CN109267030B - Substrate loading clamp for magnetron sputtering and magnetron sputtering device - Google Patents
Substrate loading clamp for magnetron sputtering and magnetron sputtering device Download PDFInfo
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- CN109267030B CN109267030B CN201811226663.XA CN201811226663A CN109267030B CN 109267030 B CN109267030 B CN 109267030B CN 201811226663 A CN201811226663 A CN 201811226663A CN 109267030 B CN109267030 B CN 109267030B
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- 239000000758 substrate Substances 0.000 title claims abstract description 81
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a substrate loading clamp for magnetron sputtering and a magnetron sputtering device, and relates to the field of magnetron sputtering coating. The substrate loading clamp for magnetron sputtering comprises a base, an elastic piece and a bottom plate; the base comprises a base, a first boss and a second boss, the first boss is connected with one side of the base and forms a first groove with a panel of the base, and the second boss is connected with the other side of the base and forms a second groove with the panel of the base. The substrate loading clamp for magnetron sputtering and the magnetron sputtering device provided by the invention have the advantages of simple structure, easiness in processing and manufacturing and convenience in assembly; on one hand, the substrate can be clamped and loaded quickly by adopting an elastic clamping mode, so that the time for fixing the substrate is effectively saved, and the working efficiency is improved; on the other hand, the clamp can simultaneously clamp and load a plurality of substrates, so that the plurality of substrates can be simultaneously fixed, the substrates are not structurally damaged while being fixed, and the integrity of the substrates is ensured.
Description
Technical Field
The invention relates to the field of magnetron sputtering devices, in particular to a substrate loading clamp for magnetron sputtering and a magnetron sputtering device.
Background
Magnetron sputtering is a high-speed low-temperature sputtering technology which is rapidly developed in the 70 s. The general sputtering method can be used for preparing multi-materials such as metal, semiconductor, insulator and the like, and has the advantages of simple equipment, easy control, large coating area, strong adhesive force and the like, while the magnetron sputtering method developed in the last 70 th century realizes high speed, low temperature and low damage. The magnetron sputtering technology is widely applied to research aspects such as high-temperature superconducting films, ferroelectric films, giant magnetoresistance films, film luminescent materials, solar cells, memory alloy films, film chip resistors and the like, and plays an important role.
In the magnetron sputtering process, a substrate to be sputtered needs to be fixed on a clamp for placing the substrate, and then the clamp is placed in a magnetron sputtering device. Therefore, in order to better sputter the substrate, the problems of the fixing and the number of the substrates need to be solved, and an apparatus capable of solving these problems is urgently needed.
Disclosure of Invention
The invention aims to provide a substrate loading clamp for magnetron sputtering, which has the characteristics of simple structure, stable clamping and capability of simultaneously clamping a plurality of substrates.
Another object of the present invention is to provide a magnetron sputtering apparatus, which has the advantages of simple structure, stable clamping, and capability of simultaneously clamping a plurality of substrates.
The invention provides a technical scheme that:
a substrate loading clamp for magnetron sputtering is used for clamping a substrate and comprises a base, an elastic piece and a bottom plate;
the base comprises a base, a first boss and a second boss, the first boss is connected with one side of the base and forms a first groove with the surface of the base, the second boss is connected with the other side of the base and forms a second groove with the surface of the base, one end of the elastic piece is abutted to the bottom plate, the other end of the elastic piece is abutted to the base, the bottom plate is provided with a bearing surface for bearing the substrate, the two sides of the bottom plate are correspondingly embedded into the first groove and the second groove, so that one side of the substrate is clamped between the bearing surface and the first boss, and the other side of the substrate is clamped between the bearing surface and the second boss.
Further, in a preferred embodiment of the present invention, the first boss includes a first boss body and a first boss outer edge, the first boss body and the first boss outer edge are integrally disposed, and the first boss outer edge and the base form a first groove.
Further, in a preferred embodiment of the present invention, the second boss includes a second boss body and a second boss outer edge, the second boss body and the second boss outer edge are integrally disposed, and the second boss outer edge and the base form a second groove.
Further, in a preferred embodiment of the present invention, the first boss and the second boss are integrally disposed on two side edges of the base.
Further, in a preferred embodiment of the present invention, both side edges of the first groove and the second groove have openings, and the bottom plate is embedded into the first groove and the second groove through the openings.
Further, in a preferred embodiment of the present invention, the base further includes a first connecting member, a plurality of first fixing holes are formed on a side of the base, a plurality of second fixing holes corresponding to the plurality of first fixing holes are formed on the first boss, and the first connecting member fixes the first boss and the base through the first fixing holes and the second fixing holes.
Further, in a preferred embodiment of the present invention, the base further includes a second connecting member, a plurality of third fixing holes are formed on a side of the base, a plurality of fourth fixing holes corresponding to the plurality of third fixing holes are formed on the second boss, and the second connecting member fixes the second boss and the base through the third fixing holes and the fourth fixing holes.
Further, in a preferred embodiment of the present invention, the base is provided with a plurality of grooves, and the grooves are used for accommodating the elastic member.
Further, in a preferred embodiment of the present invention, the elastic member is a spring, one end of the spring is placed in the groove, and the other end of the spring abuts against the lower surface of the bottom plate.
A magnetron sputtering device comprises a substrate loading clamp for magnetron sputtering, wherein the substrate loading clamp for magnetron sputtering comprises a base, an elastic part and a bottom plate;
the base comprises a base, a first boss and a second boss, the first boss is connected with one side of the base and forms a first groove with the surface of the base, the second boss is connected with the other side of the base and forms a second groove with the surface of the base, one end of the elastic piece is abutted to the bottom plate, the other end of the elastic piece is abutted to the base, the bottom plate is provided with a bearing surface for bearing the substrate, the two sides of the bottom plate are correspondingly embedded into the first groove and the second groove, so that one side of the substrate is clamped between the bearing surface and the first boss, and the other side of the substrate is clamped between the bearing surface and the second boss. The substrate loading clamp for magnetron sputtering is positioned in the magnetron sputtering device.
Compared with the prior art, the substrate loading clamp for magnetron sputtering and the magnetron sputtering device provided by the invention have the beneficial effects that:
the substrate loading clamp for magnetron sputtering and the magnetron sputtering device provided by the invention have wide application range, and have simple structure, easy processing and manufacturing and convenient assembly from the manufacturing process; for the practical application, on one hand, the substrate can be rapidly clamped and loaded by adopting an elastic clamping mode, so that the time for fixing the substrate is effectively saved, and the working efficiency is improved; on the other hand, the clamp can simultaneously clamp and load a plurality of substrates, so that the plurality of substrates can be simultaneously fixed, the substrates are not structurally damaged while being fixed, and the integrity of the substrates is ensured.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the invention and are therefore not to be considered limiting of its scope. For a person skilled in the art, it is possible to derive other relevant figures from these figures without inventive effort.
FIG. 1 is a schematic structural view of a substrate loading jig for magnetron sputtering according to the present invention;
FIG. 2 is a schematic view of a base structure of a substrate loading jig for magnetron sputtering according to the present invention;
FIG. 3 is a schematic view of a base structure of a substrate loading jig for magnetron sputtering according to the present invention;
FIG. 4 is a schematic view of a substrate structure of the substrate loading jig for magnetron sputtering according to the present invention.
