CN103748694B - Substrate bearing device for solaode plating - Google Patents
Substrate bearing device for solaode plating Download PDFInfo
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- CN103748694B CN103748694B CN201380002685.7A CN201380002685A CN103748694B CN 103748694 B CN103748694 B CN 103748694B CN 201380002685 A CN201380002685 A CN 201380002685A CN 103748694 B CN103748694 B CN 103748694B
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- substrate
- clip
- mounting rod
- clip mounting
- bearing device
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- 239000000758 substrate Substances 0.000 title claims abstract description 244
- 238000007747 plating Methods 0.000 title description 34
- 238000009713 electroplating Methods 0.000 claims abstract description 14
- 210000003141 lower extremity Anatomy 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 241000254032 Acrididae Species 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 51
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 17
- 239000002585 base Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920001774 Perfluoroether Polymers 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
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- 239000003513 alkali Substances 0.000 description 1
- 230000001458 anti-acid effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- C25D7/126—Semiconductors first coated with a seed layer or a conductive layer for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Robotics (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of substrate bearing device for electroplating solaode, this substrate bearing device includes accommodating the faceplate part of substrate and being connected to the support section of grass-hopper.The present invention includes: at least two clip mounting rod, described at least two clip mounting rod is arranged to vertically across described faceplate part and include inserting the upper end in the hole being formed in the bar fixed cell of upper end, the bottom of described clip mounting rod is inserted in the hole being limited in bottom bar fixed cell, and described upper end is connected to described upper end bar fixed cell by spring member, and described clip mounting rod rotates when by the elastic force of described spring member in the hole；The multiple clips arranged with preset distance on described clip mounting rod, by the rotation of described clip mounting rod, the plurality of clip determines the clip open mode contacted of the clip closed mode with described substrate formation contact point and release and described substrate；And substrate housing region, described substrate housing region is arranged on the flat surfaces of described faceplate part between described clip mounting rod, and described substrate housing region repeatedly arranges and be provided with substrate support and the substrate edges guiding piece on the surface for supporting described substrate on the flat surfaces of described faceplate part.
Description
Technical field
The present invention relates to a kind of for supporting multiple semiconductor wafer thus to described in using in solar cells
Multiple semiconductor wafers carry out the equipment electroplated.
Background technology
In recent years, solaode causes people to pay close attention to as newborn power industry of future generation.Solaode is direct
Convert solar energy into the element of electricity.Typically, used the printing technology utilizing silver paste as forming change-over circuit
Technology.But, along with the growth of the price of silver (Ag), this technology lacks price competitiveness.Additionally, due to
Impurity in the binding agent of composition silver paste and bead reduces electric conductivity, and thus limits the solar energy conversion to electricity
Efficiency, the method that research uses plating the most energetically.
The existing method using printing process to form circuit is carried out in a horizontal manner.But, in order to plating is introduced circuit
In forming method, it is necessary to use vertical-type to manufacture equipment.Keep while wafer at fixture, wafer is immersed in for
In the plating solution of plating.In the middle of the various methods manufacturing solaode, formed the mistake of electrode pattern by plating
Journey, the process being layered by photoresist and etch back process the most essentially need support and transfer multiple silicon wafer
Fixture unit.
United States Patent (USP) No.7172184 discloses a kind of base for electroplating the silicon wafer for solaode
Onboard body.According to this at first patent documentation, as it is shown in figure 1, substrate carrier is provided with for loading propping up of wafer 12
Support frame frame 10 and for supporting the auxiliary frame 20 and 22 of wafer 12.Support frame 10 includes for accommodating wafer
Multiple openings 30 of 12, and these openings define the matrix of framework.Additionally, auxiliary frame 20 and 22 has
The structure corresponding with the shape of support frame 10, and be assembled in support frame 10 by multiple screws 32 and 34
Together.The flange 28 prominent to the inside of the opening 30 of support frame 10 accommodates wafer 12 and passes through auxiliary frame
Wafer 12 is fixed under loading condition by the metal holder 24 and 26 of 20 and 22.
But, this patent documentation has a problem in that, assembling substrates needs the much time, because using a large amount of screw
Wafer substrate is loaded in support frame.
Additionally, when when the clip of fixed wafer is damaged, prior art have another constitute an inconvenience in that, spiral shell
Nail needs to use screwdriver to separate, thus is removed by the clip of damage, then needs to re-assembly.Namely
Say, safeguard the most extremely difficult.
