CN106206462A - A kind of double-faced flexible structural substrate towards extending electronics - Google Patents
A kind of double-faced flexible structural substrate towards extending electronics Download PDFInfo
- Publication number
- CN106206462A CN106206462A CN201610818369.2A CN201610818369A CN106206462A CN 106206462 A CN106206462 A CN 106206462A CN 201610818369 A CN201610818369 A CN 201610818369A CN 106206462 A CN106206462 A CN 106206462A
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- China
- Prior art keywords
- island
- film substrate
- double
- substrate
- functional device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4905—Shape
Abstract
The present invention discloses a kind of double-faced flexible structural substrate towards extending electronics, including film substrate, island and groove；Each island are column；All island regular array is in the upper and lower surface of film substrate；The island being positioned at film substrate upper surface and the island being positioned at film substrate upper surface are specular about film substrate；Opened by trench separation between island and island；Functional device sticks to the end face on island, connects wire and is hidden in the groove between island, connects wire and is electrically connected with functional device.The present invention can simultaneously adhesive function device on island and island, lower section above substrate, to realize high substrate surface occupation rate, thus greatly enhance the space availability ratio of extending flexible electronic device, meet modern electronic product to miniaturized components, the requirement of densification.Present invention can apply to realize substrate two-sided adhesion functional device, need in the product of high functional device active surface occupation rate.
Description
Technical field
The present invention relates to extending electronic technology field, be specifically related to a kind of double-faced flexible structure towards extending electronics
Property substrate.
Background technology
Extending electronics is a kind of Novel electronic product, which overcomes the rigidity of traditional silica-based electronic product, fragility, easily
Broken, do not adapt to the application of relatively complex work plane, be the mainstream product of Electronic Manufacturing.Additionally, extending electronics skill
Art attracts wide attention in recent years because of portability and the applicability advantage of its uniqueness.But, current extending electronic structure
Mostly be single-sided structure, i.e. substrate only one side is used for placing functional device and interconnecting lead, which greatly limits underlying structure surface
Occupation rate, does not meets modern electronic product to miniaturized components, the requirement of densification.
Summary of the invention
The technical problem to be solved is that existing extending electronics exists surface and the low problem of space occupancy,
A kind of double-faced flexible structural substrate towards extending electronics is provided.
For solving the problems referred to above, the present invention is achieved by the following technical solutions:
A kind of double-faced flexible structural substrate towards extending electronics, including film substrate, island and groove；Each island
Small island is column；All island regular array is in the upper and lower surface of film substrate；It is positioned at the island of film substrate upper surface
Small island and the island being positioned at film substrate upper surface are specular about film substrate；By trench separation between island and island
Open；Functional device sticks to the end face on island, connects wire and is hidden in the groove between island, connects wire and functional device electricity
Connect.
In such scheme, each island are square shaped prism shape, all island on the surface of film substrate in matrix
Arrangement；Or each island are hexagonal prism shape, all island on the surface of film substrate in cellular arrangement.
In such scheme, island are integrated with film substrate.
In such scheme, island and film substrate are by hyperelastic flexible polymer.
In such scheme, the height on island is 0.75～2 with the ratio of the thickness of film substrate.
In such scheme, the degree of depth of groove is 1.5～5 with the ratio of width.
In such scheme, between functional device and island, it is provided with adhesion layer.
In such scheme, the junction connecting wire and functional device is positioned at edge or the lower section of functional device.
Compared with prior art, the present invention can simultaneously adhesive function device on island and island, lower section above substrate,
To realize high substrate surface occupation rate, thus greatly enhance the space availability ratio of extending flexible electronic device,
Meet modern electronic product to miniaturized components, the requirement of densification.Present invention can apply to realize the two-sided adhesion function of substrate
Property device, need in the product of high functional device active surface occupation rate.
Accompanying drawing explanation
Fig. 1 is the perspective view of a kind of double-faced flexible structural substrate towards extending electronics.
Fig. 2 is the perspective view of the another kind of double-faced flexible structural substrate towards extending electronics.
Label in figure: 1, film substrate；2, island；3, groove.
