CN105845697A - Wire bonding method and device for image sensor chip, and packaging system - Google Patents

Abstract

The invention provides a wire bonding method and device for an image sensor chip, and a packaging system. The method comprises the steps: firstly placing the image sensor chip on a workbench, wherein a pressure welding point is disposed beside the image sensor chip; secondly enabling a first end of a wire to be connected to a bonding pad of the image sensor chip through bonding head, and enabling a second end of the wire to contact with the pressure welding point; thirdly enabling the second end of the wire to be separated from the pressure welding point, and enabling the first end of the wire to be connected to the bonding pad of the image sensor chip, wherein the second end is suspended in a packaging structure which is located outside the image sensor chip, thereby improving the packaging flexibility of the image sensor chip, facilitating the positioning and assembly of a chip and a lens, improving the performance of a camera lens module, shortening the technological process, improving the packaging efficiency and yield, and reducing the cost of the camera lens module.

Description

Wire bonding method, bonding apparatus and the package system of image sensor chip

Technical field

The present invention relates to technical field of semiconductors, particularly to wire bonding method, bonding apparatus and the package system of a kind of image sensor chip.

Background technology

Imageing sensor is can to experience optical image information and convert thereof into the sensor of usable output signal.Imageing sensor can improve the visual range of human eye, make it is seen that the microcosmos that cannot see of naked eyes and macrocosm, see that people temporarily cannot arrive place's occurrence, see the various physics beyond naked eyes visual range, chemical change process, life, physiology, the generation evolution of pathological changes, etc..Visual picture sensor people culture, physical culture, produce, live and scientific research is played very important effect.

In actual applications, imageing sensor is that the form of image taking sensor chip plays it and experiences optical image information and convert thereof into the function of usable output signal.Image sensor chip is easily subject to the pollution of external environment in the course of the work, so needing image sensor chip is packaged, image sensor chip is made to be under sealed environment, thus avoid the external environment impact on image sensor chip, thus improve the performance and used life of image sensor chip.

At present, the encapsulation of all of image sensor chip uses the production line encapsulation of high clean environment, high pollution complicated process equipment and material, mainly includes that chip on board encapsulation (COB: Chip On Board), wafer-level packaging (CSP:Chip Scale Package) and flip-chip envelope turn (FC:Flip Chip).

In the image sensor chip packaging technology using plain conductor bonding, the most first by image sensor chip die bond (such as adhering to) to keyset, then carry out being bonded bonding wire, first end of plain conductor is connected on the pad of image sensor chip, second end is connected on keyset, it is achieved in the electrical connection of image sensor chip and keyset, the most again the image sensor chip after encapsulation is connected on circuit board by the lead-in wire on keyset or stannum ball.

The configuration flexibility that existing wire bonding method easily causes after encapsulation is poor, and the follow-up assembly precision of photographic head module requires height, and camera lens is difficult to control to affect the performance of photographic head module with the relative position of image sensor chip；And owing to the most methodical flow process is longer, packaging efficiency is relatively low, cause the image sensor chip long period to be exposed in air, need detection repeatedly and cleaning, reduce yields, increase the cost of photographic head module.Especially, the image sensor chip that other techniques are attached is used for some plain conductor second ends, needing a kind of new bonding method and device, so that the first end of wire is connected to the pad of image sensor chip, the second end is suspended on outside image sensor chip.

Summary of the invention

It is an object of the invention to provide wire bonding method, bonding apparatus and the package system of a kind of image sensor chip, to increase the motility of chip-packaging structure, it is easy to chip and the location of camera lens and assembling, improve the performance of photographic head module, shortened process, improve packaging efficiency and product yield, reduce the cost of photographic head module.

For achieving the above object, technical scheme is as follows:

One aspect of the present invention provides a kind of wire bonding method of image sensor chip, comprises the steps: to be placed on workbench image sensor chip, is provided with pressure welding point near described image sensor chip；By bonding head, the first end of wire is connected to the pad of described image sensor chip, and by the second end in contact of wire in described pressure welding point；Second end of described wire departs from described pressure welding point.

Preferably, by bonding head, the first end of wire is connected to the first bond strength the pad of described image sensor chip, and the second end of wire is connected to described pressure welding point with the second bond strength；The motion of described pressure welding point the most described image sensor chip is so that the second end of described wire departs from described pressure welding point.

Preferably, by bonding head, the first end of wire is connected to the first bond strength the pad of described image sensor chip, and the second end of wire is connected to described pressure welding point with the second bond strength；Arranging broken string mechanism near the second end of described wire to exert a force with the second end to described wire, the second end of described wire departs from from described pressure welding point.

Preferably, described pressure welding point is positioned on substrate or table top, and the surface of described substrate or table top includes the bond strength bond strength less than described second area with described wire of first area adjacent one another are and second area, described first area and described wire；When the second terminal link of described wire closes, described first area is low with the bond strength of described second end, it is simple to the second end of wire departs from described pressure welding point；Described second area is strong with the bond strength of described second end, it is simple to form line tail in bonding process continuously.

Preferably, change the structure of described bonding head so that the bond strength of pressure welding point described in the two port of described wire is less than the line tail bond strength to pressure welding point, it is simple to the second end of wire departs from described pressure welding point, simultaneously facilitate formation line tail in continuous bonding process.

Preferably, the mode of the structure changing described bonding head is: the end face outside of described bonding head is higher than interior hole end surface.

Preferably, described image sensor chip is fixed on workbench by adsorbing mechanism or clamping device.

Preferably, by changing bonding pressure, temperature, ultrasonic energy and the structure of bonding head, pressure welding point material, described first bond strength and the size of described second bond strength are regulated.

Preferably, the second bond strength of described wire is less than described first bond strength.

Preferably, the most described image sensor chip of described pressure welding point moves, and produces stress in described wire, and owing to the second bond strength of described wire is less than described first bond strength, described stress makes the second end of described wire depart from described pressure welding point.

Preferably, in certain limit, regulate described second bond strength, control described broken string mechanism, near the second end of described wire, the second end of described wire is applied active force, make the second end of described wire depart from described pressure welding point.

