CN109267030A - Substrate loading clamp for magnetron sputtering and magnetron sputtering device - Google Patents
Substrate loading clamp for magnetron sputtering and magnetron sputtering device Download PDFInfo
- Publication number
- CN109267030A CN109267030A CN201811226663.XA CN201811226663A CN109267030A CN 109267030 A CN109267030 A CN 109267030A CN 201811226663 A CN201811226663 A CN 201811226663A CN 109267030 A CN109267030 A CN 109267030A
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- Prior art keywords
- boss
- pedestal
- groove
- magnetron sputtering
- substrate
- Prior art date
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Links
- 239000000758 substrate Substances 0.000 title claims abstract description 85
- 238000011068 loading method Methods 0.000 title claims abstract description 49
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 43
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 86
- 238000004544 sputter deposition Methods 0.000 claims description 15
- 238000001727 in vivo Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009411 base construction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001739 rebound effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a substrate loading clamp for magnetron sputtering and a magnetron sputtering device, and relates to the field of magnetron sputtering coating. The substrate loading clamp for magnetron sputtering comprises a base, an elastic piece and a bottom plate; the base comprises a base, a first boss and a second boss, the first boss is connected with one side of the base and forms a first groove with a panel of the base, and the second boss is connected with the other side of the base and forms a second groove with the panel of the base. The substrate loading clamp for magnetron sputtering and the magnetron sputtering device provided by the invention have the advantages of simple structure, easiness in processing and manufacturing and convenience in assembly; on one hand, the substrate can be clamped and loaded quickly by adopting an elastic clamping mode, so that the time for fixing the substrate is effectively saved, and the working efficiency is improved; on the other hand, the clamp can simultaneously clamp and load a plurality of substrates, so that the plurality of substrates can be simultaneously fixed, the substrates are not structurally damaged while being fixed, and the integrity of the substrates is ensured.
Description
Technical field
The present invention relates to magnetic control sputtering device field, in particular to a kind of magnetron sputtering substrate loading fixture and
Magnetic control sputtering device.
Background technique
Magnetron sputtering is the one kind " high-speed low temperature sputtering technology " developed rapidly the seventies.General sputtering method can quilt
It is used to prepare more materials such as metal, semiconductor, insulator, and has that equipment is simple, easily controllable, plated film area is big and adhesive force
The advantages that strong, and the magnetron sputtering method that 1970s grow up is even more to realize high speed, low temperature, low damage.Due to skill
The continuous renewal magnetron sputtering technique of art is widely used in high-temperature superconducting thin film, ferroelectric thin film, giant magnetoresistive thin film, film hair
The research aspect such as luminescent material, solar battery, memory alloy film, film patch resistance, and play an important role.
During magnetron sputtering, need for substrate to be sputtered to be fixed on the fixture for placing substrate, it then again will folder
Tool is placed in the equipment of magnetron sputtering, and there are many kinds of the fixtures for being mounted with substrate, and most commonly seen is rectangle and rectangular folder
Tool, but they the shortcomings that be that the piece number placed is few, and substrate is not allowed to be fixed easily, some fixtures even sacrifice can sputter face
The long-pending fixation to guarantee substrate.Therefore in order to preferably sputter to substrate, need to solve the fixation of substrate and asking for quantity
Topic, urgent need want a kind of device that can solve these problems.
Summary of the invention
Simple with structure the purpose of the present invention is to provide a kind of magnetron sputtering substrate loading fixture, clamping is steady
The characteristics of determining, more substrate can be clamped simultaneously.
Simple with structure another object of the present invention is to provide a kind of magnetic control sputtering device, clamping is stablized, can be same
When clamping more substrate the characteristics of.
The present invention provides a kind of technical solution:
A kind of magnetron sputtering substrate loading fixture is used for clamping substrate, including pedestal, elastic component and bottom plate；
The pedestal includes pedestal, first boss and second boss, and the first boss is connect with the side of the pedestal,
And form the first groove with the plate face of the pedestal, the second boss connect with the other side of the pedestal, and with the bottom
The plate face of seat forms the second groove, and one end of the elastic component is held in the bottom plate, and the other end is held in the pedestal, described
Bottom plate has the loading end for carrying the substrate, and the two sides of the bottom plate are correspondingly embedded in first groove and described second
The side of the substrate is fastened between the loading end and the first boss by groove, and by the another of the substrate
Side is fastened between the loading end and the second boss.
