CN206076218U - A kind of double-faced flexible structural substrate towards extending electronics - Google Patents
A kind of double-faced flexible structural substrate towards extending electronics Download PDFInfo
- Publication number
- CN206076218U CN206076218U CN201621049848.4U CN201621049848U CN206076218U CN 206076218 U CN206076218 U CN 206076218U CN 201621049848 U CN201621049848 U CN 201621049848U CN 206076218 U CN206076218 U CN 206076218U
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- Prior art keywords
- island
- film substrate
- substrate
- double
- functional device
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Abstract
This utility model discloses a kind of double-faced flexible structural substrate towards extending electronics, including film substrate, island and groove；Each island is column；Upper and lower surface of all island regular arrays in film substrate；Positioned at the island of film substrate upper surface and positioned at the island of film substrate upper surface with regard to film substrate be in specular；Opened by trench separation between island and island；Functional device sticks to the top surface on island, and connecting wire is hidden in the groove between island, and connecting wire is electrically connected with functional device.This utility model can the simultaneously adhesive function device on island and lower section island above the substrate, to realize high substrate surface occupation rate, so as to greatly enhance the space availability ratio of extending flexible electronic device, meet modern electronic product to miniaturized components, the requirement of densification.During this utility model can be applicable to realize the two-sided adhesion functional device of substrate, the product of the high functional device active surface occupation rate of needs.
Description
Technical field
This utility model is related to extending electronic technology field, and in particular to a kind of double-faced flexible towards extending electronics
Structural substrate.
Background technology
Extending electronics is a kind of novel electronic product, which overcomes traditional the rigid of silicon substrate electronic product, fragility, easily
Application that is broken, not adapting to compared with complex work plane, is the mainstream product of Electronic Manufacturing.Additionally, extending electronics skill
Art is attracted wide attention in recent years because of its unique portability and applicability advantage.However, current extending electronic structure
Mostly single-sided structure, i.e. substrate only one side is used to place functional device and interconnecting lead, which greatly limits underlying structure surface
Occupation rate, does not meet modern electronic product to miniaturized components, the requirement of densification.
Utility model content
Technical problem to be solved in the utility model is that existing extending electronics has surface and space occupancy is low
A kind of problem, there is provided double-faced flexible structural substrate towards extending electronics.
To solve the above problems, this utility model is achieved through the following technical solutions：
A kind of double-faced flexible structural substrate towards extending electronics, including film substrate, island and groove；Each island
Small island is column；Upper and lower surface of all island regular arrays in film substrate；Positioned at the island of film substrate upper surface
Small island and positioned at the island of film substrate upper surface with regard to film substrate be in specular；By trench separation between island and island
Open；Functional device sticks to the top surface on island, and connecting wire is hidden in the groove between island, connecting wire and functional device electricity
Connection.
In such scheme, each island is square shaped prism shape, and all island are in matrix on the surface of film substrate
Arrangement；Or each island is hexagonal prism shape, all island are in cellular arrangement on the surface of film substrate.
In such scheme, island are integrated with film substrate.
In such scheme, island and film substrate are by hyperelastic flexible polymer.
In such scheme, the height on island is 0.75～2 with the ratio of the thickness of film substrate.
In such scheme, the depth of groove is 1.5～5 with the ratio of width.
In such scheme, adhesion layer between functional device and island, is provided with.
In such scheme, the junction of connecting wire and functional device is located at the edge or lower section of functional device.
Compared with prior art, this utility model can the simultaneously adhesive function device on island and lower section island above the substrate
Part, to realize high substrate surface occupation rate, so as to greatly enhance the space utilization of extending flexible electronic device
Rate, meets modern electronic product to miniaturized components, the requirement of densification.This utility model can be applicable to realize substrate double-sided adhesive
In attached functional device, the product of the high functional device active surface occupation rate of needs.
Description of the drawings
Fig. 1 is a kind of dimensional structure diagram of the double-faced flexible structural substrate towards extending electronics.
