CN109269667A - A kind of Novel IGBT device and preparation method thereof with real-time temperature test sytem - Google Patents
A kind of Novel IGBT device and preparation method thereof with real-time temperature test sytem Download PDFInfo
- Publication number
- CN109269667A CN109269667A CN201811077092.8A CN201811077092A CN109269667A CN 109269667 A CN109269667 A CN 109269667A CN 201811077092 A CN201811077092 A CN 201811077092A CN 109269667 A CN109269667 A CN 109269667A
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- igbt
- thermometric
- real
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention relates to a kind of Novel IGBT devices with real-time temperature test sytem, it is characterised in that: described device includes refrigeration system, linear optical fiber steel pipe, DBC liner plate, igbt chip, excusing from death wire bonding, copper sheet, thermometric substrate and optical fiber grating temperature-measuring sensor；The igbt chip setting forms circuit by strong close of excusing from death lead with copper sheet on DBC liner plate；The DBC liner plate fits in copper sheet bottom and is fixed on thermometric upper surface of base plate；The igbt chip is also connected with thermometric substrate；It is provided with linear grooves on the thermometric substrate, linear optical fiber steel pipe is provided in the linear grooves, is fixed with fiber-optic grating sensor in the linear optical fiber steel pipe；The refrigeration system setting and thermometric base plate bottom.The present invention is internally embedded optical fiber grating temperature-measuring sensor, can real-time monitoring IGBT temperature, the junction temperature deviation of the temperature surveyed and IGBT are small, high resolution.
Description
Technical field
The present invention relates to a kind of field of temperature measurement, and in particular to a kind of New IGBT with real-time temperature test sytem
The production method of device.
Background technique
IGBT is also known as insulated gate bipolar transistor, is made of bipolarity triode and insulating gate type field effect tube, IGBT
The advantages of having gathered both the above device, saturation pressure reduces, current carrying density is big, switching speed is fast etc., it is a kind of be applied to very much
The semiconductor high-power device in field is suitably applied the converter system that DC voltage is 600V or more, in alternating current generator, becomes
There are many applications in the fields such as frequency device, Switching Power Supply.With the rapid development of social technology, every field wants the stability of IGBT
Ask higher and higher, the service life and working condition for studying IGBT are just particularly important, and the main original for causing IGBT to fail
Puncture igbt chip because being that temperature is excessively high, and key components and parts are influenced by environment in the process of running, there are one
Fixed probability of malfunction is lacked on-line analysis means, can not be searched real failure cause due to shortage process temperature monitoring data,
Therefore just it is badly in need of the temperature change of real-time monitoring igbt chip and shell.
Now most of still to use thermocouple method, electrical parameter method and infrared thermal imaging probe method, traditional uses electricity
Method thermometric is easy to be influenced by ambient electromagnetic field, so that measurement result is generated deviation, and be difficult work steady in a long-term
Make.And the stability of light is good, fiber-optic grating sensor can work under the adverse circumstances such as high temperature and pressure, long service life, because
This can greatly improve this influence using fiber-optic grating sensor.This measuring system is equipped on IGBT thermometric substrate bottom to be held
The fiber grating temperature sensor for being cased with linear optical fiber steel pipe and optical fiber are embedded in linear groove by the linear groove of nano fiber
In, and linear optical fiber steel pipe is fixed in linear groove by heat conductive silica gel.It is connect by fiber-optic grating sensor, optical fiber, light
Head and upper computer detection, can be realized real-time multi-point measurement, monitor the temperature change of IGBT to realize warning function.
IGBT junction temperature is the important parameter that whole system works normally, the function which realizes
It is monitoring IGBT junction temperature, is more than threshold value alarm.The working condition of monitoring IGBT is usually using infrared thermal imaging probe method at present,
But this method is imaged by the temperature difference, if the object temperature difference to be measured is less big, the Comparative result degree of measurement will be made to reduce, that
Resolution capability is also deteriorated therewith.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of Novel IGBT device with real-time temperature test sytem and
Its production method, being capable of real-time monitoring IGBT junction temperature.