And, in the prior art, multiple openings house wafer substrate.Thus, in plating process, owing to opening
Mouthful the surface tension of plating solution that produces of edge and plating solution is applied on substrate carrier.As a result, plating
Solution is by luxus consumption.Further, since add two groups of auxiliary frames to support frame, the loss of plating solution is almost
Add three times.
Owing to the problems referred to above in this patent documentation have impact on the unit manufacturing cost of solaode, they are finally to system
The economic feasibility making solaode is negatively affected.
Other method, about the economic feasibility of manufacture solaode, has focused on and has exerted
The possible unfertile land that overcomes reduces the thickness of wafer, is used as a kind of effort reducing in the various effort of manufacturing cost.But,
Along with wafer thickness continues to reduce, in the loading and uninstall process of wafer, the spoilage of wafer increases.
The present inventor has paid various effort to overcome the problems referred to above, and after studying for a long period of time and making great efforts
Complete the present invention eventually.
Summary of the invention
It is an object of the invention to provide a kind of means the most more economical in the electroplating process of solar cell wafer.
The efficiency of electroplating process and economic feasibility depend on manufacturing greater amount with minimum wafer damage fast and stable
Solar wafer.In other words, Low Defectivity must meet with stability and speed simultaneously.These purposes can be categorized into
The following purpose more refined:
-when wafer substrate being loaded on carrier arrangement and unload from carrier arrangement, it is allowed to wafer substrate is easy
Be attached to device support unit and pull down from device support unit.Operated by these, it is possible to save electroplating process institute
The time needed, thus reduce the manufacturing cost of solaode.
-allow multiple wafers to be electroplated simultaneously.
-nowadays, the thickness of silicon wafer continues to reduce.Therefore, the spoilage of the wafer in electroplating process increases.Thus,
The substrate bearing device of the present invention must include the device for preventing wafer from easily being damaged.
Further, it is another object of the present invention to provide the substrate bearing device for plating of a kind of improvement, this substrate
Bogey makes to spread upon the loss reduction of the plating solution on plating fixture due to the surface tension of plating solution
Change.Thus, it is also possible to reduce the manufacturing cost of solaode.
On the other hand, should be additionally in the range of can being easily deduced that from the detailed description of the present invention and effect
Consider the other objects of the present invention indicated the most in the description.
Embodiments of the present invention provide a kind of substrate bearing device for electroplating solaode, this base
Plate bogey includes:
Accommodate the flat panel unit of substrate；
It is connected to the support unit of transfer device；
At least two clip mounting rod, described at least two clip mounting rod is mounted to vertically across described panel unit
And including inserting the upper end in the hole being limited in the bar fixed cell of upper end, the lower end of described clip mounting rod is inserted into limit
Be scheduled in the hole in bottom bar fixed cell, described upper end by spring member be connected to described upper end bar fixed cell with
Rotate in the hole while the elastic force by described spring member；
The multiple clips being spaced apart from each other on described clip mounting rod, by the rotation of described clip mounting rod, described
Multiple clips have the folder contacted of the clip closed mode with described substrate formation contact point and release and described substrate
Sub-open mode；And
Substrate housing region, described substrate housing region is repeatedly disposed in described panel between described clip mounting rod
On the panel of unit, and there is substrate support and the substrate edges guiding piece on surface for supporting described substrate.
In some embodiments, the front surface of described substrate bearing device and rear surface can have same shape, with
Described substrate is separately mounted on front surface and the rear surface of described panel unit.
In other embodiments, the handle of the motion for controlling described clip mounting rod can be separately mounted to described
In the upper end of clip mounting rod, and described spring member can be tight to described handle from the upper end of described clip mounting rod
Thickly it is wound around.
In further embodiment, relative to each other with the spaced apart installation of preset distance on described clip mounting rod
Clip can have around described bar spring shape several times, and removable unloading clip can be passed through in one end of described clip
Sub-fixed cell and be fixed to described clip mounting rod, the other end of described clip can be respectively at two of described substrate
Contact point is formed on surface.
In yet another embodiment, described substrate support may include that
First central support, this first central support is for supporting the middle body of the rear surface of described substrate；
Second central support, this second central support for round described first central support support around
The part of the middle body of the rear surface of described substrate；And
Substrate edges support member, this substrate edges support member is used for supporting the marginal portion of the rear surface of described substrate,
Wherein shape on the surface corresponding with the part contacting described substrate edges support member of this substrate of described substrate
Become contact point.
In another embodiment, described substrate edges guiding piece may include that
First edge guide member, this first edge guide member is for supporting the top edge of described substrate and lower limb also simultaneously
Guide the position of described substrate；And
Second edge guide member, this second edge guide member is for supporting the left hand edge of described substrate and right hand edge also simultaneously
Guide the position of described substrate.