Fig. 2 is the dimensional structure diagram of another kind of double-faced flexible structural substrate towards extending electronics.
Label in figure：1st, film substrate；2nd, island；3rd, groove.
Specific embodiment
A kind of double-faced flexible structural substrate towards extending electronics, as illustrated in fig. 1 and 2, by film substrate 1, island 2
Constitute with groove 3.Film substrate 1, island 2 and groove 3 are the electrical functions bases for realizing extending flexible electronic device.Thin film
The whole device architecture of substrate 1 pair is realized supporting.The support to function electronic devices and components is realized on island 2, and can be stretched
Stress isolation is realized in journey so as to realize protecting to function electronic devices and components.Groove 3 is 2 part of non-island, is to realize high prolonging
The basis of malleability, when stretching, bending and/or torsion, the change in size very little of island 2 itself relies primarily on the substrate between groove 3
High scalability realizing the flexible and ductility of total.
Main improvement of the present utility model is that all island 2 are divided into two parts, and difference regular array in thin film
The upper and lower surface of substrate 1, wherein positioned at the island 2 and the island positioned at 1 upper surface of film substrate of 1 upper surface of film substrate
Small island 2 is in specular with regard to film substrate 1.As the two sides of film substrate 1 is arranged 2 structure of multiple island, and thin film base
Can be with adhesive function device, therefore, it is possible to realize high substrate on the island 2 below island 2 and film substrate 1 above bottom 1
Surface occupation rate, and greatly improve stretchable electronic space availability ratio.Each island 2 is column, can such as be in cylinder
Shape and/or polygon-prism shape.In this utility model, each island 2 is square shaped prism shape, and now all island 2 exist
The upper and lower surface of film substrate 1 is arranged (referring to Fig. 1) in matrix；Or each island 2 is hexagonal prism shape, now institute
There are island 2 to be in cellular arrangement in the upper and lower surface of film substrate 1 (referring to Fig. 2).By handing in length and breadth between island 2 and island 2
Wrong groove 3 is separated.
Island 2 are integrated with film substrate 1, and are made up of identical material.The material is elastomeric flexibility
The elastic materials such as polymer, such as PDMS or TPU, are both total ductility, the key of high surface coverage, are real again
The basis of the extending mechanical behaviors such as now stretching, torsion, bending.The height on island 2 is 0.75 with the ratio of the thickness of film substrate 1
～2, to realize protective effect preferably to 2 top functional device of island.In this utility model, the thickness of film substrate 1 is very
It is thin, less than 1 centimetre.2, island, 3 part of groove is used to place connecting wire, therefore 3 width of groove can not be too small, normal conditions
Under need more than 100 microns.The depth of groove 3 is 1.5～5 with the ratio of width.Realizing the behaviors such as stretching, bending and torsion
Cheng Zhong, as groove 3 has high depth-to-width ratio so that there is at island 2 good stress isolation effect, functional device is answered
Power effect is very little, is prevented from coming off and realizing to its stress isolation protection, so as to realize ductility, height for functional device
While surface coverage, high reliability is realized.
In order to form extending flexible electronic device, in order to form extending flexible electronic device, in addition it is also necessary to
Connecting line and functional device are set on the basis of above-mentioned flexible substrates.Additionally, in order to integrally carry out to extending electronic device
Protection, optionally can add encapsulated layer in the top of whole extending electronic device as needed.Connecting line and effector
Part is used for the electrical functions for realizing extending flexible electronic device.Functional device is the functional realiey part of whole equipment, and which can
To be selected according to the needs of different application occasion.Connecting line is the part for realizing being electrically connected.
Functional device sticks to the top on island 2, for realizing higher work efficiency in limited area.Additionally,
Adhesion layer is provided between functional device and island 2, so as to assurance function device can be realized preferably being connected with the top on island 2, and
And play certain stress buffer effect.