Icon: 10-a substrate loading clamp for magnetron sputtering; 20-a base; 201-a base; 2010-grooves; 2011-first fixation hole; 2012-a third fixation hole; 202-a first boss; 2021-a first boss body; 2022-first boss outer edge; 2023-second fixing hole; 203-a second boss; 2031-a second boss body; 2032-the outer edge of the second boss; 2033-a fourth fixation hole; 30-a bottom plate; 40-substrate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. The terms "upper", "lower", "inner", "outer", "left", "right", and the like, refer to an orientation or positional relationship as shown in the drawings, or as would be conventionally found in use of the inventive product, or as would be conventionally understood by one skilled in the art, and are used merely to facilitate the description and simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the present invention. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It is also to be understood that, unless expressly stated or limited otherwise, the terms "disposed," "connected," and the like are intended to be open-ended, and mean "connected," i.e., fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The following detailed description of embodiments of the invention refers to the accompanying drawings.
The specific embodiment is as follows:
the embodiment provides a substrate loading clamp 10 for magnetron sputtering, which is applied to the field of magnetron sputtering devices, and as shown in fig. 1, the substrate loading clamp 10 for magnetron sputtering comprises a base 20, an elastic member and a bottom plate 30.
Referring to fig. 2, the susceptor 20 includes a base 201, a first boss 202 and a second boss 203, the first boss 202 is connected to one side of the base 201 and forms a first groove (not shown) with a panel of the base 201, the second boss 203 is connected to the other side of the base 201 and forms a second groove (not shown) with the panel of the base 201, one end of the elastic member abuts against the base plate 30, and the other end abuts against the base 201, the base plate 30 has a supporting surface for supporting the substrate 40, and two sides of the base plate 30 are correspondingly embedded into the first groove and the second groove, so as to clamp one side of the substrate 40 between the supporting surface and the first boss 202 and clamp the other side of the substrate 40 between the supporting surface and the second boss 203.
It should be noted that, the elastic member in the present embodiment may be a spring, or may be a ball, etc., and has a material with a rebound function, so that the bottom plate 30 rebounds under the elastic force, and any structure or material satisfying this function is within the protection scope of the present invention.
The first boss 202 comprises a first boss body 2021 and a first boss outer edge 2022, the first boss outer edge 2022 is convexly arranged on the upper side surface of the first boss body 2021, the plane of the first boss outer edge 2022 is parallel to the plane of the base 201, and the first boss outer edge 2022 and the base 201 form a first groove; the first boss body 2021 and the first boss outer edge 2022 are integrally disposed. Similarly, the second boss 203 includes a second boss body 2031 and a second boss outer edge 2032, the second boss outer edge 2032 is convexly provided to the upper side of the second boss body 2031, the second boss outer edge 2032 is parallel to the plane of the base 201, the second boss outer edge 2032 is formed with a second groove on the base 201, the second boss body 2031 is integrally provided with the second boss outer edge 2032.
As shown in fig. 2.
It should be noted that, the first boss body 2021 and the first boss outer edge 2022 according to the embodiment are provided for the purpose of forming the groove 2010 between the base 201 and the base to fix the bottom plate 30, and therefore, the structure of the groove 2010 capable of reaching the fixed bottom plate 30 is the protection object of the present invention.
The first boss 202 and the second boss 203 are integrally disposed on two side edges of the base 201.
Both sides of the first groove and the second groove have openings through which the bottom plate 30 is embedded into the first groove and the second groove.
The base 20 further includes a first connecting member, a plurality of first fixing holes 2011 are formed in one side edge of the base 201, the first fixing holes 2011 are uniformly distributed on the side edge of the base 201 in a straight shape, a plurality of second fixing holes 2023 corresponding to the plurality of first fixing holes 2011 are formed in the first boss 202, and the first boss 202 and the base 201 are fixed by the first connecting member through the first fixing holes 2011 and the second fixing holes 2023.
The base 20 further includes a second connecting member, a plurality of third fixing holes 2012 are formed in one side of the base 201, the third fixing holes 2012 are uniformly distributed on the side of the base 201 in a straight line shape, a plurality of fourth fixing holes 2033 corresponding to the plurality of third fixing holes 2012 are formed in the second boss 203, and the second connecting member passes through the third fixing holes 2012 and the fourth fixing holes 2033 to fix the second boss 203 and the base 201.