In another embodiment, described first edge guide member and described second edge guide member can include two
Layer, the edge of wherein said substrate is arranged on the stayed surface between said two layer, and can guide described base
Plate makes the position at the edge of described substrate will not deviate from described substrate housing region due to described guide layer.
The present invention can be able to use when the process electroplated the wafer for solaode two-sided simultaneously
Long rod element discharges the clip arranged with same matrix simultaneously.Thus, when wafer substrate is loaded in support means and
When support means unloading wafer substrate, relatively simply can dismantle wafer substrate from carrier arrangement.Therefore, it can
Save the time needed for plating and work as a result, the manufacturing cost of solaode can be reduced.
The present invention can suitably provide multiple support member, thin to prevent from damaging easily while carrying out electroplating process
Wafer.
Unlike the prior art, the substrate bearing device for plating of the present invention does not has out at substrate housing region
Mouthful, thus so that the loss reduction of electroplating solution at edge of opening.The shape of support member is also designed to prevent
Electroplating solution loses.
It should be noted that the most specifically mention but can by the technical characteristic of the present invention anticipate latent
It is considered as the effect described in the description in effect.
Accompanying drawing explanation
Fig. 1 is the view of the substrate carrier according to prior art.
Fig. 2 is the axonometric chart of the substrate bearing device 100 according to an embodiment of the invention.
Fig. 3 shows the view of the structure of the substrate housing region of the panel unit 190 of Fig. 1, wherein distinguishes (a)
Showing the first central support 110, (b) shows the second central support 120, and (c) shows first substrate
Edge guide member, (d) shows substrate edges support member, and (e) shows second substrate edge guide member.
Fig. 4 is the zoomed-in view of part A of Fig. 1.
Fig. 5 is the zoomed-in view of part B of Fig. 1.
Fig. 6 is the zoomed-in view of part C of Fig. 1.
The further understanding of illustration of the technical spirit to the present invention it is to provide for including accompanying drawing, thus, this
Bright scope is not construed as being limited by accompanying drawing.
Detailed description of the invention
It is more fully described embodiments of the present invention below with reference to accompanying drawings.Additionally, eliminating is related to this area skill
Obvious known function or the detailed description of structure for art personnel, to avoid unnecessarily obscuring subject of the present invention.
Fig. 2 shows the substrate carrier for solaode plating according to an embodiment of the invention
The schematic diagram of substrate bearing device 100.This substrate bearing device 100 can be connected to turn at its support unit 191
It is transferred under the state of the grip unit 170 of moving device (not shown).Substrate bearing device 100 can introduced
Electroplate after wherein accommodating in the electroplating bath of plating solution.The unit of known or various improvement can be used base
Plate bogey 100 is connected to transfer device, and electroplates.Due to the description of these unit to art technology
People-to-people contacts are obvious or are not the core technology of the present invention, therefore will omit their detailed description.
As in figure 2 it is shown, substrate bearing device 100 includes a panel unit 190 and support unit 191.Wafer base
Plate can be arranged in the plane of panel unit 190 of substrate bearing device 100 in the matrix form.Substrate can be distinguished
It is separately mounted at the front surface of substrate bearing device 100 and rear surface and (but this rear table is the most directly shown
Face, this rear surface is by being arranged in the lower beam fixed cell 301 ', 401 ' of the rear surface at the bottom of panel unit 190
Indirectly describe with 501 ') on.Unlike the prior art, substrate bearing device 100 is accommodating the (face, region of substrate
The plane of Slab element 190) in not there is opening.
In this embodiment, be provided with in multiple wafer substrate 1(figure shown in dotted line) substrate housing region arrange
In the plane of the panel unit 190 of substrate bearing device 100.Substrate housing region can be arranged in base plate carrying dress
Put 100 front surface and rear surface both on.As in figure 2 it is shown, substrate housing region can the most repeatedly
It is arranged on substrate bearing device.Additionally, multiple central substrate support members, upper and lower substrate edges guiding piece, Zuo He
Right substrate edges guiding piece and substrate edges support member can be arranged in each list of substrate housing region in the matrix form
In unit.
The clip mounting rod 210,220,230 and 240 vertically extended is positioned at and is disposed with wafer with being arranged parallel to each other
The left and right sides in the region of substrate.It is to say, multiple clip mounting rods 210,220,230 and 240 are arranged to
Vertically across described panel unit.
