CN109263130A - A kind of manufacturing method of graphene alloy wire - Google Patents
A kind of manufacturing method of graphene alloy wire Download PDFInfo
- Publication number
- CN109263130A CN109263130A CN201811095976.6A CN201811095976A CN109263130A CN 109263130 A CN109263130 A CN 109263130A CN 201811095976 A CN201811095976 A CN 201811095976A CN 109263130 A CN109263130 A CN 109263130A
- Authority
- CN
- China
- Prior art keywords
- graphene
- line base
- manufacturing
- alloy wire
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B11/00—Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
- B30B11/22—Extrusion presses; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
A kind of manufacturing method of graphene alloy wire, comprising the following steps: transformer insulated paint is added in the graphite powder that purity is 99.99% or more, admixes and stir into slurry mix, the weight ratio of insulated paint and graphite powder is 5-40%；Slurry mix is poured into extruder cylinder, uses continuously extruded unit wire drawing to obtain graphene line base；Wire drawing process several times is carried out for graphene line base, the line footpath of graphene line base is made to be contracted to default specification；Graphene line base is cleaned, graphene line base surface impurity is removed；Graphene line base is sent into electrostatic spraying device, the graphene wire rod finished product that line footpath is 16-55 μm is obtained after graphene line base surface sprayed metal layer, baking-curing.Wire rod prepared by the present invention can not only have both good oxidation resistance, stretch line workability, PCT reliability and u-HAST reliability, and have excellent flexibility, electric conductivity, heat-conductive characteristic and low manufacturing cost.
Description
Technical field
The invention belongs to bonding wire technical field, specifically a kind of manufacturing method of graphene alloy wire.
Background technique
Bonding wire (Bonding wire) is that semi-conductor discrete device and integrated circuit (IC) packaging industry four greatly must bases
One of material (chip, frame, bonding wire, envelope material), as lead between chip and frame, realizes and stablizes, is reliable electrical
Connection, is widely used in semi-conductor discrete device (transistor, diode, triode, Light-emitting diode LED etc.) and integrated circuit
Encapsulation.
Bonding wire mainly has spun gold, filamentary silver, copper wire sial line several prods, gold thread according to material difference currently on the market
With its excellent antioxidant always in occupation of the critical positions of bonding wire, at present still in occupation of 70% or more the market share,
But with the continuous rise of gold market price in recent years, it have stimulated other kinds to the substitution of gold thread, be in progress preferably copper in recent years
Silk product, but there are still the too big two large problems points of antioxidant difference and hardness.Therefore, people transfer to develop another fine silver line,
Have both cheap, excellent electric conductivity and thermal conductivity using fine silver wire rod, and compared to the characteristics such as copper wires are softer, to
Make up the problem of improving gold thread and copper wires.
However, the interface of silver wire material and aluminium pad is easy production such as Ag2Al or Ag4Brittleness Jie's metallic compound such as Al, can be bad
Change the bond strength at silver wire material interface.If using silver alloy wire rod, after the harsh environment by failtests, very
It is easy to generate the chemical reaction such as corrosion with encapsulating material, and often has lamination (delamination between both surface
Delamination), inadequate so as to cause the binding force between silver alloy wire rod and encapsulating material, the problems such as causing line broken circuit
Point.
Therefore, it is necessary to a kind of low-resistivity, soft, the bonding wires with certain retractility, high reliability, can be in height
It holds encapsulation field to substitute gold thread, reduces packaging cost, and improve reliability.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of manufacturing methods of graphene alloy wire, have good anti-
Oxidability stretches line workability, PCT reliability and u-HAST reliability, and has excellent flexibility, electric conductivity, heat
Conductive performance and low manufacturing cost.