To achieve the above object, the present invention adopts the following technical scheme:
A kind of Novel IGBT device with real-time temperature test sytem, described device include linear optical fiber steel pipe, DBC liner plate,
Igbt chip, excusing from death wire bonding, copper sheet, thermometric substrate and optical fiber grating temperature-measuring sensor；The igbt chip setting and DBC
On liner plate, circuit is formed by strong close of excusing from death lead with copper sheet；The DBC liner plate fits in copper sheet bottom and is fixed on thermometric base
Plate upper surface；The igbt chip is also connected with thermometric substrate；Linear grooves are provided on the thermometric substrate, it is described linear recessed
It is provided with linear optical fiber steel pipe in slot, is fixed with fiber-optic grating sensor in the linear optical fiber steel pipe.
Further, the thermometric base plate bottom is provided with refrigeration system.
Further, 12 igbt chips are provided on the DBC liner plate.
Further, the refrigeration system includes cooling piece and recirculated water.
Further, the huyashi-chuuka (cold chinese-style noodles) of the cooling piece is tightly attached to heat conductive silica gel bottom, and hot face is contacted with refrigeration system, wherein making
2 two pins of cold extraction pin 1 and pin, pin 1 are connected with the single-chip microcontroller a port inside (FBG) demodulator, other end pin
2 ground connection.
Further, a kind of production method of the Novel IGBT device with real-time temperature test sytem, including following step
It is rapid:
Igbt chip: being attached on DBC liner plate by step S1 by glue, forms circuit, DBC by excusing from death wire bonding with copper sheet
Liner plate is attached to copper sheet bottom；
Step S2: igbt chip patch is linked with DBC liner plate and is partially sintered, solidified glue, temperature is arrived at 400 DEG C when sintering
Between 450 DEG C；
Step S3: cleaning is carried out to device, removes pollutant and oxide；
Step S4: it by full-automatic wedge bonding, realizes the routing link of excusing from death wire bonding, makes igbt chip and thermometric substrate phase
Even；
Step S5: scribing linear groove on thermometric substrate, the fiber-optic grating sensor for being used to measure temperature is fixed on linear
In optical fiber steel pipe, linear optical fiber steel pipe is placed on inside linear groove；
Step S6: heat conductive silica gel is filled between the linear optical fiber steel pipe and linear groove of thermometric substrate surface, and is packaged.
Compared with the prior art, the invention has the following beneficial effects:
It, being capable of real-time monitoring IGBT temperature, the temperature surveyed and IGBT 1. the present invention is internally embedded optical fiber grating temperature-measuring sensor
Junction temperature deviation it is small, high resolution.
2. apparatus of the present invention structure is relatively easy, and practical and convenient.
Detailed description of the invention
Fig. 1 is enclosed inside schematic diagram of the present invention；
Fig. 2 is one embodiment of the invention thermometric substrate top view；
Fig. 3 is one embodiment of the invention thermometric substrate cross-sectional view；
Fig. 4 is the structural block diagram of temperature real-time detecting system in one embodiment of the invention；
Fig. 5 is (FBG) demodulator schematic diagram in one embodiment of the invention；
Fig. 6 is upper computer software flow chart in one embodiment of the invention；
In figure: the linear optical fiber steel pipe of 1- refrigeration system, 2-, 3- fastening connection piece, 4-DBC liner plate, 5- epoxy resin, 6- busbar electricity
Pole, 7- layer, 8-IGBT chip, 9- excusing from death wire bonding, 10- copper sheet, 11- thermometric substrate, 12- heat conductive silica gel composition, 14- light
Fine grating temperature transducer, 15- optical fiber, 16- host computer connecting line, 17- (FBG) demodulator indicator light, 18- host computer, 19- (FBG) demodulator,
20- light connector, 21- Novel IGBT device, 22- coupler, 23- circulator, 24- light source, the preposition collimation lens of 25-, 26- diffraction
Grating, 27- postposition collimation lens, 28- linear probing photoelectric converter, 29- control circuit, 30- signal processor, 31- storage
Device, 32- fiber grating.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and embodiments.