Bar 210,220,230,240 can cross panel unit 190, and wherein one end of these bars can be fixed
To bottom bar fixed cell 301,401 and 501, the other end of these bars can be fixed to upper end bar fixed cell
300,400 or 500.In detail, the top and bottom of clip mounting rod may be inserted into restriction in a fixation unit
Hole in.Here, term " is fixed " and is referred to that bar is not completely fixed, but can more or less left and right or move up and down
(hereinafter, identical meanings can be used).The top and bottom of these bars can be to rotate in this some holes.The anglec of rotation
It is restricted.Handle 211,221,231 and 241 for limiting rotation angle be arranged in clip mounting rod 210,
220, on the upper end of 230 and 240.It is pre-that multiple clips are arranged on the surface of bar 210,220,230 and 240
Determine position.
Upper end bar fixed cell 300,400,500 can be arranged in the support unit 191 of substrate bearing device 100
On.Support unit 191 can be arranged in grip unit and the receiving that base plate carrying unit 100 is connected to transfer device
Between the panel unit 190 of substrate.Can install for by bar and for plating electric device (not shown) and
Substrate is formed the cable 101,102,103 and 104 of electrode.For guiding clip mounting rod 210 and 240
At the top of the both sides that side guides 302 and 502 can be arranged on panel unit 190 as shown in Figure 2, and also can
To be arranged on the both sides of support unit 191.
Part A of Fig. 2, B and C amplify respectively in Fig. 4,5 and 6, and as described below by every width figure
Described in each part in these parts.
The first central support 110 and the second central support 120 for supporting the central authorities of substrate are arranged in the present invention
Panel unit 190 substrate housing region surface on.First edge guide member 130 can guide the top of substrate
Edge and lower limb.According to the position of the first edge guide member, the first edge guide member 130 can perform to omit each other
Micro-different function.It is to say, the first top edge guide member 130 guides top edge and the lower limb of substrate,
And the first edge guide member 130 of centre guides lower limb and the position of the substrate being positioned in upper substrate housing region simultaneously
The top edge of another substrate in infrabasal plate housing region.The first edge guide member 130 most on the lower can guide
The lower limb of substrate.Multiple second edge guide members 150 can guide left hand edge and the right hand edge of substrate.Multiple substrates
Edge supports 140 can support left hand edge and the right hand edge of substrate.
In the lateral edge portions of substrate, the left hand edge of substrate and right hand edge can be by the left hand edges being alternately arranged at substrate
Support with the second edge guide member 150 on right hand edge and substrate edges support member 140.As it has been described above, substrate is upper
Under/and left/right edge can be guided by multiple first and second edge guide members 130 and 150 and support, thus prevents
Substrate rocks to up/down and left/right from the predetermined substrate housing region of panel unit 190.
Unit for preventing substrate from separating on the anterior direction of Fig. 2 is not the most described.This unit can be by peace
Multiple these clips of clip 150(being contained on clip mounting rod 210,220,230 and 240 are exaggerated in the diagram)
Meet.Multiple clips 250 can contact the substrate portion supported by substrate edges support member 140 to form electrode.
It is (so-called to prevent substrate from separating on the anterior direction of Fig. 2 that multiple clips 250 can contact substrate the most as mentioned above
" clip closed mode ").Substrate can be loaded into when clip is opened on substrate bearing device 100.Here,
Multiple central support and substrate edges support member can support substrate, and multiple edge guide member can with guide edge with
Prevent substrate from separating from substrate housing region while supporting the marginal portion of substrate.The electroplating process of substrate is at clip
Carry out under the state closed.Additionally, substrate unloads from substrate bearing device 100 when clip is opened.
In the embodiment of Fig. 2, total of eight substrate is loaded on substrate bearing device 100, i.e. four substrates
Being loaded on the front surface of substrate bearing device 100, four additional substrate is loaded in the rear table of substrate bearing device 100
On face.But, this is intended merely to facilitate description.If substrate bearing device 100 size increases, then can be at it
The more substrate of upper installation.
Fig. 3 shows the multiple substrate center support members in the substrate housing region being arranged on Fig. 2, upper and lower substrate limit
Edge guiding piece, left and right substrate edges guiding piece, the example of shape of substrate edges support member.Fig. 3 A shows
One central support 110, Fig. 3 B shows the second central support 120, and Fig. 3 C shows the first edge guide member
130, Fig. 3 D show substrate edges support member 140, and Fig. 3 E shows the second edge guide member 140.Work as base
When plate is loaded on substrate bearing device 100, part or all of described element can support substrate below substrate
Rear surface.Substantially, described element can have curved surface due to its cylinder form.Thus, when by substrate
When bogey is placed vertically in electroplating bath, it is possible to prevent these elements contact plating solution to cause silting up.Fig. 3
In the height of these elements there is the relation of " h1=h2=h3=h4=h5 ".