In order to solve the above-mentioned technical problem, the present invention takes following technical scheme:
A kind of manufacturing method of graphene alloy wire, comprising the following steps:
Transformer insulated paint is added in the graphite powder that purity is 99.99% or more, blending stirs into slurry mix, insulate
The weight ratio of paint and graphite powder is 5-40%；
Slurry mix is poured into extruder cylinder, uses continuously extruded unit wire drawing to obtain graphene line base；
Wire drawing process several times is carried out for graphene line base, the line footpath of graphene line base is made to be contracted to default specification；
Graphene line base is cleaned, graphene line base surface impurity is removed；
Graphene line base is sent into electrostatic spraying device, obtains line after graphene line base surface sprayed metal layer, baking-curing
The graphene wire rod finished product that diameter is 16-55 μm.
The granularity of the graphite powder is 50-150 mesh.
The metal layer of the spraying with a thickness of 10-50nm.
The spray deposit is at least one layer of.
The metal layer material is elemental metals material or alloy material, is beaten with electrostatic spraying, plating, chemical plating or 3D
The preparation of India side formula.
When the line base wire drawing process to graphene, the drawing in such a way that online annealing combines is stretched using multi-pass
It is cooled down and is lubricated using lotion in the process.
Acid solution is used when the cleaning, carries out washing drying after the completion of cleaning again.
The present invention, which prepares wire rod not only, to be had good oxidation resistance, stretches line workability, PCT reliability and u-HAST
Reliability, and there is excellent flexibility, electric conductivity, heat-conductive characteristic and low manufacturing cost.
Using Electrostatic Spray Technology technique, not only have can a coating obtain the good relatively thick coating of corrosion resistance,
And powdery paints is free of solvent, without three public hazards, improves labour health condition.More importantly electrostatic painting process is applicable in certainly
Dynamic flow line production, high-efficient, bronze end is recyclable, and utilization rate is high.
Detailed description of the invention
Attached drawing 1 is the diagrammatic cross-section of the present invention one layer of metal layer of spraying；
Attached drawing 2 is the diagrammatic cross-section of present invention spraying more metal layers.
Specific embodiment
To further understand the features of the present invention, technological means and specific purposes achieved, function, below with reference to
Present invention is further described in detail with specific embodiment for attached drawing.
Present invention discloses a kind of manufacturing methods of graphene alloy wire, comprising the following steps:
S1 transformer insulated paint is added in the graphite powder that purity is 99.99% or more, and blending stirs into slurry mix, absolutely
The weight ratio of edge paint and graphite powder is 5-40%, and the granularity of graphite powder is 50-150 mesh, which has centainly sticky
Degree.
S2 pours into slurry mix in extruder cylinder, uses continuously extruded unit wire drawing to obtain graphene line base.
S3 stretches the technology combined with online annealing using multi-pass for graphene line base, uses in drawing process
Lotion is cooled down and is lubricated, and gradually reduces line footpath through wire drawing several times, and the line footpath after the diminution made meets default specification.
S4 cleans wire rod using acid solution, it is therefore an objective to graphene wire surface degreasing clean, then washing drying.
Graphene line base is sent into electrostatic spraying device by S5, in the gold that graphene line base surface coating thickness is 10-50nm
Belong to layer, the graphene wire rod finished product that line footpath is 16-55 μm is obtained after baking-curing.The raw material powder particle wherein sprayed it is big
It is small by the way that preferably 30-120 mesh/mesh screen hole, shape is close to spherical shape more excellent.
Graphene alloy wire hardens caused by subsequent processing is removed because of bracing wire again, according to drawing standard spiral, confirms prolonging for line
Malleability and destructiveness confirm graphene alloy wire surface using microscope.To obtain qualified wire rod.
In addition, such as attached drawing 1, can only spray one layer of metal layer 20, the gold on 10 surface of graphene wire rod for metal layer
Belong to layer 20 to be made of elemental metals material gold, silver or copper.Or such as attached drawing 2,10 surface of graphene wire rod from inside to outside successively
Sprayed metal layer 31, metal layer 32 and metal layer 21, each metal layer are made of alloy material, such as spraying NiPdAu multilayer gold
Belong to.