Fig. 1 is please referred to, the present invention provides a kind of Novel IGBT device with real-time temperature test sytem, including refrigeration system
System 1, linear optical fiber steel pipe 2, fastening connection piece 3, DBC liner plate 4,5 epoxy resin 5,6 busbar electrodes 6, layer 7, igbt chip 8,
Have children outside the state plan wire bonding 9, copper sheet 10, thermometric substrate 11, heat conductive silica gel 12, optical fiber grating temperature-measuring sensor 14；
Igbt chip 8 is attached on DBC liner plate 4 by glue, circuit, DBC lining are formed by excusing from death wire bonding 9 with copper sheet 10
Plate is attached to 10 bottom of copper sheet.Then link part is sintered, it is therefore an objective to which solidified glue, temperature is at 400 DEG C to 450 DEG C when sintering
Between, and temperature is uniform.Cleaning is carried out, in next step to achieve the purpose that remove pollutant and oxide.Then using complete
Automatic wedge bonding realizes the routing link of excusing from death wire bonding 9, igbt chip 8 is made to be connected with thermometric substrate 11.Wherein, thermometric base
It is carved with linear groove on plate 11, the fiber-optic grating sensor for being used to measure temperature is fixed in linear optical fiber steel pipe 2, it will be linear
Optical fiber steel pipe 2 is placed on inside linear groove, and the effect of 2 linear optical fiber steel pipes is to be avoided that optical fiber doubling damage etc., is mentioned thus
The accuracy of high measurement and the service life of whole device.Finally 11 surface of thermometric substrate linear optical fiber steel pipe 2 with it is linear
Heat conductive silica gel 12 is filled between groove, and is packaged.The heat that igbt chip 8 generates mainly passes through DBC liner plate 4, thermometric base
Plate 11 arrives refrigeration system 1, and takes away eventually by the recirculated water 13 in refrigeration system.
In an embodiment of the present invention, 12 igbt chips 8 are located on DBC liner plate 4, pass through excusing from death lead with copperplate 10
9 form circuit, and DBC liner plate 4 is then fixed on thermometric substrate 11.8 surface of igbt chip then filling gel, and be packaged.IGBT
The heat of generation mainly passes through lower section DBC liner plate 4, and thermometric substrate 11 passes to refrigeration system 1, and eventually by refrigeration system 1
Recirculated water 13 take away.When carrying out the welding of thermometric substrate 11, needs to be embedded in optical fiber 15 with high temperature gummed tape and fix, optical fiber 15 turns
Crook should be ensured that certain radian, and angle is 120 ° ~ 180 °, be rolled over to prevent optical fiber 15 bad；At the thermometric position of optical fiber 15
Point epoxy glue i.e. at fiber grating temperature sensor 14, so that note is wrapped up in optical fiber temperature-measurement part by epoxy glue entirely, then the device
Baking oven is put into be solidified.After epoxy adhesive curing, side frame is installed and Guan Gai, optical fiber are passed through from pipe lid hole for injecting glue, is introduced into pipe
Outside shell.The high temperature gummed tape of fixed optical fiber is removed simultaneously, and pipe cover-use screw is fixed, by the way of manual injecting glue,
Insulating cement is perfused to the device, and carries out insulating cement solidification.
In refrigeration system 1, the huyashi-chuuka (cold chinese-style noodles) of cooling piece is tightly attached to heat conductive silica gel bottom, and hot face is contacted with refrigeration system, wherein making
2 two pins of cold extraction pin 1 and pin, pin 1 are connected with the single-chip microcontroller a port inside (FBG) demodulator, other end pin
2 ground connection；So the working condition of the cooling piece can be controlled by single-chip microcontroller, when the pin 1 of the single-chip microcontroller of control cooling piece is high electricity
Usually, cooling piece works, and when pin 1 is low level, cooling piece does not work.Host computer 18 passes through inside serial ports and (FBG) demodulator
Single-chip microcontroller is connected, and host computer 18 sends instruction control single chip computer by serial ports.