First central support 110 can be arranged in the central corresponding surface of the rear surface with substrate of panel unit
On to support substrate.Second central support 120 can arrange to support around base around the first central support 110
The part of the central authorities of the rear surface of plate.As shown in FIG., this supporting construction can include two layers.Substrate edges supports
Part 140 can support the marginal portion of substrate.Supporting with the substrate edges in the rear surface being arranged in substrate at substrate
Can be formed and the contact point of clip 250 on the surface of part 140 correspondence.It is to say, substrate edges support member 140
The contact portion for plating can be supported.First and second central support 110 and 120 and substrate edges support member
140 can have same shape or difformity.
As it has been described above, for supporting and guide the top edge of substrate and the first edge guide member 130 of lower limb to wrap
Include two layers.The top edge of substrate or lower limb can be arranged on the stayed surface 132 with width d1, and
The motion at the edge of substrate can be limited by the guide layer 131 being arranged on stayed surface 132.It is to say, substrate
The position at edge can be directed into so that this substrate will not separate from substrate housing region.Guide layer 131 is permissible
There is the coniform shape on band bending surface, thus plating solution can easily flow downward along its curved surface.
Second edge guide member 150 can support and guide the edge part of substrate as the first edge guide member 130
Point.But, the second edge guide member 150 can differently guide the left and right of substrate with the first edge guide member 130
Edge.Second edge guide member 150 can include two kinds of structures.In fig. 3e, the second edge guide member 150 can
To guide and to support left hand edge.In the structure symmetrical with above-mentioned structure, the second edge guide member 150 can guide also
Support the right hand edge of substrate.What the left hand edge of substrate can be arranged in the second edge guide member 150 has width d2's
On stayed surface 153.It is to say, the position at the edge of substrate can be directed into so that substrate will not hold from substrate
Receive region deviation.Guide layer 152 can have coniform shape, so that plating solution can be easily to dirty
Dynamic.As shown in FIGURE 3 E, a part for the second edge guide member 150 can be cut, thus clip mounting rod (example
Such as clip mounting rod 220 and 240) can arrange near the receiving unit 151 being formed in cut-out.
In the various embodiments of the present invention, above-mentioned multiple substrate center support members, upper and lower substrate edges guide
Part, left and right substrate edges guiding piece and substrate edges support member can have various sizes, shape and quantity, this
Bright scope is not limited to this.
Can with the economy improving manufacture of solar cells as it has been described above, have been carried out the effort reducing the thickness of silicon wafer
Row.But, continue size and reduce the possible spoilage increased in wafer-load and uninstall process of wafer thickness.This
Bright be configured to fully by wafer support on substrate bearing device so that the damage of wafer is minimum.First and
Two central support 110 and 120 can perform to make the task of wafer loss reduction.
Plating solution can be by substrate and the support member in multiple substrate center support members, up/down/left/right substrate edges
Space rapid rundown between guiding piece and substrate edges support member.
Fig. 4 is the zoomed-in view of part A of Fig. 2.The clip 250 forming contact point with substrate can be apart from each other
It is placed on clip mounting rod 210,220,230 and 240 preset distance.Each clip 250 can be by conducting electricity
Metal is formed, and has winding resilient shapes several times.Clip 250 can be configured to spring as shown in the figure, by
This maintains predetermined pressure on a surface of the wafer.By loading repeatedly and the uninstall process of wafer substrate, clip member
Degree of fatigue may increase.As a result, irregular pressure may be applied to the surface of wafer.But, clip 250
Spring shape can be formed as, thus, though repetitive process, the physical characteristic of clip member can maintain for a long time.
One end of clip 250 can by detachable clip fixing device 251 be fixed to clip mounting rod 210,220,
230 and 240, the other end of clip 250 can form contact point with the surface of substrate (not shown).Fig. 4's
In embodiment, the clip mounting rod 220 in left side is in clip closed mode, and the clip mounting rod 230 on right side is in
Clip open mode.For the ease of description by clip mounting rod 220 and the clip mounting rod 230 on right side in left side
It is shown as difference.