Preferably, described first area is steel, copper or aluminum, and described second area is gold, silver, nickel or palladium.

Another aspect of the present invention provides the wire bonding apparatus of a kind of image sensor chip, including: workbench, it is used for placing image sensor chip；Pressure welding point, is arranged near described image sensor chip；Bonding head, for the first end of wire is connected to the pad of described image sensor chip, and departs from described pressure welding point by the second end in contact of wire in described pressure welding point, the second end of the most described wire.

Preferably, described wire bonding apparatus farther includes the motion being connected with described pressure welding point, is used for making the most described image sensor chip of described pressure welding point move, so that the second end of described wire departs from described pressure welding point.

Preferably, described wire bonding apparatus farther includes the broken string mechanism being arranged near the second end of described wire, for the second end force to described wire, so that the second end of described wire departs from from described pressure welding point.

Preferably, described wire bonding apparatus farther includes the substrate for carrying described pressure welding point or table top, the surface of described substrate or table top includes the bond strength bond strength less than described second area with described wire of first area adjacent one another are and second area, described first area and described wire；When the second terminal link of described wire closes, described first area is low with the bond strength of described second end, it is simple to the second end of wire departs from described pressure welding point；Described second area is strong with the bond strength of described second end, it is simple to form line tail in bonding process continuously.

Preferably, the end face outside of described bonding head is higher than interior hole end surface, make the bond strength of pressure welding point described in the two port of described wire less than the line tail bond strength to pressure welding point, it is simple to the second end of wire departs from described pressure welding point, simultaneously facilitate formation line tail in continuous bonding process.

Preferably, described first area is steel, copper or aluminum, and described second area is gold, silver, nickel or palladium.

Another aspect of the present invention provides automatization's package system of a kind of image sensor chip, including above-mentioned wire bonding apparatus.

Compared with prior art, technical scheme has the advantage that

Wire bonding method, bonding apparatus and the package system of the image sensor chip of the present invention, is first placed in image sensor chip on workbench, is provided with pressure welding point near described image sensor chip；Then by bonding head, the first end of wire is connected to the pad of described image sensor chip, and by the second end in contact of wire in described pressure welding point；Second end of the most described wire departs from described pressure welding point, the first end forming wire is connected to the pad of image sensor chip, second end is suspended on the encapsulating structure outside image sensor chip, thus add the encapsulation motility of image sensor chip, it is easy to chip and the location of camera lens and assembling, improves the performance of photographic head module, and also shorten technological process, improve packaging efficiency and product yield, reduce the cost of photographic head module.

Accompanying drawing explanation

By Figure of description and being used for illustrating the detailed description of the invention of some principle of the present invention subsequently together with Figure of description, further feature and advantage that the present invention is had will be clear from or more specifically be illustrated.Wherein:

Fig. 1-Fig. 3 is the process schematic of the wire bonding method of the image sensor chip of according to embodiments of the present invention 1；

Fig. 4 is the structural representation of the wire bonding apparatus of the image sensor chip of according to embodiments of the present invention 1；

Fig. 5-Fig. 7 is the process schematic of the wire bonding method of the image sensor chip of according to embodiments of the present invention 2；

Fig. 8 is the structural representation of the wire bonding apparatus of the image sensor chip of according to embodiments of the present invention 2；

Fig. 9 is the partial schematic diagram of the wire bonding apparatus of the image sensor chip of according to embodiments of the present invention 3；

Figure 10 is the structural representation of the bonding head of the wire bonding apparatus of conventional images sensor chip；

Figure 11 is the structural representation of the bonding head of the wire bonding apparatus of the image sensor chip of according to embodiments of the present invention 4;

Figure 12 is the view after wire the second terminal link conjunction of the image sensor chip of according to embodiments of the present invention 4.

Detailed description of the invention

For solving above-mentioned technical problem, the present invention provides wire bonding method, bonding apparatus and the package system of a kind of image sensor chip, is first placed on workbench by image sensor chip, is provided with pressure welding point near described image sensor chip；Then by bonding head, the first end of wire is connected to the pad of described image sensor chip, and by the second end in contact of wire in described pressure welding point；Second end of the most described wire departs from described pressure welding point, the first end forming wire is connected to the pad of image sensor chip, second end is suspended on the encapsulating structure outside image sensor chip, thus add the encapsulation motility of image sensor chip, it is easy to chip and the location of camera lens and assembling, improves the performance of photographic head module, and also shorten technological process, improve product yield, reduce the cost of photographic head module.

Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with the accompanying drawings, the specific embodiment of the present invention is described in detail.

Embodiment 1

Fig. 4 illustrates the wire bonding apparatus of the image sensor chip of according to embodiments of the present invention 1, and this wire bonding apparatus includes workbench 101, is used for placing image sensor chip 102；Pressure welding point 103, is arranged near image sensor chip 102；Bonding head 104, it is preferably provided at above workbench 101, for the first end 151 of wire 105 to be connected to the pad of image sensor chip 102 with the first bond strength, and the second end 152 of wire 105 is connected to pressure welding point 103(with the second bond strength sees Fig. 1).

In the present embodiment, pressure welding point is positioned on substrate or table top 106.Wire bonding apparatus also includes the motion (not shown) being connected with substrate or table top 106, for making substrate or table top 106 relative image sensor chip 102 move, thus drive pressure welding point 103 relative image sensor chip 102 to move, so that the second end 152 of wire 105 departs from pressure welding point 103(and sees Fig. 2), thus the first end 151 forming wire 105 is connected to the pad of image sensor chip 102, the second end 152 is suspended on the encapsulating structure (seeing Fig. 3) outside image sensor chip 102.

In the present embodiment, motion includes the guide rail extended along image sensor chip 102 place plane, so that pressure welding point 103 moves a certain distance along image sensor chip 102 place plane towards any direction, such as, move a certain distance along the direction of arrow shown in Fig. 2 away from image sensor chip 102, so that the second end 152 of wire 105 departs from from pressure welding point 103.

In other preferred embodiments unshowned, motion can also include the guide rail that vertical image sensor chip 102 place plane extends, so that pressure welding point 103 is perpendicular to image sensor chip 102 place planar movement certain distance, such as, relative image sensor chip 102 place plane declines certain altitude, so that the second end 152 of wire 105 departs from from pressure welding point 103.