Connecting wire is arranged on the lower section of each functional device, and inside the groove 3 between each island 2, which had both saved sky
Between, big ductility is provided again, while can be protected by top electronic device and structural substrate.Connecting wire by copper or
Connecting wire made by silver, with high conductivity.Traverse design is electrically connected for the snakelike interconnection such as the shape of a hoof, U-shaped can be adopted
Structure, such wire can preferably match the bilateral structure substrate.Connecting wire is electrically connected with functional device.Connecting wire with
The junction of functional device is located at the edge or lower section of functional device.
Claims (8)
1. a kind of double-faced flexible structural substrate towards extending electronics, it is characterised in that：Including film substrate (1), island
And groove (3) (2)；Each island (2) are column；All island (2) regular arrays film substrate (1) upper surface and under
Surface；Positioned at the island (2) of film substrate (1) upper surface and the island (2) for being located at film substrate (1) upper surface with regard to thin film base
Bottom (1) is in specular；Separated by groove (3) between island (2) and island (2)；Functional device sticks to the top of island (2)
Face, connecting wire are hidden in the groove (3) between island (2) Nei, and connecting wire is electrically connected with functional device.
2. a kind of double-faced flexible structural substrate towards extending electronics according to claim 1, it is characterised in that：Often
Individual island (2) are square shaped prism shape, and all island (2) are arranged in matrix on the surface of film substrate (1)；Or each
Island (2) are hexagonal prism shape, and all island (2) are in cellular arrangement on the surface of film substrate (1).
3. a kind of double-faced flexible structural substrate towards extending electronics according to claim 1, it is characterised in that：Island
Small island (2) is integrated with film substrate (1).
4. a kind of double-faced flexible structural substrate towards extending electronics according to claim 1 or 3, its feature exist
In：Island (2) and film substrate (1) are by flexible polymer.
5. a kind of double-faced flexible structural substrate towards extending electronics according to claim 1, it is characterised in that：Island
The height of small island (2) is 0.75～2 with the ratio of the thickness of film substrate (1).
6. a kind of double-faced flexible structural substrate towards extending electronics according to claim 1, it is characterised in that：Ditch
The depth of groove (3) is 1.5～5 with the ratio of width.
7. a kind of double-faced flexible structural substrate towards extending electronics according to claim 1, it is characterised in that：Work(
Adhesion layer can be provided between device and island (2).
8. a kind of double-faced flexible structural substrate towards extending electronics according to claim 1, it is characterised in that：Even
The junction that wire is connect with functional device is positioned at the edge or lower section of functional device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621049848.4U CN206076218U (en) | 2016-09-12 | 2016-09-12 | A kind of double-faced flexible structural substrate towards extending electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621049848.4U CN206076218U (en) | 2016-09-12 | 2016-09-12 | A kind of double-faced flexible structural substrate towards extending electronics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206076218U true CN206076218U (en) | 2017-04-05 |
Family
ID=58437824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621049848.4U Expired - Fee Related CN206076218U (en) | 2016-09-12 | 2016-09-12 | A kind of double-faced flexible structural substrate towards extending electronics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206076218U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206462A (en) * | 2016-09-12 | 2016-12-07 | 桂林电子科技大学 | A kind of double-faced flexible structural substrate towards extending electronics |
| CN108847412A (en) * | 2018-06-01 | 2018-11-20 | 清华大学 | Flexible electronic device based on system in package |
-
2016
- 2016-09-12 CN CN201621049848.4U patent/CN206076218U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206462A (en) * | 2016-09-12 | 2016-12-07 | 桂林电子科技大学 | A kind of double-faced flexible structural substrate towards extending electronics |
| CN108847412A (en) * | 2018-06-01 | 2018-11-20 | 清华大学 | Flexible electronic device based on system in package |
| CN108847412B (en) * | 2018-06-01 | 2019-05-21 | 清华大学 | Flexible electronic device based on system in package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170405 Termination date: 20190912 |