In the diagram, clip 250 and the substrate edges support member 140 in left side is shown as the clip 250 on the left of seemingly
Contact point is defined with substrate edges support member 140, but, owing to substrate is disposed in substrate in this embodiment
On edge supports 140, the surface of wafer substrate and the end of clip 250 can form contact point.Clip 250
With the contact portion between wafer is by tangent bend.Thus, even if the surface of the sharp tips contact substrate of clip 250,
It is also possible to prevent substrate damaged.If the contact area between clip 250 and the surface of substrate is the most roomy, then may be used
Out no-plating phenomenon can occur.But, as in embodiments of the present invention, due to the contact site of clip 250 with wafer
Divide by tangent bend, be therefore possible to prevent substrate damaged, and out no-plating phenomenon can be made to minimize.
The surface of clip 250 can coat and include antiacid and the Teflon of alkali resistant epoxy resin, resin etc..
Fig. 5 is the zoomed-in view of part B of Fig. 1.Part D of Fig. 1 is the most identical with Fig. 5, but can have
There is the direction contrary with Fig. 5.Thus by by using the description of Fig. 5 to omit the description of part D of Fig. 1.
In one end of clip mounting rod 210 is inserted into the hole (not shown) of upper end bar fixed cell 300 and be fixed to this
Hole.The handle 211 prominent from the surface of bar 210 is arranged on the front side of following position: the end of bar 210 this position
Portion is connected to upper end bar fixed cell 300.Handle 211 can have variously-shaped and can be modified as can be by machine
Other shapes of tool device clamping.Additionally, spring fixed cell 310 can be arranged on the fixing list of upper end bar as shown in the figure
In unit 300, it is wound around and is fixed to the spring member 350 of this spring fixed cell 310 around spring fixed cell 310
Closely it is wound around to handle 211 from the end of bar 210.Spring member 350 is installed as described above, thus at clip
The powerful elastic anchorage force from spring is provided by each clip 250 to substrate under the state closed.In the drawings, bullet
Spring component 350 and bar 210 have been illustrated spring member 350 seemingly and have not been in close contact bar 210 ground around bar 210
It is wound around, but, this is intended merely to facilitate description.Spring member 350 is in close contact bar at this spring member 350
Closely it is wound around around spring fixed cell 310 under the state of 210.
Fig. 5 shows the view of the state that clip cuts out.Handle 211 is arranged when each clip cuts out
In elasticity suppression projection 360, and excessive power is applied to the marginal portion of substrate, is therefore prevented from substrate damage.
Control crank 211 comes the surface of swingle 210 up and down, and thus makes multiple clip 250 shift simultaneously.Cause
And, the on and off of clip 250 can be formed relative to substrate.Thus, it is possible to be effectively reduced loading and
Unload the time needed for carried base board.
See Fig. 6.Fig. 6 is the zoomed-in view of part C of Fig. 1.The fixed cell 400 of Fig. 6 is connected to two folders
The end of sub-mounting rod 220 and 230.The two clip mounting rod 220 and 230 is arranged on substrate different from each other.
One end of clip mounting rod 220 is inserted into and is fixed to any one hole (not shown) of upper end bar fixed cell 400.
Here, prominent from the surface of bar 220 handle 221 is installed in the front side of following position: bar 220 this position
End be connected to upper end bar fixed cell 400.As it is shown in figure 5, be wound around around spring fixed cell 420 and consolidate
One end of the fixed spring member 450 to this spring fixed cell 420 is stretched out so that himself twines around the end of bar 220
Around, and make the downside himself being tightly wound to handle 221.Clip mounting rod 230 is installed with the clip in Fig. 5
Bar is identical.Clip mounting rod 220 is in clip closed mode, and clip mounting rod 230 is in clip open mode.
When being loaded completely by substrate after clip is opened, stop bullet can be carried out by retainer 421 and 431
Spring component 450 and 451.When retainer 421 and 431 is removed, spring member 450 and 451 can be due to bullet
The elastic force of spring and allow clip to return to its closed mode (state that wafer and clip contact with each other).Spring member 450
Can perform to maintain on a surface of the wafer the effect of predetermined pressure with 451.On the other hand, clip mounting rod 220
Can the most slightly offset with 230.Elastic suppression projection 460 and 461 is arranged on fixed cell 400
In, to prevent the excessive surface pressurized of substrate from (although being shown without in Figure 5, but the stop with Fig. 6 can be installed
Retainer that part is the same or for performing the unit of the retainer identical function with Fig. 6).
As set forth above, it is possible to rotate clip mounting rod 220 He by joystick 221 and 231 up and down
The surface (seeing the rotation status of the clip fixed cell 251 of Fig. 4) of 230, thus can be by multiple clips 250
/ closed mode is opened to form clip 250 relative to substrate with shift.Therefore, it can efficiently reduce loading
With the time unloading carried base board needs.