In other preferred embodiments unshowned, motion can also include the bearing being connected with substrate or table top 106, so that pressure welding point 103 rotates to an angle in the plane of image sensor chip 102 place, or relative image sensor chip 102 place planar inverted certain angle, so that the second end 152 of wire 105 departs from from pressure welding point 103.

In the present embodiment, wire bonding apparatus also includes being bonded energy supply unit 107, for providing bonding energy for bonding head 104, first end 151 of wire 105 is connected to the pad of image sensor chip 102 will pass through bonding head 104 with the first bond strength, the second end 152 of wire 105 is connected to pressure welding point 103 with the second bond strength.Additionally, bonding head 104 itself can cut off wire 105 after the second end 152 of wire 105 is connected to pressure welding point 103 and form line tail, therefore, it is not required to additionally arrange wire cutting blade.

In the present embodiment, bonding energy supply unit 107 includes pressure control module (not shown), such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit 107 also includes temperature control modules (not shown), such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit 107 also includes ultrasound control module (not shown), such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit 107, bonding pressure, temperature, ultrasonic energy can be changed, in addition, also by changing the parameters such as the structure of bonding head 104 and the material of pressure welding point 103, surface roughness, regulate the first bond strength and the size of the second bond strength, so that the second bond strength is less than the first bond strength.When pressure welding point 103 relative image sensor chip 102 moves, stress is produced in wire 105, owing to the second bond strength of wire 105 is less than the first bond strength, this stress makes the second end 152 of wire 105 depart from pressure welding point 103, thus the first end 151 forming wire 105 is connected to the pad of image sensor chip 102, the second end 152 is suspended on the encapsulating structure outside image sensor chip 102.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fixed mechanism, for image sensor chip 102 being fixed on workbench 101 surface, to prevent from causing defect or damage owing to image sensor chip 102 offsets in wire 105 bonding process or in pressure welding point 103 motor process.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip 102 periphery, in order to is clamped in image sensor chip 102 edge, thus is fixed on the surface of workbench 101 by image sensor chip 102；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip 102, such as by vac sorb at image sensor chip 102 back side, thus be fixed on the surface of workbench 101 by image sensor chip 102.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes positioning detection mechanism, is used for positioning image sensor chip 102 and bonding head 104, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes being arranged at the image sensor semiconductor device above bonding head 104, for obtaining the image information of image sensor chip 102 and bonding head 104；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of the image sensor chip 102 and bonding head 104 obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes wire feed mechanism, for transmitting wire 105 to bonding head 104.Described wire 105 can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fetching/laying machine structure, is used for picking and placeing and transmitted image sensor chip 102.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip 102 place it in the appointment position of workbench 101.

Seeing Fig. 1-Fig. 4, the present embodiment also provides for a kind of wire bonding method of image sensor chip, comprises the steps: to be placed on workbench 101 image sensor chip 102, is provided with pressure welding point 103 near this image sensor chip 102；By bonding head 104, first end 151 of wire 105 is connected to the first bond strength the pad of image sensor chip 102, and the second end 152 of wire 105 is connected to pressure welding point 103 with the second bond strength.

In the present embodiment, pressure welding point 103 is positioned on substrate or table top 106.The wire bonding method of the present invention also includes: make substrate or table top 106 relative image sensor chip 102 move by the motion being connected with substrate or table top 106, thus drive pressure welding point 103 relative image sensor chip 102 to move, so that the second end 152 of wire 105 departs from pressure welding point 103, thus the first end 151 forming wire 105 is connected to the pad of image sensor chip 102, the second end 152 is suspended on the encapsulating structure outside image sensor chip 102.

In the present embodiment, motion includes the guide rail extended along image sensor chip 102 place plane, so that pressure welding point 103 moves a certain distance along image sensor chip 102 place plane towards any direction, such as, move a certain distance along the direction of arrow shown in Fig. 2 away from image sensor chip 102, so that the second end 152 of wire 105 departs from from pressure welding point 103.

In other preferred embodiments unshowned, motion can also include the guide rail that vertical image sensor chip 102 place plane extends, so that pressure welding point 103 is perpendicular to image sensor chip 102 place planar movement certain distance, such as, relative image sensor chip 102 place plane declines certain altitude, so that the second end 152 of wire 105 departs from from pressure welding point 103.

In other preferred embodiments unshowned, motion can also include the bearing being connected with substrate or table top 106, so that pressure welding point 103 rotates to an angle in the plane of image sensor chip 102 place, or relative image sensor chip 102 place planar inverted certain angle, so that the second end 152 of wire 105 departs from from pressure welding point 103.

In the present embodiment, wire bonding method also includes: provide bonding energy by bonding energy supply unit 107 for bonding head 104, first end 151 of wire 105 is connected to the pad of image sensor chip 102 will pass through bonding head 104 with the first bond strength, the second end 152 of wire 105 is connected to pressure welding point 103 with the second bond strength.Additionally, bonding head 104 itself can cut off wire 105 after the second end 152 of wire 105 is connected to pressure welding point 103 and form line tail, therefore, it is not required to additionally arrange wire cutting blade.

