CN219737323U - Wafer inspection jig and wafer inspection equipment - Google Patents

Abstract

The utility model discloses a wafer inspection jig and wafer inspection equipment. The size of each bearing part is different, and the bearing parts are used for horizontally placing the to-be-detected article so as to enable the middle part of the to-be-detected article to be suspended; the picking and placing parts are arranged in one-to-one correspondence with the bearing parts. At least 4 bearing parts are arranged on the body, and the sizes of the bearing parts are different, so that the variety of the jig is reduced, and the compatibility of the jig is improved; the contact area of the wafer and the bearing part is reduced, the possibility that the wafer is scratched by the jig towards the surface of the body at the time of placement is reduced, and the risk of pollution of the wafer is reduced. In addition, the wafer of each specification is convenient to take, and the wafer breakage rate in the loading and taking process is reduced.

Description

Wafer inspection jig and wafer inspection equipment

Technical Field

The utility model relates to the technical field of wafer manufacturing, in particular to a wafer inspection jig and wafer inspection equipment.

Background

After the wafer fabrication process is completed, the wafer needs to be inspected to confirm whether the product is acceptable.

Generally, the upper wafer is placed on a jig, the jig is placed on a stage of a microscope, and then whether the front and the back of the wafer meet the requirements is observed through the microscope.

In the related art, a wafer of one specification corresponds to a jig, for example, a 3-inch wafer corresponds to a 3-inch jig, and an 8-inch wafer corresponds to an 8-inch jig. The arrangement leads to the specification diversity of the jig, and cannot be compatible with wafers of various specifications.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a wafer inspection jig, which reduces the variety of the jig and improves the compatibility of the jig.

The utility model further provides wafer inspection equipment.

According to an embodiment of the first aspect of the present utility model, a wafer inspection jig includes:

the body is provided with a picking and placing part and at least 4 bearing parts,

the size of each bearing part is different, and the bearing parts are used for horizontally placing the to-be-detected product so as to enable the middle part of the to-be-detected product to be suspended;

the picking and placing parts are arranged in one-to-one correspondence with the bearing parts.

According to the embodiment of the utility model, at least 4 bearing parts are arranged on the body, and the sizes of the bearing parts are different, so that the types of the jig are reduced, and the compatibility of the jig is improved; the contact area of the wafer and the bearing part is reduced, the possibility that the wafer is scratched by the jig towards the surface of the body at the time of placement is reduced, and the risk of pollution of the wafer is reduced. In addition, the wafer of each specification is convenient to take, and the wafer breakage rate in the loading and taking process is reduced.

According to some embodiments of the utility model, the bearing part comprises a supporting area, and the area of the supporting area accounts for a ratio of a to 20% to 30%.

According to some embodiments of the utility model, the support area surface is provided with a smooth layer.

According to some embodiments of the utility model, the lubricious layer is a teflon plating.

According to some embodiments of the utility model, the bearing is configured as a stepped slot.

According to some embodiments of the utility model, the step groove is in clamping fit with the article to be inspected.

According to some embodiments of the utility model, each of the carriers is coaxially arranged.

According to some embodiments of the utility model, the pick-and-place section is configured as a through hole.

According to some embodiments of the utility model, a plurality of the pick-and-place portions are provided, which are arranged in an annular array, and which communicate with the carrying portion.

A wafer inspection apparatus according to an embodiment of the second aspect of the present utility model includes the wafer inspection jig in the above embodiment.

According to the wafer inspection jig provided by the embodiment of the utility model, at least 4 bearing parts are arranged on the body, and the sizes of the bearing parts are different, so that the types of the jig are reduced, and the compatibility of the jig is improved; the contact area of the wafer and the bearing part is reduced, the possibility that the wafer is scratched by the jig towards the surface of the body at the time of placement is reduced, and the risk of pollution of the wafer is reduced. In addition, the wafer of each specification is convenient to take, and the wafer breakage rate in the loading and taking process is reduced.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a wafer inspection tool according to an embodiment of the present utility model;

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is an isometric view of FIG. 2;

reference numerals:

the bearing part 10, the first groove 11, the first supporting area 111, the first accommodating area 112, the second groove 12, the third groove 13, the fourth groove 14, the fourth supporting area 141, the fourth accommodating area 142, the fifth groove 15, the fifth supporting area 151, the fifth accommodating area 152

The pick-and-place part 20, the first through hole 21, the second through hole 22, the blind hole 23.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the applicability of other processes and/or the use of other materials.