Can be carried out by automatic system for manufacturing a series of processes of solaode.Additionally, wafer substrate is filled
The process on the substrate bearing device of plating with from substrate bearing device unloading wafer substrate that is loaded in can be by certainly
Dynamic system is carried out.Otherwise, the time needed for plating and effort may negatively affect the price of solaode.
In order to/from substrate bearing device load and unloading wafer substrate, it is important that each clip open simultaneously and
Close.Present invention be advantageous in that, clip is arranged in the anterior same position of substrate bearing device abreast,
Arrange that the position of clip only has linear element, and bend the most in different directions, and by using clip to pacify
Dress bar 210,220,230 and 240 makes all clips carry out clip cut out simultaneously and clip is opened, and the most automatically will
Wafer-load unloads on substrate and from substrate.
Other realize
The most in the drawings, the size of element is exaggerated in order to understand.When the substrate bearing device 100 of the present invention is answered
When actual place, according to designing and for the size of each element is altered or modified, and can should can select
For optimum.The quantity of substrate support, substrate edges guiding piece, clip and clip mounting rod etc. can carry out various
Change.
Although the substrate support described the most in embodiments of the present invention, substrate edges guiding piece etc. are with cylinder
Shape is formed, but in other embodiments these substrate supports, substrate edges guiding piece etc. can with prismatic or
Streamline-shaped is formed.The physical features of support member is configured to make plating solution the most quickly flow, without stopping
In the top of support member, thus reduce the use of plating solution.
The most in some embodiments, support member and guiding elements about substrate can pass through such as binding agent etc
Adhesive member be attached and be fixed to substrate bearing device 100.In another embodiment, it is disposed with described element
Substrate bearing device 100 can be molded by mould.In another embodiment, can be to the present invention's
Support member and guiding elements are controlled on width.In this embodiment, described element can be at panel unit
On the surface of 190, spiral rotating is to be inserted into the inside of substrate bearing device or to be pulled to the outside of substrate bearing device,
Thus control its width.The width of each described element can be controlled according to the viscosity of plating solution and surface tension,
So that the use of plating solution is minimum.
4. the element being installed on panel unit 190 to support and guiding the substrate of the present invention can be by such as chlorination
The synthetic resin such as polrvinyl chloride (CPVC), perfluoro alkoxy (PFA), polypropylene, polyethylene are formed.
Therefore, the scope of embodiments of the present invention is not limited to detailed description of the invention.Further, it will be appreciated that this description
Disclosed in embodiment include some modification, and be not limited to shape shown in the drawings.Therefore, the present invention's is exemplary
Embodiment is described in detail with reference to the drawings.The description of the present invention is exemplary, skill of the art
Art personnel are it will be appreciated that can realize this with other concrete forms in the case of not changing technology design or inner characteristic
Bright.
Claims (6)
1., for the substrate bearing device electroplating solaode, this substrate bearing device includes:
Accommodate the flat panel unit of substrate；
It is connected to the support unit of transfer device；
At least two clip mounting rod, described at least two clip mounting rod is mounted to vertically across described panel unit
And include inserting the upper end in the hole being limited in the bar fixed cell of upper end, and the lower end of described clip mounting rod is inserted
Enter to be limited in the hole in bottom bar fixed cell, and described upper end is connected to described upper end bar admittedly by spring member
Cell is to rotate in the hole when by the elastic force of described spring member；
The multiple clips being spaced apart from each other on described clip mounting rod, by the rotation of described clip mounting rod, described
Multiple clips have and form contacting of the clip closed mode of contact point and release and described substrate with described substrate
Clip open mode；And
Substrate housing region, these substrate housing regions are repeatedly disposed in described panel between described clip mounting rod
In the plane of unit, and there is substrate support and the substrate edges guiding piece on surface for supporting described substrate,
Wherein, described clip mounting rod relative to each other has with the described clip of the spaced apart installation of preset distance enclose
It is wound around spring shape several times around described bar, and one end of described clip is fixed by detachable clip fixed cell
To described clip mounting rod, the other end of described clip forms contact point respectively on two surfaces of described substrate.
Substrate bearing device the most according to claim 1, wherein, the front surface of described substrate bearing device and after
Surface has same shape, to be separately mounted on front surface and the rear surface of described panel unit by described substrate.
Substrate bearing device the most according to claim 1, wherein, for controlling the motion of described clip mounting rod
Handle be separately mounted in the upper end of described clip mounting rod, and described spring member is from described clip mounting rod
Upper end is closely wound around to described handle.