In the present embodiment, bonding energy supply unit 107 includes pressure control module (not shown), such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit 107 also includes temperature control modules (not shown), such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit 107 also includes ultrasound control module (not shown), such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit 107, bonding pressure, temperature, ultrasonic energy can be changed, in addition, also by changing the parameters such as the structure of bonding head 104 and the material of pressure welding point 103, surface roughness, regulate the first bond strength and the size of the second bond strength, so that the second bond strength is less than the first bond strength.When pressure welding point 103 relative image sensor chip 102 moves, stress is produced in wire 105, owing to the second bond strength of wire 105 is less than the first bond strength, this stress makes the second end 152 of wire 105 depart from pressure welding point 103, thus the first end 151 forming wire 105 is connected to the pad of image sensor chip 102, the second end 152 is suspended on the encapsulating structure outside image sensor chip 102.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by chip fixed mechanism, image sensor chip 102 is fixed on workbench 101 surface, to prevent from causing defect or damage owing to image sensor chip 102 offsets in wire 105 bonding process or in pressure welding point 103 motor process.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip 102 periphery, in order to is clamped in image sensor chip 102 edge, thus is fixed on the surface of workbench 101 by image sensor chip 102；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip 102, such as by vac sorb at image sensor chip 102 back side, thus be fixed on the surface of workbench 101 by image sensor chip 102.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by positioning detection mechanism location image sensor chip 102 and bonding head 104, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes being arranged at the image sensor semiconductor device above bonding head 104, for obtaining the image information of image sensor chip 102 and bonding head 104；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of the image sensor chip 102 and bonding head 104 obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: transmit wire 105 by wire feed mechanism to bonding head 104.Described wire 105 can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: picked and placeed and transmitted image sensor chip 102 by chip fetching/laying machine structure.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip 102 place it in the appointment position of workbench 101.

Embodiment 2

Fig. 8 illustrates the wire bonding apparatus of the image sensor chip of according to embodiments of the present invention 2, and this wire bonding apparatus includes workbench 201, is used for placing image sensor chip 202；Pressure welding point 203, is arranged near image sensor chip 202；Bonding head 204, it is preferably provided at above workbench 201, for the first end 251 of wire 205 to be connected to the pad of image sensor chip 202 with the first bond strength, and the second end 252 of wire 205 is connected to pressure welding point 203(with the second bond strength sees Fig. 5).

In the present embodiment, wire bonding apparatus also includes being arranged at the broken string mechanism 208 near the second end 252 of wire 205, for the second end 252 of wire 205 is exerted a force, so that the second end 252 of wire 205 departs from pressure welding point 203(and sees Fig. 6), thus the first end 251 forming wire 205 is connected to the pad of image sensor chip 202, the second end 252 is suspended on the encapsulating structure (seeing Fig. 7) outside image sensor chip 202.

In the present embodiment, pressure welding point 203 is positioned on substrate or table top 206.Broken string mechanism 208 is to be perpendicular to substrate or the push pedal of table top 206 apparent motion, to be perpendicular to substrate or table top 206 surface the second end 252 of wire 205 is exerted a force, such as, along the direction of arrow shown in Fig. 6, the second end 252 of wire 205 is exerted a force, thus by the second end 252 jack-up of wire 205, so that the second end 252 of wire 205 departs from from pressure welding point 203.

In other preferred embodiments unshowned, broken string mechanism 208 can also be along substrate or the push pedal of table top 206 apparent motion, to exert a force the second end 252 of wire 205 along substrate or table top 206 surface towards any direction, so that the second end 252 of wire 205 departs from from pressure welding point 203.

In the present embodiment, wire bonding apparatus also includes being bonded energy supply unit 207, for providing bonding energy for bonding head 204, first end 251 of wire 205 is connected to the pad of image sensor chip 202 will pass through bonding head 204 with the first bond strength, the second end 252 of wire 205 is connected to pressure welding point 203 with the second bond strength.Additionally, bonding head 204 itself can cut off wire 205 after the second end 252 of wire 205 is connected to pressure welding point 203 and form line tail, therefore, it is not required to additionally arrange wire cutting blade.

In the present embodiment, bonding energy supply unit 207 includes pressure control module, such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit 207 also includes temperature control modules, such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit 207 also includes ultrasound control module, such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit 207, bonding pressure, temperature, ultrasonic energy can be changed, in addition, also by changing the parameters such as the structure of bonding head 204 and the material of pressure welding point 203, surface roughness, regulate the first bond strength and the size of the second bond strength, so that the second bond strength is less than the first bond strength.When regulate the second bond strength within the specific limits time, by broken string, the second end 252 of wire 205 is exerted a force near the second end 252 of wire 205 by mechanism 208, so that the second end 252 of wire 205 departs from pressure welding point 203, thus the first end 251 forming wire 205 is connected to the pad of image sensor chip 202, the second end 252 is suspended on the encapsulating structure outside image sensor chip 202.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fixed mechanism, for image sensor chip 202 being fixed on workbench 201 surface, to prevent in wire 205 bonding process or the process that exerts a force the second end 252 of wire 205 causes defect or damage owing to image sensor chip 202 offsets.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip 202 periphery, in order to is clamped in image sensor chip 202 edge, thus is fixed on the surface of workbench 201 by image sensor chip 202；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip 202, such as by vac sorb at image sensor chip 202 back side, thus be fixed on the surface of workbench 201 by image sensor chip 202.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes positioning detection mechanism, is used for positioning image sensor chip 202 and bonding head 204, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes being arranged at the image sensor semiconductor device above bonding head 204, for obtaining the image information of image sensor chip 202 and bonding head 204；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of the image sensor chip 202 and bonding head 204 obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes wire feed mechanism, for transmitting wire 205 to bonding head 204.Described wire 205 can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fetching/laying machine structure, is used for picking and placeing and transmitted image sensor chip 202.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip 202 place it in the appointment position of workbench 201.

Seeing Fig. 5-Fig. 8, the present embodiment also provides for a kind of wire bonding method of image sensor chip, comprises the steps: to be placed on workbench 201 image sensor chip 202, is provided with pressure welding point 203 near this image sensor chip 202；By bonding head 204, first end 251 of wire 205 is connected to the first bond strength the pad of image sensor chip 202, and the second end 252 of wire 205 is connected to pressure welding point 203 with the second bond strength.

In the present embodiment, wire bonding method also include by be arranged near the second end 252 of wire 205 broken string mechanism 208 second end 252 of wire 205 is exerted a force, so that the second end 252 of wire 205 departs from pressure welding point 203, thus the first end 251 forming wire 205 is connected to the pad of image sensor chip 202, the second end 252 is suspended on the encapsulating structure outside image sensor chip 202.

In the present embodiment, pressure welding point 203 is positioned on substrate or table top 206.Broken string mechanism 208 is to be perpendicular to substrate or the push pedal of table top 206 apparent motion, to be perpendicular to substrate or table top 206 surface the second end 252 of wire 205 is exerted a force, such as, along the direction of arrow shown in Fig. 6, the second end 252 of wire 205 is exerted a force, thus by the second end 252 jack-up of wire 205, so that the second end 252 of wire 205 departs from from pressure welding point 203.