Data are handled through host computer 18 and obtain temperature information, and when temperature is more than early warning value, indicator light 17 reddens, and opens simultaneously
Refrigeration system 1 is opened, host computer 18 is sent to the signal control portion (i.e. single-chip microcontroller) of (FBG) demodulator 19 by serial ports and instructed, makes to control
The pin 1 of cooling piece is high level, to make the operating temperature of cooling piece work reduction IGBT.
When temperature monitoring, optical fiber is connected after light connector with (FBG) demodulator, and Fig. 5 is (FBG) demodulator schematic diagram, (FBG) demodulator by
Light source 24, circulator 23, coupler 22, preposition collimation lens 25, diffraction grating 26, postposition collimation lens 27, linear probing light
Electric transducer 28, control circuit 29, signal processor 30 and memory 31 form, which is monochromatic sweep light, wave-length coverage
For 1525nm ~ 1565nm, the monochromatic sweep light that light source issues enters coupler 22 after circulator, enters back into optical fiber grating sensing
Device 14, optical fiber grating temperature-measuring sensor 14 reflects the light for meeting optical grating reflection condition, when ambient temperature changes,
The grating effective refractive index or screen periods in optical fiber grating temperature-measuring sensor 14 are influenced, so that making the wavelength of reflection can also occur
Variation.Reflected light enters coupler 22, then becomes directional light after entering preposition collimation lens 25 by circulator 23, the directional light
It is radiated on diffraction grating 26, since light of the diffraction grating 26 to different wave length has different light splitting abilities, different wave length
Light will form different diffraction zones, by 27 post-concentration collection of postposition collimation lens linear probing photoelectric converter 28 difference
It is imaged on position, therefore linear probing photoelectric converter 28 can get the two dimensional image of this light beam, and carry out photoelectric conversion, most
Specific voltage or electric current are exported eventually passes through voltage value or the size energy of current value through control circuit 29 and signal processor 30
It derives the wavelength of this light beam, and memory 31 is written into wavelength information, complete demodulation.Subsequent (FBG) demodulator reaches wavelength data
Host computer 18 carries out temperature real-time monitoring to IGBT by 18 software of host computer.
Fig. 6 is the upper computer software flow chart of IGBT temperature real-time monitoring, host computer design module by parameter setting module,
Temperature display module, spectrum module, historical data are looked back four parts of module and are formed.The function of the software mainly passes through net
Mouth receives data, and then handle data transitions are temperature display in interface, while automatically saving data in text file, also
It can be shown in enquiry of historical data in X-Y figure to observe；The software adds some functions, can observe the light in each channel
Spectrogram.
1. parameter setting module
IGBT real time temperature monitoring is the linear relationship using grating wavelength and temperature, so first will need before starting test
The parameter setting of each grating is correct, deposits in parameter in text file with time point save button, and the module has memory
Function once is not required to re-enter every time as long as parameter correctly need to be only arranged.
2. temperature display module
Temperature display module mainly has temperature alarming and real time temperature in host computer, and the main working process of the module is first
Testing button is clicked, host computer can be sent by network interface and be instructed, and subsequent host computer receives the number that test equipment returns by network interface
According to processing data obtain wavelength as needed, then are shown by the form that parameter calculates temperature thermometer, with an item
Part structure completes the bright function of (FBG) demodulator indicator light when temperature is more than a certain range to realize warning function；Waveform is used simultaneously
Chart shows real time temperature.
3. spectrum module
The module can test the spectrogram in each channel, the central wavelength of selection TCH test channel be observed from figure, due to light
Modal data is not obtained with wavelength data in the same instruction, it is therefore desirable to click the start button in spectrogram, selection will be seen
The port number examined enables host computer to retransmit instruction, receives spectroscopic data and is shown with X-Y figure.
4. historical data looks back module
When the temperature data that check past certain time period, need to select the temperature for checking preservation literary at historical data interface
Part, click check button, will in X-Y figure displays temperature data and corresponding time.
The foregoing is merely presently preferred embodiments of the present invention, all equivalent changes done according to scope of the present invention patent with
Modification, is all covered by the present invention.