A wafer inspection jig and a wafer inspection apparatus according to embodiments of the present utility model are described below with reference to the accompanying drawings.

As shown in fig. 1-3, the wafer inspection jig according to the first aspect of the present utility model includes a body, on which a pick-and-place portion 20 and at least 4 carrying portions 10 are disposed.

The size of each bearing part 10 is different, and the bearing parts 10 are used for horizontally placing the to-be-detected article so as to enable the middle part of the to-be-detected article to be suspended;

the picking and placing parts 20 are arranged in one-to-one correspondence with the bearing parts 10.

It should be noted that, 4 completely different carrying portions 10 may be disposed on the body, and each carrying portion 10 is used for accommodating one type of wafer, for example, 2 inch, 3 inch, 4 inch, 8 inch wafers may be accommodated on the body. Namely, the jig can accommodate 4 wafers, and one jig can accommodate wafers with various specifications, so that the types of the jig are reduced, and the compatibility of the jig is improved.

Of course, it will be appreciated that 5 completely different carriers 10 may be provided on the body; the body may be provided with 6 completely different carriers 10. The present embodiment is not limited to this, and a person skilled in the art may select a suitable number of the carrying parts 10 according to the actual situation.

The middle part of the sample to be detected is suspended, and the sample to be detected can be understood as a wafer. The wafer is arranged in the bearing part 10, and the middle part of the wafer is suspended. So set up, there is the clearance between the surface middle part of wafer orientation body and the carrier part 10, reduced the area that wafer and carrier part 10 contacted, reduced the moment of placing the wafer orientation with the body surface by the possibility of tool fish tail, reduced the risk that the wafer was polluted.

The wafer has a front side and a back side. In practical application, whether the front and back of the wafer meet the process requirements is detected by a microscope. After the front surface of the wafer is detected, the wafer is turned manually so as to observe the back surface of the wafer. The picking and placing parts 20 are arranged in one-to-one correspondence with the bearing parts 10, so that the wafers with each specification are convenient to pick, and the fragment rate of the wafers in the loading and picking and placing processes is reduced.

In summary, in the embodiment, at least 4 carrying parts 10 are arranged on the body, and the sizes of the carrying parts 10 are different, so that the variety of the jig is reduced, and the compatibility of the jig is improved; the contact area of the wafer and the bearing part 10 is reduced, the possibility that the wafer is scratched by the jig towards the surface of the body at the time of placement is reduced, and the risk of pollution of the wafer is reduced. In addition, the wafer of each specification is convenient to take, and the wafer breakage rate in the loading and taking process is reduced.

In some embodiments of the present utility model, the bearing portion 10 includes a supporting region having an area to bearing portion 10 area ratio of a,20% a 30%.

It should be noted that, in some embodiments, the ratio of the area of the orthographic projection of the supporting area on the carrying portion 10 to the area of the carrying portion 10 is a, a may be 20%, a may be 23%, a may be 24%, a may be 25%, and this embodiment is not limited to the illustration.

On the premise of ensuring the stability of the supporting wafer, the orthographic projection area of the supporting area on the bearing part 10 is reduced as much as possible, and the possibility that the wafer is scratched by the jig on the surface of the body during placement can be reduced to the greatest extent.

In some embodiments of the utility model, the support region surface is provided with a lubricious layer.

When the blade is not cut after the wafer is coated, redundant adhesive tapes can remain on the edge of the wafer, and after the back surface is inspected, the residual adhesive films can be adhered with the jig, so that the wafer is difficult to take out and the wafer is at risk of being crushed. Therefore, by arranging the smooth layer on the surface of the supporting area, the adhesive film and the jig can be prevented from being firmly adhered.