Further, in preferred embodiments of the present invention, the first boss includes that first boss ontology and first are convex
Platform outer, the first boss ontology are wholely set with the first boss outer, the first boss outer and the pedestal
Form the first groove.
Further, in preferred embodiments of the present invention, the second boss includes that second boss ontology and second are convex
Platform outer, the second boss ontology are wholely set with the second boss outer, the second boss outer and the pedestal
Form the second groove.
Further, in preferred embodiments of the present invention, the first boss is integral with the second boss
It is set to the pedestal two sides.
Further, in preferred embodiments of the present invention, the two sides of first groove and second groove are equal
With opening, the bottom plate is embedded in first groove and second groove by the opening.
Further, in preferred embodiments of the present invention, the pedestal further includes the first connector, and the one of the pedestal
Multiple first fixation holes are offered on side, and corresponding with multiple first fixation holes multiple are offered in the first boss
Two fixation holes, first connector is by first fixation hole and second fixation hole by the first boss and described
Pedestal is fixed.
Further, in preferred embodiments of the present invention, the pedestal further includes the second connector, and the one of the pedestal
Multiple third fixation holes are offered on side, and corresponding with multiple third fixation holes multiple are offered in the second boss
Four fixation holes, second connector is by the third fixation hole and the 4th fixation hole by the second boss and described
Pedestal is fixed.
Further, in preferred embodiments of the present invention, multiple grooves are offered on the pedestal, the groove is used for
Accommodate elastic component.
Further, in preferred embodiments of the present invention, the elastic component is spring, and one end of the spring is placed in
In the groove, the other end of the spring supports the lower surface of the bottom plate.
A kind of magnetic control sputtering device, including magnetron sputtering substrate loading fixture, magnetron sputtering substrate loading fixture packet
Include pedestal, elastic component and bottom plate；
The pedestal includes pedestal, first boss and second boss, and the first boss is connect with the side of the pedestal,
And form the first groove with the plate face of the pedestal, the second boss connect with the other side of the pedestal, and with the bottom
The plate face of seat forms the second groove, and one end of the elastic component is held in the bottom plate, and the other end is held in the pedestal, described
Bottom plate has the loading end for carrying the substrate, and the two sides of the bottom plate are correspondingly embedded in first groove and described second
The side of the substrate is fastened between the loading end and the first boss by groove, and by the another of the substrate
Side is fastened between the loading end and the second boss.The magnetron sputtering is located at the magnetic control with substrate loading fixture
In sputtering equipment.
Compared with prior art, a kind of magnetron sputtering substrate loading fixture and magnetic control sputtering device provided by the invention has
Beneficial effect is:
Magnetron sputtering proposed by the invention substrate loading fixture and magnetic control sputtering device, it is applied widely, from production
Technique itself, structure is simple, easy to manufacture, and easy to assembly；For its practical application, on the one hand, use bullet
Property clamping mode can be realized substrate and quickly clamp loadings, be effectively saved the time of fixed substrate, improve work and imitate
Rate；On the other hand, this fixture can clamp simultaneously loads multiple substrates, realizes multiple substrates while fixing, and fixed substrate
It does not cause the damage in structure to it simultaneously, ensure that the integrality of substrate.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described.It should be appreciated that the following drawings illustrates only certain embodiments of the present invention, therefore it is not construed as pair
The restriction of range.It for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram of magnetron sputtering substrate loading fixture provided by the invention；
Fig. 2 is the base construction schematic diagram of magnetron sputtering substrate loading fixture provided by the invention；
Fig. 3 is the schematic diagram of base structure of magnetron sputtering substrate loading fixture provided by the invention；
Fig. 4 is the schematic diagram of substrate structure of magnetron sputtering substrate loading fixture provided by the invention.
