CN109243985A - Plain conductor broken string method and device for image sensor chip - Google Patents
Plain conductor broken string method and device for image sensor chip Download PDFInfo
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- CN109243985A CN109243985A CN201710560368.7A CN201710560368A CN109243985A CN 109243985 A CN109243985 A CN 109243985A CN 201710560368 A CN201710560368 A CN 201710560368A CN 109243985 A CN109243985 A CN 109243985A
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- 239000004020 conductor Substances 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 41
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 230000008569 process Effects 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract description 9
- 238000004806 packaging method and process Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 241001442589 Convoluta Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000009975 flexible effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000035479 physiological effects, processes and functions Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention proposes a kind of plain conductor broken string method and device for image sensor chip, first solder joint of plain conductor is electrically connected to the pad of image sensor chip by the way of heating ultrasonic bond, and the other end of plain conductor is truncated and is suspended on image sensor chip.Plain conductor broken string method and device for image sensor chip of the invention, the first solder joint for foring plain conductor is connected to the pad of image sensor chip, the other end is suspended on the encapsulating structure except image sensor chip, increase the encapsulation flexibility of image sensor chip, convenient for the positioning and assembly of chip and camera lens, the performance of camera module is improved, and also shortens process flow, product yield is improved, the cost of camera module is reduced.
Description
Technical field
The present invention relates to a kind of plain conductor broken string method and devices for image sensor chip.
Background technique
Imaging sensor is the sensor that can be experienced optical image information and convert thereof into usable output signal.Image
The visual range of human eye can be improved in sensor, makes it is seen that the microcosmos and macrocosm that naked eyes can not be seen, it is seen that
People temporarily can not the thing that occurs of the place of arrival, it is seen that various physics, chemical change process beyond naked eyes visual range, it is raw
Life, physiology, occurrence and development process of lesion, etc..Visual picture sensor is in the culture of people, sport, production, life and section
Play the role of in research very important.
In practical applications, imaging sensor is that the form of image taking sensor chip plays it and experiences optical image information
And convert thereof into the function of usable output signal.Image sensor chip is easy by external environment during the work time
Pollution, so needing to be packaged image sensor chip, is in image sensor chip under sealed environment, to avoid
Influence of the external environment to image sensor chip, to improve the performance and used life of image sensor chip.
Currently, the encapsulation of all image sensor chips using high clean environment, high pollution complicated process equipment and
The production line of material encapsulates, and mainly includes that chip on board encapsulates (COB: Chip On Board), wafer-level packaging (CSP:Chip
Scale Package) and flip-chip envelope turn (FC:Flip Chip).
In the image sensor chip packaging technology using plain conductor bonding, usually first image sensor chip is consolidated
In brilliant (such as adherency) to pinboard, bonding bonding wire is then carried out, the first end of plain conductor is connected to imaging sensor core
On the pad of piece, second end is connected on pinboard, is achieved in the electrical connection of image sensor chip and pinboard, then
The image sensor chip after encapsulation is connected on circuit board by lead on pinboard or tin ball again.
Existing packaging method be easy to cause the configuration flexibility after encapsulation poor, and the subsequent assembly precision of camera module is wanted
Ask high, the relative position of camera lens and image sensor chip is difficult to control the performance for influencing camera module；And due to existing
The process of method is longer, and packaging efficiency is lower, and the image sensor chip long period is caused to be exposed in air, needs multiple
Detection and cleaning, reduce yields, increase the cost of camera module.Especially, some plain conductor second ends are used
The image sensor chip that other techniques are attached needs a kind of new packaging method and device, so that the first end of conducting wire
It is connected to the pad of image sensor chip, second end is suspended on except image sensor chip.
Summary of the invention
The plain conductor that the purpose of the present invention is to provide a kind of for image sensor chip breaks method and device,
The flexibility for increasing chip-packaging structure improves the performance of camera module convenient for the positioning and assembly of chip and camera lens, shortens
Process flow improves packaging efficiency and product yield, reduces the cost of camera module.