It should be noted that these are only the preferred embodiment of the present invention, it is not intended to restrict the invention, although ginseng
According to embodiment, invention is explained in detail, for those skilled in the art, still can be to aforementioned reality
Technical solution documented by example is applied to modify or equivalent replacement of some of the technical features, but it is all in this hair
Within bright spirit and principle, any modification, equivalent replacement, improvement and so on should be included in protection scope of the present invention
Within.
Claims (7)
1. a kind of manufacturing method of graphene alloy wire, comprising the following steps:
Transformer insulated paint is added in the graphite powder that purity is 99.99% or more, blending stirs into slurry mix, insulate
The weight ratio of paint and graphite powder is 5-40%；
Slurry mix is poured into extruder cylinder, uses continuously extruded unit wire drawing to obtain graphene line base；
Wire drawing process several times is carried out for graphene line base, the line footpath of graphene line base is made to be contracted to default specification；
Graphene line base is cleaned, graphene line base surface impurity is removed；
Graphene line base is sent into electrostatic spraying device, obtains line after graphene line base surface sprayed metal layer, baking-curing
The graphene wire rod finished product that diameter is 16-55 μm.
2. the manufacturing method of graphene alloy wire according to claim 1, which is characterized in that the granularity of the graphite powder
For 50-150 mesh.
3. the manufacturing method of graphene alloy wire according to claim 2, which is characterized in that the metal layer of the spraying
With a thickness of 10-50nm.
4. the manufacturing method of graphene alloy wire according to claim 3, which is characterized in that the spray deposit is extremely
It is one layer few.
5. the manufacturing method of graphene alloy wire according to claim 4, which is characterized in that the metal layer material is
Elemental metals material or alloy material, with the preparation of electrostatic spraying, plating, chemical plating or 3D printing method.
6. the manufacturing method of graphene alloy wire according to claim 5, which is characterized in that described to graphene line base
When wire drawing process, stretched with online annealing combines in such a way that using multi-pass, in drawing process using lotion carry out it is cooling with
Lubrication.
7. the manufacturing method of graphene alloy wire according to claim 6, which is characterized in that using acid when the cleaning
Property solution, carry out washing drying again after the completion of cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811095976.6A CN109263130A (en) | 2018-09-19 | 2018-09-19 | A kind of manufacturing method of graphene alloy wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811095976.6A CN109263130A (en) | 2018-09-19 | 2018-09-19 | A kind of manufacturing method of graphene alloy wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109263130A true CN109263130A (en) | 2019-01-25 |
Family
ID=65197697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811095976.6A Pending CN109263130A (en) | 2018-09-19 | 2018-09-19 | A kind of manufacturing method of graphene alloy wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109263130A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102509724A (en) * | 2011-10-19 | 2012-06-20 | 广东佳博电子科技有限公司 | Copper-based bonding wire and preparation method thereof |
| CN104419843A (en) * | 2013-08-21 | 2015-03-18 | 吕传盛 | Electric heating-resistance silver-based double phase wires and production method thereof |
| CN105385112A (en) * | 2015-12-03 | 2016-03-09 | 三峡大学 | Conductive graphene wire and preparation method thereof |
| CN105838914A (en) * | 2016-04-16 | 2016-08-10 | 苏州思创源博电子科技有限公司 | Preparation method of silver-based contact material containing graphene |
| CN106128568A (en) * | 2016-07-14 | 2016-11-16 | 浙江万马股份有限公司 | A kind of cable conductor based on Graphene filling and preparation method thereof |
| CN106252319A (en) * | 2016-08-05 | 2016-12-21 | 徐高磊 | A kind of cuprio bonding wire and production technology thereof |