Icon: 10- magnetron sputtering substrate loading fixture；20- pedestal；201- pedestal；2010- groove；2011- first is solid
Determine hole；2012- third fixation hole；202- first boss；2021- first boss ontology；2022- first boss outer；2023-
Two fixation holes；203- second boss；2031- second boss ontology；2032- second boss outer；The 4th fixation hole of 2033-；30-
Bottom plate；40- substrate.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described.Obviously, described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Term " on ", "lower",
The orientation or positional relationship of the instructions such as "inner", "outside", "left", "right" be based on the orientation or positional relationship shown in the drawings, or
The invention product using when the orientation or positional relationship usually the put or orientation that usually understands of those skilled in the art
Or positional relationship, it is merely for convenience of description of the present invention and simplification of the description, rather than the equipment or element of indication or suggestion meaning
It must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.Term
" first ", " second " etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.Term " includes ", " packet
Containing " or any other variant thereof is intended to cover non-exclusive inclusion, so that including the process of a series of elements, side
Method, article or equipment not only include those elements, but also including other elements that are not explicitly listed, or further include
For elements inherent to such a process, method, article, or device.In the absence of more restrictions, by sentence " including one
It is a ... " limit element, it is not excluded that there is also in addition in the process, method, article or apparatus that includes the element
Identical element.
It should also be noted that, unless otherwise clearly defined and limited, the terms such as " setting ", " connection " should do broad sense reason
Solution, for example, " connection " may be fixed connection or may be dismantle connection, or integral connection；It can be mechanical connection,
It is also possible to be electrically connected；It can be and be directly connected to, can also be indirectly connected with by intermediary, be can be inside two elements
Connection.For the ordinary skill in the art, the tool of above-mentioned term in the present invention can be understood as the case may be
Body meaning.
With reference to the accompanying drawing, detailed description of the preferred embodiments.
Specific embodiment:
A kind of magnetron sputtering substrate loading fixture 10 is present embodiments provided, is applied to magnetic control sputtering device field, such as
Shown in Fig. 1, magnetron sputtering substrate loading fixture 10 includes pedestal 20, elastic component and bottom plate 30.
In conjunction with referring to Fig.2, pedestal 20 includes pedestal 201, first boss 202 and second boss 203, the first boss
202 connect with the side of the pedestal 201, and form the first groove (not shown) with the panel of the pedestal 201, described
Second boss 203 is connect with the other side of the pedestal 201, and forms the second groove (in figure not with the panel of the pedestal 201
Show), one end of the elastic component is held in the bottom plate 30, and the other end is held in the pedestal 201, and the bottom plate 30 has
For carrying the loading end of the substrate 40, the two sides of the bottom plate 30 are correspondingly embedded in first groove and described second recessed
The side of the substrate 40 is fastened between the loading end and the first boss 202 by slot, and by the substrate 40
The other side be fastened between the loading end and the second boss 203.
It should be noted that elastic component involved in the present embodiment can be spring and be also possible to bouncing ball etc., have
There is the material of rebound effect, so that bottom plate 30 is sprung back under elastic acting force, all structures for meeting this function or material are equal
For protection scope of the present invention.
First boss 202 includes first boss ontology 2021 and first boss outer 2022, the first boss outer
2022 are convexly equipped in the upper side of the first boss ontology 2021, the plane of first boss outer 2022 plane and pedestal 201
In parallel, first boss outer 2022 and the pedestal 201 form the first groove；The first boss ontology 2021 and described first
Boss outer 2022 is wholely set.Similarly, second boss 203 includes second boss ontology 2031 and second boss outer 2032,
The second boss outer 2032 is convexly equipped in described, the upper side of second boss ontology 2031, second boss outer
2032 is parallel with the plane of pedestal 201, and second boss outer 2032 and the pedestal 201 form the second groove, second boss sheet
Body 2031 is wholely set with the second boss outer 2032.
As shown in Figure 2.
It should be noted that first boss ontology 2021 and first boss outer 2022 involved in the present embodiment,
Its purpose is to form groove 2010 between pedestal 201, bottom plate 30 is fixed with this, therefore, it is all belong to can reach solid
2010 structure of groove for determining bottom plate 30 is protected object of the invention.
First boss 202 and the second boss 203 are one to be wholy set in 201 two sides of pedestal.
The two sides of first groove and second groove all have opening, and the bottom plate 30 is embedded in institute by the opening
It states in the first groove and second groove.
Pedestal 20 further includes the first connector, and multiple first fixation holes 2011 are offered in a side of the pedestal 201,
First fixation hole 2011 is uniformly distributed on 201 side of pedestal in "-" type, is offered in the first boss 202 and more
Corresponding multiple second fixation holes 2023 of a first fixation hole 2011, first connector pass through first fixation hole
2011 and second fixation hole 2023 first boss 202 and the pedestal 201 is fixed.