Based on considerations above, one aspect of the present invention proposes that a kind of plain conductor for image sensor chip breaks
Method, the first solder joint of plain conductor are electrically connected to the pad of image sensor chip by the way of heating ultrasonic bond, gold
The other end for belonging to conducting wire is truncated and is suspended on image sensor chip.
Preferably, chopper, wire cutter, the plain conductor extended along chopper inner hole are provided；The chopper and the wire cutter
Cutting edge it is opposite, the angle of the plain conductor and the wire cutter is 45-135 degree；The chopper is opposite with the wire cutter
Extruding breaks plain conductor；Alternatively, the mode that wire cutter opposing metallic conducting wire does reciprocating cutting cuts off plain conductor；Or
Wire cutter opposing metallic conducting wire does extruding or reciprocating cutting mutually, squeezes or cut open the above depth of a quarter for plain conductor
Afterwards, mobile chopper breaks plain conductor.
Preferably, chopper, wire cutter, the plain conductor extended along chopper inner hole are provided；The cutting edge of the wire cutter has
Plain conductor is placed in the cutting edge bending section of the wire cutter by bending section, and mobile chopper or mobile wire cutter are so that plain conductor
It is cut off by cutting edge bending section.
Preferably, the wire cutter is sickle shaped, and the plain conductor is located at inner edge.
Preferably, the quantity of the falculate wire cutter is more than or equal to the number of pads on one side of the chip, guarantees
Each pad has corresponding wire cutter.
Preferably, air-flow is provided above described image sensor chip, reduction is fallen on image sensor chip
Dust number.
Preferably, the plain conductor has along the photosurface direction of image sensor chip is more than or equal to 5 degree upwards
Radian；Plain conductor extends to chip exterior again, and plain conductor is made to have elasticity.
Preferably, the two sides for defining image sensor chip pad are left and right sides；Pressure device is provided in imaging sensor
The fixed chip is pressed against in the front and back side of chip, and/or in chip bottom using the fixed chip of suction type.
Another aspect of the present invention proposes a kind of plain conductor break wire device for image sensor chip, including splits
Knife, wire cutter, the plain conductor extend along chopper inner hole；First solder joint of plain conductor is electric by the way of heating ultrasonic bond
Be connected to after the pad of image sensor chip, and the chopper and the wire cutter cooperate with by the other end of plain conductor
It is truncated and is suspended on image sensor chip.
Preferably, the chopper is opposite with the cutting edge of the wire cutter, the angle of the plain conductor and the wire cutter
For 45-135 degree.
Preferably, the cutting edge of the wire cutter has bending section, and the cutting edge that the plain conductor is placed in the wire cutter is curved
Pars convoluta.
Preferably, the wire cutter is sickle shaped, and the plain conductor is located at inner edge.
Preferably, the quantity of the falculate wire cutter is more than or equal to the number of pads on one side of the chip, guarantees
Each pad has corresponding wire cutter.
The plain conductor for image sensor chip of the invention breaks method and device, passes through the of plain conductor
One solder joint is electrically connected to the pad of image sensor chip, the other end truncation of plain conductor by the way of heating ultrasonic bond
And it is suspended on image sensor chip, the first solder joint for foring plain conductor is connected to the pad of image sensor chip, separately
One end is suspended on the encapsulating structure except image sensor chip, increases the encapsulation flexibility of image sensor chip, is convenient for
The positioning and assembly of chip and camera lens, improve the performance of camera module, and also shorten process flow, improve product
Yield reduces the cost of camera module.
Detailed description of the invention
By Figure of description and then it is used to illustrate the specific reality of the certain principles of the present invention together with Figure of description
Mode is applied, other feature possessed by the present invention and advantage will be apparent or more specifically illustrated.
Fig. 1 is the schematic diagram according to the plain conductor of one embodiment of the invention broken string method；
Fig. 2 is the schematic diagram according to the plain conductor of another embodiment of the present invention broken string method；
Fig. 3 is the cross-sectional view of the line A-A along Fig. 2；
Fig. 4 is the schematic diagram according to the plain conductor of another embodiment of the present invention broken string method.