In one embodiment, the lubricious layer is a teflon plating.

It should be noted that the teflon plating layer has the following advantages: sliding characteristics, the coefficient of friction of which is very low; electrical characteristics having optimum different electrical characteristics in the resin, such as insulation, low dielectric loss, and arc resistance; the teflon is combined with the organic binder resin and the ceramic, so that the strength of a coating film can be enhanced; chemical resistance/corrosion resistance, hardly subject to attack by acids and bases; most solutions, besides repelling oil and water, are not wet, not easily soiled, and easy to clean.

Specifically, the thickness of the teflon plating layer can be 1mm, 1.5mm,2mm.

In some embodiments of the utility model, the carrier 10 is configured as a stepped groove.

In a specific embodiment, as shown in fig. 2 and 3, a first groove 11, a second groove 12, a third groove 13, a fourth groove 14 and a fifth groove 15 are provided on the body, where a dimension L1 of the first groove 11 is smaller than a dimension L2 of the second groove 12 is smaller than a dimension L3 of the third groove 13 is smaller than a dimension L4 of the fourth groove 14 is smaller than a dimension L5 of the fifth groove 15.

The first groove 11, the second groove 12, the third groove 13, the fourth groove 14 and the fifth groove 15 are sequentially arranged from bottom to top, and the first groove 11, the second groove 12, the third groove 13, the fourth groove 14 and the fifth groove 15 are coaxially arranged. So set up, the structure is exquisite, has reduced the holistic size of tool, helps placing at the microscope put thing platform.

The second groove 12, the third groove 13, the fourth groove 14 and the fifth groove 15 are all stepped grooves. Illustrated by the fifth groove 15:

the fifth groove 15 is surrounded by a fifth supporting area 151 and a fifth receiving area 152, the fifth receiving area 152 is surrounded by the fifth supporting area 151, the fifth wafer is placed in the fifth groove 15, and the fifth receiving area 152 corresponds to the middle of the fifth wafer.

The fourth groove 14 is surrounded by a fourth supporting area 141 and a fourth receiving area 142, the fourth receiving area 142 is surrounded by the fourth supporting area 141, the fourth wafer is placed in the fourth groove 14, and the fourth receiving area 142 corresponds to the middle of the fourth wafer.

The fifth accommodating area 152 is recessed downwards, and the fifth accommodating area 152 is hollow, so that the fifth supporting area 151, i.e. the fifth groove 15 is a stepped groove, can be formed. Wherein, the fifth supporting area 151 (e.g., the hatched area a of fig. 3) is horizontally disposed.

Similarly, the second supporting region (e.g., the hatched region d of fig. 3) of the second groove 12, the third supporting region (e.g., the hatched region c of fig. 3) of the third groove 13, and the fourth supporting region 141 (e.g., the hatched region b of fig. 3) of the fourth groove 14 may be formed, and the second supporting region, the third supporting region, and the fourth supporting region 141 may be horizontally disposed.

It should be noted that, the carrying portion 10 may also adopt other manners besides the stepped groove manner, such as the arrangement of the first groove 11 in fig. 3. The first groove 11 is composed of a first supporting area 111 and a first accommodating area 112, the first supporting area 111 is surrounded by the first accommodating area 112, and the first accommodating area 112 is in a hollowed-out design. Wherein the first supporting area 111 is horizontally arranged.

In some embodiments of the present utility model, the stepped slot is engaged with the article to be inspected.

It will be appreciated that the first recess 11 is in snap fit with the first wafer, the second recess 12 is in snap fit with the second wafer, the third recess 13 is in snap fit with the third wafer, the fourth recess 14 is in snap fit with the fourth wafer, and the fifth recess 15 is in snap fit with the fifth wafer. By the arrangement, the groove can limit the wafer, so that the wafer and the jig are prevented from colliding when the jig moves.

In some embodiments of the present utility model, the access portion 20 is configured as a through-hole. By the arrangement, the through pick-and-place part 20 can be understood as a lightening hole, so that on one hand, the overall weight of the body is reduced, and the movement of the jig is facilitated; on the other hand, the finger can be inserted into the pick-and-place portion 20, the contact area between the finger and the pick-and-place portion 20 increases, and the finger grip is stable.