Pedestal 20 further includes the second connector, and multiple third fixation holes 2012 are offered in a side of the pedestal 201,
The third fixation hole 2012 is uniformly distributed on 201 side of pedestal in "-" type, is offered in the second boss 203 and more
Corresponding multiple 4th fixation holes 2033 of a third fixation hole 2012, second connector pass through the third fixation hole
2012 and the 4th fixation hole 2033 second boss 203 and the pedestal 201 is fixed.
It should be noted that the first connector and the second connector involved in the present embodiment is for fixing lug boss
With pedestal 201, in addition to this boss can also be with pedestal 201 and be connected by glue, can bear spring after connection
Brought tensile stress under elastic acting force；Boss and pedestal 201 can also be that integrated molding is set in addition to split-type design assembly
It sets.
Multiple grooves 2010 are offered on pedestal 201, the groove 2010 is the circular trough with certain depth, described recessed
Slot 2010 is for accommodating elastic component.Elastic component is spring, and one end of the spring is placed in the groove 2010, the spring
The other end support the lower surface of the bottom plate 30.
The embodiments of the present invention also provide a kind of magnetic control sputtering devices, are loaded and are pressed from both sides with substrate including above-mentioned magnetron sputtering
Tool 10.
As shown in Figure 1, two corresponding first boss 202 and second boss 203 are arranged on pedestal 201, first is convex
The first groove and the second groove are formed between platform 202 and second boss 203 and pedestal 201, being arranged on pedestal 201 can accommodate
Or the groove 2010 of fixed spring, as shown in figure 3, spring is placed in groove 2010 first, then by bottom plate 30 from first
The opening at groove and the second groove both ends is embedded in pedestal 20, and spring press is caused pedestal 201 and bottom plate 30 in telescopiny
Between, after bottom plate 30 is completely embedded into pedestal 20, spring one end supports pedestal 201, and the other end supports bottom plate 30, and bottom plate 30
Upper surface two sides are sticked in the first groove and the second groove, further, by making spring-compressed, bottom plate 30 by press 30
Gap is generated between the first groove and the second groove, further, substrate 40 is embedded in this gap, and decontroling bottom plate 30 makes bullet
Substrate 40 is fastened on pedestal 20 by spring in the presence of a tensile force, is stably fixed to substrate 40 on pedestal 20, at the same time,
Multiple substrates 40 can be embedded in pedestal 20 according to production needs, achieve the purpose that while fixing multiple substrates 40.
In summary:
Magnetron sputtering provided in an embodiment of the present invention substrate loading fixture 10, including pedestal 20, elastic component and bottom plate 30；
Pedestal 20 includes pedestal 201, first boss 202 and second boss 203, the side of the first boss 202 and the pedestal 201
Connection, and the first groove is formed with the panel of the pedestal 201, the second boss 203 and the other side of the pedestal 201 connect
It connects, and forms the second groove with the panel of the pedestal 201, one end of the elastic component is held in the bottom plate 30, the other end
It is held in the pedestal 201, the bottom plate 30 has the loading end for carrying the substrate 40, the two sides pair of the bottom plate 30
It should be embedded in first groove and second groove, the side of the substrate 40 is fastened in the loading end and described the
Between one boss 202, and the other side of the substrate 40 is fastened between the loading end and the second boss 203.
Magnetron sputtering proposed by the invention substrate loading fixture 10 and magnetic control sputtering device, it is applied widely, from manufacture craft sheet
Body, structure is simple, easy to manufacture, and easy to assembly；For its practical application, on the one hand, use resilient clamp
Mode can be realized substrate 40 quickly clamping load, be effectively saved the time of fixed substrate 40, improve work efficiency；
On the other hand, this fixture can clamp simultaneously loads multiple substrates 40, realizes multiple substrates 40 while fixing, and fixed substrate 40
While damage in structure is not caused to it, ensure that the integrality of substrate 40.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, in the absence of conflict, the feature in the above embodiments be can be combined with each other, and the present invention can also have respectively
Kind change and variation.All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should all wrap
Containing within protection scope of the present invention.Also, it should regard embodiment as exemplary, and be non-limiting, this hair
Bright range is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are included within the present invention.It should not treat any reference in the claims as involved by limitation
And claim.