Specific embodiment
To solve above-mentioned the problems of the prior art, the present invention provides a kind of plain conductor for image sensor chip
Break method and device, is electrically connected to image sensing in such a way that the first solder joint of plain conductor is using heating ultrasonic bond
The other end of the pad of device chip, plain conductor is truncated and is suspended on image sensor chip, forms the first of plain conductor
Solder joint is connected to the pad of image sensor chip, and the other end is suspended on the encapsulating structure except image sensor chip, increases
The encapsulation flexibility of image sensor chip convenient for the positioning and assembly of chip and camera lens improves the property of camera module
Can, and process flow is also shortened, product yield is improved, the cost of camera module is reduced.
In the following detailed description of the preferred embodiment, reference is constituted to the appended attached drawing of present invention a part.Institute
Attached attached drawing, which has been illustrated by way of example, can be realized specific embodiment.Exemplary embodiment is not intended to
Exhaustive all embodiments according to the present invention.It is appreciated that without departing from the scope of the present invention, can use other
Embodiment can also carry out the modification of structure or logic.Therefore, it is below specific descriptions and it is unrestricted, and this
The range of invention is defined by the claims appended hereto.
One aspect of the present invention proposes a kind of plain conductor broken string method for image sensor chip, plain conductor
The first solder joint the pad of image sensor chip, the other end of plain conductor are electrically connected to by the way of heating ultrasonic bond
It is truncated and is suspended on image sensor chip, is connected to image sensor chip so as to form the first solder joint of plain conductor
Pad, the other end are suspended on the encapsulating structure except image sensor chip, and the encapsulation for increasing image sensor chip is flexible
Property, convenient for the positioning and assembly of chip and camera lens, the performance of camera module is improved, and also shorten process flow, mentioned
High product yield, reduces the cost of camera module.
Fig. 1 shows the one embodiment of the present invention for the plain conductor broken string method of image sensor chip.Image passes
Pad 111 is set on the photosurface of sensor chip 110, provides chopper 130, plain conductor 120 prolongs along the inner hole 132 of chopper 130
It stretches, the first solder joint of plain conductor 120 is electrically connected to the pad of image sensor chip 110 by the way of heating ultrasonic bond
111, wire cutter 140 is provided, chopper 130 is opposite with the cutting edge 141 of wire cutter 140, the folder of plain conductor 120 and wire cutter 140
Angle α is 45-135 degree；Chopper 130 breaks plain conductor 120 with 140 opposing compression of wire cutter, alternatively, wire cutter 140 is opposite
The mode that plain conductor 120 does reciprocating cutting cuts off plain conductor 120；Alternatively, 140 opposing metallic conducting wire 120 of wire cutter is done
Extruding or reciprocating cutting mutually, after plain conductor 120 squeezes or cuts the above depth of a quarter open, mobile chopper 130 will be golden
Belong to conducting wire 120 to break, so that the other end of plain conductor 120 is truncated and is suspended on image sensor chip 120.Preferably, break
In line process and after broken string, air-flow is provided above image sensor chip 110, reduction falls to image sensor chip
Dust number on 110.
Fig. 2, Fig. 3 show another embodiment of the present invention for the plain conductor broken string method of image sensor chip.Figure
As sensor chip 210 photosurface on be arranged pad 211, chopper 230, inner hole of the plain conductor 220 along chopper 230 are provided
232 extend, and the first solder joint of plain conductor 220 is electrically connected to image sensor chip 210 by the way of heating ultrasonic bond
Pad 211, provide wire cutter 240, the cutting edge of wire cutter 240 has bending section 241, plain conductor 220 is placed in described disconnected
The cutting edge bending section 241 of line knife 240, as shown in figure 3, wire cutter 240 is sickle shaped, plain conductor 220 is located at inner edge 241,
Mobile chopper 230 or mobile wire cutter 240 are so that plain conductor is cut off by cutting edge bending section 241, so that plain conductor 220 is another
One end is truncated and is suspended on image sensor chip 210.Preferably, during broken string and after broken string, in imaging sensor
Air-flow is provided above chip 210, reduces the dust number fallen on image sensor chip 210.