In other preferred embodiments unshowned, broken string mechanism 208 can also be along substrate or the push pedal of table top 206 apparent motion, to exert a force the second end 252 of wire 205 along substrate or table top 206 surface towards any direction, so that the second end 252 of wire 205 departs from from pressure welding point 203.

In the present embodiment, wire bonding method also includes: provide bonding energy by bonding energy supply unit 207 for bonding head 204, first end 251 of wire 205 is connected to the pad of image sensor chip 202 will pass through bonding head 204 with the first bond strength, the second end 252 of wire 205 is connected to pressure welding point 203 with the second bond strength.Additionally, bonding head 204 itself can cut off wire 205 after the second end 252 of wire 205 is connected to pressure welding point 203 and form line tail, therefore, it is not required to additionally arrange wire cutting blade.

In the present embodiment, bonding energy supply unit 207 includes pressure control module, such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit 207 also includes temperature control modules, such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit 207 also includes ultrasound control module, such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit 207, bonding pressure, temperature, ultrasonic energy can be changed, in addition, also by changing the parameters such as the structure of bonding head 204 and the material of pressure welding point 203, surface roughness, regulate the first bond strength and the size of the second bond strength, so that the second bond strength is less than the first bond strength.When regulate the second bond strength within the specific limits time, by broken string, the second end 252 of wire 205 is exerted a force near the second end 252 of wire 205 by mechanism 208, so that the second end 252 of wire 205 departs from pressure welding point 203, thus the first end 251 forming wire 205 is connected to the pad of image sensor chip 202, the second end 252 is suspended on the encapsulating structure outside image sensor chip 202.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by chip fixed mechanism, image sensor chip 202 is fixed on workbench 201 surface, to cause defect or damage owing to image sensor chip 202 offsets during preventing the second end 252 force in wire 205 bonding process or to wire 205.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip 202 periphery, in order to is clamped in image sensor chip 202 edge, thus is fixed on the surface of workbench 201 by image sensor chip 202；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip 202, such as by vac sorb at image sensor chip 202 back side, thus be fixed on the surface of workbench 201 by image sensor chip 202.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by positioning detection mechanism location image sensor chip 202 and bonding head 204, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes being arranged at the image sensor semiconductor device above bonding head 204, for obtaining the image information of image sensor chip 202 and bonding head 204；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of the image sensor chip 202 and bonding head 204 obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: transmit wire 205 by wire feed mechanism to bonding head 204.Described wire 205 can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: picked and placeed and transmitted image sensor chip 202 by chip fetching/laying machine structure.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip 202 place it in the appointment position of workbench 201.

Embodiment 3

The wire bonding apparatus of 3 a kind of image sensor chips of offer according to embodiments of the present invention, this wire bonding apparatus includes workbench 301, is used for placing image sensor chip 302；Pressure welding point 303, is arranged near image sensor chip 302；Bonding head (not shown), is preferably provided at above workbench 301, for the first end 351 of wire 305 is connected to the pad of image sensor chip 302, and the second end 352 of wire 305 is contacted with pressure welding point 303.

As shown in Figure 9, in the present embodiment, pressure welding point 303 is positioned on substrate or table top 306, and the surface of this substrate or table top 306 includes first area 361 that is adjacent one another are and that have different surfaces characteristic and second area 362, and pressure welding point 303 is positioned at first area 361 and the interface of second area 362.When the second end 352 of wire 305 is bonded, utilize first area 361 and the difference of second area 362 surface characteristic, the second end 352 making wire 305 departs from pressure welding point 303, thus the first end 351 forming wire 305 is connected to the pad of image sensor chip 302, the second end 352 is suspended on the encapsulating structure outside image sensor chip 302.

Specifically, can be by changing parameter change first area 361 and the surface characteristic of second area 362 such as first area 361 and the material of second area 362, surface roughness.Such as, first area 361 and second area 362 can be selected to be made up of different coating materials, preferably, first area 361 is steel, copper or aluminum, second area 362 is gold, silver, nickel or palladium, so that the bond strength of first area 361 and wire 305 is less than the bond strength of second area 362 with wire 305.Therefore, when the second end 352 of wire 305 is bonded, first area 361 is low with the bond strength of the second end 352, it is simple to the second end 352 of wire 305 departs from pressure welding point 303；Second area 362 is strong with the bond strength of the second end 352, it is simple to form line tail in bonding process continuously.

In the present embodiment, wire bonding apparatus also includes being bonded energy supply unit (not shown), for providing bonding energy for bonding head, first end 351 of wire 305 is connected to the pad of image sensor chip 302 will pass through bonding head, the second end 352 of wire 305 is contacted with pressure welding point 303.Additionally, bonding head itself can cut off wire 305 after the second end 352 of wire 305 is contacted with pressure welding point 303 and form line tail, therefore, it is not required to additionally arrange wire cutting blade.

In the present embodiment, bonding energy supply unit includes pressure control module, such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit also includes temperature control modules, such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit also includes ultrasound control module, such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit, bonding pressure, temperature, ultrasonic energy can be changed, in addition, also by changing the parameters such as first area 361, the material of second area 362, surface roughness, regulate the bond strength of first area 361 and second area 362 and wire 305, so that the bond strength of first area 361 and wire 305 is less than the bond strength of second area 362 with wire 305.When the second end 352 of wire 305 is bonded, utilize first area 361 different from the bond strength of wire 305 with second area 362, the second end 352 making wire 305 departs from pressure welding point 303, thus the first end 351 forming wire 305 is connected to the pad of image sensor chip 302, the second end 352 is suspended on the encapsulating structure outside image sensor chip 302.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fixed mechanism, for image sensor chip 302 being fixed on workbench 301 surface, to prevent from wire 305 bonding process causes defect or damage owing to image sensor chip 302 offsets.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip 302 periphery, in order to is clamped in image sensor chip 302 edge, thus is fixed on the surface of workbench 301 by image sensor chip 302；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip 302, such as by vac sorb at image sensor chip 302 back side, thus be fixed on the surface of workbench 301 by image sensor chip 302.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes positioning detection mechanism, is used for positioning image sensor chip 302 and bonding head, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes the image sensor semiconductor device being arranged at above bonding head, for obtaining the image information of image sensor chip 302 and bonding head；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of the image sensor chip 302 and bonding head obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes wire feed mechanism, for transmitting wire 305 to bonding head.Described wire 305 can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fetching/laying machine structure, is used for picking and placeing and transmitted image sensor chip 302.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip 302 place it in the appointment position of workbench 301.