Claims (6)
1. a kind of Novel IGBT device with real-time temperature test sytem, it is characterised in that: described device includes linear optical fiber
Steel pipe, DBC liner plate, igbt chip, excusing from death wire bonding, copper sheet, thermometric substrate and optical fiber grating temperature-measuring sensor；The IGBT
Chip setting forms circuit by strong close of excusing from death lead with copper sheet on DBC liner plate；The DBC liner plate fits in copper sheet bottom
And it is fixed on thermometric upper surface of base plate；The igbt chip is also connected with thermometric substrate；It is arranged on the thermometric substrate linear
Groove is provided with linear optical fiber steel pipe in the linear grooves, is fixed with fiber-optic grating sensor in the linear optical fiber steel pipe.
2. a kind of Novel IGBT device with real-time temperature test sytem according to claim 1, it is characterised in that: institute
It states thermometric base plate bottom and is provided with refrigeration system.
3. a kind of Novel IGBT device with real-time temperature test sytem according to claim 1, it is characterised in that: institute
It states and is provided with 12 igbt chips on DBC liner plate.
4. a kind of Novel IGBT device with real-time temperature test sytem according to claim 2, it is characterised in that: institute
Stating refrigeration system includes cooling piece and recirculated water.
5. a kind of Novel IGBT device with real-time temperature test sytem according to claim 4, it is characterised in that institute
The huyashi-chuuka (cold chinese-style noodles) for stating cooling piece is tightly attached to heat conductive silica gel bottom, and hot face is contacted with refrigeration system, and wherein cooling piece draws pin 1 and pin
2 two pins, pin 1 are connected with the single-chip microcontroller a port inside (FBG) demodulator, and other end pin 2 is grounded.
6. a kind of production method of the Novel IGBT device with real-time temperature test sytem described in -5 according to claim 1,
It is characterized by comprising following steps:
Igbt chip: being attached on DBC liner plate by step S1 by glue, forms circuit, DBC by excusing from death wire bonding with copper sheet
Liner plate is attached to copper sheet bottom；
Step S2: igbt chip patch is linked with DBC liner plate and is partially sintered, solidified glue, temperature is arrived at 400 DEG C when sintering
Between 450 DEG C；
Step S3: cleaning is carried out to device, removes pollutant and oxide；
Step S4: it by full-automatic wedge bonding, realizes the routing link of excusing from death wire bonding, makes igbt chip and thermometric substrate phase
Even；
Step S5: scribing linear groove on thermometric substrate, the fiber-optic grating sensor for being used to measure temperature is fixed on linear
In optical fiber steel pipe, linear optical fiber steel pipe is placed on inside linear groove；
Step S6: heat conductive silica gel is filled between the linear optical fiber steel pipe and linear groove of thermometric substrate surface, and is packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811077092.8A CN109269667A (en) | 2018-09-15 | 2018-09-15 | A kind of Novel IGBT device and preparation method thereof with real-time temperature test sytem |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811077092.8A CN109269667A (en) | 2018-09-15 | 2018-09-15 | A kind of Novel IGBT device and preparation method thereof with real-time temperature test sytem |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109269667A true CN109269667A (en) | 2019-01-25 |
Family
ID=65188419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811077092.8A Pending CN109269667A (en) | 2018-09-15 | 2018-09-15 | A kind of Novel IGBT device and preparation method thereof with real-time temperature test sytem |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109269667A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786272A (en) * | 2019-01-29 | 2019-05-21 | 河南大学 | New IGBT encapsulating structure and packaging method with internal temp sensing function |
| CN109855752A (en) * | 2019-03-22 | 2019-06-07 | 华北电力大学 | A kind of contact temperature-measuring system of crimp type semiconductor device inside Temperature Distribution |