As shown in fig. 3, the body is provided with a plurality of first through holes 21 and a plurality of second through holes 22.

The first through hole 21 communicates with the first, second, and third grooves. The plurality of first through holes 21 are arranged in an annular array, and the first wafer, the second wafer and the third wafer can be taken and placed through the first through holes 21.

The second through hole 22 communicates with the fourth groove 14. The plurality of second through holes 22 are arranged in an annular array, and the fourth wafer can be taken and placed through the second through holes 22.

The above arrangement mode, namely, the body is provided with the plurality of taking and placing parts 20 which are arranged in the annular array, and the taking and placing parts 20 are communicated with the bearing part 10, so that the overall weight of the jig can be reduced to the greatest extent, and the lightweight design of the jig is facilitated.

Of course, it is understood that the pick-and-place portion 20 may be a blind hole 23 in addition to a through hole. For example, a plurality of blind holes 23 are provided in the fifth groove 15, and the blind holes 23 are arranged in an annular array. The blind hole 23 communicates with the fifth recess 15.

In some embodiments of the present utility model, the body is made of aluminum alloy and has conductivity, so that an installer can ground the body to conduct out static electricity on the wafer inspection jig, thereby avoiding damage to the wafer by the static electricity.

In some embodiments of the utility model, the thickness of the body is 15-25 mm. The overall height of the jig is reduced, the jig is facilitated to be placed at the preset position of the microscope, and the collision between the jig and the lens of the microscope is avoided.

The embodiment of the utility model also provides wafer inspection equipment which comprises the microscope and the wafer inspection jig, wherein the wafer inspection jig is placed below the microscope.

According to the wafer inspection equipment, at least 4 bearing parts 10 are arranged on the body, and the sizes of the bearing parts 10 are different, so that the types of the jigs are reduced, and the compatibility of the jigs is improved; the contact area of the wafer and the bearing part 10 is reduced, the possibility that the wafer is scratched by the jig towards the surface of the body at the time of placement is reduced, and the risk of pollution of the wafer is reduced. In addition, the wafer of each specification is convenient to take, and the wafer breakage rate in the loading and taking process is reduced.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In the description of the utility model, a "first feature" or "second feature" may include one or more of such features.

In the description of the present utility model, "plurality" means two or more.

In the description of the utility model, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by another feature therebetween.

In the description of the utility model, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. Wafer inspection jig, its characterized in that includes:

the body is provided with a picking and placing part (20) and at least 4 bearing parts (10),

the size of each bearing part (10) is different, and each bearing part (10) is used for horizontally placing a to-be-detected article so as to enable the middle part of the to-be-detected article to be suspended;

the picking and placing parts (20) are arranged in one-to-one correspondence with the bearing parts (10).

2. The wafer inspection jig according to claim 1, wherein the carrying portion includes a supporting area, and a ratio of an area of the supporting area to an area of the carrying portion is a, and a is 20% or more and 30% or less.

3. The wafer inspection jig of claim 2, wherein the support area surface is provided with a smooth layer.

4. The wafer inspection jig of claim 3, wherein the smooth layer is a teflon plating layer.

5. Wafer inspection jig according to claim 2, characterized in that the carrier (10) is configured as a stepped groove.

6. The wafer inspection jig according to claim 5, wherein the stepped groove is engaged with the article to be inspected.

7. Wafer inspection jig according to claim 1, characterized in that each of the carrier parts (10) is coaxially arranged.

8. Wafer inspection jig according to claim 1, characterized in that the pick-and-place section (20) is configured as a through hole.

9. Wafer inspection jig according to claim 8, characterized in that a plurality of the pick-and-place sections (20) are provided, which are arranged in an annular array, and the pick-and-place sections (20) are in communication with the carrier section (10).

10. A wafer inspection apparatus comprising a microscope and the wafer inspection jig of any one of claims 1 to 9, the wafer inspection jig being disposed below the microscope.