The present embodiment also provides for a kind of wire bonding method of image sensor chip 302, comprises the steps: to be placed on workbench 301 image sensor chip 302, is provided with pressure welding point 303 near this image sensor chip 302；By bonding head, the first end 351 of wire 305 is connected to the pad of image sensor chip 302, and the second end 352 of wire 305 is contacted with pressure welding point 303.

In the present embodiment, pressure welding point 303 is positioned on substrate or table top 306.The surface of this substrate or table top 306 includes first area 361 that is adjacent one another are and that have different surfaces characteristic and second area 362, and pressure welding point 303 is positioned at first area 361 and the interface of second area 362.When the second end 352 of wire 305 is bonded, utilize first area 361 and the difference of second area 362 surface characteristic, the second end 352 making wire 305 departs from pressure welding point 303, thus the first end 351 forming wire 305 is connected to the pad of image sensor chip 302, the second end 352 is suspended on the encapsulating structure outside image sensor chip 302.

Specifically, can be by changing parameter change first area 361 and the surface characteristic of second area 362 such as first area 361 and the material of second area 362, surface roughness.Such as, first area 361 and second area 362 can be selected to be made up of different coating materials, preferably, first area 361 is steel, copper or aluminum, second area 362 is gold, silver, nickel or palladium, so that the bond strength of first area 361 and wire 305 is less than the bond strength of second area 362 with wire 305.Therefore, when the second end 352 of wire 305 is bonded, first area 361 is low with the bond strength of the second end 352, it is simple to the second end 352 of wire 305 departs from pressure welding point 303；Second area 362 is strong with the bond strength of the second end 352, it is simple to form line tail in bonding process continuously.

In the present embodiment, wire bonding method also includes: provide bonding energy by bonding energy supply unit for bonding head, first end 351 of wire 305 is connected to the pad of image sensor chip 302 will pass through bonding head, the second end 352 of wire 305 is contacted with pressure welding point 303.Additionally, bonding head itself can cut off wire 305 after the second end 352 of wire 305 is contacted with pressure welding point 303 and form line tail, therefore, it is not required to additionally arrange wire cutting blade.

In the present embodiment, bonding energy supply unit includes pressure control module, such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit also includes temperature control modules, such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit also includes ultrasound control module, such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit, bonding pressure, temperature, ultrasonic energy can be changed, in addition, also by changing the parameters such as first area 361, the material of second area 362, surface roughness, regulate the bond strength of first area 361 and second area 362 and wire 305, so that the bond strength of first area 361 and wire 305 is less than the bond strength of second area 362 with wire 305.When the second end 352 of wire 305 is bonded, utilize first area 361 different from the bond strength of wire 305 with second area 362, the second end 352 making wire 305 departs from pressure welding point 303, thus the first end 351 forming wire 305 is connected to the pad of image sensor chip 302, the second end 352 is suspended on the encapsulating structure outside image sensor chip 302.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by chip fixed mechanism, image sensor chip 302 is fixed on workbench 301 surface, to prevent from causing defect or damage owing to image sensor chip 302 offsets in wire 305 bonding process.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip 302 periphery, in order to is clamped in image sensor chip 302 edge, thus is fixed on the surface of workbench 301 by image sensor chip 302；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip 302, such as by vac sorb at image sensor chip 302 back side, thus be fixed on the surface of workbench 301 by image sensor chip 302.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by positioning detection mechanism location image sensor chip 302 and bonding head, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes the image sensor semiconductor device being arranged at above bonding head, for obtaining the image information of image sensor chip 302 and bonding head；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of the image sensor chip 302 and bonding head obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: transmit wire 305 by wire feed mechanism to bonding head.Described wire 305 can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: picked and placeed and transmitted image sensor chip 302 by chip fetching/laying machine structure.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip 302 place it in the appointment position of workbench 301.

Embodiment 4

The wire bonding apparatus of 4 a kind of image sensor chips of offer according to embodiments of the present invention, similar to Example 3ly, this wire bonding apparatus includes workbench, is used for placing image sensor chip；Pressure welding point, is arranged near image sensor chip；Bonding head, is preferably provided at above workbench, for the first end of wire is connected to the pad of image sensor chip, and by the second end in contact of wire in pressure welding point.

See Figure 10, Figure 11, in the present embodiment, made the bond strength of two port pressure welding point of wire less than the line tail bond strength to pressure welding point by the structure changing bonding head, the second end being easy to wire departs from pressure welding point, thus the first end forming wire is connected to the pad of image sensor chip, the second end is suspended on the encapsulating structure outside image sensor chip.

Figure 10 is the structural representation of the bonding head of existing wire bonding apparatus, this bonding head includes the outer wall 41 with sharp-pointed portion 43 and the endoporus 42 surrounded by this outer wall 41, wire 5 is contained in endoporus 42 and extend out to be positioned near the pressure welding point on substrate or table top 6, during wire bonding, extruding wire 5 by outer wall 41 makes it be bonded with pressure welding point, utilizes the sharp-pointed portion 43 of outer wall 41 cut off wire 5 and form line tail 53 simultaneously.Owing to the end face outside (seeing dotted line L1 in figure) of bonding head is less than interior hole end surface (seeing dotted line L2 in figure), the sharp-pointed portion 43 of outer wall 41 relativelys close to endoporus 42, make the off-position (seeing dotted line L3 in figure) of wire closer to endoporus 42, that is, after wire cuts off, the position 9 bigger with pressure welding point bond strength is stayed on the second end 52 of wire rather than on line tail 53, the second end 52 making wire 5 is more than the line tail 53 bond strength to pressure welding point to the bond strength of pressure welding point, it is simple to is formed between the second end 52 and the pressure welding point of wire 5 and is reliably connected.