Substrate bearing device the most according to claim 1, wherein, described substrate support includes:
First central support, this first central support is for supporting the middle body of the rear surface of described substrate；
Second central support, this second central support for round described first central support support around
The part of the middle body of the rear surface of described substrate；And
Substrate edges support member, this substrate edges support member is for supporting the edge part of the described rear surface of described substrate
Point,
Wherein formed on the surface that the part contacting described substrate edges support member with this substrate of described substrate is corresponding
Contact point.
Substrate bearing device the most according to claim 1, wherein, described substrate edges guiding piece includes:
First edge guide member, this first edge guide member is for supporting the top edge of described substrate and lower limb also simultaneously
Guide the position of described substrate；And
Second edge guide member, this second edge guide member is for supporting the left hand edge of described substrate and right hand edge also simultaneously
Guide the position of described substrate.
Substrate bearing device the most according to claim 5, wherein, described first edge guide member and described
Two edge guide members include two layers, and the edge of wherein said substrate is arranged in the stayed surface between said two layer
On, and will not deviate from described substrate housing region by the position at the edge of substrate described in described guide layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120001483A KR101317133B1 (en) | 2012-01-05 | 2012-01-05 | Wafer substrate carrier apparatus for electroplating solar cells |
| KR10-2012-0001483 | 2012-01-05 | ||
| PCT/KR2013/000058 WO2013103263A1 (en) | 2012-01-05 | 2013-01-04 | Substrate carrier apparatus for electroplating of solar cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103748694A CN103748694A (en) | 2014-04-23 |
| CN103748694B true CN103748694B (en) | 2016-08-17 |
Family
ID=48745293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380002685.7A Expired - Fee Related CN103748694B (en) | 2012-01-05 | 2013-01-04 | Substrate bearing device for solaode plating |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101317133B1 (en) |
| CN (1) | CN103748694B (en) |
| WO (1) | WO2013103263A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101575068B1 (en) * | 2014-09-16 | 2015-12-07 | 주식회사 호진플라텍 | Plating equipment for solar cell substrate using light-induced plating and forward bias plating jointly |
| CN108133909A (en) * | 2017-11-29 | 2018-06-08 | 北京创昱科技有限公司 | A kind of substrate holding apparatus and the vertical producing line equipment of PVD for including it |
| US11598018B2 (en) * | 2018-03-30 | 2023-03-07 | Sunpower Corporation | Dual wafer plating fixture for a continuous plating line |
| CN112098688B (en) * | 2020-09-25 | 2023-04-14 | 苏州富强科技有限公司 | Carrier for battery detection |
| CN112831822B (en) * | 2020-12-30 | 2021-12-17 | 广东成功自动化设备有限公司 | Device for improving electroplating uniformity of VCP electroplating line |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87100995A (en) * | 1986-02-28 | 1988-03-16 | 舍林股份公司 | The long frame and the annex of mounted and removable electroplated printed circuit board and various wiring boards |
| US5456814A (en) * | 1993-07-01 | 1995-10-10 | Metzka Gmbh | Contacting arrangement for a circuit board support assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0774477B2 (en) * | 1990-11-02 | 1995-08-09 | 栄電子工業株式会社 | Jig for electrolytic plating of printed wiring board and electrolytic plating method using the jig |
| JPH0617292A (en) * | 1992-07-03 | 1994-01-25 | Nec Toyama Ltd | Jig for electrodeposition coating |
| US20050145486A1 (en) * | 2004-01-07 | 2005-07-07 | Chung-Ho Chen | Clipping device of an electroplating base plate |
-
2012
- 2012-01-05 KR KR1020120001483A patent/KR101317133B1/en not_active IP Right Cessation
-
2013
- 2013-01-04 CN CN201380002685.7A patent/CN103748694B/en not_active Expired - Fee Related
- 2013-01-04 WO PCT/KR2013/000058 patent/WO2013103263A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87100995A (en) * | 1986-02-28 | 1988-03-16 | 舍林股份公司 | The long frame and the annex of mounted and removable electroplated printed circuit board and various wiring boards |
| US5456814A (en) * | 1993-07-01 | 1995-10-10 | Metzka Gmbh | Contacting arrangement for a circuit board support assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130080599A (en) | 2013-07-15 |
| WO2013103263A1 (en) | 2013-07-11 |
| CN103748694A (en) | 2014-04-23 |
| KR101317133B1 (en) | 2013-10-08 |
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