| CN110707062A (en) * | 2019-11-01 | 2020-01-17 | 富士电机（中国）有限公司 | IGBT module packaging structure and temperature detection method of IGBT chip |
| CN112731095A (en) * | 2020-12-18 | 2021-04-30 | 重庆大学 | IGBT junction temperature monitoring system based on fiber grating sensor |
| CN113372864A (en) * | 2021-07-09 | 2021-09-10 | 西安交通大学 | Intelligent epoxy packaging material with temperature real-time early warning function and preparation method and application thereof |
| CN113670469A (en) * | 2021-07-21 | 2021-11-19 | 广州大学 | IGBT power device based on distributed temperature measurement optical fiber and temperature monitoring method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101197334A (en) * | 2007-09-27 | 2008-06-11 | 厦门宏发电声有限公司 | Power semiconductor module and production method thereof |
| CN101963653A (en) * | 2010-09-17 | 2011-02-02 | 重庆大学 | Method and device for detecting spare capacity of lead-acid accumulator by optical fiber ATR sensor |
| CN202101789U (en) * | 2011-01-20 | 2012-01-04 | 中国电力科学研究院 | System for measuring real-time temperature in thyristor case |
| CN202586720U (en) * | 2012-03-20 | 2012-12-05 | 山东泰开电力电子有限公司 | Novel IGBT module |
| CN102947678A (en) * | 2010-04-30 | 2013-02-27 | 维斯塔斯风力系统集团公司 | Optical sensor system and detecting method for enclosed semiconductor device module |
| CN103413797A (en) * | 2013-07-29 | 2013-11-27 | 中国科学院电工研究所 | Power semiconductor module assembled through three-dimensional structural units |
| CN104167437A (en) * | 2013-05-17 | 2014-11-26 | 国家电网公司 | Improved high-power thyristor |
| CN104218031A (en) * | 2013-05-31 | 2014-12-17 | 湖北台基半导体股份有限公司 | Busbar connection type high-performance IGBT (insulated gate bipolar transistor) module and manufacturing method thereof |
| CN105115436A (en) * | 2015-08-04 | 2015-12-02 | 苏州光环科技有限公司 | sensing device and method for monitoring stress and temperature |
| CN105784154A (en) * | 2014-09-22 | 2016-07-20 | 现代自动车株式会社 | Temperature sensing system for switching device |
| CN107219016A (en) * | 2017-05-24 | 2017-09-29 | 湖南大学 | Calculate the method and system of IGBT module transient state junction temperature |
| CN108204866A (en) * | 2018-01-04 | 2018-06-26 | 长飞光纤光缆股份有限公司 | A kind of non-calibrating tandem type fiber-optical grating temperature sensor preparation method and product |
-
2018
- 2018-09-15 CN CN201811077092.8A patent/CN109269667A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101197334A (en) * | 2007-09-27 | 2008-06-11 | 厦门宏发电声有限公司 | Power semiconductor module and production method thereof |
| CN102947678A (en) * | 2010-04-30 | 2013-02-27 | 维斯塔斯风力系统集团公司 | Optical sensor system and detecting method for enclosed semiconductor device module |
| CN101963653A (en) * | 2010-09-17 | 2011-02-02 | 重庆大学 | Method and device for detecting spare capacity of lead-acid accumulator by optical fiber ATR sensor |
| CN202101789U (en) * | 2011-01-20 | 2012-01-04 | 中国电力科学研究院 | System for measuring real-time temperature in thyristor case |
| CN202586720U (en) * | 2012-03-20 | 2012-12-05 | 山东泰开电力电子有限公司 | Novel IGBT module |
| CN104167437A (en) * | 2013-05-17 | 2014-11-26 | 国家电网公司 | Improved high-power thyristor |
| CN104218031A (en) * | 2013-05-31 | 2014-12-17 | 湖北台基半导体股份有限公司 | Busbar connection type high-performance IGBT (insulated gate bipolar transistor) module and manufacturing method thereof |
| CN103413797A (en) * | 2013-07-29 | 2013-11-27 | 中国科学院电工研究所 | Power semiconductor module assembled through three-dimensional structural units |
| CN105784154A (en) * | 2014-09-22 | 2016-07-20 | 现代自动车株式会社 | Temperature sensing system for switching device |
| CN105115436A (en) * | 2015-08-04 | 2015-12-02 | 苏州光环科技有限公司 | sensing device and method for monitoring stress and temperature |
| CN107219016A (en) * | 2017-05-24 | 2017-09-29 | 湖南大学 | Calculate the method and system of IGBT module transient state junction temperature |
| CN108204866A (en) * | 2018-01-04 | 2018-06-26 | 长飞光纤光缆股份有限公司 | A kind of non-calibrating tandem type fiber-optical grating temperature sensor preparation method and product |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786272A (en) * | 2019-01-29 | 2019-05-21 | 河南大学 | New IGBT encapsulating structure and packaging method with internal temp sensing function |