Figure 11 is the structural representation of the bonding head of wire bonding apparatus of the present invention, this bonding head includes the outer wall 441 with sharp-pointed portion 443 and the endoporus 442 surrounded by this outer wall 441, wire 405 is contained in endoporus 442 and extend out to be positioned near the pressure welding point on substrate or table top 406, during wire bonding, extruding wire 405 by outer wall 441 makes it be bonded with pressure welding point, utilizes the sharp-pointed portion 443 of outer wall 441 cut off wire 405 and form line tail 453 simultaneously.In the present embodiment, owing to the end face outside (seeing dotted line L401 in figure) of bonding head is higher than interior hole end surface (seeing dotted line L402 in figure), sharp-pointed portion 443 is farther away from endoporus 442, make the off-position (seeing dotted line L403 in figure) of wire farther away from endoporus 442, that is, after wire cuts off, the position 409 bigger with pressure welding point bond strength is stayed on the line tail 453 of wire rather than on the second end 452, the second end 452 making wire is less than the line tail 453 bond strength to pressure welding point to the bond strength of pressure welding point, the second end 452 being easy to wire departs from pressure welding point (seeing Figure 12), thus the first end forming wire is connected to the pad of image sensor chip, second end is suspended on the encapsulating structure outside image sensor chip.

In the present embodiment, wire bonding apparatus also includes being bonded energy supply unit, for providing bonding energy for bonding head, in order to the first end of wire is connected to the pad of image sensor chip by bonding head, by the second end in contact of wire in pressure welding point.

In the present embodiment, bonding energy supply unit includes pressure control module, such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit also includes temperature control modules, such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit also includes ultrasound control module, such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit, thus it is possible to vary bonding pressure, temperature, ultrasonic energy, additionally, also by changing the parameters such as the material of pressure welding point, surface roughness, regulation wire and imageing sensor and the bond strength with pressure welding point.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fixed mechanism, for image sensor chip is fixed on table surface, to cause defect or damage due to image sensor chip skew during preventing wire bonding.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip periphery, in order to is clamped in image sensor chip edge, thus is fixed on the surface of workbench by image sensor chip；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip, such as by vac sorb at the image sensor chip back side, thus be fixed on the surface of workbench by image sensor chip.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes positioning detection mechanism, is used for positioning image sensor chip and bonding head, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes the image sensor semiconductor device being arranged at above bonding head, for obtaining the image information of image sensor chip and bonding head；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of image sensor chip and the bonding head obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes wire feed mechanism, for transmitting wire to bonding head.Described wire can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding apparatus of the present invention also includes chip fetching/laying machine structure, is used for picking and placeing and transmitted image sensor chip.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip place it in the appointment position of workbench.

The present embodiment also provides for a kind of wire bonding method of image sensor chip, comprises the steps: to be placed on workbench image sensor chip, is provided with pressure welding point near this image sensor chip；By bonding head, the first end of wire is connected to the pad of image sensor chip, and by the second end in contact of wire in pressure welding point.

In the present embodiment, made the bond strength of two port pressure welding point of wire less than the line tail bond strength to pressure welding point by the structure changing bonding head, the second end being easy to wire departs from pressure welding point, thus the first end forming wire is connected to the pad of image sensor chip, the second end is suspended on the encapsulating structure outside image sensor chip.

Specifically, in the wire bonding method of the present invention, by arranging the end face outside of bonding head higher than interior hole end surface, make the off-position of wire farther away from endoporus, it is to say, after wire cuts off, the position maximum with pressure welding point bond strength is stayed on the line tail of wire rather than on the second end, make the bond strength of two port pressure welding point of wire less than the line tail bond strength to pressure welding point, it is simple to the second end of wire departs from pressure welding point.

In the present embodiment, wire bonding method also includes: provide bonding energy by bonding energy supply unit for bonding head, in order to the first end of wire is connected to the pad of image sensor chip by bonding head, by the second end in contact of wire in pressure welding point.Additionally, bonding head itself can cut off wire after pressure welding point in the second end in contact of wire and form line tail, therefore, it is not required to additionally arrange wire cutting blade.

In the present embodiment, bonding energy supply unit includes pressure control module, such as, by pressure sensor monitoring adjusting key resultant pressure scope.

In the present embodiment, bonding energy supply unit also includes temperature control modules, such as, by temperature sensor monitors and regulate bonding temperature range.

In the present embodiment, bonding energy supply unit also includes ultrasound control module, such as, is monitored and regulate bonding ultrasonic power scope by ultrasonic transducer.

Then, by above-mentioned bonding energy supply unit, thus it is possible to vary bonding pressure, temperature, ultrasonic energy, additionally, also by changing the parameters such as the material of pressure welding point, surface roughness, regulation wire and imageing sensor and the bond strength with pressure welding point.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by chip fixed mechanism, image sensor chip is fixed on table surface, to cause defect or damage due to image sensor chip skew during preventing wire bonding.Preferably, chip fixed mechanism is the clamping device being arranged at image sensor chip periphery, in order to is clamped in image sensor chip edge, thus is fixed on the surface of workbench by image sensor chip；Or, chip fixed mechanism is to be arranged at the adsorbing mechanism below image sensor chip, such as by vac sorb at the image sensor chip back side, thus be fixed on the surface of workbench by image sensor chip.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: by positioning detection mechanism location image sensor chip and bonding head, to ensure the accuracy of bonding position.Specifically, this positioning detection mechanism includes the image sensor semiconductor device being arranged at above bonding head, for obtaining the image information of image sensor chip and bonding head；And the image processing elements being connected with image sensor semiconductor device, for processing the image information of image sensor chip and the bonding head obtained by image sensor semiconductor device.Preferably, this image sensor semiconductor device is camera, video camera, imageing sensor or infrared sensor.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: transmit wire by wire feed mechanism to bonding head.Described wire can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver wire or alloy wire.