It should be noted that the first connecting member and the second connecting member in this embodiment are used to fix the boss and the base 201, and besides, the boss and the base 201 may be connected by glue, and after the connection, the tensile stress caused by the elastic force of the spring can be borne; the boss and the base 201 can be integrally formed in addition to being designed and assembled in a split manner.
The base 201 is provided with a plurality of grooves 2010, the grooves 2010 are circular grooves with certain depth, and the grooves 2010 are used for accommodating the elastic elements. The elastic member is a spring, one end of the spring is placed in the groove 2010, and the other end of the spring abuts against the lower surface of the bottom plate 30.
The embodiment of the invention also provides a magnetron sputtering device which comprises the substrate loading clamp 10 for magnetron sputtering.
As shown in fig. 1, two corresponding first bosses 202 and second bosses 203 are provided on a base 201, first grooves and second grooves are formed between the first bosses 202 and the second bosses 203 and the base 201, and grooves 2010 capable of accommodating or fixing springs are provided on the base 201, as shown in fig. 3, the springs are first placed in the grooves 2010, then a base plate 30 is inserted into a base 20 from openings at both ends of the first grooves and the second grooves, the springs are pressed between the base 201 and the base plate 30 in the insertion process, after the base plate 30 is completely inserted into the base 20, one end of the springs abuts against the base 201, the other end abuts against the base plate 30, and both sides of the upper surface of the base plate 30 are engaged with the first grooves and the second grooves, further, the springs are compressed by pressing the base plate 30, a gap is generated between the base plate 30 and the first grooves and the second grooves, further, a substrate 40 is inserted into the gap, releasing the base plate 30 allows the spring to clamp the substrate 40 on the base 20 under the action of elastic force, so that the substrate 40 is stably fixed on the base 20, and meanwhile, a plurality of substrates 40 can be embedded into the base 20 according to production requirements, thereby achieving the purpose of simultaneously fixing a plurality of substrates 40.
In summary, the following steps:
the substrate loading clamp 10 for magnetron sputtering provided by the embodiment of the invention comprises a base 20, an elastic piece and a bottom plate 30; the susceptor 20 includes a base 201, a first boss 202 and a second boss 203, the first boss 202 is connected to one side of the base 201 and forms a first groove with a panel of the base 201, the second boss 203 is connected to the other side of the base 201 and forms a second groove with the panel of the base 201, one end of the elastic member abuts against the base plate 30, and the other end abuts against the base 201, the base plate 30 has a carrying surface for carrying the substrate 40, and two sides of the base plate 30 are correspondingly embedded into the first groove and the second groove, so as to clamp one side of the substrate 40 between the carrying surface and the first boss 202 and clamp the other side of the substrate 40 between the carrying surface and the second boss 203. The substrate loading clamp 10 for magnetron sputtering and the magnetron sputtering device provided by the invention have wide application range, and have simple structure, easy processing and manufacturing and convenient assembly from the manufacturing process; for practical application, on one hand, the substrate 40 can be rapidly clamped and loaded by adopting an elastic clamping mode, so that the time for fixing the substrate 40 is effectively saved, and the working efficiency is improved; on the other hand, the clamp can simultaneously clamp and load a plurality of substrates 40, so that the plurality of substrates 40 can be simultaneously fixed, the substrates 40 are fixed without causing structural damage, and the integrity of the substrates 40 is ensured.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it is obvious to those skilled in the art that the features in the above embodiments may be combined with each other and the present invention may be variously modified and changed without conflict. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The present embodiments are to be considered as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A substrate loading clamp for magnetron sputtering is used for clamping a substrate and is characterized by comprising a base, an elastic part and a bottom plate;
the base comprises a base, a first boss and a second boss, the first boss is connected with one side of the base and forms a first groove with the surface of the base, the second boss is connected with the other side of the base and forms a second groove with the surface of the base, one end of the elastic piece is abutted to the bottom plate, the other end of the elastic piece is abutted to the base, the bottom plate is provided with a bearing surface for bearing the substrate, the two sides of the bottom plate are correspondingly embedded into the first groove and the second groove, so that one side of the substrate is clamped between the bearing surface and the first boss, and the other side of the substrate is clamped between the bearing surface and the second boss.