| CN106448799A (en) * | 2016-11-28 | 2017-02-22 | 西北有色金属研究院 | Preparation method for graphene-enhanced copper-niobium multi-core composite wire |
| CN106910549A (en) * | 2017-03-23 | 2017-06-30 | 福建甲子信息技术股份有限公司 | A kind of polytetrafluoroethylene (PTFE)/graphene wire and preparation method thereof |
-
2018
- 2018-09-19 CN CN201811095976.6A patent/CN109263130A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102509724A (en) * | 2011-10-19 | 2012-06-20 | 广东佳博电子科技有限公司 | Copper-based bonding wire and preparation method thereof |
| CN104419843A (en) * | 2013-08-21 | 2015-03-18 | 吕传盛 | Electric heating-resistance silver-based double phase wires and production method thereof |
| CN105385112A (en) * | 2015-12-03 | 2016-03-09 | 三峡大学 | Conductive graphene wire and preparation method thereof |
| CN105838914A (en) * | 2016-04-16 | 2016-08-10 | 苏州思创源博电子科技有限公司 | Preparation method of silver-based contact material containing graphene |
| CN106128568A (en) * | 2016-07-14 | 2016-11-16 | 浙江万马股份有限公司 | A kind of cable conductor based on Graphene filling and preparation method thereof |
| CN106252319A (en) * | 2016-08-05 | 2016-12-21 | 徐高磊 | A kind of cuprio bonding wire and production technology thereof |
| CN106448799A (en) * | 2016-11-28 | 2017-02-22 | 西北有色金属研究院 | Preparation method for graphene-enhanced copper-niobium multi-core composite wire |
| CN106910549A (en) * | 2017-03-23 | 2017-06-30 | 福建甲子信息技术股份有限公司 | A kind of polytetrafluoroethylene (PTFE)/graphene wire and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Soichi et al. | Low-temperature and low-pressure die bonding using thin Ag-flake and Ag-particle pastes for power devices | |
| CN107949447A (en) | The manufacture method of engagement copper thickener, the manufacture method of conjugant and semiconductor device | |
| JP6153077B2 (en) | Metal nanoparticle paste, bonding material containing the same, and semiconductor device using the same | |
| CN108122786A (en) | Microelectronic module with sinter bonded heat dissipation structures and method of making same | |
| CN101070461B (en) | Super-high heat-conductive diamond-copper composite package material and production method | |
| CN109070206A (en) | The engagement manufacturing method of copper thickener, the manufacturing method of conjugant and semiconductor device | |
| JP6303392B2 (en) | Silver paste, semiconductor device using the same, and method for producing silver paste | |
| JP6900148B2 (en) | Silver paste and semiconductor devices using it | |
| US20120073859A1 (en) | Polymer core wire | |
| CN105428335B (en) | A kind of bonding wire | |
| Lin et al. | Drawing liquid metal wires at room temperature | |
| US9245670B2 (en) | Reliable wire method | |
| JP6153076B2 (en) | Metal nanoparticle paste, bonding material containing the same, and semiconductor device using the same | |
| TW201207129A (en) | Cooper bonding wire used in encapsulation and manufacturing method thereof | |
| CN109263130A (en) | A kind of manufacturing method of graphene alloy wire | |
| JP6270241B2 (en) | Bonding material and semiconductor device using the same | |
| TW201204843A (en) | Bonding silver wire for packaging and manufacturing method thereof | |
| JP5733638B2 (en) | Bonding material and semiconductor device using the same, and wiring material and wiring for electronic element using the same | |
| US20230230950A1 (en) | Self-densifying nano-silver paste and a method of forming interconnect layer for high power electronics | |
| CN112745636A (en) | Polymer-based metal aerogel composite thermal interface material and preparation method thereof | |
| CN111653541A (en) | Iron-and platinum-plated double-plating bonding copper wire | |
| CN108573935A (en) | Semiconductor device and its manufacturing method | |
| WO2009090849A1 (en) | Method of wire bonding and structure including mounted electronic part | |
| Li et al. | Low temperature sintering of dendritic cu based pastes for power semiconductor device interconnection | |
| CN105671355B (en) | Low-cost alloy bonding wire and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190125 |
|
| RJ01 | Rejection of invention patent application after publication |