Claims (10)
1. a kind of magnetron sputtering substrate loading fixture is used for clamping substrate, which is characterized in that including pedestal, elastic component and bottom
Plate；
The pedestal includes pedestal, first boss and second boss, and the first boss is connect with the side of the pedestal, and with
The plate face of the pedestal forms the first groove, and the second boss is connect with the other side of the pedestal, and with the pedestal
Plate face forms the second groove, and one end of the elastic component is held in the bottom plate, and the other end is held in the pedestal, the bottom plate
With the loading end for carrying the substrate, the two sides of the bottom plate are correspondingly embedded in first groove and described second recessed
The side of the substrate is fastened between the loading end and the first boss by slot, and by the another of the substrate
Side is fastened between the loading end and the second boss.
2. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that the first boss includes the
One boss ontology and first boss outer, the first boss ontology are wholely set with the first boss outer, and described first
Boss outer and the pedestal form the first groove.
3. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that the second boss includes the
Two boss ontologies and second boss outer, the second boss ontology are wholely set with the second boss outer, and described second
Boss outer and the pedestal form the second groove.
4. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that the first boss with it is described
Second boss is removably connected to the pedestal two sides respectively.
5. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that first groove with it is described
The two sides of second groove all have opening, and the bottom plate is embedded in first groove and second groove by the opening
In.
6. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that the pedestal further includes first
Connector offers multiple first fixation holes in a side of the pedestal, offers in the first boss and multiple first
Corresponding multiple second fixation holes of fixation hole, first connector pass through first fixation hole and second fixation hole
The first boss and the pedestal are fixed.
7. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that the pedestal further includes second
Connector offers multiple third fixation holes in a side of the pedestal, offers in the second boss and multiple thirds
Corresponding multiple 4th fixation holes of fixation hole, second connector pass through the third fixation hole and the 4th fixation hole
The second boss and the pedestal are fixed.
8. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that offered on the pedestal more
A groove, the groove is for accommodating elastic component.
9. magnetron sputtering according to claim 1 substrate loading fixture, which is characterized in that the elastic component is spring,
One end of the spring is placed in the groove, and the other end of the spring supports the lower surface of the bottom plate.
10. a kind of magnetic control sputtering device, it is characterised in that: the magnetic control sputtering device includes device noumenon and such as claim 1-
9 described in any item magnetron sputterings substrate loading fixtures, the magnetron sputtering are located at described device sheet with substrate loading fixture
In vivo.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811226663.XA CN109267030B (en) | 2018-10-22 | 2018-10-22 | Substrate loading clamp for magnetron sputtering and magnetron sputtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811226663.XA CN109267030B (en) | 2018-10-22 | 2018-10-22 | Substrate loading clamp for magnetron sputtering and magnetron sputtering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109267030A true CN109267030A (en) | 2019-01-25 |
| CN109267030B CN109267030B (en) | 2020-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811226663.XA Active CN109267030B (en) | 2018-10-22 | 2018-10-22 | Substrate loading clamp for magnetron sputtering and magnetron sputtering device |
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| JPH06188303A (en) * | 1992-12-17 | 1994-07-08 | Hitachi Ltd | Sputtering apparatus |
| US20010039151A1 (en) * | 1999-06-11 | 2001-11-08 | Yazaki Corporation | Electrical connector having terminal incomplete insertion recognizing structure |
| CN204825043U (en) * | 2015-08-06 | 2015-12-02 | 国营第二二八厂 | Vertical film fixture that plates of magnetron sputtering |
| CN206185536U (en) * | 2016-11-18 | 2017-05-24 | 一拖（洛阳）汇德工装有限公司 | Floating supporting and pressing device |
| CN106584099A (en) * | 2016-12-06 | 2017-04-26 | 苏州博众精工科技有限公司 | Floating carrier |
| CN206721358U (en) * | 2017-05-18 | 2017-12-08 | 江门市钧崴电子科技有限公司 | One kind stacks tool |
| CN206940979U (en) * | 2017-06-15 | 2018-01-30 | 南阳凯鑫光电股份有限公司 | Sputter coating machine clamp and film coating jig |
| CN107557748A (en) * | 2017-08-21 | 2018-01-09 | 丁芸娉 | A kind of sputtering jig |
| CN207834268U (en) * | 2018-01-12 | 2018-09-07 | 北京创昱科技有限公司 | A kind of substrate holding apparatus |
| CN207675079U (en) * | 2018-01-23 | 2018-07-31 | 国网安徽省电力有限公司检修分公司 | A kind of 35kV switch cabinet contacts silver coating thickness measure special fixture |
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