2. The substrate loading jig for magnetron sputtering as claimed in claim 1, wherein the first boss includes a first boss body and a first boss outer edge, the first boss body and the first boss outer edge are integrally provided, and the first boss outer edge and the base form a first groove.
3. The substrate loading jig for magnetron sputtering as claimed in claim 1, wherein the second boss includes a second boss body and a second boss outer edge, the second boss body and the second boss outer edge are integrally provided, and the second boss outer edge and the base form a second groove.
4. The substrate loading jig for magnetron sputtering as claimed in claim 1, wherein the first boss and the second boss are detachably attached to both side edges of the base, respectively.
5. The substrate loading jig for magnetron sputtering as claimed in claim 1, wherein both side edges of the first groove and the second groove have openings, and the bottom plate is fitted into the first groove and the second groove through the openings.
6. The substrate loading jig for magnetron sputtering as claimed in claim 1, wherein the base further includes a first connecting member, a plurality of first fixing holes are formed in one side edge of the base, a plurality of second fixing holes corresponding to the plurality of first fixing holes are formed in the first bosses, and the first connecting member fixes the first bosses and the base through the first fixing holes and the second fixing holes.
7. The substrate loading jig for magnetron sputtering as claimed in claim 1, wherein the base further includes a second connecting member, a plurality of third fixing holes are formed in one side edge of the base, a plurality of fourth fixing holes corresponding to the plurality of third fixing holes are formed in the second boss, and the second connecting member fixes the second boss and the base through the third fixing holes and the fourth fixing holes.
8. The substrate loading fixture for magnetron sputtering as claimed in claim 1, wherein the base is provided with a plurality of grooves for accommodating the elastic member.
9. The substrate loading jig for magnetron sputtering as claimed in claim 1, wherein the elastic member is a spring, one end of the spring is placed in the groove, and the other end of the spring abuts against the lower surface of the bottom plate.
10. A magnetron sputtering apparatus, characterized in that: the magnetron sputtering apparatus includes an apparatus body and the substrate loading jig for magnetron sputtering as claimed in any one of claims 1 to 9, which is located in the apparatus body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811226663.XA CN109267030B (en) | 2018-10-22 | 2018-10-22 | Substrate loading clamp for magnetron sputtering and magnetron sputtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811226663.XA CN109267030B (en) | 2018-10-22 | 2018-10-22 | Substrate loading clamp for magnetron sputtering and magnetron sputtering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109267030A CN109267030A (en) | 2019-01-25 |
| CN109267030B true CN109267030B (en) | 2020-12-22 |
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| CN201811226663.XA Active CN109267030B (en) | 2018-10-22 | 2018-10-22 | Substrate loading clamp for magnetron sputtering and magnetron sputtering device |
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| CN (1) | CN109267030B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06188303A (en) * | 1992-12-17 | 1994-07-08 | Hitachi Ltd | Sputtering apparatus |
| JP3638095B2 (en) * | 1999-06-11 | 2005-04-13 | 矢崎総業株式会社 | Terminal incomplete insertion detection structure |
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|---|---|---|---|---|
| CN204825043U (en) * | 2015-08-06 | 2015-12-02 | 国营第二二八厂 | Vertical film fixture that plates of magnetron sputtering |
| CN206185536U (en) * | 2016-11-18 | 2017-05-24 | 一拖（洛阳）汇德工装有限公司 | Floating supporting and pressing device |
| CN106584099A (en) * | 2016-12-06 | 2017-04-26 | 苏州博众精工科技有限公司 | Floating carrier |
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| Publication number | Publication date |
|---|---|
| CN109267030A (en) | 2019-01-25 |
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