| CN109855752A (en) * | 2019-03-22 | 2019-06-07 | 华北电力大学 | A kind of contact temperature-measuring system of crimp type semiconductor device inside Temperature Distribution |
| CN110707062A (en) * | 2019-11-01 | 2020-01-17 | 富士电机（中国）有限公司 | IGBT module packaging structure and temperature detection method of IGBT chip |
| CN112731095A (en) * | 2020-12-18 | 2021-04-30 | 重庆大学 | IGBT junction temperature monitoring system based on fiber grating sensor |
| CN112731095B (en) * | 2020-12-18 | 2023-03-10 | 重庆大学 | IGBT junction temperature monitoring system based on fiber grating sensor |
| CN113372864A (en) * | 2021-07-09 | 2021-09-10 | 西安交通大学 | Intelligent epoxy packaging material with temperature real-time early warning function and preparation method and application thereof |
| CN113670469A (en) * | 2021-07-21 | 2021-11-19 | 广州大学 | IGBT power device based on distributed temperature measurement optical fiber and temperature monitoring method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109269667A (en) | A kind of Novel IGBT device and preparation method thereof with real-time temperature test sytem | |
| CN110261799B (en) | High-temperature superconducting magnet quench detection system using distributed optical fiber sensing technology | |
| WO2014205996A1 (en) | Method for predicting the life of transformer based on fibre grating temperature measurement system | |
| CN102313852B (en) | Optical-fiber intelligent sensing power cable running state monitoring method and apparatus thereof | |
| CN104458799A (en) | Method and device for measuring transient thermal resistance of IGBT module | |
| CN108957379A (en) | A kind of field calibration method of GIS partial discharge superfrequency detection device | |
| CN103134833B (en) | A kind of material heat transfer analysis device based on fluorescence method | |
| CN206339317U (en) | A kind of Transformer Winding temperature on-line monitoring device | |
| CN103076108A (en) | Novel power cable conductor temperature measuring sensor based on FBG (fiber bragg grating) | |
| CN110057471A (en) | A kind of cable distribution optical fiber temperature measurement system calibration equipment and method | |
| CN201653844U (en) | Thermal barrier coating high-temperature oxidation resistant performance test device | |
| CN110186583B (en) | Method for measuring temperature of ceramic matrix composite high-temperature component based on electrical impedance imaging | |
| CN206114150U (en) | Measure thermocouple time constant's device | |
| CN103644973A (en) | Method, device and system for monitoring pavement temperature information of steel structure bridge | |
| CN206056817U (en) | A kind of connect-disconnect plug with temperature-monitoring function | |
| CN209764294U (en) | Long-distance cable continuous temperature monitoring system with automatic division of monitoring area | |
| CN104697665A (en) | Distributed optical fiber-based blast furnace hot blast stove temperature monitoring system and method | |
| CN106969857A (en) | A kind of device for measuring the hot thermocouple response time | |
| CN107271068B (en) | A kind of temperature-detecting device and detection method of intelligent electric energy meter connector | |
| CN103913253B (en) | Device for packaging optical fiber grating temperature sensing probe on electric energy meter connecting terminal and integration temperature calibration method thereof | |
| CN112649121A (en) | Working temperature detection method for 5G radio frequency equipment | |
| CN109063798A (en) | A kind of smart grid monitoring system | |
| CN109282911A (en) | High precision measuring temperature probe and high precision measuring temperature instrument | |
| CN110146550B (en) | Method for monitoring oxidation degree of composite material high-temperature part based on electrical impedance imaging | |
| CN110618332A (en) | Capacitor temperature rise measuring method and system based on heat flow measurement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190125 |
|
| RJ01 | Rejection of invention patent application after publication |