As shown in Figure 4, it is preferred that the quantity of falculate wire cutter 240 is more than or equal to the pad on one side of chip 210
211 quantity guarantees that each pad 211 has corresponding wire cutter 240, to cut off more plain conductors 220 simultaneously, improves
Packaging efficiency.
Preferably, plain conductor 220 has the arc for being more than or equal to 5 degree upwards along the photosurface direction of image sensor chip
Degree, such as angle β in Fig. 4；Plain conductor 220 extends to chip exterior again, and plain conductor 220 is made to have elasticity.
Preferably, the two sides for defining image sensor chip pad 211 are left and right sides；There is provided pressure device (not shown) in
It is pressed against fixed chip 210, and/or is fixed in 210 bottom of chip using suction type in the front and back side of image sensor chip 210
Chip 210.
Another aspect of the present invention proposes a kind of plain conductor break wire device for image sensor chip, including splits
Knife, wire cutter, plain conductor extend along chopper inner hole；First solder joint of plain conductor electricity by the way of heating ultrasonic bond connects
It is connected to after the pad of image sensor chip, chopper cooperates with wire cutter the other end of plain conductor to be truncated and be suspended on
Image sensor chip is connected to the pad of image sensor chip, the other end so as to form the first solder joint of plain conductor
The encapsulating structure being suspended on except image sensor chip increases the encapsulation flexibility of image sensor chip, is convenient for chip
With the positioning and assembly of camera lens, the performance of camera module is improved, and also shortens process flow, it is good to improve product
Rate reduces the cost of camera module.
In one embodiment as shown in Figure 1, the cutting edge 141 of chopper 130 and wire cutter 140 is opposite, plain conductor 120 with
The angle of wire cutter 140 is 45-135 degree.
In another embodiment as shown in Figure 2 and Figure 3, the cutting edge of wire cutter 240 has bending section 241, plain conductor 220
It is placed in the cutting edge bending section 241 of the wire cutter 240.Preferably, wire cutter 240 is sickle shaped, and plain conductor 220 is located at inner edge
At 241.
As shown in Figure 4, it is preferred that the quantity of falculate wire cutter 240 is more than or equal to the number of pad 211 on one side of chip
Amount, guarantees that each pad 211 has corresponding wire cutter 240.
The plain conductor for image sensor chip of the invention breaks method and device, passes through the of plain conductor
One solder joint is electrically connected to the pad of image sensor chip, the other end truncation of plain conductor by the way of heating ultrasonic bond
And it is suspended on image sensor chip, the first solder joint for foring plain conductor is connected to the pad of image sensor chip, separately
One end is suspended on the encapsulating structure except image sensor chip, increases the encapsulation flexibility of image sensor chip, is convenient for
The positioning and assembly of chip and camera lens, improve the performance of camera module, and also shorten process flow, improve product
Yield reduces the cost of camera module.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
How from the point of view of, the present embodiments are to be considered as illustrative and not restrictive.In addition, it will be evident that one word of " comprising " not
Exclude other elements and steps, and wording "one" be not excluded for plural number.The multiple element stated in device claim can also
To be implemented by one element.The first, the second equal words are used to indicate names, and are not indicated any particular order.
Claims (13)
- A kind of method 1. plain conductor for image sensor chip breaks, which is characterized in thatFirst solder joint of plain conductor is electrically connected to the pad of image sensor chip, metal by the way of heating ultrasonic bond The other end of conducting wire is truncated and is suspended on image sensor chip.
