μm, and equidistant box formation is arranged in the upper surface of substrate
And lower surface.Island body is located on connection cylinder, and each island body is in cylinder, square cylinder, rhombus cylinder or other polygon
Shape cylinder, in a preferred embodiment of the invention, each island body is in the square cylinder that the length of side is 800 μm.Island body and connection cylinder
All opened by trench separation.Substrate, connection cylinder and island body are integral structures, are all made up of hyperelastic flexible polymer,
In the preferred embodiment of the present invention, using the PDMS (polydimethylsiloxanes with performances such as corrosion resistance, high light transmittance, super-elasticity
The abbreviation of alkane) it is made.
Influence due to substrate to the completely isolated effect of strain of island body is obvious, so the thickness and substrate of island body
The ratio between thickness is controlled in the larger context, and such as 0.25~1.In the embodiment of the present invention, the thickness of substrate is 200 μm, island body
Thickness is 100 μm.Connect cylinder has obvious influence to the high selectivity of island body, it is further contemplated that the sufficiently thin premise of matrix
Under, it is 0.5~1.5 to select the ratio between the thickness of the thickness of island body with being connected cylinder.In the present embodiment, the thickness of connection cylinder is
100μm.Separated between the body of island by groove, and crosslinking conductor needs to be hidden between groove, between the Dao Tiyu islands body on same surface
The depth of groove is 0.6~2 with width ratio, and the depth of groove and width ratio are 0.2 between the connection cylinder of same surface connection
~1.
In the present invention, need in advance to stretch the flexible substrate of composite construction when electronic device is installed, it is certain pre- having
Integrated-optic device is adhered on the premise of strain, after release prestrain, crosslinking conductor bends to groove due to unstability outside face
It is interior, so as to improve the effective area occupation rate of structural matrix.
Claims (10)
1. a kind of flexible substrate of two-sided " I " type composite construction, as by the crosslinking conductor of electronic component and connecting electronic component
The integrated extending carrier of synthesis, it is characterised in that equally multiple connecting poles of box formation arrangement are connected to substrate (1)
Upper and lower surface, be respectively connected between island body, the island body of same surface connection by vertical and horizontal on each connection cylinder
Trench separation come；Connection cylinder and its island body positioned at substrate (1) lower surface and the connecting pole positioned at substrate (1) upper surface
Body and its island body are in specular；Lateral dimension of the lateral dimension of island body not less than connection cylinder.
2. the flexible substrate of two-sided " I " the type composite construction of one kind according to claim 1, it is characterised in that connection cylinder
It is in cylinder or square cylinder or polygon cylinder.
3. the flexible substrate of two-sided " I " the type composite construction of one kind according to claim 1, it is characterised in that island body (4) is in
Cylinder or square cylinder or polygon cylinder.
4. the flexible substrate of two-sided " I " the type composite construction of one kind according to claim 1, it is characterised in that substrate (1),
Connection cylinder and island body are integrated.
5. a kind of composite construction flexible substrate towards extending electronics according to claim 1 or 4, it is characterised in that
Substrate (1), connection cylinder and island body are all hyperelastic flexible polymer.
6. the flexible substrate of two-sided " I " the type composite construction of one kind according to claim 1, it is characterised in that the thickness of island body
The ratio between degree and the thickness of substrate (1) are 0.25~1.
7. the flexible substrate of two-sided " I " the type composite construction of one kind according to claim 1, it is characterised in that the thickness of island body
It is 0.5~1.5 to spend the ratio between thickness with being connected cylinder.
8. the flexible substrate of two-sided " I " the type composite construction of one kind according to claim 1, it is characterised in that island body (4) with
Gash depth and width ratio between island body (4) are 0.6~2.
9. the flexible substrate of two-sided " I " the type composite construction of one kind according to claim 1, it is characterised in that same surface
The gash depth and width ratio connected between cylinder is 0.2~2.