In other preferred embodiments unshowned, the wire bonding method of the present invention also includes: picked and placeed and transmitted image sensor chip by chip fetching/laying machine structure.Such as, by the lifting of mechanical arm control chip pick-up part, the action such as overturn and move, so that chip pick-up part can accurate captured image sensor chip place it in the appointment position of workbench.

The wire bonding method and device of the present invention, is first placed in image sensor chip on workbench, is provided with pressure welding point near described image sensor chip；Then by bonding head, the first end of wire is connected to the pad of described image sensor chip, and by the second end in contact of wire in described pressure welding point；Second end of the most described wire departs from described pressure welding point, the first end forming wire is connected to the pad of image sensor chip, second end is suspended on the encapsulating structure outside image sensor chip, thus add the encapsulation motility of image sensor chip, it is easy to chip and the location of camera lens and assembling, improves the performance of photographic head module, and also shorten technological process, improve packaging efficiency and product yield, reduce the cost of photographic head module.

Additionally, the wire bonding apparatus of the present invention can be as a self-contained unit, for the wire bonding of image sensor chip, it is possible to be integrated in automatization's package system of image sensor chip, to realize automatization's encapsulation of image sensor chip.

Although present disclosure is as above, but the present invention is not limited to this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.

Claims (19)

1. the wire bonding method of an image sensor chip, it is characterised in that comprise the steps:

Image sensor chip is placed on workbench, near described image sensor chip, is provided with pressure welding point；

By bonding head, the first end of wire is connected to the pad of described image sensor chip, and by the second end in contact of wire in described pressure welding point；

Second end of described wire departs from described pressure welding point.

Wire bonding method the most according to claim 1, it is characterized in that, by bonding head, the first end of wire is connected to the first bond strength the pad of described image sensor chip, and the second end of wire is connected to described pressure welding point with the second bond strength；The motion of described pressure welding point the most described image sensor chip is so that the second end of described wire departs from described pressure welding point.

Wire bonding method the most according to claim 1, it is characterized in that, by bonding head, the first end of wire is connected to the first bond strength the pad of described image sensor chip, and the second end of wire is connected to described pressure welding point with the second bond strength；Arranging broken string mechanism near the second end of described wire to exert a force with the second end to described wire, the second end of described wire departs from from described pressure welding point.

Wire bonding method the most according to claim 1, it is characterized in that, described pressure welding point is positioned on substrate or table top, the surface of described substrate or table top includes the bond strength bond strength less than described second area with described wire of first area adjacent one another are and second area, described first area and described wire；When the second terminal link of described wire closes, described first area is low with the bond strength of described second end, it is simple to the second end of wire departs from described pressure welding point；Described second area is strong with the bond strength of described second end, it is simple to form line tail in bonding process continuously.

Wire bonding method the most according to claim 1, it is characterized in that, change the structure of described bonding head, make the bond strength of pressure welding point described in the two port of described wire less than the line tail bond strength to pressure welding point, the second end being easy to wire departs from described pressure welding point, simultaneously facilitates formation line tail in continuous bonding process.

Wire bonding method the most according to claim 5, it is characterised in that the mode of the structure changing described bonding head is: the end face outside of described bonding head is higher than interior hole end surface.

Wire bonding method the most according to claim 1, it is characterised in that described image sensor chip is fixed on workbench by adsorbing mechanism or clamping device.

8. according to the wire bonding method described in Claims 2 or 3, it is characterised in that by changing bonding pressure, temperature, ultrasonic energy and the structure of bonding head, pressure welding point material, regulate described first bond strength and the size of described second bond strength.

9. according to the wire bonding method described in Claims 2 or 3, it is characterised in that the second bond strength of described wire is less than described first bond strength.

Wire bonding method the most according to claim 2, it is characterized in that, the most described image sensor chip of described pressure welding point moves, stress is produced in described wire, owing to the second bond strength of described wire is less than described first bond strength, described stress makes the second end of described wire depart from described pressure welding point.

11. wire bonding methods according to claim 3, it is characterized in that, in certain limit, regulate described second bond strength, control described broken string mechanism, near the second end of described wire, the second end of described wire is applied active force, make the second end of described wire depart from described pressure welding point.

12. wire bonding methods according to claim 4, it is characterised in that described first area is steel, copper or aluminum, described second area is gold, silver, nickel or palladium.

The wire bonding apparatus of 13. 1 kinds of image sensor chips, it is characterised in that including:

Workbench, is used for placing image sensor chip；

Pressure welding point, is arranged near described image sensor chip；

Bonding head, for the first end of wire is connected to the pad of described image sensor chip, and departs from described pressure welding point by the second end in contact of wire in described pressure welding point, the second end of the most described wire.

14. wire bonding apparatus according to claim 13, it is characterized in that, farther include the motion being connected with described pressure welding point, be used for making the most described image sensor chip of described pressure welding point move, so that the second end of described wire departs from described pressure welding point.

15. wire bonding apparatus according to claim 13, it is characterised in that farther include the broken string mechanism being arranged near the second end of described wire, for the second end force to described wire, so that the second end of described wire departs from from described pressure welding point.

16. wire bonding apparatus according to claim 13, it is characterized in that, farther include the substrate for carrying described pressure welding point or table top, the surface of described substrate or table top includes the bond strength bond strength less than described second area with described wire of first area adjacent one another are and second area, described first area and described wire；When the second terminal link of described wire closes, described first area is low with the bond strength of described second end, it is simple to the second end of wire departs from described pressure welding point；Described second area is strong with the bond strength of described second end, it is simple to form line tail in bonding process continuously.

17. wire bonding apparatus according to claim 13, it is characterized in that, the end face outside of described bonding head is higher than interior hole end surface, make the bond strength of pressure welding point described in the two port of described wire less than the line tail bond strength to pressure welding point, the second end being easy to wire departs from described pressure welding point, simultaneously facilitates formation line tail in continuous bonding process.

18. wire bonding apparatus according to claim 16, it is characterised in that described first area is steel, copper or aluminum, described second area is gold, silver, nickel or palladium.

Automatization's package system of 19. 1 kinds of image sensor chips, it is characterised in that include the wire bonding apparatus as according to any one of claim 13-18.