Detailed description of the invention
A kind of double-faced flexible structural substrate towards extending electronics, as illustrated in fig. 1 and 2, by film substrate 1, island 2
Form with groove 3.Film substrate 1, island 2 and groove 3 are the electrical functions bases realizing extending flexible electronic device.Thin film
Whole device architecture is realized supporting by substrate 1.Island 2 realize the support to function electronic devices and components, and can be stretched
Journey realizes stress isolation thus function electronic devices and components are realized protection.Groove 3 that is non-island 2 part, is to realize high prolonging
The basis of malleability, when stretching, bend and/or reverse, the change in size in island 2 own is the least, relies primarily on the substrate between groove 3
High scalability realize flexibility and the ductility of total.
The main improvement of the present invention is, all island 2 are divided into two parts, and difference regular array is in film substrate
The upper and lower surface of 1, is wherein positioned at the island 2 of film substrate 1 upper surface and is positioned at the island 2 of film substrate 1 upper surface
About film substrate 1 in specular.Owing to all arranging multiple island 2 structure in the two sides of film substrate 1, and film substrate 1
All can be with adhesive function device on island 2 below the island 2 of top and film substrate 1, therefore, it is possible to realize high substrate table
Face occupation rate, and it is greatly improved stretchable electronic space availability ratio.Each island 2 are column, as can be cylindrical
And/or polygon-prism shape.In the present invention, each island 2 are square shaped prism shape, and the most all island 2 are at thin film base
The upper and lower surface at the end 1 all arranges (seeing Fig. 1) in matrix；Or each island 2 are hexagonal prism shape, the most all island
2 in the upper and lower surface of film substrate 1 all in cellular arrangement (seeing Fig. 2).By crisscross ditch between island 2 and island 2
Groove 3 separates.
Island 2 are integrated with film substrate 1, and are made up of identical material.This material is elastomeric flexibility
Polymer, such as elastic materials such as PDMS or TPU, is total ductility, the key of high surface coverage, is again real
Now stretch, reverse, the basis of the extending mechanical behavior such as bending.The height on island 2 is 0.75 with the ratio of the thickness of film substrate 1
～2, to realize preferably the protective effect of functional device above island 2.In the present invention, the very thin thickness of film substrate 1, no
1 centimetre of foot.2, island groove 3 part is used for placing connection wire, and therefore groove 3 width can not be too small, needs under normal circumstances
More than 100 microns.The degree of depth of groove 3 is 1.5～5 with the ratio of width.Realizing stretching, bending and in the action process such as torsion,
Owing to groove 3 has high depth-to-width ratio so that there is at island 2 good stress isolation effect, functional device is answered masterpiece
With the least, it is possible to prevent coming off and realizing the isolation protection of its stress of functional device, thus realizing ductility, high surface
While coverage rate, it is achieved high reliability.
In order to form extending flexible electronic device, in order to form extending flexible electronic device, in addition it is also necessary to
Connecting line and functional device are set on the basis of above-mentioned flexible substrates.Additionally, in order to extending electronic device entirety is carried out
Protection, optionally can add encapsulated layer as required above whole extending electronic device.Connecting line and effector
Part is for realizing the electrical functions of extending flexible electronic device.Functional device is the functional realiey part of whole equipment, and it can
Select with the needs according to different application occasion.Connecting line is the part realizing being electrically connected.
Functional device sticks to the top on island 2, for realizing higher work efficiency in limited area.Additionally,
It is provided with adhesion layer between functional device and island 2, thus assurance function device can realize preferably being connected with the top on island 2, and
And play certain stress buffer effect.
Connecting wire and be arranged on the lower section of each functional device, the groove 3 between each island 2 is internal, and it had both saved sky
Between, provide again big ductility, can be protected by top electronic device and structural substrate simultaneously.Connect wire by copper or
The connection wire that silver is made, has high conductivity.It is electrically connected traverse design for the snakelike interconnection such as the shape of a hoof, U-shaped can be used
Structure, such wire can preferably mate this bilateral structure substrate.Connect wire to be electrically connected with functional device.Connect wire with
The junction of functional device is positioned at edge or the lower section of functional device.
Claims (8)
1. the double-faced flexible structural substrate towards extending electronics, it is characterised in that: include film substrate (1), island
And groove (3) (2)；Each island (2) are column；All island (2) regular array film substrate (1) upper surface and under
Surface；The island (2) being positioned at film substrate (1) upper surface and the island (2) being positioned at film substrate (1) upper surface are about thin film base
(1) is in specular at the end；Separated by groove (3) between island (2) and island (2)；Functional device sticks to the top of island (2)
Face, connects wire and is hidden in the groove (3) between island (2) Nei, connects wire and is electrically connected with functional device.