10. a kind of composite construction flexible substrate of flexible extending electronics according to claim 1, it is characterised in that island
Body is the square cylinder that the length of side is 800 μm；Cylinder is connected in the square cylinder that the length of side is 400 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710419790.0A CN107068648A (en) | 2017-06-06 | 2017-06-06 | A kind of flexible substrate of two-sided " I " type composite construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710419790.0A CN107068648A (en) | 2017-06-06 | 2017-06-06 | A kind of flexible substrate of two-sided " I " type composite construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107068648A true CN107068648A (en) | 2017-08-18 |
Family
ID=59617457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710419790.0A Pending CN107068648A (en) | 2017-06-06 | 2017-06-06 | A kind of flexible substrate of two-sided " I " type composite construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107068648A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109273366A (en) * | 2018-07-17 | 2019-01-25 | 西南交通大学 | A kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102202468A (en) * | 2006-12-20 | 2011-09-28 | 3M创新有限公司 | Methods of patterning a deposit metal on a substrate |
| GB201405081D0 (en) * | 2014-03-21 | 2014-05-07 | Nokia Corp | Flexible electronics apparatus and associated methods |
| CN104392904A (en) * | 2014-11-21 | 2015-03-04 | 河南理工大学 | Flexible substrate based extensible conductive film and preparation process |
| CN106206462A (en) * | 2016-09-12 | 2016-12-07 | 桂林电子科技大学 | A kind of double-faced flexible structural substrate towards extending electronics |
| US20170040306A1 (en) * | 2015-06-30 | 2017-02-09 | Apple Inc. | Electronic Devices With Soft Input-Output Components |
| CN207217521U (en) * | 2017-06-06 | 2018-04-10 | 西南交通大学 | A kind of flexible substrate of two-sided " I " type composite construction |
-
2017
- 2017-06-06 CN CN201710419790.0A patent/CN107068648A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102202468A (en) * | 2006-12-20 | 2011-09-28 | 3M创新有限公司 | Methods of patterning a deposit metal on a substrate |
| GB201405081D0 (en) * | 2014-03-21 | 2014-05-07 | Nokia Corp | Flexible electronics apparatus and associated methods |
| CN104392904A (en) * | 2014-11-21 | 2015-03-04 | 河南理工大学 | Flexible substrate based extensible conductive film and preparation process |
| US20170040306A1 (en) * | 2015-06-30 | 2017-02-09 | Apple Inc. | Electronic Devices With Soft Input-Output Components |
| CN106206462A (en) * | 2016-09-12 | 2016-12-07 | 桂林电子科技大学 | A kind of double-faced flexible structural substrate towards extending electronics |
| CN207217521U (en) * | 2017-06-06 | 2018-04-10 | 西南交通大学 | A kind of flexible substrate of two-sided " I " type composite construction |
Non-Patent Citations (1)
| Title |
|---|
| 张义哲等: "基底-立柱-岛体"型结构化基体的尺寸对柔性太阳能电池的影响" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109273366A (en) * | 2018-07-17 | 2019-01-25 | 西南交通大学 | A kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107068895B (en) | A kind of display panel and its display | |
| CN110277020A (en) | Show equipment | |
| TW200707639A (en) | Interconnect structure for semiconductor devices | |
| WO2008139611A1 (en) | Solar cell module | |
| US20230040918A1 (en) | Display module stack structure and display device | |
| CN207217521U (en) | A kind of flexible substrate of two-sided " I " type composite construction | |
| CN107068648A (en) | A kind of flexible substrate of two-sided " I " type composite construction | |
| CN107195716A (en) | A kind of space thin-film solar cells device based on flexible substrate Structured Design | |
| TWI354955B (en) | A flexible display and a method of producing a fle | |
| TW200700860A (en) | Liquid crystal display device | |
| CN113563823A (en) | 3D protective film attached to curved screen and preparation method thereof | |
| CN205241594U (en) | Antibiotic antistatic complex film | |
| CN206179865U (en) | Flexible substrate, Flexible display base plate, display device | |
| CN205827027U (en) | A kind of flexible electronic paper display device | |
| CN202221768U (en) | Insulation backplane used in solar photovoltaic cell | |
| CN206076218U (en) | A kind of double-faced flexible structural substrate towards extending electronics | |
| CN114120839A (en) | Display module and display device | |
| CN212654028U (en) | Solar low-water-permeability backboard | |
| CN109166888A (en) | A kind of composite construction flexible substrate for flexible extending electronic device | |
| Li et al. | Foldable solar cells: Structure design and flexible materials | |
| US20210135145A1 (en) | Cover window structure and oled display device | |
| JP5257927B2 (en) | Solar panel | |
| CN211591645U (en) | Composite film for alcohol-based nano silver wire ink coating and nano silver wire conductive film | |
| CN207403314U (en) | A kind of high dielectric property Nomex honeycomb cores | |
| CN202809394U (en) | Antistatic release paper |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170818 |
|
| WD01 | Invention patent application deemed withdrawn after publication |