- The method 2. plain conductor according to claim 1 for image sensor chip breaks, which is characterized in thatChopper, wire cutter, the plain conductor extended along chopper inner hole are provided；The chopper is opposite with the cutting edge of the wire cutter, and the angle of the plain conductor and the wire cutter is 45-135 degree；The chopper breaks plain conductor with the wire cutter opposing compression；Alternatively, wire cutter opposing metallic conducting wire is done back and forth The mode of cutting cuts off plain conductor；Or wire cutter opposing metallic conducting wire does extruding or reciprocating cutting mutually, and metal is led After line squeezes or cuts the above depth of a quarter open, mobile chopper breaks plain conductor.
- The method 3. plain conductor according to claim 1 for image sensor chip breaks, which is characterized in that provide Chopper, wire cutter, the plain conductor extended along chopper inner hole；The cutting edge of the wire cutter has bending section, and plain conductor is set In the cutting edge bending section of the wire cutter, mobile chopper or mobile wire cutter are so that plain conductor is cut off by cutting edge bending section.
- The method 4. plain conductor according to claim 3 for image sensor chip breaks, which is characterized in that described Wire cutter is sickle shaped, and the plain conductor is located at inner edge.
- The method 5. plain conductor according to claim 4 for image sensor chip breaks, which is characterized in that described The quantity of falculate wire cutter is more than or equal to the number of pads on one side of the chip, and guaranteeing each pad has corresponding break Line knife.
- The method 6. plain conductor according to claim 1 for image sensor chip breaks, which is characterized in thatAir-flow is provided above described image sensor chip, reduces the dust number fallen on image sensor chip.
- The method 7. plain conductor according to claim 1 for image sensor chip breaks, which is characterized in thatThe plain conductor has the radian for being more than or equal to 5 degree upwards along the photosurface direction of image sensor chip；Metal is led Line extends to chip exterior again, and plain conductor is made to have elasticity.
- The method 8. plain conductor according to claim 1 for image sensor chip breaks, which is characterized in thatThe two sides for defining image sensor chip pad are left and right sides；Pressure device is provided and is pressed against the fixed chip in the front and back side of image sensor chip, and/or is used in chip bottom The fixed chip of suction type.
- 9. a kind of plain conductor break wire device for image sensor chip, which is characterized in thatIncluding chopper, wire cutter, the plain conductor extends along chopper inner hole；After first solder joint of plain conductor is electrically connected to the pad of image sensor chip by the way of heating ultrasonic bond, The chopper and the wire cutter cooperate to be truncated the other end of plain conductor and be suspended on image sensor chip.
- 10. the plain conductor break wire device according to claim 9 for image sensor chip, which is characterized in thatThe chopper is opposite with the cutting edge of the wire cutter, and the angle of the plain conductor and the wire cutter is 45-135 degree.
- 11. the plain conductor break wire device according to claim 9 for image sensor chip, which is characterized in that institute The cutting edge for stating wire cutter has bending section, and the plain conductor is placed in the cutting edge bending section of the wire cutter.
- 12. the plain conductor break wire device according to claim 11 for image sensor chip, which is characterized in that institute Stating wire cutter is sickle shaped, and the plain conductor is located at inner edge.
- 13. the plain conductor break wire device according to claim 12 for image sensor chip, which is characterized in that institute State falculate wire cutter quantity be more than or equal to the chip one side number of pads, guarantee each pad and have and is corresponding Wire cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710560368.7A CN109243985A (en) | 2017-07-11 | 2017-07-11 | Plain conductor broken string method and device for image sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710560368.7A CN109243985A (en) | 2017-07-11 | 2017-07-11 | Plain conductor broken string method and device for image sensor chip |
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| CN109243985A true CN109243985A (en) | 2019-01-18 |
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| CN201710560368.7A Pending CN109243985A (en) | 2017-07-11 | 2017-07-11 | Plain conductor broken string method and device for image sensor chip |
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| CN105097740A (en) * | 2015-08-18 | 2015-11-25 | 嘉兴景焱智能装备技术有限公司 | Chip wire welding jig, leading-out method for chip lead and chip product |
| CN207199572U (en) * | 2017-07-11 | 2018-04-06 | 格科微电子（上海）有限公司 | Plain conductor break wire device for image sensor chip |
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