A kind of double-faced flexible structural substrate towards extending electronics the most according to claim 1, it is characterised in that: every
Individual island (2) are square shaped prism shape, and all island (2) arrange in matrix on the surface of film substrate (1)；Or it is each
Island (2) are hexagonal prism shape, all island (2) on the surface of film substrate (1) in cellular arrangement.
A kind of double-faced flexible structural substrate towards extending electronics the most according to claim 1, it is characterised in that: island
Small island (2) is integrated with film substrate (1).
4., according to a kind of double-faced flexible structural substrate towards extending electronics described in claim 1 or 3, its feature exists
In: island (2) and film substrate (1) are by flexible polymer.
A kind of double-faced flexible structural substrate towards extending electronics the most according to claim 1, it is characterised in that: island
The height of small island (2) is 0.75～2 with the ratio of the thickness of film substrate (1).
A kind of double-faced flexible structural substrate towards extending electronics the most according to claim 1, it is characterised in that: ditch
The degree of depth of groove (3) is 1.5～5 with the ratio of width.
A kind of double-faced flexible structural substrate towards extending electronics the most according to claim 1, it is characterised in that: merit
Adhesion layer can be provided with between device and island (2).
A kind of double-faced flexible structural substrate towards extending electronics the most according to claim 1, it is characterised in that: even
The junction connecing wire and functional device is positioned at edge or the lower section of functional device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610818369.2A CN106206462A (en) | 2016-09-12 | 2016-09-12 | A kind of double-faced flexible structural substrate towards extending electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610818369.2A CN106206462A (en) | 2016-09-12 | 2016-09-12 | A kind of double-faced flexible structural substrate towards extending electronics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106206462A true CN106206462A (en) | 2016-12-07 |
Family
ID=58067762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610818369.2A Pending CN106206462A (en) | 2016-09-12 | 2016-09-12 | A kind of double-faced flexible structural substrate towards extending electronics |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068648A (en) * | 2017-06-06 | 2017-08-18 | 西南交通大学 | A kind of flexible substrate of two-sided " I " type composite construction |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040065976A1 (en) * | 2002-10-04 | 2004-04-08 | Sreenivasan Sidlgata V. | Method and a mold to arrange features on a substrate to replicate features having minimal dimensional variability |
| CN102541368A (en) * | 2011-03-14 | 2012-07-04 | 烟台正海电子网板股份有限公司 | Capacitive touch panel and manufacturing method thereof |
| US20140144480A1 (en) * | 2012-11-29 | 2014-05-29 | Gwangju Institute Of Science And Technology | Stretchable substrate, stretchable photovoltaic apparatus, and stretchable device |
| CN104317161A (en) * | 2005-12-08 | 2015-01-28 | 分子制模股份有限公司 | Method and system for double-sided patterning of substrates |
| CN206076218U (en) * | 2016-09-12 | 2017-04-05 | 桂林电子科技大学 | A kind of double-faced flexible structural substrate towards extending electronics |
-
2016
- 2016-09-12 CN CN201610818369.2A patent/CN106206462A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040065976A1 (en) * | 2002-10-04 | 2004-04-08 | Sreenivasan Sidlgata V. | Method and a mold to arrange features on a substrate to replicate features having minimal dimensional variability |
| CN104317161A (en) * | 2005-12-08 | 2015-01-28 | 分子制模股份有限公司 | Method and system for double-sided patterning of substrates |
| CN102541368A (en) * | 2011-03-14 | 2012-07-04 | 烟台正海电子网板股份有限公司 | Capacitive touch panel and manufacturing method thereof |
| US20140144480A1 (en) * | 2012-11-29 | 2014-05-29 | Gwangju Institute Of Science And Technology | Stretchable substrate, stretchable photovoltaic apparatus, and stretchable device |
| CN206076218U (en) * | 2016-09-12 | 2017-04-05 | 桂林电子科技大学 | A kind of double-faced flexible structural substrate towards extending electronics |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068648A (en) * | 2017-06-06 | 2017-08-18 | 西南交通大学 | A kind of flexible substrate of two-sided " I " type composite construction |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20161207 |