CN109237319B - 将led裸片与引线框架带的接合 - Google Patents

将led裸片与引线框架带的接合 Download PDF

Info

Publication number
CN109237319B
CN109237319B CN201811011231.7A CN201811011231A CN109237319B CN 109237319 B CN109237319 B CN 109237319B CN 201811011231 A CN201811011231 A CN 201811011231A CN 109237319 B CN109237319 B CN 109237319B
Authority
CN
China
Prior art keywords
light emitting
emitting diode
dies
die
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811011231.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN109237319A (zh
Inventor
S.K.李
P.S.马丁
A.J.克劳斯
C.康
H.L.潘
L.殷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of CN109237319A publication Critical patent/CN109237319A/zh
Application granted granted Critical
Publication of CN109237319B publication Critical patent/CN109237319B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/922—Parallel electrical configurations of multiple light-emitting semiconductor components or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/942—Serial electrical configurations of multiple light-emitting semiconductor components or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN201811011231.7A 2013-06-28 2014-06-18 将led裸片与引线框架带的接合 Active CN109237319B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNPCT/CN2013/000784 2013-06-28
CNPCT/CN2013/000784 2013-06-28
CN201480047536.7A CN105493281B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480047536.7A Division CN105493281B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

Publications (2)

Publication Number Publication Date
CN109237319A CN109237319A (zh) 2019-01-18
CN109237319B true CN109237319B (zh) 2020-10-27

Family

ID=51136533

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811011231.7A Active CN109237319B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合
CN201480047536.7A Active CN105493281B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201480047536.7A Active CN105493281B (zh) 2013-06-28 2014-06-18 将led裸片与引线框架带的接合

Country Status (6)

Country Link
US (2) US9530949B2 (https=)
EP (1) EP3014657B1 (https=)
JP (1) JP6508732B2 (https=)
KR (1) KR102168935B1 (https=)
CN (2) CN109237319B (https=)
WO (1) WO2014207620A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014207620A1 (en) * 2013-06-28 2014-12-31 Koninklijke Philips N.V. Bonding led die to lead frame strips
WO2017157753A1 (en) * 2016-03-15 2017-09-21 Philips Lighting Holding B.V. An elongated lead frame and a method of manufacturing an elongated lead frame
JP6360514B2 (ja) * 2016-03-31 2018-07-18 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 Ｌｅｄ基板及びそれを有する光照射装置
WO2018108676A1 (en) 2016-12-13 2018-06-21 Lumileds Holding B.V. Arrangement of leds on a leadframe
KR102450579B1 (ko) * 2017-06-05 2022-10-07 삼성전자주식회사 Led램프
DE102017127721A1 (de) * 2017-11-23 2019-05-23 Osram Opto Semiconductors Gmbh Led-filament mit konversionsschicht
EP3803976B1 (en) 2018-05-24 2024-05-22 Lumiode, Inc. Led display structures and fabrication of same
DE102018211723A1 (de) 2018-07-13 2020-01-16 Osram Gmbh Led-anordnung und beleuchtungsvorrichtung
EP3899920A4 (en) 2018-12-21 2022-09-28 Lumiode, Inc. ADDRESSING FOR EMISSIVE INDICATORS

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3835942A1 (de) * 1988-10-21 1990-04-26 Telefunken Electronic Gmbh Flaechenhafter strahler
DE10025563B4 (de) 2000-05-24 2005-12-01 Osram Opto Semiconductors Gmbh Modul für die Anordnung von elektrischen lichtemittierenden Elementen,integrierbar in ein Leuchtengehäuse,und Verfahren zur Herstellung eines derartigen Moduls
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
DE102004001312B4 (de) * 2003-07-25 2010-09-30 Seoul Semiconductor Co., Ltd. Chip-Leuchtdiode und Verfahren zu ihrer Herstellung
JP4757477B2 (ja) * 2004-11-04 2011-08-24 株式会社 日立ディスプレイズ 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
WO2007097483A1 (en) * 2006-02-24 2007-08-30 Seoul Semiconductor Co., Ltd. Light emitting diode package
US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8581393B2 (en) 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
JPWO2008078791A1 (ja) * 2006-12-27 2010-04-30 昭和電工株式会社 発光装置の製造方法
US7806560B2 (en) 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
JP2009199977A (ja) * 2008-02-25 2009-09-03 Panasonic Corp 照明装置
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
TWI401788B (zh) 2008-12-24 2013-07-11 財團法人工業技術研究院 發光二極體照明模組與封裝方法
JP2011023295A (ja) * 2009-07-17 2011-02-03 Rohm Co Ltd Ｌｅｄ照明装置および画像表示装置
TWM379534U (en) * 2009-08-21 2010-05-01 Tong Yah Ind Co Ltd Vehicular lamp
TWM397590U (en) * 2010-04-21 2011-02-01 Cheng Feng Electro Optical Ltd Company Flexible LED package structure
US20130058082A1 (en) 2011-09-07 2013-03-07 Cree, Inc. Linear light emitting device assemblies including cylindrically shaped diffusers
WO2014207620A1 (en) * 2013-06-28 2014-12-31 Koninklijke Philips N.V. Bonding led die to lead frame strips

Also Published As

Publication number Publication date
US9530949B2 (en) 2016-12-27
EP3014657A1 (en) 2016-05-04
CN105493281A (zh) 2016-04-13
JP6508732B2 (ja) 2019-05-08
US20160329473A1 (en) 2016-11-10
US9905544B2 (en) 2018-02-27
WO2014207620A1 (en) 2014-12-31
JP2016523456A (ja) 2016-08-08
CN109237319A (zh) 2019-01-18
EP3014657B1 (en) 2018-04-25
CN105493281B (zh) 2018-09-18
KR20160027064A (ko) 2016-03-09
US20170092628A1 (en) 2017-03-30
KR102168935B1 (ko) 2020-10-23

Similar Documents

Publication Publication Date Title
CN109237319B (zh) 将led裸片与引线框架带的接合
US10490722B2 (en) Light emitting package having a guiding member guiding an optical member
JP3850665B2 (ja) 半導体発光エミッタパッケージ
EP3152477B1 (en) Leds mounted on curved lead frame
EP2342760B1 (en) Efficient led array
US7679099B2 (en) Low thermal resistance high power LED
US6733156B2 (en) Light-emitting diode illuminated light-emitting
US20120032203A1 (en) Led unit
CN102263095A (zh) 发光装置以及照明装置
JP2006049442A (ja) 半導体発光装置およびその製造方法
KR100944085B1 (ko) 발광 장치
US20100270580A1 (en) Substrate based light source package with electrical leads
US11175019B2 (en) Carrier for lighting modules and lighting device
KR101138442B1 (ko) 발광소자

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant